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Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Koninklijke Philips has applied Chinese patent for Multi-die Package with Shaped Brightness. Monestier Florent, Shen Yuzhen and Di Maria Joseph developed it.
The patent application number is CN20238085682 20231130. The patent publication number is CN120345072 (A). International Patent Classification codes ..
Semiconductor
| Thu 29 Jan 2026
Rijswijk, Jan. 29 -- ASML Netherlands has submitted a patent application for Inspection Apparatus, Inspection Method and Manufacturing Method. This invention was developed by Arie Jeffrey Den Boef.
The patent application number is NL20162017171 20160715. The patent publication number is NL2017171 (A). International Patent Cla..
Semiconductor
| Thu 29 Jan 2026
Rijswijk, Jan. 29 -- ASML Netherlands has submitted a patent application for Position Measurement System, Interferometer and Lithographic Apparatus. This invention was developed by Egelbertus Antonius Fransiscus Van Der Pasch and Robbert Edgar Van Leeuwen.
The patent application number is NL20162017261 20160729. The patent publ..
Semiconductor
| Thu 29 Jan 2026
Rijswijk, Jan. 29 -- ASML Netherlands has filed a patent application for Methods for Controlling Lithographic Apparatus, Lithographic Apparatus and Device Manufacturing Method. This invention was developed by Rene Marinus Gerardus Johan Queens and Wolfgang Helmut Henke.
The patent application number is NL20162017296 20160808. T..
Semiconductor
| Thu 29 Jan 2026
Rijswijk, Jan. 29 -- ASML Netherlands has submitted a patent application for Metrology Method and Apparatus, Substrates for Use in Such Methods, Lithographic System and Device Manufacturing Method. This invention was developed by Martin Jacobus Johan Jak, Hendrik Jan Hidde Smilde, Richard Johannes Franciscus Van Haren, Henricus ..
Semiconductor
| Thu 29 Jan 2026
Rijswijk, Jan. 29 -- ASML Netherlands has filed a patent application for Lithographic Method and Apparatus. This invention was developed by Robbert Jan Voogd and Wilhelmus Jacobus Maria Rooijakkers.
The patent application number is NL20162017222 20160725. The patent publication number is NL2017222 (A). International Patent Clas..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Xinchuangzhi Innovation Design Service Center Ningbo Co Ltd and Zhejiang Chuangxin Integrated Circuit patent application for Capacitive Coupling Island Chip Architecture with High-voltage Isolation Function and Packaging Method. Zhu Min, Wu Qiang, Wu Yo..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Xinchuangzhi Innovation Design Service Center Ningbo Co Ltd and Zhejiang Chuangxin Integrated Circuit patent application for Inductive Coupling Island Chip Architecture with High-voltage Isolation Function and Packaging Method. Zhu Min, Wu Qiang, Wu Yon..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has published Jiangsu Huachuang Microsystems patent application for Stacked Hole and Stacked Disc Chip Packaging Structure for Transmitting High-speed Signals. The invention was developed by Nie Shankun, He Guoqiang, Zhang Tao and Li Shiping.
The patent application..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has published Semiconductor Manufacturing International (Shanghai) patent application for Test Structure and Test Method. The invention was developed by Sun Lei, Lin Yihui, Wang Liang, Wang Shaobo, Zhai Guangyao, Ma Yongfang, Huang Ziqiang and Wu Jun.
The patent ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Semiconductor Manufacturing International (Shanghai) patent application for Test Structure and Forming Method and Test Method Thereof. Ke Bang, Lin Yihui, Wang Liang, Gao Jianqin, Sun Shi, Li Yuxi, Yu Jingqiu, Xie Jun and Liu Cong developed the inventio..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Mitsubishi Electric has applied Chinese patent for Power Semiconductor Device. Hasegawa Maki and Tadakuma Toshiya developed it.
The patent application number is CN20251009182 20250103. The patent publication number is CN120341213 (A). International Patent Classification codes are H01L23/538, H01L23/58 and H0..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- SK Hynix has submitted a patent application for Semiconductor Device, Semiconductor Package, and Method of Manufacturing Semiconductor Device. This invention was developed by Ahn Jae-yong, Yang Ju-heon and Yoon Kyo-sik.
