News For Last 1 Week
Industry
X
Assignee
Country
Status
-
Select All
Semiconductor
| Mon 19 Jan 2026
Beijing, Jan. 19 -- Jiangsu Aisen Semiconductor Mat Co Ltd and Aisen Semiconductor Mat Nantong Co Ltd have submitted a patent application for Chemically Amplified Positive Photoresist, Array Process and OLED. Zhou Haojie, Zhang Bing, Xiang Wensheng, Zhao Jianlong, Li Shuangqing, Yuan Huifang, Li Yifan, Wang Haochong, Dong Zhongs..
Semiconductor
| Mon 19 Jan 2026
Beijing, Jan. 19 -- Fuzhou BOE Optoelectronics Technology and BOE Technology Group have submitted a patent application for Display Substrate and Display Panel. This invention was developed by Li Chunyu, Hu Bo, Lin Xin, Zhou Rong, Wang Jianshu, Hu Pei, Mo Tongwei and Lin Lifeng.
The patent application number is CN20241009783 2..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Hefei Boe Joint Tech Co Ltd and BOE Technology Group have submitted a patent application for Display Substrate and Driving Method Therefor, and Display Apparatus, Driving Apparatus and Medium. This invention was developed by Feng Xuehuan, Li Yongqian and Zhou Dandan.
The patent application number is US2..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- SK Hynix Inc and Seoul National University R&DB Foundation have applied United States patent for Memory Controller and Operation Method Thereof. Jung Sungjun, Kwon Sangwoo, Lee Jaewook, Park Yongsang and Song Young Ook developed it.
The patent application number is US202418946506 20241113. The patent pu..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- SK Hynix Nand Product Solutions Corp Dba Solidigm and SK Hynix have submitted a patent application for Methods and Systems for SLC Copyback Operations. This invention was developed by Kathawala Gulzar, Zhang Ming, Wakchaure Yogesh, De Vries Jonathan, Carlton David, Ahn Yushin, Park Taehun and Cho Wanik.
..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Takeoka Lab Corp and Tokyo Electron have submitted a patent application for Processor for Controlling Pipeline Processing Based on Jump Instruction, and Program Storage Medium. Takeoka Shozo and Kinoshita Yoshio developed the invention.
The patent application number is US202318876798 20230530. The paten..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Samsung Electronics Co Ltd and Sogang Univ Research Foundation have applied United States patent for Photoresist Composition Including Organometallic Oxide Cluster Having Heterogeneous Inorganic Elements and Method of Manufacturing Integrated Circuit Device by Using the Photoresist Composition. Suh Ahram, ..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Tokyo Electron Ltd and National Univ Corporation Okayama Univ have sought patent for Mask Pattern Formation Method and Substrate Processing Method. This invention was developed by Oowada Shin, Asako Ryuichi, Muramatsu Makoto, Ono Tsutomu and Watanabe Takaichi.
The patent application number is US20251931..
Semiconductor
| Mon 19 Jan 2026
Beijing, Jan. 19 -- BOE Technology Group, Chengdu BOE Optoelectronics Technology and Beijing BOE Technology Development have submitted a patent application for Shifting Register, Display Substrate and Display Panel. This invention was developed by Huang Yao, Liu Tingliang and Dong Xiangdan.
The patent application number is CN..
Semiconductor
| Sun 18 Jan 2026
Beijing, Jan. 19 -- Wuhan University, Ultrahigh Pressure Branch Of State Grid Jibei Electric Power Company Ltd and China Electric Power Research Institute have applied Chinese patent for Quasi-threshold Voltage Acquisition Method, Quasi-threshold Voltage Acquisition Circuit and Junction Temperature Monitoring Method of Power Sem..
Semiconductor
| Sun 18 Jan 2026
Beijing, Jan. 19 -- Shandong University and Peking University Third Hospital have submitted a patent application for High-throughput Detection Chip for Multiple Exosome Biomarkers as Well as Preparation Method and Application of High-throughput Detection Chip. This invention was developed by Han Lin, Li Mo, Zhang Yu and Wu Yu.
..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Fan Zhaoyang, Lin Xueyan and Arizona Board of Regents on Behalf of Arizona State University have applied United States patent for Method for the Adjacent Electrodeposition of a Metal-organic Framework Coating on a Porous Substrate. Fan Zhaoyang and Lin Xueyan developed it.
