News For Last 1 Week
Industry
X
Assignee
Country
Status
-
Select All
Semiconductor
| Fri 21 Aug 2026
Alexandria, Aug. 21 -- Sicily Merger Sub Ii Inc and Celestial AI have been granted a patent for Optically Bridged Multicomponent Package with Extended Temperature Range. This invention was developed by Lazovsky David, Sahni Subal, Winterbottom Philip, Aggarwal Ankur and Bos Martinus.
The patent application number is US2025192..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Nokia Technologies OY has submitted a patent application for Buffer Mechanism and Further Enhancement of MDT in Data Collection. This invention was developed by Alizadeh Ashrafi Mohammad Reza and Dosti Enrico.
The patent application number is CN20248070344 20241031. The patent publication number is CN12213..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Fuzhou Pujing Semiconductor Co Ltd has been granted a patent for Chip Test Platform. Wang Zhaomeng, Xie Xuebin and Li Yijian developed the invention.
The patent application number is CN202422311606U 20240923. The patent publication number is CN223538949 (U). International Patent Classification codes are G0..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has awarded a patent to Heguang Photomask Tech Anhui Co Ltd for Photomask Box Capable of Being Vertically Placed. Zhu Hongliang and Zhang Jiancheng developed the invention.
The patent application number is CN202423243823U 20241226. The patent publication number i..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Ningbo Shunyun Electronic Co has been granted a patent for Intelligent Light-emitting Structure of High-temperature Cooking Equipment. This invention was developed by Yan Miaozhong, Mao Guangjun, Zhou Guangbing, Chen Huanzhao, Xie Miaojun and Zhang Jianfeng.
The patent application number is CN202423105138U..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Zhongshan Etmade Automation Equipment Co Ltd has been granted a patent for Wafer Bonding Device. This invention was developed by Gao Junpeng, Chen Tao and Zhu Yuanfu.
The patent application number is CN202422644759U 20241031. The patent publication number is CN223539585 (U). International Patent Classifica..
Semiconductor
| Fri 21 Aug 2026
Alexandria, Aug. 21 -- U.S. Patent and Trademark Office has awarded a patent to SK Hynix Nand Product Solutions Corp, SK Hynix Nand Product Solutions Corp DBA Solidigm and Solidigm Inc for Protecting Data Stored in Memory. Dudas Jozsef, Lappi Cory, Wu Ning and Khan Mohammad Nasim Imtiaz developed the invention.
The patent app..
Semiconductor
| Fri 21 Aug 2026
Alexandria, Aug. 21 -- United States Patent for Mask Plate, Alignment Mark and Photolithography System has been issued to Semiconductor Mfg International Shanghai Corp and Semiconductor Mfg Int Beijing Corp. This invention was developed by Wu Shi Jie, Sang Wei Hua and Xing Bin.
The patent application number is US202318368094 ..
Semiconductor
| Fri 21 Aug 2026
Alexandria, Aug. 21 -- United States Patent for Photonic Integrated Chip has been issued to Chamartin Laboratories LLC and Rockley Photonics. This invention was developed by Jones Haydn Frederick, Gardner Craig and Ver Steeg Benjamin.
The patent application number is US202218058455 20221123. The patent publication number is ..
Semiconductor
| Fri 21 Aug 2026
Alexandria, Aug. 21 -- United States Patent for Method and Apparatus for Applying ECC to Memory in Artificial Neural Network Based System Semiconductor has been issued to Telechips Inc. This invention was developed by Kim Dong Joo, Shin I Jou and Kim Moon Soo.
The patent application number is US202418793399 20240802. The pate..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has awarded a patent to Wuhan Puxixin Electronic Tech Co Ltd for Hardware Design Circuit for Preventing Direct Connection of Upper and Lower Bridge Arms of MOS (Metal Oxide Semiconductor) Tube. Zhu Haiyang developed the invention.
