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03:27:55 Thu 19 Feb 2026

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(1)

(1)

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Shenzhen Hope Microelectronics Co Ltd and Wuxi Zetai Microelectronics Co Ltd File Chinese Patent Application for Method for Eliminating Interference of Isolator Chip Radiation on R..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Shenzhen Hope Microelectronics Co Ltd and Wuxi Zetai Microelectronics Co Ltd have filed a patent application for Method for Eliminating Interference of Isolator Chip Radiation on Radio Frequency System. This invention was developed by Deng Jianyuan and Ruan Qingyu. The patent application number is CN202511..

BOE Technology Group and Chengdu BOE Optoelectronics Technology File Chinese Patent Application for Display Substrate and Display Device

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have filed a patent application for Display Substrate and Display Device. This invention was developed by Deng Yin, Li Haohao, Zhao Ze, Feng Yuanming, Liang Yaxing, Wang Hongjun, Li Biqi and Li Yunfan. The patent application number is CN202380..

Huazhong University of Science and Technology and Hubei Guanggu Laboratory File Chinese Patent Application for Piezoelectric-driven MEMS Scanning Mirror

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Huazhong University of Science and Technology and Hubei Guanggu Laboratory have filed a patent application for Piezoelectric-driven MEMS Scanning Mirror. This invention was developed by Wang Junya, Ding Xiaolong, Qu Ziqiang and You Zheng. The patent application number is CN202410906016 20240708. The patent..

BOE Technology Group and Chengdu BOE Optoelectronics Technology File Chinese Patent Application for Detection Method for Fitting Design of Display Substrate

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have filed a patent application for Detection Method for Fitting Design of Display Substrate. This invention was developed by Gao Xiang, Chen Lin and Xie Guangfa. The patent application number is CN202510655376 20250520. The patent publication..

BOE Technology Group and Chengdu BOE Optoelectronics Technology File Chinese Patent Application for Pixel Driving Circuit, Refresh Rate Improving Method, Driving Substrate and Disp..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have filed a patent application for Pixel Driving Circuit, Refresh Rate Improving Method, Driving Substrate and Display Device. This invention was developed by Xiang Lian and Luo Chang. The patent application number is CN202410216903 20240227...

Intel Prod Chengdu Co Ltd and Intel File Chinese Patent Application for Method for Measuring Cutting Depth of Adhesive Tape for Fixing and Supporting Wafer

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Intel Prod Chengdu Co Ltd and Intel have filed a patent application for Method for Measuring Cutting Depth of Adhesive Tape for Fixing and Supporting Wafer. This invention was developed by Liao Jian. The patent application number is CN202510718407 20250530. The patent publication number is CN120565438 (A)...

Sichuan Gaojing Solar Energy Technology and Gaojing Solar Energy Submit Patent Application for Silicon Wafer Detection System and Method

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Sichuan Gaojing Solar Energy Technology and Gaojing Solar Energy have submitted a patent application for Silicon Wafer Detection System and Method. Ma Junsheng, Xu Maoyong, Gao Peng, Fu Mingquan and Xu Zhiqun developed the invention. The patent application number is CN202510664685 20250522. The patent publ..

Hunan Jinci New Material Tech Co Ltd, Yanshan University and Hunan Jinchi Magnetic Material Tech Co Ltd Submit Patent Application for Ultrathin Silicon Steel Sheet Punching Device

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Hunan Jinci New Material Tech Co Ltd, Yanshan University and Hunan Jinchi Magnetic Material Tech Co Ltd have submitted a patent application for Ultrathin Silicon Steel Sheet Punching Device. Wang Zeyuan, Xie Jinqiang, Luo Hui, Sun Baoru and Liu Yingping developed the invention. The patent application numbe..

University of Electronic Science and Technology of China and Beijing Smartchip Microelectronics Technology Submit Chinese Patent Application for Integrated Double-channel Silicon C..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- University of Electronic Science and Technology of China and Beijing Smartchip Microelectronics Technology have submitted a patent application for Integrated Double-channel Silicon Carbide MOSFET Device and Preparation Method Thereof. This invention was developed by Li Xuan, Xu Shikang, Zhao Ze, Fu Zhen, Zhan..

Zhejiang Jinlei Soft Magnetic Mat Co Ltd, Zhejiang Jinlei Refractories Co Ltd and Zhejiang Mopper Environmental Technology Submit Patent Application for Conveying Compensation Meth..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Zhejiang Jinlei Soft Magnetic Mat Co Ltd, Zhejiang Jinlei Refractories Co Ltd and Zhejiang Mopper Environmental Technology have submitted a patent application for Conveying Compensation Method for Oriented Silicon Steel Plate Strip. Chen Gencai, Fu Ruxue and Cheng Shuzhong developed the invention. The pate..

BOE Technology Group, Chengdu BOE Optoelectronics Technology and Beijing BOE Technology Development Submit Chinese Patent Application for Display Substrate and Display Device

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- BOE Technology Group, Chengdu BOE Optoelectronics Technology and Beijing BOE Technology Development have submitted a patent application for Display Substrate and Display Device. This invention was developed by Hu Ming, Dong Xiangdan, Liu Tingliang, Fan Cong, Wang Benlian, Zhang Wei, Hao Xueguang, Wang Hongli,..

BOE Technology Group and Beijing BOE Technology Development Submit Patent Application for Display Substrate, Display Device and Method for Preparing Display Substrate

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- BOE Technology Group and Beijing BOE Technology Development have submitted a patent application for Display Substrate, Display Device and Method for Preparing Display Substrate. Zhang Yafei, Zhang Dongdong, Jia Mengwen and Qu Feng developed the invention. The patent application number is CN20238012091 2023..

