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Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has published Tokyo Electron patent application for Semiconductor Device Fabrication Method and Semiconductor Device Fabrication System. The invention was developed by Matsuoka Ryotaro, Yamashita Yohei and Miyagi Yusuke.
The patent application number is WO2024JP30458 ..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has published Micron Technology patent application for Deferred Die Data Rebuilding upon Die Failure Detection. The invention was developed by Li Juane, Hong Wenchi and Wei Yue.
The patent application number is WO2024CN115553 20240829. The patent publication number is..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has published Tokyo Electron patent application for Substrate Processing Method and Substrate Processing System. The invention was developed by Asahi Yuichi and Iizuka Yoji.
The patent application number is WO2025JP29022 20250819. The patent publication number is WO20..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has published Fujifilm patent application for Lithographic Printing Plate Precursor, Manufacturing Method for Lithographic Printing Plate, and Printing Method. The invention was developed by Hatanaka Yusuke.
The patent application number is WO2025JP28597 20250813. The..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has published Honor Device patent application for Method for Controlling Internet Access Service, Electronic Device, Storage Medium, and Chip. The invention was developed by Shao Lei, Shi Lei and Zhang Guanghua.
The patent application number is WO2025CN94937 20250514...
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has published PSK Holdings patent application for Substrate Processing Apparatus. The invention was developed by Sul Bong Ho, Lee Seock Hwi, Kim Ji Hoon, Na Jun Young, Yoon Sung Jin and Jeon Jin Pyo.
The patent application number is WO2025KR10987 20250724. The patent ..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has published Micron Technology patent application for Read Lookahead Activation in a Memory System. The invention was developed by Gohain Nitul.
The patent application number is WO2025US42799 20250820. The patent publication number is WO2026050065 (A1). International..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has published Applied Materials patent application for Slurry Delivery Method. The invention was developed by Soundararajan Hari, Chang Shou-sung, Wu Haosheng, Tang Jianshe and Fujikawa Takashi.
The patent application number is WO2025US41155 20250807. The patent publi..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has published Applied Materials patent application for Finding Substrate Notch on Substrate in a Chemical Mechanical Polishing System. The invention was developed by Wong Justin Ho Kuen, Chen Tom C and Augason Emily.
The patent application number is WO2025US40968 2025..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has published Microchip Technology patent application for Method of Decommissioning a Solid-state Drive. The invention was developed by Yang Nian Niles, Shukla Pitamber, Yelisetti Srinivas and Belhadj Mohamed Hichem.
The patent application number is WO2024US54841 2024..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Nanjing University of Posts and Telecommunications has submitted a patent application for Carbazole Derivative Monomolecular Layer, Preparation Method Therefor, Transistor Memory and Fabrication Method Therefor. This invention was developed by Zhang Guangwei, Zhu Jincheng, Zhang Yue, Zhang Yong, Shi Le, Bian ..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has received Micron Technology patent application for Journal Update Prior to Logical-to-physical Memory Address Update. Tian Dahai and You Yunfei developed the invention.
The patent application number is WO2024CN115367 20240829. The patent publication number is WO202..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has received Semiconductor Energy Laboratory patent application for Semiconductor Device. Fujita Masashi, Yakubo Yuto and Tsuda Kazuki developed the invention.
The patent application number is WO2025IB58514 20250825. The patent publication number is WO2026047502 (A1)...
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has received Beijing NAURA Microelectronics Equipment patent application for Process Parameter Determination Method and Apparatus, and Semiconductor Process Device. Du Jiajia, Wang Jing, Lei Hua, Lei Xing and Chai Jiale developed the invention.
The patent application ..
Semiconductor
| Tue 10 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has received Applied Materials patent application for Interposer Devices Having Multiple Sets of Components Formed Thereon. Chiruvolu Shivkumar, Bhansali Ameet S and Verhaverbeke Steven developed the invention.
The patent application number is WO2025US43400 20250825. ..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has received Micron Technology patent application for Buffers Configured for Individual Submission Queues in Communications Between a Memory Sub-system and a Host System. Bert Luca developed the invention.
