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Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Shanghai Wandehonghui Information Tech Co Ltd has submitted a patent application for Transaction Risk Control System and Method Based on Memory and Medium. This invention was developed by Zhu Xuanning, Jie Guangfa and Xu Maolin.
The patent application number is CN202510303110 20250314. The patent publicatio..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Xidian University and Guangzhou Research Institute Of Xidian Univ have submitted a patent application for Multi-noise Source Equivalent Circuit Topological Structure of GaN HEMT Device. Liu Zhihong, Hu You, Dong Gaofeng, Shen Jiqian, Xing Weichuan and Zhang Jincheng developed the invention.
The patent appli..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Dongfang Electric Chengdu Innovation Res Co Ltd has submitted a patent application for IGBT Loss and Junction Temperature Calculation Method. Liu Jingbo, Chen Haojie, Yang Jiawei and Yang Bing developed the invention.
The patent application number is CN202510140086 20250208. The patent publication number is..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Zhejiang University and Zhejiang Chuangxin Integrated Circuit have submitted a patent application for Split Gate Memory Parameter Optimization Method Based on Machine Learning. This invention was developed by Liu Ranran, Ling Wanyi, Ren Kun, Gao Dawei and Wu Yongyu.
The patent application number is CN202510..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Powerchip Semiconductor Manufacturing Corporation and Taiwan Tsinghua Univ have sought patent for Decision-making System for Equipment Maintenance. This invention was developed by Lin Xiuping, Guo Zongming, Liu Yuanyuan, Zhang Guohao, Xie Dongjin and Lin Chia-yang.
The patent application number is CN2023118..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has released Beijing Microelectronic Technology Inst and Beijing Mxtronics Corp patent application for Cascadable On-chip Memory Peripheral Control Circuit Capable of Correcting and Detecting Errors. This invention was developed by Chen Lei, Sun Jinyi, Sun Huabo, Yan..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Samsung Electronics has sought patent for Systems, Methods, and Apparatus for In-memory Processing Using Die-to-die Interconnects. This invention was developed by Chung Hyun-kwon.
The patent application number is CN202411788026 20241206. The patent publication number is CN120144513 (A). International Patent..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published Rambus patent application for Multi-precision Memory System. The invention was developed by Vogelsang Thomas and Hampel Craig E.
The patent application number is CN202510223953 20200319. The patent publication number is CN120144502 (A). International..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Samsung Electronics has filed a patent application for Apparatus for Die-to-die System. This invention was developed by Kim Soon-ju and Park Sae-young.
The patent application number is CN202411816015 20241211. The patent publication number is CN120144499 (A). International Patent Classification codes are G0..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Feiteng Tech Guangzhou Co Ltd and Phytium Technology have submitted a patent application for Memory Access Method, Processor and Related Equipment. This invention was developed by Wu Tong, Liu Yongpeng and Wang Yinfeng.
The patent application number is CN202510229066 20250227. The patent publication number ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- CSSC Lingjiu Electronic Wuhan Co Ltd has submitted a patent application for Multi-FPGA Module Updating Method Based on Xdma in Heterogeneous Platform. This invention was developed by Yang Aiting and Luo Yajun.
The patent application number is CN202510304592 20250314. The patent publication number is CN12014..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Rugao Enqi Daily Use Dept Store has submitted a patent application for Chip. This invention was developed by Zhang Youjin, Zhang Siqi, Sun Siyu and Hu Kaiyuan.
The patent application number is CN202510216676 20250226. The patent publication number is CN120144086 (A). International Patent Classification code..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Shanghai Lynuc Numerical Control Tech Co Ltd has submitted a patent application for Numerical Control System Based on FPGA. This invention was developed by Dai Wenyan and Yuan Zaisong.
The patent application number is CN202510284473 20250311. The patent publication number is CN120143689 (A). International P..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has awarded a patent to Zhejiang Yasheng Semiconductor Equipment Co Ltd for Semiconductor Waste Gas Cleaning Equipment. Wu Xianlong, Li Jiwei, Zhang Zhaozhao and Wu Zhe developed the invention.