Soloman Changzhou Alloy New Mat Co Ltd and Guangzhou Zhongshan Precision Technology Submit Chinese Patent Application for Preparation Method of Silicon Carbide Skeleton and Aluminu..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Soloman Changzhou Alloy New Mat Co Ltd and Guangzhou Zhongshan Precision Technology have submitted a patent application for Preparation Method of Silicon Carbide Skeleton and Aluminum-based Silicon Carbide Composite Material. This invention was developed by Cheng Shanli, Li Zongzhen, Li Zihan and Peng Jinbao...

Jingxincheng Beijing Tech Co Ltd and Hefei Nexchip Integrated Circuit Submit Patent Application for Photomask, Photomask Pattern Generation Method, Semiconductor Structure and Prep..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Jingxincheng Beijing Tech Co Ltd and Hefei Nexchip Integrated Circuit have submitted a patent application for Photomask, Photomask Pattern Generation Method, Semiconductor Structure and Preparation Method Thereof. Zhao Guang, Luo Zhaolong and Yue Hao developed the invention. The patent application number i..

Hefei Xinsheng Optoelectronic Technology Co Ltd and BOE Technology Group Submit Chinese Patent Application for Display Substrate and Display Screen

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Hefei Xinsheng Optoelectronic Technology Co Ltd and BOE Technology Group have submitted a patent application for Display Substrate and Display Screen. This invention was developed by Zhang Tianyi, Kang Hai, Yang Hongmei, Li Hu, Zhang Douqing and Tian Ziyue. The patent application number is CN202410233952 2..

Tsinghua University and Beijing Yuguang Tech Co Ltd Submit Patent Application for Construction Method of Spectrum Processing Chip and Spectrum Processing Chip

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Tsinghua University and Beijing Yuguang Tech Co Ltd have submitted a patent application for Construction Method of Spectrum Processing Chip and Spectrum Processing Chip. Cui Kaiyu, Xu Sheng, Rao Shijie, Huang Yidong, Zhang Wei, Feng Xue and Liu Fang developed the invention. The patent application number is..

Beijing Xiaomi Mobile Software and Beijing Xiaomi Songguo Elect Co Ltd Submit Chinese Patent Application for Image Processing Method and Device, Electronic Equipment, Chip and Stor..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Beijing Xiaomi Mobile Software and Beijing Xiaomi Songguo Elect Co Ltd have submitted a patent application for Image Processing Method and Device, Electronic Equipment, Chip and Storage Medium. This invention was developed by Shan Wenjun. The patent application number is CN202410232841 20240229. The patent..

Zhejiang Xingke Photoelectric Tech Co Ltd and Beijing Bojia Tech Co Ltd Submit Chinese Patent Application for TGV Glass Substrate Through Hole Quality Detection Method

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Zhejiang Xingke Photoelectric Tech Co Ltd and Beijing Bojia Tech Co Ltd have submitted a patent application for TGV Glass Substrate Through Hole Quality Detection Method. This invention was developed by Yang Xiaobo, An Liying, Wang Kun and Gao Weiming. The patent application number is CN202510585591 202505..

Beijing E Town Semiconductor Technology and Mattson Technology Submit Chinese Patent Application for Conductive Member for Cleaning Focus Ring of Plasma Processing Apparatus

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Beijing E Town Semiconductor Technology and Mattson Technology have submitted a patent application for Conductive Member for Cleaning Focus Ring of Plasma Processing Apparatus. This invention was developed by Long Maolin and Guan Changle. The patent application number is CN202510544002 20210908. The patent..

Sichuan Gaojing Solar Energy Technology and Gaojing Solar Energy Submit Chinese Patent Application for Silicon Wafer Cleaning Method, Silicon Wafer Cleaning System and Electronic E..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Sichuan Gaojing Solar Energy Technology and Gaojing Solar Energy have submitted a patent application for Silicon Wafer Cleaning Method, Silicon Wafer Cleaning System and Electronic Equipment. This invention was developed by Zhang Ziqiang, Ma Junsheng, Xu Maoyong, Gao Peng and Fu Mingquan. The patent applic..

State Intellectual Property Office of China Receives Shenzhen Yspring Tech Co Ltd Patent Application for Chip Packaging Structure

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has received Shenzhen Yspring Tech Co Ltd patent application for Chip Packaging Structure. Wen Chuanjing and Zhuang Tengfei developed the invention. The patent application number is CN202510775805 20250611. The patent publication number is CN120565540 (A). Intern..

Qingdao Jiaen Semiconductor Tech Co Ltd Seeks Patent for Embedded Double-sided IGBT (insulated Gate Bipolar Translator) Module Packaging Structure and Manufacturing Method

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Qingdao Jiaen Semiconductor Tech Co Ltd has sought patent for Embedded Double-sided IGBT (insulated Gate Bipolar Translator) Module Packaging Structure and Manufacturing Method. This invention was developed by Wang Pilong, Wang Xinqiang and Yang Yuzhen. The patent application number is CN202510510960 20250..

State Intellectual Property Office of China Publishes Semiconductor Mfg International Beijing Corp and Semiconductor Manufacturing International (Shanghai) Patent Application for W..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has published Semiconductor Mfg International Beijing Corp and Semiconductor Manufacturing International (Shanghai) patent application for Wafer, Manufacturing Method Thereof, Packaging Structure and Packaging Method. The invention was developed by Wang Yixin, Yan D..

State Intellectual Property Office of China Releases Semiconductor Mfg International Beijing Corp and Semiconductor Manufacturing International (Shanghai) Patent Application for Se..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has released Semiconductor Mfg International Beijing Corp and Semiconductor Manufacturing International (Shanghai) patent application for Semiconductor Structure, Forming Method Thereof, Packaging Structure and Method. This invention was developed by Sui Kai. The..

