News For Last 1 Week
Industry
X
Assignee
Country
Status
-
Select All
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Omnivision Technologies has submitted a patent application for Fast Low-leakage SRAM Cell. Yi Jingjun, Qin Qing, Dai Tiejun and Ng Sunny Yat-san developed the invention.
The patent application number is US202418943781 20241111. The patent publication number is US20260134906 (A1). International Patent Cla..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Omnivision Technologies has submitted a patent application for Fast Low-leakage SRAM Cell. This invention was developed by Yi Jingjun, Qin Qing, Dai Tiejun and Ng Sunny Yat-san.
The patent application number is US202418943789 20241111. The patent publication number is US20260134907 (A1). International Pa..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Ememory Technology has submitted a patent application for Memory Program Control Circuit. Chang Chia-fu and Peng Jen-yu developed the invention.
The patent application number is US202519385946 20251111. The patent publication number is US20260134923 (A1). International Patent Classification codes are G11..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Yangtze Memory Technologies has submitted a patent application for Method of Operating a Memory Controller, Memory Controller, and Memory System. This invention was developed by Shao Xiao and Sun Qian.
The patent application number is US202619442598 20260107. The patent publication number is US2026013492..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Yangtze Memory Technologies has submitted a patent application for Memory Devices and Operating Methods Thereof, Memory System. Guo Lu developed the invention.
The patent application number is US202619444787 20260109. The patent publication number is US20260134934 (A1). International Patent Classificatio..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- ASML Netherlands has submitted a patent application for Charged Particle Assessment Tool, Inspection Method. This invention was developed by Wieland Marco Jan-jaco.
The patent application number is US202519389187 20251114. The patent publication number is US20260135058 (A1). International Patent Classifica..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- ASML Netherlands has submitted a patent application for Alignment of Electron-optical Elements. This invention was developed by De Langen Johannes Cornelis Jacobus, Koning Johan Joost, Scheffers Paul Ijmert, Del Tin Laura and Steunebrink Martin.
The patent application number is US202319119680 20231002. The..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- NuFlare Technology has filed a patent application for Multi-charged Particle Beam Irradiation Apparatus and Multi-charged Particle Beam Irradiation Method. This invention was developed by Touya Takanao, Morita Hirofumi and Nakahashi Satoshi.
The patent application number is US202519338199 20250924. The pat..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has released STMicroelectronics International NV patent application for Phase-based Demodulation in Wireless Power Transfer Systems. This invention was developed by Cirillo Giovanni Amedeo, Luciani Kevin, Vitali Andrea Lorenzo and Priolo Roberta.
The patent application numb..
Semiconductor
| Tue 19 May 2026
Beijing, May 20 -- Beijing Xuanjie Technology has sought patent for Communication Method and Device, Electronic Equipment, Chip and Storage Medium. This invention was developed by Ding Shaoyang, Dong Zhijiang and Luo Guanghua.
The patent application number is CN202511387991 20250925. The patent publication number is CN121367878..
Semiconductor
| Tue 19 May 2026
Beijing, May 20 -- SK Hynix has submitted a patent application for Image Processing Apparatus and Image Processing Method. Zhang Checun, Kim Dong Ik, Yang Zhenluo and Choi Jun-hyeok developed the invention.
The patent application number is CN202510957362 20250711. The patent publication number is CN121367831 (A). International ..
Semiconductor
| Tue 19 May 2026
Beijing, May 20 -- Spreadtrum Semiconductor (Nanjing) has filed a patent application for Communication Method and Device. This invention was developed by Gu Lei and Zhang Shuai.
The patent application number is CN202410980784 20240719. The patent publication number is CN121367579 (A). International Patent Classification code ..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has released Samsung SDI patent application for Electrode Substrate Processing Apparatus and Electrode Substrate Processing Method. This invention was developed by Ko Tae-young.
The patent application number is US202519220347 20250528. The patent publication number is US202..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Applied Materials has sought patent for Resonator Probe for Plasma Diagnostics. This invention was developed by Peterson David, Chan Kelvin, Bhuiyan Shariful Islam, Xiao Yuhua, Putti Rajesh Kumar and Wani Shubham Kiran.
The patent application number is US202418942302 20241108. The patent publication number..
