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Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Zhenhe Tech Jiangsu Co Ltd patent application for Chip Bi Electrical Performance Aging Test Method and System. This invention was developed by He Junming, You Li, Gao Xiansheng and Cao Ziyan.
The patent application number is CN202510799876 20250616. ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Jiangsu Xinyuan Semiconductor Co Ltd has sought patent for Chip Aging Test and Analysis Method. This invention was developed by Yin Guohai, Jin Weijun and Liu Xiaojie.
The patent application number is CN202510393768 20250331. The patent publication number is CN120314748 (A). International Patent Classifica..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Kingsemi Japan Co Ltd has submitted a patent application for Semiconductor Manufacturing Device. This invention was developed by Otani Masami and Chen Zhengdao.
The patent application number is WO2025JP04781 20250213. The patent publication number is WO2026018476 (A1). International Patent Classification co..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Res Association For Advanced Systems has applied WIPO patent for Semiconductor Module. Kawano Masaya and Kuroda Tadahiro developed it.
The patent application number is WO2025JP14935 20250416. The patent publication number is WO2026018508 (A1). International Patent Classification code is H04B5/40.
The ab..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Yamaha Robotics Holdings Co Ltd and Kurita Water Industries have filed a patent application for Semiconductor Device Bonding Method. This invention was developed by Kikuchi Hiroshi, Tobari Yuta, Hishinuma Hayato, Ri Kinn and Ida Junichi.
The patent application number is WO2025JP22900 20250625. The patent pu..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Fortaegis Tech Holding BV has submitted a patent application for Secure Memory Transfer in a Network of Controllable Physical Unclonable Function Devices. This invention was developed by Makkes Marc Xander.
The patent application number is WO2025EP69721 20250710. The patent publication number is WO202601753..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has received GlobalWafers Co Ltd and Liu Qingmin patent application for Fdsoi Structures and Methods for Preparing Fdsoi Structures. The patent application number is WO2025US37891 20250716. The patent publication number is WO2026019906 (A1). Cooperative Patent Classific..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- Fudan University and Shanghai Integrated Circuit Manufacturing Innovation Center have sought patent for Sensing-storage-computing-integrated Neuromorphic Device and Fabrication Method Therefor. This invention was developed by Meng Jialin, Wang Tianyu, Chen Lin, Sun Qingqing and Zhang Wei.
The patent applica..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has released Cloud Intelligence Assets Holding Singapore Private Ltd and Hangzhou Alicloud Apsara Information Technology patent application for Memory Expansion System and Method, Switch, and Memory Pool. This invention was developed by Chen Hongxin.
The patent appli..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Suzhou Qiancheng New Energy Tech Co Ltd has submitted a patent application for SOC Adjustment Method and Apparatus, and Computer-readable Storage Medium. This invention was developed by Zhang He, Xiao Liujie and Tian Kang.
The patent application number is WO2025CN103416 20250625. The patent publication numb..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- LumiLEDs Singapore Pte Ltd and LumiLEDs have submitted a patent application for Monolithic LED Array and Method of Manufacturing Thereof. This invention was developed by Basin Grigoriy, Fouksman Mikhail, Lesch Norbert and Spinger Benno.
The patent application number is WO2025US37560 20250714. The patent pub..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- Suzhou Uigreen Micro & Nanotechnology Co Ltd has applied WIPO patent for MEMS Probe. Qian Xiaochen and Fu Changyong developed it.
The patent application number is WO2024CN138040 20241210. The patent publication number is WO2026016387 (A1). International Patent Classification codes are G01R1/067, G01R1/073 a..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- Chengdu Geehy Tech Co Ltd has submitted a patent application for Current Comparison Circuit, Control Chip, and Master-slave System. This invention was developed by Mei Dinglei and Huo Xianjie.
The patent application number is WO2025CN97339 20250527. The patent publication number is WO2026016638 (A1). Intern..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- NTT Innovative Devices Corp has submitted a patent application for Light-receiving Device. Muramoto Yoshifumi, Shimizu Makoto and Ishibashi Tadao developed the invention.