The patent application number is..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Xiamen Hengguang Xinrui Tech Co Ltd has been awarded a patent for Novel Miniaturized Semiconductor Light Source Packaging Structure. This invention was developed by Cai Junyuan and Zhang Xiaohai.
The patent application number is CN202422950401U 20241202. The patent publication number is CN223540059 (U). In..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Xintongkang Tech Co Ltd for Power Field Effect Transistor Based on Silicon Carbide. Tan Chao and Yuan Dingping developed the invention.
The patent application number is CN202422945161U 20241202. The patent publication number is CN..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Chinese Patent for Taiko Wafer Processing Device has been issued to Ningbo BYD Semiconductor Co Ltd. This invention was developed by Kong Jianjun, Wang Zhiwei, Chen Hongyu, Deng Chuandong and Tang Tao.
The patent application number is CN20242297543U 20240827. The patent publication number is CN223539581 (U..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has awarded a patent to Hunan Kexintai Electronic Co Ltd for Quartz Wafer Cleaning Device. Liu Wenyue and Dai Mian developed the invention.
The patent application number is CN202422571569U 20241024. The patent publication number is CN223539560 (U). International ..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has awarded a patent to Suzhou Aichuang Cloud Tech Co Ltd for End Sealing Device of Chip Multilayer Ceramic Capacitor. Jiang Mingliang and Hao Jianyu developed the invention.
The patent application number is CN202422929911U 20241129. The patent publication number..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Chinese Patent for Automatic Insulating Tape Winding Equipment for PTC Chip Assembly has been issued to Changzhou Ainuo Electronics Technical Co Ltd. This invention was developed by Wang Jie and Tian Wanlin.
The patent application number is CN202422530434U 20241018. The patent publication number is CN22353..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has awarded a patent to Dongguan Jingwang Electronics Co Ltd for Fingerprint Chip Structure for Realizing Internal and External Conduction Function by Implanting Copper Cylinders. Huang Huajun, Lim Gun-pil and Lu Enrong developed the invention.
The patent applica..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has awarded a patent to Zhuhai Yueke Jinghua Tech Co Ltd for High-reflection Aluminum Oxide Ceramic Substrate for LED. Xie Hua, Zhang Fuqi and Dong Zaiyong developed the invention.
The patent application number is CN202422833429U 20241120. The patent publication ..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Chinese Patent for Gan-based Multi-light-area LED Chip and Illumination Lamp has been issued to Foshan Naileite Photoelectric Tech Co Ltd. This invention was developed by Li Wenjie.
The patent application number is CN202422989516U 20241204. The patent publication number is CN223540881 (U). International Pa..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Chinese Patent for Super Junction Chip Structure has been issued to Shenzhen Jihua Weite Electronic Co Ltd. This invention was developed by Zhang Yixin, Wang Daming, Song Da, Zhang Yuxin and Jia Guo.
The patent application number is CN20242368586U 20241211. The patent publication number is CN223540865 (U)...
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Chinese Patent for Anti-voltage Substrate has been issued to Hunan Tongdaxin Electronic Tech Co Ltd. This invention was developed by Wang Huihui and Ma Mingfeng.
The patent application number is CN202422909432U 20241128. The patent publication number is CN223540806 (U). International Patent Classification ..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Jiangsu Qianfeng Electronic Co Ltd has been awarded a patent for Autonomous Assembly Equipment for Integrated Circuit Board. This invention was developed by Song Xuezhi, Shen Hua and Ma Hubiao.
The patent application number is CN202422895275U 20241127. The patent publication number is CN223540751 (U). Inte..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Suzhou Bohai Components Electronic Tech Co Ltd has applied Chinese patent for Ceramic Packaging Tube Shell Structure and Assembly. Qiu Jinyong, Wang Xiao, Huang Yong and Wang Xuchang developed it.
