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Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Institute of Semiconductors, Chinese Academy of Sciences has sought patent for Autonomous Navigation System. This invention was developed by Dou Runjiang, Oh Nam-gun, Liu Liyuan, Liu Jian, Wang Zhe, Wen Yiyao, Yang Xu and Yu Shuangming.
The patent application number is CN202610639467 20260511. The patent pu..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has released Huawei Device patent application for Light-emitting Assembly, Manufacturing Method Thereof and Terminal Equipment. This invention was developed by Yang Xiaolin, Yu Qingquan and Huang Hongyi.
The patent application number is CN202411989327 20241230. Th..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Zhongke Tongde Microelectronics Tech Datong Co Ltd has been granted a patent for Chip Packaging Frame Grabbing Device. Zhang Wei developed the invention.
The patent application number is CN202520310658U 20250225. The patent publication number is CN223734892 (U). International Patent Classification codes are..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Fujian Fushun Semiconductor Manufacturing has obtained a patent for clamp capable of measuring placement angle of dispensing head. This invention was developed by Chen Mengli.
The patent application number is CN202422906535U 20241127. The patent publication number is CN223733124 (U). International Patent Cl..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Suzhou Moer Jiaxin Semiconductor Tech Co Ltd has obtained a patent for variable capacitance diode. This invention was developed by Huo Shudong, Gao Yunyun and Zhang Zhengxing.
The patent application number is CN202423323508U 20241231. The patent publication number is CN223730187 (U). International Patent Cl..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Xinyuan Semiconductor Shanghai Co Ltd has secured a patent on Resistive Memory Cell and Resistive Memory. Wu Yunfeng and Liu Yefan developed the invention.
The patent application number is CN20252021672U 20250106. The patent publication number is CN223730221 (U). International Patent Classification codes ar..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Jiangsu Jingjiu Microelectronic Mat Co Ltd has obtained a patent for diluent filtering equipment for manufacturing semiconductors. This invention was developed by Zhang Wei, Li Hubao and Zhang Chi.
The patent application number is CN20252015381U 20250106. The patent publication number is CN223732330 (U). In..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Zhongke Tongde Microelectronics Tech Datong Co Ltd has been granted a patent for Chip Packaging and Loading Mechanism. This invention was developed by Wang Jiaheng, Zhang Wei and Si Shaojie.
The patent application number is CN202520279203U 20250220. The patent publication number is CN223728760 (U). Internat..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Suzhou Shangxi Semiconductor Tech Co Ltd has received a patent for Wafer Box Opener with Detection Function. This invention was developed by Huang Xingzhi, Wei Ran, Hu Mingang and Hong Minjue.
The patent application number is CN202520214277U 20250211. The patent publication number is CN223728736 (U). Intern..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Jiangsu Xingan Tech Co Ltd has secured a patent on Thinning Equipment Platform Deck Structure with RFID Function. Pei Shaoshuai and Li Ya developed the invention.
The patent application number is CN20252017898U 20250106. The patent publication number is CN223728734 (U). International Patent Classification c..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Tangren Mfg Jiashan Co Ltd has been granted a patent for Optical Alignment Device for Bonding Equipment. Tang Liang, Jiao Lei, Shen Huiqiang, Li Xiangdong and Zhao Xu developed the invention.
The patent application number is CN202423180003U 20241223. The patent publication number is CN223728749 (U). Interna..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Chengdu Huichuang Xinyao Semiconductor Co Ltd has been granted a patent for Latch for Solving Output Failure. Yin Wenxia developed the invention.
The patent application number is CN20252029848U 20250107. The patent publication number is CN223729741 (U). International Patent Classification codes are H03K19/0..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- European Patent Office has published Infineon Technologies patent application for Secure Communications Using Pre-shared Keys. The invention was developed by Zeh Alexander and Tindell Kenneth William.
The patent application number is EP20240805491 20241111. The patent publication number is EP4809662 (A1). Inte..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- SK Hynix Nand Product Solutions has sought patent for Systems and Methods for Generating Optimized Combination Sets for Error Correction in Data Transmission. This invention was developed by Ji Young Hoon and Poon Nathan.
The patent application number is EP20240892006 20241025. The patent publication number is..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- Applied Materials has filed a patent application for Die Stacking with Integrated Thermal Treatment. This invention was developed by Yong Changbum, Mehta Gaurav, Wang Ying, See Guan Huei, Zheng Ke and Hung Raymond.
