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08:04:17 Fri 05 Jun 2026

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(2)

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SK Enpulse Co Ltd [kr]; S

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(2)

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(2)

(2)

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(2)

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Zhejiang University City

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(1)

(1)

(1)

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(1)

(1)

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(1)

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(1)

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(1)

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(1)

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(1)

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(1)

(1)

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(1)

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(1)

(1)

Artience Co Ltd [jp]; TOY

(1)

Asml Netherlands Bv [nl];

(1)

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Big Health Res Institute

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Biochain Beijing Science

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Board of Regents of the U

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(1)

CNOOC Changzhou Paint Che

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(1)

(1)

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(1)

(1)

Cemvita Factory

(1)

(1)

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(1)

Central South University;

(1)

Changchun Changguang Yuan

(1)

Changchun Institute of Op

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(1)

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(1)

Chemours-Mitsui Fluoropro

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(1)

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(1)

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(1)

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(1)

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(1)

(1)

(1)

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(1)

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(1)

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(1)

Delta Electronics, Shangh

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Dingdao Zhixin (Shanghai)

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(1)

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(1)

East China Normal Univers

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(1)

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Effect Photonics B V

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(1)

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(1)

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(1)

(1)

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(1)

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(1)

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(1)

Fly Sky Innotech Inc

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Focuslight Singapore Pte

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Forehope Electronic, Ning

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Foshan Xianhu Laboratory;

(1)

Foshan Zhenmeizhijia Furn

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Foundation of Soongsil Un

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(1)

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(1)

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(1)

Fulede Technology Develop

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(1)

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(1)

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(1)

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Global Unichip Corp [tw];

(1)

GlobalFoundries Singapore

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(1)

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(1)

(1)

Government of the US Secr

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Guangdong Ocean Universit

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Harbin Engineering Univer

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(1)

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(1)

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ICleague Technology

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(1)

(1)

(1)

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(1)

Idzkowski Daniel Przemysl

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(1)

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(1)

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Information And Communica

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(1)

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(1)

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(1)

(1)

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ams OSRAM Seeks Patent for Auto-addressing of Light-emitting Devices

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- ams OSRAM has sought patent for Auto-addressing of Light-emitting Devices. This invention was developed by Colombo Matteo and Koesler Markus. The patent application number is WO2025EP82281 20251107. The patent publication number is WO2026109319 (A1). International Patent Classification codes are H05B47/175 a..

Kulicke & Soffa Ind Inc Submits WIPO Patent Application for Methods of Bonding a Semiconductor Element to a Substrate, and Related Systems

Semiconductor

| Fri 05 Jun 2026

Geneva, June 5 -- Kulicke & Soffa Ind Inc has submitted a patent application for Methods of Bonding a Semiconductor Element to a Substrate, and Related Systems. This invention was developed by Ernst Urban and Marte Andreas. The patent application number is WO2025US54280 20251106. The patent publication number is WO2026111886 ..

Bialetska Julia Submits WIPO Patent Application for a Method and a System for Forming a Product from a Biocomposite Based on a Lignocellulose Substrate Colonized with Fungal Myceli..

Semiconductor

| Fri 05 Jun 2026

Geneva, June 5 -- Bialetska Julia has submitted a patent application for a Method and a System for Forming a Product from a Biocomposite Based on a Lignocellulose Substrate Colonized with Fungal Mycelium. This invention was developed by Bialetska Julia. The patent application number is WO2025UA00061 20251118. The patent publi..

Jiangsu Haikang Borui Electronic Co Ltd Submits Chinese Patent Application for Plastic Film Curing Equipment for Packaging and Laminating RFID (radio Frequency Identification Devic..

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- Jiangsu Haikang Borui Electronic Co Ltd has submitted a patent application for Plastic Film Curing Equipment for Packaging and Laminating RFID (radio Frequency Identification Device) Chip. This invention was developed by Liu Jinpeng. The patent application number is CN202511639916 20251111. The patent publi..

Shandong Grins Semiconductor Mat Co Ltd Submits Patent Application for Method for Improving Grid Cloth Printing Defect on Back Surface of Double-sided Polished Wafer

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- Shandong Grins Semiconductor Mat Co Ltd has submitted a patent application for Method for Improving Grid Cloth Printing Defect on Back Surface of Double-sided Polished Wafer. Li Lei, Lu Yichen, Song Tongjing, Zhao Xinxin, Li Yang and Li Jintao developed the invention. The patent application number is CN2025..

Chongqing Zhenbao Semiconductor Mat Co Ltd Submits Chinese Patent Application for High-efficiency Low-damage Silicon Carbide Ceramic Grinding Method Based on Pre-oxidation

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- Chongqing Zhenbao Semiconductor Mat Co Ltd has submitted a patent application for High-efficiency Low-damage Silicon Carbide Ceramic Grinding Method Based on Pre-oxidation. This invention was developed by Chen Hao, Zeng Wenhou, Chen Lihang and Jiang Xiaojun. The patent application number is CN202511700599 2..

Huaian Ruoan Electronic Tech Co Ltd Submits Chinese Patent Application for Welding Equipment for IC Chip Processing

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- Huaian Ruoan Electronic Tech Co Ltd has submitted a patent application for Welding Equipment for IC Chip Processing. This invention was developed by Wu Dihong. The patent application number is CN202511899329 20251216. The patent publication number is CN121514773 (A). International Patent Classification code..

Lide Health Tech Guangzhou Co Ltd Submits Chinese Patent Application for Chip Preparation Method and Chip

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- Lide Health Tech Guangzhou Co Ltd has submitted a patent application for Chip Preparation Method and Chip. This invention was developed by Li Mengqi and Zhang Feng. The patent application number is CN202511450946 20251011. The patent publication number is CN121513764 (A). International Patent Classification..

Shanghai Shengzhou Juneng Semiconductor Tech Co Ltd Submits Patent Application for Multi-channel Power Distribution System and Method for Large-size Wafer Etching

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Shanghai Shengzhou Juneng Semiconductor Tech Co Ltd has submitted a patent application for Multi-channel Power Distribution System and Method for Large-size Wafer Etching. Li Tan, Zhao Junjun and Yin Qiaoxing developed the invention. The patent application number is CN202511702595 20251119. The patent publi..