Semiconductor
| Tue 19 May 2026
Beijing, May 20 -- Realtek Semiconductor Corporation has submitted a patent application for Wireless Communication Device, System Information Message Receiving Method Thereof and Wireless Communication System. Cai Ruipeng developed the invention.
The patent application number is CN202410965270 20240718. The patent publication n..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Lam Research has submitted a patent application for Minimizing Reflected Power in a Tunable Edge Sheath System. This invention was developed by Hopkins David, Lyndaker Bradford, Marakhtanov Alexei and Kozakevich Felix.
The patent application number is US202619445397 20260109. The patent publication number ..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Applied Materials has filed a patent application for Beam Conditioning for Defect Control in Beamline Ion Implanter. This invention was developed by Koo Bon-woong, Likhanskii Alexandre, Hsieh Tseh-jen, Stratoti Gregory E, Parmar Saurabhsinh Dipaksinh and Murphy Paul J.
The patent application number is US20..
Semiconductor
| Tue 19 May 2026
Beijing, May 20 -- No 10 Institute of CETC has submitted a patent application for Multi-channel Transmitting Chip Power Detection Circuit. Li Hangbiao, Zhang Kai, Liu Zhiqing, Liu Shuai and Zhao Xiaodong developed the invention.
The patent application number is CN202511557697 20251029. The patent publication number is CN1213675..
Semiconductor
| Tue 19 May 2026
Beijing, May 20 -- SK Hynix has submitted a patent application for Signal Driving Circuit, Semiconductor Device Using Same, and Method of Operating Same. Hong Yun Seok developed the invention.
The patent application number is CN202411691227 20241125. The patent publication number is CN121367491 (A). International Patent Classif..
Semiconductor
| Tue 19 May 2026
Beijing, May 20 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Integrated Circuit and Method of Operating Integrated Circuit. Yano Tomohiko and Yu Pengfei developed the invention.
The patent application number is CN202511125246 20250812. The patent publication number is CN121367483 (A). Internation..
Semiconductor
| Tue 19 May 2026
Beijing, May 20 -- STMicroelectronics International has applied Chinese patent for Bulk Acoustic Wave Filter. Buffnickel Martin developed it.
The patent application number is CN202510983505 20250717. The patent publication number is CN121367476 (A). International Patent Classification codes are H03H3/02, H03H9/13 and H03H9/54. ..
Semiconductor
| Tue 19 May 2026
Beijing, May 20 -- Sanechips Technology has filed a patent application for Digital Power Amplifier and Chip. This invention was developed by Zhang Jincheng and Wang Yushan.
The patent application number is CN202410977366 20240719. The patent publication number is CN121367466 (A). International Patent Classification codes are H0..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Micron Technology has sought patent for Logic-based Defective Memory Component Screening. This invention was developed by Guo Zimu, Wang Wei, Zhu Jiangli, Octavia Selvy and Chan Heng Yie.
The patent application number is US202418944422 20241112. The patent publication number is US20260134940 (A1). Internat..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Micron Technology has applied United States patent for Read Level Calibration with Information Collection Skipping. Brasfield Sean, Chiew Chong Giap and Opastrakoon Tawalin developed it.
The patent application number is US202619439122 20260102. The patent publication number is US20260134939 (A1). Internati..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has released Micron Technology patent application for Dynamic Select Gate Scan Management. This invention was developed by Tay Yee Yang and Loh Zixiang.
The patent application number is US202519367418 20251023. The patent publication number is US20260134933 (A1). Internatio..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Micron Technology has applied United States patent for Reliability Based Data Verification. Lien Yu-chung, Vashi Ankit V, Zhou Zhenming and Hoei Jung Sheng developed it.
The patent application number is US202619444480 20260109. The patent publication number is US20260134932 (A1). International Patent Class..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Micron Technology has submitted a patent application for Half Good Block Handling with Defective Deck Pre-programing in a Memory Sub-system. This invention was developed by Chen Hanping, Xu Zhongguang, Papagianni Christina, Lien Yu-chung and Zhou Zhenming.
The patent application number is US202619442406 20..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- SanDisk Technologies has applied United States patent for Region Dependent Current State Spacing for In-memory Compute. Cao Wei, Masuduzzaman Muhammad and Yang Xiang developed it.
