News For Last 1 Week
Industry
X
Assignee
Country
Status
-
Select All
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Chinese Patent for Supporting Tool Structure for MOS Packaging has been issued to Shenzhen Surbaner Tech Co Ltd. This invention was developed by Luo Liang.
The patent application number is CN202422703973U 20241107. The patent publication number is CN223492266 (U). International Patent Classification code ..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Chinese Patent for Anti-displacement Chip Mounting Device for SMT Chip Mounter has been issued to Shenzhen Hanhaixing Ind Co Ltd. This invention was developed by Xiong Daidi and Liu Fabing.
The patent application number is CN202422967271U 20241203. The patent publication number is CN223488650 (U). Interna..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Chinese Patent for Wafer Cleaning Device and Wafer Processing Equipment has been issued to Zhejiang Jinray Electronic Mat Co Ltd. This invention was developed by Ouyang Penggen, Sheng Yongjiang, Yang Shuimiao, Liu Xiaoqin, Zhao Yangyang, Li Jiaqiang and Wang Qihang.
The patent application number is CN2024..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has awarded a patent to Sichuan Mincheng Electronic Co Ltd for Tool for Welding and Positioning MOS (metal Oxide Semiconductor) Tube. Yang Hongwei, Xu Xueyou, Lv Wanchun and Feng Baoling developed the invention.
The patent application number is CN202422859170U 2..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has awarded a patent to Jiangsu Liduo Intelligent Tech Co Ltd for Dispensing Machine for Chip Packaging. Yao Liangliang and Tang Lisa developed the invention.
The patent application number is CN202422543593U 20241022. The patent publication number is CN223491256..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has awarded a patent to Xi'an Yep Telecommunication Tech Co Ltd for Clamp Plate and System for Testing Performance of High-speed Interface of Chip. Luo Shipiao developed the invention.
The patent application number is CN202422782419U 20241114. The patent publica..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has awarded a patent to Sichuan Siaipu Electronic Tech Co Ltd for High-integration-level Gallium Arsenide S-waveband Receiving Multifunctional Chip. Wang Ren, Sun Yiming and Wang Jiaxing developed the invention.
The patent application number is CN20242361826U 20..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Guangdong Xinyue Tech Co Ltd has been awarded a patent for Packaging Structure of Water Quality Sensitive Chip. This invention was developed by Sun Mingrui and Jin Jiandong.
The patent application number is CN202422881084U 20241125. The patent publication number is CN223485899 (U). International Patent Cl..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Taizhou City Haiying Mech And Electrical Co Ltd has been awarded a patent for Laser Welding Device for Stator Silicon Steel Sheet. This invention was developed by Duan Haifeng, Li Zhixin, Chen Xi, Wang Tao and Li Ziqiang.
The patent application number is CN202422862238U 20241123. The patent publication nu..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Yunnan Tianchuang Energy Mat Co Ltd has been awarded a patent for Automatic Metal Silicon Casting System. This invention was developed by Lin Xiang, Chen Jing and Yang Jincai.
The patent application number is CN202520104890U 20250116. The patent publication number is CN223492058 (U). International Patent ..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Shandong Semiconductor Res Institute has been awarded a patent for Cleaning Equipment for Semiconductor Coating Production. This invention was developed by Wang Hongbo and Li Zhifeng.
The patent application number is CN202422916481U 20241128. The patent publication number is CN223491535 (U). International..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Zhejiang Jiapu Tech Co Ltd has been awarded a patent for Switching Circuit Using Hall Chip. This invention was developed by Pan Jianting, Tao Wenjian and Cai Zhigang.
The patent application number is CN202422622608U 20241029. The patent publication number is CN223488213 (U). International Patent Classific..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has awarded a patent to Yongping Taida Waste Residue Dev Utilization Co Ltd for Remelting Device for Producing High-purity Silicon by Using Silicon Slag. Yang Shi, Zhou Xu, Tuo Kaizheng, Peng Bixian and Wang Zhiqiang developed the invention.