The patent application number is EP20240892049 20241108. The patent publication number is EP4809..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- Texas Instruments has submitted a patent application for Integrated Circuit Package and Manufacturing Method Thereof. This invention was developed by Morrison William R, Chen Ying-chang and Liu Jane Qian.
The patent application number is EP20240820875 20241114. The patent publication number is EP4809574 (A1). ..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- Soitec Silicon On Insulator has filed a patent application for Method for Thinning the Surface Layer of an Soi Substrate. This invention was developed by Joseph Vincent, Viravaux Laurent, Massy Damien, Loubriat Sébastien and Le Quere Etienne.
The patent application number is EP20240789907 20241016. The patent..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- European Patent Office has received Soitec Silicon On Insulator patent application for Carrier Comprising a Layer for Trapping Electrical Charges for a Composite Substrate and Method for Selecting Such a Carrier. Allibert Frédéric developed the invention.
The patent application number is EP20240783583 202409..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- SK Hynix Nand Product Solutions has submitted a patent application for Structured Data Filtering in Memory Devices. This invention was developed by Zhang Xuzheng.
The patent application number is EP20240892262 20241114. The patent publication number is EP4809398 (A1). International Patent Classification codes ..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- European Patent Office has released SK Hynix Nand Product Solutions patent application for Methods and Systems for Implementing Stream Data Updates. This invention was developed by Natarajan Sriram, Subbarao Sanjay, Galireddy Swapna and Yung Weng-chin.
The patent application number is EP20240892007 20241025. T..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- SK Hynix Nand Product Solutions has applied European patent for Flexible RAID Parity Application for Memory Management. Athreya Arun, Zhang Yihua, Natarajan Sriram, Muralishankar Shivashekar, Natarajan Shankar, Donga Parth and Yoder Orapin developed it.
The patent application number is EP20240892005 20241025. ..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Huawei Technologies has filed a patent application for Application Installation Method, Electronic Equipment, Chip System and Readable Storage Medium. This invention was developed by Zhang Runnan and Yu Zhouyi.
The patent application number is CN202411984879 20241228. The patent publication number is CN122308..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has released Wuhan Yuxin Semiconductor Co Ltd patent application for Dynamic Time Sequence Adaptive Adjustment Method for NAND Flash Control Chip. This invention was developed by Liu Shijun, Peng Xin, Wang Tao, Tian Chao and Liu Guolong.
The patent application num..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has released SK Hynix patent application for Storage Device for Determining Whether to Reconstruct Mapping Unit and Operating Method Thereof. This invention was developed by Lee Jung-ho, Son Min-su, Choi Ji-hoon and Shin Soong-sun.
The patent application number is C..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Beijing Xiaomi Mobile Software has applied Chinese patent for Control Method and Device of Foldable Equipment, Chip, Foldable Equipment and Medium. Liu Ya developed it.
The patent application number is CN202411998193 20241231. The patent publication number is CN122308594 (A). International Patent Classifica..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Beijing Smartchip Microelectronics Technology Co Limited has submitted a patent application for Dynamic Voltage Frequency Adjusting Method, Device and System Based on Multiple Power Supply Domains, Chip and Electronic Equipment. Ma Yan, Zhang Youwen, Li Dejian, Zhang Zhe, She Zenghui, Xiao Long, Zhang Qiange a..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has published Shenzhen Huaxinxing Semiconductor Co Ltd patent application for Dynamic Power Consumption Shaping Method for Memory Controller Chip. The invention was developed by Zou Shengping, Tang Guangjun, Rui Weijun and Wu Yong.
The patent application number is..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has published Shanghai Hanlantong Tech Co Ltd patent application for Self-adaptive Two-phase Heat Dissipation System for Server Chip and Control Method. The invention was developed by Cui Bo and Zou Tianxia.
The patent application number is CN202610407118 20260331..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has released Shanghai Huali Integrated Circuit Manufacturing patent application for Starting Circuit of Band-gap Reference Circuit. This invention was developed by Zhang Xuelian and Gu Jingping.
The patent application number is CN202610396486 20260327. The patent ..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Beijing Hengxin Zhihang Tech Co Ltd has sought patent for Frame Decoupling Structure and MEMS Resonant Gyroscope with Same. This invention was developed by Wang Yuyin.
