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Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Yangtze Memory Tech Holding Co Ltd has submitted a patent application for Semiconductor Device, Operating Method of Semiconductor Device, and Memory System. Li Da, Zhang Yu, Huo Zongliang, Jin Lei and Xu Feng developed the invention. The patent application number is US202619441642 20260106. The patent p..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has published Onto Innovations Inc patent application for Method and System for Inspection of Defects in Semiconductor Fabrication. The invention was developed by Dhaliwal Jatinder, Chen Chien-wen and Lee Manjun. The patent application number is US202519437902 20251231. ..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has published Besi Netherlands BV patent application for Sawing Device for Forming Saw-cuts into a Semiconductor Product and Method Therefor. The invention was developed by Langius Sietse and Hermans Mark. The patent application number is US202319141155 20231214. The pat..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing Co Ltd patent application for Semiconductor Tool. This invention was developed by Ho Chih-chi, Cheng Chih-hung, Chen Yin-chuan, Liu Yu-hsin and Kuo Pei-ching. The patent application number is US202519034584 20250123. The pa..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Method of Cleaning Sensor Used in Semiconductor Manufacturing Tool. This invention was developed by Su Yen-shuo, Liu Yen-hao, Kuo Chueh-chi, Chiu Wei-huai and Chen Li-jui. The patent application number is US202519032137 202..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has released TNP Corp patent application for Method for Manufacturing Shower Head for Semiconductor Manufacturing Using an Improved Diffusion Bonding Process. This invention was developed by Kim Tae Kyoung and Lee Kye Nam. The patent application number is US202519400367 ..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Gsec German Semiconductor Equipment Co GmbH has submitted a patent application for Apparatus and Method for Cleaning Pot-shaped Hollow Bodies, in Particular Transport Containers for Semiconductor Wafers or for Lithography Masks. This invention was developed by Rebstock Lutz. The patent application numbe..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for System and Method for Extending Lifetime of Memory Device. This invention was developed by Liao Pei-chun, Heh Dawei, Lee Yung-huei, Lin Jian-hong and Kuo Wen Hsien. The patent application number is US202619571810 20260319. ..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Memory Device and Method of Operating the Same. Yang Yao-jen, Huang Chia-en, Chiang Ting-wei and Lee Ji-kuan developed the invention. The patent application number is US202519034526 20250122. The patent publication number i..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Word-line Driver Utilizing Word-line Voltage Suppression for Read Assist. This invention was developed by Yamada Ayumu and Watanabe Ryota. The patent application number is US202519034630 20250123. The patent publication num..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Memory Unit Having High Manufacturing Capability. Liaw Jhon Jhy developed it. The patent application number is US202519027702 20250117. The patent publication number is US20260212898 (A1). International Patent Classification ..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Device and Method of Manufacturing Same. This invention was developed by Chiang Wen-chih, Tien Tzu Jung and Cheng Cheung. The patent application number is US202519028551 20250117. The patent publication number..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Co Ltd patent application for Integrated Circuit. Liaw Jhon Jhy developed the invention. The patent application number is US202519035772 20250123. The patent publication number is US20260214876 (A1). International Patent Cl..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Schweizer Electronic AG has submitted a patent application for Power Semiconductor Module and Method for Producing Same. This invention was developed by Martina Manuel and Neumann Alexander. The patent application number is US202619444315 20260109. The patent publication number is US20260214807 (A1). In..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has published Metapwr Electronics Co Ltd patent application for Power Pin Assembly Structure of Electronic Device and Manufacturing Process for Substrate Thereof. The invention was developed by Chen Qingdong, Li Liuzhu and Hong Shouyu. The patent application number is US..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Numascale AS has submitted a patent application for Network on Chip. This invention was developed by Persvold Steffen and Palfer-sollier Thibaut. The patent application number is US202619438767 20260102. The patent publication number is US20260214065 (A1). International Patent Classification code is H04..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Soteria Inc has filed a patent application for Method of Multi-deserializing for Hash Computation and Chip Adopting the Same. This invention was developed by Park Gihong, Yang Sinho and Kim James Jongman. The patent application number is US202519384016 20251110. The patent publication number is US202602..