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Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- NGK Corp has sought patent for SiC Wafer. This invention was developed by Harada Haruko, Nakane Yuki and Hirao Takayuki.
The patent application number is WO2025JP37092 20251022. The patent publication number is WO2026203478 (A1). International Patent Classification codes are C30B23/06, C30B25/02 and C30B29/..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has released NGK Corp patent application for SiC Wafer. This invention was developed by Harada Haruko, Nakane Yuki and Hirao Takayuki.
The patent application number is WO2025JP37091 20251022. The patent publication number is WO2026203477 (A1). International Patent Cl..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has released NGK Corp patent application for SiC Wafer. This invention was developed by Matsushima Kiyoshi, Urata Yuki and Nakane Yuki.
The patent application number is WO2025JP37090 20251022. The patent publication number is WO2026203476 (A1). International Patent C..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- NGK Corp has submitted a patent application for SiC Wafer. This invention was developed by Harada Haruko, Tachida Yusuke, Matsukawa Shinya and Matsushima Kiyoshi.
The patent application number is WO2025JP37089 20251022. The patent publication number is WO2026203475 (A1). International Patent Classification ..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has published NGK Corp patent application for SiC Wafer. The invention was developed by Matsushima Kiyoshi, Urata Yuki and Nakane Yuki.
The patent application number is WO2025JP37088 20251022. The patent publication number is WO2026203474 (A1). International Patent C..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has published NGK Corp patent application for SiC Wafer. The invention was developed by Harada Haruko, Nakane Yuki and Hirao Takayuki.
The patent application number is WO2025JP37086 20251022. The patent publication number is WO2026203472 (A1). International Patent Cl..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- NGK Corp has sought patent for SiC Wafer. This invention was developed by Harada Haruko, Nakane Yuki and Hirao Takayuki.
The patent application number is WO2025JP37085 20251022. The patent publication number is WO2026203471 (A1). International Patent Classification codes are C30B23/06 and C30B29/36.
An ..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has received NGK Corp patent application for SiC Wafer. Harada Haruko, Tachida Yusuke, Matsukawa Shinya and Matsushima Kiyoshi developed the invention.
The patent application number is WO2025JP37084 20251022. The patent publication number is WO2026203470 (A1). Intern..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has received Sony Europe Ltd and Sony Semiconductor Solutions Corporation patent application for Apparatus, Head-mounted Display, Method. Wang Bi developed the invention.
The patent application number is WO2026EP58518 20260325. The patent publication number is WO2026..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has received Sony Europe Ltd and Sony Semiconductor Solutions Corporation patent application for Pixel Circuit with Single Photon Detector and Image Sensor Assembly. Johansson Erik Robert developed the invention.
The patent application number is WO2026EP58462 2026032..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has published NGK Corp patent application for Laminated Substrate, Functional-film-equipped Laminated Substrate, and Method for Manufacturing Laminated Substrate. The invention was developed by Watanabe Morimichi, Tomita Takahiro and Suzuki Ayumi.
The patent applicat..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- NGK Corp has filed a patent application for Laminated Substrate and Laminated Substrate with Circuit. This invention was developed by Watanabe Morimichi, Tomita Takahiro and Suzuki Ayumi.
The patent application number is WO2026JP08778 20260306. The patent publication number is WO2026204268 (A1). Internation..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Univ Toyama Prefectural has submitted a patent application for Sensor Substrate and Detection Device. This invention was developed by Shimoyama Isao, Noda Kentaro and Tsukagoshi Takuya.
The patent application number is WO2025JP13257 20250331. The patent publication number is WO2026203383 (A1). International..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- NGK Corp has submitted a patent application for Multilayer Substrate, Multilayer Substrate Provided with Functional Film, and Method for Manufacturing Multilayer Substrate. This invention was developed by Watanabe Morimichi, Tomita Takahiro and Suzuki Ayumi.
The patent application number is WO2025JP11932 20..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has published NGK Corp patent application for Laminated Substrate and Laminated Substrate with Circuit. The invention was developed by Watanabe Morimichi, Tomita Takahiro and Suzuki Ayumi.