The patent application number is WO2025JP25516 20250716. The patent publication number is WO2026018884 (A1). International Patent Classif..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- MMT Co Ltd has submitted a patent application for Reaction By-product Collection Apparatus. This invention was developed by Cha Il Soo, Kim Yong Yun and Bae Ji Ho.
The patent application number is WO2025KR10525 20250717. The patent publication number is WO2026019272 (A1). International Patent Classification..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Jinan Institute of Quantum Technology and Hefei Nat Laboratory patent application for Superconducting Chip Micro-nano Machining Side Wall Inclination Angle Measuring Method, Device and Equipment and Medium. This invention was developed by Liu Yuqi, Su F..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Xiaomi Technology, Wuhan, Xiaomi Intelligent Home Appliance Wuhan Co Ltd and Beijing Xiaomi Mobile Software patent application for Control Method and Device of Air Conditioning Equipment, Electronic Equipment, Chip and Medium. This invention was develop..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Shaanxi Landun Chuangzhan Door Ind Co Ltd patent application for Insulating Hanging Device for Electroplating of Steel Fireproof Door. This invention was developed by Wang Siliang and Liu Jianfeng.
The patent application number is CN202510706410 2025..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Zhejiang Nanci Ind Co Ltd patent application for Microwave-assisted Chemical Vapor Deposition Composite Coating Process for Neodymium-iron-boron Magnet. This invention was developed by Bao Feng, Jia Zhiqiang, Jin Jin and Zheng Xiaolan.
The patent app..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Hangzhou Dianzi University and Hangzhou Vocational & Technical College patent application for ALD Equipment Integrating Rotary Lifting Substrate and Self-cleaning Valve. This invention was developed by Song Kai, Liang Suxia, Jiang Yunlei, Li Jiahong, Ta..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has released GlobalWafers Co Ltd and Bhagavat Sumeet S patent application for Cleaving Systems and Methods for Cleaving Semiconductor Structures by Combined Thermal and Mechanical Stress Induction. This invention was developed by Bhagavat Sumeet S, Luter William L and A..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has released Niterra Mat Co Ltd patent application for Ceramic Substrate, Ceramic Joined Body, and Semiconductor Device. This invention was developed by Aoki Katsuyuki and Yamagata Yoshihito.
The patent application number is WO2025JP25628 20250717. The patent publica..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has released Genvia patent application for Component for Solid Oxide Electrochemical Devices, Comprising a Metal Substrate Coated with a Ceramic Layer. This invention was developed by Amsellem Olivier and Bestautte Jolan.
The patent application number is WO2025EP6983..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has released Beijing Aurasky Electronics Co Ltd patent application for Electrostatic Chuck Power Supply and Semiconductor Process Device. This invention was developed by Zhang Yu, Kang Chenguang, Li Yuzhan, Wang Songtao and Ge Jun.
The patent application number is WO..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has released Wuxi Leadpro Tech Co Ltd patent application for Substrate In-situ Detection System and In-situ Detection and Transfer Method Therefor. This invention was developed by Yu Xiang.
The patent application number is WO2025CN96174 20250521. The patent publicati..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Hospital Affiliated To Fuzhou Univ patent application for Preparation Method of Flexible SERS (surface Enhanced Raman Scattering) Substrate of Ascorbic Acid Circulating Negative Silver Bacterial Cellulose Membrane and Application of Flexible Sers Substr..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd patent application for Method for Bonding Single Crystal Silicon Rod with Crystal Orientation Below 150cm. This invention was developed by Liu Xiaoping, Cao Qigang, Yang Kai, Wang Liguang, Zhang Yankun..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Xiamen Baoshili Dustless Tech Co Ltd patent application for PTFE (polytetrafluoroethylene) Bar Cutting Machine Tool with Chip Suction Function. This invention was developed by Ma Chuanshun and Deng Huaqing.
The patent application number is CN20251054..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Zhuhai Fangweicheng Semiconductor Mat Co Ltd patent application for Automatic Grinding Equipment for Gallium Nitride Multi-wafer Wafer. This invention was developed by Jia Zhou, Wang Bin, Du Zhixing, Xu Yuan, Yan Haifeng, Dong Yinkuan, Lan Haiyun and Yu..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Jingxin Semiconductor Huangshi Co Ltd patent application for CMP Polishing Machine for Semiconductor Wafer and Polishing Method. This invention was developed by Tao Sheng, Zhang Xiaochun, Dai Weiting, Lu Chenglong and Zhang Yinfeng.