The patent application number is CN202422709914U 20241107. The patent ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Anhui Puxinyuan Semiconductor Tech Co Ltd has been granted a patent for Breeding Lighting Growth Device Convenient to Arrange Underwater. Yuan Jiulong and Song Zixiong developed the invention.
The patent application number is CN202422355636U 20240926. The patent publication number is CN223375735 (U). Intern..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received Rongyao Terminal patent application for Fault Processing Method for Memory and Related Equipment. Zhou Yunpeng, Li Chenqing and Deng Shunyun developed the invention.
The patent application number is CN202311658331 20231205. The patent publication numb..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Runxi Microelectronics Chongqing Co Ltd and Cr Microelectronics Holdings Co Ltd have sought patent for Optimization Method of Photoetching Alignment Mark. This invention was developed by Miao Wenjia, Wan Li and Gan Yu.
The patent application number is CN202311719801 20231213. The patent publication number i..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Shaoxing Xinlian Semiconductor Tech Co Ltd has submitted a patent application for High-molecular Compound Coated Photomask. This invention was developed by Li Jiazhen and Huang Wenjie.
The patent application number is CN202510550814 20250428. The patent publication number is CN120143547 (A). International P..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Ganglida Jinjiang Tech Innovation Research Institute Co Ltd has submitted a patent application for Integrated Waveguide and Light Field Control Method Thereof. This invention was developed by Yu Changyuan and Huang Xuguang.
The patent application number is CN202510281090 20250311. The patent publication num..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published China Mobile IoT Co Ltd, Xinsheng Tech Co Ltd and China Mobile Communications patent application for Chip, Chip Security Verification Method and Device, Electronic Equipment and Storage Medium. The invention was developed by Liu Yong, Zhang Yankui, Ma X..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has released South China University of Technology and Yuexin Semiconductor Technology patent application for Floating Gate Coupling Coefficient Testing Method of Flash Memory Device. This invention was developed by Lin Weihao, Chen Rongsheng, Liu Wenhu and Zhu Jiali...
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Micron Technology has submitted a patent application for Smooth Rtt Transitions. This invention was developed by Fujimaki Ryo.
The patent application number is CN202411190510 20240828. The patent publication number is CN120148592 (A). International Patent Classification codes are G11C16/26, G11C16/34 and G11C..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Samsung Electronics has sought patent for Sense Amplifier Circuit and Semiconductor Memory Device Including Same. This invention was developed by Kim Kyung-min, Kim Donggun, Ryu Myung-sik, Park Su-jin, Baek In-seok, Won Bok-yeon and Yoon Jongmoon.
The patent application number is CN202411172427 20240826. The ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published Huawei Technologies patent application for Operation Method of Memory Array and Memory. The invention was developed by Xu Yannan, Xu Shengqiang, Ding Qingting and Lyu Hangbing.
The patent application number is CN202311718857 20231213. The patent public..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received Micron Technology patent application for Apparatus and Method for Access Operations During Voltage Transitions. Takahashi Hiroki, Nagashma Odile and Saito Shunichi developed the invention.
The patent application number is CN202411690399 20241125. The pa..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has released Tsinghua University patent application for Heterogeneous Integrated Sensing, Storage and Calculation Integrated Circuit, Chip and Manufacturing Method Thereof. This invention was developed by Wang Lai, Pan Wen, Tang Jinpu, Yang Zhaolong, Hao Zhibiao and ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Yangtze Memory Technologies has submitted a patent application for Memory Operation Method, Memory and Memory System. Zhao Xiangnan, Li Bo, Li Chenhui, Liu Hongtao, Zhang Shuai and Qi Wei developed the invention.
The patent application number is CN202311705591 20231211. The patent publication number is CN12..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Canon has submitted a patent application for Memory Controller, Control Method, and Memory Device. Shiraishi Daisuke and Ochiai Wataru developed the invention.
The patent application number is CN202411834521 20241213. The patent publication number is CN120148583 (A). International Patent Classification codes ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received Canon patent application for Memory Controller, Method of Controlling Memory Controller, and Memory Device. Hirata Naoki and Shiraishi Daisuke developed the invention.
The patent application number is CN202411825884 20241212. The patent publication numb..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Shengruixin Tech Co Ltd for Quartz Wafer Flatness Detection Device. Xiong Dewen, Shi Qing, Wu Chu and Chen Zongshan developed the invention.
