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Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Zhejiang Dunyuan Juxin Semiconductor Tech Co Ltd has submitted a patent application for Automatic Grinding Device. This invention was developed by Fan Mingming, Li Shuai and Shi Jiangquan.
The patent application number is CN202511273611 20250908. The patent publication number is CN121083494 (A). Internati..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Humo Laboratory Ltd has submitted a patent application for Buffer Device, Supply Device, and Supply Method. This invention was developed by Sawa Nobuo.
The patent application number is CN202411988565 20241231. The patent publication number is CN121084905 (A). International Patent Classification codes are ..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Jiangmen Youbisi Semiconductor Mat Co Ltd has submitted a patent application for Nickel Sealing Plating Solution with Enhanced Corrosion Resistance and Preparation Method Thereof. This invention was developed by Deng Qijun, Wu Jialin and Yang Chunli.
The patent application number is CN202511123185 2025081..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has received Hangzhou Zhixin Semiconductor Co Ltd patent application for Ceramic Material Separating and Partitioning Filling Device and Processing Method of Grid Plate. Cai Yixing and Ye Dingyun developed the invention.
The patent application number is CN202511..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Institute of Semiconductors, Chinese Academy of Sciences has applied Chinese patent for Handheld AI Electronic Nose Device, System and Method. Li Zhao, Wang Qiongzhang, Wang Jiayuan, Gan Yichao, Xia Zihan and Li Jitong developed it.
The patent application number is CN202511343736 20250919. The patent publ..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Changzhou Shundian Precision Tech Co Ltd has submitted a patent application for High-stability Elastic Tool Structure for Large-size Silicon Wafer Cutting Action. This invention was developed by Wang Yongping, Cai Jianhua, Cao Jinyu, Xue Yanqiu and Wang Shenghui.
The patent application number is CN2025115..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Tokyo Electron has submitted a patent application for Substrate Processing Method. This invention was developed by Sakurai Hiroki, Goto Daisuke, Nakazawa Takashi, Takamatsu Yusuke and Hashimoto Yusuke.
The patent application number is CN202511234239 20201228. The patent publication number is CN121096860 (A)..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Shanghai Xinyuan Micro Entpr Development Co Ltd has submitted a patent application for Substrate Processing Method and Apparatus. Wang Ruipu and Peng Bo developed the invention.
The patent application number is CN202511412585 20250929. The patent publication number is CN121096854 (A). International Patent..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Beijing NAURA Microelectronics Equipment has sought patent for Window Assembly, Monitoring Device and Semiconductor Process Equipment. This invention was developed by Shen Hao and Wang Wei.
The patent application number is CN202511299825 20250911. The patent publication number is CN121096846 (A). Internatio..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has released Beijing Jingyi Automation Equipment patent application for Semiconductor Temperature Control Device Based on Liquid Nitrogen Temperature Control and Control Method Thereof. This invention was developed by Zheng Lu, Gu Xiaohu, Jin Lifu, Hu Wenda, Liu Zi..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has published Tokyo Electron patent application for Plasma Processing Apparatus and Substrate Support Unit Assembly. The invention was developed by Sasaki Ryo.
The patent application number is CN202511274555 20200925. The patent publication number is CN121096844 (..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Beijing Integrated Circuit Equipment Innovation Center Co Ltd has applied Chinese patent for Air Inlet Device and Semiconductor Process Equipment. Tu Tianyou developed it.
The patent application number is CN202511120329 20250811. The patent publication number is CN121096840 (A). International Patent Class..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Beijing NAURA Microelectronics Equipment has applied Chinese patent for Lining Structure, Semiconductor Process Chamber and Ignition Method Thereof. Zuo Jie developed it.
The patent application number is CN202410741954 20240607. The patent publication number is CN121096839 (A). International Patent Classifi..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Yangtze Memory Technologies has submitted a patent application for Plasma Etching Device and Plasma Etching Method. This invention was developed by Huang Qiwei, Liu Bo, Gao Jun, Zhang Jiahe and Liu Yanwei.
The patent application number is CN202410733693 20240606. The patent publication number is CN1210968..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Huanghu Test Technology (Shenzhen) has sought patent for Memory Chip Defect Processing Method and Memory Chip. This invention was developed by Zhang Hengjia, Ding Li, Wang Weizhou, Zeng Li, Xiao Hongli and Lai Junsheng.
