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Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Yunzhou Integrated Circuit Wuhan Co Ltd has applied Chinese patent for 3D Packaging System with Heat Dissipation Interconnection Function and Packaging Method Thereof. Zhang Zhao, Feng Peng and Zhao Haojie developed it.
The patent application number is CN202411713871 20241127. The patent publication number..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- State Intellectual Property Office of China has released Beijing Semiconductor Special Equipment Research Institute The 45th Research Institute of China Electronics Te patent application for Vacuum QDR Tank and Use Method Thereof. This invention was developed by Ai Haifeng, Yuan Lian, Xie Xiaoguang, Li Guosen..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Dish Network Tech India Private Limited has secured a patent on 4k Content Memory Fragmentation Viewing Countermeasures. Dandekar Kaustubh and Huddar Lohit developed the invention.
The patent application number is US202418601798 20240311. The patent publication number is US12713092 (B2). International P..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- State Intellectual Property Office of China has published Suzhou Zhixinwei Tech Co Ltd patent application for Double-core Integrated MicroLED Chip for Illumination and Projection Integrated Intelligent Vehicle Lamp and Preparation Method. The invention was developed by Huang Long and Zhang Lintao.
The pate..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Infineon Technologies has been granted a patent for Adaptive Universal LED Bypass. Zuin Riccardo and Ioannidou Anastasia developed the invention.
The patent application number is US202418777228 20240718. The patent publication number is US12713505 (B2). International Patent Classification codes are H05B..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- U.S. Patent and Trademark Office has awarded a patent to Textron Inc and Textron Innovations for Creating Golfer Profiles Using Driving Habits. Wanta Brian David and Boehm Christopher Alexander developed the invention.
The patent application number is US202418673798 20240524. The patent publication numb..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Suzhou Guoxian Innovation Tech Co Ltd has submitted a patent application for Chip Packaging Structure and Preparation Method Thereof. This invention was developed by Zhou Yanxu.
The patent application number is CN202610202727 20260211. The patent publication number is CN122121703 (A). International Patent ..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Beijing Ziyixin Integrated Circuit Co Ltd has submitted a patent application for P3 Packaging Optimization Structure Based on aEASI Technology and Preparation Method Thereof. This invention was developed by Guo Guiguan, Lin Zixiang and Guo Jianyun.
The patent application number is CN202610149446 20260203. ..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- United States Patent for Semiconductor Device has been issued to Dynex Semiconductor Ltd and Zhuzhou CRRC Times Semiconductor. This invention was developed by Simpson Robin Adam, Wang Yangang and Nicholson Michael David.
The patent application number is US202118551950 20211021. The patent publication nu..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- U.S. Patent and Trademark Office has awarded a patent to International Business Machines for Free Layer in Magnetoresistive Random-access Memory. Gottwald Matthias Georg, Mehta Virat Vasav, Reznicek Alexander, Bruley John and Hu Guohan developed the invention.
The patent application number is US20231835..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Wisconsin Alumni Research Foundation has been granted a patent for Photonic Content Addressable Memory. Yin Zihan and Jaiswal Akhilesh developed the invention.
The patent application number is US202418786879 20240729. The patent publication number is US12712019 (B2). International Patent Classification ..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- U.S. Patent and Trademark Office has awarded a patent to Micron Technology Inc for Semiconductor Device Having DQS Counter Circuit. Mitsubori Shingo and Uemura Yutaka developed the invention.
The patent application number is US202418781037 20240723. The patent publication number is US12712009 (B2). Inte..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- United States Patent for Internal Memory Reclaiming Method and Apparatus, Device, Medium, and Product has been issued to Tencent Technology Shenzhen Co Limited. This invention was developed by Song Kairui, Xia Kaixu, Zhou Yushan and Zeng Jingxiang.
The patent application number is US202519068153 2025030..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- SanDisk Technology has secured a patent on Apparatus for Allowing the Protected mSets to Continue to be Used During Control Sync (CS) on the Base of Shadow Ulayer. Frid Marina, Kelner Vered and Genshaft Igor developed the invention.
