Semiconductor
| Fri 29 May 2026
Beijing, May 29 -- Applied Materials has sought patent for Electroplating Wetting Chamber with Reduced Bubble Rejection. This invention was developed by Hanson Kyle M, Bergman Eric J, Wilson Gregory J, Mchugh Paul R, Bradley Benjamin Clay, Juttunen Aaron Paul, Karaikadar Deepak Sagar, Durado Daniel, Strean Carl Campbell, Tripp J..