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Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has received Suzhou Yimaixi Semiconductor Tech Co Ltd patent application for Tmv Embedded Packaging Stack Structure and Manufacturing Method Thereof. Huan Xun and Huang Gao developed the invention.
The patent application number is CN202511605998 20251105. The pat..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Anteyong Suzhou Optoelectronics Tech Co Ltd has sought patent for Chip Packaging Structure and Packaging Method. This invention was developed by Li Junzhe, Lu Kai, Yuan Wenjie, Wu Tao, Wang Yu and Cheng Jian.
The patent application number is CN202511802653 20251202. The patent publication number is CN12164..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Shanghai Xianfeng Tech Co Ltd has submitted a patent application for Preparation Method of Fan-out Type Packaging Structure. Chen Junhong, Lin Zhengyi, Chen Zhihui, Li Yiying, Gao Yongqiang and Tang Xinlu developed the invention.
The patent application number is CN202511819985 20251204. The patent publicat..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Shanghai Xianfeng Tech Co Ltd has sought patent for Preparation Method of Fan-out Type Packaging Structure. This invention was developed by Chen Junhong, Lin Zhengyi, Chen Zhihui, Li Yiying, Gao Yongqiang and Tang Xinlu.
The patent application number is CN202511819739 20251204. The patent publication numbe..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Guangdong Lihong Microelectronics Co Ltd has applied Chinese patent for Power Device Packaging Device. Zeng Ziyu and Li Bing developed it.
The patent application number is CN20251229164 20251230. The patent publication number is CN121646353 (A). International Patent Classification codes are H05K7/20, H10W4..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Unicompound Semiconductor Corp has submitted a patent application for Long-distance Air Bridge Capable of Preventing Bridge Floor from Sinking and Preparation Method of Long-distance Air Bridge. This invention was developed by Wu Jing, Huang Guangwei, Chen Jianxing, Zhang Chaomin and Chen Chao.
The patent ..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Jiangsu Third Generation Semiconductor Research Inst Co Ltd has filed a patent application for Wafer Box. This invention was developed by Li Qimeng.
The patent application number is CN202511828995 20251205. The patent publication number is CN121646313 (A). International Patent Classification codes are H10P..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has published Hebei Dingci Electronic Tech Co Ltd patent application for Nickel-coated Multilayer Ceramic Substrate and Preparation Method Thereof. The invention was developed by Ai Xiaopei, Li Jie, Liang Pengjie, Li Lei, Zhu Bohua, Yan Kun, Gao Shan, Jin Huajiang a..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Hebei Huici Electronic Tech Co Ltd has applied Chinese patent for Preparation Method of High-strength Aluminum Oxide Ceramic Substrate. Zhao Qingsong, Zheng Jiahuan, Zhang Guanglei and Hao Yalong developed it.
The patent application number is CN20261001058 20260104. The patent publication number is CN12165..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has published Hangzhou Xinan Tech Innovation Co Ltd patent application for Preparation Method of Spherical Silicon Dioxide. The invention was developed by Li Guibin, Liu Shoufeng and Liu Zipeng.
The patent application number is CN202511922628 20251219. The patent..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Suzhou Xinjing Artificial Intelligence Tech Research and Development Co Ltd has submitted a patent application for Polycrystalline Silicon Continuous Growth Production Process Capable of Accurately Controlling Temperature. This invention was developed by Wang Changqing, Liu Zhenchun and Wang Meng.
The pate..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has released Tanyan Tech Service Wuxi Co Ltd patent application for Method for Preparing Nano Silicon by Etching Silicon-aluminum Alloy and Nano Silicon Material Thereof. This invention was developed by Zheng Junhua.
The patent application number is CN20261025792..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Beijing Chaoxian Memory Research Inst has applied Chinese patent for Semiconductor Structure and Preparation Method Thereof, Memory Device and Electronic Equipment. Li Yuke, Mao Shujuan, Wang Guilei, Zhao Chao and Sun Xianglie developed it.
The patent application number is CN202411220705 20240830. The pate..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Beijing Chaoxian Memory Research Inst has sought patent for Semiconductor Structure, Preparation Method of Semiconductor Structure and Electronic Equipment. This invention was developed by Wang Guilei, Li Gengfei, Lyu Haochang, Dong Shucheng and Dong Bowen.