The patent application number is US202418945329 20241112. The patent publication number is US20260134930 (A1). International Pa..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has received Silicon Storage Technology patent application for Dual Read Mode Non-volatile Memory Semiconductor Device. Liu Xian, Bartoli Simone, Sivero Stefano, Surico Stefano, Moioli Giuseppe, Bedarida Lorenzo, Thiery Jean Francois, Jourba Serguei, Decobert Catherine, Do N..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has published Micron Technology patent application for All Levels Programming with Loop Dependent Pillar Boosting. The invention was developed by Tseng Huai-yuan, Mcneil Jeffrey S, Ning Sheyang, Miranda Lawrence Celso, Iwasaki Tomoko Ogura and Goda Akira.
The patent applica..
Semiconductor
| Wed 20 May 2026
Beijing, May 20 -- State Intellectual Property Office of China has released Taiwan Semiconductor Manufacturing patent application for Processing Apparatus and Quantization Method for Quantization and Inverse Quantization of Numeric Data. This invention was developed by Peng Xiaochen, Clifton Brian, Akarvadar Murat Kerem, Lele Ih..
Semiconductor
| Wed 20 May 2026
Beijing, May 20 -- Samsung Electronics has submitted a patent application for In-memory Processor and Memory Device Including the Same. This invention was developed by Kang Shin-haeng, Lee Suk-han and Sohn Kyo-min.
The patent application number is CN202510150126 20250211. The patent publication number is CN121365034 (A). Intern..
Semiconductor
| Wed 20 May 2026
Beijing, May 20 -- State Intellectual Property Office of China has published Realtek Semiconductor Corporation patent application for Multiple Charging Path Control Device for Electronic Device with Multiple Connection Interfaces. The invention was developed by Zhu Dandan, Dai Jiwei, Zhang Congyu, Xu Min and Miao Yuanjie.
The p..
Semiconductor
| Wed 20 May 2026
Beijing, May 20 -- NVIDIA has submitted a patent application for Implementing Criteria Using Large Language Models. This invention was developed by Pathak Nitin L, Shetty Ravindra Bhushan, Nirukanda Chandrasekhar and Kumar Ravindra.
The patent application number is CN202510982768 20250716. The patent publication number is CN121..
Semiconductor
| Wed 20 May 2026
Beijing, May 20 -- SK Hynix has filed a patent application for Data Storage System and Method for Operating Data Storage System. This invention was developed by Kwon Gu-ik, Kim Seung-hwan, Kim Hee-chul and Jin Byung-min.
The patent application number is CN202510989391 20250717. The patent publication number is CN121364819 (A). ..
Semiconductor
| Wed 20 May 2026
Beijing, May 20 -- State Intellectual Property Office of China has received Infineon Technologies patent application for Volatile Memory Mode for Secure State Configuration. Homeier Kai, Lingsworth Michael and Unterweger Gernot developed the invention.
The patent application number is CN202510979588 20250716. The patent publica..
Semiconductor
| Wed 20 May 2026
Beijing, May 20 -- Micron Technology has sought patent for Configurable Partitions and Memory Type Independence in Memory Systems. This invention was developed by Wang Zheng and Bucher Sebastien.
The patent application number is CN202510978757 20250716. The patent publication number is CN121364817 (A). International Patent Clas..
Semiconductor
| Wed 20 May 2026
Beijing, May 20 -- SanDisk Technologies has applied Chinese patent for Data Storage Device and Method for Predicting Read Thresholds Using Multiple Models. Abraham David, Sharon Eran, Bazarsky Alexander and Navon Ariel developed it.
The patent application number is CN202510489592 20250418. The patent publication number is CN121..
Semiconductor
| Wed 20 May 2026
Beijing, May 20 -- Shenyang Fortune Precision Equipment has submitted a patent application for Universal Six-claw Fan-shaped Self-adaptive Clamp. Wang Xin, Wang Yao, Niu Yueqiang and Han Liying developed the invention.
The patent application number is CN202511450324 20251011. The patent publication number is CN121360830 (A). ..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan Semiconductor has sought patent for Package Structure and Fabrication Method Thereof. This invention was developed by Wu Po-ching, Chiu Chao-wei, Kuo Hsuan-ting, Lee Meng-tsan, Su An-jhih and Lin Hsiu-jen.