The patent application number is WO2025US42638 20250819. The p..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- World Intellectual Property Organization has received Applied Materials patent application for Plasma Generator and Injector Assembly for a Processing Chamber, and Related Methods. Sowwan Mukhles, Lau Shu-kwan, Chandrashekar Abhishek Kallmakki, Dhamodharan Raja Murali, Thomas Shawn, Chopra Saurabh, Ulloa Erne..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Oscillation Circuit and Control Method of Oscillation Frequency. This invention was developed by Homma Ryutaro.
The patent application number is WO2025JP24226 20250704. The patent publication number is WO2026048290 (A1). Intern..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Murata has submitted a patent application for Power Module. Tange Takayuki, Izumi Danya, Miyata Shohei and Muto Takami developed the invention.
The patent application number is WO2025JP26506 20250725. The patent publication number is WO2026048364 (A1). International Patent Classification codes are H01F17/0..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Semiconductor Energy Laboratory has sought patent for Semiconductor Device and Method for Manufacturing Semiconductor Device. This invention was developed by Yamazaki Shunpei, Jinbo Yasuhiro, Miyairi Hidekazu and Kakehata Tetsuya.
The patent application number is WO2025IB58516 20250825. The patent publicatio..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Wuhan China Star Optoelectronics Technology has sought patent for Array Substrate and Display Panel. This invention was developed by Li Zhuang, Xiong Wenhui, Ai Fei and Song Dewei.
The patent application number is WO2024CN129199 20241101. The patent publication number is WO2026044903 (A1). International Pate..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- BOE Technology Group has sought patent for Display Substrate and Preparation Method Therefor, and Display Apparatus. This invention was developed by Wang Tao, Hou Rui, Sun Tao, Yu Xingxing, Chen Dengyun, Liu Zheng and Shi Shiming.
The patent application number is WO2024CN115489 20240829. The patent publicati..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Micron Technology has sought patent for Random Host Reads Using Independent Read Commands on Multiple Planes. This invention was developed by Lin Yutong, Ye Hui, Li Zeng, Zhen Dirk and Xu Shenghao.
The patent application number is WO2024CN115466 20240829. The patent publication number is WO2026044581 (A1). I..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Guangdong OPPO Mobile Telecommunications has sought patent for Communication Method and Apparatus, Device, Chip and Storage Medium. This invention was developed by Lu Qianxi, Leng Bingxue and Yu Xinlei.
The patent application number is WO2024CN114635 20240826. The patent publication number is WO2026044461 (A..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- National Institute of Advanced Industrial Science and Technology has sought patent for Semiconductor Device and Method for Fabricating Semiconductor Device. This invention was developed by Ji Shiyang, Kojima Kazutoshi, Kosugi Ryouji and Sometani Mitsuru.
The patent application number is WO2025JP27734 2025080..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Tokyo Electron has sought patent for Plasma Processing Device and RF Generator. This invention was developed by Torii Natsumi.
The patent application number is WO2025JP29003 20250819. The patent publication number is WO2026048593 (A1). International Patent Classification code is H05H1/46.
An abstract relea..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Sony Group has sought patent for Backlight Substrate and Display Device. This invention was developed by Ichikawa Hiroaki, Fukuda Shogo, Gocho Yusuke, Yamasaki Hiroto and Chiwata Akino.
The patent application number is WO2025JP28769 20250815. The patent publication number is WO2026048552 (A1). International ..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- LG Chem has sought patent for Glass Substrate Metallization Process, Glass Substrate Manufacturing Process Comprising Same, and Metallized Glass Substrate. This invention was developed by Choi A Nam, Kwon Oh Tak, Ryu Sanguk, Jung Dae Chul and Yoo Sangmoon.
The patent application number is WO2025KR01436 20250..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Vanchip Tianjin Technology has sought patent for Packaging Structure for Chip Module and Packaging Method Therefor. This invention was developed by Hong Shengping.
The patent application number is WO2025CN111777 20250731. The patent publication number is WO2026045815 (A1). International Patent Classification..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Applied Materials has sought patent for Electrostatic Platen Cleaning Detection System and Method. This invention was developed by Ishizaka Taichiro and Matsubara Daisuke.
