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Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Shanghai Jiayi Information Tech Co Ltd has submitted a patent application for Low-altitude Channel Health Degree Assessment Method, System and Equipment Based on Lstm (long Short Term Memory). Li Hongyu, He Zhennong, Dong Ming, Yang Dongming, Zhang Xia, Zhang Yixiang and Li Shengye developed the invention. ..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- P & G Intellectual Property Company Ltd has submitted a patent application for Method and System for Producing Plurality of Rooted Cuttings from Plurality of Non-rooted Cuttings Without Aid of Substrate. This invention was developed by Steinberg Kevin, Reiner Stefan, Schimmelpfen Dirk and Klemm Peter. The p..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Yinuofei Suzhou Tech Co Ltd has filed a patent application for High-temperature-resistant Phase-change Nonvolatile Memory Device. This invention was developed by Guo Panlin and Shi Shu. The patent application number is CN202510469232 20250415. The patent publication number is CN120417748 (A). International ..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Guangdong Fozhixin Microelectronics Tech Research Co Ltd has applied Chinese patent for Piezoelectric Ceramic Chip Integrated Structure and Preparation Method Thereof. Hua Xiangang, Yang Bin and Wang Shihao developed it. The patent application number is CN202510417671 20250403. The patent publication number..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Shenzhen International Institute of Quantum Research and Hefei Nat Laboratory patent application for Silicon-based Quantum Device Based on Ge/gesi Planar Substrate Structure and Preparation Method Thereof. Tian Zhen, Wang Qiaoming, Hu Guangchong, Zhang Y..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has released Beijing Xinchi Semiconductor Tech Co Ltd patent application for Heterogeneous Chip Model Calling Method and Heterogeneous Chip. This invention was developed by Zhu Guohua. The patent application number is CN202510639299 20250516. The patent publicatio..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has released Shenzhen Mingqi Zixin Tech Co Ltd patent application for Camera Neural Network Chip Architecture System. This invention was developed by Liu Qingqing, Yu Yang, Jiang Yunchao and Liu Yun. The patent application number is CN202510474832 20250416. The pa..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Shenzhen Mingqi Zixin Tech Co Ltd has submitted a patent application for Artificial Intelligence Chip Architecture System. This invention was developed by Liu Qingqing, Jiang Yunchao, Liu Yun, Yu Yang and Zhang Tao. The patent application number is CN202510474829 20250416. The patent publication number is C..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Jinggong Shuzhi Beijing Tech Co Ltd patent application for Heterogeneous Calculation and Dynamic Model Updating Method and Device for Brain-like Chip and Medium. Xu Xiangsong developed the invention. The patent application number is CN202510437520 202..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- 720 Health Beijing Itech Health Co Ltd has filed a patent application for Electrochemical Type Air Protein Concentration Detection Device and Method Based on Nano-porous MEMS. This invention was developed by Diao Ke, Sun Yang, Si Xiaolei, Yu Hua, Xie Zichao, Wang Ganyu, Zhao Feixiang, Zhang Keqiang, Chen Jian,..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Shandong Industrial Tech Research Institute Qingdao has submitted a patent application for Submicron Wafer Manufacturing Process Defect Visual Verification Experiment Platform. Zhao Yubo, Pan Hongzhou, Li Jiaona and Xiao Han developed the invention. The patent application number is CN202510501694 20250421. ..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Zhongke Weifen Tech Development Beijing Co Ltd has submitted a patent application for Modified Silicon Dioxide Microsphere for High Performance Liquid Chromatography and Preparation Method Thereof. This invention was developed by Guo Baosheng. The patent application number is CN202510948771 20250710. The pa..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has published Chengdu Aiwei Microelectronic Tech Co Ltd patent application for Control Method and Control Circuit of Voltage Converter, Chip and Electronic Equipment. The invention was developed by Su Ziheng and Ji Xudong. The patent application number is CN202510..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has released Li Shuanglong patent application for Integrated Piezoelectric Driving Chip. The patent application number is CN202510580783 20250507. The patent publication number is CN120415122 (A). International Patent Classification codes are G01R19/00, H02M1/00,..