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Semiconductor
| Tue 02 Dec 2025
Beijing, Dec. 3 -- Suzhou Qianming Semiconductor Equipment has been granted a patent for Multi-station Test Sorting Machine. Hou Desheng, Wu Senfeng and Yan Haizhong developed the invention.
The patent application number is CN202421568207U 20240704. The patent publication number is CN223288515 (U). International Patent Classi..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Shanghai Huali Microelectronics Corporation has applied Chinese patent for Protective Cover Dust Collection Assembly, Semiconductor Manufacturing Equipment and Protective Cover Cleaning Method. Chen Chen, Liu Tao and Huang Lei developed it.
The patent application number is CN202510125679 20250126. The paten..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Shanghai Huali Integrated Circuit Manufacturing has filed a patent application for Device and Method for Reducing Failure Rate of FIB Sample Stage. This invention was developed by Chen Xi and Zhu Yaoping.
The patent application number is CN20251008203 20250102. The patent publication number is CN119926904 (..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Sony has submitted a patent application for Semiconductor Device. Ikuta Tetsuya developed the invention.
The patent application number is CN20238060881 20230728. The patent publication number is CN119923963 (A). International Patent Classification codes are H10D30/60, H10D62/10, H10D62/17 and H10D64/27. Coo..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Yangtze Memory Technologies has submitted a patent application for Semiconductor Structure and Preparation Method Thereof, and Three-dimensional Memory. Wu Shuangshuang, Liu Zhibin, Zhang Zhong and Wang Di developed the invention.
The patent application number is CN20238010139 20230807. The patent publicati..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Yangtze Memory Technologies has submitted a patent application for Semiconductor Device, Manufacturing Method Thereof and Storage System. Luo Jiaming, Pu Hao, Lin Jie, Yang Yonggang and Xia Yuping developed the invention.
The patent application number is CN20238009170 20230510. The patent publication number..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Changzhou Chengxin Semiconductor has filed a patent application for Transmission Filter Device, Transmission Filter Circuit, and Duplexer Circuit. This invention was developed by Zou Yali and Liu Yuhao.
The patent application number is CN202411824766 20241211. The patent publication number is CN119921723 (A..
Semiconductor
| Tue 02 Dec 2025
Beijing, Dec. 3 -- Wuhu Jingchun Technology has been granted a patent for Semiconductor Part Step Surface Polishing Equipment. Hu Feifan, Wu Suocheng, Zhang Feilong, Wang Cheng and Li Gangfeng developed the invention.
The patent application number is CN202421835565U 20240731. The patent publication number is CN223289540 (U). ..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- ChipMOS Technologies (Shanghai) has applied Chinese patent for Finger Pitch Minimization Method. Liu Shuai, Shao Ziren and Jiang Yiqing developed it.
The patent application number is CN202411984117 20241231. The patent publication number is CN119920706 (A). International Patent Classification codes are H01L..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Shanghai Jita Semiconductor has submitted a patent application for Semiconductor Structure with Double Deep Trench Isolation and Preparation Method Thereof. This invention was developed by Hu Linhui, Liao Liming, Qiu Feng and Zhang Qiang.
The patent application number is CN202510423224 20250407. The patent ..
Semiconductor
| Tue 02 Dec 2025
Beijing, Dec. 3 -- Jiangxi MTC Semiconductor has received a patent for Exhaust Device. This invention was developed by Yi Xinlong, Xu Jihong, Duan Liangfei, Dong Guoqing, Wen Guosheng and Jin Conglong.
The patent application number is CN202422602112U 20241028. The patent publication number is CN223287852 (U). International Pa..
Semiconductor
| Tue 02 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has published Shenzhen Daipusen New Energy Technology patent application for Chip Mounting Path Planning Method and System. The invention was developed by Cao Zongyu, Cai Changfeng and Wang Yufei.
The patent application number is CN202510423912 20250407. The paten..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Yangtze Memory Technologies has submitted a patent application for Operation Method of Memory System, Memory System and Storage Medium. This invention was developed by Fu Hai and Wang Hongbo.