The patent application number is CN202511642353 20251111. The patent publication number ..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Carbon Chip Microelectronics Tech Shenzhen Co Ltd has applied Chinese patent for Bridged Integrated Chip, DRAM and SOC System. Yang Xiaobo, Lu Jiang and Su Xiaofeng developed it.
The patent application number is CN202511197627 20250825. The patent publication number is CN121096403 (A). International Paten..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- SK Hynix has submitted a patent application for Memory Device and Method of Operating Memory Device. This invention was developed by Woo Chang-beom, Seo Moon-sik and Yun Dae-hwan.
The patent application number is CN202510169271 20250217. The patent publication number is CN121096400 (A). International Patent..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has released Xiamen Semiconductor Industry Tech Research And Development Co Ltd patent application for Reading Circuit of Memory and Operation Method. This invention was developed by Chen Anqiao, Qiu Taiwei and Su Xiaoli.
The patent application number is CN20251..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has received Micron Technology patent application for Apparatus and Method for Providing Memory Device Bleed Functionality. Vimercati Daniele developed the invention.
The patent application number is CN202510687489 20250527. The patent publication number is CN1210..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Micron Technology has submitted a patent application for Clock Transfer Circuitry for Multi-chip Ram. Mazumder Kallol developed the invention.
The patent application number is CN202510488533 20250418. The patent publication number is CN121096389 (A). International Patent Classification codes are G11C11/4076..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Macronix has sought patent for Memory Device and Computing Method. This invention was developed by Lyu Hanting.
The patent application number is CN202410784759 20240618. The patent publication number is CN121096388 (A). International Patent Classification codes are G06F7/498, G11C5/14, G11C7/10 and G11C7/..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Rongyao Terminal has submitted a patent application for Screen Control Method, Electronic Equipment, Chip System and Readable Storage Medium. This invention was developed by Wu Yuyao.
The patent application number is CN202411257315 20240530. The patent publication number is CN121096282 (A). International Pa..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Wuhan China Star Optoelectronics Semiconductor Display Technology has sought patent for Display Device and Electronic Terminal. This invention was developed by Li Bo and Wang Wei.
The patent application number is CN202511438370 20251009. The patent publication number is CN121096266 (A). International Pate..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has released Guojing Hechuang Qingdao Tech Co Ltd patent application for Display Chip Process Integration System. This invention was developed by Liu Kangzhong, Wang Shiyu, Lyu Yong, Cui Caoxiang, Zhang Chunyang, Guo Baijun and Zhang Fuxuan.
The patent applicati..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has released Spreadtrum Communications (Shanghai) patent application for Display Frame Adjusting Method and Device, Computer Equipment, Readable Storage Medium, Chip and Program Product. This invention was developed by Li Chenxi.
The patent application number is C..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Ledman Optoelectronic has applied Chinese patent for Display Substrate and Preparation Method Thereof. Li Mantie, Yu Liang, Yang Yihan, Liang Jinghao and Tu Menglong developed it.
The patent application number is CN202511555940 20251029. The patent publication number is CN121096233 (A). International Patent..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Rongyao Terminal has sought patent for Screen Lightening Method, Electronic Equipment, Chip System and Computer Readable Storage Medium. This invention was developed by Chen Pengming.
The patent application number is CN202410682757 20240528. The patent publication number is CN121092242 (A). International Pa..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Shenzhen Gosuncn Technology has submitted a patent application for Terminal Equipment Gnss Chip Adaptive Configuration Method and Device, and Terminal Equipment. This invention was developed by Zhang Bin, Xue Feng and Lu Zhao.
The patent application number is CN202511202675 20250826. The patent publication ..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Chipsea Technology Shenzhen has submitted a patent application for Computer Control Method, Chip and Electronic Equipment. This invention was developed by Zhou Zhensheng.
The patent application number is CN202510994559 20250718. The patent publication number is CN121092222 (A). International Patent Classifi..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Shanghai Feisi Information Tech Co Ltd has submitted a patent application for Equipment Firmware Updating System and Method Based on Power Management Chip. This invention was developed by Zhang Chao and Xu Yongxin.
