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Semiconductor
| Thu 23 Jul 2026
Beijing, July 24 -- Silergy Semiconductor Technology (Hangzhou) has submitted a patent application for Serial Communication Method, Serial Communication System and Backlight System. Zeng Zhenwen, Cao Yu, Gao Shang and Yang Yuanyu developed the invention.
The patent application number is CN20251241764 20251231. The patent public..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 24 -- Rockchip Electronics has submitted a patent application for Audio Read-write Method and Audio Processing Chip. Zeng Jun, Xu Jianqun and Li Dapeng developed the invention.
The patent application number is CN20251208944 20251229. The patent publication number is CN121935186 (A). International Patent Classifica..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 24 -- STMicroelectronics International has submitted a patent application for Self-clocked Control in Multi-block In-memory Computing (imc) Neural Processing Units. Chawla Nitin, Cerani Vincenzo, Harsh Rawat and Ayutiavas Melissa developed the invention.
The patent application number is CN202511511260 20251022. Th..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 24 -- Haiguang Information Technology has filed a patent application for Processor Soft Error Injection System and Method and Chip. This invention was developed by Luo Xiaoliang, Zhang Xin and Li Jin.
The patent application number is CN202511893253 20251215. The patent publication number is CN121935101 (A). Intern..
Semiconductor
| Fri 24 Jul 2026
Munich, July 24 -- ASML Netherlands has filed a patent application for Apparatus for Joining Substrates and Methods Therefor. This invention was developed by Gouteux Louise Karina Laurie, Tukker Teunis Willem, Zijp Ferry, Renkens Michael Jozefa Mathijs, Beukman Arjan Johannes Anton and Den Boef Arie Jeffrey.
The patent applicat..
Semiconductor
| Fri 24 Jul 2026
Munich, July 24 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Ignition Chamber of Semiconductor Process Device, Semiconductor Process Device and Control Method. Fang Yang and Kong Xiangtian developed the invention.
The patent application number is EP20240881402 20241009. The patent publicati..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Shenzhen Kaihong Digital Industry Development has submitted a patent application for Cross-device-level Communication Adaptation Method, System and Chip. This invention was developed by Liu Guoping.
The patent application number is CN202511853765 20251210. The patent publication number is CN121940434 (A). In..
Semiconductor
| Fri 24 Jul 2026
Munich, July 24 -- Sony Semiconductor Solutions Corporation has sought patent for Semiconductor Memory Device. This invention was developed by Tatsuno Taro.
The patent application number is EP20240865304 20240902. The patent publication number is EP4779640 (A1). International Patent Classification codes are G11C11/56, G11C17/16..
Semiconductor
| Fri 24 Jul 2026
Munich, July 24 -- SK Hynix has submitted a patent application for Memory Supporting Frequency Setting and Operation Method of Memory. Kim Kyu Young, Kwon Han Byeol, Kim Min O and You Jung Taek developed the invention.
The patent application number is EP20250211292 20251027. The patent publication number is EP4779639 (A1). Inte..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Spreadtrum Communications (Shanghai) has filed a patent application for Conversation Method and Device, Computer Equipment and Chip. This invention was developed by Chen Bo, Rao Guoming and Yang He.
The patent application number is CN202610291151 20260310. The patent publication number is CN121940386 (A). In..
Semiconductor
| Fri 24 Jul 2026
Munich, July 24 -- Huawei Technologies has sought patent for Communication Method and Apparatus, Chip System and Electronic Device. This invention was developed by Li Lizhuang, Tang Bin, Shao Minghao and Yu Hongliang.
The patent application number is EP20240881017 20240529. The patent publication number is EP4779469 (A1). Inter..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has received Realtek Semiconductor Corporation patent application for Communication Device and Method with Frequency Offset Tracking Mechanism. Wang Fengxiang developed the invention.
The patent application number is CN202411506787 20241028. The patent publication ..
Semiconductor
| Thu 23 Jul 2026
Munich, July 24 -- ASML Netherlands has submitted a patent application for Method of Forming an Illumination Mode, Method of Exposing a Substrate and Illumination System. This invention was developed by Everts Frank, Kriete Bjorn, De Jong Edwin and Van Veen Marieke Katherine.
