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Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Northwestern Polytechnical University and Xi'an Xice Testing Tech Co Ltd have applied Chinese patent for Microwave Assembly Hydrogen Effect Reliability Evaluation Method. Su Yutai, Zhou Zhenrui and Li Zexin developed it.
The patent application number is CN202510595590 20250509. The patent publication number..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Shenzhen Puolop Electronics Co Ltd has submitted a patent application for Sgt MOSFET Device Structure. This invention was developed by Fang Shaoming, Zeng Wei, Zhan Yilin and Bo Chunyu.
The patent application number is CN20251088171 20250120. The patent publication number is CN120111938 (A). International P..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has released Wuxi Botong Microelectronics Tech Co Ltd patent application for High-speed Longitudinal GaN Switching Device and Preparation Method Thereof. This invention was developed by Feng Kaiyong, Wang Gang and Yang Guang.
The patent application number is CN202..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Wuxi Botong Microelectronics Tech Co Ltd has applied Chinese patent for Composite Gate Longitudinal GaN Switching Device and Preparation Method Thereof. Feng Kaiyong, Wang Gang and Yang Guang developed it.
The patent application number is CN202510154220 20250212. The patent publication number is CN120111928..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has released Hyper Electronics Co Ltd Of Cayman Islands patent application for Semiconductor Structure of High Electron Mobility Transistor. This invention was developed by Yang Weichen and He Weizhi.
The patent application number is CN202311646289 20231201. The p..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has published Hyper Electronics Co Ltd Of Cayman Islands patent application for High Electron Mobility Transistor. The invention was developed by Yang Weichen and He Weizhi.
The patent application number is CN202311643882 20231201. The patent publication number is..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has released Shanghai Aiji Semiconductor Co Ltd patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Cheng Weitao and Yao Yang.
The patent application number is CN202510276176 20250310. The patent publicatio..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Shenzhen Yuntong Microelectronics Tech Co Ltd and Chongqing Yuntong Technology have filed a patent application for Groove Type IGBT Device and Manufacturing Method Thereof. This invention was developed by Zhang Wei, Tian Tian, Liu Jiping and Liao Guangchao.
The patent application number is CN202510562738 20..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Xidian University and Shaanxi Junpu Xinhang Tech Co Ltd have applied Chinese patent for High-voltage-resistance and Low-leakage GaN Sbd Based on Regrowth P-GaN. Song Xiufeng, Yu Hengyi, Zhao Shenglei, Sun Xuejing, Wang Zhongxu, Zhang Ga, Zhang Jincheng and Hao Yue developed it.
The patent application number..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Hubei Xingchen Tech Co Ltd has sought patent for Semiconductor Structure and Forming Method Thereof. This invention was developed by Yang Daohong, Wang Yiqun, Hu Chencheng, Liu Shujuan and Hu Wenchao.
The patent application number is CN202510577734 20250506. The patent publication number is CN120111899 (A)...
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Sichuan Kiloway Tech Co Ltd has submitted a patent application for High Density Otp Memory. This invention was developed by Mao Junhua, Peng Zezhong, Lei Ming, Tao Chuandong and Wang Kun.
The patent application number is CN202510135161 20250207. The patent publication number is CN120111885 (A). Internationa..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Changxin Xinqiao Storage Tech Co Ltd has submitted a patent application for Manufacturing Method of Memory. Lu Kun and Zhao Panfa developed the invention.
The patent application number is CN202510595161 20250509. The patent publication number is CN120111884 (A). International Patent Classification code is H..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Hefei Shengtao Semiconductor Tech Co Ltd has received a patent for Transportation Device Convenient to Fix. This invention was developed by Zhao Xing and Li Tongchun.
The patent application number is CN202421843291U 20240801. The patent publication number is CN223384499 (U). International Patent Classificat..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Wuhan Xinchuangyuan Semiconductor Co Ltd has sought patent for IC Carrier Plate and Manufacturing Method Thereof. This invention was developed by Xiao Di, Zhao Chao, Cong Peibo and Zhou Lemin.
The patent application number is CN202510265575 20250307. The patent publication number is CN120111782 (A). Interna..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has released Zhengzhou Zhongke Integrated Circuit And System Application Res Institute patent application for Multi-channel RTSP Video Playing Method Based on Embedded Linux. This invention was developed by Miao Yuhui, Song Aolong, Zhang Jie, Zhu Mingji, Li Zhenfeng,..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has received Asionwise Semiconductor Co Ltd patent application for Code Rate Adjustment Method and Device, Equipment and Storage Medium. Zhai Kang developed the invention.