The patent application number ..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Nippon Shokubai Co Ltd and Hiroshima University have applied United States patent for Method for Producing Silicon Film and Silicon Film. Yamamoto Tetsuya, Abe Takashi, Akiyama Tatsuhiko and Teramoto Akinobu developed it.
The patent application number is US202318879400 20230627. The patent publication n..
Semiconductor
| Sun 18 Jan 2026
Beijing, Jan. 19 -- Shenzhen Shangxi Green Energy Tech Co Ltd and Shenzhen Shangxi Shuangtan Tech Co Ltd have applied Chinese patent for Multi-station Automatic Chip Testing Equipment. Tang Weiping and Wang Yuqiong developed it.
The patent application number is CN202510730300 20250603. The patent publication number is CN12025..
Semiconductor
| Sun 18 Jan 2026
Beijing, Jan. 19 -- Zhejiang Xingke Photoelectric Tech Co Ltd and Beijing Bojia Tech Co Ltd have submitted a patent application for Pretreatment Method for Digesting Glass Substrate. Li Qing, Li Heran, Song Yabin, Chen Tiande, Zhao Yonghua, Dong Qingmin, Pan Ning, Fan Hongbin and Zhang Xichen developed the invention.
The pate..
Semiconductor
| Sun 18 Jan 2026
Beijing, Jan. 19 -- Phytium Technology and Feiteng Tech Changsha Co Ltd have submitted a patent application for High-speed Signal Wiring Structure and Method of Chip. This invention was developed by Liu Yonghui.
The patent application number is CN202510736284 20250604. The patent publication number is CN120257935 (A). Interna..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Fraunhofer-Gesellschaft has submitted a patent application for Laser Device and Manufacturing Method. Vasudevan Rajeswari Gayatri and Möhrle Martin developed the invention.
The patent application number is US202418761292 20240701. The patent publication number is US20260005491 (A1). International Paten..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Nichia has submitted a patent application for Light-emitting Device, Light-emitting Module, and Mobile Device. This invention was developed by Hori Akira.
The patent application number is US202519250192 20250626. The patent publication number is US20260005486 (A1). International Patent Classification co..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Toppan Holdings has submitted a patent application for Reflector Array, Reflector Array Device, and Method for Designing a Reflector Array. Imai Jumpei, Nishiyama Hiroyoshi, Kondo Shinpei and Nishimura Daiki developed the invention.
The patent application number is US202519314455 20250829. The patent pu..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has published T Mobile Innovations patent application for Reflector Array for Non-line-of-sight Coverage. The invention was developed by Au Chad Chun Fai.
The patent application number is US202418759196 20240628. The patent publication number is US20260005435 (A1). Inter..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Alpha and Omega Semiconductor International has sought patent for Semiconductor Package Having Side Protections and Method of Making the Same. This invention was developed by Xue Yan Xun, Wang Long-ching, Niu Zhiqiang and Wen Chunya.
The patent application number is US202418759365 20240628. The patent p..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- KIOXIA has submitted a patent application for Semiconductor Device. This invention was developed by Akada Yusuke.
The patent application number is US202519074693 20250310. The patent publication number is US20260005184 (A1).
An abstract released by the U.S. Patent and Trademark Office states: "A sem..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has released ROHM patent application for Semiconductor Device. This invention was developed by Kosaka Takara and Egami Kazuo.
The patent application number is US202519316352 20250902. The patent publication number is US20260005183 (A1).
According to the abstract rele..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has released Intel patent application for Land-side Die Cooling of Double-sided Package Substrates. This invention was developed by Gebrael Tarek, Elhebeary Mohamed, Ravoori Darshan, Magnavita Matthew T and Lu Xiao.
The patent application number is US202418758138 2024062..
Semiconductor
| Sun 18 Jan 2026
Beijing, Jan. 19 -- Jiangsu Shenzhou Semiconductor Technology has submitted a patent application for Ignition Control Method of Remote Plasma Source. This invention was developed by Pan Xiaogang, Shu Yinzhi, Gu Xiaojun and Geng Tao.
The patent application number is CN202510740220 20250605. The patent publication number is CN1..
Semiconductor
| Sun 18 Jan 2026
Beijing, Jan. 19 -- Fulian Yuzhan Technology Shenzhen has submitted a patent application for PVD (physical Vapor Deposition) Processing Monitoring Method, PVD Processing Prediction Model Training Method and Related Equipment. This invention was developed by Shi Yueding, Lin Junyan, Zan Yan, Zhang Yuanhua and Wu Zhenting.