The patent application number is EP20250152911 20250..
Semiconductor
| Thu 23 Jul 2026
Munich, July 24 -- European Patent Office has received ASML Netherlands patent application for Electrostatic Discharge Detection in Exposure Apparatus. Van Wanrooij Jeroen Earl developed the invention.
The patent application number is EP20250152555 20250117. The patent publication number is EP4779402 (A1). International Patent ..
Semiconductor
| Thu 23 Jul 2026
Munich, July 24 -- Nihon Micronics has submitted a patent application for Probe. This invention was developed by Umeda Ryuichi.
The patent application number is EP20240865294 20240830. The patent publication number is EP4779321 (A1). International Patent Classification codes are G01R1/067 and G01R1/073. Cooperative Patent Class..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has received Mengmaike Technology (Suzhou) patent application for New Energy Automobile Chip Mold Intelligent Positioning Method and System Based on Machine Vision. Liu Jiayi developed the invention.
The patent application number is CN202511674801 20251114. The pat..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has released Huawei Device patent application for Two-dimensional Code Scanning Method, Electronic Equipment, Storage Medium and Chip System. This invention was developed by Lyu Nanqing.
The patent application number is CN202411519109 20241028. The patent publicati..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has received Muxi Integrated Circuit (Shanghai) patent application for RDL Information Push-down Method for Chip Back-end Design. Li Shunrui developed the invention.
The patent application number is CN202610397733 20260330. The patent publication number is CN1219..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has received Beijing University patent application for Design Method and Device of Integrated Circuit, Integrated Circuit and Electronic Equipment. Lu Haoran, Wu Heng, Wang Runsheng, Xu Ziqiao, Liu Yu, Li Ming and Huang Ru developed the invention.
The patent applic..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 24 -- Hesai Technology has applied Chinese patent for Chip Security Access Control Method, Device and System and Chip. Yu Qingguo, Lee Sanghwa and Zou Congcong developed it.
The patent application number is CN202411506394 20241025. The patent publication number is CN121935976 (A). International Patent Classificati..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 24 -- Rongyao Terminal has applied Chinese patent for Information Processing Method, Electronic Device, Chip System, Storage Medium and Program Product. Zhong Wei developed it.
The patent application number is CN202411515724 20241025. The patent publication number is CN121935236 (A). International Patent Classific..
Semiconductor
| Thu 23 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has released Silergy Semiconductor Technology (Hangzhou) patent application for Serial Communication Method, Serial Communication System and Backlight System. This invention was developed by Zeng Zhenwen, Cao Yu, Gao Shang and Yang Yuanyu.
The patent application nu..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has released Beijing Xuanjie Technology patent application for Communication Method and Device, Electronic Equipment, Chip and Storage Medium. This invention was developed by Zhu Mingfeng.
The patent application number is CN20261090983 20260122. The patent publicat..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has published Fuzhou University patent application for Bipolar Time Division Multiplexing Display Driving System Based on Memristor and Anti-parallel Light Emitting Diode Architecture and Driving Method Thereof. The invention was developed by Liu Di, Chen Zhenjia, C..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Rongyao Terminal has submitted a patent application for Fault Detection Method, Electronic Device, Storage Medium, Chip System and Computer Program Product. Cui Ke developed the invention.
The patent application number is CN202411515836 20241025. The patent publication number is CN121940527 (A). Internationa..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Rongyao Terminal has applied Chinese patent for Fault Detection Method, Electronic Device, Storage Medium, Chip System and Computer Program Product. Cui Ke developed it.
The patent application number is CN202411509289 20241025. The patent publication number is CN121940526 (A). International Patent Classifica..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has published Chipone Technology, Beijing patent application for Pulse Width Broadening Circuit, Chip and Display Device. The invention was developed by Liu Yuhang.
The patent application number is CN202610282249 20260309. The patent publication number is CN1219382..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has received Realtek Semiconductor Corporation patent application for Display System, Display Method, and Training System. Chen Zhengyue, Wu Qianrou and Yang Shengru developed the invention.