The patent application number is US202418942739 20241110. The patent publication number is US2..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Samsung Electronics has submitted a patent application for Semiconductor Package. Lee Keunyoung and Kwak Dongok developed the invention.
The patent application number is US202519379064 20251104. The patent publication number is US20260137001 (A1). Cooperative Patent Classification codes are H10W90/00 (US..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has released Samsung Electronics patent application for Semiconductor Package. This invention was developed by Shin Wonbin.
The patent application number is US202519349696 20251003. The patent publication number is US20260136999 (A1). International Patent Classification c..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Samsung Electronics has submitted a patent application for Semiconductor Package. This invention was developed by Lee Dongkuk and Baek Seungduk.
The patent application number is US202519242103 20250618. The patent publication number is US20260136996 (A1). Cooperative Patent Classification codes are H10W9..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Samsung Electronics has applied United States patent for Semiconductor Package. Kim Hongjin and Jeong Ki-hong developed it.
The patent application number is US202519199484 20250506. The patent publication number is US20260136995 (A1). Cooperative Patent Classification codes are H10W90/00 (US), H10W72/884..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan Semiconductor has applied United States patent for System on Integrated Circuit Structure and Method for Fabricating the Same. Wang Wen-yun, Shih Chao-wen, Ting Kuo-chiang and Chen Yen-ming developed it.
The patent application number is US202418948322 20241114. The patent publication number is US202..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan Semiconductor has filed a patent application for Semiconductor Package and Method of Manufacturing Semiconductor Package. This invention was developed by Lin Chien-chang, Cheng Chih-kai, Chang Hung-min, Kuo Hsuan-cheng and Wang Shih-hui.
The patent application number is US202418946997 20241114. The ..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan Semiconductor has applied United States patent for Semiconductor Device and Methods of Formation. Tien Tzu Jung and Chang Jen-yuan developed it.
The patent application number is US202418946075 20241113. The patent publication number is US20260136991 (A1). International Patent Classification codes ar..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Mitsubishi Electric has filed a patent application for Semiconductor Apparatus and Method for Manufacturing Semiconductor Apparatus. This invention was developed by Nakata Yosuke, Sato Yuji and Uegaki Shin.
The patent application number is US202519266873 20250711. The patent publication number is US2026013..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Micron Technology has applied United States patent for Multiple Epoxy Compounds for Memory System Manufacturing. Lowry Kimball D and Bitz Bradley developed it.
The patent application number is US202519380740 20251105. The patent publication number is US20260136983 (A1). Cooperative Patent Classification co..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Littelfuse has submitted a patent application for Pressfit Terminal for Isolated Power Semiconductor Devices. This invention was developed by Maldo Tiburcio A, Grozen Jeff, Deveza Arnel, Spann Thomas, Cadut Roger and Hughes Rhodri.
The patent application number is US202418946694 20241113. The patent public..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Samsung Electronics has sought patent for Method of Manufacturing Semiconductor Device. This invention was developed by Sun Kahyun.
The patent application number is US202519227740 20250604. The patent publication number is US20260136978 (A1). Cooperative Patent Classification codes are H10W72/0711 (US), H1..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Samsung Electronics has applied United States patent for Package Substrate and Semiconductor Package Including the Same. Lee Gyeongah developed it.
The patent application number is US202519364594 20251021. The patent publication number is US20260136974 (A1). Cooperative Patent Classification codes are H10W..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has received Micron Technology patent application for Hybrid Layers in Substrates. Lowry Kimball D, Bitz Bradley R, Jensen Travis M, Chaves Joao E and Christianson David L developed the invention.
The patent application number is US202519380705 20251105. The patent publicat..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Samsung Electronics has filed a patent application for Package Substrate, Semiconductor Package Including the Same, and Manufacturing Method of the Semiconductor Package. This invention was developed by Oh Seungjin.
The patent application number is US202519221980 20250529. The patent publication number is ..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has published Microsoft Technology Licensing patent application for Template Cell Alignment for Interposer Layout Design. The invention was developed by Calderon Olga M, Huang Chunchieh, Robinson Charles Kenneth and Mandal Gurupada.
The patent application number is US2024..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Samsung Electronics has submitted a patent application for Package Substrate Including Inductor. This invention was developed by Kim Juwon, Yong Seokbeom and Yu Seulgi.