The patent applic..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Jiangnan Institute Computing Tech patent application for Wafer-level Chip Simulation Method, Device and Equipment and Storage Medium. This invention was developed by Wang Liyi, Hu Xiahui, Liu Qinglin and Wu Yingying.
The patent application number is ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Zhejiang University and Zhejiang Cuizhan Microelectronic patent application for Modeling and Optimizing Method for Thermal Resistance Network of High-power Semiconductor Module. This invention was developed by Yin Wenyan, Zhang Yu, Chen Zhiyuan, Yang Ka..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Huacai Luminous Energy Tech Yunnan Co Ltd and Yunnan University patent application for Passivation Method of Large-area Perovskite Solar Cell. This invention was developed by Zhang Wenhua, Xie Lin, Wu Bin, Zhai Jiaxue and Chen Jiayan.
The patent appl..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Guangzhou Research Institute Of Xidian University and Xidian University patent application for Enhanced N-type Two-dimensional Transistor Based on P-type Diamond Film and Preparation Method Thereof. This invention was developed by Feng Xin, Song Suwen, ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Hangzhou Yongxie Tech Co Ltd patent application for Ap or Sta Simulator Based on Real Chip and Test Method Thereof. This invention was developed by Zhang Yuntao, Zeng Huaqing, Ma Changchun and Hou Min.
The patent application number is CN202510556549 ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Shanghai Xinheng Electronic Tech Co Ltd patent application for Intelligent Chip Mounting Equipment Applied to Integrated Circuit Manufacturing and Control System of Intelligent Chip Mounting Equipment. This invention was developed by Ge Shixiang.
The..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Shenzhen Limeituo Tech Co Ltd patent application for Display Performance Optimization Method and System of OLED Screen and Computer Readable Storage Medium. This invention was developed by Dai Tieguang.
The patent application number is CN202510617966..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has released Heilongjiang Smart Interconnection Traffic Tech Co Ltd patent application for Internet of Vehicles Intelligent Traffic Flow Regulation and Control Method and System Based on ETC Chip. This invention was developed by Lin Ying, Wu Jialong and Chen Mingrui..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Suzhou Lasuo Biochip Tech Co Ltd patent application for Feature Extraction Method, System and Equipment for Microbeads in High-density Gene Chip and Medium. The invention was developed by Liu Chaojun, Liu Ruoyu, Xu Jian and Xu Xinyi.
The patent appl..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Anhui North Microelectronics Res Institute Group Co Ltd patent application for Manufacturing Method of TSV (through Silicon Via) with Horn Mouth Shape. The invention was developed by Zhang Shengbing and Yu Lei.
The patent application number is CN202..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Anhui Microchip Changjiang Semiconductor Mat Co Ltd patent application for Method for Optimizing Geometric Surface Type of Silicon Carbide Cutting Blade. The invention was developed by Yao Zhiyong, Jiang Chengchen and Chen Haibing.
The patent applic..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has published Anycasting Co Ltd and Kim Sungbin patent application for Double-sided Plating Jig and Substrate Through-hole Filling Device Including Same. The invention was developed by Kim Sungbin and Kim Myungjun.
The patent application number is WO2025KR10400 20250..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has published BOE Tech Group Co Ltd and Chengdu BOE Optoelectronics Technology patent application for Display Substrate and Display Apparatus. The invention was developed by Wang Yangpeng, Dong Tian and Liu Libin.
The patent application number is WO2025CN103263 20250..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has published Xi'an ESWIN Material Tech Co Ltd and Xi'an ESWIN Silicon Wafer Technology patent application for Support Structure for Epitaxial Growth Apparatus, Epitaxial Growth Apparatus and Epitaxial Wafer. The invention was developed by Liang Penghuan.