The patent application number is CN202422916601U 20241128. The patent publication number i..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Hubei Jiangcheng Chip Pilot Production Services has been granted a patent for Substrate Processing Apparatus and Substrate Offset Detection Assembly. This invention was developed by Liu Changming.
The patent application number is CN202422545491U 20241022. The patent publication number is CN223376572 (U). Inte..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- BOE Technology Group and Mianyang BOE Optoelectronics Technology have applied Chinese patent for Display Substrate and Display Device. Zhou Renjie, Xiao Wangxiang, Huang Xingwei and Wang Canghong developed it.
The patent application number is CN202510505556 20250421. The patent publication number is CN12014..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Beijing Xiaomi Mobile Software and Beijing Xiaomi Songguo Elect Co Ltd have filed a patent application for Behavior Prediction Method and Device, Equipment, Vehicle, Storage Medium and Chip. This invention was developed by Zhang Qiong and Jin Dian.
The patent application number is CN202311696540 20231211. T..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have submitted a patent application for Flexible OLED Display Module Warping Processing Device and Method. Wang Shiyou, Yan Linhuan, Gao Yongxiao, Xiong Ren, Tang Qiang and Zhang Lei developed the invention.
The patent application number is CN2..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Suzhou Everbright Photonics Tech Co Ltd and Suzhou Everbright Semiconductor Laser Innovation Res Institute Co Ltd have sought patent for High-speed, High-efficiency and Low-cost Semiconductor Optical Communication Device and Preparation Method Thereof. This invention was developed by Wang Jun, Xiao Yao, Lu Xin..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Beijing Xiaomi Mobile Software and Beijing Xiaomi Songguo Elect Co Ltd have submitted a patent application for Image Processing Method and Device, Storage Medium and Chip. Jia Qifei, Zhang Yasen, Yan Zehang, Chai Yajie and Lu Qiming developed the invention.
The patent application number is CN202311696926 20..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Beijing Smartchip Microelectronics Technology and State Grid Electric Power Research Institute, State Grid Zhejiang Electric Power have sought patent for Quantum Random Number Generation Device, Chip and Quantum Random Number Generation Method. This invention was developed by Li Yan, Wang Jing, Zhang Yanjie, S..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- ACM Research, Shanghai, Acm Res Korea Inc and Qingxin Tech Co Ltd have applied Chinese patent for Substrate Processing Apparatus and Method. Xu Fei, Lee Kang-sik, Wu Jun, Yang In-jung, Cheng Cheng and Wang Jian developed it.
The patent application number is CN202510114602 20250123. The patent publication nu..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Nanjing University and Jiangsu Jieguan Catalytic Material Tech Co Ltd have sought patent for Novel Fuel Cell Catalyst Based on Novel Silicon Carbide Material. This invention was developed by Ding Weiping, Liang Chenjia, Zhao Ruiyao, Hou Xiaoxia, Guo Xiangke, Xue Nianhua, Peng Luming, Guo Xuefeng and Zhu Yan.
..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Siplp Microelectronics Chongqing Ltd and Cr Microelectronics Holdings Co Ltd have submitted a patent application for Manufacturing Method of Semiconductor Structure and Semiconductor Structure. This invention was developed by Liu Fei.
The patent application number is CN202311696626 20231211. The patent publ..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Tangzhi Science & Technology Hunan Development and Beijing Tangzhi Science & Tech Development Co Ltd have received a patent for Vertical Signal Detection Sensor with Out-of-plane Sensitive MEMS Accelerometer. This invention was developed by Wang Weisong, Liu Minying, Chen Weiqi, Wei Junjie and Song Xinhui.
..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Tangzhi Science & Technology Hunan Development and Beijing Tangzhi Science & Tech Development Co Ltd have been granted a patent for Horizontal Signal Detection Sensor with Out-of-plane Sensitive MEMS Accelerometer. This invention was developed by Wang Weisong, Liu Minying, Chen Weiqi, Wei Junjie and Song Xinhu..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Shanxi Lingshi Huayuan Coal Industry and Wuxi Key Sensor Photonics Tech Co Ltd have been granted a patent for Micro-vibration Signal Detection Device Based on Optical Fiber MEMS. Meng Jianwei, Ma Yuedong, You Hongwei, Zhao Weigen, Ren Shuai, Zhao Wei, Wang Yichuan, Wang Sen and Ding Fei developed the invention..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has awarded a patent to Shanghai Meite Curtain Wall Co and Shanghai Meite Curtain Wall Tech Co Ltd for Earthenware Brick and GRC Substrate Integrated Curtain Wall System. Zhu Qifei, Lu Shaolong, Li Liang, Ye Zaoming and Li Yunhao developed the invention.