The patent application number is US202519351372 20251007. The patent publication number is US20260136964 (A1). Cooperative Patent Classifi..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Shinko Electric Industries has submitted a patent application for Wiring Substrate and Semiconductor Device. This invention was developed by Horiuchi Michio.
The patent application number is US202519378702 20251104. The patent publication number is US20260136956 (A1). Cooperative Patent Classification code..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- SK Hynix has submitted a patent application for Stacked Memory Systems. This invention was developed by Choi Joon Yong.
The patent application number is US202519318133 20250903. The patent publication number is US20260136955 (A1). International Patent Classification codes are H10B80/00 and H10D80/30. Coope..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has released Amkor Technology Singapore Holding patent application for Semiconductor Devices and Methods of Manufacturing Semiconductor Devices. This invention was developed by Yamada Yasuaki and Sato Hidenari.
The patent application number is US202519023891 20250116. The p..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has received Bridge Semiconductor patent application for Terminal Structure with Depression Region Below Dielectric Wall and Semiconductor Package Having the Same. Lin Charles W C and Wang Chia-chung developed the invention.
The patent application number is US202418947792 2..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has received GigaDevice Semiconductor patent application for Package Structure. Du Yong, Liu Yang and Li Yuanyuan developed the invention.
The patent application number is US202519384142 20251110. The patent publication number is US20260136949 (A1). Cooperative Patent Cla..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has published Infineon Technologies, Austria patent application for Substrate Clip with Sheet and Patterned Electrically Conductive Structure Having Different Thicknesses. The invention was developed by Tan Yi Ting, Tommy Khoo Chwee Pang, Hiew Mei Fen, Saw Bee Kwan and Koo W..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Canon has submitted a patent application for Substrate and Method of Manufacturing Substrate. This invention was developed by Toshishige Mitsunori and Fukumoto Yoshiyuki.
The patent application number is US202619443377 20260108. The patent publication number is US20260136947 (A1). International Patent Clas..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan Semiconductor Manufacturing has applied United States patent for Semiconductor Device Package and Methods of Manufacture. Wu Po-ching, Chen Shih-wei, Lee Meng-tsan and Su An-jhih developed it.
The patent application number is US202519055809 20250218. The patent publication number is US20260136941 (A..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has received Allegro MicroSystems patent application for Voltage-isolated Integrated Circuit Packages. Mangtani Vijay, Taylor William P and David Paul A developed the invention.
The patent application number is US202619441151 20260106. The patent publication number is US202..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has received Samsung Electronics patent application for Semiconductor Chip Including Crack Propagation Prevention Structure. Bae Hyoungjin and Ko Jungmin developed the invention.
The patent application number is US202519382877 20251107. The patent publication number is US20..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Samsung Electronics has submitted a patent application for Semiconductor Package. This invention was developed by Shin Sangho, Kim Sungeun, Yu Hae-jung and Jung Yanggyoo.
The patent application number is US202519221715 20250529. The patent publication number is US20260136937 (A1). Cooperative Patent Clas..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Semiconductor Components Industries has submitted a patent application for Cooling Assembly Including Mechanical Reinforcement to Prevent Warpage. This invention was developed by Im Seungwon.
The patent application number is US202519381897 20251106. The patent publication number is US20260136934 (A1). Coop..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan-Asia Semiconductor has filed a patent application for Power Semiconductor Structure. This invention was developed by Wei Cheng-chang, Chen Chuan-wei, Lai Wen-tsung and Wu Hou-jun.
The patent application number is US202519198238 20250505. The patent publication number is US20260136932 (A1). Internati..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Integrated Circuit Package and Method. This invention was developed by Sun Sey-ping and Liang Shih Wei.
The patent application number is US202619444835 20260109. The patent publication number is US20260136926 (A1). International Pate..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Microchip Technology has submitted a patent application for Power Module with Local Heat Spreader. Pandey Shesh Mani and Zhang Zichen developed the invention.
The patent application number is US202519061592 20250224. The patent publication number is US20260136924 (A1). Cooperative Patent Classification cod..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan Semiconductor has filed a patent application for Package Structure and Method of Forming the Same. This invention was developed by Lee You Ru, Chen Ching Yang, Chiang Yi Ping and Lin Hsin Ying.