The patent application number is CN20251062271 20250115. The patent publication number is..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Yangtze Memory Technologies has submitted a patent application for Semiconductor Packaging Structure with Glass Substrate and Packaging Method Thereof. Zeng Xinru and Chen Peng developed the invention.
The patent application number is CN20241069355 20240117. The patent publication number is CN120341207 (A). ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- China Zhenhua Group Yongguang Electronics, State Run No 873 Factory has applied Chinese patent for Plastic Package DFN Package Based on Cu-clip Structure. He Weiwei, Wei Xingxing, Zhang Li, Wu Dayan, Zhang Peng and Wen Wenhui developed it.
The patent application number is CN202510557529 20250429. The paten..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Nanya Technology has submitted a patent application for Semiconductor Element with Pad Contact and Preparation Method Thereof. Zhuang Yingzheng developed the invention.
The patent application number is CN202410689608 20240530. The patent publication number is CN120341203 (A). International Patent Classific..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Zhongke Weicaoqun Beijing Energy Saving Tech Development Co Ltd has filed a patent application for Small-size Light-weight High-power Chip Microstructure Air Cooling Radiator. This invention was developed by Hu Xuegong and Xiang Lifeng.
The patent application number is CN202510705982 20250529. The patent p..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Samsung Electronics has submitted a patent application for Semiconductor Module. Park Hwan-joo, Ko Byung-han, Wen Yu and Lee Hee-chul developed the invention.
The patent application number is CN202411327538 20240923. The patent publication number is CN120341198 (A). International Patent Classification code..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Anshan Leadsun Electronics Co Ltd has submitted a patent application for High-voltage Silicon Stack. This invention was developed by Chen Gang and Xia Bingcheng.
The patent application number is CN202510805782 20250617. The patent publication number is CN120341197 (A). International Patent Classification c..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Jiangsu Xinde Semiconductor Technology has filed a patent application for Wafer-level Inductor Packaging Structure and Preparation Method Thereof. This invention was developed by Zhao Yue, Xu Qianqian, Xie Yulong and Zhang Zhong.
The patent application number is CN202510840130 20250623. The patent publicat..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Mitsubishi Electric has submitted a patent application for Semiconductor Device. Zhang Hongbo developed the invention.
The patent application number is CN202411949141 20241227. The patent publication number is CN120341184 (A). International Patent Classification codes are H01L23/29, H01L23/31, H01L23/367 a..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Xinai Tech Nanjing Co Ltd patent application for Package Substrate and Manufacturing Method Thereof. This invention was developed by Chen Minyao and Zhang Chuihong.
The patent application number is CN202510510315 20250422. The patent publication numb..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Beijing Institute of Technology has submitted a patent application for Stacked Packaging Type Information Self-destruction Chip and Chip Self-destruction Method. This invention was developed by Feng Hengzhen, Chai Yichen, Lou Wenzhong, Lyu Sining and Xiao Chuan.
The patent application number is CN20251038814..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Rirong Semiconductor (Shanghai) has submitted a patent application for Novel Substrate Design Method and Substrate Structure. Du Liang developed the invention.
The patent application number is CN202510482330 20250417. The patent publication number is CN120341180 (A). International Patent Classification codes..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Haiguang Information Tech Suzhou Co Ltd has submitted a patent application for Interconnection Method and Interconnection Structure After Chip Screening. This invention was developed by Jia Weijie and Xue Xiaodi.
The patent application number is CN202510518142 20250423. The patent publication number is CN1..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Shanghai Jita Semiconductor has submitted a patent application for Semiconductor Structure and Preparation Method Thereof. Liu Cong developed the invention.
The patent application number is CN202510450248 20250410. The patent publication number is CN120341176 (A). International Patent Classification code i..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Nanya Technology patent application for Semiconductor Element with Pad Contact and Preparation Method Thereof. This invention was developed by Zhuang Yingzheng.