The patent application number is US202418914949 20241014. The patent pu..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- Micron Technology has been granted a patent for Efficient Data Management for Memory System Error Handling. This invention was developed by Parry Jonathan S, Gohain Nitul and Mulani Jameer.
The patent application number is US202418581275 20240219. The patent publication number is US12711023 (B2). Intern..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- Finisar Shanghai Inc has obtained a patent for on-chip structure for fiber array alignment by assisting edge coupler index-matching epoxy/oil filling. This invention was developed by Li Yu, Sun Yao, Wei Jianhu, Fryett Taylor, Zhou Linjie, Zeng Shanshan, Dong Po, Si Wei and Shi Tony.
The patent applicati..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- II VI Delaware Inc has been awarded a patent for Multi-layer High-efficiency Dielectric Grating with Improved Manufacturability. This invention was developed by Greiner Christoph, Hostetler John, Hannigan Justin and Iazikov Dmitri.
The patent application number is US202318382366 20231020. The patent pub..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- Silicon Mitus Inc, Silicon Magic Semiconductor Tech Hangzhou Co Ltd and Hangzhou Silicon Magic Semiconductor Tech Co Ltd China have been awarded a patent for Apparatus and Method for Detecting Foreign Substance. This invention was developed by Ko Young Seok, Park Chang Sub and Hong Chang Ki.
The patent ..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- Bosch GmbH Robert has received a patent for Method for Fault Analysis in Wafers. This invention was developed by Augke Ralf, Smirnov Waldemar, Schnitzler Thomas and Janus Michel.
The patent application number is US202418427609 20240130. The patent publication number is US12710377 (B2). International Pat..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Fujian Jinhua Integrated Circuit has obtained a patent for semiconductor device. This invention was developed by Zhang Qinfu and Tong Yucheng.
The patent application number is CN202423104584U 20241216. The patent publication number is CN223567985 (U). International Patent Classification code is H10B12/00. ..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Guangdong Wanhe Thermal Energy Technology has obtained a patent for temperature controller power-down memory circuit and temperature controller. This invention was developed by Xie Gege.
The patent application number is CN202422996202U 20241204. The patent publication number is CN223567603 (U). Internation..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- U.S. Patent and Trademark Office has awarded a patent to Hue Inc and Jade Bird Display, Shanghai for Micro LED Structure and Full Color Micro LED Panel. Xu Qunchao and Tan Wei Sin developed the invention.
The patent application number is US202318542755 20231217. The patent publication number is US127137..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- U.S. Patent and Trademark Office has awarded a patent to Vanguard International Semiconductor for ESD Protection Circuit and Structure. Liao Hsien-feng, Lin Chih-hsuan, Jou Yeh-ning, Chuang Chieh-yao, Lee Jian-hsing and Chang Ting-yu developed the invention.
The patent application number is US202418640..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Renesas Design Netherlands BV has been awarded a patent for ESD Protection Circuit. This invention was developed by Mahajan Prantik and Otten Jan.
The patent application number is US202318508776 20231114. The patent publication number is US12713709 (B2). International Patent Classification codes are H10..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Nexperia BV has obtained a patent for semiconductor device and esd protection device comprising the same. This invention was developed by Ritter Hans-martin and Seider Stefan.
The patent application number is US202217877175 20220729. The patent publication number is US12713704 (B2). International Patent..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- U.S. Patent and Trademark Office has awarded a patent to Penn State Research Foundation for an Ultra-steep Slope and High-performance Strain Effect Transistor. Das Sarbashis and Das Saptarshi developed the invention.
The patent application number is US202318861954 20230621. The patent publication number..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Magnolia White Corp and Japan Display have been granted a patent for Semiconductor Device. Hanada Akihiro, Watakabe Hajime and Onodera Ryo developed the invention.
