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Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- ASM International Holding has submitted a patent application for Semiconductor Processing Apparatus. Proserpio Davide, Bankras Radko Gerard, Jdira Lucian, Oosterlaken Theodorus G M, Terhorst Herbert and Yukananto Riza developed the invention.
The patent application number is EP20250217535 20251121. The pate..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- Hoya has submitted a patent application for Optical Glass, Optical Element Blank and Optical Element. This invention was developed by Kuwatani Shungo.
The patent application number is CN202511864764 20190726. The patent publication number is CN121591409 (A). International Patent Classification codes are C03C..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- Hebei Meitai Meizhi Mat Co Ltd has submitted a patent application for Preparation Method of Silicon Steel Grade Magnesium Oxide. This invention was developed by Xing Xuan, Bai Xuemei, Cai Weixing, Bi Liheng and Sun Mengyong.
The patent application number is CN202511968082 20251224. The patent publication n..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- Robert Bosch Co Limited has submitted a patent application for MEMS Vibration Element and Method for Operating MEMS Vibration Element. Classen Johannes developed the invention.
The patent application number is CN202511166027 20250820. The patent publication number is CN121591164 (A). International Patent C..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- Wuhu Wanlian New Energy Auto Parts Co Ltd has submitted a patent application for Copper Needle Type Heat Dissipation Substrate Needle Cutting Die. This invention was developed by Tian Jinlong and Li Liangang.
The patent application number is CN202511619518 20251106. The patent publication number is CN12158..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Beijing Shengfan Tech Co Ltd has applied Chinese patent for Flexible Solar Cell Based on Multi-module Splicing. Wang Ju and An Da developed it.
The patent application number is CN202511783613 20251128. The patent publication number is CN121586299 (A). International Patent Classification codes are H02S40/34..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Zhejiang Chuangxin Integrated Circuit has submitted a patent application for ESD Protection Structure, Forming Method Thereof and Semiconductor Device. Zhang Yiming, Tao Ran and Qiu Jia developed the invention.
The patent application number is CN202511800216 20251202. The patent publication number is CN12158..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Integrated Circuit Device and Manufacturing Method Thereof. This invention was developed by Chen Jiahui, Hong Jingyu, Cai Yukai and Zhang Jiarong.
The patent application number is CN202511571515 20251030. The patent publication number ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has published Runxin Microelectronics Dalian Co Ltd patent application for Depletion Type GaN Chip Internally Integrated with Diode and Cascade Device. The invention was developed by Ren Yongshuo, Xu Lingrui, Wang Ronghua and Liang Huinan.
The patent application ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Hefei Nexchip Integrated Circuit has filed a patent application for Preparation Method of Semiconductor Structure. This invention was developed by Li Fei and Dong Zongyu.
The patent application number is CN202610122489 20260129. The patent publication number is CN121586286 (A). International Patent Classific..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has published Navitas Semiconductor Inc patent application for Two-dimensional Electron Gas Charge Density Control. The invention was developed by Park Pil Sung.
The patent application number is CN202511727163 20220621. The patent publication number is CN12158628..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Shenzhen Tianlangxin Semiconductor has sought patent for Metal Oxide Semiconductor Field Effect Transistor and Preparation Method Thereof. This invention was developed by Lyu Haitao.
The patent application number is CN202610108045 20260127. The patent publication number is CN121586279 (A). International Pate..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has released Gree Electric Appliances, Zhuhai patent application for Sic LDMOS Device, Manufacturing Method and Chip. This invention was developed by Yang Gang, Peng Huayi, Xie Zixiang and Liao Yongbo.
The patent application number is CN202511490320 20251017. The p..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Jiangsu Huachuang Microsystems has sought patent for Five-layer Ddr (double Data Rate) Chip Stacking and Packaging Method. This invention was developed by Tian Lifang, Dou Zongyi, Nie Shankun, He Guoqiang, Li Shiping and Lin Ye.
The patent application number is CN20251224539 20251230. The patent publication ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has released Beijing NAURA Microelectronics Equipment patent application for Preparation Method of Semiconductor Device and Semiconductor Process Equipment. This invention was developed by Li Dong, Yang Guang and Wang Jing.