The patent application number is CN202510139938 20240530. The patent publication number i..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Hefei Nexchip Integrated Circuit patent application for Manufacturing Method of Semiconductor Structure. This invention was developed by Zhang Wei, Yun Guangtao, Shao Zhangpeng, Su Shengzhe and Luo Qinxian.
The patent application number is CN2025108118..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Shanghai Xinaoxinyi Tech Co Ltd has applied Chinese patent for Preparation Method of Bonded Wafer. Chen Meng, Wei Xing and Li Wei developed it.
The patent application number is CN202510489003 20250417. The patent publication number is CN120341173 (A). International Patent Classification codes are H01L21/02..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Beijing Integrated Circuit Equipment Innovation Center Co Ltd patent application for Preparation Method of Semiconductor Device and Semiconductor Device. This invention was developed by Xu Wenqing, Sun Chunyu, Zhao Leichao and Shi Xiaoping.
The paten..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Shanghai Xinaoxinyi Tech Co Ltd patent application for Preparation Method of Soi Wafer. This invention was developed by Xiang Xiao, Zhang Yarong, Zhou Pinghua, Xu Hongtao, Zhang Weimin and Li Wei.
The patent application number is CN202510486761 20250..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Shanghai Xinaoxinyi Tech Co Ltd patent application for Method for Forming Bonded Wafer. Chen Meng, Wei Xing and Li Wei developed the invention.
The patent application number is CN202510486755 20250417. The patent publication number is CN120341170 (A)..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Beijing Yandong Microelectronic Technology has submitted a patent application for Trench Filling Method and Semiconductor Structure Manufacturing Method. This invention was developed by Gong Li, Qiu Fanglin, Wang Qian and Li Jingyi.
The patent application number is CN202510286675 20250311. The patent publica..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Sumitomo Osaka Cement has sought patent for Substrate, Electrostatic Chuck Device, and Method for Manufacturing Substrate. This invention was developed by Nakazawa Yuya and Harada Kenji.
The patent application number is CN20251061338 20250115. The patent publication number is CN120341165 (A). International P..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Changxin Xinqiao Storage Tech Co Ltd has submitted a patent application for Positioning Jig and Correction Method of Active Wafer Centering System. This invention was developed by Hu Guogang.
The patent application number is CN202510828003 20250619. The patent publication number is CN120341155 (A). Interna..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Door Opening Mechanism, Loading and Unloading Chamber and Semiconductor Process Equipment. This invention was developed by Qian Cuncun, Chang Jiang and Kong Xiangtian.
The patent application number is CN202510593000 20250508. The..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Suzhou Simaitu Tech Co Ltd has applied Chinese patent for Silicon Wafer Transmission System. Xiao Changli, Chen Xiaohui and Yi Zheng developed it.
The patent application number is CN202510448362 20250410. The patent publication number is CN120341150 (A). International Patent Classification code is H01L21/6..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Suzhou Dexin Chip Tech Co Ltd has sought patent for Quartz Boat, Boat Taking Device and Wafer Moving Assembly. This invention was developed by Yang Jie.
The patent application number is CN202510432155 20250408. The patent publication number is CN120341147 (A). International Patent Classification codes are ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Semiconductor Cleaning Carrier and Semiconductor Cleaning Equipment. This invention was developed by Zhang Yang.
The patent application number is CN20241073078 20240118. The patent publication number is CN120341146 (A). Internati..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Chongqing Xinlian Microelectronic Co Ltd patent application for Method for Monitoring Temperature of Semiconductor Process Cavity. This invention was developed by Li Gang.
The patent application number is CN202510445416 20250410. The patent publicati..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Hangzhou Ounuo Semiconductor Equipment Co Ltd has applied Chinese patent for Mixed Process Efficient Double-cavity Furnace Tube for Wafer Processing. Yu Meng, Zhao Hui, Ma Yalan, Li Jun and Luo Dong developed it.
The patent application number is CN202510419773 20250403. The patent publication number is CN1..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Jiangsu Lilong Semiconductor Tech Co Ltd has submitted a patent application for Processing Equipment for Wafer Production. This invention was developed by Xiao Di, Chen Erjing and Zou Xinyi.