The patent application number is CN202411508228 20241028. The patent publi..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- BOE Technology Group has submitted a patent application for Test Method and Substrate. This invention was developed by Tian Xueyan, Li Ran and Li Dong.
The patent application number is CN202610123412 20260128. The patent publication number is CN121938285 (A). International Patent Classification codes are G01..
Semiconductor
| Fri 24 Jul 2026
Munich, July 24 -- LG Electronics has filed a patent application for Substrate for Assembling Semiconductor Light-emitting Device for Display Pixel, and Display Device Comprising Same. This invention was developed by An Jaeyong, Heo Younho and Sung Junho.
The patent application number is EP20230954867 20231005. The patent publi..
Semiconductor
| Fri 24 Jul 2026
Munich, July 24 -- Huawei Technologies has filed a patent application for Semiconductor Device, Chip, Electronic Device and Semiconductor Device Manufacturing Method. This invention was developed by Wang Cheng, Wang Tianyu and Zhu Jifeng.
The patent application number is EP20240869911 20240627. The patent publication number is ..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has published ChangXin Technology Group patent application for Preparation Method of Semiconductor Structure and Semiconductor Structure. The invention was developed by Liu Mingyuan, Lu Xiaolong, Yuan Lin, Akitomi, Zhang Ming and Tian Enqiang.
The patent applicatio..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has released Beijing University patent application for Memory Unit Structure, Three-dimensional Integrated Memory Array and Preparation Method. This invention was developed by Huang Peng, Feng Yulin, Kang Jinfeng and Tang Zhuohua.
The patent application number is C..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- ChangXin Technology Group has applied Chinese patent for Semiconductor Chip and Semiconductor Packaging Structure. Fan Tianqi developed it.
The patent application number is CN202411473147 20241022. The patent publication number is CN121941038 (A). International Patent Classification codes are H10B12/00, H10B..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Semiconductor Device and Forming Method Thereof. This invention was developed by Cai Qingwei, Wu Jiadian, Li Jiazhen, Lin Gaozheng, Liao Yibo, Wu Jinchang and Qiu Yixun.
The patent application number is CN20251212139 20251229. The pate..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- SiEn QingDao Integrated Circuits has submitted a patent application for Gas Input Device and Semiconductor Equipment. Xue Panfei developed the invention.
The patent application number is CN202411449975 20241016. The patent publication number is CN121938820 (A). International Patent Classification codes are H..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has released NVIDIA patent application for Integrated Heat Exchange in Hybrid Data Center Cooling System. This invention was developed by Edari Abdellah, Mehrabikermani Mehramurthy and Manassar Youssef.
The patent application number is CN202511513973 20251022. The ..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Cummins has applied Chinese patent for Techniques for Assembly, Mounting and Repair of Power Electronics Including Via Semiconductor Devices. Yan Tao developed it.
The patent application number is CN202411490169 20241024. The patent publication number is CN121940976 (A). International Patent Classification c..
Semiconductor
| Fri 24 Jul 2026
Munich, July 24 -- European Patent Office has released Samsung Electronics patent application for Nonvolatile Memory Device, Electronic Device Including the Same and Method of Manufacturing the Nonvolatile Memory Device. This invention was developed by Choi Seokhoon, Lee Minhyun, Park Jinjoo, Leem Youngchul and Jang Seonghun.
T..
Semiconductor
| Fri 24 Jul 2026
Munich, July 24 -- ASML Netherlands has submitted a patent application for a Modular Rack System Suitable for Distributing Electrical Input/output (I/O) Signals. Akyazi Sinan, Smeets Eelco Michiel Theodorus Henricus, Madan Alican, Romo Gallego Santiago, Thomassen Bart Hendrikus Carolus and Meulendijks Antonius Lambertus Theodoru..
Semiconductor
| Fri 24 Jul 2026
Munich, July 24 -- LG Chemical has submitted a patent application for Glass Substrate Metallization Process, Glass Substrate Manufacturing Process Comprising Same, and Metallized Glass Substrate. Choi A Nam, Ryu Sanguk, Jung Dae Chul, Yoo Sangmoon and Kwon Oh Tak developed the invention.
