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Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has received Wuhan Optics Valley Information Photoelectron Innovation Center Co Ltd patent application for Package Structure. Jiao Kai, Chen Shiping, Wu Miao and Wang Dong developed the invention.
The patent application number is CN202511933100 20251219. The paten..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has received STMicroelectronics International patent application for Laminated Substrate for Radio Frequency Device. Cogoni Dario and Velayudhan Veerayudhan developed the invention.
The patent application number is CN202511436286 20251009. The patent publication num..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- STMicroelectronics International has filed a patent application for Laminated Substrate for Radio Frequency Device. This invention was developed by Velayudhan Veerayudhan.
The patent application number is CN202511434702 20251009. The patent publication number is CN121793787 (A). International Patent Classific..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Xiamen Anjieli Meiwei Tech Co Ltd has applied Chinese patent for High-order Glass Substrate Structure and Preparation Method Thereof. Yan Guoqiu, Tian Hongzhou, Lu Haokuan, Cao Zikun, Zhang Dawei, Ao Weiping, Kamimiya Shohei and Huang Jian developed it.
The patent application number is CN202411367159 202409..
Electrical
| Wed 08 Jul 2026
Beijing, July 8 -- Beijing Institute Technology has applied Chinese patent for Photoelectric Simultaneous Transmission Vertical Interconnection Structure and Preparation Method Thereof. Zhang Ziyue, Wang Han, Ding Yingtao, Chen Zhiming, Chang Huiyu and Ren Anrun developed it.
The patent application number is CN202511691463 20..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Taiyo Holdings has applied Chinese patent for Wiring Substrate and Semiconductor Device. Shibata Daisuke, Kawada Hayayoshi, Takahashi Tsutomu and Konno Kai developed it.
The patent application number is CN202511386527 20250926. The patent publication number is CN121793783 (A). International Patent Classificat..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Forehope Electronic Ningbo Limited Co has submitted a patent application for Semiconductor Packaging Structure and Packaging Method Thereof. This invention was developed by He Zhenghong and Jiang Ruidong.
The patent application number is CN202511955958 20251223. The patent publication number is CN121793782 ..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has received Infineon Technologies, Austria patent application for Semiconductor Package Including First and Second Substrates Connected to Connector Elements of Lead Frame. Garbato Emanuele, Jung Yong-ha, Upendra Baleshwar Manikandan, Jin Jiling, Fang Qiumin, Concep..
Electronics
| Wed 08 Jul 2026
Beijing, July 8 -- Partition Semiconductor Bonding Tech Inc has filed a patent application for Microelectronic Component. This invention was developed by Haba Belgacem.
The patent application number is CN20251206873 20190703. The patent publication number is CN121793780 (A). International Patent Classification codes are H10W7..
Electronics
| Wed 08 Jul 2026
Beijing, July 8 -- Partition Semiconductor Bonding Tech Inc has submitted a patent application for Microelectronic Component. This invention was developed by Haba Belgacem.
The patent application number is CN20251206099 20190703. The patent publication number is CN121793779 (A). International Patent Classification codes are H..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- HF Smat Microtech Co has sought patent for CSP (chip Scale Package) Structure of Single MOS (metal Oxide Semiconductor) Chip and Packaging Method Thereof. This invention was developed by Tan Xiaochun and Zhang Guangyao.
The patent application number is CN202511857641 20251210. The patent publication number ..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Semiconductor Die Stack and Method of Forming the Same. This invention was developed by Su Anzhi and Liu Chunhong.
The patent application number is CN202511867657 20251211. The patent publication number is CN121793777 (A). International..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Forehope Semiconductor Ningbo Limited Co has submitted a patent application for 2.5 D Interposer Exposed Copper Preparation Process and Packaging Structure. He Zhenghong, Zhong Lei and Xu Yupeng developed the invention.
The patent application number is CN202610256286 20260304. The patent publication number ..
Packaging & Containers
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has released Hefei Peidun Storage Technology patent application for Glass Core Multi-core Particle Packaging Method and Packaging Structure. This invention was developed by Zheng Shuhao, Wei Xiaobo, Yu Zhongxiang, Mu Junhong, Liu Chunxiao, Lyu Dongbing, Zhou Gengshen..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has received Wuxi Zhongwei High Tech Electronic patent application for Mixed-structure High-density Packaging Substrate and Processing Method Thereof. Li Yang, Yang Kun, Yao Xin and Zhu Jiachang developed the invention.