The patent application number is CN202511162469 20250819. The patent publication number is ..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Pengxi Semiconductor Tech Beijing Co Ltd has submitted a patent application for Data Management Method, System and Device of Semiconductor Manufacturing Execution System and Medium. This invention was developed by Zhang Shaolong and Tian Liuqing.
The patent application number is CN202511605789 20251105. T..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Beijing Zhengdao Quantum Tech Co Ltd has submitted a patent application for Quantum Random Number Generator Chip Based on Phase Fluctuation. Zhang Lingsong, Xing Zhaolin, Shen Qidong, Lu Xuefeng, Xu Chengbao, Han Yaoyang and Gao Xiaobin developed the invention.
The patent application number is CN202511653..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Beijing Zhengdao Quantum Tech Co Ltd has applied Chinese patent for Quantum Random Number Generator Chip. Zhang Lingsong, Shen Qidong, Xing Zhaolin, Zhang Xiangang, Gao Chao and Gao Xiaobin developed it.
The patent application number is CN202511653231 20251112. The patent publication number is CN121092118..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Micron Technology has submitted a patent application for Managing Operations Performed Using Accelerators in Compute Fast Link (CXL) Memory Devices. Silvenathan Michael A developed the invention.
The patent application number is CN202510748953 20250606. The patent publication number is CN121092057 (A). In..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has published SanDisk Technologies patent application for Data Storage Device and Method for Garbage Collection in Multi-tier Memory. The invention was developed by Shenoy Meenakshi M and Muthiah Ramanathan.
The patent application number is CN202411616733 20241113..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Realtek Semiconductor Corporation has submitted a patent application for Electronic Device and Clock Signal Jitter Analysis Method. This invention was developed by Chen Yingjie, Yu Meili and Luo Youlan.
The patent application number is CN202410728374 20240606. The patent publication number is CN121091959 (A..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has published Chengdu Lipuxin Microelectronics Co Ltd patent application for Electric Vehicle Controller Interface Chip and Control System. The invention was developed by Zhong Rui, Jiang Haowen, Gao Xingbo and Lu Shixiong.
The patent application number is CN202..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Dingdao Zhixin (Shanghai) Semiconductor has submitted a patent application for Signal Processing Device, Signal Processing Method and Signal Processing Equipment. This invention was developed by Li Han and Dai Liang.
The patent application number is CN202511205236 20250826. The patent publication number i..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Yixin Micro Semiconductor Tech Shenzhen Co Ltd has filed a patent application for Electric Performance and Defect Synchronous Test System of Cowos Packaging TSV Interconnection Structure. This invention was developed by Zhou Yongqiang, Yan Yue, Li Li and Huang Ruiling.
The patent application number is CN2..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Chengdu Hua Yao Technology has sought patent for Double-station Radio Frequency Chip High-low Temperature High-speed Test Sorting Machine. This invention was developed by Zhang Dongmei, Wang Guohua, Li Zelin and Zhang Hua.
The patent application number is CN202511586519 20251101. The patent publication numb..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Jinzhou Kerui Microelectronic Co Ltd has sought patent for Power Supply Chip Test Method, System and Device and Storage Medium. This invention was developed by Shi Guohua, Quan Zhanzhong and Xiao Zheyu.
The patent application number is CN202511244250 20250902. The patent publication number is CN121091036 ..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Guangzhou Runxin Information Tech Co Ltd has submitted a patent application for Multi-channel Anti-interference Chip Test Method and Device, Equipment and Storage Medium. This invention was developed by Li Jianjun, Wang Xue, Yang Kunming, Wang Riyan, He Hongyin, Zhang Gong and Peng Heng.
The patent applic..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Taiwan Semiconductor Manufacturing has applied Chinese patent for Method for Deriving Real-time Failure Rate, Computer Readable Medium and Computer System. Yang Zhongjie and Wang Mingyi developed it.
The patent application number is CN202511125421 20250812. The patent publication number is CN121091030 (A). ..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has received Xian Peri Power Semiconductor Converting Tech Co Ltd patent application for Self-adaptive Binding Device for Gate (gate) Electrode of Semiconductor Module. Yu Qing, Qiao Yu, Rao Qiong, Li Gengsheng, Fan Chao, Gao Lunian, Wang Guochao and Yang Yu develo..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- NVIDIA has sought patent for Generative AI Using Logical Reasoning. This invention was developed by Krishnamani Krishnamurthy.