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Zhejiang Yikong Power System Co Ltd patent application for Control Circuit Using Switching Power Supply Chip to Drive Disengagement Mechanism. Yang Ruijia, Ma Zhiqiang and Gao Yuan developed the invention. The patent application number is CN2025105563..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Affiliated Hospital Guizhou Med Univ has submitted a patent application for Polymyxin B-loaded Dendritic Silicon Dioxide Nanoparticles and Preparation Method Thereof. This invention was developed by Yang Chengli, Tan Lin, Li Na, Li Ming, Zhong Wen and Cao Yong. The patent application number is CN20231147731..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Xinyuan Semiconductor Shanghai Co Ltd and Xinyuan Semiconductor Hangzhou Co Ltd patent application for Non-volatile Memory Array, Method for Operating, Reading and Writing Non-volatile Memory Array, and Related Product. Zhou Yuliang and Lu Zhun developed..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Hangzhou Shuotian Tech Co Ltd has submitted a patent application for Analog Electrically Erasable Memory, Control Method and Micro-processing Chip. This invention was developed by Yao Jianhang, Yuan Zhiqiao, Zhang Shengai and Li Shiwei. The patent application number is CN202510424996 20250403. The patent pu..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Zhongtian Hongyu Integrated Circuit Co Ltd has sought patent for Programming Method of P-type Channel Flash Memory. This invention was developed by Nie Hong, Huang Jun and Zhang Nansheng. The patent application number is CN202510171572 20250217. The patent publication number is CN120412687 (A). Internationa..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Hangzhou Weina Hexin Electronic Tech Co Ltd has submitted a patent application for Memory Chip, Control Method and Memory Chip System. This invention was developed by Chen Peiyu, Liu Ying, Ye Le, Qu Xinyu and Yan Fengyun. The patent application number is CN202510668259 20250521. The patent publication numbe..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Hangzhou Beihang Univ International Innovation Institute Beihang Univ International Innovation Insti has submitted a patent application for Magnetic Memory Device and Information Storage Method. Yang Wei, Xu Yibo, Li Shen and Lin Xiaoyang developed the invention. The patent application number is CN202510913..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Shanghai Calcium Crystal Tech Co Ltd has submitted a patent application for Method for Testing Thickness Uniformity of Adhesive Film After Packaging of Perovskite Solar Cell. This invention was developed by Wang Xueliang and Lu Zhiqing. The patent application number is CN202510525504 20250424. The patent pu..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has released Wuxi Boda Xinneng Tech Co Ltd patent application for Perovskite Thin Film and Preparation Method Thereof, Perovskite Solar Cell and Laminated Cell. This invention was developed by Wang Ying and Qian Zongyao. The patent application number is CN20251090..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Shenzhen Research Institute Of Shandong Univ has sought patent for Method for Preparing Solar Cell by Using Green Solvent and Green Additive. This invention was developed by Gao Ke, Sun Yanna, Xu Huajun, Kan Yuanyuan and Zhang Xu. The patent application number is CN202510669545 20250523. The patent publicat..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Univ Shenzhen Polytechnic patent application for Perovskite Solar Cell and Preparation Method Thereof. Hu Hanlin and Sun Yonggui developed the invention. The patent application number is CN202510801828 20250616. The patent publication number is CN1204..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has released BOE Huacan Optoelectronics Guangdong Co Ltd patent application for Miniature Light Emitting Diode Chip and Preparation Method Thereof. This invention was developed by Lan Ye, Wang Jiangbo, Zhu Guangmin, Wu Zhihao and Zhang Wei. The patent application ..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Xinyi New Energy Tech Quzhou Co Ltd patent application for Solar Cell, Preparation Method of Solar Cell and Photovoltaic Module. Ni Zhirong developed the invention. The patent application number is CN202510553500 20250429. The patent publication numbe..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has published Beijing Shengyang Tech Development Co Ltd patent application for Copper-indium-gallium-selenium Thin Film Solar Cell with Flexible Substrate and Preparation Method Thereof. The invention was developed by Zhang Ning. The patent application number is C..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Beijing Shengyang Tech Development Co Ltd has submitted a patent application for Copper-indium-gallium-selenium Thin-film Solar Cell with Flexible Polyimide Substrate and Preparation Method Thereof. This invention was developed by Zhang Ning. The patent application number is CN202510531030 20250425. The pat..