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Semiconductor
| Mon 08 Jun 2026
Taipei, June 8 -- Global Unichip Corp and Taiwan Semiconductor Manufacturing have sought patent for Testing Circuit. This invention was developed by Wan Yu-lun, Liu Bor-yueh, Kao Chen-yuan and Chen Ting-yu.
The patent application number is TW20240101489 20240115. The patent publication number is TW202522017 (A). International..
Semiconductor
| Mon 08 Jun 2026
Taipei, June 8 -- Taiwan Semiconductor Mfg Co Ltd and National Tsing Hua University have sought patent for Detection Device and Method for Operating the Same. This invention was developed by King Ya-chin, Lin Chrong-jung, Lin Burn-jeng, Huang Ting-kai and Chang Wei.
The patent application number is TW20240120111 20240530. The..
Semiconductor
| Mon 08 Jun 2026
Taipei, June 8 -- Xian Eswin Material Technology Co Ltd and Xi'an Xinsemi Material Technology Co Ltd have filed a patent application for Monocrystalline Silicon and Silicon Wafer with Controllable Oxygen Content, and Monocrystalline Silicon Growth Method and System. This invention was developed by Pan Hao.
The patent applicat..
Semiconductor
| Mon 08 Jun 2026
Taipei, June 8 -- ASML Netherlands BV and Max Planck Gesellschaft have submitted a patent application for Manufacturing a Hollow Core Photonic Crystal Fiber. This invention was developed by Lagler Josef, Staab Gordon and Bergler Michael Sebastian.
The patent application number is TW20240127628 20240724. The patent publication..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Xi'an ESWIN Material Technology and Xi'an Eswin Silicon Wafer Technology have submitted a patent application for Epitaxial Wafer Edge Morphology Compensation Type Wafer Double-sided Polishing Device and Method. This invention was developed by Wang Junfu.
The patent application number is CN202511770029 20251..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have applied Chinese patent for Display Substrate and Display Device. Liu Biao, Zhang Yi, Xu Peng, Zheng Hai and Ma Hongwei developed it.
The patent application number is CN20248000138 20240129. The patent publication number is CN121533176 (A)...
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Tokyo Electron and Hacaras Holding AG have submitted a patent application for Information Processing Method, Computer Program, and Information Processing Device. This invention was developed by Inoue Hisashi, Matsumoto Shunichi, Kobayashi Masahiro, Masui Takaharu and Uchino Hirotoshi.
The patent application..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Wuhan University and Nantong Haimen Kechuang Invest Group Co Ltd have applied Chinese patent for Digital Integrated Circuit Rear-end Layout Data Set Construction Method Based on Parameter Regulation and Control. Chai Zhuomin, Shi Langhua, Zhao Shujing and Liu Wei developed it.
The patent application number ..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Shenyang Ruijing Precision Tech Co Ltd and Konfoong Material International have submitted a patent application for Method for Processing Semiconductor Sheet Products. Yao Lijun, Zhou Ji, Zhang Tongbin, Dong Zhiqing, Ran Qilin and Bian Tao developed the invention.
The patent application number is CN202511740..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Zhejiang Xuantian Intelligent Tech Co Ltd, Shanghai Xuantian Intelligent Technology and Shanghai Zhishen Information Tech Co Ltd have submitted a patent application for High-speed Automatic Wafer Feeding Mechanism and Feeding Method of Kgd Test Equipment. Chen Yuanming, Sun Xiaoyin, Zhao Guanlei, Qian Kaijian..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have filed a patent application for Display Substrate and Display Device. This invention was developed by Huang Yao and Xiao Xingliang.
The patent application number is CN202511574001 20220930. The patent publication number is CN121548199 (A). ..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Nanjing University and Renshuo Solar Suzhou Co Ltd have submitted a patent application for Perovskite Solar Cell with Internal Interface Modification Layer, Photovoltaic Module and Preparation Method Thereof. Tan Hairen, Huang Shun, Li Manya and Liu Ye developed the invention.
The patent application number ..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- CETC Blue Sky Technology and Tianjin Hengdian Space Power Source Co Ltd have submitted a patent application for Method for Simultaneously Obtaining Rigid Solar Cell and Flexible Solar Cell by Adopting One-time Epitaxial Process. Li Xiaodong, Tie Jianrui, Sun Xipeng, Guo Zhisheng, Cheng Baoyi, Xu Jun, Li Xun an..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Yangzhou Artes Solar Battery Co Ltd and Suzhou CSI Solar Power Technology have submitted a patent application for Preparation Method of Solar Cell and Solar Cell. This invention was developed by Wang Yulin.