The patent application number is US202318447470 20230810. The patent publication number is US12713659 (B2). International Patent Classificat..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Toshiba Electronic Devices & Storage Corp, KK Toshiba and Toshiba have been granted a patent for Semiconductor Device and Method for Manufacturing Same. Kawamura Keiko, Oasa Kohei, Ichinoseki Kentaro and Nishiwaki Tatsuya developed the invention.
The patent application number is US202318105164 20230202...
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- United States Patent for Semiconductor Device and Manufacturing Method Thereof has been issued to Toshiba Electronic Devices & Storage Corp, KK Toshiba and Toshiba. This invention was developed by Kawamura Keiko, Iwakaji Yoko, Ichinoseki Kentaro, Motai Takako and Fuse Kaori.
The patent application numbe..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Memorist Co Ltd has secured a patent on Memory Device and Method of Manufacturing the Same. Chen Chao-yang and Huang Chih-jen developed the invention.
The patent application number is US202217979059 20221102. The patent publication number is US12713626 (B2). International Patent Classification codes are..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Nanya Technology Corp and Nanya Tech have been granted a patent for Memory Device and Forming Method Thereof. This invention was developed by Hsu Kuo Chung and Li En-jui.
The patent application number is US202318204795 20230601. The patent publication number is US12713585 (B2). International Patent Clas..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Infineon Technologies, Austria has been granted a patent for Trans-inductor Voltage Regulator (TLVR) Inductor Module and Power Electronics Assembly Including the TLVR Inductor Module. This invention was developed by Huang Wenkang, Galipeau Darryl and Somasundaram Surendhar.
The patent application number..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- Taiwan Semiconductor Manufacturing has received a patent for Extended Reality Content Display Based on a Context. This invention was developed by Agrawal Tushar, Rakshit Sarbajit K, Compton Christian and Fox Jeremy R.
The patent application number is US202318187415 20230321. The patent publication numbe..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- Micron Technology has secured a patent on System for Generating Virtual Block Stripes in a Memory Device. Xie Tingjun, Zhang Daniel, Liu Yang, Zhu Jiangli, Li Juane and Lee Aaron developed the invention.
The patent application number is US202418820085 20240829. The patent publication number is US1271089..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- U.S. Patent and Trademark Office has awarded a patent to Hewlett Packard Entpr Dev LP and Hewlett Packard Enterprise Company (HPE) for Federated Management of Data Operators on Near-memory Compute Nodes. Milojicic Dejan S and Bresniker Kirk M developed the invention.
The patent application number is US2..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- U.S. Patent and Trademark Office has awarded a patent to International Business Machines for Clock Synchronization in a Multichip Module. Dreps Daniel Mark, Tong Ching Lung, Malone Douglas J, Wiedemeier Glen A, Arp Andreas H A, Zhang Lily Jielu and Rudolph Bruce George developed the invention.
The paten..
Semiconductor
| Sun 23 Aug 2026
Beijing, Aug. 24 -- State Intellectual Property Office of China has awarded a patent to Jiangsu Changguang Space Time Photoelectric Tech Co Ltd for Semiconductor Component Dispensing Mechanism. Zhang Xing developed the invention.
The patent application number is CN202422953678U 20241202. The patent publication number is CN223..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Inno Saike (Suzhou) Semiconductor has been granted a patent for Power Device. Zhang Xue developed the invention.
The patent application number is CN202422944740U 20241129. The patent publication number is CN223567988 (U). International Patent Classification codes are H10D30/47 and H10D62/10.
The abstra..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Air Force Early Warning Academy has received a patent for Composite Function Metasurface Capable of Simultaneously Regulating and Controlling Radiation and Scattering Characteristics. This invention was developed by Zhang Di, Yang Jun, Li Yujun, Hong Liang, Chen Qiang, Zhang Yuanpeng and Yu Fangli.
The pat..