Advanced View Tech Inc Submits WIPO Patent Application for Method for Cleaning Surface of Substrate and Led Assembly Using Same

Semiconductor

| Fri 05 Jun 2026

Geneva, June 5 -- Advanced View Tech Inc has submitted a patent application for Method for Cleaning Surface of Substrate and Led Assembly Using Same. This invention was developed by Hwang Jun-seok and Kim Jaekyun. The patent application number is WO2025KR15850 20251002. The patent publication number is WO2026111167 (A1). Inte..

Biochain Beijing Science & Tech Inc Submits Patent Application for Integrated Microfluidic Chip

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- Biochain Beijing Science & Tech Inc has submitted a patent application for Integrated Microfluidic Chip. Chen Ming, Shi Xiaodong, Wu Zhen, Liu Siwen and Gan Weiqiong developed the invention. The patent application number is WO2025CN136323 20251120. The patent publication number is WO2026108901 (A1). Internat..

Sicc Shanghai Semiconductor Mat Co Ltd Submits WIPO Patent Application for SiC Crystal and SiC Substrate Having Low Defect Stress

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- Sicc Shanghai Semiconductor Mat Co Ltd has submitted a patent application for SiC Crystal and SiC Substrate Having Low Defect Stress. This invention was developed by Ma Jianli, Wang Zhenxing, Jia Xiuzhe, Li Peida, Gao Chao, Zhang Jiuyang, Shi Zhiqiang and Li Hao. The patent application number is WO2025CN1305..

China Satellite Network Application Co Ltd Submits WIPO Patent Application for Satellite Communication Method, Computing Device, Storage Medium, Computer Program Product, and Chip ..

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- China Satellite Network Application Co Ltd has submitted a patent application for Satellite Communication Method, Computing Device, Storage Medium, Computer Program Product, and Chip System. This invention was developed by Li Jianing, Chang Lian, Jiang Botao, Chen Xin and Zhuang Yunsheng. The patent applicat..

Sany Heavy Equipment Co Ltd Submits WIPO Patent Application for Control Method and Apparatus, Shearer, Readable Storage Medium, and Chip

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- Sany Heavy Equipment Co Ltd has submitted a patent application for Control Method and Apparatus, Shearer, Readable Storage Medium, and Chip. This invention was developed by Xie Mingwei. The patent application number is WO2025CN96608 20250522. The patent publication number is WO2026108118 (A1). International ..

XDL Tech Inc Submits WIPO Patent Application for High-bandwidth Flash Memory, Data Reading Method and Memory Chip

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- XDL Tech Inc has submitted a patent application for High-bandwidth Flash Memory, Data Reading Method and Memory Chip. This invention was developed by Li Yuan. The patent application number is WO2025CN90107 20250421. The patent publication number is WO2026108072 (A1). International Patent Classification code ..

Chongqing Xinhui Materials Tech Co Ltd Submits WIPO Patent Application for Part for Semiconductor Processing Equipment, and Manufacturing Method Therefor

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- Chongqing Xinhui Materials Tech Co Ltd has submitted a patent application for Part for Semiconductor Processing Equipment, and Manufacturing Method Therefor. This invention was developed by Deng Zhanchuan, Tang Jie and Chang Minseok. The patent application number is WO2025CN78963 20250225. The patent publica..

Yinwang Intelligent Tech Co Ltd Submits Patent Application for Waveguide Structure, Silicon Optical Chip, Detection Apparatus, and Terminal Device

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- Yinwang Intelligent Tech Co Ltd has submitted a patent application for Waveguide Structure, Silicon Optical Chip, Detection Apparatus, and Terminal Device. Niu Ben, Yu Anliang, Liu Tonghui and Wu Hongying developed the invention. The patent application number is WO2024CN141167 20241220. The patent publicatio..

Zhongke Yichuang Guangzhou Tech Co Ltd Submits Chinese Patent Application for Metal Oxide Semiconductor (mos) Tube Elastic Sheet Pressing Structure and Heat Dissipation Structure

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Zhongke Yichuang Guangzhou Tech Co Ltd has submitted a patent application for Metal Oxide Semiconductor (mos) Tube Elastic Sheet Pressing Structure and Heat Dissipation Structure. This invention was developed by Li Ning, Feng Guanhua, Wang Kai, Wang Zhiming and Ren Guanghui. The patent application number is..

Shgenzhen Zhongke Sihe Tech Co Ltd Submits Patent Application for Board-level Packaging Structure for Chip with Vertical Structure and Manufacturing Method of Board-level Packaging..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Shgenzhen Zhongke Sihe Tech Co Ltd has submitted a patent application for Board-level Packaging Structure for Chip with Vertical Structure and Manufacturing Method of Board-level Packaging Structure. Zhu Jianfang, Shao Dongdong and Liu Shikang developed the invention. The patent application number is CN2025..

Chengdu Shudun Zhixin Tech Co Ltd Submits Patent Application for Wettable Side Wall Packaging Substrate and Preparation Method Thereof

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Chengdu Shudun Zhixin Tech Co Ltd has submitted a patent application for Wettable Side Wall Packaging Substrate and Preparation Method Thereof. Liu Hailun developed the invention. The patent application number is CN202511655916 20251112. The patent publication number is CN121510978 (A). International Patent..

Gudeng Prec Industral Co Ltd Submits Patent Application for Fixing Assembly and Substrate Carrier Applying Same

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Gudeng Prec Industral Co Ltd has submitted a patent application for Fixing Assembly and Substrate Carrier Applying Same. Qiu Mingqian, Li Qilin, Lin Jiaqi, Pan Yongjin and Liu Jialiang developed the invention. The patent application number is CN202511657198 20251112. The patent publication number is CN12151..

Dongguan Xuhong Surface Treat Technology Co Ltd Submits Chinese Patent Application for Multifunctional Wafer Surface Processing Equipment

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Dongguan Xuhong Surface Treat Technology Co Ltd has submitted a patent application for Multifunctional Wafer Surface Processing Equipment. This invention was developed by Tang Xiaohong, Chen Haitong and Tang Haibo. The patent application number is CN202511539296 20251027. The patent publication number is CN..