The patent application number is US202418945471 20241112. The patent publication number is US20260136922 (..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Samsung Electronics has submitted a patent application for Integrated Circuit Devices Including Stacked Transistors with Offset Power Delivery Network Scheme on Opposite Sides of Cell Structure. Lim Jinyoung, Park Young Gook, Shin Hyojong and Seo Kang-ill developed the invention.
The patent application num..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan Semiconductor has applied United States patent for Semiconductor Structure with Conductive Through Via and a Method of Manufacturing the Same. Chu Hwei-jay, Tien Hsi-wen, Liao Wei-hao, Dai Yu-teng, Yao Hsin-chieh, Chen Cheng-hao, Wang Wei Chih and Lu Chih Wei developed it.
The patent application num..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan Semiconductor has sought patent for Semiconductor Devices and Methods of Forming the Same. This invention was developed by Su Chia-wei, Wu Yung-hsu, Chen Hsin-ping, Lu Chih Wei, Liao Wei-hao, Tien Hsi-wen and Tsai Cherng-shiaw.
The patent application number is US202619445597 20260111. The patent pub..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Texas Instruments has submitted a patent application for Back End of Line Structure for Improved Current Density in Hr Devices. This invention was developed by Harrison William, Ankamah-kusi Sylvester, Tang Yiqi and Murugan Rajen M.
The patent application number is US202519429020 20251222. The patent publi..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Samsung Electronics has filed a patent application for Semiconductor Device. This invention was developed by Choi Seung, Jeong Jin Woo, Kim Byung-sung and Park Sung Ho.
The patent application number is US202519245270 20250621. The patent publication number is US20260136913 (A1). International Patent Clas..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan Semiconductor has submitted a patent application for Semiconductor Structure and Manufacturing Method Thereof. Lin Cheng Ying, Hwang Chih-hong, Wang Xiaodong and Liaw Jhon Jhy developed the invention.
The patent application number is US202418941455 20241108. The patent publication number is US202601..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan Semiconductor has sought patent for Semiconductor Die and Method of Forming the Same. This invention was developed by Lai Yen-kun, Hsu Chien-hao, Tu Wei-hsiang, Chang Kuo-chin and Lii Mirng-ji.
The patent application number is US202619443017 20260108. The patent publication number is US20260136910 (..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan Semiconductor has submitted a patent application for Semiconductor Device and Methods of Formation. This invention was developed by Lin Tzu-ging.
The patent application number is US202418947533 20241114. The patent publication number is US20260136909 (A1). Cooperative Patent Classification codes are..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor patent application for Semiconductor Structure and Method for Manufacturing the Same. This invention was developed by Wu Tzung-yi, Hwang Chih-hong, Lin Cheng-ying, Chin Chih-ming, Lin Ta-chun, Wang Xiaodong and Liaw Jhon-jhy.
The patent app..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Samsung Electronics has applied United States patent for Method of Fabricating a Semiconductor Device. Han Eunshoo and Kim Byeung Chul developed it.
The patent application number is US202519076654 20250311. The patent publication number is US20260136904 (A1). International Patent Classification codes are H..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has published Samsung Electronics patent application for Contact Pad Structures for Wordlines in Three-dimensional Memory Circuits. The invention was developed by Kim Dongwan, Lee Don Koun, Agrawal Nidhi, Jeong Young Doo, Noshin Maliha, Kanago Anthony, Akhtar Mohd Kamran, Ki..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan Semiconductor has sought patent for Interconnect Structure Including Hybrid Via and Method for Manufacturing the Same. This invention was developed by Chou Chuan-pu.
The patent application number is US202418947052 20241114. The patent publication number is US20260136902 (A1). Cooperative Patent Clas..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Sony Semiconductor Solutions Corporation has sought patent for Semiconductor Device. This invention was developed by Mayumi Takahiro.
The patent application number is US202319121310 20231013. The patent publication number is US20260136897 (A1). International Patent Classification codes are H10F39/00, H10..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has published Samsung Electronics patent application for Semiconductor Structure, Semiconductor Package, and Manufacturing Method Thereof. The invention was developed by Jo Sungeun.
The patent application number is US202519077376 20250312. The patent publication number is U..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor patent application for Semiconductor Structure. Hsiao Ching-wen, Lin Cheng-nan, Cheng Ching-ho, Huang Wei-ren and Su Yu-tse developed the invention.