The patent application number is CN20251256460 20251231. The patent publication number is CN122137361 (A). Int..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Nanjing Microbonding Semiconductor Co Ltd has obtained a patent for quad flat no-lead (QFN) packaging test device under test (DUT) board based on turret type sorting machine. This invention was developed by Peng Haidong, Mu Yunfei and Zhang Yongyin.
The patent application number is CN202422626406U 20241030..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has released Xiandao Yuanchuang Shanghai New Tech Research Co Ltd patent application for Semiconductor Packaging Structure and Application Thereof. This invention was developed by Bao Yu.
The patent application number is CN202411737421 20241129. The patent public..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Xiandao Yuanchuang Shanghai New Tech Research Co Ltd has submitted a patent application for Semiconductor Packaging Structure and Application Thereof. Bao Yu developed the invention.
The patent application number is CN202411737419 20241129. The patent publication number is CN122138672 (A). International Pa..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Anhui Juhe Microelectronics Co Ltd has sought patent for Semiconductor Structure, Forming Method and Packaging Structure. This invention was developed by Xu Shuo.
The patent application number is CN202610611799 20260506. The patent publication number is CN122138689 (A). International Patent Classification ..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Moyan Jiangzao Zhejiang Tech Co Ltd has filed a patent application for Pop Packaging Structure and Manufacturing Method. This invention was developed by Liu Bin.
The patent application number is CN202610279398 20260309. The patent publication number is CN122138704 (A). International Patent Classification c..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Jiangsu Shengchuang Semiconductor Tech Co Ltd has filed a patent application for Semiconductor Electronic Packaging Double-path Lead Bonding Equipment. This invention was developed by Sun Haipeng, Gu Chuanglong and Gu Binjie.
The patent application number is CN202610593176 20260430. The patent publication ..
Semiconductor
| Fri 21 Aug 2026
Madrid, Aug. 21 -- Spanish Patent and Trademark Office has released Zayer SA patent application for Set of Machines for Chip Removing, Supply of Material and/or Measurement in Parts. This invention was developed by Orive De Diego Javier and Calleja MartÃnez Luis.
The patent application number is ES20210030211 20210310. The p..
Semiconductor
| Fri 21 Aug 2026
Alexandria, Aug. 21 -- Marvell Israel Misl Ltd has received a patent for Secure Access to Memory in an Integrated Circuit. This invention was developed by Nos Roman and Dror Nitzan.
The patent application number is US202418882472 20240911. The patent publication number is US12699788 (B2). International Patent Classification c..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Hangzhou Rightsilver Electronic Mat Co Ltd has applied Chinese patent for Front Fine Grid Silver Paste for Topcon Solar Cell and Preparation Method and Application of Front Fine Grid Silver Paste. Yang Hua developed it.
The patent application number is CN202610504911 20260416. The patent publication number..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has received Zhejiang Gonda Electronic Tech Co Ltd patent application for Electrode Slurry and Solar Cell. Fu Yao, Zhang Hao, Guo Cuiwen, Feng Jiwei and Wang Zhongnan developed the invention.
The patent application number is CN202610401336 20260330. The patent pu..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Shanghai Juke Fluid Control Co Ltd has submitted a patent application for Selection Method and Device for Material Ratio of Semiconductor Diaphragm Valve. Song Haixiao, Xue Hui, Ren Qingming and Tao Zhicheng developed the invention.
The patent application number is CN202610237457 20260228. The patent publi..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Guangzhou China Star Optoelectronics Tech Co Ltd has submitted a patent application for Display Device and Driving Method Thereof, Source Electrode Driving Chip and Time Sequence Controller. Liu Teng and Peng Bangyin developed the invention.
The patent application number is CN202610162655 20260204. The pat..
Semiconductor
| Thu 20 Aug 2026
Beijing, Aug. 21 -- Fujian Yonghong High Tech Mat Co Ltd has been granted a patent for Perfluoropolyether Dehydration Device for Semiconductor Heat Conduction. This invention was developed by Zhu Jihong, Zhou Ping, Xiao Zhiyong and Chen Qishuang.