The patent application number is CN202411111874 20240813. The patent publication number is CN12154812..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- State Grid Hebei Electric Power Supply Co Ltd Hengshui Power Supply Branch, State Grid Hebei Electric Power Supply Co Ltd and State Grid Corporation of China have applied Chinese patent for Power Distribution Network Fault Self-recovery Method and System Based on Silicon Carbide Electric Energy Router. Zhao Ji..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Suzhou Everbright Photonics Tech Co Ltd and Suzhou Everbright Semiconductor Laser Innovation Res Institute Co Ltd have submitted a patent application for Semiconductor Light-emitting Structure of Integrated Grating and Preparation Method of Semiconductor Light-emitting Structure. This invention was developed b..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Wuhan Jiana Energy Tech Co Ltd and Shenzhen Jiana Energy Technology have submitted a patent application for Negative Electrode Substrate of Sodium Metal Battery as Well as Preparation Method and Application of Negative Electrode Substrate. This invention was developed by Cao Yuliang, Chung Jin-wook, Xia Miaomi..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- BOE Technology Group Co Ltd, BOE Mled Technology Co Ltd and Beijing Boe Technology Development Co Ltd have filed a patent application for Wiring Substrate and Manufacturing Method Therefor, Backplane, and Display Apparatus. This invention was developed by Zhai Ming, Liu Chao, Wang Li-li, Feng Shan-shan, Zhao Ji..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Optorun Taiwan Co Ltd and Optorun Co Ltd have submitted a patent application for Substrate Clamping Structure and Substrate Positioning Method. This invention was developed by Chang Yung-lin, Lin Wen-han and Lo Chi-hsuan.
The patent application number is TW20230144864 20231121. The patent publication number ..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Taiwan Semiconductor Mfg Co Ltd and TSMC Nanjing have submitted a patent application for Write Assist Circuit for Memory Array, Memory Device, and Operating Method Thereof. This invention was developed by Liu Jun-cheng, Zhu Zhi-min, Huang Chien-yu, Lee Cheng-hung and Liao Hung-jen.
The patent application num..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Information and Communication Branch Of State Grid Henan Electric Power Company and State Grid Henan Electric Power Co have submitted a patent application for ISP (internet Service Provider) and NPU (network Processing Unit)-based Intelligent Visual Chip Fusion Architecture and Construction Method. This invent..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Inpria Corp and Tokyo Electron have sought patent for Method for Developing Radiation Exposed Organometallic Patterning Layer, and Method for Improving Processing of Radiation Patternable Organo Tin-based Coating. This invention was developed by Telecky Alan J, Shepper Peter De, Meyers Stephen T, Stowers Jason ..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Anhui Kameng Tech Co Ltd has submitted a patent application for Chip Implanting and Packaging Process for Hand Handling. Wang Liangfu, Dong Haiwei and Fu Nian developed the invention.
The patent application number is CN202511375656 20250925. The patent publication number is CN121548333 (A). International Pa..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Beijing Ziyixin Integrated Circuit Co Ltd has submitted a patent application for Stop Strip Structure for Forming Cavity of Ultrasonic Transceiver and Packaging Method. Yang Weiyuan and Huang Zhangbin developed the invention.
The patent application number is CN202511667814 20251114. The patent publication n..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Hangzhou Jingshi Semiconductor Protection Tech Co Ltd has submitted a patent application for Protective Box Body Capable of Being Rapidly Maintained. Lai Yixi, Hua Qing, Guo Shuyi and Li Shuailong developed the invention.
The patent application number is CN202511674596 20251114. The patent publication numbe..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Payton Technology Shenzhen Co Ltd has filed a patent application for DRAM (dynamic Random Access Memory) Double-particle Stacked Packaging Structure and Packaging Process. This invention was developed by Zhang Mingyu, Zhang Li and Liu Dichun.
The patent application number is CN202511707345 20251120. The pat..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has published Xiamen Sky Semiconductor Tech Co Ltd patent application for Multi-chip Stacking Fan-out Packaging Structure and Packaging Method Thereof. The invention was developed by Wu Heng and Yu Daquan.
