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Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Heilongjiang Huixin Semiconductor Co Ltd has submitted a patent application for Pulse Circuit, PCB and Chip. Feng Yuxiang, Zhong Zunheng and Feng Kexin developed the invention.
The patent application number is CN202511295932 20250911. The patent publication number is CN121356530 (A). International Patent Cl..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Tianjin Haweike Tech Co Ltd has filed a patent application for Operation Method Supporting Dual-protocol RFID Chip System. This invention was developed by Ma Hongwei, Cui Tao, Zheng Yantao, Yu Lei, Xu Zhonghua, Su Yudong, Yang Xiaofeng, Zhao Yonggang, Guo Zhiyuan, Zhao Bin, Zhao Kai, Yan Peng, Wang Baocheng, W..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Gree Electric Appliances, Zhuhai patent application for Intelligent Power Module, Chip and Motor. Liang Zhanghuai, Ma Yingjiang, Song Dechao, Liao Yongbo and Li Chunyan developed the invention.
The patent application number is CN202511390997 20250926. T..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Mingtech Co Ltd has submitted a patent application for Method and System for Reading Different Electronic Tags Through Single Radio Frequency Chip and Double Antennas. This invention was developed by Yang Huijun and Feng Haiqing.
The patent application number is CN202410940218 20240715. The patent publicati..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Navitas Semiconductor Inc has submitted a patent application for Flyback Power Converter Primary Side Controller and Method of Operating Same. Huang Jianchun developed the invention.
The patent application number is CN202510973471 20250715. The patent publication number is CN121356291 (A). International Pat..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Toshiba Memory patent application for Semiconductor Memory Device. The invention was developed by Arai Shinya and Wada Hideo.
The patent application number is CN202510208767 20250225. The patent publication number is CN121357886 (A). International Pate..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Huawei Technologies patent application for Memory, Manufacturing Method of Memory, Semiconductor Device and Electronic Equipment. The invention was developed by Huang Kailiang, Jing Weiliang, Sun Ying, Zhuo Yi and Wang Zhengbo.
The patent application n..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published SanDisk Technologies patent application for Authenticatable Enclosure for Electronic Device. The invention was developed by Bedau Dirk.
The patent application number is CN202510458295 20250414. The patent publication number is CN121357828 (A). Internat..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Heshan Zhongfu Xingye Circuit Co Ltd has submitted a patent application for Manufacturing Process of Thermoelectric Separation Substrate and Thermoelectric Separation Substrate. This invention was developed by Xiao Hongbing and Wang Xianfeng.
The patent application number is CN202511295261 20250911. The pat..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published MFLEX Yancheng patent application for Device for Filling Hole in Wiring Substrate. The invention was developed by Ma Lijun and Zhang Jie.
The patent application number is CN202511607972 20251105. The patent publication number is CN121357818 (A). Intern..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shandong Inspur Huixin Microelectronics Tech Co Ltd has submitted a patent application for Method for Bonding Lead on Printed Circuit Board of Packaging-free Power Chip and Bonding Structure. Du Jun, Zhao Rongzhuang, Li Xingliang, Zhang Shibo, Tang Fuguo and Xia Wei developed the invention.
The patent appli..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Jiangmen Yamin Electronic Tech Co Ltd has submitted a patent application for Aluminum Substrate Production Process for Cutting Circuit Through Mold. This invention was developed by Tong Chaoliang.
The patent application number is CN202511519781 20251023. The patent publication number is CN121357807 (A). Int..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Rongyao Terminal patent application for Communication Method and Device, Storage Medium, Chip System and Communication System. Pan Xiaogang, Shan Baokun and Zhang Mingzhu developed the invention.
The patent application number is CN202410911196 20240708...
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Beijing Xuanjie Technology has sought patent for Networking Method and Device, Electronic Equipment, Chip and Medium. This invention was developed by Ding Shaoyang, Dong Zhijiang and Luo Guanghua.
The patent application number is CN202511387962 20250925. The patent publication number is CN121357640 (A). Inter..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Rongyao Terminal has submitted a patent application for Communication Method and Device, Chip System, Storage Medium and Computer Program Product. Du Qinghe, Zhang Junying, Chen Zhe and Lin Wei developed the invention.