The patent application number is CN202510256229 20250305. The patent publication number is C..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Shenzhen Xiaoying Vision Intelligent Co Ltd has submitted a patent application for Low-power-consumption AOV Data Acquisition and Transmission System. This invention was developed by Yang Liu, Peng Dongbai, Li Junjie, Wang Sen and Li Hongwen.
The patent application number is CN202510588776 20250508. The pat..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Zhongshan Zhiniu Electronic Co Ltd has filed a patent application for Image Scaling Method and System Based on bicubic Interpolation. This invention was developed by Liu Qiuyi, Liao Zhixiong, Ding Guangbo, Yang Guichuan, Guo Xiaochuan, Liu Zhi, Lin Mingjie, Huang Lijuan, Pan Jiangtao, Liang Zhiqin, Qu Yadong a..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Hengshui Chenggang Renewable Resources Co Ltd has been granted a patent for Efficient Purification Device for Recycled Polyester Bottle Chips. Guo Chenggang, Chen Jigen and Peng Zhenbu developed the invention.
The patent application number is CN202421617384U 20240710. The patent publication number is CN2233..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Genqi Nantong Artificial Intelligence Tech Co Ltd has secured a patent on Semiconductor Processing Equipment. Chen Wenchao and Yu Bailin developed the invention.
The patent application number is CN202422766406U 20241113. The patent publication number is CN223383714 (U). International Patent Classification c..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Tongling Huizhi Electromechanical Co Ltd has been awarded a patent for Three-terminal Voltage-stabilizing IC (integrated Circuit) Trimming and Forming Device. This invention was developed by Xie Jun, Huang Hanyong, Liu Zuci, Bai Jiafa and Cui Mingyue.
The patent application number is CN202422178399U 2024090..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has received Jiangsu Yuntu Semiconductor Co Ltd patent application for Adaptive Wheel Speed Decoding Method and System Based on Ak Protocol. Zhang Xuwen and Zhou Jian developed the invention.
The patent application number is CN202510594058 20250509. The patent pub..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- China Electric Power Research Institute and State Grid Corporation of China have applied Chinese patent for High-synchronism Control Protection Device and Method for Valve-based Controller of Distributed IGBT (insulated Gate Bipolar Translator) Series Valve. Gu Weiming, Wang Xiang, Dai Fengjiao, Chen Guofu, Mu..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Chinese Patent for Positioning Device for Diode Lead Welding has been issued to Jining Yanzhou Yizhen Electron Co Ltd. This invention was developed by Kim Hak-sung and Li Jun.
The patent application number is CN202422781539U 20241115. The patent publication number is CN223382729 (U). International Patent Cl..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has published Mianyang Xinhua IC Engine Co Ltd patent application for High-safety Brake-by-wire Motor. The invention was developed by Yu Qing, Loh Bill, Lin Lin, Xu Qiang and Quan Liang.
The patent application number is CN202510592798 20250509. The patent publicat..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has received Tianshui Normal University and Wuhan Taiyue Semiconductor Co Ltd patent application for Drive Device. Ma Baohui, Xu Aili, Lu Junxiang, Shang Qinghua, Fan Fuhua, Lu Yuhan, Yang Peinian, Chen Wen and Lyu Panpan developed the invention.
The patent applic..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Ding Xin and Shanghai Aiyan Semiconductor Co Ltd have submitted a patent application for Wafer Conveying System. This invention was developed by Ding Xin.
The patent application number is CN202510252665 20250304. The patent publication number is CN120109072 (A). International Patent Classification codes are..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has received Shenzhen Robotvision Tech Co Ltd patent application for Wafer Adjusting Device. Mei Shuang, Bie Wei, Hua Kai, Wang Xiangtong and Hu Yanchao developed the invention.
The patent application number is CN202510557179 20250429. The patent publication numbe..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Chuanlin Electronic Tech Guangdong Co Ltd has applied Chinese patent for Wafer Mounting Rack. Dong Xiangtao and Wang Genyou developed it.