The patent application number is WO2025US36817 20250708. The patent publication number is WO2026049866 (A1). International Patent Classif..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Apple has sought patent for Multiple Chip Versions from Integrated Design Process. This invention was developed by Kelm John H and Gupta Rohit K.
The patent application number is WO2025US34073 20250618. The patent publication number is WO2026049838 (A1). International Patent Classification codes are G06F15/7..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Microchip Technology has sought patent for Transistor and Method for Manufacturing Same. This invention was developed by Isukapati Sundar, Odekirk Bruce and Pandey Shesh.
The patent application number is WO2025US17667 20250227. The patent publication number is WO2026049786 (A1). International Patent Classifi..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Micron Technology has sought patent for Early Use of Rain in Read Error Handling Process. This invention was developed by Li Juane and Hong Wenchi.
The patent application number is WO2025US41626 20250812. The patent publication number is WO2026050000 (A1). International Patent Classification codes are G11C16..
Semiconductor
| Tue 10 Mar 2026
Geneva, March 10 -- Applied Materials has sought patent for Oxide Film Deposition Using Oxygen Free Plasma. This invention was developed by Zhao Kent Qiujing, Xie Bo, Lu Rui, Lu Xinyi, Cheng Ya Yun, Tsiang Michael Wenyoung, Lee Ming-jer, Lang Chi-i, Xia Li-qun, Padhi Deenesh and Venkataraman Shankar.
The patent application numb..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Murata has submitted a patent application for Sensitive Membrane. This invention was developed by Sato Ryutaro.
The patent application number is WO2025JP28688 20250814. The patent publication number is WO2026048539 (A1). International Patent Classification code is G01N27/12.
An abstract released by the..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Canon has submitted a patent application for Organic Compound and Organic Light-emitting Element. This invention was developed by Tanaka Akane, Takahashi Hideaki, Tani Yutaka and Demura Seiya.
The patent application number is WO2025JP29312 20250821. The patent publication number is WO2026048647 (A1). Inter..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- ROHM has submitted a patent application for Semiconductor Light-emitting Device. Kondo Okimoto developed the invention.
The patent application number is WO2025JP29499 20250822. The patent publication number is WO2026048686 (A1). International Patent Classification codes are H01S5/02234, H01S5/02255, H01S5/..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Panasonic Intellectual Property Management has submitted a patent application for Chip Resistor. Yamashita Yudai, Ito Hirokatsu and Nakayama Shogo developed the invention.
The patent application number is WO2025JP29855 20250826. The patent publication number is WO2026048777 (A1). International Patent Class..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Fujifilm has applied WIPO patent for Etching Solution, Substrate Processing Method, and Semiconductor Device Manufacturing Method. Takahashi Kazutaka, Takahashi Tomonori, Miyazaki Kosuke and Ohtsu Akihiko developed it.
The patent application number is WO2025JP28537 20250812. The patent publication number is ..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Huawei Technologies has applied WIPO patent for Optical Chip and Display Device. Huang Yi Jui and Cui Hao developed it.
The patent application number is WO2025CN104120 20250626. The patent publication number is WO2026045554 (A1). International Patent Classification code is H10H20/84.
The abstract of the pa..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Fujifilm has applied WIPO patent for Method for Manufacturing Bonded Body, Method for Manufacturing Semiconductor Member, Photosensitive Resin Composition, Laminate, Semiconductor Member, and Resin Composition. Yamashita Kosuke developed it.
The patent application number is WO2025JP29712 20250825. The patent..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- ASML Netherlands has applied WIPO patent for Metrology Method and Associated Metrology and Exposure Apparatuses. Tinnemans Patricius, Mehta Nikhil and Roscher Dietrich developed it.
The patent application number is WO2025EP70654 20250718. The patent publication number is WO2026046586 (A1). International Pate..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Microchip Technology has applied WIPO patent for Transistor and Method for Manufacturing Same. Isukapati Sundar, Odekirk Bruce, Pandey Shesh and Dorman George developed it.