The patent..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Chengdu Pro Microwave Electronic Tech Co Ltd patent application for Epitaxial Structure, Preparation Method Thereof and Communication Chip. The invention was developed by Yin Yuzhe, He Li and Zhao Guangyu.
The patent application number is CN20251045..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Ganghua Energy Chuangke Shenzhen Co Ltd patent application for Perovskite Solar Cell and Preparation Method Thereof. The invention was developed by Du Yixuan, Wu Xiaoxue, Zhou Chuanzhe, Tan Junyi, Zhou Jun, Huang Liang, Shi Yuxian, Zhang Tengfei and Zh..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Beijing BOE Technology Development and BOE Technology Group patent application for Semiconductor Device, and Method and Apparatus for Manufacturing Semiconductor Device. The invention was developed by Meng Hu.
The patent application number is CN2024..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has published Femtum Inc patent application for Photonic Chip Having a Guiding Structure and a Surrounding Cladding Matrix, and Method of Modifying Same. The invention was developed by Berube Jean-philippe, Robichaud Louis-rafaël and Duval Simon.
The patent applicat..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Guangdong Leadyo Ic Testing Co Ltd patent application for Testing Board Card Cooling Device for Chip Testing Machine. The invention was developed by Hayashi Nozomu, Zhang Yifeng, Yuan Jun, Sun Xiaohui and Cao Helei.
The patent application number is ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Guanghua Science And Tech Research Institute Guangdong Co Ltd, Guangdong Guanghua Sci Tech Co Ltd and Guangdong Toneset Science & Tech Co Ltd patent application for Method for Filling and Plating Metal in Through Hole of Substrate. The invention was de..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Beijing Huadian Zhongxin Tech Co Ltd patent application for Multi-path Network Interface Extension System of Communication Chip and Communication Chip. The invention was developed by Liu Nian, Zhang Weitian and Chen Wen.
The patent application numbe..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Hoya, Hoya Electronics Korea Co Ltd, Hoya Optoelectronic Taiwan Co Ltd and Chongqing Maite Photoelectric Co Ltd patent application for Phase Shift Mask and Manufacturing Method of Display Device. The invention was developed by Ma Bengang and Kanetani K..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Lingang Nat Laboratory patent application for Device Interconnection Method and Semiconductor Apparatus. The invention was developed by Shi Zhicheng, Guo Xiliang, Tao Kai and Li Chengyu.
The patent application number is CN202510533888 20250425. The ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Heilongjiang University and China Electronics Tech Group Corporation No. 49 Research Institute patent application for MEMS Gas Flow Chip. The invention was developed by Liu Zhihui, Zhao Xiaofeng, Li Zixu, Li Tao, Liu Xingyu, Wang Yonggang, Chen Jing an..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has published Guangzhou Zhongge Electronic Tech Co Ltd patent application for Fm-index Calculation Acceleration Device Based on FPGA Chip. The invention was developed by Park Young-ho and Wang Changli.
The patent application number is CN202510470565 20250415. The..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Topped Person Tianmen Pump Co Ltd patent application for Anti-corrosion Silicon Carbide Ceramic Pump. Wu Dengwen, Liu Yang, Wang Chao and Sheng Yu developed the invention.
The patent application number is CN202510509525 20250422. The patent publicati..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Quzhou Dongfang Special Steel Co Ltd patent application for High-efficiency Smelting Method for Semiconductor Ultra-pure Steel Capable of Accurately Regulating and Controlling Components. Chen Zhihao, Chang Junyong and Chen Haitong developed the inventi..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Guangdong Mingju New Material Tech Co Ltd patent application for Polyurethane-based Thermoplastic Organic Silicon Elastomer as Well as Preparation Method and Application Thereof. Wang Jiqiang, Chen Pingxu, Luo Yongquan, Tian Zhongtao, Zhu Jianfeng and L..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Chaozhou Yuechao Innovation Tech Consulting Co Ltd patent application for Preparation Process of Silicon Nitride Ceramic Material. Lin Jia, Lai Hang and Liu Shengdong developed the invention.
The patent application number is CN202510663682 20250522. ..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has received Tokyo Electron Ltd and Tokyo Electron US Holdings patent application for Substrate Processing System Using an Optical Pattern. Maleev Ivan developed the invention.