The patent application number is CN202511904359 20251217. The patent publication number is ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Shanghai Awinic Technology patent application for Audio Processing Device, Method and Chip. This invention was developed by Jiang Zhiguang, Liu Dong, Jiang Songying and Yao Wei.
The patent application number is CN202511613240 20251105. The patent public..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Spreadtrum Communications (Shanghai) has filed a patent application for Data Frame Processing Method and Device, Terminal, Base Station and Chip. This invention was developed by Chen Junyu and Ji Hongzhen.
The patent application number is CN202511493371 20251017. The patent publication number is CN121357420 (..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Taiyuan University of Technology patent application for Intelligent Trolley Vehicle-mounted Camera Module Chip Packaging Structure. Liu Yuhang developed the invention.
The patent application number is CN202511619128 20251106. The patent publication numb..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Wuxi Guoxin Micro High Tech Co Ltd has submitted a patent application for Can Bus Wake-up Device and Can Bus Communication Chip. Zheng Jiang, Xiao Zuonan, Kuang Qihe and Wang Zhonglin developed the invention.
The patent application number is CN202511884133 20251215. The patent publication number is CN121356..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Taiwan Semiconductor Manufacturing has filed a patent application for Optical Integrated Circuit Device, Electronic and Photonic Integrated Circuit (epic) Device, and Method of Operating Same. This invention was developed by Lu Youcheng, Rusu Stefan, Cho Lan-chou, Zhong Mingyang and Huang Taijun.
The patent a..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Guangdong OPPO Mobile Telecommunications patent application for Radio Frequency Transceiver Circuit, Radio Frequency Signal Transmission Method, Chip and Equipment. Yang Huai and Gao Xuefei developed the invention.
The patent application number is CN202..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Infineon Technologies has submitted a patent application for Noise-based Driver Stage Selection in Galvanically Isolated Signal Transmission. This invention was developed by Nublin Martin.
The patent application number is CN202510963566 20250714. The patent publication number is CN121356568 (A). International..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Xi'an University of Technology has sought patent for Portable Wide Bandgap Semiconductor Photoconductive Switch Trigger Device. This invention was developed by Xu Ming, Song Hao, Zhang Yiwen, Lyu Ruidong, Sun Li and Chen Shengtao.
The patent application number is CN202511505991 20251021. The patent publicatio..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- GLF Microelectronics Sichuan Co Ltd has submitted a patent application for Trimming Circuit with Power-on Feedback, Trimming Method and Chip. Sun Ni, Kang Ziyang and Zhao Jing developed the invention.
The patent application number is CN202511501909 20251021. The patent publication number is CN121356553 (A)...
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Mitsubishi Electric has submitted a patent application for Power Semiconductor Device. Yoshida Kentaro and Takahashi Hajime developed the invention.
The patent application number is CN202510952850 20250710. The patent publication number is CN121356549 (A). International Patent Classification codes are H02M7/0..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Hubei University patent application for Low-kick-back Low-imbalance Dynamic Comparator with Cross-coupled Pair Transistors and Operation Method of Low-kick-back Low-imbalance Dynamic Comparator. The invention was developed by Song Min, Li Yang, Guo Zhe,..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Suzhou 3ctest Electronic Tech Co Ltd has submitted a patent application for Square Wave Generating Device Based on Semiconductor Switch. This invention was developed by Zhu Yuxuan, Yu Hui and Shi Jian.
The patent application number is CN202511902036 20251217. The patent publication number is CN121356534 (A)..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Jinko Solar Holding Co Ltd has submitted a patent application for Preparation Method of Solar Cell, Solar Cell and Photovoltaic Module. This invention was developed by Zhang Yuanfang, Wang Zhao, Zheng Peiting, Yang Jie and Zhang Xinyu.
The patent application number is CN202511902257 20251216. The patent pub..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Yingweixin Shanghai Tech Co Ltd has submitted a patent application for Group III-V Compound and Silicon Heterogeneous Integrated Single Photon Avalanche Diode and Preparation Method Thereof. This invention was developed by Chen Qingyu, Nie Hui and Zhao Hui.