The patent application number is CN20238011350 20230711. The patent publication number is CN119923688 (A). Internati..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Application Provision Device, Application Provision Method, and Program. This invention was developed by Hibino Tomokazu and Nagao Shinichi.
The patent application number is CN20238066758 20231010. The patent publication number ..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Nanjing University of Technology has submitted a patent application for Application of Ultra-sensitive Phototransistor Based on Double Photoactivation Layers. This invention was developed by Li Jinze, Wang Lin, Song Xuefen, Hang Yang, Xie Haitao and Liu Tianyu.
The patent application number is CN20251015900..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Hefei Nexchip Integrated Circuit has submitted a patent application for Semiconductor Device and Preparation Method Thereof. Zhang Man, Bao Wei and Liu Zheru developed the invention.
The patent application number is CN202510405338 20250402. The patent publication number is CN119922987 (A). International Pat..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Samsung Electronics has submitted a patent application for Semiconductor Device Including Dual Contact Structure on Source/drain Region. This invention was developed by Lee Jae Hong, Kim Jin-tae, Seo Kang-ill and Liang Ming.
The patent application number is CN20241125594 20240730. The patent publication num..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- United Microelectronics Corporation has filed a patent application for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Hou Taicheng, Lin Dajun, Cai Binxiang and Cai Fuyu.
The patent application number is CN202311514596 20231114. The patent publication number is CN11..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- United Microelectronics Corporation has submitted a patent application for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Li Xinhong.
The patent application number is CN202311413621 20231027. The patent publication number is CN119922968 (A). International Patent Cl..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Robert Bosch has submitted a patent application for Method of Fabricating Vertical Field Effect Transistor Structure and Vertical Field Effect Crystal Structure. This invention was developed by Krebs Daniel.
The patent application number is CN202411525362 20241030. The patent publication number is CN1199229..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- NXP USA has submitted a patent application for Semiconductor Device with Multi-step Gate and Multi-step Field Plate and Manufacturing Method Thereof. This invention was developed by Grote Bernhard and Bruce Mcrae Green.
The patent application number is CN202411360424 20240927. The patent publication number ..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- NXP USA has submitted a patent application for Semiconductor Device with Multi-step Gate and Multi-step Field Plate and Manufacturing Method Thereof. This invention was developed by Grote Bernhard and Bruce Mcrae Green.
The patent application number is CN202411359982 20240927. The patent publication number ..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Shanghai Jita Semiconductor has submitted a patent application for Memory Structure and Preparation Method Thereof. This invention was developed by Wu Jiang and Li Huzi.
The patent application number is CN202510104706 20250122. The patent publication number is CN119922916 (A). International Patent Classific..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Semiconductor Manufacturing International (Shanghai) has submitted a patent application for Memory and Forming Method Thereof. This invention was developed by Yin Shijie and Yuan Jun.
The patent application number is CN202311440579 20231031. The patent publication number is CN119922914 (A). International Pa..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- ChangXin Technology Group has submitted a patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Tang Yi, Tan Yali and Li Huihui.
The patent application number is CN20251072290 20250116. The patent publication number is CN119922911 (A). International Paten..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Fujian Jinhua Integrated Circuit has filed a patent application for Semiconductor Device. This invention was developed by Zhang Qinfu.
The patent application number is CN20251058388 20250114. The patent publication number is CN119922910 (A). International Patent Classification code is H10B12/00.
Accordi..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- STATS ChipPAC has submitted a patent application for Semiconductor Device and Method of Forming Fan-out Package Structure with Embedded. Lin Yaojian, Cai Peiyan, Yang Danfeng and Gao Yinghua developed the invention.
The patent application number is CN202411307263 20240919. The patent publication number is C..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Shanghai Jita Semiconductor has submitted a patent application for Interconnection Process Defect Test Structure, Critical Defect Value Acquisition Method and Interconnection Process Defect Clamping Control Method. This invention was developed by Huang Wentian.
The patent application number is CN20251010530..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Nanya Technology has submitted a patent application for Semiconductor Structure. Xu Ping developed the invention.
