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Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Taiwan Semiconductor Manufacturing has been granted a patent for Semiconductor Structure with Daisy Chain and a Method of Manufacturing the Same. This invention was developed by Liao Tse-wei, Chou Wei-yu, Chen Yang-che, Lai Chi-hui and Lu Hsiang-tai.
The patent application number is US202318347530 202307..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- United States Patent for Semiconductor Assemblies with System and Methods for Aligning Dies Using Registration Marks has been issued to Micron Technology Inc. This invention was developed by Uchiyama Shiro.
The patent application number is US202418614583 20240322. The patent publication number is US12751..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Fuji Electric has received a patent for Semiconductor Module. This invention was developed by Kishi Tomoya.
The patent application number is US202418588212 20240227. The patent publication number is US12751340 (B2). International Patent Classification codes are H01L25/07, H10W44/00, H10W70/65 and H10W90/..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Macronix has been granted a patent for Memory Device. This invention was developed by Chen Shih-hung.
The patent application number is US202318451159 20230817. The patent publication number is US12751335 (B2). International Patent Classification codes are H01L23/00, H01L23/48, H01L25/065, H10B80/00, H10W..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- GlobalFoundries has been granted a patent for Stress-reduction Structures for a Compound Semiconductor Layer Stack. Cucci Brett, Mitchell Patrick, He Zhong-xiang, Rassel Richard and Hazbun Ramsey developed the invention.
The patent application number is US202318232876 20230811. The patent publication num..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Jiangxi MTC Visual Display Co Ltd has been awarded a patent for LED Panel Structures. This invention was developed by Zhang Haibo, He Shengbin and Gu Wei.
The patent application number is US202318221277 20230712. The patent publication number is US12751325 (B2). International Patent Classification codes ..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Adeia Semiconductor Bonding Technologies has been granted a patent for Direct Bonding Methods and Structures. This invention was developed by Uzoh Cyprian Emeka.
The patent application number is US202318179126 20230306. The patent publication number is US12751323 (B2). International Patent Classification..
Optics & Imaging
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Xiamen Tianma Micro Electronics Co Ltd has obtained a patent for display panel and display device. This invention was developed by Fang Liting, Wang Wei and Chen Xiaofen.
The patent application number is US202318140683 20230428. The patent publication number is US12751322 (B2). International Patent Class..
Optics & Imaging
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- LG Electronics Inc and LG Display have been granted a patent for Display Apparatus. Moon Joonkwon, Park Sungjin, Choi Bongseok and Oh Taesu developed the invention.
The patent application number is US202217742239 20220511. The patent publication number is US12751319 (B2). International Patent Classificat..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- U.S. Patent and Trademark Office has awarded a patent to Fuji Electric for Semiconductor Module. Inoue Daisuke developed the invention.
The patent application number is US202217973941 20221026. The patent publication number is US12751318 (B2). International Patent Classification codes are H01L23/055, H05..
Electronics
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- VisEra Technologies has been awarded a patent for Microelectronic Device. This invention was developed by Chang Chin-ching, Chiu Yi-hua and Shih Wen-yu.
The patent application number is US202418754880 20240626. The patent publication number is US12751316 (B2). International Patent Classification codes are ..
Engineering
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- U.S. Patent and Trademark Office has awarded a patent to Adeia Semiconductor Bonding Tech Inc and Invensas Bonding Tech Inc for Selective Alteration of Interconnect Pads for Direct Bonding. Fountain Jr Gaius Gillman, Fountain Jr Gaius Gillman and Delacruz Javier A developed the invention.
The patent appl..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Samsung Electronics has been granted a patent for Semiconductor Package. This invention was developed by Kim Minjin and Shin Seongho.
The patent application number is US202418615675 20240325. The patent publication number is US12751300 (B2). International Patent Classification codes are H01L25/065, H01L2..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Toshiba Electronic Devices & Storage Corp, KK Toshiba and Toshiba have been awarded a patent for Semiconductor Device. This invention was developed by Suzuki Takeyuki, Katamawari Riku and Kojima Hideharu.
The patent application number is US202318458899 20230830. The patent publication number is US1275129..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Infineon Technologies, Austria has been granted a patent for Semiconductor Device Comprising a Leadframe Adapted for Higher Current Output or Improved Placement of Additional Devices. Treu Julian and Schwab Stefan developed the invention.
The patent application number is US202318374379 20230928. The pate..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Power Master Semiconductor Co Ltd has received a patent for Semiconductor Device. This invention was developed by Kwon Soonho, Lee Taekkeun, Eom Jooyaung and Yoon Ki-myung.
The patent application number is US202318218182 20230705. The patent publication number is US12751296 (B2). International Patent Cla..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- U.S. Patent and Trademark Office has awarded a patent to ROHM for Semiconductor Device. Kano Masaki developed the invention.
The patent application number is US202318491315 20231020. The patent publication number is US12751295 (B2). International Patent Classification codes are H10W70/40 and H10W74/10. C..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Diodes Inc has been granted a patent for Semiconductor Device and Lead Frame. Wei Wu, Xiaorui Yang, Wu Wei and Yang Xiaorui developed the invention.