The patent application number is CN202511..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has released Dafeng Shuangzhan Electronic Tech Co Ltd patent application for Stacked Packaging Structure for Integrated Circuit Board. This invention was developed by You Zhifeng and Zhao Haikou.
The patent application number is CN202511661245 20251113. The paten..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has published Yiyang Xingzhiyuan Electronic Tech Co Ltd patent application for Auxiliary Jig for Manufacturing Copper-embedded Copper Substrate of Integrated Circuit. The invention was developed by Liu Jianchun.
The patent application number is CN20261022294 2026..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Nantong Wenhu Clean System Tech Co Ltd patent application for Chip Mounting Mechanism for Manufacturing Integrated Circuit Board and Chip Mounting Method Thereof. Wang Zhehu and Wang Mingwei developed the invention.
The patent application number is C..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has published Huang Tuqing patent application for Electric Heating Tube Adopting Organic Silicon Heat Conduction Paint. The invention was developed by Huang Tuqing.
The patent application number is CN202511824162 20251205. The patent publication number is CN12158..
Semiconductor
| Wed 10 Jun 2026
Munich, June 11 -- Synopsys has applied European patent for in Situ Delay Measurements on Integrated Circuits Using Live Data and Pulse Width Modulation. Darbinyan Karen, Zorian Yervant, Khachatryan Grigor and Melkonyan Karen developed it.
The patent application number is EP20240791126 20240903. The patent publication number ..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 11 -- State Intellectual Property Office of China has received Shenji Semiconductor Tech Xuzhou Co Ltd patent application for Semiconductor Growth Apparatus. Wang Shuai, Chen Liang and Xing Shuaikang developed the invention.
The patent application number is CN202610107689 20260127. The patent publication number ..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 11 -- Tuojing Chuangyi Shenyang Semiconductor Equipment has sought patent for Rectification Gas Homogenizing Ring. This invention was developed by Chen Zhen, Yang Yan, Zhan Yong and Wu Zhe.
The patent application number is CN202511705922 20251119. The patent publication number is CN121575375 (A). International P..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Winbond Electronics has submitted a patent application for Semiconductor Structure. This invention was developed by Wei Hung-yu.
The patent application number is TW20240101270 20240111. The patent publication number is TW202529610 (A). International Patent Classification codes are H01L21/768, H01L23/522 and..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Taiwan Patent Office has published Samsung Display patent application for Display Device. The invention was developed by Choi Jin-woo, Lee Kang-young, Jeon Hyung-il and Tae Chang-il.
The patent application number is TW20240138832 20241011. The patent publication number is TW202529605 (A). International Pate..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Semiconductor Device Structure and Method for Forming the Same. This invention was developed by Chiang Chen-hao, Chang Li-weng, Wu Jiun-yi and Yu Chen-hua.
The patent application number is TW20240106939 20240227. The patent publication ..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Dowa Electronics Materials has filed a patent application for Semiconductor Light Receiving Element and Method for Manufacturing Semiconductor Light Receiving Element. This invention was developed by Nakano Masayuki, Moriya Yoshihiko and Watanabe Masahiro.
The patent application number is TW20240132384 2024..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Taiwan Patent Office has released Volta Semiconductor Inc patent application for a Semiconductor Power Device. This invention was developed by Nebesnyi Valerii, Widjaja Yuniarto, Zeni Nikolas, Duan Meng, Asenov Asen, Topaloglu Ismail and Bensouiah Djamel.
The patent application number is TW20240134684 20240..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Taiwan Patent Office has received Taiwan Semiconductor Manufacturing patent application for Semiconductor Structure and Method of Forming the Same. Cheng Yung-shih and Huang Wen-sheh developed the invention.
The patent application number is TW20240106967 20240227. The patent publication number is TW202529579 ..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Taiwan Patent Office has received Vanguard International Semiconductor patent application for Semiconductor Device and Methods for Forming the Same. Tzou Chen-dong and Lee Chia-hao developed the invention.
The patent application number is TW20240100699 20240108. The patent publication number is TW202529578 ..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Method for Fabricating Integrated Circuits, and Integrated Circuit. Syu Ming-cheng, Yang Yu-tao and Chou Wen-shen developed the invention.