The patent application number is CN20242334998U 20241210. The patent publication..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has received China Starnet Network Application Research Instituite Co Ltd patent application for Satellite Communication Method, Computing Device, Storage Medium, Computer Program Product and Chip System. Chen Xin, Jiang Botao, Zhuang Yunsheng, Chang Lian and Li Ji..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Yuxian Microelectronic Chengdu Co Ltd has applied Chinese patent for Digital Oscillation Ring, Digital Phase-locked Loop and Large-scale Digital Integrated Circuit. Chen Zhengsheng, Ji Xinwei and Luo Yong developed it.
The patent application number is CN202610239355 20260228. The patent publication number ..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has released Shenzhen Xinsheng Semiconductor and Suzhou Xinsheng Tech Co Ltd patent application for Filter, Filter Preparation Method and Integrated Circuit. This invention was developed by Wang Youliang, Zou Jie and Geng Deqiang.
The patent application number is..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Guangdong Hongyixin Automobile Electronic Tech Co Ltd has submitted a patent application for Brake Power Supply Chip and Power-on Method Thereof. Zheng Kunkun and Zhang Meng developed the invention.
The patent application number is CN202610241216 20260228. The patent publication number is CN122137232 (A). ..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Qingdao Lianzhi Optical Communication Tech Co Ltd has applied Chinese patent for Preparation Method of Laser Chip and Laser Chip. Zhu Xuyuan, Chen Hongmin, Wang Tao, Xu Yunfei, Wang Fuli and Niu Jiangfeng developed it.
The patent application number is CN202411698354 20241125. The patent publication number ..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Changchun Instituite of Optics Fine Mechanics and Physics Chinese Academy of Sciences has sought patent for External Cavity Feedback Type Narrow Linewidth Semiconductor Laser. This invention was developed by Wang Lijun, Lei Yuxin, Liang Lei, Li Siqi, Chen Yongyi, Wang Yubing, Qin Li, Jia Peng, Qiu Cheng and S..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Dalian Overseas Huasheng Electronics Tech Co Ltd has filed a patent application for Superfine Roll Printing Nickel Paste for MLCC (Multiplayer Ceramic Chip Capacitor) with Extreme High Capacity and Preparation Method of Superfine Roll Printing Nickel Paste. This invention was developed by Chen Jiangjun, Liu C..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Xiangsheng Tech Xiamen Co Ltd has filed a patent application for High-quality Anti-surge Anti-vulcanization Chip Resistor and Preparation Method Thereof. This invention was developed by Zhao Weiqiang and Xia Houyu.
The patent application number is CN202610188282 20260210. The patent publication number is C..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Jiangsu BQD Electric Co Ltd has been granted a patent for Multifunctional Test Board for Testing Integrated Circuit. Chen Dongsen, Xu Zhenhua and Lyu Dong developed the invention.
The patent application number is CN202422327131U 20240924. The patent publication number is CN223538950 (U). International Pate..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Shenzhen Yingmeihua Tech Co Ltd has secured a patent on Current Detection Circuit, Chip and Data Line. Wang Xuancheng, Du Changbo and Tang Menglong developed the invention.
The patent application number is CN202422473336U 20241011. The patent publication number is CN223538921 (U). International Patent Clas..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Jiangyin Sijie Electronics Co Ltd has secured a patent on BMS Chip Reliability Testing Device. Yu Hongyu, Yu Zhangyong and Huang Wenlong developed the invention.
The patent application number is CN202422769995U 20241114. The patent publication number is CN223538898 (U). International Patent Classification ..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Baoxin International Biological Tech Shandong Co Ltd has obtained a patent for device for preparing biosensor chip. This invention was developed by Ma Xingyi, Li Bing, Zhang Zongming and Li Dong.