The patent application number is CN202610712626 20260522. The patent publication number is CN122306033 (A). International Patent Classificat..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Shanghai Dachen Weiying Semiconductor Technology has submitted a patent application for Deviation Angle Measuring Device and Method, Semiconductor Device and Program Product. Liu Wenyang developed the invention.
The patent application number is CN202610536177 20260421. The patent publication number is CN12230..
Semiconductor
| Thu 01 Oct 2026
Alexandria, Sept. 30 -- University Beijing and Peking University have obtained a patent for three-dimensional memory array and preparation method thereof. This invention was developed by Wang Zongwei, Huang Ru, Cai Yimao, Bao Shengyu and Yang Gaoqi.
The patent application number is US202418966791 20241203. The patent publicat..
Semiconductor
| Wed 30 Sep 2026
Beijing, Sept. 30 -- Zhongtian Communication Tech Co Ltd, Zhongtian Broadband Technology Co Ltd and Jiangsu Zhongtian Technology have secured a patent on Space Division Multiplexing Silicon Optical Module. Zhang Wei, Xie Shuhong, Tan Zuwei, Shen Yichun, Fu Xiaodong, Lan Yanrui and Zheng Qifei developed the invention.
The pate..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has awarded a patent to Wuxi Kunsheng Intelligent Equipment for Assembly Tool Suitable for Electroplating Flower Basket Clamping Elastic Piece. Shao Yulin and Wen Xujun developed the invention.
The patent application number is CN202423111894U 20241217. The patent pu..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Chengdu Jutian Electronic Tech Co Ltd has received a patent for Locating Device Convenient to Adjust and Used for Low-noise Amplifier Chip Production and Processing. This invention was developed by Wu Zhenping and Deng Wenqi.
The patent application number is CN202520313554U 20250226. The patent publication ..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Chinese Patent for Stamping Die for Silicon Steel Sheet Production has been issued to Tianjin Shengkun Machinery Parts Co Ltd. This invention was developed by Yu Yongsheng.
The patent application number is CN20252057619U 20250110. The patent publication number is CN223733672 (U). International Patent Classi..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Zhejiang Xinheiyang Automation Equipment Co Ltd has received a patent for Small Wafer Machine. This invention was developed by Zhang Shunguo.
The patent application number is CN20252044389U 20250108. The patent publication number is CN223733628 (U). International Patent Classification codes are B21D22/02, B..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Kaiyuan Bonong Machinery Co Ltd has been awarded a patent for Substrate Covering Device for Intelligent Tray-loading Seeder. This invention was developed by Wang Ping, Du Xiuguo, Zhao Zhendong, Lu Qidi and Wang Bo.
The patent application number is CN20252077707U 20250113. The patent publication number is CN..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has awarded a patent to Tunghsu Group Co Ltd for Flexible Solar Substrate Structure. Zhao Xuejun developed the invention.
The patent application number is CN202422964670U 20241202. The patent publication number is CN223730192 (U). International Patent Classificati..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Huaian Kaineng Shiguang Electronic Co Ltd has secured a patent on PCBA Circuit Board Chip Mounter. Lu Aimin developed the invention.
The patent application number is CN202423130897U 20241218. The patent publication number is CN223730186 (U). International Patent Classification codes are H05K13/00, H05K13/04..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Suzhou Jiashun Pipe Ind Co Ltd has been awarded a patent for Cable Silicon Core Pipe Convenient for Butt Joint. This invention was developed by Xia Jie and Li Ailin.
The patent application number is CN20242379983U 20241213. The patent publication number is CN223729395 (U). International Patent Classificatio..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- European Patent Office has published SiCrystal patent application for Production Method for a Sic Volume Monocrystal and Sic Source Material to be Used in Such a Production Method. The invention was developed by Hosomi Tadahiro, Eckstein Robert, Müller Ralf and Schuh Philipp.
The patent application number i..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- Pioneer Corp has submitted a patent application for Light-emitting Device, Method for Controlling Light-emitting Device, and Program. This invention was developed by Sakai Yoshikazu, Nagata Hideki, Fujimura Naoki, Suguru Mizuki and Mitsunaga Naoki.
The patent application number is EP20230958851 20231115. The..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- ams-OSRAM International has sought patent for Radiation Emitting Semiconductor Device and Method for Manufacturing the Device. This invention was developed by Schmid Wolfgang, Barthel Stefan and Abass Aimi.