Hongyang Semiconductor Co Ltd Submits Chinese Patent Application for Method for Manufacturing Semiconductor Wafer

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Hongyang Semiconductor Co Ltd has submitted a patent application for Method for Manufacturing Semiconductor Wafer. This invention was developed by Chen Jinhong, Yan Hongxin and Lin Yiren. The patent application number is CN20241169301 20240806. The patent publication number is CN121510869 (A). International..

Shanghai Yunchen Jingjie Tech Co Ltd Submits Chinese Patent Application for Tin-based Perovskite Solar Cell and Preparation Method Thereof

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Shanghai Yunchen Jingjie Tech Co Ltd has submitted a patent application for Tin-based Perovskite Solar Cell and Preparation Method Thereof. This invention was developed by Li Zhi, Liu Zhen, Li Tianpeng and Fang Qiyi. The patent application number is CN202511437563 20251009. The patent publication number is ..

Nantong Shangyangtong Integrated Circuit Co Ltd Submits Chinese Patent Application for Manufacturing Method of Trench Gate Semiconductor Power Device

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Nantong Shangyangtong Integrated Circuit Co Ltd has submitted a patent application for Manufacturing Method of Trench Gate Semiconductor Power Device. This invention was developed by Xu Tianci. The patent application number is CN202511641926 20251111. The patent publication number is CN121510615 (A). Intern..

Jiangsu Punuowei Electronic Co Ltd Submits Patent Application for Embedded Package Substrate and Processing Method Thereof

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Jiangsu Punuowei Electronic Co Ltd has submitted a patent application for Embedded Package Substrate and Processing Method Thereof. Chen Man, Lu Minchen, Zhang Zhili and Ma Hongwei developed the invention. The patent application number is CN202511721081 20251121. The patent publication number is CN121510465..

Chengdu Weiguang Jidian Tech Co Ltd Submits Patent Application for Dual-conversion Gain Reading Circuit, Reading Method and Image Sensor

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Chengdu Weiguang Jidian Tech Co Ltd has submitted a patent application for Dual-conversion Gain Reading Circuit, Reading Method and Image Sensor. Fang Dongxing, Cai Hua, Chen Fei, Chen Zheng, Xia Tian and Wang Yong developed the invention. The patent application number is CN202511789785 20251201. The patent..

Datang Huaxian Wind Power Generation Co Ltd Submits Chinese Patent Application for Zero-trust Gateway Single Packet Authentication Method and System for New Energy Fan Control Syst..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Datang Huaxian Wind Power Generation Co Ltd has submitted a patent application for Zero-trust Gateway Single Packet Authentication Method and System for New Energy Fan Control System, Computing Equipment, Computer Storage Medium, Computer Program Product and Chip. This invention was developed by Yang Zilong, J..

Diyixin Shanghai Microelectronics Co Ltd Submits Chinese Patent Application for Single-ended Input Successive Approximation Analog-to-digital Converter and Optical Module Chip

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Diyixin Shanghai Microelectronics Co Ltd has submitted a patent application for Single-ended Input Successive Approximation Analog-to-digital Converter and Optical Module Chip. This invention was developed by Wang Yikuan, Fan Mingjun and Wu Ruili. The patent application number is CN202511622575 20251106. Th..

Navitas Semiconductor Inc Submits Chinese Patent Application for Signal Isolator Having a Modulator Circuit and Method of Operating the Same

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Navitas Semiconductor Inc has submitted a patent application for Signal Isolator Having a Modulator Circuit and Method of Operating the Same. This invention was developed by De Sade Vincent, Seppo Antti, Adriaansen Sebastian, Bay Xavier, Marco Giandella and Kinzer Daniel M. The patent application number is ..

Jiejie Microelectronics Chengdu Tech Co Ltd Submits Chinese Patent Application for Solid-state Relay Control Chip Circuit

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Jiejie Microelectronics Chengdu Tech Co Ltd has submitted a patent application for Solid-state Relay Control Chip Circuit. This invention was developed by Sun Xinqi, Yan Chengxiang and Wang Maoji. The patent application number is CN202511736932 20251125. The patent publication number is CN121508512 (A). Int..

Inst Electronic Eng China Academy Eng Physics Submits Patent Application for Lithium Niobate Film MEMS Traveling Wave Motor Design Structure and Preparation Method

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Inst Electronic Eng China Academy Eng Physics has submitted a patent application for Lithium Niobate Film MEMS Traveling Wave Motor Design Structure and Preparation Method. Yang Tianyu, Zhang Kaisheng, Li Xiaoshi, Sun Xiangyu and Zhou Quanfeng developed the invention. The patent application number is CN2026..

Power Diamond Systems Inc Seeks Patent for Diamond Semiconductor Device

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- Power Diamond Systems Inc has sought patent for Diamond Semiconductor Device. This invention was developed by Kawai Sora. The patent application number is WO2025JP37414 20251024. The patent publication number is WO2026110556 (A1). International Patent Classification codes are H10D30/60 and H10D30/66. An ..

Yiweisheng Semiconductor Tech Shanghai Co Ltd Seeks Patent for Multi-sensor Collaborative Wafer Pose Real-time Correction Method Based on Deep Learning

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- Yiweisheng Semiconductor Tech Shanghai Co Ltd has sought patent for Multi-sensor Collaborative Wafer Pose Real-time Correction Method Based on Deep Learning. This invention was developed by Ding Shuangwei. The patent application number is CN20261049549 20260115. The patent publication number is CN121515220 ..

Nantong Weisi Paier Semiconductor Tech Co Ltd Seeks Patent for Process Method for Adjusting Temperature Uniformity of Amb Substrate Brazing Product

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- Nantong Weisi Paier Semiconductor Tech Co Ltd has sought patent for Process Method for Adjusting Temperature Uniformity of Amb Substrate Brazing Product. This invention was developed by Wu Li'e and Chen Juming. The patent application number is CN202511705464 20251120. The patent publication number is CN1215..