The patent application number is CN202510288305 20250312. The patent publication number is CN120109064 (A). International Patent Classification code is H01L21/673. Cooper..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Zhejiang Huachen Xinguang Tech Co Ltd has sought patent for Wafer Placing Disc for Plasma Degumming Machine. This invention was developed by Yan Shuaishuai, Yu Xiaoming and Leng Xiang.
The patent application number is CN202510131773 20250206. The patent publication number is CN120109061 (A). International P..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has published Hefei Shengda Electronics Tech Industry Co Ltd patent application for Gold Paste for High-temperature NTC (negative Temperature Coefficient) Thermistor as Well as Preparation Method and Application Thereof. The invention was developed by Sun Xiaoyu, Zha..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Ruitianxin Pte Ltd has submitted a patent application for Offset Calibration Method and Apparatus for High Bandwidth Memory 3. Zhao Zijian, Hwang Hong-jin, Chen Daxing and Zheng Zhixue developed the invention.
The patent application number is CN202410329118 20240321. The patent publication number is CN12010..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has received Fudan University and Shen Taoran patent application for Silicon-based High-density Dual-port Read-write Separation Static Memory Technology. Xue Xiaoyong, Zhao Chenyang, Shen Taoran, Fang Jinbei and Jiang Jingwen developed the invention.
The patent ap..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Hefei Xincun Semiconductor Co Ltd has submitted a patent application for Activation Circuit and Storage Device. This invention was developed by Li Ruitian and Zhu Zhen.
The patent application number is CN20251032072 20250108. The patent publication number is CN120108455 (A). International Patent Classificat..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has received Beijing Tonggan Tech Co Ltd patent application for Memory Scene Reproduction and Interaction Method. Cao Min and Wang Zeyu developed the invention.
The patent application number is CN202510209930 20250225. The patent publication number is CN120107529 ..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Shenzhen Ruikai Hongchen Tech Co Ltd has submitted a patent application for Design Method and System of System-on-chip. This invention was developed by Ye Kejun.
The patent application number is CN20251032865 20250109. The patent publication number is CN120105998 (A). International Patent Classification cod..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has received Nanjing Nari Semiconductor Co Ltd patent application for Semiconductor Chopper Device. Wang Rui, Zhang Dahua, Dong Zhiyi, Huang Quanquan and Liu Xuguang developed the invention.
The patent application number is CN20251098817 20250122. The patent publi..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Yixin Micro Semiconductor Tech Shenzhen Co Ltd has filed a patent application for Self-destruction Method and Device Applied to Storage Device and Storage Device. This invention was developed by Zhou Yongqiang, Wang Jiaqing, Luo Wangbao, Zhang Renfu and Liu Boyang.
The patent application number is CN2025101..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Center has submitted a patent application for Pulse Width Modulation Control System, Chip, Method and Device. This invention was developed by Yu Zhe.
The patent application number is CN202510209730 20250225. The patent publication numbe..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Beijing Smartchip Microelectronics Technology has filed a patent application for Amplifier, Chip and Method for Adjusting Error of Amplifier. This invention was developed by Su Meng, Tian Di, Hou Jiali, Hu Yi, Shen Hongwei, Li Zhenguo and Wang Yabin.
The patent application number is CN202510124468 20250126. T..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Texas Instruments has submitted a patent application for Methods, Apparatus, and Articles of Manufacture for Transmitting Multiple Signals Through Isolated Channels. This invention was developed by Soe Sooping, Calabrese Giovanni and Greenberg Craig B.
The patent application number is CN202411700432 2024112..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Murata Manufacturing has submitted a patent application for High-frequency Module. Sakita Satoshi, Takahashi Wataru, Takezono Naofumi and Ikegami Katsuya developed the invention.
The patent application number is CN202411701888 20241126. The patent publication number is CN120110407 (A). International Patent ..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Hefei Chipsea Electronic Tech Co Ltd has submitted a patent application for Signal Processing Circuit, Chip and Electronic Equipment. This invention was developed by Luo Xiang, Yang Baoding and Ye Xuefeng.
The patent application number is CN202510191442 20250220. The patent publication number is CN120110395..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has released Chipsea Technology Shenzhen patent application for Signal Processing Circuit, Chip and Electronic Equipment. This invention was developed by Liu Yuke, Liu Weihui, Sun Yiyun and Chen Min.
