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Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- Tianjin Polytechnic University and Shaoxing Keqiao Research Institute Tianjin University Of Technology have submitted a patent application for Closed-loop Response Type Dressing Based on Semiconductor Yarn Logic Gate Circuit. This invention was developed by Liu Hao, Lin Xiaoping and Li Peng.
The patent app..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- Dongfang Electric Yangtze River Delta Hangzhou Innovation Res Institute Co Ltd and Dongfang Electric Science and Technology Research Institute have filed a patent application for Perovskite Solar Cell Based on Thiophene Conjugated Polymer Hole Transport Layer. This invention was developed by Qin Yunpeng, Zhao..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- Tianhe Solar Dongtai Photoelectric Co Ltd and Trina Solar have submitted a patent application for Passivation Structure, Method for Preparing Phosphorus-doped Layer of Solar Cell, Solar Cell and Preparation Method of Solar Cell. Gu Dehua, Bian Qiang, Zou Yang and He Zaoyang developed the invention.
The pat..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation, Huahong Semiconductor Mfg Wuxi Co Ltd and Huahong Semiconductor, Wuxi have submitted a patent application for Formation Method of Semiconductor Structure. Chen Hualun, Chen Chen, Xu Aibin and Wang Li developed the invention.
The patent applica..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- Zhejiang Semiharv Tech Co Ltd and Huaqiao University have filed a patent application for Highly Integrated Power Semiconductor Device. This invention was developed by Huang Ke, Guo Xinhua, Zhou Yucheng, Jin Zhimeng and Fu Jinyuan.
The patent application number is CN202510877491 20250627. The patent publica..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- BOE Technology Group and Beijing BOE Technology Development have submitted a patent application for Light-emitting Device, Light-emitting Substrate and Display Device. Li Zhongxiao, Dong Shuilang, Zhou Ying, Yan Yutong and Zhang Can developed the invention.
The patent application number is CN20248000177 20..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- BOE Technology Group and Beijing BOE Technology Development have submitted a patent application for Light-emitting Assembly, Preparation Method Thereof and Display Substrate. This invention was developed by Li Haixu and Meng Fanna.
The patent application number is CN20248000152 20240130. The patent publica..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Southeast University and Southeast University Wuxi Institute Of Integrated Circuit Technology have sought patent for Driving Power Supply Safety Protection Circuit for Direct-drive Power Semiconductor Device. This invention was developed by Liu Siyang, Wang Qinhan, Li Sheng and Sun Weifeng.
The patent appl..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- China Star Net Innovation Res Institute Co Ltd and Nanjing Panda Comm Tech Co Ltd have submitted a patent application for Single-ended to Differential Signal Conversion Device, Integrated Circuit, Chip and Packaging Structure. Wang Wei, Lu Liwu, Yao Qiyuan, Zhang Yang, Chen Shouqi, Sun Zhenning and Rong Liang..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Zhejiang University and Zhejiang Chuangxin Integrated Circuit have applied Chinese patent for Method and Equipment for Predicting Etching Structure of Semiconductor Device, and Storage Medium. Guo Jianming, Ren Kun, Ni Dong and Gao Dawei developed it.
The patent application number is CN202511234364 2025090..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has released ACM Research, Shanghai, ACM Res Korea Inc and Qingxin Tech Co Ltd patent application for Wafer Processing Cavity, Wafer Processing Device and Wafer Processing Equipment. This invention was developed by Wang Hui, Gu Jianguo, Tian Liangang, Zhu Zhijun, Ki..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Anhui Microchip Changjiang Semiconductor Mat Co Ltd has submitted a patent application for Film Reversing and Turning-over Device for Multi-size Film Boxes. This invention was developed by Dong Zhiyong, Zhang Lei, Zhou Zhengfei and He Fei.
The patent application number is CN202510833435 20250620. The paten..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received Shengxi Tech Weihai Co Ltd patent application for Silicon Wafer Pretreatment Cleaning Machine. Fan Demeng and Li Yan developed the invention.
The patent application number is CN202510893604 20250630. The patent publication number is CN120727620 (A). ..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Sound Semiconductor Equipment Jiangsu Co Ltd has submitted a patent application for Degumming Equipment for Semiconductor Wafer. Tao Yulong, Huang Feng, Pu Qiwen and Hu Lei developed the invention.