The patent applicati..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has awarded a patent to Wuxi Zhirong Electronic Co Ltd for Voltage Reference Chip Control Post-stage Load Power Supply Circuit. Fu Cheng developed the invention.
The patent application number is CN202422939622U 20241129. The patent publication number is CN223487..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Beijing Reach Micro Electronics Tech Co Ltd has been awarded a patent for Under-voltage Protection System of Driving Chip. This invention was developed by Lin Yu and Zheng Zejian.
The patent application number is CN202422972106U 20241203. The patent publication number is CN223487845 (U). International Pat..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has awarded a patent to Raytek Semiconductor Inc for Substrate Structure with Through Silicon Vias. Lin Jiancai, Dai Guorui, Li Quanfeng and Lin Junhong developed the invention.
The patent application number is CN202422791893U 20241115. The patent publication nu..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Paibo Tech Co Ltd and Dongguan Paibo Tech Co Ltd for Heat Sink Structure and Semiconductor Device with Same. An Yi, Qin Taimeng, Chen Qi and Chen Wei developed the invention.
The patent application number is CN202422802824U 20241..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has awarded a patent to Dongguan Xiongshun Hardware Products Co Ltd for Machining Device for Stacking Silicon Steel Sheets. Hu Luwu, Shi Xianhai, Fang Rongjun and Lu Ruzhuang developed the invention.
The patent application number is CN202422942351U 20241130. The..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Guangdong Advanced Ceramic Material Tech Co Ltd has been awarded a patent for Inner Electrode Pattern of Chip Multilayer Ceramic Capacitor. This invention was developed by Qiu Jihua and Chen Shuo.
The patent application number is CN202422745401U 20241111. The patent publication number is CN223486865 (U). ..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has awarded a patent to Zhejiang Yuanjin Electronic Tech Co Ltd for Beam Welding Alloy Current Detection Chip Resistor. Bao Jingda developed the invention.
The patent application number is CN202422459916U 20241011. The patent publication number is CN223486770 (U..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Weihai Daewoo Electronics Co Ltd has been awarded a patent for Liquid-cooled OLED Display. This invention was developed by Yu Weihai and Sun Huabo.
The patent application number is CN202422863210U 20241123. The patent publication number is CN223486653 (U). International Patent Classification codes are G09..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has awarded a patent to Wuhan BOE Photoelectric Technology Co Ltd and BOE Technology Group for Display Substrate and Display Device. Tian Zihan, Cheng Liang, Liu Xin, Jiang Peng, Ding Jun, Huang Junling, Wang Hui and Liu Jiantao developed the invention.
The pate..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Hongmao Tech Co Ltd has been granted a patent for Laser Slicing Device for Silicon Carbide Wafer. Xie Chengjing developed the invention.
The patent application number is CN202422442889U 20241010. The patent publication number is CN223492327 (U). International Patent Classification codes are B23K26/362, B2..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Hangzhou Xinyun Optoelectronics Tech Co Ltd has been granted a patent for Anti-seismic Silicon Light Modulator. This invention was developed by Huang Xiaowei and Xia Xiaoliang.
The patent application number is CN20242340840U 20241210. The patent publication number is CN223486303 (U). International Patent ..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Suzhou Luoke Equipment Tech Co Ltd has been granted a patent for Cleaning and Spraying Device of Wafer Spin-drying Equipment and Spin-drying Equipment. Yang Xinguo, Su Jianbin and Qiu Wei developed the invention.
The patent application number is CN202422170729U 20240905. The patent publication number is C..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Nanjing Puneng Communication Tech Co Ltd has been granted a patent for Classification Device Based on Chip Packaging Test. This invention was developed by Ruan Zhancang and Shi Qiuming.