Semiconductor
| Sun 23 Aug 2026
Beijing, Aug. 24 -- Hangzhou Cobetter Semiconductor Separation Membrane has been granted a patent for Hollow Fiber Module. Jia Jiandong, Shen Ruliang and Jin Binbin developed the invention.
The patent application number is CN202422131580U 20240831. The patent publication number is CN223570437 (U). International Patent Classif..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Advanced Semiconductor Engineering has been granted a patent for Semiconductor Package Structure. This invention was developed by Essig Kay Stefan, Appelt Bernd Karl, Yen You-lung and Yannou Jean Marc.
The patent application number is US202318137392 20230420. The patent publication number is US12713980 ..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- U.S. Patent and Trademark Office has awarded a patent to Enkris Semicondustor Inc for Semiconductor Structure and Manufacturing Method Therefor. Liu Zhuan and Cheng Kai developed the invention.
The patent application number is US202017916413 20200716. The patent publication number is US12713977 (B2). In..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- U.S. Patent and Trademark Office has awarded a patent to Toshiba KK and Toshiba Infrastructure Systems & Solutions for Semiconductor Device and Method for Adjusting Phase Characteristics Thereof. Takahashi Koji developed the invention.
The patent application number is US202318472863 20230922. The patent..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- The Trustees of Princeton University and Princeton University have secured a patent on Configurable in Memory Computing Engine, Platform, Bit Cells and Layouts Therefore. Verma Naveen, Valavi Hossein and Jia Hongyang developed the invention.
The patent application number is US202418738851 20240610. The ..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Avago Technologies International Sales has been granted a patent for Hybrid Substrates and Manufacturing Methods Thereof. This invention was developed by Mayukh Mayank, Tendel Shrikara Prabhu, Pallinti Jayanthi and Dix Gregory.
The patent application number is US202318496645 20231027. The patent publica..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Stmicroelectroncis Grenoble 2 SAS has obtained a patent for qfn package comprising two electronic chips with different substrates. This invention was developed by Coffy Romain and Boutaleb Younes.
The patent application number is US202318387196 20231106. The patent publication number is US12713944 (B2)...
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Suzhou Oriental Semiconductor and Chixin Microelectronic Tech Suzhou Co Ltd have submitted a patent application for Power Semiconductor Module. This invention was developed by Tang Le, Zhang Hangyu and Yuan Wei.
The patent application number is CN202610204670 20260212. The patent publication number is CN12..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Beijing Tankeblue Semiconductor and Shenzhen Zhongtou Tianke Semiconductor Co Ltd have filed a patent application for Silicon Carbide Wafer Purging Flower Basket Device. This invention was developed by Zhang He, Peng Tonghua, Yang Jian, Song Linna, Tian Xinxin, Wang Peng and Wang Bo.
The patent application..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Huazhong University of Science and Technology and Hubei Guanggu Laboratory have submitted a patent application for Polar Substrate Regulated and Controlled Electrically-driven Narrow-band Mid-infrared Thermal Emission Method and Device. This invention was developed by Li Peining, Cai Bingnan and Tan Tianwei.
..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Gaojing Solar Energy and Guangdong Jinwan Gaojing Solar Energy Tech Co Ltd have submitted a patent application for Monocrystalline Silicon Wafer Cleaning Agent and Method for Cleaning Monocrystalline Silicon Wafer by Using Same. This invention was developed by Xiao Bing, Tang Qi, Quan Xiaodong, Zhou Yu and Gu..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Chengdu BOE Optoelectronics Technology and BOE Technology Group have filed a patent application for Display Substrate and Display Device. This invention was developed by Shi Bo, Xu Baoqiang, Ni Zibo, Zuo Kailong, Zhang Zhengdong and Huang Li.
