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Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received Toshiba Electronic Devices & Storage Corp and Toshiba patent application for Chip-stacked Device. Shimooka Yoshiaki developed the invention.
The patent application number is US202619542754 20260218. The patent publication number is US20260271805 (A1). Inter..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Yangtze Memory Tech Holding Co Ltd has filed a patent application for Memory Devices, Fabrication Methods, and Operating Methods Thereof. This invention was developed by Fan Dongyu, Zheng Hao, Liu Lei, Xia Zhiliang, Zhou Wenxi, Huo Zongliang and Gao Tingting.
The patent application number is US20251933..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Toshiba Electronic Devices & Storage Corp and Toshiba have submitted a patent application for Semiconductor Device. This invention was developed by Tsujimura Toshihiro and Liu Jia.
The patent application number is US202519359831 20251016. The patent publication number is US20260271779 (A1). Internation..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Powertech Tech Inc has applied United States patent for Semiconductor Package Module and Method of Manufacturing the Same. Chang Chien Shang-yu and Chen Chih Hao developed it.
The patent application number is US202619555908 20260304. The patent publication number is US20260271774 (A1). International Pa..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- ProAsia Semiconductor Corp has applied United States patent for Wafer Processing Method. Chen Hsi-chih developed it.
The patent application number is US202619556196 20260304. The patent publication number is US20260271676 (A1). International Patent Classification codes are H10P74/20 and H10W46/00. Coop..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- ProAsia Semiconductor Corp has applied United States patent for Thermal Processing Apparatus. Lai Kang-cheng and Cheng Tun-yuan developed it.
The patent application number is US202519408996 20251204. The patent publication number is US20260271655 (A1). Cooperative Patent Classification codes are H10P72..