The patent application number is CN202422913769U 20241128. The patent publication number is CN223491465 (U). Internation..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Yangzhou Yinghang Silicon Industry Tech Co Ltd has been granted a patent for Screening Device for Metal Silicon Powder Production. This invention was developed by Gao Zhongming, Gao Sheng and Xing Pengfei.
The patent application number is CN202422865120U 20241125. The patent publication number is CN223491..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Yangzhou Yinghang Silicon Industry Tech Co Ltd has secured a patent on Cooling Mold for Metal Silicon Production. Gao Sheng, Gao Zhongming and Xing Pengfei developed the invention.
The patent application number is CN202422803665U 20241118. The patent publication number is CN223492045 (U). International Pa..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Jiangsu Jiangyong New Materials Science and Tech Co Ltd has been granted a patent for Sealant Extrusion Device for Solar Cell Module. This invention was developed by Pan Jianjun and Xu Lanping.
The patent application number is CN202421533647U 20240628. The patent publication number is CN223491250 (U). Int..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Suzhou Qingxinzhuo Semiconductor Equipment Co Ltd has secured a patent on Flow Adjusting Device for Wafer Cleaning Machine. Ma Hongfang and Wang Wei developed the invention.
The patent application number is CN202422140006U 20240902. The patent publication number is CN223491505 (U). International Patent Cl..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Shanghai Dabeirui Industrial Intelligent Tech Co Ltd has been granted a patent for Motor Cooling and Heating System Based on Ceramic Chip. Xie Nengbin developed the invention.
The patent application number is CN202422411612U 20240930. The patent publication number is CN223488030 (U). International Patent ..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Shenzhen Luxiang Tech Co Ltd has obtained a patent for circuit structure of hall current sensor chip and hall current sensor chip. This invention was developed by Zhou Jingxu and Liu Weimin.
The patent application number is CN202422828768U 20241120. The patent publication number is CN223486067 (U). Intern..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Shandong Zhonglian Chemical Co Ltd has secured a patent on Super Airflow Crushing Device for Producing Food Silicon Dioxide Anti-caking Agent. Wang Baofu developed the invention.
The patent application number is CN202422847882U 20241121. The patent publication number is CN223491090 (U). International Pate..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Zhejiang Hoya Electronic Control System Co Ltd has obtained a patent for phase sensor assembly. This invention was developed by Han Weida.
The patent application number is CN202422961082U 20241202. The patent publication number is CN223487503 (U). International Patent Classification codes are G01B21/00, G..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Zhuhai Smart Ware Tech Co Ltd has been granted a patent for Protection Circuit of Charging and Discharging Chip, Charging and Discharging Chip and Electronic Equipment. Xiong Chaohui developed the invention.
The patent application number is CN202422911417U 20241127. The patent publication number is CN2234..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Kunming Yicheng Electromechanical Tech Development Co Ltd has secured a patent on Clamp for Chip Cleaning. Zhang Meng, Lin Yang, Li Yimin, Liu Yanzhen and Ren Yuan developed the invention.
The patent application number is CN202520117362U 20250118. The patent publication number is CN223487038 (U). Internat..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Zhongxin Taihe Yiyuan Electronic Mat Co Ltd has been granted a patent for Epoxy Plastic Package Structure for Flip Chip. This invention was developed by Wang Cheng, Yang Donghui and Niu Mingjian.
The patent application number is CN202520181481U 20250205. The patent publication number is CN223487051 (U). I..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has released South China University of Technology and Dymatic Chemicals Inc patent application for Hydrophilic Organic Silicon Softening Agent for Chemical Fibers as Well as Preparation Method and Application of Hydrophilic Organic Silicon Softening Agent. This in..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has released Aoxin Semiconductor Tech Taicang Co Ltd patent application for Conveying Equipment and Conveying Method for Glass Substrate Packaging. This invention was developed by Liu Zheng'ai, Tao Zipeng, Hong Ji-wang and Hua Dezheng.