The patent application number is CN20251228046..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has released Xiamen Anjieli Meiwei Tech Co Ltd patent application for Method for Manufacturing High-precision and High-flatness Cavity on Integrated Circuit Packaging Substrate. This invention was developed by Zhang Yu, Shen Xun, Liu Bin and Feng Houle.
The patent..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has released Shenzhen Demingli Technology patent application for Processing Method of eMMC Substrate Common Mode Structure. This invention was developed by Jin Wei.
The patent application number is CN202511843191 20251209. The patent publication number is CN121793..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Wuhan DR Laser Technology has submitted a patent application for Micropore Processing Method and Substrate. This invention was developed by Zhu Fan, Xue Cheng, Ma Rong, Wang Qixian, Li Shuai and Liu Xiaodong.
The patent application number is CN202411391368 20240930. The patent publication number is CN12179377..
Automobile
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has received Chongqing Xiaokang Power patent application for Power Module of Motor Controller, Preparation Method of Power Module and Vehicle. Jiang Peng, Fan Yi, Liu Zhijun, Lin Bingchuan and Ouyang Jie developed the invention.
The patent application number is CN..
Electronics
| Wed 08 Jul 2026
Beijing, July 8 -- Beijing Chaoxian Memory Research Institute has sought patent for Semiconductor Device, Manufacturing Method Thereof and Electronic Equipment. This invention was developed by Li Yuke, Wang Guilei and Deng Xuejian.
The patent application number is CN202411389379 20240930. The patent publication number is CN12..
Electronics
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has published BYD Co Limited patent application for Power Module and Electronic Device. The invention was developed by Zhu Guodong, Zhao Lei, Tang Honghao, Zhang Huaixin and Bian Ruofan.
The patent application number is CN202511621217 20251105. The patent publicat..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Suzhou Suna Photoelectric has filed a patent application for Semiconductor Structure and Preparation Method Thereof, and Semiconductor Device. This invention was developed by Jin Shan, Huang Yuyang and Wan Minkai.
The patent application number is CN202610236464 20260228. The patent publication number is CN121..
Electronics
| Wed 08 Jul 2026
Beijing, July 8 -- Advanced Semiconductor Engineering has filed a patent application for Electronic Device. This invention was developed by Chen Xinyu and Xu Shaoen.
The patent application number is CN202510260133 20250306. The patent publication number is CN121793765 (A). International Patent Classification code is H10W42/20. ..
Electronics
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has published Huawei Technologies patent application for Chip and Electronic Equipment. The invention was developed by Wang Qiquan, Wen Detong, Li Tianran, Xu Miao and Li Chen.
The patent application number is CN202411382131 20240929. The patent publication number i..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has received Shenzhen Rongwei New Mat Co Ltd patent application for Integrated Rectifier Diode Module with Three-dimensional Spiral Structure. Yao Lin developed the invention.
The patent application number is CN20251239005 20251231. The patent publication number i..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Harbin Institute Of Technology has submitted a patent application for Sealing Chip Multi-dimensional Heat Dissipation Structure Based on Liquid Metal High-thermal-conductivity Filler and Packaging Method of Sealing Chip Multi-dimensional Heat Dissipation Structure. Tian Yanhong, Wen Jiayue, Yu Minghan, Feng Ji..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has published Guangdong Xinji Shifeng Tech Co Ltd patent application for Novel Semiconductor Device Packaging Structure with Overcurrent Protection Function. The invention was developed by Zhou Zehua, Wei Zhenyan and Lan Zhaohong.
The patent application number is ..
Electronics
| Wed 08 Jul 2026
Beijing, July 8 -- Shenzhen STS Microelectronics has submitted a patent application for Power Module, Manufacturing Method Therefor, and Electrical System. Chen Qiao, Huang Mingyue and Zheng Nannan developed the invention.
The patent application number is CN202411375072 20240929. The patent publication number is CN121793760 (..
Electrical
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has received Shenzhen STS Microelectronics patent application for Internal Cooling Device for Power Module, Method for Manufacturing Same, Power Module, and Electrical System. Chen Qiao, Huang Mingyue and Zheng Nannan developed the invention.