The patent application number is TW20240107496 20240301. The patent publication number is TW20252..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Taiwan Patent Office has received KIOXIA patent application for Semiconductor Device and Semiconductor Memory Device. Maeda Takeru, Kaneko Sakuya, Toratani Kenichiro, Ochiai Takafumi, Matsuo Kazuhiro, Toda Masaya, Hoang Ha and Noda Kotaro developed the invention.
The patent application number is TW20240132880..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has published Sichuan Gaojing Solar Energy Technology and Gaojing Solar Energy patent application for Monocrystalline Silicon Drawing Power Automatic Adjusting Method, Device, Equipment and Medium. The invention was developed by Chen Jun, Xu Yao, Qiao Le, Fu Mingqua..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Samsung Electronics has submitted a patent application for Semiconductor Device. This invention was developed by Lee Hong-jun, Lee Ki-seok, Kim Hui-jung, Song Young-geun and Lee Yong-jin.
The patent application number is TW20240131637 20240822. The patent publication number is TW202529521 (A). International..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Taiwan Patent Office has received Winbond Electronics patent application for Semiconductor Structure and Method for Forming the Same. Hou Tai-an, Manabe Kazutaka and Peng Pei-hsiu developed the invention.
The patent application number is TW20240100245 20240103. The patent publication number is TW202529520 (..
Semiconductor
| Fri 12 Jun 2026
Taipei, June 12 -- Taiwan Patent Office has received Samsung Electronics patent application for Semiconductor Device. Cho Kyung-hee, Kim Hyo-jin, Hwang Dong-hoon and Moon Byung-ho developed the invention.
The patent application number is TW20240140022 20241021. The patent publication number is TW202529519 (A). International P..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Shanghai Xinwei Semiconductor Co Ltd has sought patent for Molecular Beam Epitaxy Heating Device, Epitaxy Equipment and Epitaxy Heating Method. This invention was developed by Zhao Xuyi, Wang Weizhu and Shang Jinming.
The patent application number is CN202511847758 20251209. The patent publication number i..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has released Hongyuan New Materials (Baotou) and Hongyuan Green Energy Co Ltd patent application for N-type Czochralski Silicon Dopant Co-doping Method. This invention was developed by Yang Hao, Sun Ziyang and Huang Huaiyu.
The patent application number is CN202..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Ji Hua Laboratory patent application for Layered Selenide Ge3sb2se5 Semiconductor Material and Preparation Method Thereof. Zhang Chuanlin, Lu Lu and Mi Shaobo developed the invention.
The patent application number is CN202610115797 20260128. The patent..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Xindong Micro Shanghai Semiconductor Tech Co Ltd has submitted a patent application for Automatic Liquid Supplementing Device Used in Tgv Electroplating Process, Electroplating System and Method. This invention was developed by Wang Steven He, Yin Qiongling, Wang Yitian, Lin Pengpeng, Zhou Zhiwei, Wang Zheng ..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has released Guangdong Aglaia Optoelectronic Materials patent application for Heterospiro Compound and Organic Light-emitting Device. This invention was developed by Chen Shaofu, Tan Jiahui, Dai Lei and Cai Lifei.
The patent application number is CN202511560428 2..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- Honor Device has submitted a patent application for Method for Determining Depth Value, Device, Chip System, and Storage Medium. Chang Zhongcan, Wang Ruoqiu, Wu Runhao and Feng Xiaogang developed the invention.
The patent application number is EP20240915885 20240108. The patent publication number is EP4756494..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- Fakeeyes Co Ltd has filed a patent application for Method and Apparatus for Detecting Shock Wave by Using Image Sensor.
The patent application number is EP20250828079 20250805. The patent publication number is EP4756353 (A1). International Patent Classification codes are F41A31/00, G06F18/21, G06N3/08, G06T..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received China Catalyst Holding Co Ltd patent application for Non-spherical Colloidal Silicon Dioxide as Well as Preparation Method and Application Thereof. Wang Chunyan, Li Yanxin, Jiang Jiawei, Sun Hongliang, Hu Yiming, Xu Jinghua and Jiang Shan developed the ..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- China Silicon; China Enfi Eng Corp has submitted a patent application for Method for Preparing Chlorosilane by Utilizing Recovered Silicon Material of Retired Photovoltaic Module. This invention was developed by Zhang Huizhi, Dong Chaoqiang, Wen Guosheng, Li Yanping, Yang Tao, Yan Dazhou, Wan Ye, Liu Jianhua ..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- Xiaomi Automobile Technology has submitted a patent application for Vehicle Control Method and Device, Vehicle, Chip and Storage Medium. This invention was developed by Fang Liang, Yu Lei, Gao Feng, Gu Haonan, Ye Zi, Gao Yemeng and Wang Zhensuo.