The patent application number is WO2025US22819 20250402. The patent publication number is ..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has received Flexell Space Co Ltd patent application for Thin-film Solar Cell Device, Thin-film Solar Cell Module, and Manufacturing Method Thereof. Noh Shin Young and Ahn Tae Hun developed the invention.
The patent application number is WO2025KR07423 20250530. The p..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has received Brilliance BV patent application for Improved Photonic Integrated Circuit and Method for the Fabrication Thereof. Geuzebroek Douwe Harmen, Frentrop Raimond, Dekker Ronald, Tiek Tim and Drost Edwin Wilco developed the invention.
The patent application num..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has received Alivedx Suisse SA patent application for Compositions and Methods for Immobilising DFS70 on a Substrate. Ataman Yasemin and Van Den Bogaard Patrick developed the invention.
The patent application number is WO2025EP70642 20250718. The patent publication n..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- World Intellectual Property Organization has received BOE Tech Group Co Ltd and Beijing BOE Sensor Technology patent application for Photoelectric Conversion Substrate and Flat Panel Detection Apparatus. Li Jinyu, Pang Fengchun, Du Qingxin, Yu Haibo, Geng Yue, Ming Zhenxing and Zhang Peng developed the inventi..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Tianshui Tianguang Semiconductor Co Ltd patent application for Data Processing Method and Device for Cache in Chip Design. Zhao Min, Gao Yanping, Shang Zean, Wen Yeye, Lu Yu, Pu Yaochuan and Li Wenjun developed the invention.
The patent application n..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Zhuhai Print Rite Microelectronics Co Ltd patent application for Consumable Chip and Instruction Processing Method Thereof, Consumable Container and Printing Equipment. Wen Guanguo, Luo Shoujie, Liao Jiansheng, Pan Huifeng, Yang Haihuo and Xie Guangyu d..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Kungao Xinxin Microelectronics Jiangsu Co Ltd patent application for System-level Fault and Anomaly Detection and Management Method and Device of Vehicle-mounted Ethernet Chip and Storage Medium. Zhou Yuqian, Zheng Haidong and Guan Jinxin developed the ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Guangdong Xinyueneng Semiconductor Co Ltd patent application for Adjusting Method of Photoresist Angle in Photoetching Process and Preparation Method of Silicon Carbide Chip. Huang Tao developed the invention.
The patent application number is CN20251..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Beijing Yanhuang Guoxin Tech Co Ltd patent application for Method and System for Dynamically Adjusting Driving Rate of Power Management Chip. Wang Huidong, Li Jianwei and Wang Caibao developed the invention.
The patent application number is CN2025107..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Tuoer Microelectronics Co Ltd patent application for Self-adaptive Detection Comparison Circuit and Chip. Mu Siyu and Shi Pengju developed the invention.
The patent application number is CN202510339763 20250321. The patent publication number is CN120..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Xiaoduan Shenzhen Computing Tech Co Ltd patent application for Semiconductor Structure Based on 3D Packaging, Packaging Method and Semiconductor Device. Zheng Shengwei and Bai Dawei developed the invention.
The patent application number is CN20241075..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Tengyun Chuangxin Semiconductor Mat Shanghai Co Ltd patent application for Preparation Method of Fd-soi Substrate Structure Through Multi-channel Ion Implantation Process. Chen Minteng and Yang Xiujing developed the invention.
The patent application ..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Hangzhou First Applied Material has filed a patent application for Photocuring Insulation Paste Composition, Photocuring Insulation Paste and Application. This invention was developed by Cui Xuetao, Zhou Hongtao and Mei Yunxiao.
The patent application number is CN202510385126 20250328. The patent publicati..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received ACM Research, Shanghai and Shengwei Semiconductor Equipment Shanghai Co Ltd patent application for Substrate Box Storage Device, Working Method and Substrate Processing Equipment. Xu Chuangwei, Jia Shena and Zhang Dahai developed the invention.
The p..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Core Microelectronics Equipment Xiamen Co Ltd patent application for Wafer Detection Equipment and Wafer Detection Method. Hu Junlin, Zheng Longjie and Sun Huimin developed the invention.