The ..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- JCET STATS ChipPAC, Korea has submitted a patent application for Semiconductor Device and Method of Forming Interconnect Structure Using VFM and TCB. Lee Minsung, Yun Yeojun, Lee Heesoo and Park Junhee developed the invention.
The patent application number is US202418760283 20240701. The patent publicat..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has received Cirrus Logic International Semiconductor patent application for Integrated Die Circuit. Coleman Lee R, Amiri Omid and Khare Rupesh developed the invention.
The patent application number is US202418754623 20240626. The patent publication number is US202600051..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- STATS ChipPAC has applied United States patent for Semiconductor Package Assembly and Method for Forming the Same. Lee Jiseon and Maeng Bumryul developed it.
The patent application number is US202519246732 20250624. The patent publication number is US20260005103 (A1).
The abstract of the patent publ..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has received GlobalWafers patent application for Methods for Controlling Flatness of Handle Structures for Use in Semiconductor-on-insulator Structures. Liu Qingmin, Libbert Jeffrey L, Zhang Guoqiang David, Lottes Charles R, Lu Xiaofei, Kim Taehyeong, Bae Boram and Park Won..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- ASM has submitted a patent application for Method and Apparatus for Etching a Surface. This invention was developed by Surman Matthew, Krishtab Mikhail, Atosuo Elisa K, Xu Tao, Färm Elina, Dezelah Charles and Romero Patricio Eduardo.
The patent application number is US202519250048 20250625. The patent ..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Intel has submitted a patent application for Automated Minimization of Etch Variations by Adjusting Etch Process Based on Pattern Density. Suresh Divya, Sohn Egon, Sathe Ajay, Geremew Adane, Zheng Yixiong, Shah Manan, Luo Xian Yao, Erten Hale, Baidya Bikram, Javvaji Vishal and Atay Cemil M developed the in..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- YCCHEM has filed a patent application for Spin on Carbon Hardmask Compositions with Low Evaporation Loss and Patterning Method by Using the Same. This invention was developed by Lee Su Jin, Kim Gi Hong, Lee Seung Hun and Lee Seung Hyun.
The patent application number is US202218559791 20220503. The paten..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Intel has submitted a patent application for Methods of Fabricating Coupled Coaxial Inductors in Package Structures. This invention was developed by Saber Mohamed R.
The patent application number is US202418757265 20240627. The patent publication number is US20260004962 (A1). International Patent Classi..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has received Macronix patent application for Repairing Defective Columns of Compute-in-memory and Near-memory Computing Devices. Hung Chun-hsiung and Ho Hsin-yi developed the invention.
The patent application number is US202418755329 20240626. The patent publication numb..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Everspin Technologies has submitted a patent application for Systems and Methods for Monitoring and Managing Memory Devices. Alam Syed M, Janesky Jason, Lee Han Kyu, Almasi Hamid, Sanchez Pedro, Masgras Cristian P, Rahman Iftekhar, Ikegawa Sumio, Aggarwal Sanjeev, Houssameddine Dimitri and Neumeyer Frederi..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- KIOXIA has sought patent for Memory System. This invention was developed by Takeda Naomi and Shirakawa Masanobu.
The patent application number is US202519320191 20250905. The patent publication number is US20260004866 (A1). International Patent Classification codes are G11C29/12, G11C29/18, G11C29/42 an..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has published Macronix patent application for Memory Device and Memory System. The invention was developed by Tseng Po-hao, Fang Shao-yu and Lee Feng-min.
The patent application number is US202418760123 20240701. The patent publication number is US20260004854 (A1). Inter..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Lodestar Licensing Group has submitted a patent application for Comparison Operations in Memory. This invention was developed by Wheeler Kyle B, Manning Troy A and Murphy Richard C.
The patent application number is US202519322259 20250908. The patent publication number is US20260004841 (A1). Internation..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Storage Device, Electronic Apparatus, and Storage Device Control Method. Tatsuno Taro developed the invention.
The patent application number is US202318881745 20230711. The patent publication number is US20260004836 (A1). In..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has received Xilinx patent application for Memory Circuit with Bit Line Clamps. Rahul Kumar, Yachareni Santosh, Hussain Md, Alam Tabrez and Chong Nui developed the invention.