The patent application number is CN202511851615 20251209. The p..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- Starker Int Pte Ltd has sought patent for Aerosol-generating Substrate Carrier and Method of Manufacture of Same. This invention was developed by Kiew Yong Seang.
The patent application number is EP20250221197 20251205. The patent publication number is EP4755213 (A1). International Patent Classification cod..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- European Patent Office has released Applied Materials patent application for Si-ap Overhang Display. This invention was developed by Lin Yu-hsin, Choung Ji Young, Haas Dieter, Chen Chung-chia and Lee Jungmin.
The patent application number is EP20240849806 20240716. The patent publication number is EP4755155 (..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- Ce Cell Eng GmbH has filed a patent application for System for Electrically Contacting Wafer Solar Cells, In-line Production Device, and Method for Producing a Wafer Solar Cell. This invention was developed by Krassowski Eve, Stöckel Stefan and Hofmüller Eckehard.
The patent application number is EP202407..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- Texas Instruments has submitted a patent application for Semiconductor Device with a High K Field Relief Dielectric Structure. This invention was developed by Mahalingam Pushpa, Dunteman Nick, Rust Ryan and Sadovnikov Alexei.
The patent application number is EP20230947807 20231229. The patent publication numb..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Zhejiang Chuanghao Semiconductor Co Ltd patent application for Micropore Processing Method of Packaging Substrate and Packaging Substrate. Tang Hua, Zhang Linwei, Jiao Xuezhi, Lu Hailin and Chen Junqiang developed the invention.
The patent applicatio..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has released Shanghai Aipei Rongsi Electronic Tech Co Ltd patent application for Cutting Device for Semiconductor Device Processing and Use Method. This invention was developed by Yue Zheng.
The patent application number is CN20261053535 20260115. The patent publ..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Jinan Tmmt Stone Co Ltd patent application for Laser Cutting Equipment for Semiconductor Crystal Material Processing. Xi Xiangdong, Wang Jun, Zhang Lei and Zhang Wenxiang developed the invention.
The patent application number is CN202511985915 202512..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- Suzhou Lizhen Microwave Technology has filed a patent application for Eutectic Welding Equipment for Chip Processing. This invention was developed by Du Xiaohui, Wang Shaoqing, Zhou Zhongtai, Zhou Jinglei and Ding Yong.
The patent application number is CN202511557904 20251029. The patent publication number i..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Shenzhen Lanruixiang Tech Co Ltd patent application for Automatic Welding Device for Integrated Circuit Chip Processing. Chang Jinyu and Li Zonghan developed the invention.
The patent application number is CN20251225744 20251230. The patent publicati..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- European Patent Office has released Nexperia patent application for a Semiconductor Device and a Method of Manufacturing the Semiconductor Device. This invention was developed by Liu Haiyan, Yuan Zhihui, Liu Xu and Minotti Agatino.
The patent application number is EP20250219473 20251128. The patent publicatio..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- European Patent Office has published Samsung Electronics patent application for Semiconductor Device. The invention was developed by Chung Myungjin, Chung Eunguk, Cho Keun Hwi, Song Inhyun, Jeong Hoyeong, Lee Kyoungwoo and Heo Suhaeng.
The patent application number is EP20250188535 20250709. The patent publ..
Semiconductor
| Thu 11 Jun 2026
Beijing, June 12 -- SAE Technologies Development, Dongguan has filed a patent application for Anti-oxidation Treatment Method of Circuit Board Substrate. This invention was developed by Wang Yinguo.
The patent application number is CN202411176871 20240826. The patent publication number is CN121589019 (A). International Patent C..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- Samsung Electronics has filed a patent application for Semiconductor Device. This invention was developed by Kang Ju Hui, Kim Sanghyun, Ahn Shihyun, Hwangbo Sumin, Park Junhyuk, Kim Jongseob, Kim Joonyong, Son Chaeyeon and Jo Junbeom.