The patent application number is WO2025JP11931 20250325. The patent publicatio..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Corintis SA has applied WIPO patent for Semiconductor Arrangement. Van Erp Remco developed it.
The patent application number is WO2026EP57732 20260319. The patent publication number is WO2026201749 (A1). International Patent Classification code is G06F1/20. Cooperative Patent Classification codes are G06F1/..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Hangzhou Hikmicro Sensing Technology Co Ltd has submitted a patent application for Lens and Wafer. This invention was developed by Wei Shuai, Liu Jianhua and Ding Jinling.
The patent application number is WO2026CN82258 20260309. The patent publication number is WO2026200507 (A1). International Patent Classi..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- NGK Corp has applied WIPO patent for Composite Substrate, Device, and Method for Manufacturing Composite Substrate. Kaneko Shinya, Fujita Naoki, Niwa Masato, Yamamoto Takeshi and Yajima Ryuga developed it.
The patent application number is WO2026JP07632 20260227. The patent publication number is WO2026204128..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- NGK Corp has submitted a patent application for Composite Wafer and Method for Manufacturing Composite Wafer. This invention was developed by Hattori Ryosuke and Kato Yukinobu.
The patent application number is WO2026JP05724 20260217. The patent publication number is WO2026203962 (A1). International Patent C..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has received Mitsubishi Electric Corp and Mitsubishi Electric R&D Centre Europe BV patent application for Method and Circuit Adapted to Monitor the Junction Temperature of a Power Semiconductor. Mitsubishi Electric R&d Centre Europe Bv, Quemener Vincent and Degrenne Nic..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Ibm China Co Limited and IBM UK have filed a patent application for Stacked FET Sram with Top-layer Pass-gate. This invention was developed by Yamashita Tenko, Wang Junli, Bajpai Utkarsh, Zhang Chen, Khan Shahrukh and Reboh Shay.
The patent application number is WO2026IB52234 20260309. The patent publicatio..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has released Deepwave Inc patent application for Conductive Substrate and Manufacturing Method Thereof. This invention was developed by Lee Kuk Hwan and Choi Dae-kyu.
The patent application number is WO2025IB54168 20250422. The patent publication number is WO20262025..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Cirrus Logic International Semiconductor has sought patent for Audio Processing. This invention was developed by Brickman Adam.
The patent application number is WO2026EP52182 20260128. The patent publication number is WO2026201347 (A1). International Patent Classification code is G06F3/16. Cooperative Paten..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has received Shenzhen Huaxin Semiconductor Equipment Tech Co Ltd patent application for Temperature Control Method and System for Semiconductor Chamber Heater, and Storage Medium. Lai Senyu, Zhou Xuan, Zeng Qiang and Zhou Lingchuan developed the invention.
The patent..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Maxscend Microelectronics Co Limited has submitted a patent application for Semiconductor Structure and High-frequency Semiconductor Device. Zhu Hong, Xu Yajun and Tao Gengming developed the invention.
The patent application number is WO2026CN86314 20260326. The patent publication number is WO2026201081 (A1..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has released Theo End Shenzhen Computing Tech Co Ltd patent application for Huffman Encoding Method and Encoding Apparatus, Chip and Storage Medium. This invention was developed by Tang Nianqi.
The patent application number is WO2026CN86035 20260325. The patent publi..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has received Qingdao Huaxin Crystal and Electronics Tech Co Ltd patent application for Cleaning Control System and Method for Double-side-polished Sapphire Wafer. Xiao Yanqing, Jiang Jian, Xiao Di, Zhang Xiufang, Jia Songsong and Dai Lei developed the invention.
The ..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has received Soi Micro Co Ltd patent application for Semiconductor Device and Manufacturing Method Therefor. Ji Minghua developed the invention.
The patent application number is WO2025CN86341 20250331. The patent publication number is WO2026199615 (A1). International..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Soi Micro Co Ltd has submitted a patent application for Method for Measuring Overlay Error, and Integrated Circuit. Lian Zongxiang developed the invention.
The patent application number is WO2025CN86316 20250331. The patent publication number is WO2026199614 (A1). International Patent Classification code is..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- SOI Micro Co Ltd has filed a patent application for Semiconductor Device and Manufacturing Method Therefor. This invention was developed by Hou Yongtian.