The patent application number is WO2025US17765 20250228. The patent publication number is WO2026049789 (A1). International Patent Classi..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Microchip Technology has applied WIPO patent for Transistor and Method for Manufacturing Same. Isukapati Sundar, Odekirk Bruce, Pandey Shesh and Dorman George developed it.
The patent application number is WO2025US17683 20250227. The patent publication number is WO2026049787 (A1). International Patent Classi..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- LG Innotek has applied WIPO patent for Circuit Board and Semiconductor Package. Lee Jong Min and Paik Jee Heum developed it.
The patent application number is WO2025KR11403 20250731. The patent publication number is WO2026049326 (A1). International Patent Classification codes are H05K1/03, H05K1/11, H05K3/28 ..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Micron Technology has applied WIPO patent for Multiplexing for Memory Packages with Buffer Die and Modules with Same. Rooney Randall J, Prather Matthew A, Veches Anthony D, Lashkarian Navid, O'leary James J and Ayyapureddi Sujeet developed it.
The patent application number is WO2025US40939 20250806. The pate..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Micron Technology has applied WIPO patent for Memory Packages with Additional Redundant Storage. Rooney Randall J, Prather Matthew A, Lahkarian Navid, Veches Anthony D and Ayyapureddi Sujeet developed it.
The patent application number is WO2025US40932 20250806. The patent publication number is WO2026049956 (..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Applied Materials has applied WIPO patent for Flexible Element for a Substrate Processing Chamber. Ummethala Upendra, Alayavalli Kaushik, Nayfeh Samir, Nguyen Tuan Anh, Basavarajaiah Somashekar Vishwas, Hattangadi Amit, Rajendran Hari Prasath and Somanahalli Malleshappa Chethan developed it.
The patent appli..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Micron Technology has applied WIPO patent for Dynamic Management of Buffers for Submission Queues in Communications Between a Memory Sub-system and a Host System. Bert Luca developed it.
The patent application number is WO2025US42641 20250819. The patent publication number is WO2026050044 (A1). International..
Semiconductor
| Tue 10 Mar 2026
Geneva, March 10 -- Lam Research has applied WIPO patent for Cyclic Gapfill with Selective Etch. Imade Mamoru, Agarwal Pulkit and Baker Jonathan Grant developed it.
The patent application number is WO2025US44028 20250828. The patent publication number is WO2026050554 (A1). International Patent Classification codes are C23C16/04..
Semiconductor
| Tue 10 Mar 2026
Geneva, March 10 -- Micron Technology has applied WIPO patent for Scheduling Scan Operations in Memory Sub-systems. Liu Yang, Shen Zhenlei, Lee Aaron, Wei Yue, Zou Xiaoxin and Peh Woei Chen developed it.
The patent application number is WO2025US43795 20250827. The patent publication number is WO2026050416 (A1). International Pa..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Semiconductor Energy Laboratory has submitted a patent application for Storage Device. This invention was developed by Inoue Hiroki, Matsuzaki Takanori and Hamada Toshiki.
The patent application number is WO2025IB58512 20250825. The patent publication number is WO2026047501 (A1). International Patent Classif..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Fuji has submitted a patent application for Substrate Processing System. This invention was developed by Nakamura Yusuke and Uchida Takeshi.
The patent application number is WO2024JP30723 20240828. The patent publication number is WO2026047893 (A1). International Patent Classification code is H05K13/04.
An..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Sharp has submitted a patent application for Semiconductor Device and Method for Producing Semiconductor Device. Miyamoto Tadayoshi, Makita Naoki and Hara Takeshi developed the invention.
The patent application number is WO2024JP30476 20240827. The patent publication number is WO2026047848 (A1).
World Inte..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Resonac has submitted a patent application for Positive Photosensitive Resin Composition, Insulating Resin Film, Method of Forming Insulating Resin Film, Semiconductor Device, Imide Compound, and Alkali-soluble Resin. This invention was developed by Aoki Yukika and Yamashita Chika.
The patent application num..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- BOE Technology Group has filed a patent application for Display Substrate and Display Device. This invention was developed by Fan Yan, Hao Yanjun, Bai Shanshan and Li Na.