Amlogic Semiconductor Shanghai Co Ltd Seeks Patent for Chip Positioning Method, Chip Positioning System, Storage Medium and Automatic Sorting Machine

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- Amlogic Semiconductor Shanghai Co Ltd has sought patent for Chip Positioning Method, Chip Positioning System, Storage Medium and Automatic Sorting Machine. This invention was developed by Zhou Xiang, Liu Lang, Chen Wenqi and Gu Chunlei. The patent application number is CN202411111155 20240813. The patent pu..

Shenyang Xingmo Tech Co Ltd Seeks Patent for Molybdenum Disilicide-recrystallized Silicon Carbide Ceramic Composite Ultrafiltration Membrane and Preparation Method Thereof

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- Shenyang Xingmo Tech Co Ltd has sought patent for Molybdenum Disilicide-recrystallized Silicon Carbide Ceramic Composite Ultrafiltration Membrane and Preparation Method Thereof. This invention was developed by Hao Jianliang, Ren Xia, Liu Changchun, Ren Yun, Han Ruirong, Li Bin and Xue Mingze. The patent app..

Sicc Shanghai Semiconductor Mat Co Ltd Seeks Patent for SiC Crystal and SiC Substrate Having Small Axial and Radial Optical Path Differences

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- Sicc Shanghai Semiconductor Mat Co Ltd has sought patent for SiC Crystal and SiC Substrate Having Small Axial and Radial Optical Path Differences. This invention was developed by Ma Jianli, Wang Zhenxing, Li Peida, Gao Chao, Zhang Jiuyang, Shi Zhiqiang and Li Hao. The patent application number is WO2025CN130..

Shanghai Cooled Electronics Co Ltd Seeks Patent for Three-dimensional Stacked Heat Dissipation Structure for High-power Semiconductor Device and Preparation Method

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Shanghai Cooled Electronics Co Ltd has sought patent for Three-dimensional Stacked Heat Dissipation Structure for High-power Semiconductor Device and Preparation Method. This invention was developed by Wang Qinheng. The patent application number is CN202511598995 20251104. The patent publication number is C..

Changzhou Correll Tech Co Ltd Seeks Patent for Wafer and Substrate Mounting Heating Platform Based on Nitrogen Protection

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Changzhou Correll Tech Co Ltd has sought patent for Wafer and Substrate Mounting Heating Platform Based on Nitrogen Protection. This invention was developed by Tang Guangming, Xu Yao, Gao Wenxiang, Ye Wei and Hong Beilei. The patent application number is CN202511776357 20251128. The patent publication numbe..

Guangdong Xincheng Hanqi Semiconductor Tech Co Ltd Seeks Patent for 2D (two-dimensional) and 3D (three-dimensional) Detection Method and Device for Wafer with Bump

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Guangdong Xincheng Hanqi Semiconductor Tech Co Ltd has sought patent for 2D (two-dimensional) and 3D (three-dimensional) Detection Method and Device for Wafer with Bump. This invention was developed by Yang Fan, Xie Sisi and Liu Kunqi. The patent application number is CN202511387935 20250926. The patent pub..

Sunuo Xiamen Photovoltaic Ind Co Ltd Seeks Patent for Perovskite Solar Cell Optimization Method and System Based on Machine Learning

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Sunuo Xiamen Photovoltaic Ind Co Ltd has sought patent for Perovskite Solar Cell Optimization Method and System Based on Machine Learning. This invention was developed by Lin Xi, Liu Jiakai, Zhu Xu, Meng Hao, Zhang Jingzi, Yang Antai, Hu Kailong and Yao Kexin. The patent application number is CN202511360446..

Rayval Tech Suzhou Co Ltd Seeks Patent for Inductor Pin and Substrate Integrated Clamping Tool for Welding and Assembling PCBA (printed Circuit Board Assembly)

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Rayval Tech Suzhou Co Ltd has sought patent for Inductor Pin and Substrate Integrated Clamping Tool for Welding and Assembling PCBA (printed Circuit Board Assembly). This invention was developed by Wang Shengliang, Wang Yafei and Deng Jie. The patent application number is CN202511566111 20251030. The patent..

State Intellectual Property Office of China Receives Science and Technology Branch Of Chongqing Yuanda Flue Gas Treat Franchising Co Ltd Patent Application for Crystalline Silicon ..

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received Science and Technology Branch Of Chongqing Yuanda Flue Gas Treat Franchising Co Ltd patent application for Crystalline Silicon Photovoltaic Module Recovery Method Based on Cooperation of Light Exposure Treatment and Microwave Separation. Zhang Yingting, ..

State Intellectual Property Office of China Receives Jiangsu Yingci Semiconductor Co Ltd Patent Application for Automatic Chip Sorting Device

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received Jiangsu Yingci Semiconductor Co Ltd patent application for Automatic Chip Sorting Device. Liu Qingbin, Mai Jieping, Cai Xiao, Li Haoran and Qu Feng developed the invention. The patent application number is CN202511721526 20251121. The patent publicati..

State Intellectual Property Office of China Receives Baoyi New Mat Jiangsu Co Ltd Patent Application for High-purity Silicon Powder Production Equipment and Use Method Thereof

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received Baoyi New Mat Jiangsu Co Ltd patent application for High-purity Silicon Powder Production Equipment and Use Method Thereof. Cui Yibin, Liu Liang, Jia Qixian, Jia Lingyun, Cheng Qiang, Liu Jixian and Ma Weixiao developed the invention. The patent appli..

State Intellectual Property Office of China Receives Hanwha Semitech Co Ltd Patent Application for Substrate Processing Apparatus and Method

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received Hanwha Semitech Co Ltd patent application for Substrate Processing Apparatus and Method. Lee Baek-joo, Seo Dong-won, Cho Hyun-chul and Ryu Hee-sung developed the invention. The patent application number is CN20248046385 20240709. The patent publicatio..

State Intellectual Property Office of China Receives Shanghai Honmax Electronic Tech Co Ltd Patent Application for Gan-based Semiconductor Device and Preparation Method Thereof

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received Shanghai Honmax Electronic Tech Co Ltd patent application for Gan-based Semiconductor Device and Preparation Method Thereof. Wu Hao developed the invention. The patent application number is CN202511532749 20251024. The patent publication number is CN1..