The patent application number is WO2025CN86296 20250331. The patent publication number is WO2026199613 (A1). International Patent Classification code is H..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- SOI Micro Co Ltd has applied WIPO patent for Semiconductor Device and Manufacturing Method Therefor. Ji Minghua developed it.
The patent application number is WO2025CN86290 20250331. The patent publication number is WO2026199612 (A1). International Patent Classification code is H10D30/65. Cooperative Patent..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Soi Micro Co Ltd has sought patent for Semiconductor Device and Manufacturing Method Therefor. This invention was developed by Ji Minghua.
The patent application number is WO2025CN86266 20250331. The patent publication number is WO2026199611 (A1). International Patent Classification code is H10D30/67. Coope..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Chinese Patent for Tail Gas Waste Heat Utilization Device of Polycrystalline Silicon Reduction Furnace has been issued to Xinjiang Jingnuo New Energy Ind Development Co Ltd. This invention was developed by Wang Lin, Shang Guobin, Zhang Fengyang, Fang Xu, Yang Peng and Wang Dong.
The patent application numb..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Tangshan Caofeidian Yingmei Tech Co Ltd has received a patent for I2C (Inter-integrated Circuit) Bus Printing Consumable Chip Without Polarity Division. This invention was developed by Li Jianfeng, Lin Yuanzhi and Li Desheng.
The patent application number is CN202520767314U 20250422. The patent publication..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has published CCSH Corp patent application for Semiconductor Devices and Fabricating Methods Thereof. The invention was developed by Sun Changzhi, Xia Zhiliang, Zhou Wenxi and Wang Di.
The patent application number is WO2025CN85005 20250326. The patent publication nu..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has released Innostar Semiconductor Shanghai Co Ltd patent application for Non-volatile Two-terminal Memory Cell and Product Thereof. This invention was developed by Zhang Peng, Chen Liang and Ni Jiaqi.
The patent application number is WO2026CN73745 20260120. The pat..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Jiangsu Jingchuang Advanced Electronic Tech Co Ltd has filed a patent application for Wafer Processing Method, System and Device. This invention was developed by Gao Jinlong, Hu Xiaobo, Zhou Jingxin, Sun Zhichao, Ji Xiaoyan and Lin Xuan.
The patent application number is WO2026CN72197 20260113. The patent pu..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has received Shenzhen Institute of Advanced Technology Chinese Academy Of Sciences patent application for Database Verification Method Based on Polynomial Commitment and Memory Correctness Verification. Cui Buwen and Qu Qiang developed the invention.
The patent appli..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Yinwang Intelligent Tech Co Ltd has submitted a patent application for Waveguide Structure, Silicon Photonic Chip, Detection Apparatus, and Terminal Device. This invention was developed by Xu Ci, Li He, Niu Ben, Zhang Xiaobin and Zhu Yadan.
The patent application number is WO2025CN84372 20250324. The patent..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has released The University Of Hong Kong Shenzhen Institute Of Research and Innovation patent application for Method for Synthesizing Two-dimensional Conjugated Coordination Polymer Thin Film on Basis of Ammonia-assisted Chemical Vapor Deposition. This invention was dev..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Shanmu Shenzhen Biotechnology Co Ltd has submitted a patent application for Method for Using Microfluidic Chip. Chen Xi, Lin Hequan and Chen Yueyun developed the invention.
The patent application number is WO2025CN144606 20251223. The patent publication number is WO2026200114 (A1). International Patent Clas..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Jolywood Taizhou Solar Tech Co Ltd has sought patent for Laser-assisted Etching Grooving Method for Preparing High-doping-concentration P+ Polycrystalline Silicon and Use. This invention was developed by Lin Jianwei, Su Hao, Hu Shengjie, Yuan Jing, Li Feng, Gou Ting, Yang Weiguang, Li Daoxian, Yang Kai, Nie Ji..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Wuxi Shennan Circuits Co Ltd has applied WIPO patent for Method for Manufacturing Substrate Frame Layer, Package Substrate, and Product. Hu Kai developed it.