The patent application number is US202418758730 20240628. The patent publication number is US202..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Advanced Micro Devices has submitted a patent application for Memory Latency Aware Tiling for Generalized Matrix Multiplications on Parallel Processors. Masood Amna developed the invention.
The patent application number is US202418754865 20240626. The patent publication number is US20260003932 (A1). Int..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Wolfspeed has submitted a patent application for High Throughput High Dynamic Range (HDR) Microscopy. This invention was developed by Conrad Matthew David, Witry Jason William Leon and Van Brunt Edward Robert.
The patent application number is US202418759385 20240628. The patent publication number is US2..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Advanced Micro Devices has submitted a patent application for Systems, Methods, and Devices for Advanced Memory Technology. This invention was developed by Madan Niti, Loh Gabriel H and Magro James R.
The patent application number is US202519272158 20250717. The patent publication number is US2026000380..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has released General Electric Company patent application for Multicore Interferer Generation. This invention was developed by Ambrose Christopher J and Roper Simon E.
The patent application number is US202519174230 20250409. The patent publication number is US20260003760..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Intel has filed a patent application for Memory Bandwidth Control in a Core. This invention was developed by Madduri Venkateswara Rao, Brandt Jason W, Abraham Philip, Herdrich Andrew J and Luck Anthony.
The patent application number is US202418758220 20240628. The patent publication number is US20260003..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Silicon Laboratories has submitted a patent application for Sleep Management for Rtos Environment. Deschenes Jean Francois and Monchalin Marylise developed the invention.
The patent application number is US202418760801 20240701. The patent publication number is US20260003641 (A1). International Patent C..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has received ARM Ltd patent application for Instruction Fetching. Ecco Leonardo Luiz, Bolbenes Guillaume, Lanois Thibaut Elie and Wallon Benoît Henri Pierre-marie Matthieu developed the invention.
The patent application number is US202418754594 20240626. The patent publ..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has received Advanced Micro Devices patent application for Instruction Deltas for Processing-in-memory Divergence. Aga Shaizeen Dilawarhusen and Ibrahim Mohamed Assem Abd Elmohsen developed the invention.
The patent application number is US202418757922 20240628. The pate..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has released ARM Ltd patent application for Address Translation for Accelerator-triggered Memory Access Requests. This invention was developed by Hugosson Sven Ola Johannes, Rosemarine Elliot Maurice Simon, Bruce Klas Magnus and Grisenthwaite Richard Roy.
The patent appl..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- KIOXIA has submitted a patent application for Memory System. Onishi Shohei and Hasegawa Yohei developed the invention.
The patent application number is US202519330929 20250917. The patent publication number is US20260003514 (A1). International Patent Classification code is G06F3/06. Cooperative Patent C..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Advanced Micro Devices has filed a patent application for Power Gating for Memory Physical Layers. This invention was developed by Bhandari Saurabh, Haritsa Manjunath D, Prajapati Sandeep and Sriadibatla Srinivas.
The patent application number is US202418758387 20240628. The patent publication number is..
Semiconductor
| Sun 18 Jan 2026
Beijing, Jan. 19 -- GoerTek has submitted a patent application for File Management Method and Memory. This invention was developed by Zhao Dongdong, Sui Chenghao, Pan Junjie and Liu Yaocheng.
The patent application number is CN202510251495 20250303. The patent publication number is CN120255795 (A). International Patent Classi..
Semiconductor
| Sun 18 Jan 2026
Beijing, Jan. 19 -- Jiangsu Shenzhou Semiconductor Technology has applied Chinese patent for Remote Plasma Source Load Impedance Disturbance Protection Control Method and Device. Pan Xiaogang, Gu Xiaojun, Shu Yinzhi and Peng Yipeng developed it.
The patent application number is CN202510740219 20250605. The patent publication ..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has published SPTS Technologies patent application for Method of Treating a Shutter of a PVD Apparatus. The invention was developed by Haymore Scott, Wilby Tony and Jones Stephen.
The patent application number is US202418959918 20241126. The patent publication number is ..
Semiconductor
| Sun 18 Jan 2026
Beijing, Jan. 19 -- Yangtze Memory Technologies has submitted a patent application for Semiconductor Test Structure and Preparation Method Thereof. Wang Meng and Zhang Baohua developed the invention.
The patent application number is CN20241008367 20240103. The patent publication number is CN120254540 (A). International Patent..