State Intellectual Property Office of China Releases Huatian Tech Jiangsu Co Ltd Patent Application for 2.5 D Packaging Method and Structure

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has released Huatian Tech Jiangsu Co Ltd patent application for 2.5 D Packaging Method and Structure. This invention was developed by Fu Dongzhi and Ma Shuying. The patent application number is CN202510689232 20250527. The patent publication number is CN120565431..

State Intellectual Property Office of China Publishes Jiangsu Pangu Semiconductor Tech Co Ltd Patent Application for Board-level High-thermal-conductivity Packaging Method and Stru..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has published Jiangsu Pangu Semiconductor Tech Co Ltd patent application for Board-level High-thermal-conductivity Packaging Method and Structure. The invention was developed by Jiang Xinglong and Ma Shuying. The patent application number is CN202510723698 202505..

State Intellectual Property Office of China Receives Shenzhen Meixi Micro Vision Tech Co Ltd Patent Application for Self-adaptive Alignment Method of Chip Substrate

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has received Shenzhen Meixi Micro Vision Tech Co Ltd patent application for Self-adaptive Alignment Method of Chip Substrate. Yuan Chuzhuo, He Ximing and Wang Shuangqing developed the invention. The patent application number is CN20251145962 20250729. The patent ..

Elane Beijing Data Tech Co Ltd Files Chinese Patent Application for Ais Data Pricing Method and Device, Electronic Equipment, Readable Storage Medium and Chip

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Elane Beijing Data Tech Co Ltd has filed a patent application for Ais Data Pricing Method and Device, Electronic Equipment, Readable Storage Medium and Chip. This invention was developed by Wang Guoliang. The patent application number is CN202510595379 20250509. The patent publication number is CN120563183..

State Intellectual Property Office of China Releases BOE Technology Group, Beijing Zhongxiangying Tech Co Ltd and Beijing BOE Technology Development Patent Application for Test Man..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has released BOE Technology Group, Beijing Zhongxiangying Tech Co Ltd and Beijing BOE Technology Development patent application for Test Management Method and Test Management System for Test Wafer. This invention was developed by Ban Cheng, Zhang Libo, Wang Hong, Pa..

State Intellectual Property Office of China Publishes Sichuan Gaojing Solar Energy Technology and Gaojing Solar Energy Patent Application for Silicon Wafer Automatic Cargo Allocati..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has published Sichuan Gaojing Solar Energy Technology and Gaojing Solar Energy patent application for Silicon Wafer Automatic Cargo Allocation Optimization Method and Device, Electronic Equipment and Medium. The invention was developed by Zhang Ziqiang, Ma Junsheng,..

Sice Huixin Suzhou Tech Co Ltd Applies for Patent on Novel Chip Detection Method

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Sice Huixin Suzhou Tech Co Ltd has applied Chinese patent for Novel Chip Detection Method. Zhang Gongchang, Wen Mingyou and Huang Mingzhi developed it. The patent application number is CN202510696482 20250528. The patent publication number is CN120563467 (A). International Patent Classification codes are G..

State Intellectual Property Office of China Publishes Shenzhen City Meipusen Semiconductor Co Ltd Patent Application for Power Semiconductor Fault Detection Method and System Based..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has published Shenzhen City Meipusen Semiconductor Co Ltd patent application for Power Semiconductor Fault Detection Method and System Based on Multi-modal Data. The invention was developed by He Chang, Zhang Guangya and Li Junfeng. The patent application number ..

Wuhan Daqo Energy Tech Co Ltd Seeks Patent for Intelligent Calculation Method and System for Loss of Semiconductor Device

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Wuhan Daqo Energy Tech Co Ltd has sought patent for Intelligent Calculation Method and System for Loss of Semiconductor Device. This invention was developed by Wu Meina, Chen Rongqiang, Wang Wenjin, Yu Zizhen and Hu Shiming. The patent application number is CN202510632117 20250516. The patent publication n..

Zhan Changzhen Seeks Patent for Self-supporting Silicon Carbon Electrode Plate and Preparation Method Thereof

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Zhan Changzhen has sought patent for Self-supporting Silicon Carbon Electrode Plate and Preparation Method Thereof. The patent application number is CN202510626261 20250515. The patent publication number is CN120565555 (A). International Patent Classification codes are C01B32/225, C01B33/035, H01M4/04, H01M..

Mitsubishi Electric Seeks Patent for Semiconductor Device

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Mitsubishi Electric has sought patent for Semiconductor Device. This invention was developed by Miyahara Satoshi. The patent application number is CN202510166973 20250214. The patent publication number is CN120565550 (A). International Patent Classification codes are H01L23/48, H01L23/52, H01L23/552 and H0..

Xinai Tech Nanjing Co Ltd Submits Chinese Patent Application for Packaging Structure of Low-stress Glass Substrate and Rewiring Layer

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Xinai Tech Nanjing Co Ltd has submitted a patent application for Packaging Structure of Low-stress Glass Substrate and Rewiring Layer. This invention was developed by Chen Minyao and Tong Jiajun. The patent application number is CN202510749264 20250606. The patent publication number is CN120565546 (A). Int..

State Intellectual Property Office of China Publishes Guizhou Zhenhua Fengguang Semiconductor Co Ltd Patent Application for Semiconductor Module Packaging Structure and Semiconduct..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has published Guizhou Zhenhua Fengguang Semiconductor Co Ltd patent application for Semiconductor Module Packaging Structure and Semiconductor Module Packaging Method. The invention was developed by Chen Yuan, Zhang Jian, Gan Xianpeng, Geng Feng, Li Ping, Fu Jixian,..