The patent application number is WO2025CN138462 20251128. The patent publication number is WO2026200000 (A1). International Patent Classification code..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has published International Innovation Center Of Tsinghua Univ Shanghai and Tsinghua University patent application for Electron-beam Direct Writing System and Chip Production System. The invention was developed by Wu Huaqiang, Chou You Hua and Chang Shun Teh.
The pat..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Beijing Borui Advanced Tech Co Ltd has obtained a patent for automatic height measuring device of chip mounter. This invention was developed by Wang Peng, Cao Fan and Shi Guibin.
The patent application number is CN202423216922U 20241225. The patent publication number is CN223827000 (U). International Paten..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Harvard College and Corning have submitted a patent application for Metasurface-based Fiber-to-chip Couplers. This invention was developed by Cassara Davide, Capasso Federico, Rocha Rodrigues Janderson, Portes Ary Reis, Dainese Jr, Oh Jaewon, Palmieri Alfonso and Marra Louis.
The patent application number i..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has received Tokyo Electron Ltd and Tokyo Electron US Holdings patent application for Methods for Etching Semiconductor Devices. Dorfner Alec developed the invention.
The patent application number is WO2025US53000 20251029. The patent publication number is WO20261981..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has published Jaiswal Supriya patent application for Materials, Architectures, and Methods for Use with Extreme Ultraviolet Radiation in Lithography and Other Components. The invention was developed by Jaiswal Supriya.
The patent application number is WO2025US20703 2..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Shandong Haixian Biological Material Tech Co Ltd has secured a patent on Metal Electroplating Device for Conductive Cloth. Liu Chunmei developed the invention.
The patent application number is CN20252087458U 20250115. The patent publication number is CN223823724 (U). International Patent Classification cod..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Jiangsu Zhuojin Semiconductor Technology has been granted a patent for Cutting Blade Producing and Machining Device. This invention was developed by Wang Hao and Chen Donger.
The patent application number is CN202423263944U 20241230. The patent publication number is CN223823723 (U). International Patent Cl..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Hunan Lujiang Automation Equipment Co Ltd has been granted a patent for Diamond Wire Automatic Sand Burying Electroplating Mechanism. Yoo Im-seok, Yang Feng, Hu Tao and Liu Hongyu developed the invention.
The patent application number is CN202423244807U 20241227. The patent publication number is CN22382372..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Chuyun Precision Technology (Shanghai) has been awarded a patent for Semiconductor Growth Apparatus. This invention was developed by Zheng Dong.
The patent application number is CN20252074759U 20250113. The patent publication number is CN223823698 (U). International Patent Classification codes are C23C16/1..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Suzhou Liyan Machinery Tech Co Ltd has received a patent for Rear Discharge Type Chip Removal Water Tank for Lathe. This invention was developed by Guo Congcong.
The patent application number is CN202520161355U 20250123. The patent publication number is CN223820169 (U). International Patent Classification ..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has released Ling Peiching patent application for Memory Cells and Methods for Manufacturing the Same. This invention was developed by Ling Peiching, Wu Nanray and Yao Liang-gi.
The patent application number is WO2026US20267 20260323. The patent publication number is..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Nexus1 Co Ltd has submitted a patent application for Modular System for Wafer Defect Inspection. This invention was developed by Han Sang Ei, Hwang Byoung Moon and Kim Hyun Jung.
The patent application number is WO2026KR04113 20260313. The patent publication number is WO2026197707 (A1). International Patent..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has received Nexus1 Co Ltd patent application for Wafer Position Alignment Device. Han Sang Ei, Hwang Byoung Moon and Kim Hyun Jung developed the invention.
The patent application number is WO2026KR04050 20260312. The patent publication number is WO2026197697 (A1). I..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Beijing Huairou Laboratory; Southern Power Grid New Electric Power System Beijing Res Institute Co Ltd has secured a patent on Replacement Apparatus for Semiconductor Device. Li Jinyuan, Lee Yo-seong, Shi Hao and Jiang Taosha developed the invention.
The patent application number is CN202522441401U 2025111..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Xian Yixing New Mat Co Ltd has been granted a patent for Diamond Grinding Wheel Marking Tool for Grinding in Semiconductor Field. This invention was developed by Chen Ke, Yin Panfeng and Wang Lu.