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has published Jinko Solar Holding Co Ltd and Jinko Energy Haining patent application for Solar Cell and Method for Manufacturing Solar Cell. The invention was developed by Zhang Xinyu, Pan Wanting, Yang Haibin, Xu Menglei, Liao Hui, Zheng Peiting and Yang Jie. The..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has published Zhongke Hongxin Changzhou Sensing Tech Co Ltd patent application for Method for Preparing CZT Radiation Chip with High Energy Resolution. The invention was developed by Dong Minghui and Sun Shiwen. The patent application number is CN202510913356 2025..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Zhongsheng Micro Taixing Prec Manufacturing Co Ltd patent application for Chain Type Silicon Wafer Psg Layer Removing Equipment. Zhang Jianzhong developed the invention. The patent application number is CN202510619905 20250514. The patent publication ..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Yangzhou Artes Solar Battery Co Ltd and Yangzhou Atesi Photoelectric Mat Co Ltd patent application for Preparation Method of Solar Cell, Solar Cell and Photovoltaic Module. Mao Jie and Liu Libing developed the invention. The patent application number ..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Suzhou Yidong Xinneng Tech Co Ltd has applied Chinese patent for Preparation Method of Aluminum Grid on Solar Silicon Wafer. Zhong Meizhou developed it. The patent application number is CN202410125560 20240130. The patent publication number is CN120417521 (A). International Patent Classification codes are H..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has released Huahong Semiconductor Mfg Wuxi Co Ltd and Huahong Semiconductor, Wuxi patent application for CMOS Image Sensor for Improving White Pixel and Manufacturing Method Thereof. This invention was developed by Wei Zhenggang, Li Pucai, Zhang Guangbing and Du Min..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has released Jinko Energy Haining and Jinko Solar Holding Co Ltd patent application for Back Contact Solar Cell and Laminated Cell. This invention was developed by Liao Hui, Pan Wanting, Chen Danshuo, Liu Jiaxin, Wen Dongfang, Xu Menglei, Yang Jie and Zhang Xinyu. ..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has released Diodes Taiwan Inc patent application for Electrostatic Discharge Protection Structure, Semiconductor Power Device and Manufacturing Method of Semiconductor Power Device. This invention was developed by Guo Dachuan, Hu Jiawei and Ge Wanyu. The patent a..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has published Shanghai Yijing Microelectronic Tech Co Ltd patent application for Automatic Gain Control Test Circuit of Infrared Receiving Chip. The invention was developed by Liang Tianyi and Yang Yue. The patent application number is CN202510912464 20250703. The..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has published Hangzhou Zhongke Yixin Microelectronics Tech Co Ltd patent application for Radio Frequency Chip Testing Method. The invention was developed by Yin Li, Xue Chuan and Kang Li. The patent application number is CN202510611312 20250513. The patent publica..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Anhui University has submitted a patent application for Hybrid Modal Federated Learning Method and System Based on Modal Decoupling and Modal Memory. This invention was developed by Hu Guyue, Song Siyuan, Yuan Duzhi, Yu Changjiu, Li Chenglong and Tang Jin. The patent application number is CN202510482694 202..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Ningbo Qingyun Chuangxin Tech Co Ltd has sought patent for Method for Automatically Generating MOS (metal Oxide Semiconductor) Transistor Layout with Standard Cell Structure. This invention was developed by Chang Cheng, Zhou Tianjia, Yang Junjie, Ji Zexin and Huang Li. The patent application number is CN202..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has released Ningbo Biangxin Tech Co Ltd patent application for Stackable Thermal Modeling Method for 3D Integrated Circuit and Storage Medium. This invention was developed by Yi Longbin, Meng Xiangqiao, Zhang Yiming and Feng Qi. The patent application number is C..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Chengdu Nanfei Microelectronics Co Ltd has applied Chinese patent for Uvm Automatic Verification Method for Chip to Load External Memory Function. Zhang Gaoming, Li Xianwei, Cao Gan and He Yuxin developed it. The patent application number is CN202510905380 20250702. The patent publication number is CN120409..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Wuhan Lingjiu Microelectronics Co Ltd has applied Chinese patent for SOC Chip Pin Multiplexing Function Test Circuit and Test Method. Xia Yazhou and Fan Shi developed it. The patent application number is CN202510581821 20250507. The patent publication number is CN120405394 (A). International Patent Classifi..