The patent application number is CN202510409861 20250402. The patent publication number is CN120341136 (A). Internat..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Zhuhai Hongjun New Energy Co Ltd has applied Chinese patent for Photovoltaic Silicon Wafer Detecting and Sorting Equipment. Zhang Wei, Hou Hongtao, Li Changhong and Jiang Qingtang developed it.
The patent application number is CN202510331923 20250320. The patent publication number is CN120341135 (A). Inter..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- SCREEN Holdings has submitted a patent application for Substrate Processing Apparatus and Substrate Processing Method. This invention was developed by Kawagishi Ryoya, Takamura Yukihiro and Oe Muneaki.
The patent application number is CN20251056526 20250114. The patent publication number is CN120341134 (A). ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- SCREEN Holdings has sought patent for Substrate Processing Apparatus and Substrate Processing Method. This invention was developed by Kawagishi Ryoya, Takamura Yukihiro and Oe Muneaki.
The patent application number is CN20251056524 20250114. The patent publication number is CN120341133 (A). International Pat..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received SCREEN Holdings patent application for Substrate Processing Apparatus and Substrate Processing Method. Kawagishi Ryoya, Oe Muneaki and Takamura Yukihiro developed the invention.
The patent application number is CN20251056193 20250114. The patent public..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has published Shibaura Mechatronics patent application for Substrate Processing Apparatus. The invention was developed by Fukukita Nobutaka, Iso Akinori, Nakatsuka Yasuyuki and Fukuzaki Hiroyuki.
The patent application number is CN202411913135 20241224. The patent ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Kokusai Electric patent application for Substrate Processing Apparatus, Ambient Gas Control Method, Substrate Processing Method, Semiconductor Device Manufacturing Method, and Recording Medium. Yamamoto Kaoru and Ohashi Naofumi developed the invention.
..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Samsung Electronics has filed a patent application for Substrate Processing Apparatus and Substrate Processing Method. This invention was developed by Lee Jun-ho, Noh Sung-jun, Jeong Ji-hoon, Kang Song Yun, Kim Tae Heon, Kim Young-hoo, Yun Jun Ho, Lee Jong-won, Zheng Zhixiong and Hong Tinghe.
The patent appl..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Hefei Peidun Storage Technology patent application for Method for Improving Bonding Force Between Bump and Bottom and Chip Structure. This invention was developed by Geng Baocheng, Liu Yue, Zheng Shuhao, Wang Lin, Wei Xiaobo and Yao Weiyong.
The patent..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Zhuhai Yuanjiyi Electronic Tech Co Ltd has submitted a patent application for Manufacturing Method of Diamond Ceramic Semiconductor Packaging Tube Shell and Method for Packaging Computing Power Chip. This invention was developed by He Dongge and Liu Xuanting.
The patent application number is CN202510823237..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Semiconductor Manufacturing International (Shanghai) patent application for Deposition Equipment, Semiconductor Deposition Process and Semiconductor Structure. Zhu Haiyang developed the invention.
The patent application number is CN20241063759 20240116..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Xiamen Tianma Display Technology patent application for Display Panel, Integrated Chip and Display Device. This invention was developed by Yuan Yong.
The patent application number is CN202510541104 20220824. The patent publication number is CN120340414..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Beijing ESWIN Computing Technology patent application for Display Driving Circuit and Method, Chip and Display Equipment. Gan Linchong, Zhang Tianyou, Liu Wenming, Yu Jinquan, Zhang Xing and Zeng Wenbin developed the invention.
The patent application n..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Wuhan China Star Optoelectronics Semiconductor Display Technology patent application for Display Panel. This invention was developed by Fang Li.
The patent application number is CN202510705281 20250528. The patent publication number is CN120340402 (A..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Nanjing Cold Source Matrix Tech Co Ltd has sought patent for Air Conditioning System Based on Semiconductor Refrigerating and Heating Technology. This invention was developed by Luo Wen.
The patent application number is CN202510739306 20250604. The patent publication number is CN120351585 (A). Internationa..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Zhejiang Chuangxin Integrated Circuit patent application for Formation Method of Semiconductor Structure. Bai Hao and Shi Xiaoming developed the invention.