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Dual Micro-electro Mechanical System and Manufacturing Method Thereof. This invention was developed by Liang Victor Chiang, Teng Yi-chuan, Liu Chwen-ming, Chen Yang-che, Tseng Huang-wen and Lin Chen-hua. The patent applicat..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Akoustis Tech Corp has submitted a patent application for Doped Crystalline Piezoelectric Resonator Films and Methods of Forming Doped Single Crystalline Piezoelectric Resonator Layers on Substrates Via Epitaxy. Kim Dao Ho, Moe Craig, Bi Zhiqiang, Winters Mary and Leathersich Jeffrey M developed the invent..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Loboptics Inc has submitted a patent application for Gas Filled Hollow-core Silicon Spiral Waveguide Photonic Chip Laser. This invention was developed by Abed Arin and Beygi Azar Aghbolagh Farzin. The patent application number is US202519030969 20250117. The patent publication number is US20260213492 (A..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has published Bobst Italia SpA patent application for Drying Unit for Drying a Substrate. The invention was developed by Parodi Davide and Patrucco Andrea. The patent application number is US202319137441 20231212. The patent publication number is US20260208504 (A1). Inte..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Co Ltd patent application for Semiconductor Device and Method of Manufacturing the Same. Huang Shih-min, Huang Kuo-chin, Hsiao Chia-chi, Chung Chi-hsien, Hsu Ming-chieh and Wang Tzu-jui developed the invention. The patent a..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Co Ltd patent application for Semiconductor Device and Methods of Formation. Huang Lin-yu, Chen Shih-fan and Hsu Sheng-fu developed the invention. The patent application number is US202519033714 20250122. The patent publica..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing Co Ltd patent application for Semiconductor Device and Method for Forming the Same. This invention was developed by Lee Hsin-yi, Lee Hsien-ming, Liao Chun-da and Yang Kai-chieh. The patent application number is US2025190341..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has sought patent for Semiconductor Device and Method for Forming the Same. This invention was developed by Huang Hao-chin, Lai Ting-hsuan and Loh Wei-yip. The patent application number is US202519033648 20250122. The patent publication number is US20260214979 (..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Semiconductor Device and Formation Method Thereof. Jeng Pei-ren, Liao Szuya, Tsai Ji-yin, Lo Hung-kun and Yang Ku-feng developed it. The patent application number is US202519033206 20250121. The patent publication number is U..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Ltd patent application for Conformal Source/drain Structures for Semiconductor Devices. The invention was developed by Cheng Kuan-hao, Lee Wei-yang and Lai Bo-yu. The patent application number is US202519255060 20250630..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Device and Methods of Formation. This invention was developed by Shih Chien-hsueh, Mao Ching-han, Huang Jau-jiun, Chang Chih-yi and Lin Chun-chieh. The patent application number is US202519196343 20250501. The..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing Co Ltd patent application for Method for Gap Filling with Selectively Formed Seed Layer and Heteroepitaxial Cap Layer. This invention was developed by Liao De Jhong, Chiu Ya-wen, Chen Szu-ying, Pan Zheng-yang and Chen Yu-yu. ..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Ltd patent application for Method for Etching High-k Layer of Stacked Device Using Atomic Layer Etching Process. The invention was developed by Huang Chun-hsien and Hsu Wan Ting. The patent application number is US20251..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Semiconductor Structure and Method of Forming Thereof. Lee Olivia Pei-hua, Huang Hao-chin, Chang Po-chin, Liao Szuya, Lin Pinyen, Wang Hsin, Loh Wei-yip, Chu Chia-hung, Ho Shih-jung, Wang Sung-li and Yang Ku-feng developed it. ..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing Co Ltd patent application for CFET Structure Formed by a Low Temperature Process. This invention was developed by Lin Cheng-ming, Chen Szu-hua, Woon Wei-yen, Liao Szuya, Yang Kai-chieh and Hu I Fan. The patent application n..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Structure with Stacked Transistors. This invention was developed by Chang Hsu-kai, Woon Wei-yen, Liao Szuya and Yang Kai-chieh. The patent application number is US202519030434 20250117. The patent publication ..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has received Yungu Gu’an Tech Co Ltd and Hefei Visionox Technology patent application for Thin Film Transistor and Manufacturing Method Thereof, Array Substrate and Display Panel. Wang Dejian, Chen Fa-hsyang, Sun Xiaoqi, Yan Guowen, Xu Lin and Ding Lidong developed the in..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Semiconductor Structure and Method for Manufacturing the Same. Chiang Katherine H, Kao Yun-feng, Ling Chia Yu and Chuang Ming-yen developed it. The patent application number is US202519033665 20250122. The patent publication ..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Semiconductor Structures and Methods of Forming Same. Huang Hsien-chung, Chen Bing-hung, Li I-hung, Chang Jung-hao and Lin Pinyen developed it. The patent application number is US202519029394 20250117. The patent publication ..