The patent application number is CN202510789713 20250613. The ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Shanghai Ceyong Automation Tech Co Ltd patent application for Silicon Steel Sheet Preparation Method and Equipment Based on Silicon Steel Sheet Lamination System. Zhu Difei and Liu Xingyu developed the invention.
The patent application number is CN20..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- State Intellectual Property Office of China has received Nke Fa&robot Wuxi Co Ltd patent application for Encoder Chip Sensor Calibration Detection Platform. Zheng Feng, Zhang Jun, Guo Taolei, Wu Songling, Zou Hai and Lu Songjie developed the invention.
The patent application number is CN202510478068 202504..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Southwest Petroleum University has filed a patent application for SiC Particle Reinforced Aluminum-based Composite Material and Preparation Method Thereof. This invention was developed by Yan Jikang, Liu Jiangshan, Zhang Runzi, Leng Manxi, Zhao Jianhua, Wang Biao and Yi Senlin.
The patent application numbe..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Jiaxing University has sought patent for Dense Video Description Method Based on Multi-modal Memory Knowledge. This invention was developed by Li Yonggang, Fang Haojie, Cao Zongrui, Ye Lihua, Wei Yuanwang, Gong Xunwei and Liu Yanmei.
The patent application number is CN202510540965 20250427. The patent publ..
Semiconductor
| Tue 27 Jan 2026
Geneva, Jan. 27 -- Chengdu Geehy Tech Co Ltd has sought patent for Leakage Compensation Circuit, Crystal Oscillator Circuit, and Microprocessor Chip. This invention was developed by Zhong Jiale, Mei Dinglei and Wang Feng.
The patent application number is WO2025CN107449 20250708. The patent publication number is WO2026016931 (..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Chongqing Xinlian Microelectronic Co Ltd has sought patent for Dielectric Layer Removing Method, Gate Structure Forming Method and Semiconductor Structure. This invention was developed by He Deyan, Ye Ronghong and Chen Yingru.
The patent application number is CN202510373037 20250327. The patent publication..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Shenzhen Jieshengwei Semiconductor Co Ltd has sought patent for Flash Memory Chip. This invention was developed by Yang Jiebin.
The patent application number is CN202510511960 20250423. The patent publication number is CN120321960 (A). International Patent Classification codes are H01L23/04, H01L23/10, H01..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Hefei Chipsea Electronic Tech Co Ltd has sought patent for Push-pull Output Circuit, Chip and Electronic Equipment. This invention was developed by Ye Xuefeng and Liu Shuaifeng.
The patent application number is CN202510391082 20250331. The patent publication number is CN120320765 (A). International Patent ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- 3peak Incorporated has sought patent for High-voltage Driving Circuit and Chip. This invention was developed by Cao Jianwen.
The patent application number is CN202510391782 20250331. The patent publication number is CN120320750 (A). International Patent Classification codes are H03K17/06 and H03K17/687. Co..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Tonson Tech Automation Equipment Co Ltd has sought patent for Large-cavity Plasma Processing Equipment. This invention was developed by Wang Zhaoyang.
The patent application number is CN202510799119 20250616. The patent publication number is CN120319650 (A). International Patent Classification codes are B0..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Futeng Hebei Energy Saving Tech Co Ltd has applied Chinese patent for Composite Interlayer High-efficiency Energy-saving Hollow Glass Based on Silicon Dioxide Aerogel. Jin Chenglong, Zhang Manren, Han Wei and Tian Wenming developed it.
The patent application number is CN202510811418 20250618. The patent pu..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Huzhou Jinye Surface Tech Co Ltd has applied Chinese patent for High-wear-resistance and Corrosion-resistance Quick-release Pin Surface Electroplating Equipment and Electroplating Process Thereof. Jin Jianzhong, Xu Yongjiang and Jin Liqian developed it.
The patent application number is CN202510603312 20250..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Suzhou Fulaiyige Sealing Tech Co Ltd has sought patent for High-sealing-performance Semiconductor Sealing Ring and Preparation Method and Vulcanizing Machine Thereof. This invention was developed by Zhang Xinli.