The patent application number is EP20250186361 20250630. The patent publi..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- Samsung Electronics has applied European patent for Semiconductor Device, Electronic Apparatus Including the Same, and Method of Manufacturing the Semiconductor Device. Park Baekwon, Yang Eunji, Kim Joonyun and Kim Sangwon developed it.
The patent application number is EP20250218937 20251127. The patent publi..
Semiconductor
| Thu 11 Jun 2026
Munich, June 12 -- Samsung Electronics has applied European patent for Semiconductor Device, Method of Manufacturing the Same, and Electronic Device Including the Semiconductor Device. Lee Eunkyu, Yoo Joungeun and Kwon Junyoung developed it.
The patent application number is EP20250216554 20251118. The patent publication number ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has released Shanghai Huali Integrated Circuit Manufacturing patent application for Manufacturing Method of Zero-layer Alignment Mark Suitable for Multi-material Active Region Substrate. This invention was developed by Xia Yu.
The patent application number is CN202..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has published Chengdu Yisiwei Computing Tech Co Ltd and Beijing ESWIN Computing Technology patent application for Electrostatic Protection Circuit, Chip and Equipment. The invention was developed by Bai Yuan.
The patent application number is CN202511714179 202511..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has released Muxi Integrated Circuit (Shanghai) patent application for Chip Packaging Method with High Heat Dissipation Performance, Chip Structure, Medium and Equipment. This invention was developed by Jing Chaoyu, Ma Yinglan and Gu Yu.
The patent application numb..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Xuyi Xinwang Electronic Co Ltd has submitted a patent application for Efficient GPU Chip Liquid Cooling Heat Dissipation Device. Jing Cheng, Qi Leiting and Wang Jinfang developed the invention.
The patent application number is CN202511537325 20251027. The patent publication number is CN121586472 (A). Inter..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has released Chongqing Xinlian Microelectronic Co Ltd patent application for Chip Structure and Chip Back Heat Dissipation Method. This invention was developed by Liu Lintao.
The patent application number is CN202511647921 20251111. The patent publication number ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has published East China University of Science and Technology and Nanchang Zhongwei Semiconductor Equipment Co Ltd patent application for Process Method for Eliminating Mask Collapse in High Aspect Ratio Silicon Through Hole Etching. The invention was developed by L..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Shanghai Huali Integrated Circuit Manufacturing has submitted a patent application for Soi Substrate Current Test Structure. This invention was developed by Yang Liu, Jiang Hao and Zhang Yu.
The patent application number is CN202511767514 20251127. The patent publication number is CN121586450 (A). Internatio..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has published Shanghai Huali Integrated Circuit Manufacturing patent application for Semiconductor Test Structure and Manufacturing Method Thereof. The invention was developed by Zha Binbin, Xu Jun, Huang Sha and Wang Bin.
The patent application number is CN20251..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has released Northwest Electronic Equipment Tech Research Institute Second Research Institute Of China Electronic patent application for Air Floating Type Leveling Device and Leveling Equipment for Wafer Alignment. This invention was developed by Dai Jiangwen, Wang ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Jingxin Semiconductor Huangshi Co Ltd has filed a patent application for Wafer Carrier Transition Wafer Reversing Device and Wafer Reversing Method. This invention was developed by Zhang Guangfa, Hu Jian and Chen Shuang.
The patent application number is CN202511547603 20251028. The patent publication numbe..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Xi'an Microelectronics Technology Institute has filed a patent application for Automatic Magnetic Attraction Tool and Method for Micro-assembly Bonding Chip Bonding Connection. This invention was developed by Lyu Qinglin, Feng Jishan, Wu Shaohua, Huang Darong, Cai Yingchao, Lian Xuefan, Song Jiayu and Xue Yah..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Itest Semiconductor Tech Jiangsu Co Ltd has submitted a patent application for Alignment Method Based on Wafer Before and After Recombination. This invention was developed by Bi Zhongming and Xiang Junwu.