The patent application number is CN202410603155 20240119. The patent publication number is CN119920798 (A). International Patent Classification codes are H01L21/50, H01L21/768, H01L23/488 and H0..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Synaptics has submitted a patent application for Bump Arrangements for Flip-chip Bonded Integrated Circuits. This invention was developed by Suzuki Shinya, Hasegawa Naoki, Oyama Yuji, Takasaki Keigo, Kasuga Kenichi and Fukaya Tomohito.
The patent application number is CN202411500092 20241025. The patent pub..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Shindengen Electric Manufacturing has filed a patent application for Semiconductor Module. This invention was developed by Morinaga Yuji and Wakuguchi Junya.
The patent application number is CN202411459248 20241018. The patent publication number is CN119920782 (A). International Patent Classification codes ..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Shindengen Electric Manufacturing has sought patent for Semiconductor Module. This invention was developed by Morinaga Yuji and Wakuguchi Junya.
The patent application number is CN202411458332 20241018. The patent publication number is CN119920781 (A). International Patent Classification code is H01L23/48. ..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Win Semiconductors has submitted a patent application for Semiconductor Device. This invention was developed by Chen Weiru, Song Junhan and Xu Ronghao.
The patent application number is CN202410539263 20240430. The patent publication number is CN119920758 (A). International Patent Classification codes are H0..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- SiEn QingDao Integrated Circuits has applied Chinese patent for System and Method for Controlling Inflation of OHB. Bai Haizhen, Lin Maokuan and Li Xiangfeng developed it.
The patent application number is CN202311429340 20231031. The patent publication number is CN119920737 (A). International Patent Classif..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Semiconductor Process Chamber and Air Inlet Assembly Thereof. Wang Yongzhao, Wang Wei and Lu Yancheng developed the invention.
The patent application number is CN202311422716 20231030. The patent publication number is CN11992067..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has received Shanghai Jita Semiconductor patent application for Semiconductor Device and Forming Method Thereof. Shan Yabing, Lin Baowei, Pang Hongrong, Qiu Feng, Cao Xueting and Jiang Yingjie developed the invention.
The patent application number is CN20251023882..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has received Samsung Electronics patent application for Semiconductor Device. Son Yong-hyuk, Xu Zhengyi, Li Tongxun, Kang Seung-mo, Lee Seung-joo, Jo Eu-gene and Choi Seong-jun developed the invention.
The patent application number is CN202410895756 20240705. The ..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Mitsubishi Electric has sought patent for Semiconductor Device. This invention was developed by Aoki Nobuchika.
The patent application number is CN202411498564 20241025. The patent publication number is CN119920774 (A). International Patent Classification codes are H01L23/367, H01L23/473 and H10D80/20. Coop..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has received Shanghai Jita Semiconductor patent application for Semiconductor Test Structure and Test Method Thereof. Guo Lina and Liu Xiang developed the invention.
The patent application number is CN202510101335 20250121. The patent publication number is CN11992..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has published Siliconware Precision Industries patent application for Electronic Package and Fabrication Method Thereof. The invention was developed by Zhong Songhua and Chen Liangbin.
The patent application number is CN202311461535 20231106. The patent publicatio..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released PI Semiconductor (Nantong) patent application for PCB (printed Circuit Board) Drilling and Laminating Equipment and Process. This invention was developed by Tang Lixiang and Yin Linzhong.
The patent application number is CN202311430441 20231031. The p..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has received Nanya Technology patent application for Semiconductor Device. Fang Weiquan developed the invention.
The patent application number is CN20251083698 20250120. The patent publication number is CN119922918 (A). International Patent Classification codes ar..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released Xinlian Yuezhou Integrated Circuit Manufacturing (Shaoxing) patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Li Xiang and Hu Junjie.
The patent application number is CN202510101452 20250122...
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released Shanghai Jita Semiconductor patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Wang Hengyu, Cao Xueting, Li Yang, Pang Hongrong and Qiu Feng.
The patent application number is CN202510238787 20250..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Chongqing Kangjia Optoelectronic Technology has sought patent for Light-emitting Assembly and Manufacturing Method and Mass Transfer Method Thereof. This invention was developed by Chai Yuanyuan, Wang Tao, Guo Lei and Li Hongtao.