The patent application number is CN202411204199 2..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Chengdu Xinziguang Semiconductor Tech Co Ltd has filed a patent application for High-density Semiconductor Device and Preparation Method Thereof. This invention was developed by Zhang Jianping.
The patent application number is CN202411259457 20240909. The patent publication number is CN121645832 (A). Inter..
Semiconductor
| Sun 21 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has published Suzhou Aicheng Tech Tech Co Ltd patent application for Double-sided Conduction Amb Ceramic Substrate and Manufacturing Method Thereof. The invention was developed by Chen Yilong, Liang Kai and Wang Yuan.
The patent application number is CN2025118242..
Semiconductor
| Sun 21 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has received Hangzhou Yihuitong Tech Co Ltd patent application for Led High-voltage Direct-current Driving Circuit, Chip and Led Lighting Circuit. Liu Qiang, Xue Hao, Xu Chao, Wei Zhengyi, Dai Yifan and Zhang Yaguang developed the invention.
The patent applicatio..
Semiconductor
| Sun 21 Jun 2026
Beijing, June 22 -- Jiangsu Guangqian Electronic Co Ltd has filed a patent application for Production and Processing Device for Thermoelectric Separation Aluminum Substrate. This invention was developed by Wu Qiong and Xie Xiansheng.
The patent application number is CN202511771815 20251128. The patent publication number is CN..
Semiconductor
| Sun 21 Jun 2026
Beijing, June 22 -- Zhaoqing Guangsheng Lilv Aluminum Ind Co Ltd has filed a patent application for Raw Material Cutting Machine for Aluminum Wafer Machining. This invention was developed by Peng Haiqiang, Yang Zhiwen and Xue Jinquan.
The patent application number is CN202511829022 20251205. The patent publication number is C..
Semiconductor
| Mon 22 Jun 2026
Alexandria, June 22 -- Think Silicon Research and Technology Single Member has filed a patent application for Thread Tiling for Memory Latency Reduction. This invention was developed by Georgakakis Dimitris, Bartsokas Anastasios and Keramidas Georgios.
The patent application number is US202318567544 20231127. The patent publi..
Semiconductor
| Mon 22 Jun 2026
Alexandria, June 22 -- Stripe LLC has sought patent for Systems and Methods for Electrostatic Discharge Protection. This invention was developed by Chung Jay, Mok Bryan, Wong Steven, Tsang Tony and Gan Wayne.
The patent application number is US202619466261 20260130. The patent publication number is US20260170275 (A1). Interna..
Semiconductor
| Mon 22 Jun 2026
Alexandria, June 22 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Method of and System for Generating Layout Diagram of Integrated Circuit Device Having Transistor Architecture. Chang Hsiu-chuang and Chang Hsiang-ho developed the invention.
The patent application number is US202519172865 ..
Semiconductor
| Mon 22 Jun 2026
Alexandria, June 22 -- Beijing Tsingmicro Intelligent Tech Co Ltd has filed a patent application for Reconfigurable 3D Chip and Integration Method Thereof. This invention was developed by Yu Yi and Ouyang Peng.
The patent application number is US202318718855 20230718. The patent publication number is US20260170206 (A1). Inter..
Semiconductor
| Mon 22 Jun 2026
Alexandria, June 22 -- U.S. Patent and Trademark Office has released Re Alloys Sp ZOO patent application for Complex Multi-component Alloy of Iron, Silicon and Chromium. This invention was developed by Miskiewicz Radoslaw, Banasik Lukasz, Wilczek Miroslaw and Kozlowski Slawomir.
The patent application number is US202319512284..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has published Guizhou Zhenhua Fengguang Semiconductor Co Ltd patent application for Silicon Through Hole Sandwich Cavity MEMS Wafer Level Packaging Method and Packaging Body Thereof. The invention was developed by Shang Denghui, Fang Di, Pan Qin, Su Baorong, Yoon Ch..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has released Guizhou Zhenhua Fengguang Semiconductor Co Ltd patent application for Sip Plastic Packaging Method for Double-cavity High-thermal-conductivity MEMS Chip and Packaging Body of Double-cavity High-thermal-conductivity MEMS Chip. This invention was develope..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Guizhou Zhenhua Fengguang Semiconductor Co Ltd has submitted a patent application for Hybrid Dual-cavity MEMS High-thermal-conductivity Sip System-in-package Method and Package Body. Xia Liang, Shang Denghui, Fang Di, Pan Qin, Su Baorong, Yoon Chan and Zhang Xinghua developed the invention.