The patent application number is CN202511759847 20251127. The patent publication number is CN121586434..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has published Northwest Electronic Equipment Tech Research Institute Second Research Institute Of China Electronic patent application for Hot-pressing Bonding Chip Stripping Mechanism. The invention was developed by Yan Wen'e, Yan Ying, Zhuang Yuan, Yang Wei, Dong Y..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Tokyo Electron has filed a patent application for Cleaning Method of Substrate Processing Apparatus. This invention was developed by Aratake Hidemasa, Kuroda Osamu and Kanagawa Kozo.
The patent application number is CN202511606667 20201010. The patent publication number is CN121586418 (A). International Pate..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Sbt Semiconductor Equipment Tech Co Ltd has submitted a patent application for Welding Head Module Heating and Cooling Device for Chip Bonding. This invention was developed by Shi Xinhua, Wu Yicheng, Huang Yixiang and Xiong Zehao.
The patent application number is CN202510698445 20250528. The patent publica..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Beiao Tech Shenzhen Co Ltd has applied Chinese patent for Chip and Semiconductor Manufacturing Equipment. Yi Yunhua and Xu Jiahao developed it.
The patent application number is CN202511798139 20251202. The patent publication number is CN121586412 (A). International Patent Classification codes are B08B3/02,..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Wuxi Hai Yi Semiconductor Tech Co Ltd patent application for Multifunctional Semiconductor Wafer Cleaning and Drying Equipment. Wang Yi and Xu Lei developed the invention.
The patent application number is CN202511790873 20251201. The patent publicati..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Huaian Haojie Chuangxin Semiconductor Equipment Co Ltd patent application for Semiconductor Production Wafer Cleaning Machine. Wu Hongwei developed the invention.
The patent application number is CN202511688467 20251118. The patent publication number..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Changfei Advanced Semiconductor Wuhan Co Ltd patent application for Bonding Wafer De-bonding Method. Wei Hao and Zhang Leiguo developed the invention.
The patent application number is CN20251257260 20251231. The patent publication number is CN1215864..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Chongqing Yineng Tech Co Ltd patent application for Scribing Method of Wafer with Back Metal Layer and Wafer Structure. Liu Wanzhong, Kim Byung-soo and Hu Xianwei developed the invention.
The patent application number is CN202511604274 20251104. The ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Beijing Integrated Circuit Equipment Innovation Center Co Ltd has submitted a patent application for Etching Method and Semiconductor Process Equipment. Lin Yuanwei, Wang Jianzong, Yuan Renzhi and Zhang Yue developed the invention.
The patent application number is CN202511652036 20251111. The patent public..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Method of Forming Semiconductor Device. Wu Zhiguang, Chen Zhihong and Chang Jin-ho developed the invention.
The patent application number is CN202511594428 20251103. The patent publication number is CN121586402 (A). International Paten..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has published Institute of Electrical Engineering, Chinese Academy of Sciences patent application for Semiconductor Film Doping Method and Semiconductor Structure. The invention was developed by Zhang Yufeng, Zhao Lei, Zhou Chunlan, Liu Huijing, Wang Guanghong and D..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Shanghai Insi Sensor Tech Co Ltd has applied Chinese patent for High-temperature Piezoresistive Chip Manufacturing Method Based on Silicon on Insulator and Heavy Doping Process. Zhang Qiyun and Liu Shanshan developed it.
The patent application number is CN202511786504 20251201. The patent publication numbe..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Zhejiang Lishui Zhongxin Jingyuan Semiconductor Tech Co Ltd has filed a patent application for Epitaxial Process Method for Stabilizing Breakdown Voltage of Substrate Device Heavily Doped with Red Phosphorus. This invention was developed by Shi Hainan.
The patent application number is CN202511806992 202512..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Univ Guiyang has submitted a patent application for Preparation Method and Application of Wafer-level Two-dimensional Semiconductor Heterojunction Film from Bottom to Top. This invention was developed by Dai Tianjun, Zhou Yi, Tian Lang, Zhang Ziyan, Zhou Zhangyu, Huang Yanbin, Jiang Changxin and Liu Huawei.
..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Shanghai Xinaoxinyi Tech Co Ltd has submitted a patent application for Bonded Wafer and Preparation Method Thereof. Wang Ziwen, Dai Rongwang, Wei Xing and Li Wei developed the invention.