The patent application number is CN202422890184U 20241126. The patent publication number is CN223538764 (U). In..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has received Beijing Smartchip Microelectronics Technology Co Limited patent application for Lateral Double-diffusion Field Effect Transistor, Manufacturing Method, Chip and Circuit. Fu Zhen, Yu Shan, Xiao Chao and Shen Meigen developed the invention.
The patent ..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Shenzhen Longjing Micro Electronics Co Ltd has applied Chinese patent for Die Bonding Auxiliary Device of Integrated Circuit Transistor. Lin Mingsheng developed it.
The patent application number is CN20261058081 20260115. The patent publication number is CN122138392 (A). International Patent Classification..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has released Vertiv International Co Ltd patent application for Integrated Two-phase Direct Chip Cooling Using R718. This invention was developed by Bisaro Carlo, Tammaro Marcello and Pariser Andrea.
The patent application number is CN202511765042 20251127. The p..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has received Vertiv International Co Ltd patent application for Integrated Single Phase Direct Chip Cooling Using R718. Bisaro Carlo, Barbato Pierpaolo and Tammaro Marcello developed the invention.
The patent application number is CN202511764944 20251127. The pat..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Beijing Shudu Information Tech Co Ltd has filed a patent application for CXL On-chip Switching Network of Multi-target Port Queue Architecture and CXL Switching Chip. This invention was developed by Bai Songhui, Zhou Hengzhao, Hu Yafei, Chen Xinmin and Li Huafang.
The patent application number is CN2026103..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has released China Starnet Network Application Research Inst Co Ltd and Rongyao Terminal patent application for Carrier Synchronization Method, Carrier Synchronization Device, Terminal Device, Computer Readable Storage Medium, Computer Program Product and Chip Syste..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Shanghai Yishi Intelligent Tech Co Ltd has sought patent for Cipher Chip Random Number Generator Entropy Source Quality Detection Method and System. This invention was developed by Yang Zijiang and Zhang Jianghu.
The patent application number is CN202610228663 20260226. The patent publication number is CN1..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Guangzhou Innotech Advanced Material Tech Co Ltd has been granted a patent for Substrate Racking and Sheet Inserting Device. Li Min, Lin Lihui and Huang Hai developed the invention.
The patent application number is CN202423112766U 20241213. The patent publication number is CN223539577 (U). International Pa..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Heyuan Maituo Electronic Tech Co Ltd has been granted a patent for Feeding Mechanism for Semiconductor Packaging and Die Bonding. This invention was developed by Wang Yongliang, Gao Yun and Jiang Min.
The patent application number is CN202422877340U 20241125. The patent publication number is CN223539574 (U..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Yingmu Automation Tech Xiamen Co Ltd has received a patent for Air Bag Device of Wafer Bonding Equipment. This invention was developed by Lyu Zhiyi, Huang Huaxing, Huang Hai and Wang Huirong.
The patent application number is CN202422979902U 20241204. The patent publication number is CN223539570 (U). Intern..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Jiangsu Zhongshengwei Tech Co Ltd has filed a patent application for Back Contact Solar Cell Structure and Manufacturing Method Thereof. This invention was developed by Lyu Wenhui, Zhang Jianzhong and Zhang Dongwei.
The patent application number is CN202610256534 20260304. The patent publication number is ..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Changchun Univ Science & Technology has filed a patent application for Integrated Semiconductor Photoelectric Detector and Preparation Method Thereof. This invention was developed by Wei Zhipeng, Tang Jilong, Hao Qun, Li Kexue and Li Shangheng.
The patent application number is CN202610612621 20260507. The ..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Zhongshan Ruike New Energy Co Ltd has sought patent for Activating Solution for Activating Cadmium Telluride Thin Film and Application of Activating Solution in Preparation of Cadmium Telluride Thin Film Solar Cell. This invention was developed by Zhou Zhuangda, Chen Kai, Pan Zhilin and Zhao Zhibo.
