Construction
| Tue 03 Nov 2026
Beijing, Nov. 3 -- Chinese Patent for Dust-free Cutting Device for Building Floor Tiles has been issued to Tangshan Wenlv Construction Eng Co Ltd. This invention was developed by Sun Liying, Wu Jiao, Li Mingchen, Liu Ruifu, Ma Yifan, Zhang Shuwen, Jiang Xueping, Xue Feng, Cong Wei, Qin Jia and Zhao Xing.
The patent applicatio..