The patent application number is EP20250..
Semiconductor
| Fri 24 Jul 2026
Munich, July 24 -- European Patent Office has received Tokyo Electron patent application for Plasma Processing Device, Power Supply System, and Control Method. Kosaka Yuto and Koshimizu Chishio developed the invention.
The patent application number is EP20240888707 20241105. The patent publication number is EP4780143 (A1). Inte..
Semiconductor
| Fri 24 Jul 2026
Munich, July 24 -- ASML Netherlands has sought patent for Radiation Source. This invention was developed by Luiten Otger Jan, Ross Aimee Jaye, Oosterink Samuel Jan, Van Den Berg Rick Gerardus Wilhelmus, De Raadt Tim Christiaan Hendrik, Smorenburg Petrus Wilhelmus, Mutsaers Petrus Henricus Antonius and Sweers Coen.
The patent ap..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- STMicroelectronics International has sought patent for Low Power Wireless Network System. This invention was developed by Loiacono Daniele, Tomasoni Alessandra and Osnato Fabio.
The patent application number is CN202511532211 20251024. The patent publication number is CN121940847 (A). International Patent Cl..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has released STMicroelectronics International patent application for Management Method of Remote Manager Module in Embedded Universal Integrated Circuit Card, Corresponding Device and System Architecture. This invention was developed by Veneroso Amedeo and Vanore Al..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has received Guangdong OPPO Mobile Telecommunications patent application for Wireless Communication Method and Device, Equipment and Chip. Liu Haizhou developed the invention.
The patent application number is CN202411517740 20241028. The patent publication number i..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has released Taiwan Semiconductor Manufacturing patent application for Write Line Circuit, Floating Data Line Circuit and Method Thereof. This invention was developed by Nikhil Puri, Arora Manish, Xu Yuhao, Chen Yanhui and Liao Hongren.
The patent application numbe..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has published Micron Technology patent application for Configurable Substrate Bias at Memory Systems. The invention was developed by Lin Kevin C.
The patent application number is CN202511528529 20251024. The patent publication number is CN121938423 (A). Internation..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- SK Hynix has submitted a patent application for Enable Signal Generation Circuit and Semiconductor Device Including Same. Kim Hyun Seung developed the invention.
The patent application number is CN202510340276 20250321. The patent publication number is CN121938421 (A). International Patent Classification cod..
Semiconductor
| Fri 24 Jul 2026
Munich, July 24 -- European Patent Office has published STMicroelectronics International patent application for Programmable High-speed Frequency Divider. The invention was developed by Tiwari Jeet Narayan.
The patent application number is EP20260151469 20260113. The patent publication number is EP4779875 (A1). International ..
Semiconductor
| Fri 24 Jul 2026
Munich, July 24 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Circuit Device, Semiconductor Integrated Circuit, Camera, and Mobile Body Device. This invention was developed by Gosho Kunio, Kikuchi Hidekazu, Hara Shintaro, Tanaka Tomokazu and Morohashi Hideo.
The patent application number is ..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has received Yungu Guan Technology patent application for Array Substrate and Display Device. Guo Zidong developed the invention.
The patent application number is CN202610135780 20260130. The patent publication number is CN121941220 (A). International Patent Classi..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Lextar Electronics Corporation has submitted a patent application for Package Structure. This invention was developed by Liang Jianqin and Guo Xiuyi.
The patent application number is CN202510736399 20250604. The patent publication number is CN121941182 (A). International Patent Classification codes are H10H2..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has received Kaneka Corporation patent application for Method for Manufacturing Substrate Laminate for Solid-state Imaging Element. Kuroda Kenta developed the invention.
The patent application number is CN202511502204 20251021. The patent publication number is CN12..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Yungu Guan Technology has applied Chinese patent for Array Substrate, Preparation Method of Array Substrate and Display Panel. Guo Zidong and Yan Guowen developed it.
The patent application number is CN202610135217 20260130. The patent publication number is CN121941113 (A). International Patent Classificatio..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Guangzhou China Star Optoelectronics Semiconductor Display Technology has submitted a patent application for Array Substrate and Display Panel. This invention was developed by Si Shuaichen.