The patent appl..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Shenzhen Qingli Tech Co Ltd; Research Inst Of Tsinghua University In Shenzhen has filed a patent application for Multifunctional Logic Device Based on Self-super-smooth Effect, Semiconductor Device, Computing System and Driving and Preparation Method Thereof. This invention was developed by Hu Guofeng, Ma Lan..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has received Beijing Automation Control Equipment Inst patent application for Low-stress Packaging Structure and Silicon Micro-resonance Accelerometer. Wang Rutao, Shen Yanchao, Li Chenzheng, Wang Yongsheng, Wang Yanyan, Zhao Zhiheng, Liu Fei, Sheng Jie and Cao Huit..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Shenzhen Kuntan Shengda Tech Co Ltd has sought patent for Preparation Method of Microporous Glass Substrate and Atomizing Core for Atomizing Device. This invention was developed by Hu Jin and Sun Shende.
The patent application number is CN20251249584 20251230. The patent publication number is CN121651725 (..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Zhongke Wanchuang Group Tech Industry Co Ltd has submitted a patent application for Glass Fiber Surface Low-dielectric Fluorine-doped Silicon Oxide Coating and Preparation Method Thereof. This invention was developed by Li Hongliang, Wang Lishuang, Chen Tianyang and Wang Xuelei.
The patent application numb..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has published Guangzhou Ruxing Tech Development Co Ltd and Wuxi Ruxing Tech Development Co Ltd patent application for Acid-resistant Glass Powder Suitable for N-type Battery Front Fine Grid Leco Slurry and Preparation Method and Application Thereof. The invention wa..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Shandong Longguan Tianxu Solar Energy Co Ltd has filed a patent application for Low-dielectric-loss Chip Packaging Glass Substrate and Preparation Method Thereof. This invention was developed by Xing Yepeng, Tian Yingliang and Qian Qiwei.
The patent application number is CN202610179013 20260209. The patent..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Zhejiang Dijixin Semiconductor Co Ltd has submitted a patent application for Plasma Activation Bonding Method and System for Chip Three-dimensional Packaging. This invention was developed by Tan Liyong, Xu Qiang, Zhao Yaping, Chen Lei, Li Jiajun and Tang Xiaohai.
The patent application number is CN20251180..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Shanghai Yaogan Tech Co Ltd has submitted a patent application for Manufacturing Method of Three-dimensional System Chip. This invention was developed by Han Yinan.
The patent application number is CN202511864580 20251210. The patent publication number is CN121646387 (A). International Patent Classificatio..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Tianxin Interconnection Tech Co Ltd has sought patent for Preparation Method of Semiconductor Package and Semiconductor Device. This invention was developed by Zhang Xiaowei, Li Guoshuai, Yu Guoqing and Ding Peng.
The patent application number is CN202511739706 20251125. The patent publication number is CN..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- China Electronics Technology Group Corporation No. 13 Research Inst has submitted a patent application for Microwave Circuit, Packaging Method, Resonance Suppression Chip Preparation Method, Equipment and Medium. Fu Qi, Liu Lele, Zhang Shaohua, Guo Fengqiang, Gao Hongfei, Wang Qiaonan, Deng Shixiong, Xiao Nin..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Chengdu Yicheng Integrated Circuit Co Ltd has submitted a patent application for Preparation Method of Chip Packaging Structure, Chip Packaging Structure and Electronic Equipment. This invention was developed by Li Gaolin and Huang Han.
The patent application number is CN202511806634 20251203. The patent p..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Zhejiang Chuanghao Semiconductor Co Ltd has sought patent for Packaging Substrate Exposure Method, Manufacturing Method and Packaging Substrate. This invention was developed by Zhang Linwei, Fang Yong, Lu Hailin, Wu Jianfeng and Yan Chuanzhao.
The patent application number is CN202511684406 20251117. The p..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has published Shanghai Meadville Science & Tech Co Ltd patent application for Chip-embedded Tgv Glass Substrate and Manufacturing Method Thereof. The invention was developed by Yan Guoqiu, Tian Hongzhou, Cao Zikun, Kamimiya Shohei and Wang Xiaoben.