The patent application number is CN202510739748 20250604. The patent publication number is CN121094099 (A). International Patent Classification codes are G06F16/3329, G06F16/334, G0..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- 58th Research Institute of China Electronics Technology Corporation has filed a patent application for Model-adaptive AI Computing Chip Implementation Method. This invention was developed by Ying Lingkai, Yang Liang, Liang Donghan, Gu Yi, Song Fenghe and Xu Jingwen.
The patent application number is CN202511..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- NVIDIA has filed a patent application for Generative AI Model for Image Rendering and Reverse Rendering. This invention was developed by Wang Zian, Liang Ruofan, Ling Huan, Gojcic Zoran and Fiedler Stefan.
The patent application number is CN202510755172 20250606. The patent publication number is CN121094015..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Suzhou Akasuo Biological Science & Tech Co Ltd has applied Chinese patent for Method for Preparing Monodisperse Microspheres Based on Micro-fluidic Chip. Liu Teng, Zhou Xuemeng, Wu Baixuan, Chen Jiake, Jiang Tao and Bao Xiaofan developed it.
The patent application number is CN202410735049 20240607. The pa..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has released Shanghai Gailun Electronic Co Ltd patent application for Integrated Circuit Standard Cell Library Layout Quality Verification Method and System. This invention was developed by Chen Qi, Luo Zhihong, Solovyev Andrey and Liu Wenchao.
The patent applic..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has received Taiwan Semiconductor Manufacturing patent application for Layout Design Processing Method, Integrated Circuit Manufacturing System and Computer Readable Medium. Shen Youde, Chen Yongshun, Hayashi Yoshimasa, Lin Hongxiang, Dai Shuqin and Zhang Qiwen dev..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Huada Empyrean Tech Co Ltd has submitted a patent application for Method for Sharing Calculation Parameters in Large-scale Integrated Circuit Simulation. This invention was developed by Chang Liang, Xu Qidi, Kang Bo, Wu Dake and Zhou Zhenya.
The patent application number is CN202511275838 20250908. The pa..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Jiangsu Gutai Microelectronics Co Ltd has submitted a patent application for Power Consumption Prediction and Optimization Method in Chip Design. This invention was developed by Hu Weibo and Shi Fangmin.
The patent application number is CN20251145197 20250729. The patent publication number is CN121093872 ..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has published STMicroelectronics International patent application for Test Mode Reset Control Circuit. The invention was developed by Kumar Hemant and Kumar Nitish.
The patent application number is CN202510737940 20250604. The patent publication number is CN121093..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has published Haiguang Information Technology patent application for Integrated Circuit Chip Construction Method and Device, Storage Medium and Program Product. The invention was developed by Li Jianguo.
The patent application number is CN202511303774 20250912. Th..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Shanghai Cheyitian Technology has filed a patent application for Method and System for Optimizing Process Environment in Epitaxial Growth Reaction Cavity. This invention was developed by Liu Xinyang, Zhang Liming and Xing Chenchen.
The patent application number is CN202511630627 20251110. The patent publi..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has received Xinhuo Microtest Chengdu Tech Co Ltd patent application for Pre-loading Carrier Plate for Chip Ultrasonic Scanning Detector. He Qisong and Wu Yan developed the invention.
The patent application number is CN202511639371 20251111. The patent publicati..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- NuFlare Technology has sought patent for Pattern Inspection Device and Pattern Inspection Method. This invention was developed by Otaki Toshiaki and Hirano Ryoichi.
The patent application number is CN202510751594 20250606. The patent publication number is CN121090566 (A). International Patent Classification..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has published Guangdong Renmao Electronics Co Ltd patent application for Method and System for Rapidly Detecting Surface Defects of Silicon Carbide MOS (metal Oxide Semiconductor) Device. The invention was developed by Qiu Liang and Dou Jing.
The patent applicat..
Semiconductor
| Tue 21 Apr 2026
Beijing, April 22 -- Xiaomi Technology, Wuhan and Xiaomi Intelligent Home Appliance Wuhan Co Ltd has submitted a patent application for Defrosting Method of Air Conditioning Equipment, Air Conditioning Equipment, Device, Electronic Equipment and Chip. Yu Xiaxin developed the invention.