The patent application number is CN202511483844 20..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- SK Hynix has filed a patent application for Image Sensing Device. This invention was developed by Kim Dong-ha.
The patent application number is CN202411788666 20241206. The patent publication number is CN121358026 (A). International Patent Classification code is H10F39/18. Cooperative Patent Classification co..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Cnac Kaimai Shanghai Infrared Tech Co Ltd has filed a patent application for Back Thinning and Polishing Preparation Method of Infrared Focal Plane Array Chip Assembly. This invention was developed by Li Rong and Zhang Yuxi.
The patent application number is CN202511224811 20250829. The patent publication nu..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Taiwan Semiconductor Manufacturing patent application for Integrated Chip and Forming Method Thereof. The invention was developed by You Bingcheng, Hong Bong-ki, Chen Weilong, Shi Zhicheng and Liu Rencheng.
The patent application number is CN2025113649..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Semiconductor Manufacturing International (Shanghai) has submitted a patent application for Standard Cell Structure of Integrated Circuit and Preparation Method. Liu Qing, Yu Lei, Ji Shiliang and Zhang Haiyang developed the invention.
The patent application number is CN202410933459 20240711. The patent public..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Taiwan Semiconductor Manufacturing patent application for Transistor Device and Forming Method Thereof. The invention was developed by Lin Zhichang, Qiu Zongkai, Jiang Yuxian, Yu Jianlin, Yang Gufeng and Liao Siya.
The patent application number is CN20..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Huawei Technologies patent application for Semiconductor Device and Preparation Method Thereof, Integrated Circuit and Electronic Equipment. Xu Miao, Li Chen, Li Tianran and Liu Yanxiang developed the invention.
The patent application number is CN202410..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Taiwan Semiconductor Manufacturing patent application for Semiconductor Device and Forming Method Thereof. This invention was developed by Zhong Zhengting and Chen Haoyu.
The patent application number is CN202511390085 20250926. The patent publication n..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Hefei Nexchip Integrated Circuit has sought patent for Manufacturing Method of Semiconductor Device. This invention was developed by Liu Sutao and Lin Shimin.
The patent application number is CN202511927061 20251219. The patent publication number is CN121357983 (A). International Patent Classification codes a..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Beijing Ruidi Shikong Information Tech Co Ltd has submitted a patent application for Multi-mode Chip Preparation Method Based on Radio Frequency Digital-analog Mixing. This invention was developed by Xue Xiaofeng, Jiang Cheng, Du Wentao and Wei Shuaipeng.
The patent application number is CN202511492906 2025..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Taiwan Semiconductor Manufacturing patent application for Method for Forming Semiconductor Structure and Semiconductor Device. He Weide, Lin Zhichang, Wang Guanren, Jiang Yuxian and Hu Zuyu developed the invention.
The patent application number is CN202..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Taiwan Semiconductor Manufacturing has filed a patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Li Zonglin, Ye Zhikai and Ye Zhuhui.
The patent application number is CN202511401214 20250928. The patent publication number is CN121357971 (A). Internation..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Taiwan Semiconductor Manufacturing patent application for Semiconductor Structure and Forming Method Thereof. Lin Zhibin and Lin Zhichang developed the invention.
The patent application number is CN202511401203 20250928. The patent publication number is..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Texas Instruments patent application for Asymmetric Transmission Line Power Combiner. Das Arnab and Dandu Krishnanshu developed the invention.
The patent application number is CN202510850995 20250624. The patent publication number is CN121357967 (A). ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Institute of Microelectronics, CAS patent application for Ring Gate Stacked Semiconductor Device and Preparation Method Thereof. This invention was developed by Yin Huaxiang, Li Qingkun, Zhang Qingzhu, Yao Jiaxin and Cao Lei.
The patent application numb..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Guangzhou Zengxin Technology patent application for Semiconductor Structure and Forming Method of Semiconductor Structure. The invention was developed by Wu Liyu and Shen Baoxin.