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing Co Ltd patent application for Via Structure with Low Resistivity. This invention was developed by Hwang Chih-hong, Yu Ke-jing, Tsai Kuo-chiang, Chen Jyh-huei and Su Fu-hsiang. The patent application number is US202619572005..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has sought patent for Semiconductor Device and Method of Fabricating the Same. This invention was developed by Lee Chia-jui, Chen Fei-yun, Song Jhu-min and Chen Yi-huan. The patent application number is US202519034400 20250122. The patent publication number is U..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has received Trinno Tech Co Ltd patent application for Silicon Carbide Based-lateral Power Semiconductor Device, and Method for Manufacturing Same. Yun Chongman, Oh Kwang Hoon, Kim Soo Seong and Jung Jin Young developed the invention. The patent application number is US2..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Semiconductor Structure and Method for Forming the Same. Chiang Katherine H, Ling Chia Yu and Chuang Ming-yen developed it. The patent application number is US202519034610 20250123. The patent publication number is US20260214..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has sought patent for Semiconductor Structure and Method of Manufacturing the Same. This invention was developed by Chiang Katherine H, Kao Yun-feng and Chuang Ming-yen. The patent application number is US202519034599 20250123. The patent publication number is U..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Device Including a Memory Array and Methods of Formation. Chang Chih-yu, Chiang Katherine H, Chen Chieh-fang and Chiang Kuo-chang developed the invention. The patent application number is US202519034991 202501..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Cell Regions and Methods of Manufacturing Same. This invention was developed by Chang Kuang-ching, Lin Cheng-yu, Tsai Wei-hsin, Yang Jung-chan, Chang Wei-ling and Lin Yo-shiuan. The patent application number is US2025192217..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Co Ltd patent application for Semiconductor Device and Method for Manufacturing the Same. Lin Chin-shen, Gao Jia-hong and Lu Yung-fong developed the invention. The patent application number is US202519032150 20250120. The p..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Stacked Via Structures and Methods for Forming the Same. This invention was developed by Lai Yen-kun, Lii Mirng-ji, Cheng Ching-ho, Lin Cheng-nan, Chu Chiang-jui, Hsu Chien Hao, Chang Kuo-chin and Tu Wei-hsiang. The patent ..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Tower Semiconductor Ltd has applied United States patent for Manufacturing a Second Semiconductor Item While Concurrently Forming Via Holes and Line Holes. Gudinetzky Marina, Cappa Gerardo and Sirkis Alex developed it. The patent application number is US202519034524 20250122. The patent publication numb..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Tel Mfg And Engineering Of America Inc has applied United States patent for Overlay Correction in Semiconductor Device Manufacturing. Raley Angelique, Kitano Junichi, Fernandez Luis and Heussner Robert William developed it. The patent application number is US202519330585 20250916. The patent publication..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Ltd patent application for Processes for Planarization of a Semiconducting Wafer Substrate. The invention was developed by Deng Yu-luen, Shieh Min-feng, Yang Chih-kai and Lu Hsuan-chin. The patent application number is ..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Die Assembly and Method of Manufacturing the Same. This invention was developed by Tsui Yingkit Felix, Cheng Hsin-li, Teng Li-feng, Huang Shih-fen, Chang Yu-chi and Su Shu-hui. The patent application number is..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has released Tsmc China Co Limited and Taiwan Semiconductor Manufacturing Co Ltd patent application for Apparatus and Method for Processing Wafer. This invention was developed by Hang Lisheng, Zhang Ronghua, Ji Xu, Luo Yi, Zhu Honghua, Huang Lan and Ma Longlong. The pate..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Co Limited patent application for Apparatus with Exhaust Baffle. Cheng Kai-wen, Liang Yen-hsiang, Lo Yi-hao and Chen Wei-da developed the invention. The patent application number is US202519028519 20250117. The patent publi..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has filed a patent application for Method of Fabricating Semiconductor Pacakge. This invention was developed by Chang Ken-yu, Ting Kuo-chiang, Lin Yung-chi, Chung Ming-tsu and Chen Yi-hsiu. The patent application number is US202519034414 20250122. The patent pub..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has filed a patent application for Semiconductor Device and Methods of Manufacturing. This invention was developed by Sung Fu-ting. The patent application number is US202619570611 20260318. The patent publication number is US20260215171 (A1). International Paten..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has sought patent for Spacer Scheme and Method for Mram. This invention was developed by Liou Joung-wei and Lan Chin Kun. The patent application number is US202619570301 20260318. The patent publication number is US20260215165 (A1). International Patent Classifi..