The patent application number is CN202510789882 20250613. The patent publication number is CN120727617 (A). I..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has published Kelaixin Suzhou Semiconductor Tech Co Ltd patent application for Medicament Circulation Control System for Semiconductor Cleaning Device. The invention was developed by Hua Hongliang, Yang Hui and Deng Juewen.
The patent application number is CN2025..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has released ACM Research, Shanghai, ACM Res Korea Inc and Qingxin Tech Co Ltd patent application for Loading Cavity and Semiconductor Device. This invention was developed by Xu Xuetong, Zhou Peilong, He Bin, Zhang Shan, Jia Shena and Kim Kyoung-jun.
The patent a..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Jingjian Semiconductor Changzhou Co Ltd has applied Chinese patent for Chip Mounter and Chip Mounting Method. Chao Yangsheng, Liu Yiman and Duan Sai developed it.
The patent application number is CN202410362387 20240328. The patent publication number is CN120727601 (A). International Patent Classification ..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Hangzhou Qitai Electronic Tech Co Ltd has applied Chinese patent for Multi-layer Chip Stacking and Packaging Method and Multi-layer Chip Stacking and Packaging Structure. Cai Jinlong and Zhang Weiwei developed it.
The patent application number is CN202511212014 20250828. The patent publication number is CN..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has released Dabo Tech Shanghai Co Ltd patent application for Preparation Method of Indium Antimonide-containing Heterogeneous Wafer Capable of Reducing Annealing Thermal Stress and Product. This invention was developed by Li Xin, Xue Chenglong, Bai Wenwen, Wang Han..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Suzhou Nanowin Science And Tech Co Ltd has applied Chinese patent for Method for Preparing Semiconductor Device by Using Infrared Laser to Peel Off Substrate and Device. Li Jinjuan, Wang Shengchun, Chen Jihu and Wang Jianfeng developed it.
The patent application number is CN202510898557 20250701. The paten..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Anhui Microchip Changjiang Semiconductor Mat Co Ltd has applied Chinese patent for Process Method for Realizing Ultra-low Warping Laser Stress Release After SiC Thinning. Yao Zhiyong, Jiang Chengchen and Cao Dekun developed it.
The patent application number is CN202510833438 20250620. The patent publicatio..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Shenzhen Weixun Tech Co Ltd has submitted a patent application for Level Conversion Circuit and Chip. This invention was developed by Yang Hui and Wang Jian.
The patent application number is CN202511232686 20250901. The patent publication number is CN120729286 (A). International Patent Classification code ..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received Taijidian Nanjing Co Ltd and Taiwan Semiconductor Manufacturing patent application for Semiconductor Device and Method of Manufacturing the Same. Xian Huaixin, Yan Zhangying, Meng Qingchao, Liao Jiajun and Wang Jinxian developed the invention.
The pa..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Wuhan Erjin Semiconductor Co Ltd has submitted a patent application for Driving Circuit and Signal Transmitting Chip. Sun Zhanjie, Zhou Hua, Cheng Ni, Wang Lifang, Feng Jiao and Chen Chufeng developed the invention.
The patent application number is CN202510894419 20250630. The patent publication number is ..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has released Jiangsu Jiejie Microelectronics Co Ltd patent application for Silicon Controlled Rectifier Self-adaptive Energy-saving Trigger Circuit and System Based on Nonlinear Semiconductor Temperature Control Characteristic. This invention was developed by Tang C..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Beijing Huacheng Electronic Co Ltd has sought patent for Signal Acquisition Control Method, Matching Controller, Matcher and Semiconductor Process Equipment. This invention was developed by Li Ying, Niu Zhonglian and Cheng Xiaoyang.
The patent application number is CN202410324183 20240320. The patent publi..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Hangzhou Beihang University International Innovation Institute Beihang University International Innovation Insti has submitted a patent application for Low-noise Photoelectric Front-end Amplification Circuit Chip. This invention was developed by Wu Lianbo.
The patent application number is CN202511220170 20..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Chengdu Aiwei Microelectronic Tech Co Ltd has sought patent for Common-mode Voltage Control Circuit and D-type Power Amplifier Chip. This invention was developed by Cheng Xiaoyang.