The paten..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Realtek Semiconductor Corporation has applied Chinese patent for Coding and Decoding System and Coding Circuit and Decoding Circuit Thereof. Xu Jiongfa developed it.
The patent application number is CN202311718039 20231213. The patent publication number is CN120150711 (A). International Patent Classification ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has released Shenzhen Yangxing Tech Co Ltd patent application for Compensation Circuit and Compensation Method of Radio Frequency Clock Chip. This invention was developed by Cai Qinhong and Cai Ronghong.
The patent application number is CN202510624769 20250515. Th..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Taiwan Semiconductor Co Ltd has submitted a patent application for Wide-band Optical Relay. This invention was developed by Wang Dibao.
The patent application number is CN202410173549 20240207. The patent publication number is CN120150689 (A). International Patent Classification codes are H03K17/04, H03K17/..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Lii Semiconductor Inc has filed a patent application for Over-current Protection Method and Device for Silicon Carbide MOS (metal Oxide Semiconductor) Driving Control Chip. This invention was developed by Zheng Lingbo, Wang Yemei, Tang Shaolin and Wang Fulong.
The patent application number is CN202510165239..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has released ABLIC patent application for Protection Circuit and Semiconductor Device Including Same. This invention was developed by Tomioka Tsutomu.
The patent application number is CN202411778272 20241205. The patent publication number is CN120150683 (A). Interna..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Huawei Technologies has submitted a patent application for Voltage Comparison Circuit, Chip and Electronic Equipment. This invention was developed by Zeng Zhi.
The patent application number is CN202311718140 20231213. The patent publication number is CN120150682 (A). International Patent Classification codes ..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- STMicroelectronics International has submitted a patent application for Current Equalization Circuitry for Folded Branches of Rail-to-rail Input OTA with Class Ab Output Stages. This invention was developed by Giancristofaro Luca.
The patent application number is CN202411765474 20241204. The patent publicatio..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Chinese Patent for Test Socket for Enhancing Integrated Circuit Wafer Testing has been issued to Hezhou Tech Co Ltd. This invention was developed by Yu Weibin and Zeng Shaojun.
The patent application number is CN202422342110U 20240925. The patent publication number is CN223377440 (U). International Patent C..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Nuvoton Technology has been awarded a patent for Microprocessor Integrated Circuit Test Equipment. This invention was developed by Li Wenfeng.
The patent application number is CN202421588798U 20240705. The patent publication number is CN223377436 (U). International Patent Classification codes are G01R1/02, G0..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Chinese Patent for Pressure Head Device for Chip Testing and Temperature Control Testing Machine has been issued to Hangzhou Changchuan Technology. This invention was developed by Li Zhezhe, Fang Yunnan and Liu Yipeng.
The patent application number is CN202422410913U 20240930. The patent publication number is..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has awarded a patent to Wuxi Xipeng Semiconductor Testing Co Ltd for Detection Table for Semiconductor. Zhou Guocheng developed the invention.
The patent application number is CN202422564063U 20241023. The patent publication number is CN223377356 (U). Internationa..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Wuhu Longke Intelligent Equipment Co Ltd has been awarded a patent for Control Chip Performance Detection Device. This invention was developed by Yang Qilong.
The patent application number is CN202422445019U 20241010. The patent publication number is CN223377347 (U). International Patent Classification code..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Shenzhen Yunbao Intelligent Co Ltd has applied Chinese patent for Clock Burr-free Output Circuit and Chip. Zhang Xueli and Huang Jinjian developed it.
The patent application number is CN202510203635 20250224. The patent publication number is CN120150679 (A). International Patent Classification codes are H03..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Shenzhen Xinsheng Semiconductor has filed a patent application for Integrated Device Packaging Structure, Acoustic Device and Related Equipment. This invention was developed by Huang Lei, Zou Jie and Feng Duan.