The pat..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has released Redsolar New Energy Tech Co Ltd patent application for Back-bonded Double-sided Flexible Gallium Arsenide Solar Cell and Preparation Method Thereof. This invention was developed by Yang Wenyi, Zhou Wei, Zhou Zhi and Wang Shuo.
The patent application ..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has released Beijing Smartchip Microelectronics Technology Co Limited patent application for Semiconductor Structure and Preparation Method Thereof, Chip and Circuit. This invention was developed by Fu Zhen, Yu Shan, Xiao Chao and Zhu Songchao.
The patent applica..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Beijing Smartchip Microelectronics Technology Co Limited has submitted a patent application for Semiconductor Structure and Preparation Method Thereof, Chip and Circuit. Fu Zhen, Yu Shan, Xiao Chao and Zhu Songchao developed the invention.
The patent application number is CN202610189435 20260210. The paten..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Beijing Smartchip Microelectronics Technology Co Limited has sought patent for Semiconductor Structure and Preparation Method Thereof, Chip and Circuit. This invention was developed by Fu Zhen, Yu Shan, Xiao Chao and Zhu Songchao.
The patent application number is CN202610189429 20260210. The patent publica..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Beijing Smartchip Microelectronics Technology Co Limited has filed a patent application for Lateral Double-diffusion Field Effect Transistor, Preparation Method Thereof, Chip and Circuit. This invention was developed by Fu Zhen, Yu Shan, Xiao Chao and Shen Meigen.
The patent application number is CN2026101..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Beijing Smartchip Microelectronics Technology Co Limited has submitted a patent application for Lateral Double-diffusion Field Effect Transistor, Preparation Method Thereof, Chip and Circuit. Fu Zhen, Yu Shan, Xiao Chao and Shen Meigen developed the invention.
The patent application number is CN20261018574..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Guangdong Electronic Information Engineering Research Instituite of UESTC University of Electronic Science has submitted a patent application for Optically Matched and Sputtering Damage Resistant Laminated Solar Cell and Manufacturing Method Thereof. Li Guangxin, Zhang Ting, Mo Rihua, Guo Xinkai, Qian Feng an..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Guojing Hechuang Qingdao Tech Co Ltd has sought patent for Active Display Control Device Based on Gallium Arsenide Photoelectric Device. This invention was developed by Zhang Fuxuan, Cui Caoxiang, Wang Shiyu, Guo Baijun, Liu Kangzhong, Lyu Yong and Zhang Chunyang.
The patent application number is CN2026106..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Anhui Hongming Tech Co Ltd has filed a patent application for B + G + B + KSF Film-coated CSP Product and Application Thereof in Replacing Traditional RGB CSP Red Light Chip. This invention was developed by Li Fuwei, Yang Xue, Hu Yong and Wang Weifu.
The patent application number is CN202610285400 20260310..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has received Zhejiang Guiyi New Energy Tech Co Ltd patent application for Monocrystalline Silicon with Double-slope Pyramid Structure as Well as Preparation Method and Application Thereof. Peng Li, Cao Xiaan and Zhou Hao developed the invention.
The patent applic..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Redsolar New Energy Tech Co Ltd has applied Chinese patent for Wafer-level Packaged III-V Group Flexible Thin-film Solar Cell and Preparation Method Thereof. Ling Guangyun, Dai Zhiwen, Zhou Zhi, Li Jianfang and Wang Shuo developed it.
The patent application number is CN20261088448 20260122. The patent publ..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Guangdong Guangyi Zhizao Tech Co Ltd has submitted a patent application for Perovskite Film, Preparation Method Thereof and Perovskite Solar Cell. Liu Tie, Chen Guanrong, Li Wanli, Wang Zaiwei and Xiao Zhongqin developed the invention.
The patent application number is CN202610159297 20260203. The patent pu..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Zhejiang Zhongneng Semiconductor Tech Co Ltd has submitted a patent application for Bionic Perovskite Silicon Nanoparticle Photovoltaic Cell and Preparation Method Thereof. This invention was developed by An Wenzhen, Shi Lei, Liu Xuelei and Deng Shifeng.