The patent application number is CN202510191441 20250220. The pate..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has released Jiuyou Xi'an Microelectronics Co Ltd patent application for Power-controllable Switch Hall Chip and Power Control Method. This invention was developed by Sima Jianbo.
The patent application number is CN202510226430 20250227. The patent publication num..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Hangzhou Suriot Tech Co Ltd has sought patent for Single-phase Asynchronous Motor Starting Control Circuit Based on MCU and Double Silicon Controlled Rectifiers. This invention was developed by Chen Qiuhuang, Liu Yong, Wen Qianling and Zheng Lei.
The patent application number is CN202510593007 20250509. The..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- BOE Technology Group and Beijing BOE Technology Development have filed a patent application for Display Substrate and Display Device. This invention was developed by Zhang Xing, Xu Pan, Han Ying, Lyu Guangshuang, Zhao Donghui, Zhou Dandan, Zhang Dacheng and Chen Yi.
The patent application number is CN202380..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have filed a patent application for Display Substrate and Display Device. This invention was developed by Dong Xiangdan, Fan Cong, Zhang Wei, Du Mengmeng, Yan Jun, Huang Yao, Wang Qiwei, Qiu Haijun, Hu Ming, Jiang Zhiliang, Xie Taofeng, Zhao Yongl..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- BOE Technology Group and Beijing BOE Technology Development have submitted a patent application for Light-emitting Assembly and Preparation Method Thereof, Light-emitting Chip and Display Substrate. Niu Yanan, Sun Shuang, Niu Jing, Wang Wei, Qin Bin, Ren Jinyu and Tian Hongwei developed the invention.
The p..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have applied Chinese patent for Display Substrate and Display Device. Li Yujing, Song Jiang, Aomi Tsuyoshi, Bai Lu, Zhang Daiying, Wen Weishu, Dai Junxiu, Zhao Guowei, Huang Yan and Cui Hongda developed it.
The patent application number is CN20..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- BOE Technology Group, Chengdu BOE Optoelectronics Technology and Beijing BOE Technology Development have submitted a patent application for Display Substrate and Display Device. This invention was developed by Cai Wenzhe, Liu Jia, Wang Rong, Huang Yao, Wang Qiwei and Dong Xiangdan.
The patent application nu..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have submitted a patent application for Array Substrate and Display Device. This invention was developed by Zhang Tiaomei, Gao Wenhui, Jiang Zhiliang, Wu Jianpeng and Hu Ming.
The patent application number is CN20238010883 20230926. The patent ..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Beijing Institute Of Tech Yangtze River Delta Research Institute Jiaxing and Beijing Institute of Technology have submitted a patent application for Fine-adjustable Reference Unit Circuit of MRAM (magnetic Random Access Memory) Chip. Huang Haiteng, Ye Shujun, Wang Ya and Zhao Jinlu developed the invention.
..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- China Mobile Chengdu Information Communication Tech Co Ltd and China Mobile Communications have applied Chinese patent for API Risk Assessment Method and Device, Electronic Equipment, Chip and Storage Medium. Zheng Haiyan, Liu Jia, Zhu Lei, Liu Xiaobin and Liang Naiwen developed it.
The patent application n..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- BOE Technology Group, Chengdu BOE Optoelectronics Technology and Beijing BOE Technology Development have submitted a patent application for Array Substrate and Display Device. This invention was developed by Zhang Tiaomei, Chen Wenbo, Yu Ziyang, Huang Yao, Jiang Zhiliang, Hu Ming and Dong Xiangdan.
The pate..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- BOE Technology Group, Beijing BOE Display Tech Co and Beijing BOE Technology Development have submitted a patent application for Pixel Circuit, Driving Method, Display Substrate and Display Device. This invention was developed by Cong Ning, Xuan Minghua, Zhang Can, Wang Can, Niu Jinfei and Yan Jiakui.
The p..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Verisilicon Microelectronics Shanghai Co Ltd, Verisilicon Microelectronics Hainan Co Ltd, Verisilicon Tech Shanghai Co Ltd, Verisilicon Microelectronics Nanjing Co Ltd and Verisilicon Microelectronics Chengdu Co Ltd have submitted a patent application for Request Merging Method, Unit and Chip. This invention w..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- BOE Technology Group and Beijing BOE Optoelectronics Technology have sought patent for Array Substrate, Display Device and Manufacturing Method of Array Substrate. This invention was developed by Chih-chao Yang, Zhang Yong, Nie Lingfang, Deng Qi, Guo Zanwu, Wang Desheng, Zhang Qiuyang and Ding Ying.