The patent application number is CN202510623356 20250515. The patent publication number is CN1201..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Qingdao Huatuo Tech Co Ltd has submitted a patent application for Intelligent Flushing System for Solar Cell Panel of Photovoltaic Power Station. This invention was developed by Wang Haiying, Sun Dezheng, Gao Shufei and Liang Chaohua.
The patent application number is CN20251086272 20250120. The patent publi..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Giga Solution Tech Co Ltd has been granted a patent for Improved Structure of Probe Card Circuit Substrate. Wang Jielin, He Yunpeng, Chen Boyang, Dai Hengjun, Chen Minxian, Gan Dongsheng and Jian Zhengyu developed the invention.
The patent application number is CN202422348700U 20240926. The patent publicati..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Institute of Microelectronics, CAS has sought patent for Optical Interconnection System on Optical Chip and Optical Chip. This invention was developed by Fu Tianyang, Yang Yan, Sun Fujun, Yang Gang, Yang Zaili, Xiao Jing, Gao Hong, Tang Wei and Wang Yuxing.
The patent application number is CN202510221532 2025..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Zhongshan Chaojiayuan Solar Energy Tech Co Ltd has submitted a patent application for Solar Cell Panel Support Capable of Automatically Contracting, Solar Cell Panel and Method. Liu Chao developed the invention.
The patent application number is CN202510430450 20250408. The patent publication number is CN120..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Maxim Integrated Products has filed a patent application for Multi-phase Switching Power Converter with Low Magnetic Core Loss and Associated Method. This invention was developed by Ikriannikov Alexandr and Bairn Travis S.
The patent application number is CN202411775269 20241205. The patent publication numb..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Dongguan Yingde Prec Hardware Co Ltd has obtained a patent for transformer silicon steel sheet stacking and shaping machine. This invention was developed by Liu Ziyang, Liu Runzhi and Shan Shuyi.
The patent application number is CN202422814745U 20241119. The patent publication number is CN223378022 (U). Int..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Chinese Patent for Interaction Circuit of Chip and External Equipment, Mainboard and Electronic Equipment has been issued to Loongson Zhongke Chengdu Technology. This invention was developed by Wang Hongwei.
The patent application number is CN202422530693U 20241018. The patent publication number is CN22337770..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Uhoyan Technology Suzhou has been granted a patent for Developing Cavity Structure of Gluing Developing Machine. Zhou Xiubin and An Liyu developed the invention.
The patent application number is CN202422930615U 20241129. The patent publication number is CN223377601 (U). International Patent Classification cod..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Chinese Patent for Single Wafer Inverted Double-sided Structure Developing Flower Basket has been issued to Tianjin Huahui Xinke Intelligent Equipment Co Ltd. This invention was developed by Qu Di, Song Xueying and Li Zongyan.
The patent application number is CN202422180666U 20240905. The patent publication..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Hubei Jiagui Energy Tech Co Ltd has sought patent for Preparation Method of Metal-coated Nano Silicon Material for Lithium Ion Battery. This invention was developed by Jin Xianbo and Wu Zesheng.
The patent application number is CN202510413993 20250403. The patent publication number is CN120149378 (A). Inter..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Jiangsu Zhongxingwei Testing Co Ltd has secured a patent on Positioning Device for Oversized Packaging Chip Detection. Li Xiaoli, Wang Yilin and Mao Chen developed the invention.
The patent application number is CN202422738497U 20241111. The patent publication number is CN223377235 (U). International Patent..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Chinese Patent for 3D Imaging System and Detection System of Chip Product has been issued to Dongguan Huashi Crystal Electronic Tech Co Ltd. This invention was developed by Luo Jianhua, Luo Weihuan, Li Chao and Lyu Yongkang.
The patent application number is CN202422588808U 20241025. The patent publication n..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Shandong Inspur Huaguang Optoelectronics has been awarded a patent for Silicon-based Chip Detection Device. This invention was developed by Cao Zhifang and Yan Baohua.