The patent application number is EP20240802191 20241105. The patent publication number is EP4809794 (A1)..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- Wolfspeed has filed a patent application for Gate Trench Power Semiconductor Devices with Deep Jfet Patterns. This invention was developed by Kim Woongsun, Islam Naeem, Ryu Sei-hyung and Sampath Madankumar.
The patent application number is EP20240821186 20241106. The patent publication number is EP4809789 (A1)..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- Wolfspeed has submitted a patent application for Split Support Shield Structures for Trenched Semiconductor Devices with Integrated Schottky Diodes. Kim Woongsun, Islam Naeem, Ryu Sei-hyung and Sampath Madankumar developed the invention.
The patent application number is EP20240812301 20241106. The patent publi..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- Micron Technology has submitted a patent application for Self-aligned Capacitors for Three-dimensional Memory Systems. This invention was developed by Ma Yuanzhi, Sills Scott E and Lee Si-woo.
The patent application number is EP20240892029 20241105. The patent publication number is EP4809786 (A1). Internationa..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- IBM has submitted a patent application for Redressing a Chip Site on a Multi-chip Laminate Package. Jain Aakrati, Farooq Mukta Ghate, Raghavan Sathyanarayanan and Roy Chowdhury Prabudhya developed the invention.
The patent application number is EP20240764827 20240829. The patent publication number is EP4809779..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has released SK Hynix Memory Solutions Inc patent application for Systems, Methods, and Media for Optimizing Solid State Drive Performance. This invention was developed by Bourne Darren, Gangadhar Sudhir V, Motwani Ravi, Gonsikar Kiran K, Mcclelland David and Goletz ..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Shenzhen Maideer Semiconductor Co Ltd has filed a patent application for SSD (solid State Disk) Control Chip Thermoelectric Collaborative Acceleration Test Method, System and Program. This invention was developed by Li Bin, Wenting Hu and Li Fang.
The patent application number is CN202610434039 20260403. Th..
Semiconductor
| Fri 02 Oct 2026
Munich, Oct. 1 -- European Patent Office has published LX Semicon patent application for Vapor Chamber for a Heat Dissipation Substrate and Heat Dissipation Substrate for a Power Semiconductor Module Including the Same and a Manufacturing Method Thereof. The invention was developed by Lee Sang Rae, Kim Hak Jun and Ra Se Woong.
..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Huawei Technologies has submitted a patent application for Data Processing Method and Device, Chip and Cluster. Yao Haolin and Zhu Jianfeng developed the invention.
The patent application number is CN202411999451 20241231. The patent publication number is CN122309122 (A). International Patent Classification c..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Rongyao Terminal has submitted a patent application for Texture Picture Caching Method, Electronic Equipment, Chip System and Storage Medium. This invention was developed by Zhao Shipeng.
The patent application number is CN202411987074 20241230. The patent publication number is CN122309107 (A). International ..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Xinxin Hangtu Suzhou Tech Co Ltd has applied Chinese patent for Task Execution Method, Compiling Method, Chip and Device of Artificial Intelligence Model. Zhao Zifeng and Xiang Shaolin developed it.
The patent application number is CN202411898910 20241220. The patent publication number is CN122309039 (A). I..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Xinxin Hangtu Suzhou Tech Co Ltd has submitted a patent application for Test Task Execution Method and Device of Artificial Intelligence Model, Task Compiling Method and Device, Chip and Computer Equipment. This invention was developed by Zhao Zifeng and Xiang Shaolin.
The patent application number is CN202..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has released BYD Company patent application for Display Method, Chip System and Electric Equipment. This invention was developed by Yang Dongsheng, Li Wei, Xue Tianyu, Jiang Guili and Nong Jingxin.
The patent application number is CN202610274958 20260306. The patent..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has released Beijing Telixin Electronics Tech Co Ltd patent application for Flash Memory Firmware Starting Method and System Based on Flash Memory Chip and Electronic Equipment. This invention was developed by Zhu Bin, Mi Cunzhao and Zhang Fulong.
The patent appli..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has released Shandong University patent application for Scalar-vector Heterogeneous Assembly Line Interaction Chip and Interaction Method. This invention was developed by Sun Tao, Zhou Li and Cao Zhuodong.
