Plastics
| Tue 09 Jun 2026
Taipei, June 9 -- LG Chemical has submitted a patent application for Thermosetting Resin Composition, Insulating Film Comprising Same and Printed Circuit Board. This invention was developed by Park Jun-wuk, Kim Bo-kyung, Kim Tae-soon, Park Da-seul, Yoon Young-sik, Lee Jong-hwa, Choi Byung-ju and Hwang Seong-min.
The patent ap..