The patent application number is CN20261043527 20260113. The patent publication number is CN121941105 (A). Internationa..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- InfoVision Optoelectronics, Kunshan has submitted a patent application for Manufacturing Method for Improving Via Hole Corrosion, Array Substrate and Display Device. This invention was developed by Zhu Jian and Tao Lingzhi.
The patent application number is CN20261019633 20260108. The patent publication numbe..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. Zeng Jianting, Jiang Hongli, Lin Weicheng and Chen Jianhao developed the invention.
The patent application number is CN20251209372 20251229. The patent publication number is CN1219..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has received Hefei Nexchip Integrated Circuit patent application for Manufacturing Method of Stepped Field Plate and Semiconductor Device. Wang Wei'an, Zhu Min and Cheng Yang developed the invention.
The patent application number is CN202610389259 20260327. The pat..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has received STMicroelectronics International patent application for Manufacturing Method of Trench Schottky Diode with Adjustable Forward Voltage. Ruan Wenzheng and Frederic Lanois developed the invention.
The patent application number is CN202511539274 20251027. ..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has received Taiwan Semiconductor Manufacturing patent application for Memory Device, Semiconductor Device and Forming Method Thereof. Shi Shenghong, Zou Zongcheng and Lin Zhengjun developed the invention.
The patent application number is CN20251245146 20251231. Th..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has released STMicroelectronics International patent application for ESD Protection Circuit. This invention was developed by Galy Philippe.
The patent application number is CN202511543884 20251028. The patent publication number is CN121939324 (A). International Pat..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- StarPower Semiconductor has submitted a patent application for Miniature Terminal Automatic Plug-in Mounting Device for Semiconductor Module and Method of Miniature Terminal Automatic Plug-in Mounting Device. This invention was developed by Xia Peng.
The patent application number is CN202511890639 20251215. ..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has released Delta Electronic Enterprise Management (Shanghai) patent application for Power Semiconductor Device. This invention was developed by Feng Weiyi, Zhang Xing and Zhang Weiqiang.
The patent application number is CN202411496282 20241024. The patent publica..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has received StarPower Semiconductor patent application for Packaging and Signal Output Structure, Manufacturing Method and Power Semiconductor Module. Xu Linfeng developed the invention.
The patent application number is CN202511840276 20251208. The patent publicat..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Texas Instruments has filed a patent application for Electronic Device with Lead Insulation. This invention was developed by Li Fukang, Zhou Hongyu and He Mengyu.
The patent application number is CN202511446576 20251011. The patent publication number is CN121941380 (A). International Patent Classification ..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Beijing NAURA Microelectronics Equipment has sought patent for Electric Connector and Semiconductor Process Equipment. This invention was developed by Zong Kai.
The patent application number is CN202411505254 20241025. The patent publication number is CN121939173 (A). International Patent Classification code..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Realtek Semiconductor Corporation has sought patent for Semiconductor Device and Semiconductor Structure. This invention was developed by Xuan Nairen and Yang Wencheng.
The patent application number is CN202510877395 20250627. The patent publication number is CN121941373 (A). International Patent Classificat..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Semiconductor Components Industries has submitted a patent application for Substrate Bonding Systems and Related Methods. Park Jung-hyuk, Lee Keunhyuk and Han Kyu-hwan developed the invention.
The patent application number is CN202411896920 20241223. The patent publication number is CN121941369 (A). Internat..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has published Realtek Semiconductor Corporation patent application for Rewiring Layer Substrate and Method for Manufacturing Same. The invention was developed by Su Shijie, Zhou Jiaren and Xuan Nairen.
The patent application number is CN202511388187 20250926. The p..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has released StarPower Semiconductor patent application for Packaging Structure of Power Semiconductor Module. This invention was developed by Liu Dongye.
The patent application number is CN202511969188 20251224. The patent publication number is CN121941351 (A). In..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Realtek Semiconductor Corporation has sought patent for Semiconductor Device and Semiconductor Structure. This invention was developed by Xuan Nairen.