Semiconductor
| Mon 19 Jan 2026
Beijing, Jan. 19 -- Guangdong Xincheng Hanqi Semiconductor Tech Co Ltd has submitted a patent application for Gluing Method of Thick Film Photoresist for Advanced Packaging. This invention was developed by He Han, Liu Kunqi, Yang Huihui, Hong Ruibin, Xie Sisi, Liu Zhiyun and Ran Qingsong.
The patent application number is CN20..
Semiconductor
| Mon 19 Jan 2026
Beijing, Jan. 19 -- Samsung SDI has submitted a patent application for Semiconductor Photoresist Composition and Method of Forming Pattern Using the Same. This invention was developed by Zhang Sangji, Han Meilian, Shin Seung-wook and Baek Jae-yeol.
The patent application number is CN202411715264 20241127. The patent publicati..
Semiconductor
| Mon 19 Jan 2026
Beijing, Jan. 19 -- State Intellectual Property Office of China has received Samsung SDI patent application for Semiconductor Photoresist Composition and Method of Forming Pattern Using the Same. Shin Seung-wook, Zhang Shuimin, Kang Eun-mi, Kim Ji-min, Xu Yeyin, Sung Tae-geun, Woo Chang Soo, Lee Min Young, Lim Wan-hee, Jang Seun..
Semiconductor
| Mon 19 Jan 2026
Beijing, Jan. 19 -- Samsung SDI has submitted a patent application for Semiconductor Photoresist Composition and Method of Forming Pattern Using the Same. This invention was developed by Choi Jung Min, Han Jun Hee, Im Sang Kyun, Moon Sung-il, Baek Jae-yeol, Oh Bu-keun and Sakong Jun.
The patent application number is CN2024116..
Semiconductor
| Mon 19 Jan 2026
Beijing, Jan. 19 -- State Intellectual Property Office of China has published Samsung SDI patent application for Semiconductor Photoresist Composition and Method of Forming Pattern Using the Same. The invention was developed by Zhang Shuimin, Oh Bu-keun, Kang Eun-mi, Lee Chung-heon, Shin Seung-wook and Lim Wan-hee.
The patent..
Semiconductor
| Mon 19 Jan 2026
Beijing, Jan. 19 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation has filed a patent application for Optical Proximity Correction Method. This invention was developed by Wang Lei.
The patent application number is CN202510716425 20250529. The patent publication number is CN120255261 (A). International Patent C..
Semiconductor
| Mon 19 Jan 2026
Beijing, Jan. 19 -- Jinan University has submitted a patent application for Design of Dynamic Linear Polarization Device Based on Phase Change Diatomic Metasurface. This invention was developed by Yue Wenjing, Yuan Dong, Gao Song and Li Wenjie.
The patent application number is CN202510549969 20250429. The patent publication n..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Amazon Technologies has submitted a patent application for Radio Chipset with Integrated Radar Functionality. Inti Durga Laxmi Narayana Swamy, Ichapurapu Ravi, Hsu Morris Yuanhsiang and Abdul Careem Maqsood Ahamed developed the invention.
The patent application number is US202418759487 20240628. The pat..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Intel has sought patent for Monitoring and Control of Advance Die-to-die Interconnect Lanes. This invention was developed by Mitra Sambaran, Gautam Swapnil Shashank, O U Neethumol, S Lokuprasanth and K Raja Vignesh.
The patent application number is US202418755761 20240627. The patent publication number ..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has published The Hong Kong Polytechnic University patent application for Method for Synthesizing Mixed-carbene Iridium(iii) Complexes. The invention was developed by Wong Wai-yeung and Sun Yingjie.
The patent application number is US202418755438 20240626. The patent pub..
Semiconductor
| Sun 18 Jan 2026
Beijing, Jan. 19 -- Calterah Semiconductor Technology, Shanghai has sought patent for Signal Processing Method, Storage Medium, Integrated Circuit, Device and Terminal Equipment. This invention was developed by Jiang Pengfei, Chen Jiashu and Zhang Liji.
The patent application number is CN202311832699 20231227. The patent publ..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has received Apogee Semiconductor Inc patent application for Processor Employing Instruction That Performs a Sum of Two Closest Operation. Grant David A developed the invention.
The patent application number is US202418759812 20240629. The patent publication number is US..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has received Pan Yang and Inspiring Atoms Pte Ltd patent application for System and Method for Improving Atomic Layer Etching Performance. Pan Yang developed the invention.