The patent application number is WO2024CN115639 20240829. The patent publication number is WO2026044619 (A1). International Patent Classif..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Semiconductor Energy Laboratory has filed a patent application for Semiconductor Device and Method for Producing Semiconductor Device. This invention was developed by Yamazaki Shunpei, Abe Sota, Isaka Fumito, Miyairi Hidekazu and Kakehata Tetsuya.
The patent application number is WO2025IB58517 20250825. The ..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Kokusai Electric has submitted a patent application for Substrate Processing Method, Method for Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Program. This invention was developed by Nonomura Kazuki, Isobe Noriyuki and Eda Akira.
The patent application number is WO2025JP13205 202503..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Tokyo Electron has filed a patent application for Method of Manufacturing Semiconductor Device and System for Manufacturing Semiconductor Device. This invention was developed by Matsuoka Ryotaro, Yamashita Yohei, Miyagi Yusuke and Osada So.
The patent application number is WO2025JP10683 20250319. The patent ..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Wuhan Choice Technology has filed a patent application for Adhesive-backed Film for Integrated Film Packaging and Preparation Method Therefor, and Chip Packaging Method. This invention was developed by Wu De, Zhou Qiao, Liao Shuhang and Su Junxing.
The patent application number is WO2025CN86099 20250331. The..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Star Micronics has filed a patent application for Electronic Device and Guide Image Display Method. This invention was developed by Tokita Daisuke.
The patent application number is WO2025JP28139 20250807. The patent publication number is WO2026048472 (A1). International Patent Classification code is G06F3/14..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Huawei Technologies has filed a patent application for Data Sending Method, Data Receiving Method, Device and Chip. This invention was developed by Sun Liang and Yao Di.
The patent application number is WO2025CN79814 20250228. The patent publication number is WO2026045191 (A1). International Patent Classific..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Huawei Technologies has submitted a patent application for Photoelectric Detection Chip and Preparation Method Therefor, and Photoelectric Detector and Electronic Device. This invention was developed by Zhang Yunxiao.
The patent application number is WO2025CN72223 20250114. The patent publication number is W..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Fujifilm has filed a patent application for Film and Semiconductor Package. This invention was developed by Abe Takumi, Hayashi Daisuke, Aimi Keitaro and Toyooka Kentaro.
The patent application number is WO2025JP29213 20250820. The patent publication number is WO2026048632 (A1). International Patent Classifi..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Honor Device has filed a patent application for Power Supply Apparatus, Charging Method, Electronic Device, Chip System and Storage Medium. This invention was developed by Zhang Weichen.
The patent application number is WO2025CN94456 20250513. The patent publication number is WO2026045374 (A1). International..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Fujifilm has filed a patent application for Joined Body Production Method, Photosensitive Resin Composition, and Semiconductor Member Production Method. This invention was developed by Yamashita Kosuke.
The patent application number is WO2025JP29711 20250825. The patent publication number is WO2026048733 (A1..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Tokyo Electron has filed a patent application for Substrate Processing Method. This invention was developed by Itagaki Yuto, Tsuzuki Reiko and Dobashi Kazuya.
The patent application number is WO2025JP29626 20250822. The patent publication number is WO2026048710 (A1). International Patent Classification code ..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- BOE Technology Group has filed a patent application for Display Substrate and Display Apparatus. This invention was developed by Xu Chuanxiang, Shu Shi, Yao Qi, Yuan Guangcai, Yu Yong, Yue Yang, Liu Xinhua and Li Xiang.
The patent application number is WO2025CN108040 20250711. The patent publication number i..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Star Micronics has submitted a patent application for Communication System, Terminal Apparatus, and Terminal Registration Method. This invention was developed by Matsushita Yuichi, Umezawa Shingo and Ito Hiroki.
The patent application number is WO2025JP28252 20250808. The patent publication number is WO20260..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Star Micronics has submitted a patent application for Communication System, Terminal Apparatus, and Device Identification Method. This invention was developed by Matsushita Yuichi, Umezawa Shingo and Ito Hiroki.