The patent application number is CN202411659227 20241119. The pa..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Zhejiang Aiko Solar Energy Technology, Shandong Aiko Solar Energy Tech Co Ltd, Zhuhai Fushan Aixu Solar Energy Technology and Tianjin Aiko Solar Energy Technology have submitted a patent application for Back Contact Solar Cell and Preparation Method Thereof. This invention was developed by Feng Mengxian, Yang..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Huaneng Jiayuguan New Energy Co Ltd and Huaneng Clean Energy Research Institute have applied Chinese patent for Heterojunction Solar Cell. Wang Wei, Wang Haijun, Chen Guojun, Bai Xinkui, Xiao Ping, Niu Jingkai, Zhou Ying, Li Menglei, Wang Dapeng and Zhao Dongming developed it.
The patent application number..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Shanghai YZ Lapping Mat Co Ltd and Quzhou Bolai Narun Electronic Mat Co Ltd have sought patent for Polishing Solution for Silicon Carbide Wafer and Preparation Method Thereof. This invention was developed by An Junxue and Huang Min.
The patent application number is CN202610194794 20260211. The patent publi..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Huaneng Jiayuguan New Energy Co Ltd and Huaneng Clean Energy Research Institute hae filed a patent application for Solar Cell Solder Strip and Solar Cell. This invention was developed by Lin Zizhen, Chen Chuanke, Wang Wei, Xue Yao, Wang Zhize, Wang Haijun, Li Rui, Li Youdi, Yang Bin, Hao Zhidan, Niu Jingkai a..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Polyontech Advanced Mat Shanghai Co Ltd and Puwei Shanghai New Material Tech Co Ltd have filed a patent application for Preparation Method and Application of Polar Group-containing Modified Organic Silicon Polymer and Defoaming Agent. This invention was developed by Hou Junli.
The patent application number..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- UIF University Industry Foundation Yonsei University and SK Hynix have been awarded a patent for Etching Composition for Selectively Etching Silicon Nitride, Etching Method, and Manufacturing Method of Semiconductor Device Using the Same. This invention was developed by Kang Hyun Goo, Lim Sang Woo, Oh Eun ..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- National University of Singapore and Applied Materials have been awarded a patent for in Situ Acyclic Diamino Carbene (ADC) Deposition. This invention was developed by Mota Merelo De Aguiar Sara Raquel, Huynh Han Vinh, Leoncini Andrea and Lim Wei Chun.
The patent application number is US202418621661 202..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- BOE Technology Group Co Ltd and Yunnan Invensight Optoelectronics Tech Co Ltd have received a patent for Display Panel and Drive Substrate. This invention was developed by Wu Bin, Guo Zhicheng, Zhu Yun, Lu Pengcheng, Pu Chao, Yang Shengji, Chen Xiaochuan, Huang Kuanta, Yang Junyan, Ding Yanqiang and Zhu Sh..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- BOE Technology Group Co Ltd and Hefei BOE Joint Technology have secured a patent on Array Substrate and Display Panel. Feng Xuehuan and Li Yongqian developed the invention.
The patent application number is US202218549038 20221031. The patent publication number is US12713701 (B2). International Patent Cl..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Brown University and Trustees of Boston University have been awarded a patent for Hybrid Biofilm Semiconductor Information Systems. This invention was developed by Rosenstein Jacob K, Hu Kangping and Larkin Joseph W.
The patent application number is US202318300278 20230413. The patent publication number..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- TSMC China Co Limited and Taiwan Semiconductor Manufacturing Co Ltd have obtained a patent for method of using semiconductor device and method of making. This invention was developed by Zhong Jia Liang, Wang Ming Jian, Wang Xin Yong and Chen Cun Cun.
The patent application number is US202318492238 20231..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Silicon Magic Semiconductor Tech Hangzhou Co Ltd and Hangzhou Silicon Magic Semiconductor Technology have obtained a patent for super-junction semiconductor device with enlarged process window for desirable breakdown voltage. This invention was developed by Chen Hui, Wang Jiakun and Li Lvqiang.