The patent application number is CN202511637383 20251110. ..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has released Xiamen Sky Semiconductor Tech Co Ltd patent application for Multi-chip Fan-out Packaging Structure and Packaging Method Thereof. This invention was developed by Wu Heng and Yu Daquan.
The patent application number is CN202511637401 20251110. The paten..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Xiamen Sky Semiconductor Tech Co Ltd has filed a patent application for Multi-chip Fan-out Packaging Structure and Packaging Method Thereof. This invention was developed by Wu Heng and Yu Daquan.
The patent application number is CN202511637403 20251110. The patent publication number is CN121548318 (A). Inte..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has released Jixin Tuofang Tech Shanghai Co Ltd patent application for Semiconductor Device. This invention was developed by Liu Jingsong.
The patent application number is CN20261055886 20260115. The patent publication number is CN121548050 (A). International Pate..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Shaoxin Labs has submitted a patent application for Method for Regulating and Controlling Retentivity of Ferroelectric Domain Wall Memory Through Device Size. This invention was developed by Zhou Peng, Tan Xiaojun, Chen Dongfang, Huang Xianliang and Shi Meng.
The patent application number is CN202511510835 ..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Shenzhen Shangdingxin Tech Co Ltd has submitted a patent application for RC-IGBT Device and Preparation Method Thereof. This invention was developed by Liu Daoguo and Liu Pengfei.
The patent application number is CN202511851014 20251210. The patent publication number is CN121548061 (A). International Patent..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has published Semiconductor Mfg International Tianjin Co Ltd and Semiconductor Mfg International Shanghai Co Ltd patent application for LDMOS and Forming Method Thereof. The invention was developed by Mi Hongxing.
The patent application number is CN202411112787 20..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Beijing Intellectual Property Operation Man Co Ltd and Institute of Microelectronics, CAS have submitted a patent application for Manufacturing Method of Gate-all-around Transistor. Li Junjie, Yang Chaoran, Xia Longrui, Chen Rui and Li Junfeng developed the invention.
The patent application number is CN2025..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has released Xidian University and Guangzhou Research Institute of Xidian University patent application for Multi-channel GaN HEMT (high Electron Mobility Transistor) Device with Active Region Ion Implantation Structure and Preparation Method. This invention was deve..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Yangzhou Artes Solar Battery Co Ltd has sought patent for Solar Cell. This invention was developed by Chen Haiyan, Wang Chunyan and Deng Weiwei.
The patent application number is CN202511375028 20240829. The patent publication number is CN121548115 (A). International Patent Classification codes are H10F10/14..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Nanjing University and Nanjing Leibang Semiconductor Tech Co Ltd have filed a patent application for Ultrafast Photoconductive Material Structure and Terahertz Photoconductive Device. This invention was developed by Lu Hong, Yao Jinshan, Zhang Weiwei, Liao Junjie, Wang Yunlong and Zhang Li.
The patent appli..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Jiangxi Zhaochi Integration Tech Co Ltd and Jiangxi MTC Semiconductor have applied Chinese patent for Green Micro-led Epitaxial Wafer, Preparation Method Thereof and Micro-led. Zheng Wenjie, Wang Xiaolan, Ao Yingquan, Shu Jun, Gao Hong, Liu Chunyang, Hu Jiahui and Jin Conglong developed it.
The patent appli..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Masson Tech Inc has sought patent for Wafer Transmission Device. This invention was developed by Chen Ruey Teng.
The patent application number is CN202411106961 20240813. The patent publication number is CN121548241 (A). International Patent Classification codes are H10P72/00 and H10P72/30.
An abstract ..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Masson Tech Inc has submitted a patent application for Wafer Transmission Device. This invention was developed by Chen Ruey Teng.
The patent application number is CN202411106963 20240813. The patent publication number is CN121548242 (A). International Patent Classification codes are H10P72/00 and H10P72/30...
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has released Shanghai Xijia Semiconductor Co Ltd patent application for Analog Quantity Monitoring Method and Device, Equipment, Storage Medium and Program Product. This invention was developed by Lu Weifeng, Chen Peng, Wang Hui, Liu Kun and Jiang Jiayi.
The paten..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Wushi Microelectronics Suzhou Co Ltd has filed a patent application for Wafer Warping Correction Device. This invention was developed by Cai Weijia, Kong Qingxin, He Yusen and Shen Da.