The 43th Research Institute Of China Electronics Tech Group Corporation Submits Chinese Patent Application for Metallized Ceramic Substrate with Vertically Interconnected Trapezoid..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- The 43th Research Institute Of China Electronics Tech Group Corporation has submitted a patent application for Metallized Ceramic Substrate with Vertically Interconnected Trapezoidal Through Holes and Preparation Method Thereof. This invention was developed by Liu Junfu, Wei Xin, Nie Qiangqiang, Wang Yansheng..

ABLIC Files Chinese Patent Application for Semiconductor Device

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- ABLIC has filed a patent application for Semiconductor Device. This invention was developed by Kadoi Kiyoaki. The patent application number is CN20251015755 20250106. The patent publication number is CN120565528 (A). International Patent Classification code is H01L23/495. Cooperative Patent Classification ..

Huatian Tech Jiangsu Co Ltd Seeks Patent for High-density Double-sided Fine Wiring Fan-out Chip Packaging Structure and Method

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Huatian Tech Jiangsu Co Ltd has sought patent for High-density Double-sided Fine Wiring Fan-out Chip Packaging Structure and Method. This invention was developed by Fu Dongzhi and Ma Shuying. The patent application number is CN202510506826 20250422. The patent publication number is CN120565521 (A). Interna..

Qili Semiconductor Shaoxing Co Ltd Seeks Patent for Chip Packaging Heat Dissipation Cover with Silicon Substrate Replacing Metal for Heat Conduction

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Qili Semiconductor Shaoxing Co Ltd has sought patent for Chip Packaging Heat Dissipation Cover with Silicon Substrate Replacing Metal for Heat Conduction. This invention was developed by Xie Jianyou, Wang Jiawei, Zhang Hong and Zheng Lijie. The patent application number is CN202510711853 20250529. The pate..

Nanjing Nari Semiconductor Co Ltd Submits Chinese Patent Application for Field Decoupling Type Substrate of Power Semiconductor Module

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Nanjing Nari Semiconductor Co Ltd has submitted a patent application for Field Decoupling Type Substrate of Power Semiconductor Module. This invention was developed by Mo Shenyang, Li Shuaike, Tong Yan, Wang Yong, Luo Jian and Zhou Liang. The patent application number is CN202510398781 20250401. The patent..

State Intellectual Property Office of China Releases Tianxin Interconnection Tech Co Ltd Patent Application for Chip Packaging Structure and Packaging Method of Chip Packaging Stru..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has released Tianxin Interconnection Tech Co Ltd patent application for Chip Packaging Structure and Packaging Method of Chip Packaging Structure. This invention was developed by Zhong Shijie, He Haiping, Song Guanqiang, Li Yuhong and Tao Du. The patent applicati..

State Intellectual Property Office of China Publishes Sun Yat Sen University Shenzhen and Sun Yat-sen University Patent Application for High-thermal-conductivity Boron Arsenide Cer..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has published Sun Yat Sen University Shenzhen and Sun Yat-sen University patent application for High-thermal-conductivity Boron Arsenide Ceramic Substrate and Preparation Method and Application Thereof. The invention was developed by Mou Yun, Liu Ruijie, Wang Xinyua..

State Intellectual Property Office of China Receives Guangdong Xinyueneng Semiconductor Co Ltd Patent Application for Cutting Method of Silicon Carbide Chip

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has received Guangdong Xinyueneng Semiconductor Co Ltd patent application for Cutting Method of Silicon Carbide Chip. Yuan Hao developed the invention. The patent application number is CN202510754539 20250606. The patent publication number is CN120565502 (A). Int..

Shanghai Optical Communication Co Ltd Submits Patent Application for Wafer Bearing Device and Semiconductor Equipment

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Shanghai Optical Communication Co Ltd has submitted a patent application for Wafer Bearing Device and Semiconductor Equipment. Li Shixiong developed the invention. The patent application number is CN202410186048 20240219. The patent publication number is CN120565480 (A). International Patent Classification..

Hunan Lianxin Precision Tech Co Ltd Submits Patent Application for Self-positioning Detection Equipment for Chip Production

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Hunan Lianxin Precision Tech Co Ltd has submitted a patent application for Self-positioning Detection Equipment for Chip Production. Cai Guo, Zeng Bin, Li Yuzhi and Hong Woo-jin developed the invention. The patent application number is CN20251181125 20250804. The patent publication number is CN120565479 (A..

State Intellectual Property Office of China Releases Shanghai Xinyuan Micro Entpr Development Co Ltd Patent Application for Wafer Turnover Device and Wafer Turnover Equipment

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has released Shanghai Xinyuan Micro Entpr Development Co Ltd patent application for Wafer Turnover Device and Wafer Turnover Equipment. This invention was developed by Liu Tao, Peng Bo, Wang Rongxiang, Li Shuang, Xiao Jing, Song Xuanjie and Zhao Qi. The patent ap..

Wuxi Xivi Tech Co Ltd Submits Chinese Patent Application for Intelligent Loading Equipment Compatible with Multi-size Wafer Cassettes and Control Method

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Wuxi Xivi Tech Co Ltd has submitted a patent application for Intelligent Loading Equipment Compatible with Multi-size Wafer Cassettes and Control Method. This invention was developed by Lu Minjie, Wang Zhaokun and Liu Haohao. The patent application number is CN20251147153 20250729. The patent publication n..

State Intellectual Property Office of China Publishes Sound Semiconductor Equipment Jiangsu Co Ltd Patent Application for Chip Inserting Machine for Semiconductor Wafer

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has published Sound Semiconductor Equipment Jiangsu Co Ltd patent application for Chip Inserting Machine for Semiconductor Wafer. The invention was developed by Chen Jiongjie, Zhang Xunkun, Hu Lei and Huang Feng. The patent application number is CN202510827751 20..