The patent application number is CN202311402957 20231026. The patent publicati..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has received People's Hospital of Guangxi Zhuang Autonomous Region patent application for Stretchable Organic Field Effect Transistor Based on Double Dielectric Layers and Preparation and Application Thereof. Shi Wei, Li Wei, Yang Xing, Lei Xuan, Huang Xiaozhi, Lin J..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released Muxi Integrated Circuit (Shanghai) patent application for Multiprocessor Interconnection System, Processor Group and Processors. This invention was developed by Li Zhaoshi, Cong Gaojian, Fu Xuan, Liu Xiaoqing and Wei Li.
The patent application number ..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released Yangtze Memory Technologies patent application for Semiconductor Package. This invention was developed by Li Zhiguo.
The patent application number is CN20238011212 20230830. The patent publication number is CN119923724 (A). International Patent Classi..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released Mitsubishi Electric patent application for Semiconductor Device and Protection System. This invention was developed by Omaru Takeshi.
The patent application number is CN202280100131 20220930. The patent publication number is CN119923797 (A). Internati..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has received IBM patent application for Gate All-around Transistor with Heterogeneous Channel. A Green, Mochizuki Shogo, Forougier Julien, Tsutsui Hajime and Qin Liqiao developed the invention.
The patent application number is CN20238064411 20230901. The patent pu..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Guangdong Poloma New Material Tech Co Ltd has applied Chinese patent for Organic Silicon Optical Adhesive Composition, Integrated Black Organic Silicon Optical Transparent Adhesive Film, and Preparation Method and Application of Integrated Black Organic Silicon Optical Transparent Adhesive Film. Lun Zhen'an, C..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has received Wuhan Sanxuan Tech Co Ltd patent application for Low-warpage and High-stability Film Sealing Adhesive, Preparation Method Thereof and Chip Packaging Method. Wu De, Cao Dongping, Liao Shuhang and Su Junxing developed the invention.
The patent applicati..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Shanghai Plusco New Mat Co Ltd has sought patent for Adhesive for Flexible OLED (organic Light Emitting Diode) Display Panel, Adhesive Layer, Support Film and Preparation Method of Support Film. This invention was developed by Sun Pan and Li Peiran.
The patent application number is CN202510428983 20250408. ..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has published Yuyin Material Tech Shanghai Co Ltd patent application for Stainless Steel Nickel Alloy Seamless Square Tube Forming Machining Die for Nuclear Power Semiconductor Military Industry and Aerospace. The invention was developed by Niu Caihui.
The patent ..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Xuzhou Weiju Electronic Mat Co Ltd has filed a patent application for Silicon Wafer Cleaning Device. This invention was developed by Li Wei and Wang Kankan.
The patent application number is CN202510203061 20250224. The patent publication number is CN119926876 (A). International Patent Classification codes a..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released Suzhou Xintai Semiconductor Tech Co Ltd patent application for Liquid Supply Spraying Device for Wafer Cleaning. This invention was developed by Qi Yi, Wu Mingfang, Su Yongxin, Lai Jianhao, Xiao Minhao and Rao Wenyi.
The patent application number is C..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Huzhou Huolisite Intelligent Tech Co Ltd has submitted a patent application for Separation Adjustment Method, Electronic Equipment, Computer Readable Storage Medium and Chip. This invention was developed by Sun Zhaoyan, Tong Xiaolei, Wang Haishan, Tian Bin and Wu Fan.
The patent application number is CN2024..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Hangzhou Lingce Tech Co Ltd has filed a patent application for Spot Inspection Method of Integrated Circuit Test System and Integrated Circuit Test System. This invention was developed by Jin Hao and Bian Yaoyao.
The patent application number is CN202411877348 20241219. The patent publication number is CN11..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Sky Wing Communication Electronic Co Ltd has submitted a patent application for Method and System for Optimizing Signal Receiving Sensitivity of Low-power-consumption Dual-mode Bluetooth Chip. This invention was developed by Liu Jianhua, Xie Yangfei, Lin Zonglong and Huang Shaomin.