The patent application number is CN20242291702U 20240828. The patent publication number is CN223377221 (U). International Patent Classificatio..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Infineon Technologies has applied Chinese patent for Devices Including Phase Change Switching Devices and Methods of Providing Phase Change Switching Devices. Kaemmer Klaus, Marcotte Michael and Bernd Pflum developed it.
The patent application number is CN202411801274 20241209. The patent publication number i..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Huawei Technologies has submitted a patent application for Semiconductor Device and Design and Manufacturing Method Thereof. This invention was developed by Zhang Zehao, Bai Yujie, Li Xiaohan, Diao Mengjuan and Li Peng.
The patent application number is CN202311695204 20231211. The patent publication number ..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published Guangdong Fenghua Semiconductor Technology patent application for High-power Semiconductor Package and Preparation Method Thereof. The invention was developed by Li Ziying, Tang Qingyuan, Ding Lulu and Guo Haojie.
The patent application number is CN202..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Hubei Xingchen Tech Co Ltd has submitted a patent application for Adapter Plate Structure, Preparation Method Thereof and Packaging Structure. Xiong Neng, Chen Zhen, Zhang Peiyuan, Zeng Hong and Liu Dengwu developed the invention.
The patent application number is CN202510261760 20250306. The patent publicat..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published Mitsubishi Electric patent application for Semiconductor Device. The invention was developed by Fukuda Ikumi.
The patent application number is CN202411787849 20241206. The patent publication number is CN120149279 (A). International Patent Classificat..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Macronix has applied Chinese patent for Semiconductor Structure and Manufacturing Method Thereof. Wang Yunyuan, Lv Zhengxian, Li Daiying and Weng Weilun developed it.
The patent application number is CN20241032380 20240109. The patent publication number is CN120149274 (A). International Patent Classificatio..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Xinai Tech Nanjing Co Ltd has applied Chinese patent for Package Substrate and Manufacturing Method Thereof. Que Junhua, Liu Yiwen and Xu Tianya developed it.
The patent application number is CN202510285909 20250311. The patent publication number is CN120149272 (A). International Patent Classification codes..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Mitsubishi Electric has applied Chinese patent for Semiconductor Device. Murakami Haruki developed it.
The patent application number is CN202411788993 20241206. The patent publication number is CN120149268 (A). International Patent Classification codes are H01L23/13 and H01L23/16. Cooperative Patent Classif..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Semiconductor Components Industries has submitted a patent application for Etching Die Cutting Systems and Related Methods. Su Bingzhi and Liu Yong developed the invention.
The patent application number is CN202410591682 20240514. The patent publication number is CN120149266 (A). International Patent Classifi..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Zhejiang Chuangxin Integrated Circuit has filed a patent application for Formation Method of Semiconductor Structure. This invention was developed by Zhou Luhao, Wu Yongyu, Tao Ran, Wang Jianghong and Huang Tianzhe.
The patent application number is CN202510370175 20250326. The patent publication number is CN1..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- SiEn QingDao Integrated Circuits has applied Chinese patent for Semiconductor Structure Surface Pretreatment Method. Zhao Qingqing, Gai Wenchao, Lyu Chaolong and Peng Jie developed it.
The patent application number is CN202510300502 20250313. The patent publication number is CN120149264 (A). International P..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has released Geke Semiconductor Shanghai Co Ltd patent application for Formation Method of Semiconductor Device. This invention was developed by Wang Rui, Wang Haiping, Yang Xiao and Jiang Yi.
The patent application number is CN202311701402 20231211. The patent pu..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received Tengyun Chuangxin Semiconductor Mat Shanghai Co Ltd patent application for Preparation Method of Germanium-on-insulator Substrate Structure. Chen Minteng and Yang Xiujing developed the invention.
The patent application number is CN202510579307 2025050..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Tengyun Chuangxin Semiconductor Mat Shanghai Co Ltd has submitted a patent application for Method for Preparing Fd-geoi Substrate Structure Through Ion Implantation Process. This invention was developed by Chen Minteng and Yang Xiujing.
The patent application number is CN202510579292 20250507. The patent pu..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Nanjing Yaozhizhou Intelligent Machinery Co Ltd has submitted a patent application for Packaging Device for Integrated Circuit. Qi Wenting and Liu Wenjing developed the invention.