The patent app..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has released China Electronics Technology Group Corporation No. 13 Research Inst patent application for Mmic Chip Preparation Method, Chip, Electronic Equipment and Preparation Device. This invention was developed by Liu Fanggang, Fu Qi, Zhang Shaohua, Guo Fengqiang..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has received China Electronic Product Reliability and Environmental Testing Research Inst The Fifth Electronic Re patent application for Complementary Metal Oxide Semiconductor Device and Repair Circuit. Gao Rui, Li Chao, Wei Tanru and Lin Xiaoling developed the inv..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Ventec Electronics Suzhou Co Ltd has submitted a patent application for Preparation Method of Heat Dissipation Substrate and Prepared Heat Dissipation Substrate. This invention was developed by Jiang Jie, Wang Feilong and Wang Zhuo.
The patent application number is CN202511771259 20251128. The patent publi..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has published Hlj Tech Co Ltd patent application for High-conductivity and Heat-dissipation Chip and Manufacturing Method Thereof. The invention was developed by Li Yanzhu, Reilwin and Lai Lihong.
The patent application number is CN202411180374 20240827. The pate..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Shandong Zhongjing Xinyuan Semiconductor Tech Co Ltd has applied Chinese patent for Method and System for Detecting Fault Type of 4H-SiC Single Crystal Wafer. Wang Zhongfu, Shao Chen, Zhang Ruilin, Yang Xianglong, Zhong Guanglei and Wang Lulu developed it.
The patent application number is CN202511858700 20..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has released Suzhou Noc Intelligent Tech Co Ltd patent application for Adsorption Positioning Rotating Platform for Chip Substrate Processing. This invention was developed by Xu Deqiang.
The patent application number is CN202511678919 20251117. The patent publica..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has received Huzhou Nanxun Haiheng Intelligent Prec Instrument Co Ltd patent application for Wafer Clamp Device for Semiconductor Detection. Li Hailun developed the invention.
The patent application number is CN202511950377 20251223. The patent publication number..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Rongtai Semiconductor Jiangsu Co Ltd has sought patent for Packaging Equipment for Gallium Nitride Semiconductor Processing. This invention was developed by Hua Wenqiang, Chen Xianbiao and Zhou Conglin.
The patent application number is CN202511823574 20251205. The patent publication number is CN121646322 (..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has received Saimikang Tech Zhuhai Co Ltd and Shenzhen Sainikang Electronic Tech Co Ltd patent application for Semiconductor Chip Mounting Device with Automatic Detection and Calibration Functions. Wu Weizheng, Peng Feipeng, Chen Zhenwei and Huang Jianhua developed ..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has released Beijing Xinyuewei Semiconductor Tech Co Ltd, Wuhu Xin Yue Micro Semiconductor Co Ltd and Hefei Xin Yue Micro Semiconductor Co Ltd patent application for Door Lock Structure and Wafer Transport Box. This invention was developed by Woo Jae-chang, Zhang Li..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Northwest Electronic Equipment Technology Research Inst Second Research Inst Of China Electronics Te has submitted a patent application for Precise Pressure Control Large-angle Rotation Chip Mounting Head and Chip Mounter. This invention was developed by Wang Chengjun, Wang Ruipeng, Cao Guobin, Cui Hailong, W..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has received Shandong Hanya Network Tech Co Ltd patent application for Reactive Ion Etching Equipment and Etching Method for Semiconductor Device Processing. Sun Yanli, Li Danzhou and Wang Ge developed the invention.
The patent application number is CN20261012400..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Shenzhen Eagle Eye Vision Tech Co Ltd has submitted a patent application for Visual Integrated Force Control Feedback Working Head and Chip Mounting and Testing Method. This invention was developed by Ding Xiaohua, Ding Jiada, Zhou Xiang, Chen Ming and Ruan Lingfang.
The patent application number is CN2025..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- Jiwei Sanhe Semiconductor Equipment Tech Co Ltd has sought patent for Intelligent Visual Inspection and Automatic Correction Device of Wafer Cutting Machine. This invention was developed by Xiu Xin, He Ling and Huang Wenbin.
The patent application number is CN202511832110 20251208. The patent publication n..
Semiconductor
| Mon 22 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has received Beijing Longzhiyuan Tech Development Co Ltd patent application for Indium Antimonide Chip Beryllium Ion Implantation and Rapid Thermal Annealing Damage Repair Method and System. Liu Wei and Lyu Xiaoyong developed the invention.