The patent application number is CN20252008887U 20250102. The patent publication number is CN223819875 (U). Int..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- State Intellectual Property Office of China has awarded a patent to Guangdong Huaxin Semiconductor Tech Co Ltd for Novel Semiconductor Chip Welding Head. Yang Bin developed the invention.
The patent application number is CN202520426444U 20250312. The patent publication number is CN223819845 (U). Internatio..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Jiangxi Wodejia Photoelectric Co Ltd has been granted a patent for Laser Cutting Platform for Flexible OLED Panel. This invention was developed by Xu Zihao and Guo Chunjian.
The patent application number is CN202423108521U 20241217. The patent publication number is CN223819839 (U). International Patent Cla..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Andon Tech Pty Ltd has submitted a patent application for Artificial Intelligence Memory Architecture, System and Method. This invention was developed by Andon Joe.
The patent application number is WO2026AU50350 20260412. The patent publication number is WO2026199042 (A1). International Patent Classificatio..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has published Ling Peiching patent application for Memory Cells and Methods for Manufacturing the Same. The invention was developed by Ling Peiching, Wu Nanray and Yao Liang-gi.
The patent application number is WO2026US20446 20260323. The patent publication number is..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has received Lu Bin patent application for Embedded Channel Iii-nitride Transistor. Lu Bin developed the invention.
The patent application number is WO2026US19842 20260318. The patent publication number is WO2026198724 (A1). International Patent Classification codes ..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- State Intellectual Property Office of China has awarded a patent to Dongguan Hongyi Electronic Co Ltd for Energy-saving Heating and Refrigerating Device Based on Semiconductor Temperature Control Module. Chen Jiliang, Chen Yinan and Liao Hongmei developed the invention.
The patent application number is CN2..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Inner Mongolia Heguang New Mat Co Ltd has obtained a patent for silicon rod feeding machine for square silicon core production. This invention was developed by Li Shuai, Wang Wangui, Liu Xiaoming and Wu Haixiao.
The patent application number is CN20252066349U 20250113. The patent publication number is CN22..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Shenzhen Zhongxinglian Tech Co Ltd has been granted a patent for Leveling Device for Manufacturing Ceramic Substrate. Ji Zhenjie developed the invention.
The patent application number is CN202423254073U 20241225. The patent publication number is CN223820738 (U). International Patent Classification codes ar..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Hangzhou Tiaoyue Tech Co Ltd has secured a patent on Radiating Substrate Film Covering Puncher. Zhang Hengbiao and Xu Xiaofeng developed the invention.
The patent application number is CN202520403269U 20250310. The patent publication number is CN223820680 (U). International Patent Classification codes are ..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Jiangmen Qianzhao Electrical Appliance Co Ltd has been granted a patent for Substrate Cutting Machine for Producing and Processing SMD (Surface Mount Device) LED (Light Emitting Diode) Lamp Beads. This invention was developed by Liu Wanhong.
The patent application number is CN20252039208U 20250108. The pat..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has published Evon Medics LLC patent application for Pupillometer and Related Methods. The invention was developed by Adeleke Adekunle Ilias, Nwoko Gbasochi Paul, Nwulia Evaristus A, Reddy Vamsi and Okunade Mubarak Babajide.
l
The patent application number is WO2026US..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Johnson William B has sought patent for Endodontic Instrument with Enlarged Chip Space and Reduced Torque Strength.
The patent application number is WO2026US19678 20260318. The patent publication number is WO2026198624 (A1). International Patent Classification code is A61C5/42. Cooperative Patent Classific..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has published Shterengas Leon and Research Foundation of State University of New York patent application for System and Method for Mid-infrared Avalanche Photodiode with Hole-initiated Multiplication. The invention was developed by Shterengas Leon.
The patent applica..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Resideo Usa LLC has sought patent for Heat Pump Controller. This invention was developed by Banh Michelle.