The patent application number is CN20261056419 20260116. The patent publication number is CN121548253 (A). International Pa..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has received Dingzhou Tech Co Ltd patent application for Wafer Cassette and Frame Thereof. Chen Yanfang developed the invention.
The patent application number is CN202411217827 20240902. The patent publication number is CN121548255 (A). International Patent Classi..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Chingis Tech Corporation has submitted a patent application for Package Structure and Forming Method Thereof. Yu Zhengfu developed the invention.
The patent application number is CN20241198696 20240812. The patent publication number is CN121548307 (A). International Patent Classification codes are H10W70/04..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Shanghai Lewa Microelectronics Tech Co Ltd has sought patent for Power Supply IC with Good Waterproof Effect. This invention was developed by Zou Zhaoyi and Li Xuehui.
The patent application number is CN20261070344 20260120. The patent publication number is CN121548321 (A). International Patent Classificati..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Shenzhen Winsemi Microelectronics Co Ltd has submitted a patent application for Intelligent Electronic Switch, Chip, Product and Equipment for Overload Protection. Song Pengliang, Li Guozheng and Zhao Piao developed the invention.
The patent application number is CN202511439039 20250930. The patent publicat..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has received Hangzhou Research Institute Xidian Univ and Xidian University patent application for Feram Array-based Physical Unclonable Function Structure and Response Method. Wu Xiguang, Ma Yue, Zhang Zhiyun, Zhang Huanning, Chen Bing and Han Genquan developed the i..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has released Shenzhen Jiangyuan Tech Co Ltd patent application for Clock Circuit with Self-diagnosis Function, Clock Circuit Diagnosis Method and Chip. This invention was developed by Huo Ruru, Li Ying, Wang Yongdong and Wang Peng.
The patent application number is..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Shandong Shanke Maidisaisi Laser Tech Co Ltd has submitted a patent application for High-performance 976nm Wide-strip Semiconductor Laser. This invention was developed by Xu Nannan, Chen Wenyan, Chen Sijia and Wang Zhe.
The patent application number is CN202511741811 20251125. The patent publication number ..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has released An Shengjun patent application for Method for Preparing Vascular Organ Chip from Human Umbilical Artery Stem Cells. This invention was developed by An Shengjun.
The patent application number is CN20251169704 20250822. The patent publication number is ..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Rehabilitation Univ has applied Chinese patent for Organ Chip Capable of Realizing Parallel Precise Time-sequence Administration and Application of Organ Chip. Deng Jiu, Yuan Shuai and Wu Chengjun developed it.
The patent application number is CN202511685034 20251117. The patent publication number is CN1215..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Beijing Fire Gene Dx Tech Co Ltd has applied Chinese patent for Temperature Control Module of Micro-fluidic Chip and Micro-fluidic Detection System. Lin Xiao, Xu Rui, Zhu Chengcheng, Wu Hongyan, Liao Hongyan, Song Keqing, Wu Jiawei and Yang Yang developed it.
The patent application number is CN20261063275 2..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Beijing Poly Microchip Tech Co Ltd has filed a patent application for Centrifugal Micro-fluidic Chip and Nucleic Acid Detection Method Thereof. This invention was developed by Liu Zhiyu, Chen Hui, Wu Dalin, Su Chenyu, Wu Xiao, Gao Yachai, Niu Fengxiao, Zhang Wenjie, Wu Jingxuan, Tan Xiaofeng and Liu Qiang.
..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Changchun Changguang Chenying Biological Science Instr Co Ltd has applied Chinese patent for Micro-fluidic Chip Combining In-situ Raman Detection with Optical Tweezers Sorting and Preparation Method. Liang Peng, Li Bei and Xu Liwei developed it.
The patent application number is CN202511643475 20251111. The ..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has published Kunshan Jingke Micro Electronics Mat Co Ltd patent application for Additive for Semiconductor Etching Liquid and Application Thereof. The invention was developed by Tong Chen, Xu Shan, Xia Yuting, Chen Guihong and Wu Haiyan.
The patent application nu..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Shanghai Junzilan New Mat Co Ltd has applied Chinese patent for Led Vacuum Spraying Transparent Wood Lacquer Applied to Shutters and Preparation Method of LED Vacuum Spraying Transparent Wood Lacquer. Zhang Junying, Fan Xinqiang, Ou Zhengzhong, Wang Haijun and Deng Wengen developed it.