The patent application ..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Suzhou Zhenkun Tech Co Ltd has submitted a patent application for Semiconductor Packaging Structure and Manufacturing Method Thereof. Zhao Wanxue developed the invention.
The patent application number is CN20261006817 20260105. The patent publication number is CN121793757 (A). International Patent Classific..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has published Partition Semiconductor Bonding Tech Inc patent application for Electrical Redundancy for Bonded Structures. The invention was developed by Haba Belgacem and Katkar Rajesh.
The patent application number is CN20251211359 20201221. The patent publicati..
Electrical
| Wed 08 Jul 2026
Beijing, July 8 -- Partition Semiconductor Bonding Tech Inc has submitted a patent application for Electrical Redundancy for Bonded Structures. This invention was developed by Haba Belgacem and Katkar Rajesh.
The patent application number is CN20251206528 20201221. The patent publication number is CN121793755 (A). Internation..
Electronics
| Wed 08 Jul 2026
Beijing, July 8 -- Chongqing Xinlian Microelectronic Co Ltd has submitted a patent application for Metal Interconnection Structure and Forming Method Thereof. Huang Rende, Huang Qianqian, Li Yechao and Zhu Kebao developed the invention.
The patent application number is CN202511732700 20251124. The patent publication number is..
Metal & Mining
| Wed 08 Jul 2026
Beijing, July 8 -- Hunan Institute Technology has submitted a patent application for Glass Through Hole Copper Plating Filling Method and Structure and Application Thereof. This invention was developed by Liu Huaimin, Xu Aijun, Zhang Qinglong, Liu Bin, Zhang Liang and Wang Yongqiang.
The patent application number is CN2026103..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has released Hubei Jiangcheng Chip Pilot Production Services patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Chen Huizhi.
The patent application number is CN20251253816 20251231. The patent publication num..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Hubei Jiangcheng Chip Pilot Production Services has submitted a patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Chen Huizhi.
The patent application number is CN20251250241 20251231. The patent publication number is CN121793750 (A). International Pat..
Electronics
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has released Rongxin Semiconductor Huaian patent application for Manufacturing Method of Interconnection Hole Conductive Structure. This invention was developed by Li Mingming, Yin Kaihua, Liu Yi and Zhao Xuefa.
The patent application number is CN20251230055 2025123..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Puya Semiconductor, Shanghai has sought patent for Connection Line Isolation Performance Improvement Method and Integrated Circuit. This invention was developed by Li Huzi.
The patent application number is CN20251227278 20251230. The patent publication number is CN121793748 (A). International Patent Classific..
Electronics
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has published Chongqing Xinlian Microelectronic Co Ltd patent application for Diffusion Barrier Layer for Copper Interconnection Structure and Preparation Method Thereof. The invention was developed by Huang Rende, Li Yechao, Fang Guiqin and Zhao Bin.
The patent a..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Chongqing Xinlian Microelectronic Co Ltd has applied Chinese patent for Manufacturing Method of Semiconductor Structure. Huang Junxian, Song Xiangjin and Liu Changtao developed it.
The patent application number is CN202511887895 20251215. The patent publication number is CN121793746 (A). International Paten..
Electronics
| Wed 08 Jul 2026
Beijing, July 8 -- Chongqing Xinlian Microelectronic Co Ltd has submitted a patent application for Preparation Method of Copper Interconnection Structure. This invention was developed by Zheng Xingwang.
The patent application number is CN202511827353 20251205. The patent publication number is CN121793745 (A). International Pa..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Chongqing Xinlian Microelectronic Co Ltd has submitted a patent application for Semiconductor Structure and Preparation Method Thereof. Huang Junxian, Song Xiangjin and Zeng Guoxing developed the invention.
The patent application number is CN202511730990 20251124. The patent publication number is CN12179374..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Anhui Dapeng Semiconductor has submitted a patent application for Trench Isolation Type PN Junction, Preparation Method Thereof and Trench Isolation Type Semiconductor Device. This invention was developed by Wang Hailin and Zhang Changjun.
The patent application number is CN202411357127 20240927. The patent..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has released 3peak Incorporated patent application for Preparation Method of Semiconductor Device. This invention was developed by Ma Xiaobo.