The patent application number is CN202610595524 2026..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has released Shanghai Instituite of Microsystem and Information Technology Chinese Academy of Sciences patent application for Semiconductor Film Epitaxy Method. This invention was developed by Liu Qiang, Shen Lingyan and Yu Wenjie.
The patent application number i..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Shanghai Instituite of Microsystem and Information Technology Chinese Academy of Sciences has sought patent for Preparation Method of High-quality Semiconductor Film. This invention was developed by Liu Qiang, Shen Lingyan and Yu Wenjie.
The patent application number is CN20261070491 20260120. The patent p..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Shanghai Instituite of Microsystem and Information Technology Chinese Academy of Sciences has submitted a patent application for High-quality Semiconductor Film Transfer Method. Liu Qiang, Shen Lingyan and Yu Wenjie developed the invention.
The patent application number is CN20261070425 20260120. The paten..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Dingcheng Xiamen Semiconductor Tech Co Ltd has submitted a patent application for Monolithic Wafer Wet Etching Equipment and Method. Zhang Hongyuan, Zhang Heng, Qiu Minjing, Zhang Fangpi and Wu Hongzhen developed the invention.
The patent application number is CN202610415400 20260331. The patent publicatio..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has released Geke Microelectronics Zhejiang Co Ltd patent application for Device and Method for Preventing Wafer from Being Reversely Placed in Semiconductor Processing Equipment. This invention was developed by Zhang Ge and Yan Jingwen.
The patent application nu..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Hangzhou Firstack Tech Co Ltd has submitted a patent application for Test Protection System of Power Semiconductor Wafer and Test Protection Method Based on Test Protection System. Li Jun, Shi Yimeng and Liu Wei developed the invention.
The patent application number is CN202610150297 20260203. The patent p..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Chongqing Xinhui Material Tech Co Ltd has sought patent for Carrier and Semiconductor Cleaning Equipment and Method. This invention was developed by Li Qing, Zhu Jianglin, Jung Hyun and Deng Xinyu.
The patent application number is CN202610302425 20260312. The patent publication number is CN122138652 (A). I..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- 58th Research Instituite of CETC has applied Chinese patent for Wafer-level Packaging Preparation Method of Gaas Chip Based on 3D Printing. Zhang Peng, Zhu Juntong, Ye Dongdong and Ji Yong developed it.
The patent application number is CN202610623000 20260508. The patent publication number is CN122138750 (..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has received Liding Semiconductor Tech Shenzhen Co Ltd and Liding Semiconductor Tech Qinhuangdao Co Ltd patent application for Package Substrate and Manufacturing Method Thereof. Zhuang Ruibin, Song Shuhua and Zou Jinyan developed the invention.
The patent applic..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Shenzhen Weitongbo Tech Co Ltd has submitted a patent application for Substrate Structure and Preparation Method Thereof, Substrate Mother Board, Chip Packaging Module and Electronic Equipment. Wu Baoquan developed the invention.
The patent application number is CN202510502853 20250421. The patent publicat..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- 58th Research Instituite of CETC has submitted a patent application for Preparation Method of TMV Chip Based on 3D Printing. This invention was developed by Zhang Peng, Geng Xueqi, Ye Dongdong and Ji Yong.
The patent application number is CN202610588792 20260430. The patent publication number is CN12213872..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Dongguan Shengdingyuan Tech Co Ltd has applied Chinese patent for High-power Chip Radiator. Li Silong developed it.
The patent application number is CN202610231896 20260227. The patent publication number is CN122138705 (A). International Patent Classification codes are H10W40/22, H10W40/47 and H10W40/73.