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Manufacturing Method of Package with Magnetic Shielding Structure. This invention was developed by Chiang Tien-wei, Lee Yuan-jen and Chuang Harry-hak-lay. The patent application number is US202619569653 20260317. The patent..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Schroeder Jon Murray has submitted a patent application for Superconducting Type Silicon Thermoelectric Generator. The patent application number is US202319137988 20231215. The patent publication number is US20260215158 (A1). International Patent Classification codes are H10N10/17 and H10N10/855. Coope..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- BYD Co Limited has submitted a patent application for Tunnel Oxide Passivated Contact Solar Cell and Photovoltaic Module. Luo Xue, Ou Canlin, Zhou Wei, Li Yan and Zheng Jiaxin developed the invention. The patent application number is US202619456478 20260122. The patent publication number is US2026021502..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Ltd patent application for Pixel Shielding Using Air Gaps. The invention was developed by Lin Chunhao, Cheng Yun-wei, Tu Chien Nan and Lee Kuo-cheng. The patent application number is US202619570548 20260318. The patent ..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Image-sensing Structure and Method for Manufacturing the Same. This invention was developed by Yang Ming-hsien, Lu Chun-liang, Chou Chun-hao and Lee Kuo-cheng. The patent application number is US202619570209 2..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Photo Diode with Dual Backside Deep Trench Isolation Depth. Huang Yimin developed it. The patent application number is US202619567435 20260316. The patent publication number is US20260215009 (A1). International Patent Classif..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Limited has submitted a patent application for Integrated Passive Device Dies and Methods of Forming and Placement of the Same. This invention was developed by Lin Meng-liang, Jeng Shin-puu, Chen Hsien-wei and Wei Chun Huan. The patent application number is US202619..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Package and Fabrication Method Thereof. Hsu Shu-huai, Sheu Tzu-shiun, Wang Shih-hui and Chiang Yung-ping developed the invention. The patent application number is US202519034390 20250122. The patent publication number is US..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has published Viatron Tech Inc patent application for Semiconductor Chip Laser Bonding Device. The invention was developed by Lim Hyeon Tae, Han Maeng Kun, Lim Hyun Kyo, Yang Won Yeong, Kim Byung Kuk, Kim Hyoung June and Kim Ji Hye. The patent application number is US202..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Structure and Method for Forming the Same. Yang Kan-ju, Lee Hsing-chieh, Lin Wen-yi and Zou Zhihua developed the invention. The patent application number is US202519033908 20250122. The patent publication numb..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Co Ltd patent application for Chip Package Structure with Glass Substrate and Method for Forming the Same. Arumugam Manikandan, Wu Wei-cheng, Tseng Chien-fu, Lu Han-yi and Yeh Der-chyang developed the invention. The patent ..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has sought patent for Package Structure and Method of Forming the Same. This invention was developed by Tsai Hao-yi, Hu Yu-chen, Kuo Hung-yi and Liang Yu-min. The patent application number is US202519034372 20250122. The patent publication number is US2026021529..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has filed a patent application for Semiconductor Package Structure and Method of Forming the Same. This invention was developed by Hsu Shu-huai, Sheu Tzu-shiun and Chiang Yung-ping. The patent application number is US202519033905 20250122. The patent publication..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. Hsiao Ru-shang and Yu Kejing developed the invention. The patent application number is US202519032786 20250121. The patent publication number is US20260215282 (A1). Int..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Supporting Sealant Layer Structure for Stacked Die Application. This invention was developed by Yang Che Wei, Yu Chung-yi, Wu Kuo-ming, Tsai Cheng-yuan, Hsiao Hau-yi and Chen Sheng-chau. The patent application number is US2..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has filed a patent application for Semiconductor Package and Method of Forming the Same. This invention was developed by Hsu Shu-huai, Wang Shih-hui and Chiang Yung-ping. The patent application number is US202519034522 20250122. The patent publication number is ..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Ltd patent application for Package Structure and Method for Forming the Same. The invention was developed by Liao Han Hsiang. The patent application number is US202519033417 20250121. The patent publication number is US..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Co Ltd patent application for Semiconductor Package and Method of Manufacturing Semiconductor Package. Lai Chih-ting, Chuang Kris Lipu and Lin Chien-chang developed the invention. The patent application number is US20251903..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Structure and Method of Fabricating the Same. This invention was developed by Lin Wei-ray, Chen Yang-che, Lai Chi-hui and Lu Hsiang-tai. The patent application number is US202519034510 20250122. The patent pub..