The patent application nu..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Wuxi Winsemi Microelectronics Co Ltd has applied Chinese patent for High-side Intelligent Electronic Switch, Integrated Circuit Chip, Chip Product and Electromechanical Equipment. Song Pengliang, Liu Xue and Lei Hao developed it.
The patent application number is CN202411762676 20241203. The patent publicati..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Harbin Shengbang Microelectronic Co Ltd has sought patent for Anti-backflow Protection Substrate Potential Generation Circuit. This invention was developed by Xu Xiaohang, Zhang Lidi, Zhou Jian and Hou Xiaohan.
The patent application number is CN202411998672 20241231. The patent publication number is CN1199..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Beijing Tsing Micro Intelligent Tech Co Ltd has submitted a patent application for CMOS Power Amplifier. This invention was developed by Qi Jianye, Li Xiudong, Wang Bo and Ouyang Peng.
The patent application number is CN202411668493 20241121. The patent publication number is CN119921688 (A). International P..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Espressif Sys Shanghai Co Ltd has submitted a patent application for Oscillator Frequency Modulation Circuit and Communication Chip. This invention was developed by Li Fangbo, Zhang Ruian and Mao Yandong.
The patent application number is CN20241200029 20241231. The patent publication number is CN119921680 (..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Shanghai Ziying Microelectronics Co Ltd has applied Chinese patent for Circuit for Improving Boost Input Range and Power Supply Chip. Li Yujun, Dong Yuan and Zhuang Jian developed it.
The patent application number is CN202510144448 20250210. The patent publication number is CN119921572 (A). International Pa..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has published Elite Semiconductor Memory Tech Inc patent application for Bootstrap Device and Buck-boost Converter. The invention was developed by Yang Yaowei.
The patent application number is CN202311419972 20231030. The patent publication number is CN119921570 (..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released Xidian University and Guangzhou Research Institute of Xidian Univ patent application for Full Gallium Nitride Integrated Half-bridge Circuit, Chip and Electronic Equipment. This invention was developed by Li Xiangdong, Zhang Yuanhang, Zhang Jincheng and ..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Shanghai Aorui Tech Co Ltd has applied Chinese patent for Micro-fluidic Chip and Single Cell Sorting Method. Wang Kun, Liu Demeng, Yang Miaomiao and Guan Yimin developed it.
The patent application number is CN202311444610 20231101. The patent publication number is CN119931829 (A). International Patent Class..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Wuhan Optical Valley Aerospace Sanjiang Laser Ind Tech Res Institute Co Ltd has submitted a patent application for Laser Cutting Method and Equipment Based on Silicon Carbide Wafer. This invention was developed by Hu Xirui, Yang Fufei, Wan Xiaomin, Zheng Yiming, Lei Xiaofeng, Xu Wei, Xia Kai, Fan Xiaokang and ..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Suzhou Bofeng Intelligent Tech Co Ltd has applied Chinese patent for Tin Dispensing Device for Semiconductor Element Production. Ouyang Jie, Zhang Jie and Ouyang Rui developed it.
The patent application number is CN202510364187 20250326. The patent publication number is CN119927353 (A). International Patent..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Ailibi Semiconductor Equipment Shanghai Co Ltd has filed a patent application for Welding Equipment and Welding Method for Semiconductor Heating Plate Production. This invention was developed by Chang Qiang and Xu Bing.
The patent application number is CN202510432386 20250408. The patent publication number ..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released Chongqing Pingchuang Semiconductor Res Institute Co Ltd patent application for Preparation Method of Semiconductor Packaging Piece, Preparation Method of Copper Powder, Copper Powder and Copper Powder Reaction Device. This invention was developed by Wang..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released Qiu Yunsheng patent application for Bio-based Silicon Carbon Black Poly-generation Process System and Energy Gradient Utilization Integrated Device and Method.
The patent application number is CN202510337705 20250321. The patent publication number is..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Wuxi Haite New Mat Institute Co Ltd has sought patent for Functional Water-based Organic Silicon and Preparation Method Thereof. This invention was developed by Bai Yongping, Liu Yang, Wang Yu, Yang Zhen, Wang Chao, Chen Qihao and Zhang Yanqiu.