The patent application number is CN20251256187 20251231. The patent publication number is CN121793742 (A). International P..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has received Wuxi Xinzhuo Huguang Semiconductor Co Ltd patent application for Trench Structure, Preparation Method Thereof and Semiconductor Device. Li Xuesong, Liang Debin, Xie Kanglin, Bai Yu and Yu Qing developed the invention.
The patent application number is ..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Wuxi Xinzhuo Huguang Semiconductor Co Ltd has applied Chinese patent for Strain Semiconductor Structure, Semiconductor-on-insulator Structure and Preparation Method. Jiang Wenbin developed it.
The patent application number is CN20251247546 20251231. The patent publication number is CN121793740 (A). Internat..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has released Chongqing Xinlian Microelectronic Co Ltd patent application for Method for Filling Interlayer Dielectric Layer in High Aspect Ratio Structure. This invention was developed by Huang Junxian, Song Xiangjin and Liu Changtao.
The patent application number..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Chongqing Lanshan Electronics Co Ltd has submitted a patent application for Chip Trimming Method, Chip Trimming Platform and Control Module. This invention was developed by Fang Da, Yang Changliang, Lyu Zhenghua, Li Tao, Dai Qiulin and Mou Chun.
The patent application number is CN202610213457 20260213. The ..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Shenzhen Pinghu Laboratory has applied Chinese patent for Composite Substrate and Preparation Method Thereof. Zou Xing, Cui Xinchun and Hu Haolin developed it.
The patent application number is CN202511936304 20251218. The patent publication number is CN121793737 (A). International Patent Classification codes ..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has received Taiwan Semiconductor Manufacturing patent application for Underlayer Composition and Method of Manufacturing Semiconductor Device. Cheng Joy, Luo Yuanzhi, Zi Anren and Guo Yanyou developed the invention.
The patent application number is CN202511740813 2..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has received Zhangjiang Nat Laboratory patent application for Semiconductor Substrate Etching Method and Photoresist Etching Resistance Evaluation Method. Lu Zhan, Peng Xiaojun, Wang Xiang and Zhu Hui'e developed the invention.
The patent application number is CN2..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has published Shenzhen Xinkailai Industry Machine patent application for Combination and Separation Apparatus, Semiconductor Device, and Combination and Separation Method. The invention was developed by Chen Wei, Xu Shui and Jia Huaiyuan.
The patent application numb..
Measurement & Testing
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has published Syscos Instr Shanghai Co Ltd patent application for Wafer Thickness Measuring Device. The invention was developed by Liu Lei, Tang Tiantian, He Li, Liu Dafeng and Su Chenkai.
The patent application number is CN202511770564 20251128. The patent public..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has released Semiconductor Manufacturing International (Shanghai) patent application for Test Method and Test Structure. This invention was developed by Jin Sha and Lu Yifeng.
The patent application number is CN202411386512 20240929. The patent publication number ..
Information Technology
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has published Hubei Jiangcheng Laboratory patent application for Bonding Interface Stress Measurement Method and System. The invention was developed by Luo Chao, Cheng Tiantian, Gao Biao and Wan Yixian.
The patent application number is CN20251253317 20251231. The ..
Optics & Imaging
| Wed 08 Jul 2026
Beijing, July 8 -- Shanghai Optical Communication Co Ltd has sought patent for Detection Device and Etching Equipment. This invention was developed by Cao Shilin and Pan Xinghua.
The patent application number is CN202411380769 20240929. The patent publication number is CN121793724 (A). International Patent Classification code..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has published Chengdu Chenxian Photoelectric patent application for Chip Pick-up Structure, Pick-up Mechanism and Pick-up Mechanism Control Method. The invention was developed by Wang Wanchun and Cao Xuan.
The patent application number is CN202411368325 20240929. ..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has published Nanjing Huarui Microchip Co Ltd patent application for Semiconductor Wafer Clamp and Semiconductor Equipment with Same. The invention was developed by Zheng Junbiao and Hu Zhenhua.
The patent application number is CN20261002711 20260105. The patent p..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Jiangsu Wuxi Jingwei Tiandi Semiconductor Tech Co Ltd has submitted a patent application for Semiconductor Processing Device and Semiconductor Process Equipment. Zhang Gang and Liang Defu developed the invention.