The pat..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- BOE Technology Group and Wuhan BOE Photoelectric Technology Co Ltd have submitted a patent application for Display Substrate and Display Device. This invention was developed by Yuan Dongxu, Jiang Peng, Mao Dalong, Li Yun, Wang Zihao, Mo Zhiheng, Li Geng, Mao Caixia, Wan Zhong, Zhao Xinxin, Chen Chuang, Huang X..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Huaneng Clean Energy Res Institute and Huaneng Group Technology Innovation Center have applied Chinese patent for Flexible Perovskite Solar Cell Manufacturing System. Xiao Ping, Cai Zihe, Zhao Zhiguo, Wang Lijun, Zhao Dongming and Zhao Zhengjing developed it.
The patent application number is CN202311658961 ..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have sought patent for Display Substrate and Display Device. This invention was developed by Qi Puyu.
The patent application number is CN202510515233 20250423. The patent publication number is CN120112115 (A). International Patent Classificatio..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have submitted a patent application for Display Substrate and Display Device. Wang Benlian, Wang Hongli, Zhang Wei, Huang Weiyun, Hu Ming, Ko Young-ik and Qiu Haijun developed the invention.
The patent application number is CN202510318641 20210..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Hebei University and Baoding Deyou Electrical Equipment Mfg Co Ltd have applied Chinese patent for Method for Preparing Gradient Absorption Layer and Solar Cell Using Gradient Absorption Layer. Wang Xinzhan, Gao Zeran, Ma Delong, Xiong Yuchen, Lu Wanbing, Gao Chao, Teng Xiaoyun and Yu Wei developed it.
The ..
Semiconductor
| Fri 02 Jan 2026
Beijing, Jan. 3 -- Xidian University and Guangzhou Research Institute Of Xidian Univ have submitted a patent application for Gallium Oxide Cascode Field Effect Transistor Based on Enhanced Silicon MOS (metal Oxide Semiconductor) Heterogeneous Integration and Preparation Method of Gallium Oxide Cascode Field Effect Transistor. Th..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has awarded a patent to Jiangsu Jinyou Electronic Tech Co Ltd for Fingerprint Chip Cutting Device. Yang Xuechun and Ding Cuiping developed the invention.
The patent application number is CN202422388976U 20240928. The patent publication number is CN223382784 (U). I..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Hongmao Tech Co Ltd has been granted a patent for Device for Performing Laser Etching on Flaky Wafer to Form Taiko Structure. This invention was developed by Xie Chengjing.
The patent application number is CN202422516796U 20241017. The patent publication number is CN223382778 (U). International Patent Class..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Selenium Microelectronics Hangzhou Co Ltd has submitted a patent application for High-power Flyback Power Supply Chip and Controller. Xu Qiang, Dong Haoqi and Xu Chen developed the invention.
The patent application number is CN202510298889 20250313. The patent publication number is CN120110138 (A). Internat..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Chinese Patent for Laser Marking Equipment with Dustproof Function has been issued to Liance Youte Semiconductor Dongguan. This invention was developed by Lenz, Peng Xianglong, Feng Yilian and Sun Guoyao.
The patent application number is CN202422498123U 20241016. The patent publication number is CN223382764..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Beijing Cec Huada Elect Design has submitted a patent application for Light Detection Circuit, Chip and Light Detection Method. This invention was developed by Yu Huihong, Liu Minglei and Chen Yongqiang.
The patent application number is CN202510168823 20250214. The patent publication number is CN120105495 (..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has received Anhui Zhongke Rongxinchuang Tech Co Ltd patent application for Encryption Docking Station Device Based on Security Chip. Xu Dantian, Qi Naibao, Yuan Jing and Wang Tiangong developed the invention.
The patent application number is CN202411981951 202412..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has released Hainan Power Supply Company Of State Grid Qinghai Electric Power Company and State Grid Qinghai Electric Power patent application for Information Judgment Method in Metal Object Oxidation Process in Electroplating Process. This invention was developed by..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Shanghai Sanfei Semiconductor Co Ltd has sought patent for Preparation Method of Ridge Waveguide Simulation Laser with Low Threshold Current. This invention was developed by Yang Jun.