The patent application number is CN20251038333 20250110. The pa..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- KZJ New Mat Group Co Ltd has applied Chinese patent for Polyether Organic Silicon Foam Control Agent, Cement-based Material Shrinkage Performance Control Agent and Preparation Method of Polyether Organic Silicon Foam Control Agent. Lin Yanmei, Fang Yunhui, Chen Zhanhua, Shen Qiang, Ke Yuliang, Pan Zhifeng, Zha..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Nichia has submitted a patent application for Sintered Body and Light-emitting Device. Noguchi Teruhiko, Hirai Toshiyuki and Kinoshita Shinpei developed the invention.
The patent application number is CN202411547913 20241101. The patent publication number is CN119931645 (A). International Patent Classificat..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Baja Electronics Tech Co Ltd has filed a patent application for Semiconductor Silicon Wafer Slicing Device Capable of Efficiently Bending and Slicing Silicon Wafers. This invention was developed by Ma Ziang, Peng Yu, Lin Jingqi and Lin Li.
The patent application number is CN202411982025 20241231. The patent..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has received Beijing Gmpower Tech Co Ltd patent application for Radio Frequency Power Supply Output Power Calibration Method and Device, and Semiconductor Process Method. Li Shuyu and Wang Li developed the invention.
The patent application number is CN202411823338..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released Dongguan Langcheng Microelectronic Equipment Co Ltd patent application for Automatic Feeding Detection Equipment for Integrated Circuit Packaging. This invention was developed by Chen Tianxiang, Kang Jin and Wu Ziming.
The patent application number is..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has received Jiangxi Wannianxin Microelectronic Co Ltd patent application for Semiconductor Wire Welding Processing Method and Semiconductor Device. Wu Haoru, Zhu Jinhui, Ai Yulin and Zhan Weidi developed the invention.
The patent application number is CN202510774..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Wuxi China Resources Micro Assembly Tech Co Ltd has submitted a patent application for Manufacturing Method of Semiconductor Structure. This invention was developed by Pan Xiaofei, Chen Li and Gong Ping.
The patent application number is CN202311437037 20231031. The patent publication number is CN119920703 (..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released Guangdong Taijin Semiconductor Tech Co Ltd and Dongguan Taijin Precision Tech Co Ltd patent application for Self-adjusting Chip Packaging Method and Device. This invention was developed by Huang Meilin.
The patent application number is CN202510397766 ..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Huakui Electromechanical Tech Suzhou Co Ltd has submitted a patent application for Precision Mold for Semiconductor Packaging. This invention was developed by Yuan Hao, Dai Jingtao, Kang Zhen, Zhang Zhiyong and Zhang Renyong.
The patent application number is CN202510209247 20250225. The patent publication n..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Shi Yinrui has sought patent for Flip Chip Packaging Process. This invention was developed by Hong Kaiyou.
The patent application number is CN202311377252 20231023. The patent publication number is CN119920693 (A). International Patent Classification codes are H01L21/48, H01L21/56, H01L23/31 and H01L23/498...
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Hangzhou Zhongxin Wafer Semiconductor Co Ltd has submitted a patent application for Bmd Regulation and Control Method of Annealed Sheet Based on Substrate Oxygen Content Oi. This invention was developed by Cao Yu, Wang Yunfeng and Zhang Pei.
The patent application number is CN202411898718 20241220. The pate..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has published Songshan Lake Materials Laboratory and Institue of Physics, CAS patent application for Method for Transferring Wafer-size Two-dimensional Semiconductor Film by Selenium-assisted Dry Method. The invention was developed by Zhang Guangyu, Zhang Xingchao, W..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Shanghai Bangxin Semiconductor Tech Co Ltd has submitted a patent application for Air Inlet System for Plasma Processing Equipment. This invention was developed by Tang Le, Wang Zhaoxiang, Liang Jie, Tu Leyi, Li Ke, Zhang Pengbing and Peng Guofa.
The patent application number is CN202510421523 20250407. The..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Hebei Tongguang Semiconductor Co Ltd has submitted a patent application for Continuous Synthesis Device and Method Based on Silicon Carbide Powder. This invention was developed by Li Ruoming, Zheng Xiangguang, Yang Kun, Lu Yajuan and Liu Xinhui.