The patent application number is CN20251197504 20250806. The patent publication number is CN121941341 (A). International Patent Classification codes are H10W4..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Xie Xiehong, Chen Hongshen and Ye Zizhen.
The patent application number is CN20251209346 20251229. The patent publication number is CN121941337 (A)...
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Samsung Electronics has submitted a patent application for Method for Manufacturing Semiconductor Device. This invention was developed by Kim Ye Ji, Lee Shin-wook, Tsuji Yukihide, Kim Su-min, Chang Yoon-soo, Yoon Tae-sun and Ito Hironobu.
The patent application number is CN202511192962 20250825. The patent p..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Delta Electronics has submitted a patent application for Double-layer Antenna Structure and Optical Phased Array Chip. Zhang Dengxiang, Zhang He, Chen Xinhua, Kee Jack Sheng, Lin Enhong and Li Dongdong developed the invention.
The patent application number is CN202510513157 20250423. The patent publication n..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Shanghai Jita Semiconductor has applied Chinese patent for Testing Method of Semiconductor Structure, Semiconductor Structure and Preparation Method of Semiconductor Structure. Zhang Danmei and Gu Dongguang developed it.
The patent application number is CN20261050067 20260114. The patent publication number i..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Suzhou Tongfu Chaowei Semiconductor has submitted a patent application for Chip Carrying Process Monitoring Method and Chip Carrying Carrier. This invention was developed by Zhu Jun, Jiao Jie and Bian Bingbing.
The patent application number is CN20261007314 20260105. The patent publication number is CN121941..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- ATEC has filed a patent application for Temperature Control Device of Semiconductor Product for Changing Flow Path of Test Gas Based on Different States. This invention was developed by Li Zeshan, Kim Ho Nam, Moon Seong-cheol and Choi Se-mi.
The patent application number is CN202510869761 20250626. The paten..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Kokusai Electric has submitted a patent application for Substrate Processing Method, Method of Manufacturing Semiconductor Device, Program Product, and Substrate Processing Apparatus. This invention was developed by Yamamoto Takayuki, Tahara Kaigo, Qu Hideki, Yamamoto Ryuji and Tachibana Junpei.
The patent a..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Toray Industries has filed a patent application for Photosensitive Resin Composition, Photosensitive Resin Sheet Using the Photosensitive Resin Composition, Method for Manufacturing Cured Product and Cured Product Film, and Semiconductor Device and Display Device Including the Cured Product. This invention wa..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Applied Materials has filed a patent application for Anti-reflection Edge Coating. This invention was developed by Wang Evan.
The patent application number is CN20248063104 20240822. The patent publication number is CN121941946 (A). International Patent Classification codes are G02B1/11, G02B27/01 and G02B6/..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Infineon Technologies, Austria has submitted a patent application for Driver Chip and Method for Driving Gate of Power Transistor. This invention was developed by Ferianz Thomas and Agarwal Vishal.
The patent application number is CN202511527484 20251024. The patent publication number is CN121939776 (A). Int..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- JoulWatt Technology has filed a patent application for Failure Early Warning Circuit of Switching Tube, Control Chip and Switching Converter. This invention was developed by Wang Siyun.
The patent application number is CN202510838577 20250620. The patent publication number is CN121939750 (A). International P..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- NAMICS Corporation has submitted a patent application for Curable Resin Composition and Method for Producing Same, Adhesive, Sealing Material, Cured Product, Semiconductor Device and Electronic Component. This invention was developed by Otomo Masayoshi.
The patent application number is CN20248061991 20241120..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has released SanDisk Technologies patent application for High Bandwidth Non-volatile Memory Device. This invention was developed by Higashitani Masaaki, Li Yanru, Yang Xiang and Dutta Deepanshu.
The patent application number is CN20258004794 20250127. The patent pu..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Microchip Technology has submitted a patent application for Locating EMS Unit Closest to Distress Signal Source and Notifying Approaching Personal Device. This invention was developed by Stoia Vito and Boiancourt Damien.