The patent application num..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has released Guangdong Changhua Tech Co Ltd patent application for Automatic Feeding Method for Chip Packaging and Related Device. This invention was developed by Wang Jinhua and Wang Zhi.
The patent application number is CN202511444922 20251010. The patent publ..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has released Shanghai Fulehua Semiconductor Tech Co Ltd and Jiangsu Fulehua Power Semiconductor Research Institute patent application for Copper-plated Substrate Double-sided Plane Chemical Mechanical Polishing Method. This invention was developed by Liu Jingkun, G..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has released Wuxi Geruisi Prec Machinery Co Ltd patent application for Drilling Equipment of Semiconductor Equipment Mounting Plate and Processing Technology of Drilling Equipment. This invention was developed by Qin Chun, Liu Haichao and He Zengrong.
The patent..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has published Jiangsu Bolan Xiwei Metal Tech Co Ltd patent application for Equipment for Preparing Lead-free Paste for QFN (quad Flat No-lead) Chip. The invention was developed by Hong Zhigang, Ding Mingyao, Liu Guangming, Zhu Xiaoyan, Wang Yahui and Liu Xiaoqin.
..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has published Nantong University and Haian Nantong Univ High End Textile Research Institute patent application for Nylon Chip Spinning Equipment Based on Textile Engineering. The invention was developed by Yan Tingting, Chen Yanshu, Zhou Jingling, Long Tongna and S..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has published Ningbo Institute of Materials Technology & Engineering, Chiense Academy of Sciences and Ningbo Cixi Inst Of Biomedical Engineering patent application for Polymerase Substrate for Isolating Fluorescent Molecules by Using DNA (deoxyribose Nucleic Acid) ..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has published Suzhou Peiqi Material Tech Co Ltd patent application for Low-temperature Self-drying High-temperature-resistant Organic Silicon Coating and Preparation Method Thereof. The invention was developed by Gu Jing, Lu Yu, He Libin and Ye Fuqiang.
The pate..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has published Hang Cheung Coatings Huiyang Ltd patent application for Plastic Toy Substrate Ceramic-imitating Glaze Dipping Paint and Preparation and Construction Method of Plastic Toy Substrate Ceramic-imitating Glaze Dipping Paint. The invention was developed by ..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Huang Wenfu has submitted a patent application for Multi-substrate Adaptive High-performance Composite Coating and Preparation Method Thereof. Huang Wenfu developed the invention.
The patent application number is CN20251154954 20250730. The patent publication number is CN121045616 (A). International Paten..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Anhui Jingkai Electronic Mat Co Ltd has submitted a patent application for Polycyclic Aromatic Hydrocarbon Tadf-oled Main Body Material with Bipolar Transmission Characteristic, Metal-free Synthesis Method and OLED Device Processed by Solution of Polycyclic Aromatic Hydrocarbon Tadf-oled Main Body Material. ..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Guigang Microchip Tech Co Ltd has submitted a patent application for Method for Preparing P-(1-ethoxyethoxy) Styrene. Yao Zhiyi and Lu Changyin developed the invention.
The patent application number is CN202511209400 20250827. The patent publication number is CN121044975 (A). International Patent Classifi..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Zhejiang Kingcred New Mat Co Ltd has submitted a patent application for High-temperature-resistant Dynamic Anti-skinning Silicon Carbide Microcrystalline Plate and Preparation Method Thereof. Zhu Guoping, Wang Liwang, Wang Qi, Zhu Yuping, Peng Jingjing, Li Xinming and Fang Lihua developed the invention.
T..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Qilu Medical Univ has submitted a patent application for Diw 3D Printing Silicon Nitride Dental Ceramic and Preparation Method Thereof. This invention was developed by Xue Jing, Dong Gang, Chu Wei, Wang Jing, Jiang Chunrong, Sun Qichen and Yan Feifei.