The patent application number is CN202511843133 20251208. The patent publication number is CN121586392 (A). Internationa..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Suzhou Guoxian Innovation Tech Co Ltd has submitted a patent application for Array Substrate and Preparation Method Thereof, Display Panel and Display Device. This invention was developed by Zhao Yanfei.
The patent application number is CN202511761776 20251127. The patent publication number is CN121586370 ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Suzhou Guoxian Innovation Tech Co Ltd patent application for Solar Cell Module and Solar Cell. Gao Wei developed the invention.
The patent application number is CN202511774935 20251128. The patent publication number is CN121586361 (A). International ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has published Zhejiang Dongci Tech Co Ltd patent application for High-heat-dissipation RGB Chip Packaging Structure and Preparation Method Thereof. The invention was developed by Xu Yangsheng, Xu Le, Xie Jieyun, Zhang Yue, Zhou Wei and Zhang Qiang.
The patent app..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Silergy Semiconductor Technology (Hangzhou) patent application for Packaging Structure of Light-emitting Module. Xu Xiaoqiang and Zeng Zhenwen developed the invention.
The patent application number is CN202511565090 20251028. The patent publication num..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Sinopatt Semiconductor Technology, Guangdong has submitted a patent application for Multi-material Composite Substrate and Preparation Method Thereof. This invention was developed by Zhang Jianqiao, Lu Jianhang, Xiao Zhaowei, Li Peiwen and Zhang Xiaoqiong.
The patent application number is CN202511796843 2025..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has released Suzhou Nanowin Science And Tech Co Ltd patent application for Micro-led Device Based on GaN Homogeneous Substrate and Design Method and Application Thereof. This invention was developed by Wang Jianfeng and Cai Demin.
The patent application number is..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- State Intellectual Property Office of China has received Suzhou Xinju Semiconductor Co Ltd patent application for Chip Packaging Structure, Optical Device and Chip Packaging Method. Xing Hui, Yue Han and Li Qing developed the invention.
The patent application number is CN202511812226 20251203. The patent p..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Suzhou Nanowin Science and Tech Co Ltd has filed a patent application for Design Method of Flip-structure Micro-led Unit on GaN Homogeneous Substrate and Flip-structure Micro-led Device. This invention was developed by Wang Jianfeng and Cai Demin.
The patent application number is CN202511732313 20251124. T..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Global Sensor Technology Co Ltd has sought patent for Infrared Chip Low-temperature Testing Device with Double Thermal Interface Materials. This invention was developed by Huang Sheng, Huang Li, Chen Ziye, Yao Baiwen, Dai Junbi, Yi Xian, Wang Long, Zhang Xuewen, Deng Xi and Wang Shaowei.
The patent applica..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Triumph Photovoltaic Mat Co Ltd has submitted a patent application for Copper-indium-gallium-selenium Thin-film Solar Cell Module and Preparation Method Thereof. Zhu Denghua, Wang Longyi, Jiang Jiwen, Oh Chung-heon, Zhang Kuanxiang, Wu Yi, Dai Ziqiang, Wang Changhua and Cheng Haibo developed the invention.
..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Acken Optoelectronics Ltd has submitted a patent application for N-type Digital Alloy Material for Multiplication Region of Avalanche Photodiode and Preparation Method of N-type Digital Alloy Material. This invention was developed by Chen Chao, Qian Cheng and Chen Yiqiao.
The patent application number is C..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- The 10th Research Institute of China Electronics Technology Group has sought patent for Preparation Method of Heterojunction Bipolar Transistor Device. This invention was developed by Yu Hui, Yu Songlin, Liu Ming, Xing Weirong, Zhang Yi, Huo Xiaopei, Wen Tao, Zhou Lei, Wang Xiaoqian, Wang Jing, Ni Yupeng and ..
Semiconductor
| Fri 12 Jun 2026
Beijing, June 12 -- Goertek Microelectronics has submitted a patent application for Substrate Structure, Packaging Module and Electronic Equipment. This invention was developed by Zhou Yujie, Tao Yuan and Wang Dexin.
The patent application number is CN202511932779 20251219. The patent publication number is CN121586158 (A). Inte..
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