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Zhuhai Siliconcore Tech Co Ltd has submitted a patent application for Test Method and Device of Integrated Circuit Based on Efpga Circuit. Zhao Yi, Zou Haiquan, Fu Lu, Huang Jieying, Li Shaobai, Mo Xiaolin, Chen Yuwen and Hu Kunmei developed the invention. The patent application number is CN202510929472 202..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has released Sanhai Intelligent Equipment Guangzhou Co Ltd patent application for Clamp for Wafer Aging Test. This invention was developed by Li Junming and Wu Ma. The patent application number is CN202510801958 20250616. The patent publication number is CN1204053..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Zhenhe Tech Jiangsu Co Ltd has filed a patent application for Chip Aging Test Method and System Based on Thermal Migration Analysis. This invention was developed by You Li, He Junming, Gao Xiansheng and Cao Ziyan. The patent application number is CN202510733405 20250604. The patent publication number is CN1..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Wuhan Elite Optoelectronics Co Ltd patent application for Junction Temperature Testing Method and System for Laser Diode Chip. Li Shuang and Luo Xi developed the invention. The patent application number is CN202510907947 20250702. The patent publicati..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received North China Electric Power University and Zhuhai Power Supply Bureau Guangdong Power Grid Co Ltd patent application for Power Semiconductor Device Test System and Method. Zhang Yihao, Chen Yong, Zhao Bin, Cheng Xu, Zhao Zhibin, Chen Jianfu, Sun Peng, Gao..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has published Nuclear Industry Huzhou Survey and Design Inst Co Ltd patent application for Soil Sample Pretreatment Method and Soil Total Silicon Determination Method. The invention was developed by Shen Chunyi, Yao Yahong, Guan Yan, Wang Chengzhi, Liu Lifang, Yuan W..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Changzhou Luopanxing Detection Tech Co Ltd has filed a patent application for Novel Ultra-low Silicon Content Testing System. This invention was developed by Zhu Bo and Yang Sheng. The patent application number is CN202510622993 20250515. The patent publication number is CN120404614 (A). International Paten..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Beijing Fanzhouhuanneng Tech Development Co Ltd has submitted a patent application for Preparation Method of Afm-s Active Silicon Filter Material. This invention was developed by Su Zhenguo, Huang Shukui, Xu Wenhui and Jiang Hongjie. The patent application number is CN202510365289 20250326. The patent publi..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Tianshui Tianguang Semiconductor Co Ltd has sought patent for Analog Switch Chip. This invention was developed by Pu Yaochuan, Li Huihui, Lu Yu, Li Long, Li Qi, Qiang Zhaojun, Zhang Zhiqi, Yan Lifeng, Li Yinglong and Li Wenjun. The patent application number is CN202510544939 20250428. The patent publication..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Chongqing Jixin Technology Co Ltd has submitted a patent application for Complementary Metal Oxide Semiconductor (CMOS) Complementary Sampling Switch and CMOS Complementary Sampling Switch Control Method. This invention was developed by Yang Tiancong, Lei Langcheng, Gao Weiqi, Hu Yongfei, Wang Zhongyan, Du Yub..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has published Shenzhen World Ind Co Ltd patent application for Method and System for Reducing Threshold Voltage of MOS (metal Oxide Semiconductor) Tube. The invention was developed by Zhang Dinghua and Li Feng. The patent application number is CN202510447659 20250..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Fengtiao Tech Co Ltd has submitted a patent application for High-voltage Integrated Circuit and Electronic Equipment. This invention was developed by Hu Shuyun, Xiong Long, Zhang Feng, Lee Jun-yeob, Bi Lei and Bi Chao. The patent application number is CN202510334286 20250320. The patent publication number i..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Shanghai Sillumin Semiconductor Co Ltd has submitted a patent application for Driving Control Circuit, Power Switch Chip and Electronic Equipment. This invention was developed by Hu Jintong, Shao Bin and Liu Tao. The patent application number is CN202510303982 20250314. The patent publication number is CN12..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Taiwan Semiconductor Co Ltd has submitted a patent application for Photoinduction Zero-point Trigger Bidirectional Thyristor Circuit and Zero-point Trigger Circuit. This invention was developed by Hong Juanyu. The patent application number is CN202410363622 20240328. The patent publication number is CN12041..