The patent application number is CN202511606957 202511..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has received Hoya and Hoya Photoelectric Tech Weihai Co Ltd patent application for Optical Glass, Optical Element, Light Guide Plate and Image Display Device. Sasaki Hayato developed the invention.
The patent application number is CN202510709628 20250529. The pa..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Tibet Guisu Water Tech Development Co Ltd has submitted a patent application for Wastewater Treatment Device for Silicon Bacterial Fertilizer Production. This invention was developed by Xu Xiaoguang and Tan Weiquan.
The patent application number is CN202511481077 20251016. The patent publication number is..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has received Anhui North Microelectronics Res Institute Group Co Ltd patent application for MEMS Micro Differential Pressure Chip and Preparation Method Thereof. Cao Weida, Zhao Bin, Song Jidi, Chen Pu and Wang Peng developed the invention.
The patent applicatio..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Sichuan Micron Vip New Mat Co Ltd has submitted a patent application for Continuous Edge Rolling Equipment for Vacuum Insulated Panel. This invention was developed by Wu Shengxuan, Hu Wei, Zhang Xu, Cheng Xueyu and Yu Yao.
The patent application number is CN202511320151 20250916. The patent publication nu..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Shenzhen Huifuxin Tech Co Ltd has submitted a patent application for Tire Chip Signal Receiving Method and System Based on Diamond Woven Mesh Antenna. Han Ling and Pan Zhigang developed the invention.
The patent application number is CN202511453591 20251013. The patent publication number is CN121043536 (A..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has received Nantong Jiapeng New Material Tech Co Ltd patent application for Material Grinding Equipment for Polyester Chip Processing. Chen Xiaofeng developed the invention.
The patent application number is CN202511389659 20250926. The patent publication number..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Hangzhou Zhixin Semiconductor Co Ltd has submitted a patent application for Sand Blasting Anti-breakdown Processing Method for Surface of Semiconductor Wafer Base. Lu Minfeng and Ye Dingyun developed the invention.
The patent application number is CN20251118178 20250723. The patent publication number is C..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Jiangxi Yufeng Circuit Co Ltd has submitted a patent application for Edge Grinding Device for Copper Substrate Machining. This invention was developed by Yan Hao, Li Xiang, Li Daxin, Pei Guangmei and Lai Suzhen.
The patent application number is CN202511377154 20250925. The patent publication number is CN1..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Hangzhou Lyucheng Electromechanical Co Ltd has received a patent for Single-fan Semiconductor Refrigeration Helmet. This invention was developed by Tian Xiangning, Li Ning, Wang Yan, Tian Jianing, Wang Yalin, Shen Fengqiang, Ning Taigang and Mao Yingjie.
The patent application number is CN20242346704U 202..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Jiangsu Minchuang Communication Tech Co Ltd has received a patent for Shielding Cover for Enhancing Heat Dissipation of Chip. This invention was developed by Hu Chunrong.
The patent application number is CN202422584242U 20241025. The patent publication number is CN223488643 (U). International Patent Class..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Shanghai Fuxi Thinksky Tech Co Ltd has received a patent for Satellite Sailboard Multi-size Perovskite Solar Cell Parallel Positioning Auxiliary Adjustable Carriage. This invention was developed by Jiao Jian, He Jianing, Xu Shilong, Xu Wang, Lan Ruixue, Dou Yangzhen and Liu Shuai.
The patent application n..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Zhuhai Smart Electronic Mat Co Ltd has submitted a patent application for Soft Gold Electroplating Solution as Well as Preparation Method and Application Thereof. This invention was developed by Wu Shixiang and Yang Hui.
The patent application number is CN202511212826 20250828. The patent publication numb..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has received Xingyi Normal Univ For Nationalities patent application for Method for Aluminum Step-by-step Electrolysis by Using Silicon Carbide Electrode. Lei Yuanqing developed the invention.