The patent application number is CN202510299743 20250314. The patent publication number is CN12..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Jinbao Composite New Material Tech Wuxi Co Ltd has sought patent for Suspended Conveying Device for Electroplating Surface of Automobile Workpiece. This invention was developed by Hou Jinsong and Xi Jiafeng.
The patent application number is CN202510451875 20250411. The patent publication number is CN120308..
Semiconductor
| Mon 26 Jan 2026
Geneva, Jan. 27 -- Suzhou Uigreen Micro & Nanotechnology Co Ltd has applied WIPO patent for Mems-based Wafer Test Probe. Qian Xiaochen and Fu Changyong developed it.
The patent application number is WO2024CN138656 20241212. The patent publication number is WO2026016390 (A1). International Patent Classification code is G01R1/0..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Wondersolar Co Ltd has applied Chinese patent for Curved-surface Perovskite Solar Cell and Preparation Method Thereof. Sheng Yusong, Peng Yishu, Liu Shuang, Chen Xiayan and Jiang Youyu developed it.
The patent application number is CN202510444099 20250410. The patent publication number is CN120322089 (A). ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Hangzhou Xinju Semiconductor Co Ltd has applied Chinese patent for Micro LED Chip Packaging Structure and Preparation Method. Li Qing, Li Jin, Zhao Ke and Yue Han developed it.
The patent application number is CN202510803987 20250617. The patent publication number is CN120322081 (A). International Patent C..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Jiangsu Xingang Semiconductor Co Ltd has applied Chinese patent for Manufacturing Method of Si-based Depletion Mode Hemt Epitaxial Wafer. Bai Junchun, Cheng Bin and Jia Yong developed it.
The patent application number is CN202510515902 20250423. The patent publication number is CN120321978 (A). Internation..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Fuzhou Pujing Semiconductor Co Ltd has applied Chinese patent for Dew Detection Device for Chip Testing. Wang Zhaomeng developed it.
The patent application number is CN202510692582 20250527. The patent publication number is CN120314758 (A). International Patent Classification codes are G01R1/02 and G01R31/..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Aiwei Jiangsu Power Electronics Co Ltd has applied Chinese patent for E-comp and PTC Two-in-one Power Semiconductor Device. Zhang Liangjun developed it.
The patent application number is CN202510467086 20250415. The patent publication number is CN120319742 (A). International Patent Classification codes are ..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Tengyun Chuangxin Semiconductor Mat Shanghai Co Ltd has applied Chinese patent for Preparation Method of Fd-soi Substrate Structure Through Hydrogen, Carbon and Germanium Ion Implantation Process. Chen Minteng and Yang Xiujing developed it.
The patent application number is CN202510561772 20250430. The pate..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Hypersics Semiconductor Co Ltd has applied Chinese patent for Electrochemical Cleaning Method for Removing Organic Matters on Surface of Silicon Carbide Wafer. Liu Xinyu and Yuan Zhenzhou developed it.
The patent application number is CN202510564125 20250430. The patent publication number is CN120319659 (A..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 27 -- Silicon Motion Tech Corp has applied Chinese patent for Data Storage Device, Data Storage Medium and Data Refreshing Method. Wu Hongyi developed it.
The patent application number is CN202411302487 20240918. The patent publication number is CN120319291 (A). International Patent Classification code is G11C16..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Shenzhen Evopute Industry Mat Co Ltd has applied Chinese patent for Organic Silicon Pouring Sealant and Preparation Method Thereof. Liu Licang, Wu Xianxin, Zeng Meichan and Tan Peiyu developed it.
The patent application number is CN202510532028 20250425. The patent publication number is CN120310522 (A). In..
Semiconductor
| Tue 27 Jan 2026
Beijing, Jan. 27 -- Changzhou Guangli Pipeline System Tech Co Ltd has filed a patent application for Process for Electroplating Nickel-tungsten Alloy on Threaded Coupling. This invention was developed by Li Zhixiong, Chen Wenmei, Li Yue and Han Yun.
The patent application number is CN202510695856 20250528. The patent publicat..
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