Metal & Mining
| Sun 05 Jul 2026
Munich, July 6 -- Intel has applied European patent for Package Substrates with Components Included in Cavities of Glass Cores. Marin Brandon Christian, Shan Bohan, Hariri Haifa, Tanaka Hiroki, Ecton Jeremy, Duan Gang, Kandanur Sashi Shekhar, Vehonsky Jacob Ryan, Stacey Joshua James, Pietambaram Srinivas Venkata Ramanuja, People..