The patent application number is CN202510533955 20250425. The patent publication number is CN120..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- ChangXin Technology Group has applied Chinese patent for Manufacturing Method of Semiconductor Structure and Semiconductor Structure. Lian Lei, Zhang Jun, Wang Ruiming and Zhong Baojian developed it.
The patent application number is CN202510525612 20250424. The patent publication number is CN120341114 (A). I..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Xuzhou Weiju Electronic Mat Co Ltd patent application for Preparation Method for Reducing Surface Defects of Semiconductor Wafer. This invention was developed by Li Wei and Wang Kankan.
The patent application number is CN202510482116 20250417. The pa..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Samsung Electronics has applied Chinese patent for Focusing Ring, Substrate Processing Apparatus, and Substrate Processing Method. Koh Hyung-sik developed it.
The patent application number is CN202410914538 20240709. The patent publication number is CN120341105 (A). International Patent Classification codes ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received ASM International Holding patent application for Holder, Holder Assembly, Semiconductor Processing System, and Method of Manufacturing Holder Assembly. Gao Fan, Lyu Jeffrey, Mccullough William and Kudala Praveen Srinivasa Reddy developed the invention.
..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Heraeus Photovoltaic Tech Shanghai Co Ltd has submitted a patent application for Conductive Paste, Electrode Prepared Therefrom, and Crystalline Silicon Solar Cell Comprising Said Electrode. Liu Yinyao and Gao Changlu developed the invention.
The patent application number is CN20241061934 20240116. The pat..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- NVIDIA has submitted a patent application for Text-based Object Generation. This invention was developed by Yuan Ye, Iqbal Umar, Song Jiaming, Wadat Andrew and Kautz Jan.
The patent application number is CN20251094530 20250121. The patent publication number is CN120355840 (A). International Patent Classifica..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Sunuo Xiamen Photovoltaic Ind Co Ltd has submitted a patent application for Mesoscopic Perovskite Solar Cell Conductive Carbon Electrode Component Design Method and System Based on Machine Learning Model. This invention was developed by Lin Xi, Meng Hao, Liu Jiakai, Zhu Xu, Zhang Jingzi, Zhong Chengquan, Hu K..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Micron Technology has applied Chinese patent for Dual Device Data Correction for Redundant Array of Independent Disks Based Systems. Sforzin Marco developed it.
The patent application number is CN20251061693 20250115. The patent publication number is CN120340582 (A). International Patent Classification codes..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation has submitted a patent application for Failure Chip Screening Method. This invention was developed by Xie Zhonghua and Xu Huan.
The patent application number is CN202510396981 20250331. The patent publication number is CN120340580 (A). Internatio..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation has applied Chinese patent for Failure Chip Screening Method. Xie Zhonghua, Xu Huan and Ren Dongliang developed it.
The patent application number is CN202510397054 20250331. The patent publication number is CN120340578 (A). International Patent C..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Ziguang Tongxin Microelectronics has submitted a patent application for Shift Register, Signal Anti-interference System and Chip. This invention was developed by Xu Haijun.
The patent application number is CN202510426118 20250407. The patent publication number is CN120340572 (A). International Patent Classif..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Shandong University patent application for Resistive Random Access Memory Array and Storage Circuit. This invention was developed by Chen Jiezhi, Wang Chengcheng, Hu Yuzhe, Sang Pengpeng, Wu Jixuan and Zhan Xuepeng.
The patent application number is CN2..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released ChangXin Technology Group patent application for Receiver, Data Receiving Structure and Memory. This invention was developed by Jiang Mianchao.
The patent application number is CN20241077246 20240118. The patent publication number is CN120340560 (A)...
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Samsung Electronics has submitted a patent application for Semiconductor Memory Device and Self-refreshing Method Thereof. This invention was developed by Lim Suk-hyun.
The patent application number is CN202411660812 20241120. The patent publication number is CN120340556 (A). International Patent Classificat..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received XCMG Excavator Machinery patent application for Secondary Buffering Overflow Valve and Using Method Thereof. Ren Lu, Zhang Fei, Li Jinpeng, Yue Suhua, Pan Saisai and An Pengfei developed the invention.