The patent applicatio..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Weifang Liuhe New Mat Co Ltd has applied Chinese patent for Low-temperature Sintered Silicon Carbide Ceramic and Production Process Thereof. Lyu Yi developed it.
The patent application number is CN202511991731 20251226. The patent publication number is CN121537211 (A). International Patent Classification co..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Zhengzhou Hollowlite Materials Co Ltd has submitted a patent application for Modified Hollow Glass Bead, Preparation Method Thereof and Organic Silicon Addition Pouring Sealant. This invention was developed by Li Zirui, Zhang Yingcai, Ma Zehua, Lyu Shuaikang, Cai Jianwu, Wang Jianbin, Cai Yaowu and Tao Xinlian..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Tianjin Yingxing Juhe Tech Co Ltd has applied Chinese patent for Quartz Glass CVD (chemical Vapor Deposition) Synthesis Method Based on Secondary Heating and Cvd Deposition Furnace. Diao Yuyang, Yang Linshuai and He Xin developed it.
The patent application number is CN20261077347 20260121. The patent public..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Emeishan Xinrui New Mat Co Ltd has sought patent for Preparation Method of Full-hollow Silicon Carbide Microbeads. This invention was developed by Luo Jianhua, Wang Jian, Cao Shuangli, Shi Keyu and Fu Xiao.
The patent application number is CN202511519075 20251023. The patent publication number is CN12153693..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has received Beijing Poly Microchip Tech Co Ltd patent application for Polymer Micro-fluidic Chip Runner Hydrophobic Modification Method and Chip Thereof. Chen Hui, Gao Yachai, Wu Dalin, Su Chenyu, Wu Xiao, Niu Fengxiao, Liu Zhiyu, Zhang Wenjie, Wu Jingxuan, Tan Xiao..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Xinlian Integrated Circuit Manufacturing has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Wang Yu, Lu Xiaolong and Yao Yangwen.
The patent application number is CN202511647250 20251111. The patent publication number is CN121536877 ..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Zhejiang Fuxi Photoelectric Mfg Co Ltd has submitted a patent application for Silicon Nanotube Array Preparation Method and Silicon Nanotube Array. This invention was developed by Tian Jie.
The patent application number is CN202511345698 20250918. The patent publication number is CN121536874 (A). Internatio..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Guangdong Haina Zhiwei Semiconductor Tech Co Ltd has sought patent for High-performance 3taps Circuit Based on Single-gate Thin Film Transistor. This invention was developed by Wang Kai, Wang Yuhao and Xie Haorong.
The patent application number is CN202511617699 20251106. The patent publication number is CN..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- Aotai Electric Co Ltd has filed a patent application for Full-bridge Soft Switching Inverter Circuit Based on Silicon Carbide Power Device and Control Method Thereof. This invention was developed by Zhang Guangxian, Zhang Fuguo, Wang Tongxiao, Li Hao, Liu Yuemei, Li Zhiyong, Li Xiankai and Zhang Hanbo.
The ..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has received Shenzhen Lixin Semiconductor Co Ltd patent application for Negative Voltage Driving Circuit Suitable for Silicon Carbide Mosfet, Switching Power Supply Converter and Equipment. Zeng Yanni, Chen Wei, Huang Yunchuan and Zhu Xiaoan developed the invention.
..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- ChipMOS Technologies has submitted a patent application for Semiconductor Structure. This invention was developed by Chen Wei-lin.
The patent application number is TW20230146392 20231129. The patent publication number is TW202522733 (A). International Patent Classification codes are H01L23/48, H01L23/488, H0..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has released DEC Inc patent application for Alumina Polishing Solution for Polishing Surface of Germanium Wafer as Well as Preparation Method and Application of Alumina Polishing Solution. This invention was developed by Zhou Lihu and Ma Nannan.
The patent applica..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- Guangdong Jiansujing Biotechnology Co Ltd has applied Chinese patent for Stable Organic Silicon Emulsion as Well as Preparation Method and Application Thereof. Wu Weimin developed it.
The patent application number is CN202511734114 20251124. The patent publication number is CN121537650 (A). International Pa..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has published Beijing Pingtouge Information Tech Co Ltd patent application for Time Sequence Verification Method and Device of Three-dimensional Integrated Circuit and Electronic Equipment. The invention was developed by Chen Yanbin.