The patent application number is CN20251..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Beijing NAURA Microelectronics Equipment has applied Chinese patent for Gas Interlocking Equipment and Semiconductor Process Equipment. Zhang Zipeng and Ma Enze developed it.
The patent application number is CN202410718244 20240604. The patent publication number is CN121088973 (A). International Patent Clas..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has received Jiangsu Sanjing Semiconductor Mat Co Ltd patent application for Semiconductor Efficient and Stable Wafer Scribing Cleaning Solution and Preparation Method Thereof. Zhu Huachao developed the invention.
The patent application number is CN202511264158 ..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Shenzhen TCL High New Tech Development Co Ltd has submitted a patent application for Composite Material, Film and Quantum Dot Light Emitting Diode. Jiang Hua developed the invention.
The patent application number is CN202410736153 20240607. The patent publication number is CN121086784 (A). International P..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has received Shenzhen Sunyes New Mat Co Ltd patent application for Organic Silicon Sealant as Well as Preparation Method and Application Thereof. Xu Juanyu, Huang Jifeng, Wen Ming and Xu Huabin developed the invention.
The patent application number is CN20251176..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has published Dongguan Chaokang New Mat Co Ltd patent application for High-flame-retardant High-thermal-conductivity Low-viscosity Organic Silicon Pouring Sealant and Preparation Method Thereof. The invention was developed by Yao Zhuangzhuang.
The patent applica..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Chongqing Lihong Fine Chemicals Co Ltd has sought patent for Lithium Battery Silicon Negative Electrode Adhesive as Well as Preparation Method and Application Thereof. This invention was developed by Zhong Xingqiao, Yin Xi, Xia Jihe, Nie Zhenzhen, Xia Yinfeng and Liang Yuanpeng.
The patent application num..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Shanghai Yike Gas Co Ltd has applied Chinese patent for High-toughness Low-adhesive-residue Composite UV Film for Semiconductor Packaging and Preparation Method of High-toughness Low-adhesive-residue Composite UV Film. Yang Guancao, Hu Hongjie, An Chenni and Li Jianxin developed it.
The patent application..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Wujiang Kejie Electronic Co Ltd has submitted a patent application for Heat-insulating Silicon Resin Glass Fiber Sleeve and Preparation Method Thereof. This invention was developed by Xiao Jianyong.
The patent application number is CN202511419528 20250930. The patent publication number is CN121086667 (A)...
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Guangxi Nanning Weiyi Anti Corrosion Tech Co Ltd has submitted a patent application for Organic Silicon Heat-resistant Finishing Paint and Preparation Method Thereof. Li Jinqing, Li Changyong and Huang Zhagang developed the invention.
The patent application number is CN202511301147 20250912. The patent pu..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Suzhou Institute of Systems Medicine has filed a patent application for Coating, Compound Array Chip as Well as Preparation Method and Application of Compound Array Chip. This invention was developed by Lin Weilin, Chen Hao, Ma Ying, Dai Yushuang and Liang Junqi.
The patent application number is CN202511981..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has received Guangdong Hali New Mat Co Ltd patent application for UV Finish Paint Capable of Being Matched with Thermosetting Electroplating Primer and Application of UV Finish Paint. Cheng Wen, Hao Huiyuan and Huang Bixing developed the invention.
The patent ap..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Qingdao Besland Semiconductor Tech Co Ltd has submitted a patent application for Composite Material for Preparing Wafer Loader and Preparation Method Thereof. This invention was developed by Jian Dunliang, Jia Lingyan and Chen Yanbing.
The patent application number is CN202511330848 20250917. The patent p..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Guangdong Leyuan Chemical Material Tech Co Ltd has sought patent for Ultrathin Organic Silicon Gasket Filler Composition and Ultrathin Organic Silicon Gasket. This invention was developed by Xu Zuming, Huang Yuanbiao and Li Xiyi.