State Intellectual Property Office of China Receives Zhejiang Chuanghao Semiconductor Co Ltd Patent Application for Packaging Substrate Processing Equipment and Packaging Substrate

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received Zhejiang Chuanghao Semiconductor Co Ltd patent application for Packaging Substrate Processing Equipment and Packaging Substrate. Fang Yong, Zhang Linwei, Lu Hailin, Jiao Xuezhi and Huang Jianfeng developed the invention. The patent application number ..

State Intellectual Property Office of China Receives Zhongke Tongde Microelectronics Tech Datong Co Ltd Patent Application for Method for Forming Holes in Glass Substrate, Glass Su..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received Zhongke Tongde Microelectronics Tech Datong Co Ltd patent application for Method for Forming Holes in Glass Substrate, Glass Substrate Obtained by Method and Application of Glass Substrate. Zhang Wei developed the invention. The patent application num..

State Intellectual Property Office of China Receives BOE Huacan Optoelectronics Guangdong Co Ltd Patent Application for Substrate Recovery Method

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received BOE Huacan Optoelectronics Guangdong Co Ltd patent application for Substrate Recovery Method. Li Yue and Zhang Wei developed the invention. The patent application number is CN202511401824 20250928. The patent publication number is CN121510938 (A). Int..

State Intellectual Property Office of China Receives Shanghai Cixing Microelectronic Tech Co Ltd Patent Application for Mechanical Arm Detection System and Method for Wafer Detecti..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received Shanghai Cixing Microelectronic Tech Co Ltd patent application for Mechanical Arm Detection System and Method for Wafer Detection of Photoetching Machine. Peng Shiyu and Peng Miaosheng developed the invention. The patent application number is CN202511..

State Intellectual Property Office of China Receives China Electronics Standardization Institute Electronics Standardization Institute Of Ministry Of Ind Patent Application for Pre..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received China Electronics Standardization Institute Electronics Standardization Institute Of Ministry Of Ind patent application for Preparation and Passivation Process of Carrier Decay Time Standard Sample Wafer. Zhao Zhao and Huang Zhichao developed the inventi..

State Intellectual Property Office of China Receives Weishi Advanced Intelligent Tech Suzhou Co Ltd Patent Application for High-tightness Storage Device for Semiconductor Wafer Pla..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received Weishi Advanced Intelligent Tech Suzhou Co Ltd patent application for High-tightness Storage Device for Semiconductor Wafer Plate. Liu Ming, Yu Yongchao and Zhou Zhiyuan developed the invention. The patent application number is CN20261042934 20260114...

State Intellectual Property Office of China Receives Niko Semiconductor and Super Group Semiconductor Co Ltd Patent Application for Power Component and Manufacturing Method Thereof

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received Niko Semiconductor and Super Group Semiconductor Co Ltd patent application for Power Component and Manufacturing Method Thereof. Tang Songnian, Chen Hetai and Xu Xiuwen developed the invention. The patent application number is CN20241183340 20240808. ..

State Intellectual Property Office of China Receives Chongqing Pingwei Enterprise; Chongqing University Patent Application for Reverse Conducting Insulated Gate Bipolar Transistor

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received Chongqing Pingwei Enterprise; Chongqing University patent application for Reverse Conducting Insulated Gate Bipolar Transistor. Xu Xiangtao, Shen Zhigang, Chen Wensuo, Zhang Chengfang and Wang Hang developed the invention. The patent application numbe..

State Intellectual Property Office of China Receives Zhongke Huaqing Quanzhou Fine Ceramics Res Institute Co Ltd Patent Application for Preparation Method of Silicon Nitride Cerami..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received Zhongke Huaqing Quanzhou Fine Ceramics Res Institute Co Ltd patent application for Preparation Method of Silicon Nitride Ceramic Heating Rod. Liu Jinchao, Shi Chunxi, Xiao Qun and Tian Zhuo developed the invention. The patent application number is CN2..

State Intellectual Property Office of China Receives Zhongying Qingchuang Tech Co Ltd Patent Application for Dynamic Optimization System for Energy Consumption of 5G Network Commun..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received Zhongying Qingchuang Tech Co Ltd patent application for Dynamic Optimization System for Energy Consumption of 5G Network Communication Chip. Yu Dapeng, Qu Chenggang, Jin Haoyang, Lu Haidong, Xu Jun and Huang Wentao developed the invention. The patent ..

State Intellectual Property Office of China Receives Shenzhen Realbom Information Co Ltd Patent Application for Audio Output and Power Amplifier Output Integrated Circuit and Devic..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has received Shenzhen Realbom Information Co Ltd patent application for Audio Output and Power Amplifier Output Integrated Circuit and Device. Liu Yongping, Qiu Faqiang and Wang Wei developed the invention. The patent application number is CN20261037254 20260113. ..

World Intellectual Property Organization Receives Iljin Global Holdings Co Ltd Patent Application for PCB Substrate Heat Dissipation Structure and Vehicle Blower Motor Comprising S..

Semiconductor

| Fri 05 Jun 2026

Geneva, June 5 -- World Intellectual Property Organization has received Iljin Global Holdings Co Ltd patent application for PCB Substrate Heat Dissipation Structure and Vehicle Blower Motor Comprising Same. Chang Sung Dong, Hahm Young Jun, Shim Ki Chang, Ko Seoung Deug and Park Seong Cheol developed the invention. The patent ..

World Intellectual Property Organization Receives Hoya Lens Thailand Ltd and Kaga Tadashi Patent Application for Method for Designing Single-focus Aspherical Spectacle Lens and Met..

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- World Intellectual Property Organization has received Hoya Lens Thailand Ltd and Kaga Tadashi patent application for Method for Designing Single-focus Aspherical Spectacle Lens and Method for Manufacturing Single-focus Aspherical Spectacle Lens. Kaga Tadashi developed the invention. The patent application nu..