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Shenzhen Amb Optoelectronics Tech Co Ltd has filed a patent application for Deep Learning-based Silicon Controlled Rectifier Dimming Circuit Zero Crossing Point Detection Method and System. This invention was developed by Liu Fangrong, Zheng Yibo, Chen Siyuan and Wei Xian. The patent application number is C..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Shenzhen Xinshijue Tech Co Ltd patent application for Vehicle-mounted Camera Chip Neural Network Fault Diagnosis Method and Self-repairing Redundant Circuit. Xu Chen and Xiao Jianping developed the invention. The patent application number is CN2025104..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Jinko Solar Holding Co Ltd has sought patent for Data Analysis Task Execution Method, Device and Equipment of Battery Silicon Wafer, Storage Medium and Product. This invention was developed by Zheng Jingming, Mao Jie, Wang Zhao, Yang Jie, Zheng Peiting and Zhang Xinyu. The patent application number is CN202..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has published Shanghai Jiao Tong University and Shenzhen Hopewind Electric Corporation patent application for Online Junction Temperature Calculation System and Method for Power Semiconductor Device. The invention was developed by Ma Ke, Chen Shuangzhe, Cai Xu, Zhou ..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has published Zhejiang Hangke Instr Co Ltd patent application for Automatic Aging Equipment for Semiconductor. The invention was developed by Guo Jing, Cao Ji and Li Linjie. The patent application number is CN202410137301 20240201. The patent publication number is..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has published Beijing Smartchip Microelectronics Technology and State Grid Hebei Electric Power Supply Co Ltd Electric Power Res Inst patent application for Current Sensing Chip and Manufacturing Method. The invention was developed by Liu Ziwei, Du Jun, Li Tenghao, L..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Maxone Semiconductor Shanghai Co Ltd has submitted a patent application for Multilayer Glass Substrate and Preparation Method Thereof. This invention was developed by Yu Haichao, Hou Keyu and Shao Yu. The patent application number is CN202510480014 20250417. The patent publication number is CN120405194 (A)...

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Haoji Zhuhai Semiconductor Co Ltd has submitted a patent application for Probe for Packaging and Testing Chip or Packaging Substrate and Preparation Process of Probe. This invention was developed by Lu Zibin. The patent application number is CN202510332022 20250319. The patent publication number is CN120405..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Semiconductor Mfg International Shanghai Co Ltd has submitted a patent application for Formation Method of Semiconductor Structure. This invention was developed by Ma Yecheng, Wang Liujian and Tan Cheng. The patent application number is CN202410117712 20240126. The patent publication number is CN120417469 (..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Beijing Qingyun Tech Co Ltd has submitted a patent application for Stacked Chip. This invention was developed by Zhao Ruyue. The patent application number is CN202510838335 20250620. The patent publication number is CN120417466 (A). International Patent Classification codes are H10B80/00 and H10D80/30. Coop..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Wuxi Kuangtong Semiconductor Co Ltd has sought patent for Preparation Method of Super-junction Semiconductor Device. This invention was developed by Zhao Yong and Liao Wei. The patent application number is CN202510705325 20250529. The patent publication number is CN120417453 (A). International Patent Classi..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Hangzhou Puxiguangjing Semiconductor Technology Co Ltd has filed a patent application for Irradiation-reinforced Sic Super-junction MOS Structure and Preparation Process Thereof. This invention was developed by Xu Yili, Li Xin and Yang Qi. The patent application number is CN202510906089 20250702. The patent..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Wuxi Nce Power Co Ltd patent application for Double-groove Type Silicon Carbide Field Effect Transistor Device and Preparation Method Thereof. Zhu Yuanzheng, Zhu Chenkai, Yang Zhuo, Huang Xuequan and Ye Peng developed the invention. The patent applica..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Jiangsu Changjing Tech Co Ltd has submitted a patent application for Preparation Method of Semiconductor Structure. This invention was developed by Rui Qiang, Yang Guojiang, Yan Yilin and Liu Jianhua. The patent application number is CN202510920094 20250704. The patent publication number is CN120417413 (A)...