The patent application number is CN202511609148 20251104. The patent publ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Toshiba Memory has submitted a patent application for Semiconductor Memory Device. This invention was developed by Arai Shinya.
The patent application number is CN202510215045 20250226. The patent publication number is CN121357900 (A). International Patent Classification codes are H10B43/20, H10B43/35, H10B43..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Micron Technology has filed a patent application for Microelectronic Devices Including Shape Memory Materials and Related Methods, Memory Devices and Electronic Systems. This invention was developed by Yeduru Srinivasa Reddy and Langaard Swapnil A.
The patent application number is CN202510955298 20250711. The..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Micron Technology patent application for Memory Channel Structure. O 'leshea Michael, Li Donghua and Venkatesan Subramanian developed the invention.
The patent application number is CN202510974346 20250715. The patent publication number is CN121357888 (..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received SJ Semiconductor patent application for Semiconductor Process Method and Semiconductor Structure. Lu Chunshan and Zhou Zuyuan developed the invention.
The patent application number is CN202410927163 20240710. The patent publication number is CN121358202..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Applied Materials has submitted a patent application for Etching Metal Oxides Using Fluorine and Metal Halides. This invention was developed by Woods Kristopher Nathan, Cui Zhe and Saly Mark.
The patent application number is CN202511466337 20200611. The patent publication number is CN121358194 (A). Internatio..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Huahong Semiconductor Mfg Wuxi Co Ltd has submitted a patent application for Method for Improving Silicon Weed Defect in Groove-shaped Contact Hole Etching Process of Semiconductor Device. This invention was developed by Yang Jialin, Yu Peng, Ruihuan Wang, Sun Jian, Yu Tao and Zhou Qian.
The patent applicat..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Etching Method and Semiconductor Process Equipment. This invention was developed by Zhu Mengjiao, Wang Jing and Chen Qingyuan.
The patent application number is CN202511573843 20251030. The patent publication number is CN121358187 ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Geke Semiconductor Shanghai Co Ltd has submitted a patent application for Ion Implantation Process of Image Sensor. This invention was developed by Chen Lin and Liu Kaifan.
The patent application number is CN202410854882 20240627. The patent publication number is CN121358184 (A). International Patent Classi..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shanghai Xinaoxinyi Tech Co Ltd has submitted a patent application for Substrate Oxidation Method and Semiconductor Device. This invention was developed by Wang Ziwen, Lu Qiong, Dai Rongwang, Wei Xing and Li Wei.
The patent application number is CN202511923054 20251218. The patent publication number is CN12..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Sichuan University has filed a patent application for Cu3sbse3 Alloyed P-type Bi2te3-based Thermoelectric Material and Preparation Method of Cu3SbSe3 Alloyed P-type Bi2te3-based Thermoelectric Device. This invention was developed by Ang Ran, Li Ruiheng and Zheng Jie.
The patent application number is CN20251..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Sichuan University has submitted a patent application for Znsb Alloying and Se Doping Regulation P-type Bi2te3 Thermoelectric Material and Preparation Method of Znsb Alloying and Se Doping Regulation P-type Bi2te3 Thermoelectric Device. Ang Ran, Li Ruiheng and Zheng Jie developed the invention.
The patent app..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Institute of Chemistry, Chinese Academy of Sciences has sought patent for Method for Photo-assisted Chemical Doping of Organic Semiconductor Material and Application. This invention was developed by Zou Ye, Ji Zhen, Li Zhiyi, Liu Liyao, Di Zhongan and Zhu Daoben.
The patent application number is CN20241094239..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received East China Normal University patent application for Conductive Anisotropic Intermediate Connection Layer and Application of Conductive Anisotropic Intermediate Connection Layer in Laminated Solar Cell. Li Yanqing, Tang Jianxin, Tian Shuo and Chen Jingde ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shenzhen Xunguang Technology has submitted a patent application for Optical Assembly, Semiconductor Integrated Light Source and Lighting Device. This invention was developed by Huang Wei, Cao Yuxing and Li Xiangyang.