..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has released Xi'an Jubian Material Tech Co Ltd patent application for Phase-change Integrated Heat Dissipation Module for Realizing Asynchronous Temperature Equalization of Gan-based Chip, GaAs-based Chip and Si-based Chip in Tr Assembly. This invention was develope..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Shanghai Instituite of Microsystem and Information Technology Chinese Academy of Sciences has filed a patent application for Heat Dissipation Structure, Semiconductor Device and Preparation Method Thereof. This invention was developed by Zhang Kai, Liu Daoxiang, Xiao Kelaiti and Chen Ji.
The patent applica..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has received Shanghai Xinwei Semiconductor Co Ltd patent application for Back Metallization Structure of Semiconductor Device and Manufacturing Method of Back Metallization Structure. Xu Qiang, Wang Hao, Chen Guoji and Yang Yu developed the invention.
The patent ..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has released Changxin Jidian Beijing Storage Tech Co Ltd patent application for Measurement Method and Measurement Device of Semiconductor Structure and Electronic Equipment. This invention was developed by Li Hongxiang and Huang Xin.
The patent application numbe..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Muehlbauer Tech Wuxi Co Ltd has submitted a patent application for Strip Chip Hot-pressing Curing Production Equipment and Method. This invention was developed by Chen Yifu, Hua Wenjun, Zhang Shoucheng and Zhang Yunhui.
The patent application number is CN202610227719 20260226. The patent publication number..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Brookes Automation USA LLC has sought patent for Separated Connecting Rod Substrate Conveying Device. This invention was developed by Mcclellan Michael J, May Robert C and Caveney Robert T.
The patent application number is CN20248070611 20240906. The patent publication number is CN122139486 (A). Internatio..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Marvell Israel Misl Ltd has filed a patent application for Secure Access to Memory in Integrated Circuit. This invention was developed by North Raymond and Dror Nir.
The patent application number is CN20248070962 20240911. The patent publication number is CN122139187 (A). International Patent Classificatio..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Fanlin Group Salsburg Co Ltd has applied Chinese patent for Closing System for Process Chamber for Chemical and/or Electrolytic Surface Treatment of Substrate in Substrate Holder. Gleissner Andreas, Hu Fer Ju Rg and Locke Ricky developed it.
The patent application number is CN20248071059 20241028. The pate..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- National Instituite of Advanced Industrial Science and Technology has submitted a patent application for Nitride Material, Piezoelectric Body Comprising Same, MEMS Device Using Same, Nitride Material, Ferroelectric Body Comprising Same, and Electronic Element Using Same. This invention was developed by Tahara..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- State Intellectual Property Office of China has published Hanwha Chemical Corp patent application for Method for Forming Electron Transport Layer for Perovskite Solar Cell and Method for Manufacturing Perovskite Solar Cell. The invention was developed by Zheng Junqing, Jang Eun-soo and Lee Min Ji.
The pate..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Enpus AB has sought patent for Polishing Pad and Method of Manufacturing Semiconductor Device Using Same. This invention was developed by Hong Tae Il, Kim Young-hwan, Seo Jang-won, Min Eun-ki, Moon Su-young and Yun Jong Wook.
The patent application number is CN20248070644 20241106. The patent publication n..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Robert Bosch Co Limited has sought patent for Method for Treating Substrate for Electrochemical Cell. This invention was developed by Quest David, Burger Matthias, Graf Uwe, Kroschel Andreas, Kidlowski Tomasz, Kakkar Amol Singh, Reinig Martin and Gilbertson John.
The patent application number is CN20248069..
Semiconductor
| Fri 21 Aug 2026
Beijing, Aug. 21 -- Kunshan Sokay Automation Tech Co Ltd has received a patent for Scratch-proof Conductive Structure for Multi-material-belt Plate Electroplating. This invention was developed by Zhang Wenbiao.
The patent application number is CN202423102106U 20241216. The patent publication number is CN223540022 (U). Interna..
1
to
100 of
1585 Items
Next >>
![Close [X]](../images/close.gif){kind=small}
![Close [X]](https://www.globalipnews.com/images/close.gif){kind=small}