The patent application number is US202418758955 20240628. The patent publication number is US20260..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Advanced Micro Devices Inc and Xilinx have sought patent for Dynamically Pooled Allocations of Memory Buffers on Spatial Compute Architectures. This invention was developed by Denolf Kristof, Bisca Andra, Melber Joseph, Khodamoradi Alireza and Singh Gagandeep.
The patent application number is US20241875..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Arteris Inc has filed a patent application for Reinforced Learning for Topology Generation of a Network-on-chip. This invention was developed by Charif Amir, Lecerf Ugo and Conte Donatello.
The patent application number is US202519257390 20250701. The patent publication number is US20260004143 (A1). Int..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- JCET Microelectronics Jiangyin Co Ltd has filed a patent application for Wafer-scale System-in-package Structure and Forming Method Thereof. This invention was developed by Yang Danfeng, Xu Songhua, He Ming, Li Pingping, Li Yao and Lin Yaojian.
The patent application number is US202519251832 20250627. T..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has released Disco Hi Tec Europe GmbH patent application for Wafer Producing Method. This invention was developed by Priewasser Karl Heinz and Epple Christoph.
The patent application number is US202519252398 20250627. The patent publication number is US20260005010 (A1). ..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Arteris Inc has submitted a patent application for Deadlock-free Modification to Network-on-chip Topology. Charif Amir developed the invention.
The patent application number is US202519256057 20250630. The patent publication number is US20260004041 (A1). International Patent Classification codes are G06..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has published GlobalWafers patent application for Modified Object and Manufacturing Method Thereof. The invention was developed by Cheng Chung-wei, Shih Ying-ru, Kuo Jia-fan and Wang Bo-kai.
The patent application number is US202519201810 20250507. The patent publication..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has released Maxell patent application for IC Sheet, and Passport and Non-contact IC Card Including IC Sheet. This invention was developed by Oae Koji and Kameda Yoshikazu.
The patent application number is US202318877283 20230626. The patent publication number is US20260..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has released Mitsubishi Electric patent application for Optical Semiconductor Device. This invention was developed by Okuda Shinya.
The patent application number is US202218993108 20220927. The patent publication number is US20260005488 (A1). International Patent Classific..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Mitsubishi Electric has applied United States patent for Optical Semiconductor Device and Method for Manufacturing Optical Semiconductor Device. Onoe Kazuyuki developed it.
The patent application number is US202218993129 20221130. The patent publication number is US20260005487 (A1). International Patent C..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has published City University of Hong Kong patent application for Gain-enhanced Low-profile Dielectric Resonator Antenna with a Loading Metal. The invention was developed by Leung Kwok Wa, Su Zhili and Lu Kai.
The patent application number is US202418760103 20240701. The..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Sandisk Technology has filed a patent application for Cba Semiconductor Device with Edge Connections. This invention was developed by Zhang Izzie, Zhang Cong, Zhang Elley, Mong Derek, Bhagath Shrikar and Yu Fen.
The patent application number is US202418758785 20240628. The patent publication number is US2..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Hangzhou Zhicun (Witmem) Technology has sought patent for Memory-computing Integrated Chip Architecture, Packaging Method and Apparatus. This invention was developed by Wang Shaodi and Guo Xinjie.
The patent application number is US202519250904 20250626. The patent publication number is US20260005208 (A1)..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- ROHM has submitted a patent application for Semiconductor Device, Insulation Switch, and Rectifier Chip. This invention was developed by Sekito Junichi.
The patent application number is US202519244385 20250620. The patent publication number is US20260005197 (A1). International Patent Classification code i..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- STATS ChipPAC has filed a patent application for Semiconductor Packages with a Bridge Semiconductor Die and Methods for Forming the Same. This invention was developed by Lee Kyuwon, Lee Jisang, Kim Kyungeun and Lee Youngdeuk.
The patent application number is US202519253947 20250629. The patent publication..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- All Ring Tech has applied United States patent for Packaging Apparatus for Integrated Circuit Component. Tsai Chun-hung, Chang Kai-min, Lin Yen-ling and Jhang Guo-sin developed it.
The patent application number is US202519170280 20250404. The patent publication number is US20260005193 (A1).
The abstract..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- EV Group E Thallner has submitted a patent application for Method of Bonding a First Substrate to a Second Substrate, Bonding Apparatus and Assembly of First and Second Substrates. This invention was developed by Wimplinger Markus and Mühlstätter Christian.