The patent application number is CN202510540567 ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- 3peak Incorporated has filed a patent application for Operational Amplifier and Chip. This invention was developed by Zhao Xiaobin and Zhang Rui.
The patent application number is CN202510403526 20250401. The patent publication number is CN120342333 (A). International Patent Classification codes are H03F1/0..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Shandong Salu Optical Tech Co Ltd has filed a patent application for Mobile Phone Glass Cover Plate Quality Detection Method Based on Image Sensor. This invention was developed by Li Peideng, Zhu Lijun and Wei Zengyin.
The patent application number is CN202510424493 20250407. The patent publication number ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Suzhou University of Science and Technology patent application for Multi-AGV Cooperative Path Planning and Scheduling Method for Chip Intelligent Storage. Xu Benlian, Yang Zhicheng, Lu Mingli, Zhou Xu, Wang Chao and Yang Yong developed the invention.
..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Chipsea Technology Shenzhen patent application for Switching Power Supply Circuit, Power Supply System, Power Supply Chip and Electronic Equipment. This invention was developed by Chen Min and Lin Cheng.
The patent application number is CN202510723181 ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Huaiyin Institute of Technology has submitted a patent application for Buck Type DC-DC High-order Sliding Mode Control Method and System Based on Sliding Mode Observer. This invention was developed by Zhao Minggao, Ding Yu, Ke Yongbin, Liu Yue, Zhong Tiancheng, Lai Xingcong and Wu Qiyue.
The patent applica..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Shanghai Awinic Technology patent application for Power Supply Circuit, Chip and Electronic Equipment. Zhang Haijun, Zhou Jianing, Yao Wei and Sun Hongjun developed the invention.
The patent application number is CN202510535094 20250425. The patent pub..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- China Soft Technology has submitted a patent application for Automatic Buck-boost Control Circuit Based on DCDC Control Chip. Jiang Ye, Yin Han and Li Tie developed the invention.
The patent application number is CN202510492686 20250418. The patent publication number is CN120342219 (A). International Paten..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Qualgend Ltd has sought patent for Power Semiconductor Element Testing Device. This invention was developed by Sakata Shigeo, Kajinishi Takahiro, Kihara Seiichiro and Takahara Hiroshi.
The patent application number is CN202510667136 20200525. The patent publication number is CN120342195 (A). International ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Chongqing Qianwei Wireless Tech Co Ltd has submitted a patent application for Multipath Output Semiconductor Crown Block Vehicle-mounted Non-contact Power Supply Module. This invention was developed by Zhou Shijie, Wang Deyong, Song Guanghong, Liu Qi and Li Jun.
The patent application number is CN202510642..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Qinghai Jinko Energy Co Ltd and Jinko Solar patent application for Single Crystal Furnace and Single Crystal Silicon Rod Annealing Method. This invention was developed by Chen Zhancang, Wang Pengfei, Sun Weigang, Zhao Yuzhi and Qi Yumeng.
The patent ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Canadian Solar and Baotou Canadian Solar Energy Tech Co Ltd patent application for Silicon Single Crystal and Silicon Single Crystal Czochralski Method. This invention was developed by Liao Caichao, Bai Xiaolong, Xiong Bo, Su Jinfeng, Kang Yuhu and Yan ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Anhui Hejing Material Tech Co Ltd has sought patent for Adjustable Electrolysis Device, Electroplating System and Electroplating Method. This invention was developed by Kadomatsu Meiju, Zhou Zhihan and Zhou Aihe.
The patent application number is CN202510855136 20250625. The patent publication number is CN1..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Northeastern University has submitted a patent application for Method for Electroplating Aluminum or Aluminum-zinc Alloy on Surface of Magnesium-lithium Alloy by Using Room-temperature Aprotic Solvent. This invention was developed by Shi Zhongning, Yang Xue and Liu Aimin.
The patent application number is CN2..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has published Shenzhen Xielida Precision Tech Co Ltd patent application for Optical Module High-temperature-resistant Surface Treatment Process Based on Composite Electroplating. The invention was developed by Fan Yumin and Shi Zhenhua.