Zhejiang Xinwei Taike Semiconductor Co Ltd Submits Patent Application for Method and System for Manufacturing Semiconductor Device

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Zhejiang Xinwei Taike Semiconductor Co Ltd has submitted a patent application for Method and System for Manufacturing Semiconductor Device. Yi Lan, Wang Chong, Chen Lunxing, Hu Zhijie and Ding Yonglu developed the invention. The patent application number is CN20251164339 20250731. The patent publication nu..

Lianyungang Shengquan Quartz Tech Co Ltd Files Chinese Patent Application for Built-in Wafer Pushing Device for Semiconductor Quartz Tube

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Lianyungang Shengquan Quartz Tech Co Ltd has filed a patent application for Built-in Wafer Pushing Device for Semiconductor Quartz Tube. This invention was developed by Xu Bingran, Xu Bingjie and Li Gang. The patent application number is CN20251163439 20250731. The patent publication number is CN120565467 ..

State Intellectual Property Office of China Publishes Shanghai Xinyuan Micro Entpr Development Co Ltd Patent Application for Swing Arm Track Planning Method and Wafer Cleaning Mach..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has published Shanghai Xinyuan Micro Entpr Development Co Ltd patent application for Swing Arm Track Planning Method and Wafer Cleaning Machine. The invention was developed by Kang Ying, Zhang Xiaolong and Wang Yanhua. The patent application number is CN202511618..

Safe Instr Chengde Co Ltd Files Chinese Patent Application for Efficient Cleaning and Degumming Integrated Equipment for Semiconductor Chip Manufacturing

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Safe Instr Chengde Co Ltd has filed a patent application for Efficient Cleaning and Degumming Integrated Equipment for Semiconductor Chip Manufacturing. This invention was developed by Sun Jianwen, Wang Yingli, Li Guannan, Zhang Hengqiang, Chen Hongli, Chen Zhen and Lin Fangning. The patent application num..

SC New Energy Technology Submits Patent Application for Semiconductor Process Furnace

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- SC New Energy Technology has submitted a patent application for Semiconductor Process Furnace. Liu Huaiyue, Long Xiao and Lin Xiaojiao developed the invention. The patent application number is CN202510960062 20250711. The patent publication number is CN120565463 (A). International Patent Classification cod..

State Intellectual Property Office of China Publishes Guojing Hechuang Qingdao Tech Co Ltd Patent Application for Flexible Substrate Processing Device

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has published Guojing Hechuang Qingdao Tech Co Ltd patent application for Flexible Substrate Processing Device. The invention was developed by Lyu Yong, Zhang Fuxuan, Cui Caoxiang, Zhang Chunyang, Guo Baijun and Li Xiaodong. The patent application number is CN202..

Wentian Jingce Instrument Tech Suzhou Co Ltd Submits Chinese Patent Application for Heating and Cooling System for Wafer Bonding Equipment

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Wentian Jingce Instrument Tech Suzhou Co Ltd has submitted a patent application for Heating and Cooling System for Wafer Bonding Equipment. This invention was developed by Zhao Tianbiao, Yang Peiyu and Jiang Jie. The patent application number is CN202510754290 20250606. The patent publication number is CN1..

Fuzhou Langning Mould Co Ltd Seeks Patent for Efficient Silicon Wafer Cleaning Equipment for Manufacturing Solar Photovoltaic Cell Panel

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Fuzhou Langning Mould Co Ltd has sought patent for Efficient Silicon Wafer Cleaning Equipment for Manufacturing Solar Photovoltaic Cell Panel. This invention was developed by Zhang Wu. The patent application number is CN202510740080 20250605. The patent publication number is CN120565458 (A). International ..

State Intellectual Property Office of China Receives Xinlian Integrated Circuit Manufacturing Patent Application for Statistical Process Control Method and Device

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has received Xinlian Integrated Circuit Manufacturing patent application for Statistical Process Control Method and Device. Liang Dongsheng, Xiang Lin, Wang Zheng, Liu Mengmeng, Li Shuwen and Wu Jianghua developed the invention. The patent application number is C..

Qingdao Besland Semiconductor Tech Co Ltd Submits Chinese Patent Application for Control Method of Semiconductor Wafer Processing Equipment, Equipment and Medium

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Qingdao Besland Semiconductor Tech Co Ltd has submitted a patent application for Control Method of Semiconductor Wafer Processing Equipment, Equipment and Medium. This invention was developed by Yang Zhen and Hara Keiryu. The patent application number is CN202510597835 20250509. The patent publication numb..

Intel NDTM USA Inc Applies for Patent on FOSB Wafer Cassette Management Method and Wafer Handling System

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Intel NDTM USA Inc has applied Chinese patent for FOSB Wafer Cassette Management Method and Wafer Handling System. Yang Yueqin, Li Hanlin and Dou Maoquan developed it. The patent application number is CN202410231318 20240229. The patent publication number is CN120565441 (A). International Patent Classifica..

State Intellectual Property Office of China Releases Suzhou Weixin Intelligent Tech Co Ltd Patent Application for Method for Non-contact Testing of Quantum Efficiency (EQE) and Sho..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has released Suzhou Weixin Intelligent Tech Co Ltd patent application for Method for Non-contact Testing of Quantum Efficiency (EQE) and Short-circuit Current (ISC) of Solar Cell. This invention was developed by Zhang Yu, He Yifei and Xu Jianbing. The patent appl..