The patent application number is CN202511901906 20251217. The patent publication number is CN..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Taiwan Semiconductor Co Ltd has submitted a patent application for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Hayashi Fumiyoshi, Wu Shimin, Zhang Xuanting and Xu Wangcheng.
The patent application number is CN202411509659 20241028. The patent publication number ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Jiangsu Third Generation Semiconductor Research Institute patent application for Semiconductor Epitaxial Structure and Preparation Method Thereof, and Semiconductor Device. Yan Qi'ang and Wang Guobin developed the invention.
The patent application numbe..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Beijing Zhichuang Xinyuan Tech Co Ltd has submitted a patent application for Molecular Beam Epitaxy Heterogeneous Base Hgcdte Material and Preparation Method Thereof. This invention was developed by Tong Lei.
The patent application number is CN202511522293 20251023. The patent publication number is CN121358..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Interconnection Structure and Forming Method Thereof. This invention was developed by Guo Jiabang, Lin Yanjun, Liu Renwei, Jiang Mingzhou and Weng Zhenghui.
The patent application number is CN202510842834 20250623. The patent publicatio..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Changsha Anmuquan Intelligent Tech Co Ltd has submitted a patent application for Crystal Grain Manufacturing Process, Crystal Grain and Chip. Liu Zheng, Wei Ping, Zheng Boyu, Luo Jiahu and Guo Wenjuan developed the invention.
The patent application number is CN202511489792 20251017. The patent publication n..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shenzhen Xinkailai Industry Machine has filed a patent application for Preheating Ring, Lining Structure and Semiconductor Equipment. This invention was developed by Chen Xuxiong, Wang Jianwei, Wu Wen, Li Wenrui and Jiao Haimiao.
The patent application number is CN202511467641 20251014. The patent publication..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Qinghe Jingyuan Tianjin Semiconductor Material patent application for Donor Substrate Processing Method and Composite Substrate. The invention was developed by Song Kaihua, Mu Fengwen, Tan Xianghu, Liu Fuchao and Guo Chao.
The patent application number..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Winbond Electronics has submitted a patent application for Detection Method of Semiconductor Structure and Test Element Group. Lin Changhong developed the invention.
The patent application number is CN20241177130 20240807. The patent publication number is CN121358257 (A). International Patent Classification c..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Ji Hua Laboratory patent application for Lifting Mechanism and Adsorption Bearing Mechanism Suitable for Large-size Substrate. This invention was developed by Zhang Buyang, Yu Shuang, Huang Mengmeng and Wang Xuefeng.
The patent application number is CN2..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Nissin Ion Equipment patent application for Substrate Processing Apparatus and Substrate Detachment Method. This invention was developed by Inoue Shinsuke, Murayama Takayuki and Hirai Yuya.
The patent application number is CN202510696662 20250528. The p..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Mairuijie Nanjing Semiconductor Tech Co Ltd has submitted a patent application for Long-stroke High-precision Wafer Feeding Manipulator with Positioning Function. Li Bin, Zhu Haibing, Sun Hongtao and Huang Zhenlong developed the invention.
The patent application number is CN202511495370 20251020. The patent..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shenyang Siasun Semiconductor Equipment Co Ltd has submitted a patent application for Wafer Transfer Control Method and System Based on Wafer Box Storage Equipment. This invention was developed by Wang Dongsheng, Cheng Long, Yang Zhiyu, Zhang Meng, Jiao Hongchan, Jin Lei and Li Zhitian.
The patent applicati..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Samsung Display has applied Chinese patent for Substrate Transfer Apparatus. Seo Ki-soo, Shin Jong-soo, Ryu Seok, Yu Jung-ju and Lee Jongwon developed it.
The patent application number is CN202510389820 20250331. The patent publication number is CN121358229 (A). International Patent Classification codes are H..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Guangdong Changhua Tech Co Ltd has submitted a patent application for Chip Mounting Device and Chip Mounting Method. This invention was developed by Wang Jinhua and Wang Zhi.