The patent application number is CN202510837338 20250620. The patent publication number is CN120729178 (A). International Pate..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has published Shenzhen Raybow Optoelectronic Co Ltd patent application for Semiconductor Edge-emitting Laser Device and Preparation Method of Semiconductor Edge-emitting Laser Device. The invention was developed by He Jinguo.
The patent application number is CN20..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Tianfu Wireless Intelligent Res Institute has applied Chinese patent for Broadband Wide-angle Single-layer Substrate Linear Circular Polarization Conversion Device Based on Metasurface. Li Yuke, Li Zhiye, Zhou Zelin, Wang Hongbin, Wang Dongyang and Li Xinran developed it.
The patent application number is C..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received Beijing Bige Bosi Information Tech Co Ltd patent application for Interposer Electronic Module for Semiconductor Interposer Process and Manufacturing Method Thereof. Xu Xingxuan developed the invention.
The patent application number is CN202410497421 ..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has released Karamay Tanhe Network Tech Co Ltd and University of Shanghai for Science and Technology patent application for Composite Heat Dissipation Device Applied to Electronic Chip. This invention was developed by Kim Kyum, Wang Tao, Zheng Xiaohai, Ilijiang Epag..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received Hangzhou Toll Microelectronics Co Ltd patent application for Heat Dissipation Structure of Control Chip. Yu Aidi, Gao Lihua, Wang Weili and Gao Kewei developed the invention.
The patent application number is CN202510832275 20250620. The patent public..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has published Suzhou Echip Microelectronics Tech Co Ltd patent application for Chip Superposition Packaging Process and Packaging Structure of Semiconductor Discharge Diode. The invention was developed by Ai Junsheng, Zhu Zhili and He Qiang.
The patent applicatio..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has published Guangdong Taijin Semiconductor Tech Co Ltd and Dongguan Taijin Precision Tech Co Ltd patent application for Plastic Package Chip Packaging Method and Plastic Package Chip Packaging Structure. The invention was developed by Huang Meilin.
The patent a..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Guangdong Xincheng Photoelectric Semiconductor Co Ltd has sought patent for Laser Cutting Method for Wafer. This invention was developed by Li Yuqing, Jing Haiyang and Huang Runfa.
The patent application number is CN202510606426 20250512. The patent publication number is CN120727660 (A). International Pate..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has released Zhongwang Jinshi Tianjin Automation Tech Co Ltd patent application for Miniature Chip Clamp. This invention was developed by Li Jintao, Ji Qingsong, Li Yang, Bao Yanlei and Xia Xiaokang.
The patent application number is CN202511231866 20250901. The p..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received Suzhou Xixing Semiconductor Tech Co Ltd patent application for Wafer Stage and Wafer Transfer Device. Tao Dashuai, Wang Jing, Zhang Jin, Jin Yujie, Li Gaofei, Chen Chang, Chen Zhaoyun, Chen Junru and Wu Dong developed the invention.
The patent applic..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Suzhou Xixing Semiconductor Tech Co Ltd has sought patent for Wafer Carrying Disc and Wafer Transferring Device. This invention was developed by Wang Jing, Li Gaofei, Chen Chang, Zhang Jin, Jin Yujie, Chen Junru, Chen Zhaoyun, Wu Dong and Tao Dashuai.
The patent application number is CN202511185028 2025082..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Hangzhou Zhicun Suanli Tech Co Ltd has sought patent for Digital-to-analog Conversion Circuit and Analog-to-digital Conversion Circuit Multiplexing Device in Storage and Calculation Integrated Chip. This invention was developed by Wang Shaodi.
The patent application number is CN202510947129 20190226. The p..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has published Suzhou Wuai Yida Internet Of Things Co Ltd patent application for Communication Control Method and System Based on Smart Wearable Chip. The invention was developed by Mao Zhangmei, Su Hongfei and Nie Shilong.
The patent application number is CN20241..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- Chongqing Haishiyuan Tech Co Ltd has filed a patent application for Semiconductor Film Preparation Method Based on Nano Material. This invention was developed by Duan Haiping.