The patent application number is WO2026US19548 20260317. The patent publication number is WO2026198540 (A1). International Patent Classification codes are F24F11/50, F24F11/52 and G06F3/00. Cooperative..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Wuxi Anyanke Semiconductor Co Ltd has been granted a patent for Multi-axis Linkage Stabilizing Device for Semiconductor Manipulator Frame. Zhou Ming and Wu Zhidong developed the invention.
The patent application number is CN202520304435U 20250225. The patent publication number is CN223820556 (U). Internati..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Chinese Patent for Diode Clamping Jig has been issued to Ningde Juneng Power System Technology. This invention was developed by Wang Hui, Liu Fengbo and Ding Qiang.
The patent application number is CN202520187335U 20250206. The patent publication number is CN223820389 (U). International Patent Classificati..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Tasmit Inc and Toray Engineering have filed a patent application for Wafer Holding Mechanism. This invention was developed by Takeshima Makoto.
The patent application number is WO2026JP03859 20260203. The patent publication number is WO2026196844 (A1). International Patent Classification codes are B23Q3/08 ..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has published Japan Display patent application for Method for Manufacturing Light-emitting Device. The invention was developed by Nishimura Masumi.
The patent application number is WO2026JP00143 20260106. The patent publication number is WO2026196757 (A1). Internatio..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Japan Display has sought patent for Method for Manufacturing Light-emitting Device. This invention was developed by Nishimura Masumi.
The patent application number is WO2026JP00139 20260106. The patent publication number is WO2026196756 (A1). International Patent Classification codes are G09F9/00, G09F9/33,..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has received NGK Corp patent application for Member for Semiconductor Manufacturing Apparatus. Ishikawa Masaki, Kojima Mitsuru and Ogiso Yusuke developed the invention.
The patent application number is WO2025JP42603 20251205. The patent publication number is WO202619..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has received Hamamatsu Photonics patent application for Light-emitting Body. Nakamura Tomohiro, Suzuki Hiroki, Takagi Yutaka, Maeda Junya and Nakamura Takayuki developed the invention.
The patent application number is WO2025JP41002 20251125. The patent publication nu..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has received Uldtec Co Ltd patent application for Micro Light Emitting Diode Substrate, Micro Light Emitting Diode Display, and XR Glass. Takeya Motonobu developed the invention.
The patent application number is WO2025JP28439 20250812. The patent publication number i..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Toshiba Electronic Devices & Storage Corp and Toshiba have submitted a patent application for Semiconductor Device. This invention was developed by Sato Motonobu, Takeda Katsuyuki and Nakazato Yusuke.
The patent application number is WO2025JP11198 20250321. The patent publication number is WO2026196585 (A1)..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 --Toshiba Electronic Devices & Storage Corp and Toshiba have filed a patent application for Semiconductor Device. This invention was developed by Nakazato Yusuke and Miura Kosuke.
The patent application number is WO2025JP11174 20250321. The patent publication number is WO2026196582 (A1). International Patent C..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Yixing Rongli Tungsten & Molybdenum Products Co Ltd has been awarded a patent for Limiting Device for Processing Silicon Carbide Heating Rod. This invention was developed by Tan Zhuowei, Tan Zhuojun, Wang Cairong and Xu Weijiang.
The patent application number is CN202423283800U 20241230. The patent publica..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Cangzhou Jingyuan Yuanmao Crystal Mat Co Ltd has secured a patent on Dust Removal Device for Ceramic Substrate of Quartz Crystal Resonator. Liu Jinming, Zhao Weijiang and Zhang Yanqiang developed the invention.
The patent application number is CN202520206457U 20250210. The patent publication number is CN22..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Nexus1 Co Ltd has submitted a patent application for Mask Apparatus for Wafer Defect Inspection. This invention was developed by Han Sang Ei, Hwang Byoung Moon and Kim Hyun Jung.
The patent application number is WO2025KR16900 20251023. The patent publication number is WO2026197511 (A1). International Patent..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Seoul National University R&DB Foundation has applied WIPO patent for Apparatus and Method for Targetless LiDAR-camera Calibration. Jung Haebeom, Park Jaesik and Kim Namtae developed it.
