Chemicals
| Sat 19 Sep 2026
Seoul, Sept. 19 -- Electronics & Telecommunications Research Institute has sought patent for Method for Dipping of Adhesive Material. This invention was developed by Lee Chanmi, Jiho Joo, Eom Yong Sung, Gwang Mun Choi, Yun Ho Gyeong, Oh Jin Hyuk, Jang Ki Seok, Shin Jungho, Choi Kwang Seong and Moon Seok Hwan.
The patent applica..