The patent application number is CN202511205234 20250827. The patent ..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Sinochip Semiconductor Tech Co Ltd has submitted a patent application for Dry Vacuum System with Vcsel Chip Having Variable Volume Function. Liang Gaoming, Wang Xiaoqin, Chen Yun, Lee Wang-rim, Tian Zhengru, Tang Xiujuan and Yao Shun developed the invention.
The patent application number is CN202511596204..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Shenzhen Weipan Tech Co Ltd has received a patent for Semiconductor Integrated MOS Tube Structure. This invention was developed by Xie Fengxiong, Deng Yibing and Zhang Tangfeng.
The patent application number is CN202422875874U 20241122. The patent publication number is CN223487056 (U). International Paten..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Sino Nitride Semiconductor Co has submitted a patent application for Grinding and Polishing Solution for Gallium Nitride Wafer. Huang Zijie, Zhang Ruihua, Yan Jianfeng and Zhuang Wenrong developed the invention.
The patent application number is CN202510983777 20250716. The patent publication number is CN1..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Shanghai Haitai Hongli Energy Co Ltd has submitted a patent application for Organic Silicon Modified External Wall Thermal Insulation Coating and Preparation Method Thereof. This invention was developed by Zhang Hongkun, Wang Hongmei, Wang Qing, Zhu Chao, Xu Yabei, Dai Jun and Yang Zhenglong.
The patent a..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has received Heilongjiang Xinbahe Biotechnology Co Ltd patent application for Oak Chip for Ageing High-quality Beer as Well as Preparation Method and Application of Oak Chip. Huang Di, Chen Zhijun, Li Jian, Wang Min, Li Qi, Liu Chunfeng, Niu Chengtuo, Guan Yu, Li W..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Jiangsu Chuangyi Prec Forging Co Ltd has submitted a patent application for Cold Forging Forming Nickel Plating Process for Red Copper IGBT (insulated Gate Bipolar Translator) Heat Dissipation Substrate. Chen Xuefeng, Nie Xiangyi, Zhu Jun and Zhang Chaozhong developed the invention.
The patent application..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Nanjing Jingyao Xinhui Semiconductor Tech Co Ltd has submitted a patent application for Alignment Welding Device for Semiconductor Laser. This invention was developed by Huai Chen, Li Xiaohan and Li Yannian.
The patent application number is CN202511263563 20250905. The patent publication number is CN12104..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Guizhou Quanxin New Mat Co Ltd has submitted a patent application for Method for Preparing Semiconductor Thermal Inductance Power Generation Chip from Metal. This invention was developed by Ren Yunfu, Yang Hairong, Sun Zhibiao, Li Juan, Gong Junhong and Chai Zewen.
The patent application number is CN20251..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Hangzhou Luntek Tech Co Ltd has submitted a patent application for Pre-pressing Device and Method for Crimping Tool of Semiconductor Test Sorting Machine. Chen Yinwei, Song Shenshen, Zhou Mengqi and Gong Yunpeng developed the invention.
The patent application number is CN202511267742 20250905. The patent ..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Jiangsu Aoguang Electronics Co Ltd has submitted a patent application for Movable Adsorption Type Electroplating Water Replacement Mechanism. This invention was developed by Huang Qiao, Ren Qingying, Wu Ling, Meng Xiaoyong, Wu Debao and Li Wei.
The patent application number is CN202511351499 20250922. The..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Jiangsu Saiouxinyue Defoamer Co Ltd has submitted a patent application for Organic Silicon Defoaming Composition Used in Anti-cancer Drug and Preparation Method of Organic Silicon Defoaming Composition. This invention was developed by Chen Shihai, Yang Baizhong, Hu Mingming and Yang Yingchao.
The patent a..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Shenzhen Chaoying Intelligent Tech Co Ltd has received a patent for Calibration Circuit Board for Chip Detection Jig. This invention was developed by Xia Junjie, Lin Huasheng and Gu Hongwei.