The patent application number is CN202610770051 20260601. Th..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Kunlun Core Beijing Tech Co Ltd has applied Chinese patent for Processor Core, Data Reading Method, Chip and Computer Equipment. Li Bowen, Ma Bo, Bai Endong, Qiu Zhengqian, Zhu Zhijun, Shi Xingbo and Du Xueliang developed it.
The patent application number is CN202610405735 20260330. The patent publication n..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has received Beijing Xingyun Integrated Circuit Co Ltd and Xingyun Jiwei Chengdu Tech Co Ltd patent application for Instruction Processing Method, Information Processing Unit, Chip and Chip System. Chang Wei, Liu Bing, Ji Yu, Guo Shaocheng and Yu Hongmin developed th..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Changshu Guanghe Tech Co Ltd has submitted a patent application for Light Color Operation Chip. This invention was developed by Lyu Zhenguo.
The patent application number is CN202610680981 20260518. The patent publication number is CN122308553 (A). International Patent Classification code is G06E3/00. Coope..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Wuxi Aiwei Integrated Circuit Tech Co Ltd has filed a patent application for Voltage Stabilizing Circuit, Chip and Electronic Equipment. This invention was developed by Li Nianlong.
The patent application number is CN202610667877 20260514. The patent publication number is CN122308550 (A). International Pate..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has released Wuxi China Resources Microelectronics Integrated Circuit patent application for Current Reference Circuit. This invention was developed by Ma Lin.
The patent application number is CN202411967745 20241230. The patent publication number is CN122308543 (..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Zhuhai Yiwei Tech Co Ltd has filed a patent application for Target Navigation Point Planning Method Based on Dangerous Obstacles, Chip and Robot. This invention was developed by Zhang Ziqian, Wang Yiming, Chen Zhuobiao and Chen Zexin.
The patent application number is CN202411885808 20241220. The patent publ..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has received Provincial Hospital Affiliated to Shandong First Medical University, Shandong Provincial Hospital patent application for Data Acquisition Control System Based on Organ Chip Microflow. Han Lin, Wang Jinshen and Wang Yutao developed the invention.
The pat..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Suzhou Zhishan Sensing Tech Co Ltd has sought patent for Batch Accelerated Aging Method and System for Metal Oxide Semiconductor Gas Sensor. This invention was developed by Ren Wanwei and Zhou Wenhua.
The patent application number is CN202511956569 20251223. The patent publication number is CN122306887 (A)...
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has published Hangzhou Advanced Research Inst USTC and Uzhen Laboratory patent application for Method for Directly Detecting Silicon Nitride Grain Boundary Phase, Replica Film and Application. The invention was developed by Wang Genshui, Hu Tengfei, Deng Tao, Liu Nin..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Changfei Advanced Semiconductor Wuhan Co Ltd has filed a patent application for Failure Analysis Method and Device for Power Chip. This invention was developed by Hu Ziqiang, Li Meirong and Xu Peng.
The patent application number is CN202610608980 20260506. The patent publication number is CN122306852 (A). I..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Jiangsu Kaihao Tech Co Ltd has submitted a patent application for Device and Method for Detecting Chip Packaging Cracks by Utilizing Side Light Type Led Backlight. Chen Wei, Zi Yiguo and Chen Guoda developed the invention.
The patent application number is CN202610473941 20260411. The patent publication numb..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has received SEMES patent application for Inkjet Droplet Inspection Method on Substrate. Shin Hyeon Jun developed the invention.
The patent application number is CN202511362691 20250923. The patent publication number is CN122306686 (A). International Patent Classifi..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- China Electronic Product Reliability and Environmental Testing Research Inst The Fifth Electronic Re has submitted a patent application for Strain Threshold Value Detection Method for Vehicle Gauge Level Chip Assembly. Yang Xiaofeng, Cui Junchao, Liu Peijiang, Ma Bingxu, Yang Shangjie and Tian Wanchun develope..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has received Shanghai Precision Measurement Semiconductor Technology and Shanghai Huizhuo Optical Tech Co Ltd patent application for Interferometric Measurement Method and Device for Large-warpage Wafer. Guo Kai and Chen Ming developed the invention.
The patent ap..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- Spirox Corp has applied Chinese patent for Semiconductor Substrate Optical Detection System and Method. Yang Yaozhou, Zhao Yanzheng and Lee Bong-geol developed it.
