Plastics
| Fri 30 Jan 2026
Beijing, Jan. 31 -- Sichuan Haiying Electronic Technology has submitted a patent application for Packing Device and Method for Packing Resin Columns in Multiple Through Holes of IC Carrier Plate. This invention was developed by Lu Xiaoyan, Wang Jianquan, Zhou Aijun, Zhao Qiang, Tao Yinghui, Li Baoxia, Wu Rui, Li Peng, Li Xu and ..