The patent application number is CN202510570996 20250506. The patent publication number is CN120109649 (A). International Pa..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Anhui Geen Semiconductor has filed a patent application for III-V Group Semiconductor Green Laser Chip Element. This invention was developed by Zheng Jinjian, Zhong Zhibai, Yang Lixun, Liu Zihan, Chen Wanjun, Cai Xin, Cao Jun, Li Xiaoqin, Lan Jiabin, Xun Feilin, Deng Heqing, Zhang Jiangyong and Li Shuiqing.
..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- China Jiliang University has filed a patent application for Method for Adjusting Current Tuning Sensitivity of Dfb Semiconductor Laser. This invention was developed by Chen Liang, He Qicheng, Meng Fei, Wang Guishi, Lv Quanchao, Xu Rui, Yang Kai, Huang Shuai, Zhang Peng, Zhang Xiong, Li Fanghao and Shen Yang.
..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Lumentum Operations has filed a patent application for Semiconductor Laser. This invention was developed by Nakamura Atsushi.
The patent application number is CN202411520616 20241029. The patent publication number is CN120109645 (A). International Patent Classification code is H01S5/12. Cooperative Patent C..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Harbin Engineering University has applied Chinese patent for Nano-imprinting-based Micro-nano Array Resonant Cavity Nano Laser Chip Preparation Method. Wang Wenxin, Wang Yi, Gao Yuhao, Zheng Yan, Ding Tianyu and Xu Yifan developed it.
The patent application number is CN202510237967 20250303. The patent public..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Anhui Geen Semiconductor has submitted a patent application for Epitaxial Structure of Compound Semiconductor Laser. Kan Hongzhu, Zheng Jinjian, Yang Lixun, Zhong Zhibai, Deng Heqing, Xun Feilin, Liu Zihan, Hu Zhiyong, Cai Xin, Chen Wanjun, Lan Jiabin, Li Xiaoqin, Zhang Jiangyong and Li Shuiqing developed the ..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Unimicron Technology has sought patent for Electronic Packaging Structure. This invention was developed by Wang Jinsheng, Tan Ruimin, Zhan Zhikai and Jian Junxian.
The patent application number is CN202411584921 20241107. The patent publication number is CN120109487 (A). International Patent Classification co..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has released HannStar Display patent application for Micro Light Emitting Diode Display Device and Manufacturing Method Thereof. This invention was developed by Zhang Hongming, Chu Chun-yi, Huang Chengpei, Zeng Junqin and Jiao Youqi.
The patent application number is..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has published Shanghai Jita Semiconductor patent application for Semiconductor Test Structure and Semiconductor Test Method. The invention was developed by Wang Shuai, Liao Liming and Qiu Feng.
The patent application number is CN202510253562 20250304. The patent pub..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has published ChangXin Technology Group patent application for Semiconductor Structure and Preparation Method Thereof. The invention was developed by Liu Ying.
The patent application number is CN202311693554 20231206. The patent publication number is CN120109125 (..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Yangtze Memory Technologies has sought patent for Semiconductor Structure, Manufacturing Method Thereof and Memory System. This invention was developed by Han Chengqian, Liu Wu and Sun Mingchen.
The patent application number is CN202311668198 20231205. The patent publication number is CN120109114 (A). Inter..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has released ChipMOS Technologies patent application for Bump Structure of Chip. This invention was developed by Zhong Guangxiang.
The patent application number is CN202410245689 20240305. The patent publication number is CN120109112 (A). International Patent Classi..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Avago Technologies General IP has applied Chinese patent for Structure and Method for Providing Connections Across Channels. Theil Juergen developed it.
The patent application number is CN202411758143 20241203. The patent publication number is CN120109109 (A). International Patent Classification codes are H..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has received Taizhou Aisaikang Electronics Co Ltd patent application for Planar Liquid Cooling Chip. Wu Zuojin developed the invention.
The patent application number is CN202510283211 20250311. The patent publication number is CN120109106 (A). International Patent..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Huawei Technologies has filed a patent application for Multi-layer Chip Stacking Packaging Structure, Preparation Method Thereof and Electronic Equipment. This invention was developed by Wang Rui, Dai Xiangyu, Yao Mingjun and Zhang Le.