The patent application number is CN202510276599 20250310. The patent publication number is CN122305961 (A). International Patent Classification ..
Semiconductor
| Fri 02 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has published Jiangsu Shuguang Pressure Vessel Co Ltd patent application for Energy-saving Shell-and-tube Silicon Carbide Heat Exchanger. The invention was developed by Xie Xiaoxia, You Shiqing, Hua Yuezhong and Tai Yu.
The patent application number is CN202610790..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Beijing Borui Advanced Tech Co Ltd has been granted a patent for Improved Full-automatic Chip Mounter Feeding Mechanism. Wang Peng developed the invention.
The patent application number is CN202520321917U 20250227. The patent publication number is CN223737093 (U). International Patent Classification codes a..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Zhengzhou Qisheng Prec Manufacturing Co Ltd has been granted a patent for Double-shaft Driving Structure of Full-automatic Precision Wafer Cutting Machine. This invention was developed by Li Kuangwei, Ma Yungang, Sun Yaowei and Fu Minghao.
The patent application number is CN202520178113U 20250127. The paten..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has awarded a patent to Anhui Juxin Zhizao Tech Co Ltd for Visual Positioning Clamp for Cutting Single Crystal Wafer. Cheng Jilong, Xie Mengjiao, Wang Yang, Zhou Lei and Zhu Xiaodong developed the invention.
The patent application number is CN202423222107U 2024122..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Hubei Zhonggong Fine Ceram Co Ltd has been awarded a patent for Powder Coating Equipment for Ceramic Substrate Production. This invention was developed by Chen Jiangtao and Xiao Xiaoling.
The patent application number is CN202520255870U 20250218. The patent publication number is CN223735137 (U). Internation..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Jiangsu Yanhu Electronic Technology has been granted a patent for Die Cutting Device for Processing and Cutting Circuit Board Substrate. Shen Huafang and Cai Xiaomao developed the invention.
The patent application number is CN202520107754U 20250116. The patent publication number is CN223735078 (U). Internatio..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Beijing Dingkun Jiaye Tech Co Ltd has obtained a patent for board splitting machine for integrated circuit board processing. This invention was developed by Jiang Yu and Bai Lina.
The patent application number is CN202520106811U 20250117. The patent publication number is CN223734948 (U). International Paten..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Chinese Patent for Auxiliary Mounting Tool for Polishing Head of 12-inch Silicon Wafer Fine Polishing Machine has been issued to Shandong Grins Semiconductor Mat Co Ltd. This invention was developed by Zhang Rongbin, Yu Xingrui, Meng Deqiang, Cheng Huaizhang, Chen Xin and Shao Qiusheng.
The patent applicati..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Chinese Patent for Auxiliary Driving Device, Polishing Mechanism for Wafer Processing and Polishing Equipment has been issued to Hwatsing Shanghai Semiconductor Co Ltd. This invention was developed by Wu Xing, Xu Haiyang and Xia Jiaqi.
The patent application number is CN202423142534U 20241219. The patent pu..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Guangdong Beigete New Mat Co Ltd has been granted a patent for Aluminum Substrate Cutting Machine. This invention was developed by Luo Bao and Peng Shurong.
The patent application number is CN202520232478U 20250214. The patent publication number is CN223733961 (U). International Patent Classification codes ..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Suzhou Yisailunte Electronic Tech Co Ltd has secured a patent on High-efficiency Plasma Cleaning Equipment for Semiconductor Chip. Fan Yao, Han Haiyang, Xiong Zhonglai and Gou Fuqiang developed the invention.
The patent application number is CN202423256617U 20241229. The patent publication number is CN22373..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Hangzhou Tinker Biotechnology Co Ltd has obtained a patent for micro-fluidic chip capable of realizing liquid quantification. This invention was developed by Wang Yiyang, Peng Yamei, Yu Feng and Ye Jiaming.
The patent application number is CN20252093256U 20250115. The patent publication number is CN22373279..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Guangzhou Weimi Tech Co Ltd has received a patent for Micro-fluidic Chip. This invention was developed by Lin Chaoning, Chen Ju and Wang Yantao.
The patent application number is CN202423303090U 20241231. The patent publication number is CN223732794 (U). International Patent Classification code is B01L3/00. ..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Jiangsu Tongnai Environmental Protection Tech Co Ltd has been granted a patent for Reaction Device for Synthesizing Catalyst and Silicon Nitride. Jin Zhichao, Li Jing and Chen Qiuyun developed the invention.