The pate..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- SanDisk Tech LLC and SanDisk Technologies have been granted a patent for Three-dimensional Memory Device Containing Silicon Oxycarbide Liners and Methods of Forming the Same. Tsutsumi Masanori, Fujimura Nobuyuki, Suzuki Ryota, Kudo Takashi, Hosoda Naohiro and Moriyama Takumi developed the invention.
The..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- Tokyo Electron Ltd and Fujitsu have been awarded a patent for Quantum Computation Control Method and Information Processing Apparatus. This invention was developed by Nagata Tomohisa and Ito Yuto.
The patent application number is US202519052322 20250213. The patent publication number is US12711410 (B2)...
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- SK Hynix Inc and Korea Advanced Institute of Science and Tech Kaist have secured a patent on Neuromorphic Device Having Three-dimensional Stacked Structure and Method of Fabricating the Same. Choi Yang-kyu and Han Joon-kyu developed the invention.
The patent application number is US202218059861 20221129..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- Muto Shunichi, Choi Byeong Gyu and Thermal Solution Tech Co Ltd have secured a patent on Apparatus for Testing Semiconductor Device Test.
The patent application number is US202318839154 20230217. The patent publication number is US12710470 (B2). International Patent Classification codes are G01K1/14, G..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- ASM IP Holding BV and ASM have been awarded a patent for Dew Point Sensing in Semiconductor Processing System Load Locks. This invention was developed by Pugliese Jr Frank A and Rosser Andrew.
The patent application number is US202218065911 20221214. The patent publication number is US12710341 (B2). Int..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- ASM IP Holding BV and ASM have been granted a patent for Methods of Filling a Recessed Feature on a Substrate Employing Metal Sequential Infiltration Synthesis Processes. This invention was developed by Kachel Krzysztof Kamil.
The patent application number is US202519185384 20250422. The patent publicat..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- Kobashi Toshiyuki, Ricoh Co Ltd and Harada Shigeyuki have been granted a patent for Polymer, Copolymer, Ink, Ink Container, Image Forming Method, Image Forming Device, and Backsheet for Solar Cell.
The patent application number is US202318158639 20230124. The patent publication number is US12709654 (B2..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- ASML Netherlands BV and ASML Netherlands NV have been awarded a patent for Charged-particle Optical Device. This invention was developed by Wieland Marco Jan-jaco.
The patent application number is US202218580269 20220705. The patent publication number is US12712147 (B2). International Patent Classificat..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Western Digital Tech Inc and SanDisk Technology have obtained a patent for word line switch gate voltage and well voltage separation. This invention was developed by Dunga Mohan Vamsi, Qin Sichang, Narayanan Sudarshan, Zhao Qinghua and Jeong Gwang Yeong Stanley.
The patent application number is US202318..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- Microprgram Information Co Ltd, T Parus Trading Co Ltd and Sheng Chyuan Tech Co Ltd have been granted a patent for End Effector of Wafer Transfer Robot with Embedded Sensors. Liu Chia Wei and Wu Teng Yen developed the invention.
The patent application number is US202218064164 20221209. The patent public..
Semiconductor
| Sun 23 Aug 2026
Beijing, Aug. 24 -- Zhuhai Gree Electronic Components and Gree Electric Appliances, Zhuhai have been awarded a patent for Semiconductor Structure and Semiconductor Device. This invention was developed by Yan Zhengkun, Ma Wanli, Liu Haowen and Cai Hongwei.
The patent application number is CN20242332872U 20241209. The patent pu..
Semiconductor
| Sun 23 Aug 2026
Beijing, Aug. 24 -- Intelligent Manufacturing Institute of HFUT and Hefei Kaibirui Fine Machine Tech Co Ltd have received a patent for Impurity Removal Device for Silicon Material Crushing Process. This invention was developed by Luo Hui, Yu Zhongyuan, Zhou Long and Zhao Chong.
The patent application number is CN202422872643U..
