Semiconductor
| Mon 12 Jan 2026
Geneva, Jan. 13 -- Hisense Home Appliances Group has submitted a patent application for Semiconductor Module. Li Xingshi, Yang Jingcheng, Dong Jun, Li Zhengkai, Liu Jian, Cheng Zhangming and Jiang Wei developed the invention.
The patent application number is WO2025CN80096 20250228. The patent publication number is WO202600106..