The patent application number is CN202311665382 20231205. The patent publi..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Hefei Nexchip Integrated Circuit has sought patent for Preparation Method of Conductive Plug, Preparation Method of Semiconductor Device and Semiconductor Device. This invention was developed by Zhu Hailong.
The patent application number is CN202510603669 20250512. The patent publication number is CN120109089..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Chengdu Ziguang Semiconductor Tech Co Ltd has applied Chinese patent for Method for Manufacturing Interlayer of Semiconductor Device and Semiconductor Device. Wu Huangyi developed it.
The patent application number is CN202311675549 20231206. The patent publication number is CN120109085 (A). International Pa..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Shandong Zhongcheng Packaging Tech Co Ltd has filed a patent application for Cleaning Barrel for Chip and Assembling Method of Cleaning Barrel. This invention was developed by Gong Yanhui and Cheng Youliang.
The patent application number is CN202510602253 20250512. The patent publication number is CN1201090..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Semiconductor Process Equipment and Clamping Device Thereof. Xu Lu, Zhang Yutao and Zhao Hongyu developed the invention.
The patent application number is CN202510307993 20250314. The patent publication number is CN120109078 (A)...
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Research Micro Jiangsu Semiconductor Tech Co Ltd has sought patent for Split Type Pedestal for Supporting Substrate and Method for Transferring Substrate. This invention was developed by Yan Huaiyu and Wang Fei.
The patent application number is CN202311653182 20231204. The patent publication number is CN120..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Beijing NAURA Microelectronics Equipment has filed a patent application for Bearing Device, Semiconductor Process Equipment and Preparation Method of Bearing Device. This invention was developed by Tian Xiqiang, Ye Hua, Wang Dan and Bian Guodong.
The patent application number is CN202510252219 20250304. The p..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has released Advanced Micro-Fabrication Equipmen patent application for Electrostatic Chuck, Lower Electrode Assembly and Plasma Processing Device. This invention was developed by Tang Guanyang and Zuo Taotao.
The patent application number is CN202311661980 20231205..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Jingxin Semiconductor Huangshi Co Ltd has applied Chinese patent for Carrying Box and Wafer Carrying System and Method. Zhang Guangfa, Yu Wenbo, Luo Wei, Liu Xiao and Chen Shuang developed it.
The patent application number is CN202510182468 20250219. The patent publication number is CN120109066 (A). Interna..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- State Intellectual Property Office of China has published Shenzhen Yunzaishang Semiconductor Mat Co Ltd and Hunan Xiangxin New Mat Co Ltd patent application for Solution Silicon Carbide Wafer Cleaning Device and Method Thereof. The invention was developed by Zhang Guihua, Liu Chang, Liu Jinhao and Yi Xiaonian...
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Xuzhou Lingce Semiconductor Tech Co Ltd has submitted a patent application for Integrated Circuit Chip Packaging Processing Equipment. This invention was developed by Wu Longjun, Qin Lihui and Bao Bingguo.
The patent application number is CN202510273914 20250310. The patent publication number is CN120109054..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Anhui Jixin Microelectronics Tech Co Ltd has submitted a patent application for High-speed High-precision Chip Trimming Forming and Processing All-in-one Machine. This invention was developed by Gu Mengtian, Zhang Chi and Chen Hao.
The patent application number is CN202510263265 20250306. The patent publica..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Suzhou Taichuang Electronic Co Ltd has submitted a patent application for Wafer Cleaning Equipment and Method for Semiconductor Processing. This invention was developed by Zheng Liang.
The patent application number is CN202510260738 20250306. The patent publication number is CN120109051 (A). International P..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Jinan Kaitai Electronic Tech Co Ltd has applied Chinese patent for Silicon Wafer Cleaning Device Based on Polishing. Jing-ling Chuanhui, Li Chunmei, Li Kaikai, Li Mingxue and Zhang Yue developed it.
The patent application number is CN202510258186 20250306. The patent publication number is CN120109050 (A). I..
Semiconductor
| Sat 03 Jan 2026
Beijing, Jan. 3 -- Huaian Tuobang New Energy Co Ltd has filed a patent application for High-boiling-point Silicon Wafer Texturing Additive Spraying Device. This invention was developed by Zhang Manjiang and Shi Yanzhong.
The patent application number is CN202510251493 20250304. The patent publication number is CN120109049 (A)..
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