The patent application number ..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has received Zhonghao Xinying Hangzhou Tech Co Ltd patent application for Chip Verification Method and Device, Equipment, Medium and Chip. Zheng Hanxun, Han Zheng and Chen Chaohui developed the invention.
The patent application number is CN20261032231 20260112. Th..
Semiconductor
| Mon 08 Jun 2026
Beijing, June 8 -- University of Science and Technology Beijing has sought patent for Thermoelectric Transistor Performance Simulation Method and System. This invention was developed by Qian Na, Xu Guiying, Chen Jikun, Chen Jie, Wang Wenjun, Yang Ruizhe, Si Nuo and Tang Chen.
The patent application number is CN202511671009 20..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Taiwan Patent Office has released Landmark Optoelectronics Corp patent application for Light Detection Element to Provide Support and Prevent Defect Formation Caused by Stress Accumulation Between the Substrate and the Buffer Layer. This invention was developed by Huang Hong-wen, Chen Yong-chao and Wang Yi-xian..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Taiwan Patent Office has published Or-bach Zvi, Cronquist Brian, Beinglass Israel, De Jong J L, Sekar Deepak C and Wurman Zeev patent application for Method to Construct Semiconductor Device, Method to Process an Integrated Circuit Device, Method for Processing a 3D Integrated Circuit, and 3D Semiconductor Devi..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Xiamen Industrial Technology Research Institute Co Ltd has sought patent for Semiconductor Structure and its Preparation Method Wherein the Semiconductor Structure Includes a Substrate and a Plurality of Resistive Switching Devices Located on the Substrate. This invention was developed by Li Wu-xin, Chiu Tai-we..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Kepler Computing has sought patent for Device for Embedded Memory. This invention was developed by Sato Noriyuki, Gosavi Tanay, Mukherjee Niloy, Mathuriya Amrita, Dokania Rajeev Kumar and Manipatruni Sasikanth.
The patent application number is TW20250105021 20220831. The patent publication number is TW202523..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Nanya Technology has submitted a patent application for Semiconductor Structure Including Bit Line Structure and Method of Manufacturing the Same. This invention was developed by Chiang Hsu.
The patent application number is TW20240125798 20240125. The patent publication number is TW202523075 (A). Internation..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Taiwan Patent Office has released Nanya Technology patent application for Semiconductor Structure Including Bit Line Structure and Method of Manufacturing the Same. This invention was developed by Chiang Hsu.
The patent application number is TW20240102905 20240125. The patent publication number is TW20252307..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Powerchip Semiconductor Manufacturing Corporation has sought patent for Gate Structure and Floating Gate Memory. This invention was developed by Chen Hsin-hsu, Huang Tzung-bin and Yang Wen-chung.
The patent application number is TW20230146391 20231129. The patent publication number is TW202523072 (A). Intern..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Taiwan Patent Office has released Nanya Technology patent application for Memory Structure. This invention was developed by Lu Tseng-fu and Hsiao Chuan-lin.
The patent application number is TW20250105811 20220406. The patent publication number is TW202523071 (A). International Patent Classification codes are..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Nanya Technology has sought patent for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Wu Chun-heng.
The patent application number is TW20240142814 20240226. The patent publication number is TW202523068 (A). International Patent Classification code is H10B12/00. Coo..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Nanya Technology has submitted a patent application for Semiconductor Device and Method of Manufacturing the Same. Wu Chun-heng developed the invention.
The patent application number is TW20240106865 20240226. The patent publication number is TW202523058 (A). International Patent Classification code is H10B1..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Nanya Technology has submitted a patent application for Semiconductor Device and Method of Forming the Same. This invention was developed by Chuang Ying-cheng and Lin Yu-ting.
The patent application number is TW20240106421 20240222. The patent publication number is TW202523057 (A). International Patent Class..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Nanya Technology has filed a patent application for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Wu Chun-heng.
The patent application number is TW20240102133 20240118. The patent publication number is TW202523052 (A). International Patent Classification codes are..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Nanya Technology has submitted a patent application for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Hsu Yueh.
The patent application number is TW20230144813 20231120. The patent publication number is TW202523050 (A). International Patent Classification code is H1..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Canon has filed a patent application for System Including a Plurality of Die Heads with Releasably Coupled Die Chucks and a Method of Using the Same. This invention was developed by Choi Byung-jin, Cherala Anshuman, Meissl Mario Johannes, Roy Nilabh K and Mori Kenichiro.