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Hefei Ruike Micro Electronic Co Ltd has applied Chinese patent for Manufacturing Method and Structure of Integrated Memory Chip. Chen Chaoyang, Zhao Liang and Lyu Zhichao developed it. The patent application number is CN202510565432 20250430. The patent publication number is CN120417396 (A). International P..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Hangzhou Beihang Univ International Innovation Institute Beihang Univ International Innovation Insti has submitted a patent application for Magnetic Memory Device Based on Multiferroic Heterojunction and Information Storage Method. This invention was developed by Yang Wei, Xu Yibo, Li Shen and Lin Xiaoyang. ..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Huahong Semiconductor Mfg Wuxi Co Ltd and Huahong Semiconductor, Wuxi patent application for Integrated Process Method for Regulating and Controlling Morphology of Polycrystalline Silicon. Hu Dalong, Chen Hao, Dong Jun, Jin Pei and Ju Biyu developed the ..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Eyeone Innovation Co Ltd has filed a patent application for Memory Device, Integrated Circuit, and Method of Operating Memory Device. This invention was developed by Seo Duck Hoon. The patent application number is CN202410137306 20240131. The patent publication number is CN120417380 (A). International Paten..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Shanghai Boluosi New Material Tech Co Ltd has filed a patent application for Transparent Polyimide Substrate Copper Foil Composite Material and Preparation Method Thereof. This invention was developed by Xu Hao and Xu Xinyi. The patent application number is CN202510291934 20250312. The patent publication nu..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Tianjin Lianqi Tech Co Ltd has applied Chinese patent for Industrial Circuit Board Intelligent Repairing Method and System Based on Lossless Damping Chip. Gao Haibao developed it. The patent application number is CN202510824779 20250619. The patent publication number is CN120417253 (A). International Patent..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Shenzhen Boardtech Co Ltd patent application for Anti-diffusion Agent for PCB Glass Substrate as Well as Preparation Method and Application of Anti-diffusion Agent. Wei Jinyu, Liu Jiang, Chen Hong and Huang Lianfeng developed the invention. The patent..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Beijing Haichuang Microchip Tech Co Ltd has sought patent for Printed Circuit Board and Preparation Method Thereof. This invention was developed by Liu Yanchun, Lu Yuan, Yan Yuepeng, Yu Xinyuan, Wang Penghui, Ding Yan and Zhao Hanyang. The patent application number is CN202510534881 20250427. The patent pub..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has released SK Hynix Memory Solutions Inc patent application for Peripheral Component Interconnect High Speed Over Fabric Network. This invention was developed by Karwitz Gunnar. The patent application number is CN20238089311 20231130. The patent publication numb..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Beijing Haichuang Microchip Tech Co Ltd has filed a patent application for Multilayer Circuit Board and Preparation Method Thereof. This invention was developed by Liu Yanchun, Lu Yuan, Yan Yuepeng, Yu Xinyuan, Wang Penghui, Ding Yan and Zhao Hanyang. The patent application number is CN202510535034 20250427..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Shanghai Anbang Semiconductor Equipment Co Ltd patent application for Induction Coil Structure Adjusting Assembly and Plasma Processing Equipment. Xiang Lang, Li Ke, Wang Zhaoxiang, Tu Leyi and Liang Jie developed the invention. The patent application..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Hangzhou Zhongxin Wafer Semiconductor Co Ltd has submitted a patent application for Device and Method for Improving Accuracy of Flatness Test of High-resistance Wafer. This invention was developed by Zhang Qian. The patent application number is CN202510393157 20250331. The patent publication number is CN120..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Hefei Liujiaoxing Semiconductor has applied Chinese patent for Video Transmission Method, Electronic Device, Storage Medium and Program Product. Shu Jiemin, Wang Tao, Zhang Lei, Wang Jie and Du Chenjian developed it. The patent application number is CN202510640049 20250519. The patent publication number is ..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Lisheng Automotive Tech Guangzhou Co Ltd has filed a patent application for Vehicle-mounted Chip Safe Starting Method and Device and Computer Program Product. This invention was developed by Chen Quanlei. The patent application number is CN202510466380 20250415. The patent publication number is CN120408636 ..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Hebei Tongguang Semiconductor Co Ltd has filed a patent application for Maintenance Method for Improving Performance of Silicon Carbide Cleaning Brush Head. This invention was developed by Cui Jingguang, Zheng Xiangguang, Tang Huan, Zhang Xiaoyun and Li Qingxuan. The patent application number is CN202510933..