Semiconductor
| Sun 23 Aug 2026
Beijing, Aug. 24 -- State Intellectual Property Office of China has received Gechuang Communication Zhejiang Co Ltd patent application for Longest Prefix Matching Storage Device and Method Based on TCAM (Ternary Content Addressable Memory) and Chip. Yang Yi developed the invention.
The patent application number is CN202610536..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Applied Materials has received a patent for Radiation Heating to Dry Moisture from Air Bearing Shaft. This invention was developed by Krampert Jeffrey E and Fish Roger B.
The patent application number is US202318541019 20231215. The patent publication number is US12712151 (B2). International Patent Clas..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Texas Instr Incorporated has been granted a patent for Transformers with Separated Magnetic Members. Aoya Kengo, Yan Yi, Shimizu Tatsuhiro and Noguchi Tomoko developed the invention.
The patent application number is US202017002283 20200825. The patent publication number is US12712122 (B2). International..
Semiconductor
| Mon 24 Aug 2026
Alexandria, Aug. 24 -- Applied Materials Israel has obtained a patent for systems and methods for registration between images informative of one or more semiconductor specimens. This invention was developed by Frank Tal, Schwarzband Ishai, Avniel Yan, Gat Shani, Kris Roman, Levin Sahar, Bat Mor Orel and Bistritzer Rafael.
The..
Semiconductor
| Sun 23 Aug 2026
Beijing, Aug. 24 -- Shaanxi Xintiandi Solid Waste Mat Management Co Ltd has secured a patent on Equipment for Recovering Silicon Powder from Semiconductor Silicon Wafer Processing Cutting Fluid. Ma Qi, Fan Zenghua, Hou Junli, Zhou Jiangnan and Liu Mengyun developed the invention.
The patent application number is CN20242307731..
Semiconductor
| Sun 23 Aug 2026
Beijing, Aug. 24 -- Zhejiang Geyang New Mat Co Ltd has obtained a patent for feeding mechanism of silicon dioxide processing reaction kettle. This invention was developed by Fan Yonggen.
The patent application number is CN202422755812U 20241112. The patent publication number is CN223570652 (U). International Patent Classifica..
Semiconductor
| Mon 24 Aug 2026
Beijing, Aug. 24 -- Chinese Patent for Pet Chip Automatic Identification Feeder has been issued to Guangzhou Yuyongqi Intelligent Tech Co Ltd. This invention was developed by Zhu Xishui.
The patent application number is CN202422905219U 20241127. The patent publication number is CN223568366 (U). International Patent Classifica..
Semiconductor
| Sun 23 Aug 2026
Beijing, Aug. 24 -- Chengdu Weiguang Jidian Tech Co Ltd has submitted a patent application for Image Compression and Decompression Method and System and Image Processing Chip. This invention was developed by Wang Hanchen, Wang Yong, Song Bo and Wen Jianxin.
The patent application number is CN202610294756 20260311. The patent ..
Semiconductor
| Sun 23 Aug 2026
Beijing, Aug. 24 -- Tianxing Shuke Tech Co Ltd has submitted a patent application for Resource Pushing Method and Device, Electronic Equipment, Medium and Chip. This invention was developed by Ji Yue.
The patent application number is CN202411751197 20241129. The patent publication number is CN122120326 (A). International Pate..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Samsung Electronics has been awarded a patent for Semiconductor Devices and Data Storage Systems Including the Same. This invention was developed by Park Junseok, Park Seunghak and Hwang Chan.
The patent application number is US202318489354 20231018. The patent publication number is US12713935 (B2). Int..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- United States Patent for Energy Harvest and Storage Device for Semiconductor Chips and Methods for Forming the Same has been issued to Taiwan Semiconductor Manufacturing Co Limited. This invention was developed by Huang Kuo-ching, Chen Kuen-yi, Ong Yi Ching and Chuang Harry-hak-lay.