The patent application number is CN202511594899 20251103. The patent publication number is CN121358225 (A). International Patent Clas..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Xinpai Tech Co Ltd has submitted a patent application for Series Assembly Die and Chip for High-power Semiconductor Device Cells. This invention was developed by Liu Tong, Yang Yong, An Jing, Li Yufei, Yu Jia and Luo Yi.
The patent application number is CN202511473626 20251015. The patent publication number..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Kunshan Rongyuan Xinye Machinery Tech Co Ltd has submitted a patent application for Surface Treatment Device for Processing Semiconductor Parts. Zhang Ming, He Debing and Zhang Zhen developed the invention.
The patent application number is CN202511399675 20250928. The patent publication number is CN12135821..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published Tokyo Electron patent application for Substrate Processing Apparatus and Deterioration Degree Determination Method. The invention was developed by Iino Tadashi.
The patent application number is CN202511333853 20210302. The patent publication number is ..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Beijing Shunxing Juyuan Microelectronics Co Ltd has submitted a patent application for Wafer Backflow Method and Wafer Backflow Vacuum Furnace. This invention was developed by Xue Xinghai.
The patent application number is CN202510481622 20250417. The patent publication number is CN121358213 (A). Internation..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Zhejiang Institute Mechanical & Electrical Engineering has applied Chinese patent for Automatic Scraping Device and Method Suitable for Semiconductor Scribing Process. Xu Xiaotao, Yang Yutian, Wang Xiaohu and Bao Jiaying developed it.
The patent application number is CN202511787866 20251201. The patent public..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Guangzhou Yumai Electronic Tech Co Ltd has submitted a patent application for Silicon Wafer Cleaning Device and Cleaning Method. Li Kunting and Chen Jingli developed the invention.
The patent application number is CN202511510566 20251022. The patent publication number is CN121358207 (A). International Paten..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Lam Research has filed a patent application for Aluminum Fluoride Etch from Aluminum-containing Components. This invention was developed by Kwon Byoung-seok, Zheng Jilai, Huang Yanhui, Shaikh Fayaz A, Nick Ray Linebarger Jr, Boatwright Daniel, Chopra Sudhir and Wang Ruisong.
The patent application number is C..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has received Tokyo Electron patent application for Film Forming Apparatus. Takatori Kentaro and Takahashi Takeshi developed the invention.
The patent application number is CN20248041913 20240625. The patent publication number is CN121358890 (A). International Patent..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Applied Materials has filed a patent application for Side Pump Chamber and Downstream Residue Management Hardware. This invention was developed by Ge Zhixin, Pormani Paolo, Kulkarni Ambarish L, Ha Sungwon, Bansal Amit, Khaja Abdul Aziz, Bobek Sarah Michelle, Ramamurthy Bala Narasimhan and Xiong Yuhong.
The pa..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Chipone Technology, Beijing has applied Chinese patent for Display Device and Charge Sharing Circuit, Method and Chip Thereof. Zhuang Zhenrong developed it.
The patent application number is CN202511686167 20251117. The patent publication number is CN121354485 (A). International Patent Classification codes are..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Suzhou Aiwei Integrated Circuit Tech Co Ltd has submitted a patent application for Driving System and Method of Matrix Lamp, Chip and Display Device. This invention was developed by Li Shuai, Xia Xiang, Zhang Zhong and Hong Tao.
The patent application number is CN202511882246 20251212. The patent publicatio..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Chipone Technology, Beijing has submitted a patent application for Display Device, Receiving Card, Chip and Gamma Compensation Method. Li Xinhui, Li Shida and Yong Shanggang developed the invention.
The patent application number is CN202511508307 20251021. The patent publication number is CN121354474 (A). Int..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Weidu Microelectronics Guangdong Co Ltd has filed a patent application for Method and System for Realizing Output of Arbitrary Source-level Signal Sequence by Display Driving Chip. This invention was developed by Li Yue, Wang Xiqi, Wu Yong and Li Furong.
The patent application number is CN202511881177 20251..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Stan International Semiconductor Co Ltd has submitted a patent application for Gamma Correction Method, Display Driving Chip and Image Display Device. This invention was developed by Pang Weiou, Zhu Kaisong, Zhang Ke and Huang Li.