The patent application num..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Qingdao University has submitted a patent application for Semiconductor Photo-anode Containing Catalyst Mvxoy as Well as Preparation Method and Application of Semiconductor Photo-anode. This invention was developed by Zhang Hongwen, Tang Hua, She Xilin and Xue Jiayue.
The patent application number is CN20251..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Beijing NAURA Microelectronics Equipment has sought patent for Process Control Method Applied to Semiconductor Equipment and Semiconductor Equipment. This invention was developed by Li Peizhen and Zhang Lu.
The patent application number is CN20241081472 20240119. The patent publication number is CN120350363 ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Hubei Ruihua Science And Tech Co Ltd has submitted a patent application for Method for Growing Diamond by Ion Implantation of Carbon on Iridium-containing Substrate. This invention was developed by Xiang Xiaoyan, Zhang Chaoqi and Gan Changyin.
The patent application number is CN202510766629 20250610. The p..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Beijing NAURA Microelectronics Equipment has applied Chinese patent for Method for Forming Protective Film and Semiconductor Process Equipment. Yang Zhihui developed it.
The patent application number is CN20241090792 20240122. The patent publication number is CN120350360 (A). International Patent Classificat..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has published Soochow University, Beijing Graphene Inst and Beijing University patent application for Radio Frequency Plasma Enhanced Chemical Vapor Deposition Device and Application Thereof. The invention was developed by Sun Jingyu, Wei Wenze, Yoo Chung-beom, Jia..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Dalian University of Technology has submitted a patent application for Cocrfeni High-entropy Silicide Semiconductor Film Capable of Modulating Band Gap and Preparation Method of Cocrfeni High-entropy Silicide Semiconductor Film. Li Xiaona, Zhu Qi, Qin Yujing and Wang Xiao developed the invention.
The patent ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Maanshan Iron & Steel has submitted a patent application for Color-coated Substrate with Excellent Corrosion Resistance, Preparation Method of Color-coated Substrate and Color-coated Steel Plate. This invention was developed by Yu Bo, Zhang Yi, Qian Tingting, Ji Yaoyao, Shi Guolan, Wang Teng, Wang Zhanye, Li ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- STMicroelectronics International has applied Chinese patent for Data Protection. Jean Marc developed it.
The patent application number is CN20251069436 20250116. The patent publication number is CN120342584 (A). International Patent Classification codes are G06F21/44, G06F21/60, H04L9/06, H04L9/08 and H04L9/..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Rongyao Terminal patent application for Communication Method and Device, Storage Medium, Chip System and Program Product. This invention was developed by Wang Bin and Chen Mengying.
The patent application number is CN202510813205 20250618. The patent p..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has published Spreadtrum Semiconductor (Nanjing) patent application for Ptp (precision Time Protocol) Message Processing Method, Time Synchronization Method and Device and Communication Equipment. The invention was developed by Guo Jian.
The patent application nu..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Beijing Xuanjie Technology has submitted a patent application for Beam Sensing Method and Device, Communication Equipment, Storage Medium and Chip. Tan Shu, Wei Gang and Wang Bo developed the invention.
The patent application number is CN202510542962 20240517. The patent publication number is CN120342452 (A)..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Beijing Xuanjie Technology has submitted a patent application for Signal Processing Device, Method and System, Signal Receiver, Equipment and Chip. This invention was developed by Zhu Zhimin.
The patent application number is CN202510528295 20250424. The patent publication number is CN120342413 (A). Internati..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- H3C Holdings has submitted a patent application for Data Compression Method and Logic Chip. Hou Haijun developed the invention.
The patent application number is CN202510399161 20250328. The patent publication number is CN120342403 (A). International Patent Classification code is H03M7/40. Cooperative Patent ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Anhui Geen Semiconductor has sought patent for Group Iii Nitride Semiconductor Laser Element. This invention was developed by Zheng Jinjian, Deng Heqing, Xun Feilin, Liu Zihan, Cai Xin, Chen Wanjun, Zhong Zhibai, Yang Lixun, Li Xiaoqin, Lan Jiabin, Zhang Jiangyong and Li Shuiqing.
The patent application numb..
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