State Intellectual Property Office of China Publishes Anhui Annuqi Tech Co Ltd Patent Application for Manufacturing Method of Semiconductor Structure

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has published Anhui Annuqi Tech Co Ltd patent application for Manufacturing Method of Semiconductor Structure. The invention was developed by Zhou Zhihu, He Chenggong and He Jun. The patent application number is CN202510688941 20250527. The patent publication num..

Sanju Semiconductor Suzhou Co Ltd Files Chinese Patent Application for Metal Connecting Piece and Chip or Substrate Bonding Structure and Manufacturing Method Thereof

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Sanju Semiconductor Suzhou Co Ltd has filed a patent application for Metal Connecting Piece and Chip or Substrate Bonding Structure and Manufacturing Method Thereof. This invention was developed by Feng Kun, Zhao Haijun, Sun Sen and Ge Zhengdong. The patent application number is CN202510630307 20250516. Th..

State Intellectual Property Office of China Releases Powerchip Semiconductor Manufacturing Corporation Patent Application for Semiconductor Structure and Manufacturing Method There..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has released Powerchip Semiconductor Manufacturing Corporation patent application for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Ni Peirong, Lyu Junlin, Lin Xiaojiang and Zhang Shouren. The patent application number ..

State Intellectual Property Office of China Receives Shaoxin Labs Patent Application for Hgte Zero-dimensional Semiconductor Patterning Method Based on Orthogonal Ligand

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has received Shaoxin Labs patent application for Hgte Zero-dimensional Semiconductor Patterning Method Based on Orthogonal Ligand. Zhou Peng, Wang Jianlu, Guo Tianle, Liu Jingjing, Hu Zhourui and Qin Yilu developed the invention. The patent application number is ..

State Intellectual Property Office of China Receives Dongguan Lizhi Grinding Tech Co Ltd Patent Application for Polishing Process of Semiconductor-level Monocrystalline Silicon Waf..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has received Dongguan Lizhi Grinding Tech Co Ltd patent application for Polishing Process of Semiconductor-level Monocrystalline Silicon Wafer Substrate. Zhou Qingyi, He Jinyuan and Gong Ting developed the invention. The patent application number is CN20251067632..

Jiangsu Kaiweitesi Semiconductor Tech Co Ltd Submits Chinese Patent Application for Composite Functional Component for Semiconductor Reaction Equipment

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Jiangsu Kaiweitesi Semiconductor Tech Co Ltd has submitted a patent application for Composite Functional Component for Semiconductor Reaction Equipment. This invention was developed by Ding Ruihua, Zhang Mu, Zhu Wenjian, Chen Kaiqing, Xue Hongyu, Gui Chuanshu and Yan Wangxue. The patent application number ..

Hefei Silergy Semiconductor Tech Co Ltd Files Chinese Patent Application for Inductor Structure and Manufacturing Method Thereof, Power Supply Module and Power Converter

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Hefei Silergy Semiconductor Tech Co Ltd has filed a patent application for Inductor Structure and Manufacturing Method Thereof, Power Supply Module and Power Converter. This invention was developed by Dai Ke, Noritaka, Lou Xin, Huang Qiukai, Yan Jiajia and Li Chao. The patent application number is CN202510..

China Three Gorges University Files Chinese Patent Application for Spin Transistor Based on Edge Engineering Mos2 Nanobelt Heterojunction and Design Method

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- China Three Gorges University has filed a patent application for Spin Transistor Based on Edge Engineering Mos2 Nanobelt Heterojunction and Design Method. This invention was developed by Hu Gongwei, Eno, Chen Qiao, Liu Min, Yang Xianwei and Pan Liqing. The patent application number is CN202510720867 202505..

Zhuhai Linglong Yuxin Tech Co Ltd Submits Patent Application for Chip Pin Multiplexing Control Circuit, Control Method Thereof and Chip

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Zhuhai Linglong Yuxin Tech Co Ltd has submitted a patent application for Chip Pin Multiplexing Control Circuit, Control Method Thereof and Chip. Chen Hao, Yang Yicong, Zhu Guozhong and Han Shuo developed the invention. The patent application number is CN202510511978 20250423. The patent publication number ..

Guanghe Technology, Guangzhou Applies for Patent on Correction Method and Device for Dielectric Constant of Circuit Board, Equipment and Storage Medium

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Guanghe Technology, Guangzhou has applied Chinese patent for Correction Method and Device for Dielectric Constant of Circuit Board, Equipment and Storage Medium. Ni Haoran, Wang Guohui, Zhang Wenjie and He Dong developed it. The patent application number is CN202510683724 20250526. The patent publication n..

Muxi Integrated Circuit (Shanghai) Applies for Patent on Method and Device for Generating Function Coverage Rate Based on Variable-length Data Packet and Medium

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Muxi Integrated Circuit (Shanghai) has applied Chinese patent for Method and Device for Generating Function Coverage Rate Based on Variable-length Data Packet and Medium. Yang Hanjia developed it. The patent application number is CN20251174755 20250801. The patent publication number is CN120562354 (A). Int..

Shandong Aerospace Artificial Intelligence Safety Chip Res Institute Submits Patent Application for Artificial Intelligence Acceleration Operation Chip

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Shandong Aerospace Artificial Intelligence Safety Chip Res Institute has submitted a patent application for Artificial Intelligence Acceleration Operation Chip. Chen Weihua, Du Hui and Han Zhiwei developed the invention. The patent application number is CN202510500055 20250421. The patent publication numbe..

State Intellectual Property Office of China Releases Yuanqixin Shandong Semiconductor Tech Co Ltd Patent Application for Computational Graph Processing Method and Device Under Data..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has released Yuanqixin Shandong Semiconductor Tech Co Ltd patent application for Computational Graph Processing Method and Device Under Data Stream Architecture Chip and Electronic Equipment. This invention was developed by Tong Qisheng, Ge Junzheng and Liu Min. ..