The patent application number is CN202410945957 20240715. The patent publicat..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has published HKC patent application for Array Substrate and Display Device. The invention was developed by Hu Xiaogang and Ye Lidan.
The patent application number is CN202511668839 20251113. The patent publication number is CN121354437 (A). International Patent Cla..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- NAMICS Corporation has submitted a patent application for Photocurable Resin Composition, Adhesive, Sealing Material, Coating Agent, Cured Product, Semiconductor Device, Electronic Component, and Curing, Adhesive, Sealing, and Coating Method Using Photocurable Resin Composition. This invention was developed by..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Teijin Carbon Europe has submitted a patent application for Semi-prepreg with Substrate Coating. This invention was developed by Krabbe Jurgen and Gotthardt Daniel.
The patent application number is CN20248042159 20240529. The patent publication number is CN121358599 (A). International Patent Classification co..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Hoya Optical Laboratory USA Inc has filed a patent application for Optical Article with Embedded Wafer and Wafer Coating Composition. This invention was developed by Vu Hanna, Brown Jeffrey, Olund David and Palak Vikas.
The patent application number is CN20248038029 20240405. The patent publication number i..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Silead patent application for Ultrasonic Fingerprint Chip and Integral Clock Generation Method and Device of Ultrasonic Fingerprint Chip. This invention was developed by Zhou Jinling, Yu Xianyin and Su Wei.
The patent application number is CN20251193780..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Pengxi Semiconductor Tech Beijing Co Ltd has submitted a patent application for Tank Car Operation Behavior Analysis Method Based on Improved Yolo Network for Semiconductor Factory Service System. This invention was developed by He Jipei and Su Feng.
The patent application number is CN202511904730 20251217...
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Shenzhen Huicun Semiconductor Co Ltd has filed a patent application for Power Semiconductor Module Low-inductance Packaging Structure and Packaging Method. This invention was developed by Luo Xiyan, Lai Chenchen and Li Tianwen.
The patent application number is CN202511542484 20251027. The patent publication..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Guangdong Xincheng Hanqi Semiconductor Tech Co Ltd has submitted a patent application for Airtight Packaging Structure and Packaging Method of Chip. This invention was developed by Han Lei and Zhu Kai.
The patent application number is CN202511326808 20250917. The patent publication number is CN121358321 (A)..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Lisuan Tech Shanghai Co Ltd has submitted a patent application for Solder Ball Arrangement Structure and Method in Chip Packaging Substrate, Chip and Electronic Equipment. This invention was developed by Lu Yu, Yang Ke and Zhang Weibo.
The patent application number is CN202511893121 20251216. The patent pub..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Tongfu Microelectronics patent application for Lead Frame and Chip Packaging Module. This invention was developed by Xing Weibing, Wang Rui and Gu Xiamao.
The patent application number is CN202511714497 20251120. The patent publication number is CN12135..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Huayi Microelectronics Co Ltd has filed a patent application for Packaging Method for Preventing Layering of Semiconductor Power Device. This invention was developed by Chen Hongming, Sun Jie, Wang Huiping, He Jialun, Li Ai'ai, Chen Junyan and Ma Qian.
The patent application number is CN202511548859 2025102..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Texas Instruments has sought patent for Data and Power Isolation Barrier. This invention was developed by Rajapaksha Divya B, Sperlich Rainer, Kamath Anant Shankar, Devarajan Vijayalakshmi and Ray William.
The patent application number is CN202511478875 20200624. The patent publication number is CN121358284..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- Hefei Nexchip Integrated Circuit has submitted a patent application for Chip Preparation Method and Chip. Song Furan developed the invention.
The patent application number is CN202511907701 20251217. The patent publication number is CN121358275 (A). International Patent Classification code is H10W20/46.
Sta..
Semiconductor
| Mon 18 May 2026
Beijing, May 19 -- State Intellectual Property Office of China has released Socionext patent application for Semiconductor Integrated Circuit Device. This invention was developed by Komada Kohei.
The patent application number is CN20238099284 20230706. The patent publication number is CN121359609 (A). International Patent Cla..
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