The patent application number is CN20251253212 20251231. The patent publication number is CN121..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has published Mairuijie Nanjing Semiconductor Tech Co Ltd patent application for Wafer Processing Caching Device and Processing Method Thereof. The invention was developed by Li Bin, Wang Cheng, Chen Qunqi, Huang Zhenlong, Zhang Defeng and Zhu Haibing.
The patent ..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Suzhou Xinweisheng Electronic Tech Co Ltd has submitted a patent application for Transfer Manipulator with Particle Pollution Prevention Function Between Wafer Vacuum Chambers. He Ji and Xu Junyi developed the invention.
The patent application number is CN202610261212 20260305. The patent publication number..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Hefei Weiyun Semiconductor Tech Co Ltd has submitted a patent application for Rapid Temperature Adjusting and Cooling System for Electrostatic Chuck (ESC). This invention was developed by Liu Zhaoyu and Wang Jun.
The patent application number is CN20261004198 20260105. The patent publication number is CN121..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has received Chongqing Lingxin Microelectronic Co Ltd patent application for Ultrathin Wafer Thinning Anti-warping Method Based on Glass Slide Bonding. Sun Yuanjiao, Zheng Wenquan and Cai Menglin developed the invention.
The patent application number is CN20261024..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Shenyang Heyan Tech Co Ltd has filed a patent application for Jet Flow Calibration Device and Method, Semiconductor Processing Equipment, Storage Medium and Processor. This invention was developed by Han Yingyan, Hou Ying, Qi Xiaodong, Yuan Huizhu, Wu Hongbai, Li Zhipeng, Xu Peng and Li Wenlong.
The patent ..
Optics & Imaging
| Wed 08 Jul 2026
Beijing, July 8 -- ZC Optoelectronic Tech Ltd has sought patent for Wafer Eccentricity Correction Device with Integrated Horizontal Moving Rotating Shaft and Method. This invention was developed by Zhu Chunsheng, Wu Shengyang, Liu Xinliang, Chen Jian and Cui Xianglong.
The patent application number is CN202511922277 20251218...
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Huatian Technology Xi'an Co Ltd has applied Chinese patent for Stopping Block Mechanism Suitable for Track of Integrated Circuit Packaging Machine. Zhang Geng, Dong Huijun, Zhang Leilei and Shi Junqiang developed it.
The patent application number is CN20261013918 20260107. The patent publication number is C..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Zhiwei Semiconductor Shanghai Co Ltd has submitted a patent application for Movable Wafer Caching Device and Wafer Transmission System. You Jia, Zhu Junjie and Gong Shuaihao developed the invention.
The patent application number is CN20251228732 20251230. The patent publication number is CN121793706 (A). In..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Shenyang Heyan Tech Co Ltd has filed a patent application for Carrying Mechanism for Packaging Workpieces and Semiconductor Processing Equipment. This invention was developed by Han Yingyan, Wu Xuebin, Qi Xiaodong, Yuan Huizhu, Wu Hongbai, Li Zhipeng, Xu Peng and Li Wenlong.
The patent application number is..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Shandong Liansheng Electronic Equipment Co Ltd has submitted a patent application for Silicon Wafer Basket Grabbing Mechanism. Liao Hongzhan, Wang Zhiguang, Li Yan, Cui Shaomeng and Chen Xue developed the invention.
The patent application number is CN202511731312 20251124. The patent publication number is C..
Measurement & Testing
| Wed 08 Jul 2026
Beijing, July 8 -- Dongguan Huashi Crystal Electronic Tech Co Ltd has filed a patent application for Chip Die Bonding Wire Detection Equipment. This invention was developed by Lei Zhijun, Luo Weihuan, Luo Jianhua, Liu Jiahua and Li Qiaoyou.
The patent application number is CN202511320036 20250916. The patent publication numbe..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Boat Bearing Device and Semiconductor Process Equipment. This invention was developed by Han Zenan, Li Chao and Li Jinlong.
The patent application number is CN202411391439 20240930. The patent publication number is CN121793702 (A)..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Aoxinming Semiconductor Equipment Tech Shanghai Co Ltd has sought patent for Die Bonding Equipment and Working Method Thereof. This invention was developed by Zhou Jing, Lam Kui Kam, Chen Jiacheng, Zhao Zhiyu and Wu Yuezhou.