The patent application number is CN202422455715U 20241010. The patent publication number is CN223486166 (U). Intern..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Guangzhou Weier Electronics Co Ltd has received a patent for High-speed Self-checking Device for PCB Finished Products with Multiple MOS Devices. This invention was developed by Wu Guohong and Chen Jiabao.
The patent application number is CN202422493891U 20241015. The patent publication number is CN223486..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Shenzhen Lianxin Measurement & Control Co Ltd has received a patent for Tool Clamp for Chip Testing. This invention was developed by Chen Kun, Li Qingwei and Ding Yinzhi.
The patent application number is CN202422382456U 20240929. The patent publication number is CN223486021 (U). International Patent Class..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Suzhou Zhuomao Photoelectric Tech Co Ltd has received a patent for Substrate Conveying and Positioning Device of Online Inspection Machine. This invention was developed by Wang Eyu and Lai Qiyong.
The patent application number is CN202422845445U 20241121. The patent publication number is CN223485813 (U). ..
Semiconductor
| Thu 16 Apr 2026
Warsaw, April 16 -- Instytut Tech Elektronowej has submitted a patent application for Method of Connecting Semiconductor Wafers. This invention was developed by Szerling Anna, Kosiel Kamil, Prokaryn Piotr, Ozyuzer Lutfi, Aygun Ozyuzer Gulnur and Ozdemir Koklu Mehtap.
The patent application number is PL20190428588 20190115. Th..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Shenzhen Zhenmao Jia Semiconductor Co Ltd has received a patent for Double-sided Heat Dissipation Power Semiconductor Packaging Structure and Electronic Device. This invention was developed by Xie Wenhua and Ren Weiqiang.
The patent application number is CN20242346745U 20241210. The patent publication num..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Beijing Yandong Microelectronic Co Ltd has received a patent for Circuit Structure, Circuit System and Integrated Circuit Chip. This invention was developed by Chen Xiaojing, Ma Yan and Mai Longji.
The patent application number is CN202423145193U 20241219. The patent publication number is CN223486493 (U)...
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Shenyang Xingguang New Mat Co Ltd has sought patent for Method for Preparing High-purity Silicon Carbide Part Based on Low-pressure Injection Molding. This invention was developed by Ren Yun, Liu Changchun, Xing Gang, Ren Jiang, Li Xiaoyong, Liu Chao, Dai Weifan and Zhang Jiaxun.
The patent application nu..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has received Guangdong Zixin Environmental Protection Tech Co Ltd patent application for High-yield Wafer Laser Cutting Protection Liquid and Preparation Method Thereof. Cao Guohua, Pan Jixiang and Wang Ting developed the invention.
The patent application number..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- East China Sea Res Institute National Silicon Materials Deep Processing Product Quality Supervision has sought patent for Hot Material Tiling Device for Silicon Material Processing. This invention was developed by Gao Lirong, Xu Yanyan, Zhao Xiufang, Song Houwei, Shu Mindi, Xu Fan, Zhang Buqian, Wang Yingjie..
Semiconductor
| Thu 16 Apr 2026
Beijing, April 16 -- Shenyang Heyan Tech Co Ltd has sought patent for Adsorption Working Disc for Scribing Machine, Wafer Adsorption Control Method and Scribing Machine. This invention was developed by Zheng Qingyang, Yu Huping, Sun Xingyun, Liu Hongwen, Zhang Haiyan, Xu Peng and Li Wenlong.
The patent application number is C..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Hefei Jingweite Electronics Co Ltd has filed a patent application for Organic Etching Solution for Groove Corrosion of Quartz Wafer and Application of Organic Etching Solution. This invention was developed by Ding Yiqi, Zha Xiaobing, Cao Rui, Zhao Ling and Xia Junchao.