The patent application number is CN202511108207 20250808. The patent publica..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has published Zhejiang Sanshiji New Material Tech Co Ltd patent application for Silicon Dioxide Powder for Reducing Dielectric Loss as Well as Preparation Method and Application of Silicon Dioxide Powder. The invention was developed by Li Wen, Pan Ting, Wang Ke, Sh..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has published Harbin Institute of Technology and Beijing Institute of Astronautical Systems Engineering patent application for Preparation Method of High-temperature-resistant and Heat-insulating Silicon Dioxide-phthalocyanine Hybrid Foam Material. The invention wa..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has released Guangdong University of Technology and Jieyang Sub Center Chemie and Fine Chemical Guangdong Province Laboratory patent application for Organic Silicon Prepolymer Modified Polyester Resin and Preparation Method Thereof. This invention was developed by ..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Xiaomi Automobile Technology has submitted a patent application for Vehicle Control Method and Device, Vehicle, Medium, Program Product and Chip System. This invention was developed by Zhang Jia and Wang Yunhong.
The patent application number is CN202511470815 20251014. The patent publication number is CN12..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has released Suzhou Parino Tech Co Ltd patent application for Semiconductor Chip Chemical Grinding Fluid Supply Method. This invention was developed by Wu Hongwei.
The patent application number is CN202511263944 20250905. The patent publication number is CN12108..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Hwatsing Beijing Tech Co Ltd has submitted a patent application for Grinding Wheel Self-sharpening Enhancement Method and Device and Wafer Thinning Equipment. Shen Wuqi, Li Sen and Liu Yuanhang developed the invention.
The patent application number is CN202511307082 20250526. The patent publication number..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has received Yanghua Zhizao Sichuan Innovation Tech Co Ltd patent application for Polishing Head for Cooperatively Pressurizing Master and Slave Partitions and Application of Polishing Head in Wafer Polishing. Jiang Liang, Zhou Liao and Wei Yuting developed the inv..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has released Shaanxi Qiwu Shijie Tech Co Ltd patent application for Polishing Device for Plastic Packaging Chip and Coring Method. This invention was developed by Duan Chengang, Liu Jing, Liu Qingyuan, Wang Zhenxing, Duan Chenfei, Xue Kexin and Wang Zhenhua.
The..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Zhejiang Jibao Intelligent Equipment has filed a patent application for Energy-saving Inclined Numerical Control Machine Tool Chip Removal Device and Method. This invention was developed by Xia Ping.
The patent application number is CN202511182567 20250822. The patent publication number is CN121083379 (A). ..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has released Jiangsu Chuangyi Prec Forging Co Ltd patent application for Cold Forging Forming Process for Red Copper IGBT (insulated Gate Bipolar Translator) Radiating Substrate. This invention was developed by Chen Xuefeng, Nie Xiangyi, Zhu Jun and Zhang Chaozhong..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Shenzhen Yufeng Tech Co Ltd has applied Chinese patent for Machining Method for Rotary Disc of Wafer Conveying Mechanical Arm. Xu Jinlong, Shu Cong, Chen Wen, Wei Xing and He Ming developed it.
The patent application number is CN202511402017 20250928. The patent publication number is CN121083271 (A). Inte..
Semiconductor
| Wed 22 Apr 2026
Canberra, April 22 -- Australian Patent Office has released Trina Solar patent application for Passivated Contact Structure and Preparation Method Thereof, and Solar Cell and Preparation Method Thereof. This invention was developed by Liu Chengfa, Lv Dongyun, Chen Daming, Chen Hong, Wang Zigang and Liu Wei.
The patent applicati..
Semiconductor
| Wed 22 Apr 2026
Canberra, April 22 -- OMICRON Electronics has submitted a patent application for Method for Testing a Wiring of an Electrical Installation. Schmidbauer Josef developed the invention.
The patent application number is AU20240259761 20241106. The patent publication number is AU2024259761 (A1). International Patent Classification..
Semiconductor
| Wed 22 Apr 2026
Canberra, April 22 -- Stora Enso has sought patent for a Method for Manufacturing a Pha Coated Fiber-based Substrate with a First and a Second PHA Aqueous Coating Compositions and a Fiber-based Substrate Coated with the Method. This invention was developed by Heiskanen Isto, Backfolk Kaj, Lyytikäinen Katja and Nyflött Åsa.
..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has received Infineon Technologies patent application for Radio Frequency Package and Manufacturing Method Thereof. Eldoll Thilo and Seler Ernst developed the invention.