The patent application..
Semiconductor
| Sun 21 Jun 2026
Beijing, June 22 -- Beijing Dasheng Sensheng Tech Co Ltd has applied Chinese patent for Automatic Welding Device for Integrated Circuit Chip. Tian Yuwei developed it.
The patent application number is CN202610143227 20260202. The patent publication number is CN121649507 (A). International Patent Classification codes are B23K3/..
Semiconductor
| Sun 21 Jun 2026
Beijing, June 22 -- Qingdao Tairuisi Microelectronics Co Ltd has submitted a patent application for Device and Method for Cleaning Products After Semiconductor Packaging and Cutting. Ge Feng developed the invention.
The patent application number is CN202511940397 20251222. The patent publication number is CN121649172 (A). Int..
Semiconductor
| Sun 21 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has released Xie Taoxia patent application for Automatic Degumming Device for Integrated Circuit Board Processing. This invention was developed by Xie Taoxia, Jiang Ziyang and He Huan.
The patent application number is CN202511822978 20251205. The patent publicati..
Semiconductor
| Sun 21 Jun 2026
Beijing, June 22 -- State Intellectual Property Office of China has released China Pingmei Shenma Holding Group Co Ltd and Pingdingshan Yicheng New Mat Co Ltd patent application for Optical Silicon Carbide Powder Sorting Device and Method. This invention was developed by Sun Yi, Yang Zhenghong, Dong Jianxun, Li Mao, Liu Chuang a..
Semiconductor
| Sun 21 Jun 2026
Beijing, June 22 -- Infineon Technologies Americas Corp has sought patent for Wireless Device, Attack Detection Method, and Attack Detection System. This invention was developed by Rey Claudio and Korytsyn Igor.
The patent application number is CN202511174935 20250821. The patent publication number is CN121644122 (A). Interna..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Methods for Manufacturing Semiconductor Plug Structure and Semiconductor Structure Having the Semiconductor Plug Structure. Cheng Yu-hung, Li Ching I and Liu Kuan-liang developed it.
The patent application number is US2024189..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Intel has applied United States patent for Integrated Circuit Structures Having Mixed Height Standard Cells with Odd/even Tracks. Thimmegowda Deepak, Pangal Kiran and Plekhanov Pavel developed it.
The patent application number is US202418981927 20241216. The patent publication number is US20260173848 (A..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- IMEC VZW has submitted a patent application for Method for Producing a Through-semiconductor Connection. This invention was developed by Witters Liesbeth, Beyne Eric and Shigetoshi Takushi.
The patent application number is US202519353993 20251009. The patent publication number is US20260173842 (A1). Int..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Canon has applied United States patent for Semiconductor Device and Manufacturing Method Therefor. Kimura Tetsuya and Asano Kosuke developed it.
The patent application number is US202519412485 20251208. The patent publication number is US20260173838 (A1). International Patent Classification codes are H1..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- United Semiconductor, Xiamen has submitted a patent application for Semiconductor Structure. Xu Hong Fu, Xie Feng, Gu Hailong, Tan Wen Yi and Du Bing developed the invention.
The patent application number is US202519019481 20250114. The patent publication number is US20260173825 (A1). International Pate..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- ASM has filed a patent application for Systems and Apparatus for a Lift Pin Assembly. This invention was developed by Ricketts Matthew.
The patent application number is US202619537032 20260211. The patent publication number is US20260173818 (A1). International Patent Classification code is H10P72/76. Co..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Hitachi High Technologies has submitted a patent application for Etching System and Etching Method. This invention was developed by Takubo Chisaki, Okumura Tadashi and Satake Makoto.
The patent application number is US202318845688 20230710. The patent publication number is US20260173797 (A1). Internatio..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Okmetic Oy has filed a patent application for Method for Manufacturing a Bonded Wafer Structure. This invention was developed by Vesapuisto Erkki and Mäkinen Jari.
The patent application number is US202418985314 20241218. The patent publication number is US20260173792 (A1). Cooperative Patent Classific..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Device Including Damascene Structure, and Method for Fabricating the Same. Hsu Wei Tse, Chiu Chien-chih, Chen Hung-chun, Chen Yu-yu, Chien Yuan-chun and Chen Chien-han developed the invention.