World Intellectual Property Organization Receives Chengdu BOE Optoelect Tech Co and BOE Technology Group Patent Application for Display Substrate and Display Apparatus

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- World Intellectual Property Organization has received Chengdu BOE Optoelect Tech Co and BOE Technology Group patent application for Display Substrate and Display Apparatus. Shi Bo, Zhang Zhengdong, Huang Li, Xu Baoqiang, Ni Zibo and Zuo Kailong developed the invention. The patent application number is WO2025..

World Intellectual Property Organization Receives BOE Technology Group Co Ltd, Chengdu BOE Optoelect Tech Co and Beijing BOE Technology Development Patent Application for Display S..

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- World Intellectual Property Organization has received BOE Technology Group Co Ltd, Chengdu BOE Optoelect Tech Co and Beijing BOE Technology Development patent application for Display Substrate and Display Device. Liu Cong, Huang Yao, Song Gukhwan, Dong Xiangdan, Liu Lang and Liu Zhen developed the invention. ..

World Intellectual Property Organization Receives BOE Technology Group Co Ltd and Chengdu BOE Optoelectronics Technology Patent Application for Display Substrate and Display Device

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- World Intellectual Property Organization has received BOE Technology Group Co Ltd and Chengdu BOE Optoelectronics Technology patent application for Display Substrate and Display Device. Xu Guanghua, Bai Lu, Xu Hongfei, Xu Yuanjie, Xie Taofeng and Zhang Yuxin developed the invention. The patent application nu..

Inner Mongolia Xinggu Tech Co Ltd Applies for Patent on Crystalline Silicon Plate Side Edge Polishing Device

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- Inner Mongolia Xinggu Tech Co Ltd has applied Chinese patent for Crystalline Silicon Plate Side Edge Polishing Device. Wan Denghua developed it. The patent application number is CN20261051483 20260115. The patent publication number is CN121515035 (A). International Patent Classification codes are B24B29/02,..

Kyocera Wireless Tech Corporation Applies for Patent on Through Silicon Vias

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Kyocera Wireless Tech Corporation has applied Chinese patent for Through Silicon Vias. Koppinen Pekka developed it. The patent application number is CN20248046715 20240613. The patent publication number is CN121511558 (A). International Patent Classification codes are H03H3/007 and H03H3/02. Cooperative Pat..

Tongfu Tongke Nantong Microelectronics Co Ltd Applies for Patent on Chip Structure and Preparation Method Thereof, and Chip Packaging Structure and Packaging Method Thereof

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Tongfu Tongke Nantong Microelectronics Co Ltd has applied Chinese patent for Chip Structure and Preparation Method Thereof, and Chip Packaging Structure and Packaging Method Thereof. Zhu Jun and Ma Liangjun developed it. The patent application number is CN202511418645 20250930. The patent publication number..

Shgenzhen Zhongke Sihe Tech Co Ltd Applies for Patent on Board-level Packaging Structure for Plane Structure Chip and Manufacturing Method Thereof

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Shgenzhen Zhongke Sihe Tech Co Ltd has applied Chinese patent for Board-level Packaging Structure for Plane Structure Chip and Manufacturing Method Thereof. Zhu Jianfang, Shao Dongdong and Lai Jianbiao developed it. The patent application number is CN202511634473 20251110. The patent publication number is C..

Suzhou Guoxian Innovation Tech Co Ltd Applies for Patent on Chip Carrier Plate and Preparation Method Thereof, and Chip Packaging Structure

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Suzhou Guoxian Innovation Tech Co Ltd has applied Chinese patent for Chip Carrier Plate and Preparation Method Thereof, and Chip Packaging Structure. Yang Dang and Zhou Yanxu developed it. The patent application number is CN202511746918 20251125. The patent publication number is CN121510975 (A). Internation..

Nantong Shenghui Microelectronic Tech Co Ltd Applies for Patent on Wafer Heating Device and Wafer Heating Machine

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Nantong Shenghui Microelectronic Tech Co Ltd has applied Chinese patent for Wafer Heating Device and Wafer Heating Machine. Liu Peng developed it. The patent application number is CN202511732870 20251124. The patent publication number is CN121510940 (A). International Patent Classification codes are H10P72/..

Hongqi Integrated Circuit Zhuhai Co Ltd Applies for Patent on Method for Detecting Ion Implantation of Silicon Carbide Device

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Hongqi Integrated Circuit Zhuhai Co Ltd has applied Chinese patent for Method for Detecting Ion Implantation of Silicon Carbide Device. Wu Xianghai, Zhang Yongwei, Niu Jia, Xie Yueling, Zhang Qihua and Yuan Yuan developed it. The patent application number is CN202511409319 20250929. The patent publication n..

Beijing Unisoc Communication Tech Co Ltd Applies for Patent on Communication Method and Device, Terminal Equipment and Chip

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Beijing Unisoc Communication Tech Co Ltd has applied Chinese patent for Communication Method and Device, Terminal Equipment and Chip. Zhang Zhongdan and Lei Zhenzhu developed it. The patent application number is CN20241145122 20240731. The patent publication number is CN121510035 (A). International Patent C..

Navitas Semiconductor Inc Applies for Patent on Full Duplex Digital Isolator

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Navitas Semiconductor Inc has applied Chinese patent for Full Duplex Digital Isolator. De Sade Vincent, Seppo Antti, Adriaansen Sebastian, Bay Xavier, Marco Giandella and Kinzer Daniel M developed it. The patent application number is CN202511107834 20250807. The patent publication number is CN121508523 (A)...

Lot Ces Co Ltd Applies for Patent on Remote Plasma Reactor for Semiconductor Manufacturing Facility

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- Lot Ces Co Ltd has applied WIPO patent for Remote Plasma Reactor for Semiconductor Manufacturing Facility. Bae Jin Ho, Kim Min Jae and Lee Jong Taek developed it. The patent application number is WO2025KR10428 20250716. The patent publication number is WO2026111091 (A1). International Patent Classification c..