The patent application number is US202418946008 20241113. The patent publication number is ..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Samsung Electronics has sought patent for Semiconductor Device and Method of Detecting Failure Therein. This invention was developed by Chung Myungjin, Kim Jinkyu, Song Inhyun, Yang Hyung-mo, Chung Eunguk, Jo Wookhyun and Cho Keun Hwi.
The patent application number is US202519303951 20250819. The patent ..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan Semiconductor has applied United States patent for Semiconductor Structure with Daisy Chain and Inspection Method Using the Daisy Chain. Hsieh Cheng-yu, Chen Yang-che, Chou Wei-yu, Lu Hsiang-tai and Lin Wei-ray developed it.
The patent application number is US202418945592 20241113. The patent public..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Texas Instruments has submitted a patent application for Populous Carrier Tape. This invention was developed by Huang Pi-chiang, Lim Chong Han, Chout Stanley, Chang Chia Wei and Kummerl Steven.
The patent application number is US202519383362 20251107. The patent publication number is US20260136886 (A1). Co..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Canon has applied United States patent for Substrate Conveyance Method, Substrate Processing Apparatus, Article Manufacturing Method, and Storage Medium. Matsubara Yasuharu, Nawamaki Teruhisa and Kawashima Jun developed it.
The patent application number is US202519379068 20251104. The patent publication nu..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Tokyo Electron has submitted a patent application for Vacuum Processing Apparatus and Method of Controlling Vacuum Processing Apparatus. Ishibashi Seiji developed the invention.
The patent application number is US202619443354 20260108. The patent publication number is US20260136881 (A1). International Pate..
Semiconductor
| Wed 20 May 2026
Alexandria, May 20 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Contamination Control in Semiconductor Manufacturing Systems. Chen Bo Chen, Wu Sheng-wei and Tsai Yung-li developed the invention.
The patent application number is US202619443867 20260108. The patent publication number is US202601368..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- ASM International Holding has submitted a patent application for Apparatus, Systems, and Associated Methods for Monitoring Process Drift in a Semiconductor Processing System. Harb Salam developed the invention.
The patent application number is US202418947941 20241114. The patent publication number is US202..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Tokyo Electron has submitted a patent application for Substrate Processing Apparatus and Substrate Processing Method. This invention was developed by Ihara Toru, Tanaka Satoru, Goshi Gentaro, Yamashita Masami, Yamanaka Reijiro and Kumashiro Hideaki.
The patent application number is US202619444684 20260109...
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- SEMES has sought patent for Substrate Treating Apparatus and Substrate Treating Method Using the Same. This invention was developed by Jung In Ki, Song Jun Ho, Shim Jeong Bo, Son Won Sik and Yu Jeong Hyup.
The patent application number is US202519389411 20251114. The patent publication number is US20260136..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Kokusai Electric has applied United States patent for Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium. Nakaya Kazuo, Ando Fumie, Nishiura Susumu and Ekko Hiroshi developed it.
The patent application number is US202619443177 20260108. The patent publication..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Applied Materials has filed a patent application for Multi-compartment Gas Panel Assembly. This invention was developed by Chandrashekar Skanda Simha, Thimmaiah Chakrapani Rayan and Joshi Mahadev.
The patent application number is US202418947268 20241114. The patent publication number is US20260136865 (A1)...
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Canon has submitted a patent application for Processing Method and Semiconductor Device Manufacturing Method. This invention was developed by Kimura Tetsuya, Asano Kosuke and Kurosawa Hiroshi.
The patent application number is US202519380708 20251105. The patent publication number is US20260136854 (A1). Coo..
Semiconductor
| Tue 19 May 2026
Alexandria, May 20 -- Applied Materials has submitted a patent application for Removing or Preventing Residue Subsequent to Repairing Low-k Materials. This invention was developed by Lu Xinyi, Xie Bo, Lang Chi-i, Wang Han, Do Tam Kevin, Liu Biao, Xia Li-qun, Kwon Shinjae, Guggilla Srinivas and Pranatharthiharan Balasubramanian.
..
1
to
100 of
2286 Items
Next >>
![Close [X]](../images/close.gif){kind=small}
![Close [X]](https://www.globalipnews.com/images/close.gif){kind=small}