The patent application number is CN202510979014 20250716. The patent publication number is CN120730869 (A). International Patent Cl..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has released Jiangsu Pangu Semiconductor Tech Co Ltd patent application for Vacuum Consumable-free Film Tearing Mechanism. This invention was developed by Zhang Dengke.
The patent application number is CN202510881392 20250627. The patent publication number is CN1..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has published Xinxin Hangtu Suzhou Tech Co Ltd patent application for Image Output Method, Image Output System, Integrated Circuit, and Domain Controller. The invention was developed by Zhu Chunyou.
The patent application number is CN202410362104 20240327. The pa..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Nanjing Yili Xinchuang Semiconductor Tech Co Ltd has sought patent for Heating Disc Assembly and Vacuum Film Pressing Equipment. This invention was developed by Zhang Jingnan, Su Yongxu and Chen Mingzhan.
The patent application number is CN202510611400 20250513. The patent publication number is CN120727615..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- Photosense Inc has submitted a patent application for Manufacturing Method of Light-emitting Diode Packaging Structure and Light-emitting Diode Packaging Structure. This invention was developed by Xie Xinpo.
The patent application number is CN202410318752 20240320. The patent publication number is CN120730..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has published Nanan Xinhua Element Sintered Packaging Co Ltd patent application for Rotary Continuous Sintering and Packaging Device and Sintering and Packaging Process. The invention was developed by Li Zhixun and Li Xiaohui.
The patent application number is CN2..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Changdian Microelectronics Jiangyin Co Ltd has sought patent for Packaging Structure and Forming Method of Packaging Structure. This invention was developed by Chen Ming, Sheng Ming, Zhao Qiang, Li Wenjie and Li Yao.
The patent application number is CN202510897327 20250630. The patent publication number is..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Guizhou Zhongxin Microelectronics Tech Co Ltd has sought patent for Chip Dfn0603-3l Packaging Process. This invention was developed by Zeng Changchun and Shi Yan.
The patent application number is CN202510891284 20250630. The patent publication number is CN120727583 (A). International Patent Classification ..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has released Xinyibang Semiconductor Jiangsu Co Ltd patent application for Decoupling Type Light-weight Dispensing Device. This invention was developed by Wu Hongjun, Wu Hua, Miao Hu, Peng Fangfang, Zhou Feng, Gao Fuliang, Wang Xiaochun and Xie Pei.
The patent ap..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Semiconductor Mfg International Shanghai Co Ltd has submitted a patent application for Packaging Structure and Packaging Method. This invention was developed by Ye Hua, Fei Chunchao and Wang Yaping.
The patent application number is CN202410386170 20240329. The patent publication number is CN120727577 (A). ..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received Semiconductor Mfg International Shanghai Co Ltd patent application for Semiconductor Packaging Structure and Packaging Method. Ye Hua, Fei Chunchao and Wang Yaping developed the invention.
The patent application number is CN202410383134 20240329. The..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has published Calterah Semiconductor Technology, Shanghai patent application for Information Protection Method and System, Controller, Processor, Equipment and Medium. The invention was developed by Wang Dongyu and Shen Yang.
The patent application number is CN20..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Zhejiang University has submitted a patent application for Semiconductor Device Critical Breakdown Characteristic Simulation Method Based on Hybrid Finite Volume Method. Wang Qichao, Zhao Dongyan, Yin Wenyan, Chen Yanning, Liu Fang, Zhang Nianen, Yang Young-jong, Wang Yinda, Zhu Yaxing, Li Tanyi, Du Zhengwei ..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Shanghai IC R&D Centre has submitted a patent application for Semiconductor Device Unit Structure Modeling Method and Device, Equipment and Storage Medium. Pang Jiayu and Liu Linlin developed the invention.
The patent application number is CN202410355904 20240327. The patent publication number is CN1207249..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- North University of China has filed a patent application for Difference Characteristic Time Phase Perception Driven Infrared and Visible Light Video Mimicry Fusion Method. This invention was developed by Guo Xiaoming, Ji Linna and Yang Fengbao.
The patent application number is CN202510958590 20250711. The ..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- North Integrated Circuit Tech Innovation Center has submitted a patent application for Non-volatile Memory Unit Circuit Based on Sram (static Random Access Memory), Control Method and Memory. Guo Chenglei and Wu Xusheng developed the invention.