The patent application number is US202318193596 20230330. The patent publication number is US12751294 (B2). International Patent Classification codes are H0..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Taiwan Semiconductor Manufacturing has been awarded a patent for Package Structure with Transmission Line and Method for Manufacturing the Same. This invention was developed by Liao Wen-shiang.
The patent application number is US202318343107 20230628. The patent publication number is US12751293 (B2). Int..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing for Package Structure Including Ring Structure Attached by Hybrid Adhesive and Methods of Forming the Same. Liu Kuo-chio, Chiang Yi-che, Kuo Chien-li, Lin Wen-yi and Li Chien-chen developed the invention.
The pate..
Computer Hardware
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- United States Patent for Semiconductor Structures Including Auxetic Microstructures and Method of Forming the Same has been issued to SanDisk Technologies. This invention was developed by Yokomizo Yushi.
The patent application number is US202217809386 20220628. The patent publication number is US12751291..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- ROHM has been awarded a patent for Nitride Semiconductor Device. This invention was developed by Shikata Keita.
The patent application number is US202318471333 20230921. The patent publication number is US12751287 (B2). International Patent Classification codes are H01L29/20, H01L29/417, H01L29/66, H01L29/..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- NXP BV has been granted a patent for finFet with Local Heatsinking and Method of Manufacturing the Same. Tam Sai-wang, Dinh Viet Thanh and Perera Asanga H developed the invention.
The patent application number is US202318506248 20231110. The patent publication number is US12751286 (B2). International Pat..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Hitachi Energy Switzerland AG has been granted a patent for Semiconductor Power Module and Method for Manufacturing a Semiconductor Power Module. This invention was developed by Roesch Andreas, Guillon David, Bayer Martin, Salvatore Giovanni and Fischer Fabian.
The patent application number is US20221802..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Taiwan Semiconductor Manufacturing has secured a patent on Interconnect Design of a Thin Film Resistor. Huang Chang-yu, Chen Chun-heng, Lin Hung-han, Liang Yu-wei, Chang Liang-yi and Hsiao Ru-shang developed the invention.
The patent application number is US202318304755 20230421. The patent publication n..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Taiwan Semiconductor Manufacturing has been awarded a patent for Metal-insulator-metal Structures and Methods of Forming the Same. This invention was developed by Chen Sheng-chau and Cheng Chung-liang.
The patent application number is US202318335838 20230615. The patent publication number is US12751283 (..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Nanya Tech has secured a patent on Semiconductor Device Structure with Dielectric Liner Portions and Method for Preparing the Same. Huang Tse-yao developed the invention.
The patent application number is US202318380893 20231017. The patent publication number is US12751282 (B2). International Patent Class..
Electronics
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- U.S. Patent and Trademark Office has awarded a patent to Samsung Electronics for Interconnect Structure and Electronic Device Including the Same. Lee Eunkyu, Lee Changseok, Byun Kyung-eun, Shin Keunwook, Yoo Joungeun, Jung Alum and Kim Sangwon developed the invention.
The patent application number is US202..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- U.S. Patent and Trademark Office has awarded a patent to Samsung Electronics for Semiconductor Package and Method of Manufacturing the Same. Park Jiyoung, Song Hosin, Lee Sera and Ko Yeongkwon developed the invention.
The patent application number is US202418612137 20240321. The patent publication number..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- KIOXIA has been awarded a patent for Semiconductor Storage Device and Manufacturing Method Thereof. This invention was developed by Takeishi Tomoyuki and Ashidate Hiroaki.
The patent application number is US202318178008 20230303. The patent publication number is US12751278 (B2). International Patent Clas..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Socionext has received a patent for Semiconductor Integrated Circuit Device. This invention was developed by Shinohara Hayato.
The patent application number is US202418609760 20240319. The patent publication number is US12751274 (B2). International Patent Classification codes are H01L23/528, H10D84/90 and ..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Micron Technology has received a patent for Memory Device Having 2-transistor Vertical Memory Cell and a Common Plate. This invention was developed by Sarpatwari Karthik, Ramaswamy Durai Vishak Nirmal, Karda Kamal M and Liu Haitao.
The patent application number is US202318234602 20230816. The patent publ..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing for Connecting Structure and Method for Forming the Same. Lee Chia Chen, Peng Shih-wei, Chen Kuan Yu and Wu Chia-tien developed the invention.
The patent application number is US202318152784 20230111. The patent p..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing for Device Having CFET with Power Grid Rails in Second Metallization Layer and Method of Manufacturing Same. Tzeng Jiann-tyng, Tzeng Wei-cheng, Lin Wei-cheng, Chen Kuan Yu, Peng Shih-wei and Lin Chun-yen developed th..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Samsung Electronics has been granted a patent for Vertical Semiconductor Devices. This invention was developed by Kim Sukhoon, Kong Myungho and Cho Hoon.