The patent applicati..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Infineon Technologies has obtained a patent for method for processing a semiconductor wafer and semiconductor composite structure. This invention was developed by Rupp Roland, Santos Rodriguez Francisco Javier, Schulze Hans-joachim, Sgouridis Sokratis, Breymesser Alexander, Moser Andreas, Knabl Michael, Vo..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- United States Patent for Semiconductor Device and Method of Manufacturing a Semiconductor Device has been issued to Infineon Technologies, Austria. This invention was developed by Mohamed Saheed Mohamed Salleh and Permal Murugalogeswaran.
The patent application number is US202418589584 20240228. The pat..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Mitsubishi Electric has been granted a patent for Semiconductor Device Module and Method for Manufacturing Same. This invention was developed by Abe Shunichi.
The patent application number is US202018000998 20200803. The patent publication number is US12713923 (B2). International Patent Classification c..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Infineon Tech Austria AG has been granted a patent for Power Semiconductor Module Arrangement and Method for Producing the Same. Heinrich Alexander, Bohnenberger Timo and Roth Alexander developed the invention.
The patent application number is US202318316376 20230512. The patent publication number is US..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Texas Instr Incorporated has been awarded a patent for Thermal Test Chip with Stackable Metal Based Heater and Sensor. This invention was developed by Travis Blake, Venugopal Archana and Rai Vinod.
The patent application number is US202217952111 20220923. The patent publication number is US12713918 (B2)..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing Co Ltd for Back-end-of-line Passive Device Structure. Hsiao Yuan-yang, Huang Chen-chiu, Hsiao Tsung-chieh, Chen Dian-hau and Shen Hsiang-ku developed the invention.
The patent application number is US202418784616..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Taiwan Semiconductor Manufacturing Co Ltd has secured a patent on Interconnect Layer and Method for Manufacturing the Same. Lee Cheng-chin, Cheng Kai-fang, Chang Hsiao-kang, Huang Hsin-yen and Wu Yen-ju developed the invention.
The patent application number is US202217877350 20220729. The patent publica..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Taiwan Semiconductor Manufacturing Co Ltd has been awarded a patent for Method of Manufacturing Semiconductor Structure and Semiconductor Structure Thereof. This invention was developed by Liu Szu-ling.
The patent application number is US202318356250 20230721. The patent publication number is US12713903..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- U.S. Patent and Trademark Office has awarded a patent to Samsung Electronics for Semiconductor Devices and Data Storage Systems Including the Same. Lee Sooyong developed the invention.
The patent application number is US202318133314 20230411. The patent publication number is US12713901 (B2). Internation..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Yangtze Memory Technologies has obtained a patent for semiconductor device and fabrication method thereof. This invention was developed by Sun Chao, Yin Hang, Wu Zhipeng, Wang Renyan and Xu Wei.
The patent application number is US202418442962 20240215. The patent publication number is US12713899 (B2). I..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Micron Technology has secured a patent on Semiconductor Device Assemblies with Coplanar Interconnect Structures, and Methods for Making the Same. Raman Thiagarajan developed the invention.
The patent application number is US202217899586 20220830. The patent publication number is US12713898 (B2). Interna..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Interconnect Structure and Methods of Forming the Same. Fu Shih-kang, Yang Shin-yi, Liu Hsu-wei, Liu Gary, Lee Ming-han, Wu Hsien-chang and Lo Ting-ya developed the invention.
The patent application number is US202318369190 20230917..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Samsung Electronics has been granted a patent for Semiconductor Package and Method for Manufacturing the Same. This invention was developed by Lee Jihyun and Lee Junho.
The patent application number is US202418592908 20240301. The patent publication number is US12713895 (B2). International Patent Classi..
Semiconductor
| Sun 23 Aug 2026
Alexandria, Aug. 24 -- Taiwan Semiconductor Manufacturing Co Ltd has received a patent for Conductive Structure in Semiconductor Structure and Method for Forming the Same. This invention was developed by Wang Jen-hung, Fu An-jiao, Wu Cai-ling, Hsueh Hsiu-wen and Chen Chii-ping.
The patent application number is US202318166130 ..
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