The patent application number is WO2025JP28243 20250808. The patent publication number is WO20260..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Applied Materials has filed a patent application for an Approach to Increase Linac Operating Range of Linear Accelerator. This invention was developed by Tam Wai-ming, Klein Jeffrey Laurence and Sinclair Frank.
The patent application number is WO2025US39218 20250725. The patent publication number is WO202604..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- ASML Netherlands has filed a patent application for Stacked Full Bridge Inverter. This invention was developed by Moon Hansol, Miric Spasoje, Mutlu Mehmet and Finney Nathan.
The patent application number is WO2025EP69797 20250710. The patent publication number is WO2026046576 (A1). International Patent Class..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- ROHM has submitted a patent application for Semiconductor Device, Semiconductor Module, Vehicle, and Method for Manufacturing Semiconductor Device. Fuji Kazunori developed the invention.
The patent application number is WO2025JP29137 20250820. The patent publication number is WO2026048612 (A1). International..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Applied Materials has filed a patent application for Wide-bandgap Super Junction Structures for Power Devices. This invention was developed by Nourbakhsh Amirhasan.
The patent application number is WO2025US42723 20250820. The patent publication number is WO2026050058 (A1). International Patent Classification..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Resonac has submitted a patent application for Sealing Resin Composition and Semiconductor Module. This invention was developed by Noguchi Shohei and Nozaki Akihiro.
The patent application number is WO2025JP29964 20250826. The patent publication number is WO2026048808 (A1). International Patent Classificatio..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Huawei Technologies has submitted a patent application for Communication Method and Apparatus, and Chip. Jia Jianxin, Zhou Han and Li Guanglei developed the invention.
The patent application number is WO2025CN105040 20250627. The patent publication number is WO2026045597 (A1). International Patent Classifica..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- ACM Research, Shanghai has submitted a patent application for Substrate Processing Device. This invention was developed by Jin Yinhua, Wang Wenjun, Zhang Xiaoyan, Zeng Juan and Wu Xudong.
The patent application number is WO2025CN110593 20250725. The patent publication number is WO2026045786 (A1).
An abstra..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Data Reporting Method for Semiconductor Process Device, and Related Apparatus. Li Junxuan developed the invention.
The patent application number is WO2025CN114373 20250813. The patent publication number is WO2026045926 (A1). Inte..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- LG Innotek has submitted a patent application for Circuit Board and Semiconductor Package. Lee Yu Jin, Shin Jun Sik and Chang Woo Young developed the invention.
The patent application number is WO2025KR11314 20250729. The patent publication number is WO2026049321 (A1). International Patent Classification cod..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Huawei Technologies has submitted a patent application for Information Transmission Method, Communication Apparatus, Storage Medium, and Chip System. This invention was developed by Wei Lai, Sun Li, Chen Lei and Liu Peng.
The patent application number is WO2025CN115289 20250818. The patent publication number..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- LG Chem has submitted a patent application for Composition for Promoting Glass Substrate Metallization, Manufacturing Method Therefor, Process of Promoting Glass Substrate Metallization, and Metallized Glass Substrate. Jung Dae Chul, Kwon Oh Tak, Ryu Sanguk, Choi A Nam and Yoo Sangmoon developed the invention..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Fuyao Glass Industry Group has submitted a patent application for Coated Substrate and Vehicle Window Assembly. Tso Fai, Zeng Dong, Huang Fengzhu, Zhu Rui, Wang Zelong and Fukuhara Kohta developed the invention.
The patent application number is WO2025CN116892 20250826. The patent publication number is WO2026..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Microchip Technology has submitted a patent application for Systems and Methods for Storing Data Associated with an Excursion Event Detected by a Power Monitor Device. This invention was developed by Andresen Tony, Polonsky Mitch, Meacham Daniel and Wimer Todd.
The patent application number is WO2025US17797 ..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Applied Materials has submitted a patent application for In-situ Monitoring System with Substrate Held by Carrier in Chemical Mechanical Polishing. This invention was developed by Lau Eric, Cherian Benjamin and Listiana Eilien.