Verdeya SA Applies for Patent on Aerosol-generating Article Comprising a Novel Substrate

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- Verdeya SA has applied WIPO patent for Aerosol-generating Article Comprising a Novel Substrate. Hooijmans Morris Kevin, Lavanchy Frédéric, Lukács Attila and Vassiliou Alexandros Vassilios developed it. The patent application number is WO2025EP83892 20251121. The patent publication number is WO2026109733 (..

Nantong Yourui Semiconductor Co Ltd Applies for Patent on Integrated Circuit Chip Mounting Substrate Cleaning Clamp

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- Nantong Yourui Semiconductor Co Ltd has applied Chinese patent for Integrated Circuit Chip Mounting Substrate Cleaning Clamp. Wang Hairong, Xu Haijian, Shen Fanping and Shi Xiaoju developed it. The patent application number is CN20261009755 20250928. The patent publication number is CN121514208 (A). Interna..

Chen Jun Applies for Patent on Vertical Silicon Carbide Rod Hydrogen Production Device with Water Decomposing Agent

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- Chen Jun has applied Chinese patent for Vertical Silicon Carbide Rod Hydrogen Production Device with Water Decomposing Agent. The patent application number is CN202411105209 20240808. The patent publication number is CN121513761 (A). International Patent Classification codes are B01J19/00, B01J19/28, B01J..

Glorysoft Shanghai Co Ltd Applies for Patent on Yield Analysis Method in Semiconductor Industry

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- Glorysoft Shanghai Co Ltd has applied WIPO patent for Yield Analysis Method in Semiconductor Industry. Hong Guangre, Chen Xiangfang and Lu Caijun developed it. The patent application number is WO2025CN134941 20251114. The patent publication number is WO2026108726 (A1). International Patent Classification cod..

Yinwang Intelligent Tech Co Ltd Applies for Patent on Waveguide Structure, Silicon Photonic Chip, Detection Apparatus, and Terminal Device

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- Yinwang Intelligent Tech Co Ltd has applied WIPO patent for Waveguide Structure, Silicon Photonic Chip, Detection Apparatus, and Terminal Device. Niu Ben, Yu Anliang, Zhao Dongfeng, Liu Tonghui and Wu Hongying developed it. The patent application number is WO2024CN141199 20241220. The patent publication numb..

Hexapro Inc Files WIPO Patent Application for High-voltage Anodization Method and Aluminum Substrate Anodized Thereby

Semiconductor

| Fri 05 Jun 2026

Geneva, June 5 -- Hexapro Inc has filed a patent application for High-voltage Anodization Method and Aluminum Substrate Anodized Thereby. This invention was developed by Kim Tae Sun, Nam Ho Chul and Lim Hyun Hong. The patent application number is WO2025KR19125 20251119. The patent publication number is WO2026111384 (A1). Inte..

Foshan Zhenmeizhijia Furniture Co Ltd Files Chinese Patent Application for Furniture Ceramic Chip Cutting Machining Line and Production Line Thereof

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- Foshan Zhenmeizhijia Furniture Co Ltd has filed a patent application for Furniture Ceramic Chip Cutting Machining Line and Production Line Thereof. This invention was developed by Cui Chunwei, Lao Qixing and Lu Jianpei. The patent application number is CN20251209462 20251229. The patent publication number i..

Beijing Aerospace Times Optical Electronic Technology Co Ltd Files Chinese Patent Application for Integrated Optical Chip Processing Method for Improving Full-temperature Stability..

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- Beijing Aerospace Times Optical Electronic Technology Co Ltd has filed a patent application for Integrated Optical Chip Processing Method for Improving Full-temperature Stability of Electro-optical Modulation Coefficient of Lithium Niobate. This invention was developed by Qiao Jiankun, Zheng Guokang, Wang Zhig..

Shanghai Meadville Electronics Co Ltd Files WIPO Patent Application for Novel Titanium Basket Cover Plate Device Capable of Improving Depression, Roughness, Copper Thickness Unifor..

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- Shanghai Meadville Electronics Co Ltd has filed a patent application for Novel Titanium Basket Cover Plate Device Capable of Improving Depression, Roughness, Copper Thickness Uniformity and Board Jamming in Horizontal Electroplating Line. This invention was developed by Peng Xiaojun, Chen Xiaofeng, Liu Hua, Zho..

Shanghai Meadville Science & Tech Co Ltd Files Chinese Patent Application for Substrate Surface Film Detection Method and Detection Substrate

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Shanghai Meadville Science & Tech Co Ltd has filed a patent application for Substrate Surface Film Detection Method and Detection Substrate. This invention was developed by Lu Xinyu, Huo Fayan, Fan Lixia, Meng Wei, Bao Hailian and Chen Zhuhua. The patent application number is CN202511721582 20251121. The pa..

Jiangsu Shanshui Semiconductor Mat Co Ltd Files Chinese Patent Application for Silicon Wafer Cleaning Machine

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Jiangsu Shanshui Semiconductor Mat Co Ltd has filed a patent application for Silicon Wafer Cleaning Machine. This invention was developed by Li Shiquan, Li Xing and Xiang Yufang. The patent application number is CN202511702938 20251119. The patent publication number is CN121510891 (A). International Patent ..

Shanghai Fulehua Semiconductor Tech Co Ltd Files Chinese Patent Application for Copper-clad Ceramic Substrate Mother Set Structure with Blocking Dam and Excessive Corrosion Prevent..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Shanghai Fulehua Semiconductor Tech Co Ltd has filed a patent application for Copper-clad Ceramic Substrate Mother Set Structure with Blocking Dam and Excessive Corrosion Prevention Method Thereof. This invention was developed by Xu Jiezhao, Zou Xuyang, Yang Qiangjun and Dai Hongxing. The patent application..

Suzhou Mingjian Sensing Tech Co Ltd Files Chinese Patent Application for Structured Light Imaging System and Method Suitable for Semiconductor SIP (session Initiation Protocol) Sys..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Suzhou Mingjian Sensing Tech Co Ltd has filed a patent application for Structured Light Imaging System and Method Suitable for Semiconductor SIP (session Initiation Protocol) System-in-package. This invention was developed by Tian Zongzong and Zhu Yifeng. The patent application number is CN202511657757 2025..