The patent application number is CN202410384727 20240329. The ..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- GigaDevice Semiconductor has submitted a patent application for Split Gate Type Flash Memory and Operation Method. Li Qi and Cui Bo developed the invention.
The patent application number is CN202410363139 20240328. The patent publication number is CN120727059 (A). International Patent Classification codes ..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- ChangXin Technology Group has submitted a patent application for Semiconductor Process Equipment and Use Method Thereof. This invention was developed by Nong Xingshun.
The patent application number is CN202510819755 20250618. The patent publication number is CN120727618 (A). International Patent Classifica..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Beijing E Town Semiconductor Technology has applied Chinese patent for Opening and Closing Device and Opening and Closing System. Cao Hongbo, Liu Peng, Ma Tao and Lu Fangfang developed it.
The patent application number is CN202510897667 20250630. The patent publication number is CN120727621 (A). Internatio..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- SAE Technologies Development, Dongguan has sought patent for Semiconductor Element Mounting Device. This invention was developed by Liu Jianhua.
The patent application number is CN202410363729 20240328. The patent publication number is CN120727648 (A). International Patent Classification codes are B24B37/0..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- ChangXin Technology Group has submitted a patent application for Semiconductor Structure and Preparation Method Thereof. Tian Cancan and Mao Siwei developed the invention.
The patent application number is CN202510899287 20250630. The patent publication number is CN120727681 (A). International Patent Classi..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received ChangXin Technology Group patent application for Semiconductor Structure and Manufacturing Method Thereof. Zhu Xiangyu developed the invention.
The patent application number is CN202510855943 20250624. The patent publication number is CN120727683 (A)..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Intel has submitted a patent application for Integrated Circuit Structure with Interleaved Backside Interconnects. This invention was developed by De Silva Jaime, Kobrinsky Mauro J, Haratipour Nazila and Dutta Santanu.
The patent application number is CN202510224427 20250227. The patent publication number ..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Nichia has sought patent for Semiconductor Element, Light-emitting Device and Manufacturing Method Thereof. This invention was developed by Norishima Hideyuki and Aihara Hiroshi.
The patent application number is CN202510355293 20250325. The patent publication number is CN120728356 (A). International Patent..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- H3C Holdings has submitted a patent application for Method and Equipment for Realizing Remote Direct Memory Access Packet Loss Recovery. This invention was developed by Xiang Xuefeng.
The patent application number is CN202510899825 20250630. The patent publication number is CN120729781 (A). International P..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- Smic Integrated Circuit Ningbo has filed a patent application for Surface Acoustic Wave Resonator and Preparation Method Thereof. This invention was developed by Yu Chao, Qi Fei, Liu Dongqing, Pan Xiaojun and Zhao Ruiping.
The patent application number is CN202510803955 20250616. The patent publication num..
Semiconductor
| Fri 06 Mar 2026
Munich, March 7 -- European Patent Office has released Meta Platforms Technologies patent application for Fabrication of Dielectric Layers with Varying Refractive Index for Anti-reflection Coatings. This invention was developed by Abbott Anthony, Luo Jie, Lefebvre Paul Murray and Lin Kevin Lai.
The patent application number i..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has released Shenzhen Zhisai Prec Equipment Co Ltd patent application for General Automatic Alignment Method for Gallium Arsenide Wafer Cutting. This invention was developed by Chen Yuansheng.
The patent application number is CN202510917174 20250703. The patent p..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has released Beijing Integrated Circuit Equipment Innovation Center Co Ltd patent application for Niobium-based Josephson Junction Etching Method and Semiconductor Process Equipment. This invention was developed by Yao Xingbing, Luo Yongjian, Wang Wenli and Yao Qi.
..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has released Origin Quantum Computing Technology Hefei Co Ltd patent application for Manufacturing Method of Quantum Device and Superconducting Quantum Chip. This invention was developed by Jia Zhilong.
The patent application number is CN202410367334 20240328. Th..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has released Jiaxing Kunbo New Energy Equipment Mfg Co Ltd patent application for Polishing Device for Inner Wall of Semiconductor Furnace. This invention was developed by Weng Chenkai, Zhou Xiang and Gao Wenzhu.
