Semiconductor
| Tue 24 Mar 2026
Alexandria, March 25 -- Intel has sought patent for Plasma-based Glass Package Dicing. This invention was developed by Wei Wei, Hu Xiyu, Liu Xiao, Chen Haobo, Shan Bohan, Guo Xiaoying, Duan Gang, Pietambaram Srinivas, Tanaka Hiroki, Feng Hongxia, Sreeramagiri Praveen, Prather Christy, Jones Jesse, Arana Leonel and Manepalli Rahu..