The patent application number is CN202411380104 20240929. The patent publication nu..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Suzhou Xinshinuo Semiconductor Equipment Co Ltd has submitted a patent application for Conveying Box Blowing Device, Conveying Box Storage Device and Conveying Box Blowing Control Method. This invention was developed by Wang Hongyu, Wang Haiyang and Wang Changsheng.
The patent application number is CN202511..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has published Lianyungang Zhixin Electronics Co Ltd patent application for Surface Mounting Machine for Production and Processing of Rotary Die Chip. The invention was developed by Chen Ping.
The patent application number is CN20251257128 20251231. The patent publ..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Quanli Microelectronics Wuxi Co Ltd has submitted a patent application for Dust-free Sealing System and Method for Power Semiconductor Device. This invention was developed by Peng Shiqiu, Li Xin and Tang Dong.
The patent application number is CN20251205241 20251229. The patent publication number is CN121793..
Tools and Machinery
| Wed 08 Jul 2026
Beijing, July 8 -- Suzhou Zhilian Xinhang Semiconductor Co Ltd has filed a patent application for Bridge Rectifier Diode Assembling Auxiliary Tool. This invention was developed by Wang Kai and Tang Jiaqing.
The patent application number is CN202511908101 20251217. The patent publication number is CN121793691 (A). Internationa..
Measurement & Testing
| Wed 08 Jul 2026
Beijing, July 8 -- Shengjisheng Prec Equipment Shanghai Co Ltd has sought patent for Wafer Detection System. This invention was developed by Xu Zhibin, Lan Haiyan and Li Qiang.
The patent application number is CN202511886471 20251215. The patent publication number is CN121793690 (A). International Patent Classification codes ..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- SCREEN Holdings has submitted a patent application for Substrate Processing Apparatus and Substrate Processing Method. This invention was developed by Shinohara Takashi.
The patent application number is CN202511408467 20250929. The patent publication number is CN121793689 (A). International Patent Classificat..
Optics & Imaging
| Wed 08 Jul 2026
Beijing, July 8 -- Canon has submitted a patent application for Production System and Manufacturing Method. This invention was developed by Kishimoto Katsushi and Kawasaki Takashi.
The patent application number is CN202511388186 20250926. The patent publication number is CN121793688 (A). International Patent Classification co..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Shibaura Mechatronics has submitted a patent application for Substrate Processing Apparatus. This invention was developed by Omori Keigo and Liang Chi Angsheng.
The patent application number is CN202511338052 20250918. The patent publication number is CN121793687 (A). International Patent Classification codes..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has received Shibaura Mechatronics patent application for Substrate Processing Apparatus and Substrate Processing Method. Tsuchimochi Takaaki developed the invention.
The patent application number is CN202511151315 20250818. The patent publication number is CN121793..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Beijing NAURA Microelectronics Equipment has sought patent for Semiconductor Process Equipment and Control Method of Semiconductor Process Equipment. This invention was developed by Hou Zheng, Liu Kexue and Sun Yan.
The patent application number is CN202411392285 20240930. The patent publication number is CN1..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has released Beijing NAURA Microelectronics Equipment patent application for Process Chamber, Semiconductor Process Equipment and Preparation Method of Semiconductor Device. This invention was developed by Shen Yuxin, Li Yuan, Zhang Nan, Zhao Lianbo and Wang Kuanmao...
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Beijing E Town Semiconductor Technology has sought patent for Air Inlet Device and Heat Treatment Equipment. This invention was developed by Song Ling, Meng Xiaogang, Pang Yunling and Sheng Tianyou.
The patent application number is CN202411388200 20240930. The patent publication number is CN121793681 (A). I..
Tools and Machinery
| Wed 08 Jul 2026
Beijing, July 8 -- Shanghai Optical Communication Co Ltd has applied Chinese patent for Method for Replacing Gear Control Piece of Etching Machine, and Control Method and Equipment for Replacing Gear Control Piece. Chen Yu, Tao Dong and Li Wenjie developed it.
The patent application number is CN202411386533 20240929. The pate..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Shanghai Optical Communication Co Ltd has submitted a patent application for Wafer Testing System and Wafer Testing Method. Wu Shanwen developed the invention.