Semiconductor

  |  Sun 26 Jul 2026

Alexandria, July 27 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Interlevel Dielectric Structure in Semiconductor Device. Lee Ming-tsung, Ko Chung-chi, Chou Chia-cheng and Lee Tze-liang developed it. The patent application number is US202619565548 20260313. The patent publication number is..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Anhui Tanlingjia Resources Recycling Service Tech Co Ltd has applied Chinese patent for Alloy Chip Continuous Solid Recovery Device and Method Thereof. Lu Liman and Dong Haonan developed it. The patent application number is CN202610125611 20260129. The patent publication number is CN121951634 (A). Internat..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- State Intellectual Property Office of China has released CR Microelectronics Holdings Co Ltd and China Resources Runan Tech Chongqing Co Ltd patent application for Material Box of Semiconductor Structure, Chemical Plating Equipment and Use Method of Chemical Plating Equipment. This invention was developed by ..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Source Bottle Device, Semiconductor Process System and Process Method. This invention was developed by Fan Qingxia, Zhang Nan and Han Liren. The patent application number is CN202411515240 20241028. The patent publication number ..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- BOE Huacan Optoelectronics Guangdong Co Ltd has submitted a patent application for Metal Organic Chemical Vapor Deposition Reaction Chamber and Monitoring Device and Method Thereof. Zhou Xuyang, Qu Limin, Chen-zhang Xiaoxiong and Zhang Leicheng developed the invention. The patent application number is CN20..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Wuhan Maiwei Optics Tech Co Ltd has applied Chinese patent for Universal Semiconductor Vacuum Coating Device Based on Adjustable Substrate Frame. Zhang Jipeng, Zhou Yanwen and Gui Yifan developed it. The patent application number is CN202610129782 20260129. The patent publication number is CN121951480 (A)...

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Shaoxing Xinlian Semiconductor Tech Co Ltd has applied Chinese patent for Phase Shift Mask Substrate and Dynamic Magnetron Sputtering Preparation Method Thereof. Zhao Yusong developed it. The patent application number is CN202610236853 20260228. The patent publication number is CN121951474 (A). Internation..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Aosilite Electronic Tech Shenzhen Co Ltd has sought patent for Quartz Wafer High-pressure Nitrogen Ion Beam Technology Surface Treatment Method. This invention was developed by Xie Hua. The patent application number is CN202610148332 20260203. The patent publication number is CN121951455 (A). International..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Xindong Micro Shanghai Semiconductor Tech Co Ltd has applied Chinese patent for Electroplating Stirring Device for Improving Electroplating Uniformity and Electroplating Equipment. Yin Qiongling, Wang Steven He, Wang Tao and Lin Pengpeng developed it. The patent application number is CN202411478164 2024102..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- State Intellectual Property Office of China has received Suzhou Top Creation Machines and Suzhou Chuangfeng Photoelectric Intelligent Tech Co Ltd patent application for Self-balancing Horizontal Electroplating Anode Net Spraying Box Device. Xu Jiasong developed the invention. The patent application number ..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Nantong Polytechnic College has submitted a patent application for Unmanned Aerial Vehicle Accessory Electroplating Equipment. This invention was developed by Hong Yan and Zhang Yunan. The patent application number is CN202610251171 20260303. The patent publication number is CN121951655 (A). International Pa..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Jian Zhihe Special Conductor Co Ltd has filed a patent application for Automatic Electroplating Production Line System Capable of Accurately Regulating and Controlling Double-layer Copper-plated Conductor. This invention was developed by Zhou Xiaoming, Wang Xiaobing, Xiao Qidao and Dai Tianbao. The patent ..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Leize New Energy Tech Jiangsu Co Ltd has applied Chinese patent for Horizontal Electroplating Conductive Roller and Conveying Mechanism. Weng Guozhou and Yang Yi developed it. The patent application number is CN202610153027 20260203. The patent publication number is CN121951652 (A). International Patent Cl..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Shenyang Chaoyi Microelectronic Equipment Co Ltd has applied Chinese patent for Semiconductor Electroplating Process Control Method and System. Qi Chengjie, Chen Tong and Gu Dejun developed it. The patent application number is CN202610162254 20260205. The patent publication number is CN121951660 (A). Inter..