The patent application number is US202218055530 20221115. The patent publication number is US12751265 (B2). International Patent Classification codes are..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- International Business Machines has received a patent for Local Line Extension for Enlarged Via-to-line Contact Area. This invention was developed by Xie Ruilong, Lanzillo Nicholas Anthony, Vega Reinaldo, Anderson Brent A, Chu Albert M and Clevenger Lawrence A.
The patent application number is US20221793..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been awarded a patent for Fin Structures. This invention was developed by Chang Huicheng, Lu Chun-yang, Chen Tz-shian, Yeo Yee-chia and Wang Li-ting.
The patent application number is US202217807324 20220616. The patent publication number is US12751257 (B2). I..
Optics & Imaging
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- U.S. Patent and Trademark Office has awarded a patent to Genesse Valley Innovations LLC and Palo Alto Research Center for Optically Activated Object Mass Transfer Using Multiple Optical Energy Sources. Chua Christopher L, Lin Ching-fuh and Yang Zhihong developed the invention.
The patent application numb..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Taiwan Semiconductor Manufacturing has been granted a patent for Semiconductor Processing Tool and Methods of Operation. This invention was developed by Chen Yan-cheng, Liu Jun Xiu, Chuang Kai-lin, Chou Chung-pin and Huang Sheng-wen.
The patent application number is US202418782313 20240724. The patent pu..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Taiwan Semiconductor Manufacturing has been awarded a patent for Wafer Alignment Assembly of the Solder Reflow System. This invention was developed by Wang Hsin-tai, Chang Chen Liang, Lee Chia-ching, Peng Chi-chun, Chang Kuo Hui and Tsai Tung-hsuan.
The patent application number is US202217817603 2022080..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Tokyo Electron has received a patent for Substrate Processing Apparatus and Substrate Processing Method. This invention was developed by Matsuyama Kenichirou.
The patent application number is US202118036079 20211102. The patent publication number is US12751246 (B2). International Patent Classification code..
Oil & Gas
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Entegris has been granted a patent for Purge Flow Distribution System for a Substrate Container and Method for Performing the Same. This invention was developed by Fuller Matthew A, Eggum Shawn D, Harr Colton J, Smith Mark V, Wilkie Thomas H and Zabka Michael C.
The patent application number is US202217973..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- United States Patent for Prevention of Contamination of Substrates During Gas Purging has been issued to Applied Materials. This invention was developed by Puri Amitabh, Reuter Paul B, Kaplan Russell and Baumgarten Douglas Brian.
The patent application number is US202418814094 20240823. The patent public..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Samsung Electronics has been granted a patent for Module Tray for Semiconductor Device. Kim Taegeon developed the invention.
The patent application number is US202418962104 20241127. The patent publication number is US12751243 (B2). International Patent Classification codes are H10P72/00 and H10P72/10. Coo..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Viavi Solutions Suzhou Co Ltd has been awarded a patent for Cover for a Wafer. This invention was developed by Liu Ling and Zhou Liang.
The patent application number is US202418608524 20240318. The patent publication number is US12751242 (B2). International Patent Classification codes are H01L21/673, H10..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Tokyo Electron has obtained a patent for container, container partition plate, substrate processing system, and substrate transfer method. This invention was developed by Numakura Masahiro, Kaise Seiichi, Takeyama Yuki and Toyomaki Toshiaki.
The patent application number is US202318198928 20230518. The pat..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Applied Materials has secured a patent on Multi-target Design for In-situ Analysis of Semiconductor Fabrication Process. Egan Todd J and Hao Yudong developed the invention.
The patent application number is US202318203353 20230530. The patent publication number is US12751240 (B2). International Patent Cla..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- United States Patent for Temperature Control System with Flammable Heat Transfer Fluid has been issued to Applied Materials. This invention was developed by Chenna Varun Kumar and Mathew Rony David.
The patent application number is US202418431051 20240202. The patent publication number is US12751236 (B2)..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- U.S. Patent and Trademark Office has awarded a patent to Samsung Electronics for Semiconductor Transport System and Method of Transporting Semiconductor. Lee Sangyong, Chang Minseock, Roh Kibong, Hong Inki, Lee Jinyoung, Kwak Kunho, Kwon Jaehong and Lim Kyungjin developed the invention.
The patent applicat..
Oil & Gas
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- U.S. Patent and Trademark Office has awarded a patent to Baker Hughes Oilfield Operations for Transducers Including Laser Etched Substrates. Jung Sebastian, Kruspe Thomas and Herbel Andreas developed the invention.
The patent application number is US202418600206 20240308. The patent publication number is U..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- Applied Materials has been granted a patent for Selective Etching Between Silicon-and-germanium-containing Materials with Varying Germanium Concentrations. Yao Bin, Wang Anchuan, Li Zihui and Kao Chia-ling developed the invention.
The patent application number is US202418790457 20240731. The patent publi..
Semiconductor
| Wed 07 Oct 2026
Alexandria, Oct. 6 -- U.S. Patent and Trademark Office has awarded a patent to Applied Materials for Etching Substrates Using Vapor Adsorption. Ranjan Alok, Lee Geuntak and Sherpa Sonam Dorje developed the invention.
The patent application number is US202318539892 20231214. The patent publication number is US12751225 (B2). In..