Juzheng Tech Jiangsu Co Ltd Seeks Patent for Label Chip Equipped with Iic Interface and Design Method Thereof

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Juzheng Tech Jiangsu Co Ltd has sought patent for Label Chip Equipped with Iic Interface and Design Method Thereof. This invention was developed by Kou Hongxia, Lu Jun and Zeng Hui. The patent application number is CN20251154632 20250730. The patent publication number is CN120560732 (A). International Pate..

Juzheng Tech Jiangsu Co Ltd Submits Chinese Patent Application for Label Chip and Method and Device for Instruction Configuration of Iic Interface Information of Label Chip

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Juzheng Tech Jiangsu Co Ltd has submitted a patent application for Label Chip and Method and Device for Instruction Configuration of Iic Interface Information of Label Chip. This invention was developed by Kou Hongxia, Lu Jun and Zeng Hui. The patent application number is CN20251154226 20250730. The patent..

State Intellectual Property Office of China Receives Nanjing Panda Electronics Co Patent Application for Dynamic Upgrading Method Suitable for Small Memory and Small Storage Embedd..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has received Nanjing Panda Electronics Co patent application for Dynamic Upgrading Method Suitable for Small Memory and Small Storage Embedded Chip Cluster. Xie Jin, Wu Xiaohai, Li Zhiwei, Kuang Lin and Wang Jian developed the invention. The patent application nu..

Suzhou Yuannao Intelligent Technology Applies for Patent on System on Chip, Management Method, Electronic Device, Storage Medium and Program Product

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Suzhou Yuannao Intelligent Technology has applied Chinese patent for System on Chip, Management Method, Electronic Device, Storage Medium and Program Product. Zhang Chuang developed it. The patent application number is CN20251163008 20250731. The patent publication number is CN120561075 (A). International ..

Zhuhai Linglong Yuxin Tech Co Ltd Applies for Patent on Uart-based Multifunctional Interface Circuit, Control Method Thereof and Chip

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Zhuhai Linglong Yuxin Tech Co Ltd has applied Chinese patent for Uart-based Multifunctional Interface Circuit, Control Method Thereof and Chip. Yang Yicong, Su Longjian, Chen Caiyue and Zhu Guozhong developed it. The patent application number is CN202510665934 20250522. The patent publication number is CN1..

Muxi Integrated Circuit (Shanghai) Applies for Patent on Address Translation System Based on Shader Tracking Data

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Muxi Integrated Circuit (Shanghai) has applied Chinese patent for Address Translation System Based on Shader Tracking Data. Wang Dongxing and He Yuyang developed it. The patent application number is CN202510704726 20250529. The patent publication number is CN120560972 (A). International Patent Classificati..

Jiangsu Chuangsite Display Tech Co Ltd Files Chinese Patent Application for Low-power-consumption Display Screen Driving Method and System Based on OLED Technology

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Jiangsu Chuangsite Display Tech Co Ltd has filed a patent application for Low-power-consumption Display Screen Driving Method and System Based on OLED Technology. This invention was developed by Shi Wei. The patent application number is CN202510710106 20250529. The patent publication number is CN120564622 ..

State Intellectual Property Office of China Receives Jiangsu Jiuzhan Material Tech Co Ltd Patent Application for Novel Preparation Method of Phenothiazine and Derivative for Semico..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has received Jiangsu Jiuzhan Material Tech Co Ltd patent application for Novel Preparation Method of Phenothiazine and Derivative for Semiconductor Photoresist. Chen Junchao, Yu Yifei, Zhou Jun, Han Wenming, Zhang Hu and Ji Wenxin developed the invention. The pat..

Samsung Electronics Files Chinese Patent Application for Gate-all-around Field Effect Transistor with In-trench Spacer and Method of Manufacturing Same

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Samsung Electronics has filed a patent application for Gate-all-around Field Effect Transistor with In-trench Spacer and Method of Manufacturing Same. This invention was developed by Baek Rok-hyun and Jung Jin-su. The patent application number is CN202280102938 20221230. The patent publication number is CN..

State Intellectual Property Office of China Receives Fuji Electric Patent Application for Semiconductor Device

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has received Fuji Electric patent application for Semiconductor Device. Matsui Toshiyuki, Naito Tatsuya, Noguchi Seiji, Yamada Takuya, Furukawa Nobuaki, Hamasaki Ryutaro, Ikura Yoshihiro and Shuhei Tatemichi developed the invention. The patent application number ..

Shanxi Chenxian Photoelectric Tech Co Ltd Seeks Patent for COF Chip Binding Point Adhesive Structure

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Shanxi Chenxian Photoelectric Tech Co Ltd has sought patent for COF Chip Binding Point Adhesive Structure. This invention was developed by Wang Xiaofei and Zhou Yufa. The patent application number is CN202510668919 20250523. The patent publication number is CN120571733 (A). International Patent Classificat..

Zhejiang Weiming Semiconductor Co Ltd Submits Chinese Patent Application for UART Baud Rate Adaptive Method

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Zhejiang Weiming Semiconductor Co Ltd has submitted a patent application for UART Baud Rate Adaptive Method. This invention was developed by Zhu Jiawei. The patent application number is CN202510689366 20250527. The patent publication number is CN120567736 (A). International Patent Classification codes are ..

Pro Med Beijing Tech Co Ltd Applies for Patent on Micro-fluidic Chip for Fluid Viscosity Detection and Manufacturing Method Thereof

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Pro Med Beijing Tech Co Ltd has applied Chinese patent for Micro-fluidic Chip for Fluid Viscosity Detection and Manufacturing Method Thereof. Yu Zhanjiang, Xing Xiaoxing, Guan Wei, Ma Fei, Pan Zhihong and Gao Weiwei developed it. The patent application number is CN20251174060 20250801. The patent publicati..