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Hunan Hongsheng Intelligent Equipment Co Ltd has filed a patent application for Online Temperature Control Coordinated Regulation and Control Method and System for Electroplating Bath of Diamond Fretsaw. This invention was developed by Gao Sien and Zhang Xiaobo. The patent application number is CN202610719..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- State Intellectual Property Office of China has received Research Micro Jiangsu Semiconductor Tech Co Ltd patent application for Epitaxial Equipment and Wafer Conveying Method Thereof. Dai Yuanxian, Zhang Qiucheng and Lin Xing developed the invention. The patent application number is CN202610410501 2026033..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd has submitted a patent application for Furnace Bottom Protection Assembly for Preventing Leakage of Silicon Liquid for Single Crystal Furnace and Single Crystal Furnace. Cao Qigang, Wang Zhongbao, Ma Cheng, Zhang Youhai, Rui Yang, Yang Kai, Yi Ran and Wang L..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Shenyang Fortune Precision Equipment has submitted a patent application for Precision Measuring Instrument for Size of Integrated Circuit Component. This invention was developed by Liu Jia and Xiu Xiaoyan. The patent application number is CN202511939135 20251222. The patent publication number is CN121953805 ..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- State Intellectual Property Office of China has published Zhiwei Semiconductor Shanghai Co Ltd patent application for Cooling Device for Wafer Heating Disc. The invention was developed by Xue Donghao, Shen Yilin and Wang Kui. The patent application number is CN20251246044 20251231. The patent publication n..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- State Intellectual Property Office of China has released Hunan Feiyu Electric Co Ltd patent application for Preparation Device and Preparation Method of Porous Pressureless Sintered Silicon Carbide Ceramic. This invention was developed by Zhong Hangyu and Zhong Qilong. The patent application number is CN20..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Guan Hairuosi New Material Tech Co Ltd has submitted a patent application for Roasting Furnace and Reduced Silicon Dioxide Roasting Method for Manufacturing Silicon-carbon Negative Electrode. This invention was developed by Yu Jinling, Yan Xia, Zhou Bochen, Wang Min, Ding Xinwei, Rong Yu and Wang Peng. The..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- State Intellectual Property Office of China has received Shanghai Xinyuan Micro Entpr Development Co Ltd patent application for Nozzle for Wafer Drying and Wafer Drying Device. Liu Peng, Peng Bo, Sun Jinzhou, Mao Guanxiang, Zhang Xingyi, Li Jinliang and Li Ze developed the invention. The patent application..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Shenzhen CBPM Kexin Banking Tech Co Ltd has sought patent for Light-emitting Module, Linear Light Source and Contact-type Image Sensor. This invention was developed by Liu Jianwen, Xie Bo, Yin Wanjie, Zhang Shaobing, Zhou Ying, Xu Xiao and Cheng Miao. The patent application number is CN202511949794 2025122..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Shenzhen Gongxian Shengshi Tech Co Ltd has filed a patent application for Intelligent Following Type OLED (organic Light Emitting Diode) Screen Device for Guiding and Explaining. This invention was developed by Liu Wensheng and Yu Hao. The patent application number is CN20261063293 20260119. The patent pub..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- State Intellectual Property Office of China has published Hugang Vacuum Pump Mfg Zhejiang Co Ltd patent application for Vacuum Pump for Semiconductor Manufacturing. The invention was developed by Lu Ruyou and Cui Ruyue. The patent application number is CN202610369958 20260325. The patent publication number..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Chongqing University has submitted a patent application for Non-pipeline Extensible Magnetic Rotor Micropump Chip. Hu Ning, Chen Ya, Zhang Jixi, Yang Chen, Yang Jun and Li Tianhao developed the invention. The patent application number is CN202610207705 20260212. The patent publication number is CN121952828 (..

Semiconductor

  |  Mon 27 Jul 2026

Beijing, July 27 -- Qingdao Sirui Intelligent Tech Co Ltd has sought patent for Vacuum Cavity Hinge Device for ALD (atomic Layer Deposition) Semiconductor Equipment. This invention was developed by Zhang Yuan, Li Zihao, Gao Fulai, Kunimasa, Liu Lianrui and Yao Lizhu. The patent application number is CN202610418252 20260401. T..
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