The patent application number is CN202510351180 20250324. The patent publication number is CN120149254 (A). International Patent..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received Lisen Noco Hardware Co Ltd patent application for Substrate Holder, Substrate Holding Method, and Film Forming Apparatus. Watanabe Yasutaka, Inoue Masatoshi and Kitahara Masanori developed the invention.
The patent application number is CN202411808278..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- SEMES has applied Chinese patent for Support Unit and Container Storage System Comprising Same. Lee Sung Ho developed it.
The patent application number is CN202411771433 20241204. The patent publication number is CN120149251 (A). International Patent Classification codes are H01L21/677 and H01L21/687. Coope..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- SiEn QingDao Integrated Circuits has sought patent for Semiconductor Device and Etching Method. This invention was developed by Jin Zhiyuan, Liang Zhensen and Yan Ao.
The patent application number is CN202510293791 20250312. The patent publication number is CN120149248 (A). International Patent Classificati..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- Hefei Visionox Technology has submitted a patent application for Substrate Transfer and Semiconductor Manufacturing Apparatus. This invention was developed by Han Qingchen, Hayashi Masaki, Li Bo, Huang Weiru and Fu Yuting.
The patent application number is CN202510628718 20250515. The patent publication number..
Semiconductor
| Tue 06 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received Sanhe Jianhua High Tech Co Ltd patent application for Transfer Device for Semiconductor Wafer Thickness Detection. Mao Shangao, Wang Chao and Xing Ying developed the invention.
The patent application number is CN202510294130 20250313. The patent publi..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Realtek Semiconductor Corporation has sought patent for Method for Configuring Buffer and Image Synthesis Device. This invention was developed by Zhou Kaixiang and You Zhenwei.
The patent application number is CN202311706661 20231212. The patent publication number is CN120147105 (A). International Patent Clas..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has received Hangzhou Advanced Research Institute USTC patent application for Edge-end-oriented Low-power-consumption Infrared Intelligent Sensing Chip and Image Processing Method. Miao Jinshui, Guo Hengrui, Li Tengyue, Wan Zhenzhen and Hu Weida developed the inventi..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Tsinghua University has submitted a patent application for Intelligent Optical Computing Chip Cluster Architecture and System. This invention was developed by Fang Lu, Jiang Yizhou, Lee Sang-yong and Zhou Tiankuang.
The patent application number is CN202510379745 20250328. The patent publication number is CN1..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Harbin Institute of Technology has filed a patent application for Method for Constructing Linear Matrix Neural Network Computing Chip Based on Mach-zehnder Interferometer. This invention was developed by Liu Chaoming, Lin Sen, Huo Mingxue, Wang Tianqi, Qi Chunhua and Zhou Jiaming.
The patent application numbe..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published Guangdong University of Technology patent application for Integrated Circuit Chip Particle Time Sequence Optimization Method and Device, Equipment and Medium. The invention was developed by Zheng Xin, Zhang Shihan, Zhong Zhixian, Zhang Jiacheng, Gao Hua..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Qingdao Zitn Micro Electronics Co Ltd has sought patent for High-integration Hybrid Integrated Circuit Thermal Management Method and System. This invention was developed by Ding Changchun, Cui Jiupeng, Liu Xin, Liu Jun and Qian Manman.
The patent application number is CN202510289688 20250312. The patent pub..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Infineon Technologies has filed a patent application for Electronic System with Integrated Master Circuit and Integrated Slave Circuit. This invention was developed by Leisenheimer Stefan.
The patent application number is CN202411797887 20241209. The patent publication number is CN120145979 (A). International..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- Nanjing University has sought patent for Timing Sequence Driven Chip Global Layout Method. This invention was developed by Qian Chao, Shi Yunqi, Lin Xi and Xue Ke.
The patent application number is CN202510207721 20250225. The patent publication number is CN120145961 (A). International Patent Classification co..
Semiconductor
| Wed 07 Jan 2026
Beijing, Jan. 7 -- State Intellectual Property Office of China has published Zhejiang Green Zhixing Kechuang and Geely Holding Group patent application for Chip Verification Method, Chip Test Method and Cross-language Simulation System. The invention was developed by Luo Yicheng.
The patent application number is CN20251024227..
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