The patent appli..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Commissariat A L'Energie Atomique Et Aux Energies Alternatives has submitted a patent application for Confined Phase-change Memory. This invention was developed by Navarro Gabriele and Bourgeois Guillaume.
The patent application number is US202519416870 20251211. The patent publication number is US20260..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- U.S. Patent and Trademark Office has published Intel patent application for Anomalous Hall Effect (ahe)-based Read Out of Logic Devices Based on Interlayer Exchange Coupling. The invention was developed by Young Ian Alexander, Rogan Carly, Clendenning Scott B, Gay Christopher M, Dc Mahendra, Li Hai, Debash..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Magnetic Tunnel Junction (mtj) Element and its Fabrication Process. This invention was developed by Lee Ya-ling and Lin Tsann.
The patent application number is US202619534814 20260210. The patent publication number is US202..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- SFC has submitted a patent application for Novel Heterocyclic Compound and Organic Light-emitting Diode Including Same. Lee Se Jin, Jang Hyuk Woo, Park Seo Youn, Choi Do Yeong, Choi Yeon Jae, Kim Si In, Kim Kyeong Wan and Kim Kyeong-hyeon developed the invention.
The patent application number is US20261..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- U.S. Patent and Trademark Office has published Seoul Viosys patent application for Light Emitting Apparatus. The invention was developed by Ryu Seung Ryeol.
The patent application number is US202519418635 20251212. The patent publication number is US20260173633 (A1). International Patent Classification ..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Nichia has submitted a patent application for Method of Manufacturing Light-emitting Device and Light-emitting Device. This invention was developed by Taguchi Koji and Sakamaki So.
The patent application number is US202519417781 20251212. The patent publication number is US20260173606 (A1). Internationa..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- U.S. Patent and Trademark Office has released LG Display patent application for Light Emitting Element Transfer Apparatus, and Method of Driving Light Emitting Element Transfer Apparatus. This invention was developed by Kwak Doyoung, Hwang Youngsuk and Choi Bongseok.
The patent application number is US2..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Epistar has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Ou Chen, Su Ching-hua, Chen Jih-kang, Liao Ching-han, Liao Wei-chun, Song Cai-jhen and Chang Chia-hao.
The patent application number is US202519410806 20251205. The paten..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- ASUSTeK Computer has submitted a patent application for Light-emitting Diode Structure and Manufacturing Method Thereof. This invention was developed by Huang Jian-jang, Yu Cheng-jui, Wang Yuan-chao, Lin Ching-hsin, Tseng Chin-an and Yu Chia-lei.
The patent application number is US202519243650 20250619...
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Omnivision Technologies has filed a patent application for Floating Diffusion Region Formed Via Shared Photomask and Methods Thereof. This invention was developed by Wang Qin and Jin Yu.
The patent application number is US202619532961 20260206. The patent publication number is US20260173568 (A1). Intern..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Taiwan Semiconductor Manufacturing Co Ltd has filed a patent application for Semiconductor Devices and Methods of Forming the Same. This invention was developed by Chen Wei-lin, Tsai Yu-cheng, Chou Chun-hao and Lee Kuo-cheng.
The patent application number is US202619531696 20260206. The patent publicati..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Image Sensor Pixel with Pixel Isolation. Kao Min-feng, Su Bo-yuan, Liu Jen-cheng and Chiang Yen-ting developed the invention.
The patent application number is US202418980112 20241213. The patent publication number is US2026..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Illumina has submitted a patent application for Semiconductor Light Sensing. This invention was developed by Rezaei Mohsen, Hetherington Craig, Emadi Arvin and Billa Ravi.
The patent application number is US202519390065 20251114. The patent publication number is US20260173559 (A1). International Patent ..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Taiwan Semiconductor Manufacturing Co Ltd has filed a patent application for Image Sensor and Method of Forming the Same. This invention was developed by Lu Chun-liang, Yang Ming-hsien, Chou Chun-hao and Lee Kuo-cheng.
The patent application number is US202619530295 20260204. The patent publication numb..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Ltd patent application for Vertically Arranged Semiconductor Pixel Sensor. The invention was developed by Cheng Yun-wei, Wu Cheng-ming, Lee Kuo-cheng and Hsieh Feng-chien.
The patent application number is US202619536305..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Co Ltd patent application for Capacitor and Method for Forming the Same. Chang Meng-sheng and Lin Meng-han developed the invention.