The patent application number is US202218880..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has released Nexperia BV patent application for Semiconductor Device and a Method of Manufacturing of the Semiconductor Device. This invention was developed by Ramalingam Vegneswary, Shiu Heiming, Syré Jörg and Wong Fei.
The patent application number is US202519247082 20..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has received ROHM patent application for Semiconductor Device and Method for Producing Semiconductor Device. Kageyama Satoshi developed the invention.
The patent application number is US202519316319 20250902. The patent publication number is US20260005179 (A1). Cooperative..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Samsung Electronics has submitted a patent application for Semiconductor Package. Kang Dongwon, Song Changyeon and Lee Jae-ean developed the invention.
The patent application number is US202519050250 20250211. The patent publication number is US20260005178 (A1). International Patent Classification code ..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Texas Instruments Incorporated has submitted a patent application for Electronic Device and Flip-chip Die Assembly with Preformed Underfill and Stud Bumps. Liew How Kiat, Budizaman Amirun Hamizan Bin and Rahman Ahmad Ridzuan Bin Abd developed the invention.
The patent application number is US202418758336 ..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has received ROHM patent application for Semiconductor Device and Method for Manufacturing Semiconductor Device. Mikami Shunya, Shirai Katsutoki and Osumi Yuji developed the invention.
The patent application number is US202519296448 20250811. The patent publication number ..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Samsung Electronics has sought patent for Semiconductor Package Including Solder Structure and Semiconductor Module Including the Same. This invention was developed by Park Dahee.
The patent application number is US202519060133 20250221. The patent publication number is US20260005174 (A1).
An abstract r..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Siliconware Precision Industries has filed a patent application for Substrate Structure and Manufacturing Method Thereof. This invention was developed by He Meng-jou, Yeh Yuan-ping and Pai Yu-cheng.
The patent application number is US202418909575 20241008. The patent publication number is US20260005172 (A..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Taiwan Semiconductor Manufacturing Company has applied United States patent for Bond Pads and Method of Manufacturing the Same. Chang Chih-ping, Wang Ming-i and Ting Shyh-fann developed it.
The patent application number is US202418888223 20240918. The patent publication number is US20260005171 (A1).
The..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- NXP USA has applied United States patent for Double-sided Multichip Packages with Direct Die-to-die Coupling. Vincent Michael B, Hayes Scott M and Gong Zhiwei developed it.
The patent application number is US202418760635 20240701. The patent publication number is US20260005170 (A1). Cooperative Patent C..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- CXMT has applied United States patent for Semiconductor Structure and Semiconductor Integrated Structure. Ji Hongkai developed it.
The patent application number is US202519265478 20250710. The patent publication number is US20260005169 (A1).
The abstract of the patent published by the U.S. Patent and Tr..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has published SK Hynix patent application for Semiconductor Device Including Bonding of Stacked Structure Parts and Method of Fabricating the Same. The invention was developed by Koo Won Tae and Im Mir.
The patent application number is US202418960820 20241126. The patent p..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Taiwan Semiconductor Manufacturing Company has submitted a patent application for Semiconductor Die Packages and Methods of Formation. Tien Tzu Jung and Chang Jen-yuan developed the invention.
The patent application number is US202418755822 20240627. The patent publication number is US20260005166 (A1).
..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has released Intel patent application for Hybrid Panel with a Glass Substrate. This invention was developed by Konchady Manohar, Jimenez Andrew, Nguyen Son, Tanaka Hiroki, Wang Yekan, Pietambaram Srinivas Venkata Ramanuja, May Robert Alan, Vehonsky Jacob, Bryks Whitney, Sha..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- Micron Technology has applied United States patent for Radiation Protection for Semiconductor Devices and Associated Systems and Methods. Gan Chong Leong, Chung Min Hua, Zou Yung Sheng, Lin Lu Fu and Jao Li developed it.
The patent application number is US202519318329 20250903. The patent publication numb..
Semiconductor
| Mon 19 Jan 2026
Alexandria, Jan. 19 -- U.S. Patent and Trademark Office has released JCET STATS ChipPAC, Korea patent application for Semiconductor Packages with Integrated Antennas and Method for Forming the Same. This invention was developed by Chun Moonkyu, Kim Hyeonjong and Seo Youngeun.
The patent application number is US202519248410 20..
1
to
100 of
2011 Items
Next >>
![Close [X]](../images/close.gif){kind=small}
![Close [X]](https://www.globalipnews.com/images/close.gif){kind=small}