The patent application number is CN202510743625 20250605. The patent publication number is CN1..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has received CRRC Zhuzhou Institute and Crosschip Microsystems Inc patent application for Packaging Structure of Magnetic Isolation Chip. Liu Haitao, Lin Zhenjun, Zhou Simin, Qian Cheng, Zhang Chu, Chen Zhongzhi, Cao Kai, Li Weibin and Ouyang Qingfeng developed the..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has published Wuyuan Semiconductor Tech Qingdao Co Ltd patent application for Heterogeneous Integrated Packaging Structure and Preparation Method Thereof. The invention was developed by Ye Biao, Zhang Yu, Yan Tiancai, Yang Lieyong and Chen Weiyu.
The patent appl..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Shenzhen Pengxinwei Integrated Circuit Manufacturing has sought patent for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Zhang Jianxiong, Li Jun and Zhu Zhenyuan.
The patent application number is CN202411703077 20241125. The patent publication number is CN121096..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has published Vanchip (Tianjin) Electronic Technology patent application for Package Substrate and Manufacturing Method Thereof. The invention was developed by Mi Duoduo and Lu Xiaoli.
The patent application number is CN202511419281 20250929. The patent publicatio..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Ningbo Cuijin Tech Development Co Ltd has submitted a patent application for To247 Packaging Structure Meeting Creepage Distance Based on Copper-clad Ceramic Substrate. This invention was developed by Fang Lei, Yang Yuandi and Lee Min-ju.
The patent application number is CN202511297541 20250911. The paten..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Xinai Tech Nanjing Co Ltd has submitted a patent application for High-binding-force Bottom Filling Packaging Substrate and Manufacturing Method Thereof. This invention was developed by Xie Linyan and Chen Yingru.
The patent application number is CN202511280244 20250909. The patent publication number is CN..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Institute of Microelectronics, CAS has filed a patent application for Glass Substrate Structure and Manufacturing Method Thereof. This invention was developed by Yu Zhongyao, Wang Qidong, Wu Xiaomeng, Yang Fang, Zhang Xu, Fang Zhidan, Ding Shanjun and Anzai Akira.
The patent application number is CN20251124..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Institute of Microelectronics, CAS has applied Chinese patent for Glass Substrate Structure and Semiconductor Packaging Substrate. Yu Zhongyao, Yang Fang, Zhang Xu, Wu Xiaomeng, Anzai Akira, Chen Chuan, Fang Zhidan, Wang Qidong and Ding Shanjun developed it.
The patent application number is CN202511241122 2..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- State Intellectual Property Office of China has received Chengdu Tiancheng Dianke Tech Co Ltd patent application for W-band Cbga Packaging Vertical Transition Structure Based on Htcc. Fang Yong, Liu Wei and Guo Qi developed the invention.
The patent application number is CN202511206254 20250827. The paten..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Chengdu Yixin Tech Co Ltd has applied Chinese patent for Packaging Substrate High-speed Signal Line Wiring Structure for Coping with BGA Solder Ball Impedance Abrupt Change. Wang Ruihuan, Chen Raosuo, Zhang Yang, Wang Yuqiao and Li Zhengshen developed it.
The patent application number is CN202410741887 20..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Infineon Technologies has submitted a patent application for Low Profile Power Module. Ludwig Matthias, Nottelmann Ralf, Schmer Andreas, Acuna James and Thiessen Nicolas developed the invention.
The patent application number is CN202510734282 20250604. The patent publication number is CN121096986 (A). Inter..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Niko Semiconductor has applied Chinese patent for Circuit Substrate Assembly and Power Module. Yang Huiqiang, Leng Zhongming, Hsieh Chih-cheng, Wang Weilun and Huang Pinrui developed it.
The patent application number is CN202410737451 20240607. The patent publication number is CN121096985 (A). International..
Semiconductor
| Wed 22 Apr 2026
Beijing, April 22 -- Beijing Chaoxian Memory Research Institute has filed a patent application for Semiconductor Unit, Semiconductor Device, and Electronic Apparatus. This invention was developed by Li Shuai, Liang Jing, Huang Long and Zhang Jing.
The patent application number is CN202410726010 20240605. The patent publication ..
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