The patent application number is US202619532664 20260206. The patent publication number is ..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Low-leakage ESD Protection Circuit and Operating Method Thereof. This invention was developed by Chu Li-wei, Lee Jam-wem, Lin Wun-jie, Hung Tao Yi and Chen Kuo-ji.
The patent application number is US202619534841 20260210. T..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Electrostatic Discharge Protection Circuit with Diode String. This invention was developed by Chang Pin-hsin, Chen Hsin-yu and Chang Tzu-heng.
The patent application number is US202619533609 20260209. The patent publication..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- U.S. Patent and Trademark Office has received Beijing Boe Tech Development Co Ltd, Hefei Xinsheng Optoelectronics Tech Co Ltd and BOE Technology Group patent application for Array Substrate and Display Device. Ma Xiaoye, Ding Zhiwei, Xie Yongxian, Wang Zhangtao, Zhang Ran, Guo Hui, Lin Liang, Zou Zhixiang ..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Nokia Networks France has submitted a patent application for Layered Semiconductor Structures and Methods for Fabricating Layered Semiconductor Structures. Besancon Claire and Decobert Jean developed the invention.
The patent application number is US202519415181 20251210. The patent publication number i..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing Co Ltd patent application for Isolation Structure for Stacked Multi-gate Device. Lin Zhi-chang and Tsai Chia-jung developed the invention.
The patent application number is US202519218265 20250524. The patent publication num..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Potens Semiconductor has submitted a patent application for Superjunction Metal-oxide-semiconductor Field-effect Transistor. Lai Tung Ming, Meng Hsiang Chi, Ko Yung Sheng and Lu Hamilton developed the invention.
The patent application number is US202519195911 20250501. The patent publication number is U..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Wafer-level Die Singulation Using Buried Sacrificial Structure. Lin Hung-te developed the invention.
The patent application number is US202619464514 20260129. The patent publication number is US20260173500 (A1). Internation..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- U.S. Patent and Trademark Office has released Tsmc Nanjing Co Limited and Taiwan Semiconductor Manufacturing Co Ltd patent application for Integrated Circuit Structure with Reduced Leakage Path. This invention was developed by Ji Baorong, Wang Chao-jui and Zhu Jian.
The patent application number is US20..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Taiwan Semiconductor Manufacturing Co Ltd has sought patent for Semiconductor Device Structure and Methods of Forming the Same. This invention was developed by Chang Cheng-wei and More Shahaji B.
The patent application number is US202619530437 20260205. The patent publication number is US20260173498 (A1..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Intel has applied United States patent for Trench Isolation Liner for Transistor Devices. Baradwaj Aditya, Jensen Jacob, Gu Yuqian, Ganapathy Harish, James Robert, Khadilkar Aditi, Gopalan Devashish, Sinha Piyush and Saha Partha developed it.
The patent application number is US202418982591 20241216. The..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Nanya Tech has applied United States patent for Semiconductor Device and Method for Fabricating the Same. Liu Yu-hua developed it.
The patent application number is US202519050883 20250211. The patent publication number is US20260173489 (A1). International Patent Classification codes are H10D30/01, H10D3..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- U.S. Patent and Trademark Office has published Nanya Tech patent application for Semiconductor Device and Method for Fabricating the Same. The invention was developed by Liu Yu-hua.
The patent application number is US202519010383 20250106. The patent publication number is US20260173488 (A1). Internation..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- U.S. Patent and Trademark Office has published Nanya Tech patent application for Semiconductor Device and Method for Fabricating the Same. The invention was developed by Liu Yu-hua.
The patent application number is US202418981769 20241216. The patent publication number is US20260173487 (A1). Internation..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- Yangtze Memory Technologies has applied United States patent for Three-dimensional Memory Devices and Fabricating Methods Thereof. Wu Shuangshuang, Han Yuhui and Wang Di developed it.
The patent application number is US202519008445 20250102. The patent publication number is US20260173374 (A1). Internati..
Semiconductor
| Sun 21 Jun 2026
Alexandria, June 22 -- U.S. Patent and Trademark Office has published Nanya Tech patent application for Semiconductor Device with Landing Pads and Method for Fabricating the Same. The invention was developed by Wang I-lun and Lo Ka-man.
The patent application number is US202418989145 20241220. The patent publication number is..
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