Semiconductor

  |  Wed 04 Feb 2026

Beijing, Feb. 4 -- Yangzhou Baoamac Electronic Co Ltd has sought patent for Chip Detecting and Sorting Equipment for Oven Intelligent Timer and Process of Chip Detecting and Sorting Equipment. This invention was developed by Xia Lei. The patent application number is CN202510668381 20250523. The patent publication number is CN..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Jiechuang Semiconductor Suzhou Co Ltd and Jiangxi Jiechuang Semiconductor Co Ltd patent application for High-speed Anti-crosstalk Integrated Chip and Manufacturing Method Thereof. Zhu Jintian developed the invention. The patent application number is C..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Jiangsu Huaxing Telecom Tech Co Ltd has submitted a patent application for Impedance Compensation Structure of Low-loss N-type Connector. Zhang Xiaogang developed the invention. The patent application number is CN202510417693 20250403. The patent publication number is CN120414173 (A). International Patent C..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has released BOE Technology Group and Beijing BOE Technology Development patent application for Driving Backboard, Light-emitting Substrate and Display Device. This invention was developed by Guo Kang, Chen Hong, Li Shulei and Gu Xin. The patent application number..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has released Ling Peiching patent application for Semiconductor Structure and Memory Device and Method of Manufacturing Same. This invention was developed by Ling Peiching, Wu Nanlei and Yao Liangji. The patent application number is CN20238087686 20231219. The pat..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Sichuan Haixinwei Tech Co Ltd has filed a patent application for Transition Structure from Radio Frequency Chip to Substrate Integrated Waveguide and Application Method. This invention was developed by Ye Hongwang, Wu Jie, Cui Bohua, Li Yihu, Deng Xiaodong, Zhou Junfeng, Du Yun, Chen Yen-hung, Chen Junhong and..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Southeast China Research Institute Of Application Magnetics No. 9 Research Institute Of China Electro has sought patent for Composite Substrate for Terahertz Waveguide Difference Phase Shift Circulator and Preparation Method Thereof. This invention was developed by Ming Bohui, He Qing, Wang Qingqing and Qu Don..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Anstem Co Ltd patent application for Power Semiconductor Device. Tanaka Shintaro, Tokuyama Takeshi, Nagasaki Masanori, Asai Kyota and Shimura Takahiro developed the invention. The patent application number is CN20238078766 20230824. The patent publica..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Valeo Electriques SAS has filed a patent application for Power Module Comprising Power Chip, Substrate and Cooling Block. This invention was developed by Lewandowski Marek. The patent application number is CN20238086110 20231215. The patent publication number is CN120418958 (A). International Patent Classif..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has published Advanced View Tech Inc patent application for Separation System of Light Emitting Diode Device and Separation Method of Light Emitting Diode Device. The invention was developed by Li Qingyuan and Park Ji-eun. The patent application number is CN202380..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has released Mmt Co Ltd patent application for Bypass-type Semiconductor Manufacturing By-product Trapping Device. This invention was developed by Cha Il-soo and Kim Yong-yun. The patent application number is CN20238088465 20231211. The patent publication number i..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- State Intellectual Property Office of China has received Foshan Junying Env Energy Equipment Co Ltd patent application for Silicon Negative Electrode CVD (chemical Vapor Deposition) and Carbon Coating Equipment and Continuous Mass Production Method. Wang Xiongying, Wang Dongyang and Huang Wenwei developed the ..

Semiconductor

  |  Tue 03 Feb 2026

Beijing, Feb. 4 -- Pingtouge Shanghai Semiconductor Technology Co Ltd has applied Chinese patent for Packaging Structure, Acceleration Unit and Chip. Chen Yanbin, Liu Bowen, Xu Bo, Pang Tingting and Liu Huan developed it. The patent application number is CN202510254349 20250304. The patent publication number is CN120413578 (A..
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