The patent application number is CN2..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Wuhan Sanxuan Tech Co Ltd has sought patent for High-adhesion Underfill Adhesive, Preparation Method Thereof and Chip Packaging Structure. This invention was developed by Wu De, Lin Ruolan and Liao Shuhang.
The patent application number is CN202511374645 20250925. The patent publication number is CN121046..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has awarded a patent to Nio Automobile Technology, Anhui for Structure for Improving Cooling Efficiency of Integrated Circuit and Vehicle-mounted Controller. Zhou Wei and Shi Jiepei developed the invention.
The patent application number is CN202422543915U 20241021..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has awarded a patent to China Zhenhua Group Yongguang Electronics, State Run No 873 Factory for Paster Type Power Hybrid Integrated Circuit Module Packaging Structure. Wang Jiajia, Wang Zeng, Xiang Yuejun, Wu Kaili, Chen Jingwei, Tang Qimei, Lee Ye-hyun and Liu Qia..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Taiwan Semiconductor Manufacturing has been awarded a patent for Semiconductor Device. This invention was developed by Lin Zijing, Liu Junyi, Lai Junliang, Li Aixuan and Wu Yunzheng.
The patent application number is CN202422926853U 20241129. The patent publication number is CN223487039 (U). International Pa..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Chuyun Precision Technology (Shanghai) has obtained a patent for base transfer equipment and semiconductor processing system. This invention was developed by Wang Dongxing, Chen Kaihui and Liu Chao.
The patent application number is CN202422677818U 20241101. The patent publication number is CN223487012 (U). ..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Tokyo Electron has obtained a patent for substrate holding member and substrate processing system. This invention was developed by Saito Yukiyoshi, Hirase Keita and Sasaki Keisuke.
The patent application number is CN20242243228U 20240822. The patent publication number is CN223487007 (U). International Paten..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Xinli Renshou High End Display Technology has been granted a patent for Array Substrate and Touch Display Device. This invention was developed by Zhang Dongqi, Wu Xiaofeng, Zeng Shiyou, Fu Hao, Du Chao and Zeng Lidan.
The patent application number is CN202422783954U 20241115. The patent publication number i..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has published Shandong Analysis & Test Center patent application for Array Integrated Bionic Intestine Organ Chip. The invention was developed by Hu Qiongzheng, Liu Xiaoqing and Yin Fangchao.
The patent application number is CN202511607524 20251105. The patent pub..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- State Intellectual Property Office of China has awarded a patent to Maxio Technology (Hangzhou) for Power Supply Module and SOC Chip. Ge Renwang, Yang Bo, Ye Xuanteng and Chen Bingjun developed the invention.
The patent application number is CN202423132504U 20241218. The patent publication number is CN22348..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- University of Electronic Science and Technology of China has applied Chinese patent for Heat-conducting and Insulating Chip Adhesive Based on Pvdf/bn (polyvinylidene Fluoride/boron Nitride) Sphere-chip Composite Material and Preparation Method Thereof. Chen Yuanfu, Wu Fugeng, Luo Wenbo, Zhang Jinbing, Shao W..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Taicang Dikeli Technology has submitted a patent application for High-cleanliness Film Uncovering Adhesive Tape for Semiconductor Manufacturing Process and Preparation Process of High-cleanliness Film Uncovering Adhesive Tape. Qu Qing, Tang Haocheng, Qian Jian and Chen Gaofeng developed the invention.
The p..
Semiconductor
| Wed 15 Apr 2026
Beijing, April 16 -- Beijing NAURA Microelectronics Equipment has filed a patent application for Fringing Magnetic Field Device and Semiconductor Processing Equipment. This invention was developed by Li Haodong, Deng Bin, Pang Xuelu and Zhang Xuefeng.
The patent application number is CN202410668900 20240527. The patent publicat..
1
to
100 of
1215 Items
Next >>
![Close [X]](../images/close.gif){kind=small}
![Close [X]](https://www.globalipnews.com/images/close.gif){kind=small}