The patent application number is CN202510428724 20250408. The ..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released Jiangxi Luda New Energy Tech Co Ltd patent application for Lithium Battery Silicon Carbon Negative Electrode Material Coating Device. This invention was developed by Zeng Niangen.
The patent application number is CN202411969009 20241230. The patent pu..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released Suzhou Institute Of Tech patent application for Design Method for Heat Insulation Performance of Silicon Carbide Ceramic Gradient Tpms Structure. This invention was developed by Tang Danna, Yang Shuying and Ding Yifei.
The patent application number is..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Hicomp Microtech Suzhou Company Ltd has submitted a patent application for Liquid Processing Chip. Chen Jiaqu, Yu Dongzhi, Gu Yifan, Feng Chengyu and Wu Yexian developed the invention.
The patent application number is CN202311447366 20231102. The patent publication number is CN119926536 (A). International P..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Hangzhou Firstack Tech Co Ltd has applied Chinese patent for Current-limiting Protection Circuit for Wafer Test and Wafer Test Circuit. Li Jinghao, Ding Wenjian, Liu Wei, Shi Yimeng, Wang Wenguang and Li Jun developed it.
The patent application number is CN202510406781 20250402. The patent publication numbe..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released Chongqing HKC Optoelectronics Tech Co Ltd and HKC patent application for Microfluidic Chip and Microfluidic System. This invention was developed by Yang Fan, Zhang Hejing, Liu Zhen, Lin Chunyan, Zhang Jie, Fan Junlong and Yuan Haijiang.
The patent app..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Micron Vision Inc has applied Chinese patent for Compact Robotic Endoscope with Built-in Nippers. Ouyang Xiaolong developed it.
The patent application number is CN202510373023 20250327. The patent publication number is CN119924753 (A). International Patent Classification codes are A61B1/005, A61B1/018, A61B..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Pan Jit International Inc has submitted a patent application for Semiconductor Packaging Structure. This invention was developed by Ho Chung-hsiung, Liu Hongmin, Huang Wenliang and Wu Zhengxian.
The patent application number is CN202311430444 20231031. The patent publication number is CN119920793 (A). Inter..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has released Hangtian Innovation Tech Co Ltd patent application for Semiconductor Packaging Structure. This invention was developed by Chen Shiji.
The patent application number is CN202311415672 20231030. The patent publication number is CN119920792 (A). Internati..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Ebersolic Inc has sought patent for Package Substrate and Method for Manufacturing Package Substrate. This invention was developed by Lee Bong-yeol and Kim Tae-kyoung.
The patent application number is CN202411540599 20241031. The patent publication number is CN119920765 (A). International Patent Classificat..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Ebersolic Inc has submitted a patent application for Package Substrate and Method for Manufacturing Package Substrate. This invention was developed by Kim Tae-kyoung and Lee Bong-yeol.
The patent application number is CN202411540590 20241031. The patent publication number is CN119920764 (A). International P..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Ebersolic Inc has submitted a patent application for Package Substrate and Method for Manufacturing Package Substrate. Lee Bong-yeol and Kim Hye-jin developed the invention.
The patent application number is CN202411491738 20241024. The patent publication number is CN119920763 (A). International Patent Class..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- Wuhan Xinlike Tech Co Ltd has sought patent for Wafer Bonding Equipment and Wafer Bonding Method Based on Bifocal Imaging. This invention was developed by Xu Zhoulong, Zhao Xinyu, Ding Xinglan and Wang Jun.
The patent application number is CN20251024810 20250108. The patent publication number is CN119920743..
Semiconductor
| Wed 03 Dec 2025
Beijing, Dec. 3 -- State Intellectual Property Office of China has published Wuhan Xinlike Tech Co Ltd patent application for Wafer Bonding Equipment and Wafer Bonding Method. The invention was developed by Xu Zhoulong, Zhao Xinyu, Ding Xinglan, Wang Jun and Zhong Yunfeng.
The patent application number is CN20251004230 202501..
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