The patent application number is CN202520132836U 20250121. The patent publication number is CN223732..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Xiamen Yining Yuanda Tech Co Ltd has received a patent for Locking Device for Connecting Silicon Rubber Case and Artificial Limb. This invention was developed by Ding Ningning.
The patent application number is CN202422998359U 20241205. The patent publication number is CN223731569 (U). International Patent C..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Beijing Jiangxinxing Medical Devices Co Ltd has been awarded a patent for Alveolar Bone Chip Taking Drill for Dental Implant. This invention was developed by Liang Guangqiang.
The patent application number is CN202422614036U 20241028. The patent publication number is CN223731509 (U). International Patent Cl..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Nanjing Xinzhi Electronic Material Tech Co Ltd has been granted a patent for Thin Film Band-pass Filter Based on Ltcc Substrate. Xue Ling developed the invention.
The patent application number is CN20252065261U 20250113. The patent publication number is CN223730088 (U). International Patent Classification c..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has awarded a patent to Xinlian Pioneer Integrated Circuit Manufacturing, Shaoxing for Power Supply Clamping Circuit and Chip. Cao Yali developed the invention.
The patent application number is CN20252032296U 20250107. The patent publication number is CN223729634 (U..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Taiwan Semiconductor Manufacturing has been granted a patent for Semiconductor Device. This invention was developed by Yang Kaixiang, Gao Jinfu, Aydin Anan and Lin Shucheng.
The patent application number is CN202422276144U 20240918. The patent publication number is CN223728779 (U). International Patent Classi..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Puya Semiconductor, Shanghai has been granted a patent for Lead Frame and Packaged Semiconductor. Xu Peiqing developed the invention.
The patent application number is CN202423228180U 20241226. The patent publication number is CN223728776 (U). International Patent Classification code is H01L23/495.
The abstr..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- State Intellectual Property Office of China has awarded a patent to Xinling Semiconductor Suzhou Co Ltd for Packaging Structure of High-thermal-conductivity Semiconductor Device. Zhu Qing and Wan Yi developed the invention.
The patent application number is CN202520297439U 20250224. The patent publication nu..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Xindong Microelectronic Tech Beijing Co Ltd has been granted a patent for Fc-bag Chip with Protection Support and Packaging Chip. Wu Kaifeng and Ye Xian developed the invention.
The patent application number is CN202520276557U 20250220. The patent publication number is CN223728766 (U). International Patent ..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Tangren Mfg Jiashan Co Ltd has secured a patent on Thin Chip Multi-step Ejection Mechanism. Tang Liang, Li Shujun, Shen Huiqiang, Yao Libo and Chen Jinglong developed the invention.
The patent application number is CN202423180001U 20241223. The patent publication number is CN223728761 (U). International Pat..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Chinese Patent for Packaging Chip Horizontal Adjusting Device and Packaging Feeding System has been issued to Suzhou Qingyue Optoelectronics Technology. This invention was developed by Liang Yongpeng, Zhu Pengfei, Ma Zhihao, Ren Xiaoying, Li Yong and Chen Bing.
The patent application number is CN20252018395U ..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Guangdong Qipai Technology has been awarded a patent for Semiconductor Chip Mounting Equipment Lead Frame Positioning Carrier. This invention was developed by Lu Xiaojiao, Lin Haihua, Mo Zhisheng, Li Zhigao, Liu Xin, Wei Shang and Chen Hongtao.
The patent application number is CN20252016524U 20250103. The pat..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Tangren Mfg Jiashan Co Ltd has secured a patent on Force Control Mechanism for Semiconductor Packaging. Wang Jiapeng, Zhang Chunxiao, Shen Huiqiang, Li Ziwen and Li Kun developed the invention.
The patent application number is CN202520274845U 20250220. The patent publication number is CN223728737 (U). Inter..
Semiconductor
| Thu 01 Oct 2026
Beijing, Oct. 1 -- Shanghai Fuchi Information Tech Co Ltd has been awarded a patent for Photovoltaic Silicon Wafer Surface Etching Equipment. This invention was developed by Shen Maotian, Liu Wei and Yang Jie.
The patent application number is CN202423283537U 20241230. The patent publication number is CN223728732 (U). Internat..
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