The patent application number is WO2025KR15694 20251001. The patent publication number is WO2026197507 (A1). Internationa..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Nuvoton Technology Japan has submitted a patent application for Semiconductor Device. Okada Naoaki, Kanda Yusuke and Inagaki Daisuke developed the invention.
The patent application number is WO2026JP10919 20260319. The patent publication number is WO2026197396 (A1). International Patent Classification code ..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Almt Corp has sought patent for Heat Sink, Semiconductor Device, and Method for Manufacturing Heat Sink. This invention was developed by Takida Tomohiro, Saito Teruya, Ito Masayuki, Takashima Kouichi and Sakakibara Kazunaga.
The patent application number is WO2026JP10618 20260318. The patent publication num..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Toshiba Electronic Devices & Storage Corp and Toshiba have submitted a patent application for Semiconductor Device. This invention was developed by Sugiyama Toru.
The patent application number is WO2025JP10187 20250317. The patent publication number is WO2026196377 (A1). International Patent Classification ..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Lvmo Fluid Tech Chengdu Co Ltd has been granted a patent for Recycling System of Polycrystalline Silicon Cutting Waste Liquid and Polycrystalline Silicon Cutting System. This invention was developed by Chen Quanyi, Wu Jian and Huang Penghao.
The patent application number is CN202520165734U 20250124. The pa..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Shanghai Junjie Semiconductor Tech Co Ltd has obtained a patent for semiconductor chip pin cutting device. This invention was developed by Li Fengjuan.
The patent application number is CN202520169786U 20250124. The patent publication number is CN223819547 (U). International Patent Classification code is B2..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Chinese Patent for Full-automatic Chip Pin Forming Machine has been issued to Suzhou Langxiang Electromechanical Equipment Co Ltd. This invention was developed by Liu Liangdian.
The patent application number is CN20242349914U 20241211. The patent publication number is CN223819543 (U). International Patent ..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has published Takatori Corp patent application for Adhesive Tape Applicator. The invention was developed by Oogita Horoshi, Nishimura Hironori and Higuchi Akihiko.
The patent application number is WO2026JP10030 20260314. The patent publication number is WO2026197247 ..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Stanley Electric has applied WIPO patent for Semiconductor Light Emitting Module. Hirama Satoshi developed it.
The patent application number is WO2026JP09948 20260313. The patent publication number is WO2026197228 (A1). International Patent Classification code is H10H20/857.
The abstract of the patent p..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Oscillation Device. This invention was developed by Motobayashi Hisayoshi, Murayama Masahiro and Shibata Norihiko.
The patent application number is WO2026JP09802 20260313. The patent publication number is WO2026197208 (A1). Inte..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- World Intellectual Property Organization has received Sony Semiconductor Solutions Corporation patent application for Display Device. Kawamura Masahiro developed the invention.
The patent application number is WO2026JP09556 20260312. The patent publication number is WO2026197175 (A1). International Patent C..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Sony Group has sought patent for Light-emitting Device. This invention was developed by Koda Rintaro, Makino Tomohiro, Hayashi Kentaro and Watanabe Takumi.
The patent application number is WO2026JP08273 20260304. The patent publication number is WO2026197033 (A1). International Patent Classification codes a..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- Jiangsu Xinhuarui Microelectronics Co Ltd has been granted a patent for Silver Silicon Carbide Sintering Mold Convenient to Demold. This invention was developed by Chen Xuqi, Wu Li and Gong Juncheng.
The patent application number is CN202520392178U 20250307. The patent publication number is CN223819655 (U)..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 13 -- State Intellectual Property Office of China has awarded a patent to Hengyang Zhongliangshun Iron Core Co Ltd for Material Receiving Structure of Silicon Steel Sheet Cross Cut Line. Luo Shuangxi and Peng Liyong developed the invention.
The patent application number is CN202520428863U 20250312. The patent pu..
Semiconductor
| Wed 14 Oct 2026
Geneva, Oct. 13 -- Denka Co Limited has sought patent for Light-emitting Substrate. This invention was developed by Konishi Masahiro.
The patent application number is WO2026JP07228 20260226. The patent publication number is WO2026196970 (A1). International Patent Classification codes are F21V19/00, G02B5/20, H10H20/851, H10H2..
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