The patent application number is TW20..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Glory Material Co Ltd has submitted a patent application for a Method for Preparing High-performance Silicon-carbon Composite Graphite Material Solving the Problems of Pulverization and Collapse Due to Large Volume Change in a Silicon Material in Charge and Discharge Processes. This invention was developed by Z..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Taiwan Patent Office has received Mediatek patent application for Electrostatic Discharge Protection Device and the Forming Method Therefor. Li Tzung-lin, Chung Yuan-fu and Lee Tung-hsing developed the invention.
The patent application number is TW20240104093 20240202. The patent publication number is TW2025..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Nanya Technology has submitted a patent application for Integrated Circuits with Cdm ESD Protection Capabilities. Chen Chien-yu developed the invention.
The patent application number is TW20240100145 20240102. The patent publication number is TW202522754 (A). International Patent Classification codes are G06..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Diodes Inc has sought patent for Semiconductor Structure and Manufacturing Method of the Same. This invention was developed by Wang Ching-wen, Li Jie, Tsai Ming-wei and Chuang Chiao-shun.
The patent application number is TW20240100733 20240108. The patent publication number is TW202522750 (A). International ..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Taiwan Patent Office has published Mediatek patent application for Semiconductor Package Structure. The invention was developed by Shen Yih-ting, Chen Tai-yu, Lin Ping-yeh, Li Yu-jin, Chang Chun-yi, Chen Chi-yuan and Chiu Sang-mao.
The patent application number is TW20240146026 20241128. The patent publicati..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Taiwan Patent Office has released Mediatek patent application for Semiconductor Package. This invention was developed by Jhan Cing-yao, Huang Chien-kai, Shih Ting-chen and Hu Chu-wei.
The patent application number is TW20240145510 20241126. The patent publication number is TW202522713 (A). International Pate..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has received Yangtze Memory Holdings Co Ltd patent application for Memory Device, Operation Method and Memory System. Wang Tingze, Xu Feng, Wang Wendong, Guan Lei, Zhu Anyi, Jin Lei, Huo Zongliang, Huang Ying and Liu Hongtao developed the invention.
The patent app..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Taiwan Patent Office has published ND Hi Technologies Lab Inc and Etron Technology patent application for Semiconductor Package Structure for Enhanced Cooling. The invention was developed by Tong Ho-ming and Lu Chao-chun.
The patent application number is TW20240132090 20240826. The patent publication number ..
Semiconductor
| Sun 07 Jun 2026
Beijing, June 8 -- State Intellectual Property Office of China has received Haiguang Yunxin Integrated Circuit Design Shanghai Co Ltd patent application for Address Comparison Circuit, Semiconductor Memory and Electronic Equipment. Wang Yixiao developed the invention.
The patent application number is CN202511632026 20251107. ..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Innolux has filed a patent application for Package Structure. This invention was developed by Chen Ying-jen and Shieh Wei-lun.
The patent application number is TW20240123770 20240626. The patent publication number is TW202522703 (A). International Patent Classification codes are H01L23/28 and H01L23/488. Coo..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Xintec has submitted a patent application for Chip Package. This invention was developed by Chien Wei-ming, Lee Po-han and Hou Yi-jui.
The patent application number is TW20240145641 20241127. The patent publication number is TW202522695 (A). International Patent Classification codes are H01L23/02, H01L23/12 ..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Asahi Utou Technology Co Ltd has submitted a patent application for Balance Device and Substrate Treating Apparatus Comprising the Same. This invention was developed by Wang Chun-hui.
The patent application number is TW20230145300 20231123. The patent publication number is TW202522684 (A). International Pate..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Taiwan Patent Office has published Joen Lih Machinery Co Ltd patent application for Grinding Device for Wafers with Tracking and Alignment Wafer Holders and Method for Loading and Unloading Wafers. The invention was developed by Lin Hsin-tang and Lin Chih-chieh.
The patent application number is TW20230145843..
Semiconductor
| Sun 07 Jun 2026
Taipei, June 8 -- Asahi Utou Technology Co Ltd has submitted a patent application for Exhaust Components and Substrate Treating Apparatus Comprising the Same. This invention was developed by Wang Chun-hui.
The patent application number is TW20230145302 20231123. The patent publication number is TW202522671 (A). International ..
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