State Intellectual Property Office of China Releases Xindong Microelectronic Tech Wuhan Co Ltd Patent Application for Performance Control Parameter Optimizing Method and Device for..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has released Xindong Microelectronic Tech Wuhan Co Ltd patent application for Performance Control Parameter Optimizing Method and Device for Serdes Chip. This invention was developed by Chen Jingcheng, Ma Zhongjie and Hu Xiaoyu. The patent application number is C..

Zhaoyuan Xinhui New Mat Co Ltd Files Chinese Patent Application for Reaction Kettle for Preparing Silicon Dioxide Catalyst

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Zhaoyuan Xinhui New Mat Co Ltd has filed a patent application for Reaction Kettle for Preparing Silicon Dioxide Catalyst. This invention was developed by Wang Minjun, Xu Guoxin, Wang Xiaomeng and Wang Xiaofei. The patent application number is CN202510700174 20250528. The patent publication number is CN1205..

East China Institute Optoelectronic Integrated Device Submits Chinese Patent Application for Anti-adhesion Bracket for Sintering Double-sided Glass Glaze of LTCC (low Temperature C..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- East China Institute Optoelectronic Integrated Device has submitted a patent application for Anti-adhesion Bracket for Sintering Double-sided Glass Glaze of LTCC (low Temperature Co-fired Ceramic) Substrate and Preparation Method of Anti-adhesion Bracket. This invention was developed by Xue Jun, Song Chul-woo..

State Intellectual Property Office of China Publishes Xi'an Boxin New Material Tech Co Ltd Patent Application for Special Fiber Reinforced Silicon Nitride Aerogel Composite Materia..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has published Xi'an Boxin New Material Tech Co Ltd patent application for Special Fiber Reinforced Silicon Nitride Aerogel Composite Material, Preparation Method and Application. The invention was developed by Zhang Jiaxu, Feng Lei and Yang Peng. The patent appli..

State Intellectual Property Office of China Releases Guangzhou Zhongnuo Microelectronics Patent Application for Communication Verification Method and Device for Consumable Chip, Ch..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has released Guangzhou Zhongnuo Microelectronics patent application for Communication Verification Method and Device for Consumable Chip, Chip, Equipment and Storage Medium. This invention was developed by Lin Wei and Li Qin. The patent application number is CN20..

Huawei Technologies Files Chinese Patent Application for Transmission Network Chip, Network Device and Method for Processing Bit Stream

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Huawei Technologies has filed a patent application for Transmission Network Chip, Network Device and Method for Processing Bit Stream. This invention was developed by Zheng Shuqian, Shao Xulong and Gao Qiao. The patent application number is CN202410235729 20240229. The patent publication number is CN120567..

Xuzhou Huijing Semiconductor Mat Co Ltd Submits Chinese Patent Application for Cleaning Device for Semiconductor Wafer

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Xuzhou Huijing Semiconductor Mat Co Ltd has submitted a patent application for Cleaning Device for Semiconductor Wafer. This invention was developed by Zhang Jingzhai and Zhang Limei. The patent application number is CN202510799567 20250616. The patent publication number is CN120571800 (A). International P..

State Intellectual Property Office of China Publishes Guangdong Jinwan Gaojing Solar Energy Tech Co Ltd and Gaojing Solar Energy Patent Application for Device and Method for Automa..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has published Guangdong Jinwan Gaojing Solar Energy Tech Co Ltd and Gaojing Solar Energy patent application for Device and Method for Automatically Removing Waterproof Monocrystalline Silicon Wafers Based on Visual Inspection. The invention was developed by Xiao Bin..

Youguang Intelligent Semiconductor Technology (Shenzhen) Applies for Patent on Chip Test Sorting Machine and Control Method Thereof

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Youguang Intelligent Semiconductor Technology (Shenzhen) has applied Chinese patent for Chip Test Sorting Machine and Control Method Thereof. Li Jinlong and Wu Houqiang developed it. The patent application number is CN20251117880 20250723. The patent publication number is CN120571769 (A). International Pat..

Beijing Maizhuji Tech Co Ltd Seeks Patent for FPD Test Method for Micro-viewpoint Defect of Monocrystalline Silicon Wafer

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Beijing Maizhuji Tech Co Ltd has sought patent for FPD Test Method for Micro-viewpoint Defect of Monocrystalline Silicon Wafer. This invention was developed by Tao Ying. The patent application number is CN202510801971 20250616. The patent publication number is CN120558988 (A). International Patent Classifi..

Northwest Electronic Equipment Tech Research Institute Second Research Institute Of China Electronic Submits Chinese Patent Application for Multi-axis Synergistic Film Winding and ..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- Northwest Electronic Equipment Tech Research Institute Second Research Institute Of China Electronic has submitted a patent application for Multi-axis Synergistic Film Winding and Unwinding Device for Green Ceramic Chip Film Coating. This invention was developed by Sun Wentao, Li Fan, Wang Ruipeng, Liu Hongyu..

State Intellectual Property Office of China Receives Sichuan Bingji Smart Computing Tech Co Ltd Patent Application for Remote Automatic Conveying System for Circuit Board Electropl..

Semiconductor

| Wed 18 Feb 2026

Beijing, Feb. 18 -- State Intellectual Property Office of China has received Sichuan Bingji Smart Computing Tech Co Ltd patent application for Remote Automatic Conveying System for Circuit Board Electroplating. Wang Xiaodan, Wang Xi and Zhang Wenli developed the invention. The patent application number is CN20251180139 202508..

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