The patent application number is CN20248062584 20240402. The patent publication number..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Texas Instruments has submitted a patent application for Accelerated FFT Hardware. This invention was developed by Ramasubramanian Karthik, Carr Andrew, Pendharkar Anurag, B Kanish, Subburaj Karthik and Venkataraman Karthik.
The patent application number is CN20248058668 20241001. The patent publication nu..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- SanDisk Technologies has filed a patent application for Artificial Intelligence-based Intelligent Data Replication/backup for Data Storage Devices. This invention was developed by Zhang Wei H, Lew Chee Seng and Chan Thomas P.
The patent application number is CN20258004816 20250111. The patent publication num..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has received ASML Netherlands patent application for Height Measuring System. Scholz Christopher O and Scholz Stephen C developed the invention.
The patent application number is CN20248062135 20240905. The patent publication number is CN121941960 (A). International..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- ASML Netherlands has sought patent for Method for Designing Focus Target for Focus Metrology. This invention was developed by Bai Shufeng, Zhao Wangshi, Fu Jiyou, Whitson David H, Zhang Chenji and Li Pengcheng.
The patent application number is CN20248061625 20240904. The patent publication number is CN121941..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has published Loongson Technology patent application for Chip Test Circuit, Chip Test Method and Chip. The invention was developed by Luo Guitao, Hao Shouqing, Wang Zhongbo, Gao Guozhong and Feng Jiajie.
The patent application number is CN20251260970 20251231. The ..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- StarPower Semiconductor has applied Chinese patent for Processing Method of Plastic Package IC Chip. Sun Qing developed it.
The patent application number is CN202511981274 20251225. The patent publication number is CN121933906 (A). International Patent Classification code is G01R31/28. Cooperative Patent Cla..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Zhejiang University has submitted a patent application for Reconfigurable Multi-frequency-point High-precision Microwave Photonic Filter Based on Multi-channel Narrow-band Optical Filter Chip. Xie Yiwei, Zhang Wenqing and Dai Daoxin developed the invention.
The patent application number is CN20261025608 2026..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has released Taiwan Semiconductor Manufacturing patent application for Optical Package, Optical Structure and Method of Forming Same. This invention was developed by Zhou Chunpu, Guo Fengwei, Rusu Stefan and Li Zhichun.
The patent application number is CN2025120059..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Chengdu Haiguang Integrated Circuit Design has applied Chinese patent for Voltage Drop Detection Circuit, Adaptive Clock System, Chip and Electronic Equipment. Wang Wengen, Li Ning and Ran Sun developed it.
The patent application number is CN20261018397 20260107. The patent publication number is CN121933796 ..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has released Applied Materials Israel patent application for Measurement of Photocathode Current. This invention was developed by Mestzki Andrzej.
The patent application number is CN202511516074 20251022. The patent publication number is CN121933785 (A). Internatio..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- CMA Meteorological Observation Center has submitted a patent application for Fused Quartz Substrate Integrated Laser Radar Transmit-receive Optical Module and Adjusting Method. This invention was developed by Zhang Peng, Chen Yubao, Liu Jie, Zhang Shuai, Dai Yaru, Li Lu, Han Xu, Huang Anfan, Bu Zhichao and Wa..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has published Kunming Institute of Physics patent application for Method for Measuring Non-equilibrium Carrier Mobility of Semiconductor. The invention was developed by Wang Quanxiao, Zhao Wen, Li Yongliang, Jin Huisong, Wu Xiao, Zheng Yaozheng, Zou Yuxiao, Wang Qio..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- Beijing Xiaomi Mobile Software has submitted a patent application for Data Processing Method and Device, Storage Medium, Program Product and Chip System. Su Zhidao developed the invention.
The patent application number is CN202411515517 20241028. The patent publication number is CN121934797 (A). Internationa..
Semiconductor
| Fri 24 Jul 2026
Beijing, July 24 -- State Intellectual Property Office of China has received Beijing Zhenxing Metrology & Test Institute patent application for Tec Controller Chip Test System and Method. Zhao Bo, Chen Tan, Gao Ran and Zhang Houzheng developed the invention.
The patent application number is CN202511916585 20251218. The patent p..
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