The patent application number is CN202510840958 20..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has released Guangdong Xinyueneng Semiconductor Co Ltd patent application for Preparation Method of Semiconductor Structure and Semiconductor Structure. This invention was developed by Zhu Pulei, Huang Xiuhong, Chen Xiao, Yang Wenmin and Yang Jun.
The patent appl..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has published Zhejiang Jingke New Mat Co Ltd patent application for Silver Paste and Solar Cell. The invention was developed by Ran Yuanming, Tao Yuefei, Ye Zhixian, Hu Jiehui and Lyu Buyun.
The patent application number is CN202510839606 20250620. The patent pub..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has released Zhejiang Liji Storage Tech Co Ltd; Ribachi Japan Ltd patent application for Semiconductor Memory Device. This invention was developed by Kubo Takashi, Su Jingyao, Kawasaki Masaru, Yu Xiao and Deng Xuejian.
The patent application number is CN202511235..
Semiconductor
| Fri 06 Mar 2026
Munich, March 7 -- European Patent Office has released Omicron Laserage Laserprodukte GmbH patent application for Positioning Device for Positioning a Light-conducting Fiber in a Calibration Port. This invention was developed by Baumann Sönke-nils.
The patent application number is EP20240198285 20240903. The patent publicati..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has published Chengdu Haiguang Microelectronics Tech Co Ltd patent application for Consistency Verification Method, Chip Design Verification Method and Related Device. The invention was developed by Zhang Jiajin, Cao Jun, Geng Jianbo and Li Yang.
The patent appli..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has published Suzhou Hongan Machinery Co Ltd patent application for Control System and Method of Wafer Box Loading Port. The invention was developed by Liu Daqing, Zhu Yue, Wang Zhi, Xu Danping and An Teng.
The patent application number is CN202511202888 20250827..
Semiconductor
| Fri 06 Mar 2026
Munich, March 7 -- European Patent Office has published Mcgowan Senor Labs Ltd patent application for a Solid-state Potentiometric Oxygen Sensor Chip. The invention was developed by Smith Peter.
The patent application number is EP20240198257 20240903. The patent publication number is EP4703718 (A1). International Patent Class..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has published Shunde Innovation College University Of Science And Technology Beijing, University of Science and Technology Beijing, Hangzhou Dianzi University and Southeast China Research Institute Of Application Magnetics No. 9 Research Institute Of China Electro p..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has published BOE Technology Group and Mianyang BOE Optoelectronics Technology patent application for Display Substrate and Display Device. The invention was developed by Jiang Peng, Song Erlong, Zhang Jingli, Tao Tao, Xu Wenjing and Zhang Kai.
The patent applica..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has released Mitsu Chemicals Inc patent application for Method for Manufacturing Substrate Laminate, Laminate, and Substrate Laminate. This invention was developed by Oka Wataru and Kayaba Yasuhisa.
The patent application number is CN20248012159 20240213. The pat..
Semiconductor
| Fri 06 Mar 2026
Munich, March 7 -- European Patent Office has released Siliconix Incorporated patent application for Semiconductor Device Having Single-member Conductive Leads Coupled to Both Sides of a Die, and Method for Forming, and System Incorporating, the Semiconductor Device. This invention was developed by Lin Barry and Chiu Tony.
Th..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has published Jiangxi Qianzhao Photoelectric Co Ltd patent application for Ultraviolet Led Epitaxial Wafer and Preparation Method Thereof, LED Chip and Light-emitting Device. The invention was developed by Huo Liyan, Teng Long, Wu Honghao, Liu Zhao and Liu Shiwei.
..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has published Sanan Japan Tech Co Ltd patent application for Semiconductor Chip. The invention was developed by Tamura Kentaro, Nakamura Hiroshi and Shioi Shinichi.
The patent application number is CN202510352461 20250325. The patent publication number is CN12073..
Semiconductor
| Fri 06 Mar 2026
Munich, March 7 -- European Patent Office has published Uab Vilnius Pakuote patent application for a Container, a Container Substrate and a Method for Providing a Container Substrate. The invention was developed by Babravicius Algirdas.
The patent application number is EP20240196975 20240828. The patent publication number is ..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received Wondersolar Co Ltd patent application for Indium-doped Tin Oxide Perovskite Solar Cell and Preparation Method Thereof. Peng Yishu, Zheng Haizhao, Chen Xiayan, Sheng Yusong and Jiang Youyu developed the invention.