The patent application number is CN202411386517 20240929. The patent publication number is CN121793679 (A). International Patent Classification code..
Electrical
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has released Beijing Institute Of Space Mechanics And Electricity patent application for Dry Etching Pretreatment Method. This invention was developed by Chai Ruiqing, Xie Lili, Chen Ruiming, Xie Shengwen and Sun Qiyang.
The patent application number is CN20251182..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has published Chongqing Xinlian Microelectronic Co Ltd patent application for Semiconductor Cleaning Method. The invention was developed by Chi Guowei and Zeng Cancan.
The patent application number is CN202511686705 20251118. The patent publication number is CN121..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Hejian Tech Suzhou Co Ltd has submitted a patent application for Method for Improving Surface Charges of Wafer Before and After Photoresist Removal. This invention was developed by Li Long.
The patent application number is CN202411368352 20240929. The patent publication number is CN121793671 (A). Internatio..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has released Zhejiang Lishui Zhongxin Jingyuan Semiconductor Tech Co Ltd patent application for Scribing Control Method and System for Improving Scribing Quality. This invention was developed by Liu Tengfei, Mao Chen and Yu Chao.
The patent application number is C..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Suzhou Yancai Micro Nano Tech Co Ltd, Xi'an Boyan Weina Information Tech Co Ltd and Suzhou Memstools Semiconductor Tech Co Ltd have filed a patent application for Preparation Method of Ultrathin Soi Structure Based on Side Anisotropic Corrosion and Stress Stripping. This invention was developed by Sun Shiwei a..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Changzhou Hongcheng Electronics Co Ltd has submitted a patent application for High-precision Wafer Cutting Equipment Based on Laser Interference Measurement. Mou Xiaowei developed the invention.
The patent application number is CN202511697687 20251119. The patent publication number is CN121793668 (A). Inter..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Beihang University has applied Chinese patent for High-quality and High-efficiency Thinning Processing Method for Laser Lift-off Semiconductor. Xu Mingjie, Guan Yingchun and Zhang Yuliang developed it.
The patent application number is CN202511524842 20251024. The patent publication number is CN121793667 (A). ..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- State Intellectual Property Office of China has published Zhonghuan Advanced Semiconductor Technology patent application for Method for Controlling Warping Degree by Adjusting Thickness of Back Oxygen Layer. The invention was developed by Luo Yongheng, Wu Xiuxiu, Xie Luxiao, Yuan Jiali, Zhang Qi and Huang Fei...
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Hefei Nexchip Integrated Circuit has filed a patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Lin Shimin, Liu Sutao and Nie Linhui.
The patent application number is CN202610256764 20260304. The patent publication number is CN121793665 (A). Interna..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Chongqing Xinlian Microelectronic Co Ltd has applied Chinese patent for Photoresistance Removing Method and Manufacturing Method of Semiconductor Device. Lu Xiang, Zheng Mingting and Qiu Jingyao developed it.
The patent application number is CN202511732272 20251124. The patent publication number is CN121793..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Chongqing Xinlian Microelectronic Co Ltd has applied Chinese patent for Method for Improving Polycrystalline Silicon Profile. Li Qiumao developed it.
The patent application number is CN202511730106 20251124. The patent publication number is CN121793660 (A). International Patent Classification codes are H10P..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Wuxi Xinzhuo Huguang Semiconductor Co Ltd has applied Chinese patent for Preparation Method of Semiconductor Structure and Semiconductor Structure. Li Xuesong, Liang Debin, Xie Kanglin, Yu Qing and Yan Qixing developed it.
The patent application number is CN202511956304 20251223. The patent publication numb..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Shanghai Jet Plasma Tech Co Ltd has sought patent for High-temperature and High-pressure Silicon Nitride Deep Doping Method Based on Supercritical Fluid Assistance. This invention was developed by Li Junliang and Yang Ping.
The patent application number is CN20261007725 20260105. The patent publication numb..
Semiconductor
| Wed 08 Jul 2026
Beijing, July 8 -- Jiangsu Tanglong Electronic Tech Co Ltd has applied Chinese patent for Multi-donor Element High-purity Silicon Diffusion Source Film and Preparation Method Thereof. Liu Dong, Wan Xing and Zhao Yunfei developed it.
The patent application number is CN202511929558 20251219. The patent publication number is CN1..
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