Hefei Chipsea Electronic Tech Co Ltd Files Chinese Patent Application for Analog-to-digital Conversion Circuit, Chip and Electronic Equipment

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Hefei Chipsea Electronic Tech Co Ltd has filed a patent application for Analog-to-digital Conversion Circuit, Chip and Electronic Equipment. This invention was developed by Ye Xuefeng and Yang Baoding. The patent application number is CN202511437333 20251009. The patent publication number is CN121508534 (A)..

Shaanxi Reactor Microelectronics Co Ltd Files Chinese Patent Application for Selectable Boost Circuit Applied to Intelligent Low-side Switch Chip

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- Shaanxi Reactor Microelectronics Co Ltd has filed a patent application for Selectable Boost Circuit Applied to Intelligent Low-side Switch Chip. This invention was developed by Kang Ji-oh, Meng Lingbai, Yuan Bo, Yang Shihong and Xiong Ping. The patent application number is CN202511561044 20251029. The paten..

State Intellectual Property Office of China Publishes Gudeng Prec Industral Co Ltd Patent Application for Fixing Device and Upward-opening Type Substrate Carrier Applying Same

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has published Gudeng Prec Industral Co Ltd patent application for Fixing Device and Upward-opening Type Substrate Carrier Applying Same. The invention was developed by Qiu Mingqian, Li Qilin, Lin Jiaqi and Pan Yongjin. The patent application number is CN2025116533..

State Intellectual Property Office of China Publishes Wuxi Xinzhuo Huguang Semiconductor Co Ltd Patent Application for Etching Method of Semiconductor Device and Semiconductor Devi..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has published Wuxi Xinzhuo Huguang Semiconductor Co Ltd patent application for Etching Method of Semiconductor Device and Semiconductor Device. The invention was developed by Yan Qixing, Liang Debin, Li Xuesong and Ding Chao. The patent application number is CN202..

State Intellectual Property Office of China Publishes Yantai Engineering Univ Research Institute Patent Application for Application of 2-bromo-4-methylaniline in Anti-solvent-free ..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has published Yantai Engineering Univ Research Institute patent application for Application of 2-bromo-4-methylaniline in Anti-solvent-free Carbon-based Perovskite Solar Cell and Preparation Method of 2-bromo-4-methylaniline. The invention was developed by Xu Chongya..

State Intellectual Property Office of China Publishes Shenzhen Mynice Photoelectric Co Ltd Patent Application for Flexible Micro Light-emitting Diode Chip Connection Method Based o..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has published Shenzhen Mynice Photoelectric Co Ltd patent application for Flexible Micro Light-emitting Diode Chip Connection Method Based on Laser-induced Selective Deposition. The invention was developed by Li Xiaoqing, Yong Hai, Chen Lin and Wang Hua. The paten..

State Intellectual Property Office of China Publishes Wuxi Huaxing Photoelectric Res Co Ltd and Jiangsu Hoaxing Laser Tech Co Ltd Patent Application for Amorphous Carbon/gallium Ar..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has published Wuxi Huaxing Photoelectric Res Co Ltd and Jiangsu Hoaxing Laser Tech Co Ltd patent application for Amorphous Carbon/gallium Arsenide Double-junction Solar Cell and Preparation Method Thereof. The invention was developed by Zhao Run, Ning Vibration, Wan..

State Intellectual Property Office of China Publishes Gigaphoton and University Kyushu National University Patent Application for Method for Manufacturing Semiconductor Element, an..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has published Gigaphoton and University Kyushu National University patent application for Method for Manufacturing Semiconductor Element, and Semiconductor Element. The invention was developed by Tanaka Yohei, Yabuta Hisato, Beppu Misa and Katayama Keita. The pate..

State Intellectual Property Office of China Publishes Zhejiang Wangrong Semiconductor Co Ltd Patent Application for Semiconductor Device, Preparation Method of Semiconductor Device..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has published Zhejiang Wangrong Semiconductor Co Ltd patent application for Semiconductor Device, Preparation Method of Semiconductor Device and Power Module. The invention was developed by Zhang Quanyi, Feng Quanyuan, Chen Mingyang, Zhan Yuanchang and Li Zhimin. ..

World Intellectual Property Organization Publishes Amst Co Ltd and Point Engineering Patent Application for Multilayer Ceramic Wafer for Inductor and Inductor Using Same

Semiconductor

| Fri 05 Jun 2026

Geneva, June 5 -- World Intellectual Property Organization has published Amst Co Ltd and Point Engineering patent application for Multilayer Ceramic Wafer for Inductor and Inductor Using Same. The invention was developed by Song Byung Chang, Oh Tae Seung, Cho Soo Ho, Park Seung Ho and Song Tae Hwan. The patent application num..

State Intellectual Property Office of China Publishes Jiangsu Sanxin Prec Machinery Co Ltd Patent Application for Semiconductor Wafer Thinning Machine

Semiconductor

| Thu 04 Jun 2026

Beijing, June 5 -- State Intellectual Property Office of China has published Jiangsu Sanxin Prec Machinery Co Ltd patent application for Semiconductor Wafer Thinning Machine. The invention was developed by Wang Qiang, Zou Yuyao, Wang Tong and Gao Shuai. The patent application number is CN202511621038 20251107. The patent publ..

World Intellectual Property Organization Publishes China Satellite Network Application Co Ltd and Honor Device Patent Application for Signal Processing Method and Apparatus, and Te..

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- World Intellectual Property Organization has published China Satellite Network Application Co Ltd and Honor Device patent application for Signal Processing Method and Apparatus, and Terminal Device, Computer-readable Storage Medium, Computer Program Product and Chip System. The invention was developed by Su Yon..

World Intellectual Property Organization Publishes NVIDIA Corp and Yu Chong Patent Application for Automatic Precision Selection in Neural Network Models

Semiconductor

| Thu 04 Jun 2026

Geneva, June 5 -- World Intellectual Property Organization has published NVIDIA Corp and Yu Chong patent application for Automatic Precision Selection in Neural Network Models. The invention was developed by Yu Chong. The patent application number is WO2024CN132836 20241119. The patent publication number is WO2026107620 (A1)...

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