The patent application number is CN20..
Semiconductor
| Sat 07 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received Ningde Contemporary Future Energy Shanghai Research Institute and Ningde Contemporary Amperex Technology patent application for Flying Chip Detection Method and Device, Electronic Equipment and Computer Readable Storage Medium. Hou Kuanxu developed the ..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received Mianyang Xinxin Titanium Crystal Tech Co Ltd patent application for Method for Inhibiting Efficiency Roll-off of Quantum Dot Light Emitting Diode. Chen Fang, Dai Xingliang, He Haiping and Ye Zhizhen developed the invention.
The patent application num..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received BOE Technology Group, Chengdu BOE Optoelectronics Technology and Beijing BOE Technology Development patent application for Display Substrate and Display Device. Hu Ming, Liu Tingliang, Fan Cong, Wang Benlian, Dong Xiangdan, Huang Yao, Zhang Wei, Yan Jun..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received Magnohot Co Ltd patent application for Mother Substrate for Display Device and Display Device. Yanagisawa Syou developed the invention.
The patent application number is CN202510318562 20250318. The patent publication number is CN120730934 (A). Intern..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received Nanchang University, Nanchang Laboratory and Nanchang Silicon Based Semiconductor Tech Co Ltd patent application for Led Chip Capable of Improving Heat Dissipation and Slowly Releasing Stress and Preparation Method Thereof. Wang Guangxu, Zhang Quan, Wu ..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received Dongguan Shengzhi Automation Equipment Co Ltd patent application for Metal Cutting Machining Equipment with Chip Blocking Prevention Function. Dong Bo, Zheng Yuxiang and Wang Pengsheng developed the invention.
The patent application number is CN20251..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- Jiangsu Xianghuan Tech Co Ltd has sought patent for Method for Metallization on P-type Surface of Crystalline Silicon Solar Cell and Solar Cell. This invention was developed by Ji Jingjia, Qin Yusen, Zhou Guohua and Lu Yibo.
The patent application number is CN202410388499 20240329. The patent publication n..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- Changchun Changguang Yuanchen Microelectronic Tech Co Ltd has sought patent for Active Area Cell of Tmbs Chip, Tmbs Chip and Circuit Structure. This invention was developed by Wu Zhiwei, Li Yanqing, Zhang Haiyu, Ye Wuyang, Song Hongde and Cai Yushan.
The patent application number is CN202511193361 20250825..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received BOE Technology Group and Nanjing BOE Display Tech Co Ltd patent application for Display Substrate and Display Device. Zhang Qin, Gu Honggang, Chen Aishi and Shao Xianjie developed the invention.
The patent application number is CN20248000149 20240130..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- State Intellectual Property Office of China has received Wuxi Xinghua Henghui Tech Co Ltd patent application for Semiconductor Chip Dispensing Device. Xiao Yu, Mou Hongshan and Zhang Xinyu developed the invention.
The patent application number is CN202511158447 20250819. The patent publication number is CN..
Semiconductor
| Fri 06 Mar 2026
Munich, March 7 -- Demcon Tsst BV has sought patent for Vapour Deposition Device and Method of Depositing a Material Layer Onto a Substrate. This invention was developed by Rutgers Emiel Daniël, Rijnders Augustinus Josephus Helena Maria and Koster Gertjan.
The patent application number is EP20240725628 20240429. The patent p..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- Guangzhou Jinghong New Mat Co Ltd has applied Chinese patent for Auxiliary Device in Processing Process of Large-size Lithium Niobate Wafer. Zhang Jianghao, Zhu Zhinong, Wang Haoxu and Shen Feng developed it.
The patent application number is CN202510898194 20250701. The patent publication number is CN12073..
Semiconductor
| Fri 06 Mar 2026
Beijing, March 7 -- Suzhou Runbang Semiconductor Material Tech Co Ltd has applied Chinese patent for Mini Led Chip Packaging Method. Ma Xiaoming, Liang Hui, Chen Yu, Chen Jiyuan, Peng Zhenwen and Yang Zhe developed it.
The patent application number is CN202510688122 20250527. The patent publication number is CN120730901 (A). ..
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