The patent application number is WO2024US44885 20240830. The patent publication n..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Applied Materials has submitted a patent application for Signal Processing in Chemical Mechanical Polishing. This invention was developed by Xu Kun, Lee Harry Q, Cherian Benjamin and Qian Jun.
The patent application number is WO2024US44854 20240830. The patent publication number is WO2026049749 (A1). Interna..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Ecole Polytechnique Fédérale de Lausanne, EPFL has submitted a patent application for Efficiency Enhancement of the Photovoltaic Cells Using a Converter, Methods for Producing Thereof, and a Solar Cell Device. Fleury Romain, Jafargholi Amir, Parvin Parviz, Motevalian Reyhaneh Sadat, Kalantari Nafiseh Sadat,..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Applied Materials has submitted a patent application for Plasma Assisted Deposition and Etching Methods, and Related Processing Chambers, Systems, and Apparatus. This invention was developed by Yang Yi, Kang Sean, Hayes Alan, Watson Jacob, Gau Justin and Nemani Srinivas D.
The patent application number is WO..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Applied Materials has submitted a patent application for Conduction Cooling Plate Using Friction Stir Welding. This invention was developed by Govindasamy Sathiyamurthi, Raju Brijesh, Palanisamy Suresh and Penmethsa Harish.
The patent application number is WO2025US38578 20250722. The patent publication numbe..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Applied Materials has submitted a patent application for Particle Accelerator Having Configurable Quadrupole Assembly. This invention was developed by Tam Wai-ming, Park Jr and Peitzsch Scott E.
The patent application number is WO2025US36910 20250709. The patent publication number is WO2026049869 (A1). Inter..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Applied Materials has submitted a patent application for Responsive Layer for Low Frequency Line Width Roughness Reduction. Wojtecki Rudy, Kanakasabapathy Sivanandha Krishnan and Huang Zhiyu developed the invention.
The patent application number is WO2025US41529 20250811. The patent publication number is WO2..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- ASML Netherlands has submitted a patent application for Systems and Assemblies for Mitigating Arcing Energy in Charged Particle Systems. This invention was developed by He Xiaodong, Zhu Dawei, Xi Qingpo, Liu Hai Fen, Zheng Jiyong, Lu He Sheng, Steenbrink Stijn, Van Soest Jurgen, Veenstra Roy, Visser Erwin, Sl..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Applied Materials has submitted a patent application for Gas Injection and Pre-heating for Selective Gas Activation, and Related Processing Chambers, Apparatus, and Methods. This invention was developed by Lau Shu-kwan, Choo Enle, Palaty Abraham, Patil Aniketnitin, Gadgil Shantanu Rajiv, Moradian Ala and Sali..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Applied Materials has submitted a patent application for Selective Material Removal with Angular Beam. Tavakoli Mohammad Mahdi, Rigor Joel, Gelatos Avgerinos V, Lee Joung Joo, Jiang Lei and Godet Ludovic developed the invention.
The patent application number is WO2025US42720 20250820. The patent publication ..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Applied Materials has submitted a patent application for Trench-based Super Junction Structures Via Sidewall Doping. This invention was developed by Nourbakhsh Amirhasan and Chudzik Michael.
The patent application number is WO2025US42714 20250820. The patent publication number is WO2026050056 (A1). Internati..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Applied Materials has submitted a patent application for Adjustable Grounding and Biasing Area. This invention was developed by Pan Junjie, Xie Xiangjin and Kashefi Kevin.
The patent application number is WO2025US42198 20250815. The patent publication number is WO2026050024 (A1). International Patent Classif..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Applied Materials has submitted a patent application for Transmissive and Absorptive Mass Arrangements for Lift Frames, and Related Processing Chambers, Chamber Kits, and Methods. This invention was developed by Chao Chen-yao, Tan Seng Hoe, Kobashi Kazuyoshi, Hu Ryan Sungbin, Ishii Masato, Shen Kuan Chien, Za..
Semiconductor
| Mon 09 Mar 2026
Geneva, March 10 -- Corning has submitted a patent application for Glass Article with Adhesive Layer Configured for Delamination of Glass Substrate in Response to Headform Impact. This invention was developed by Black Matthew Lee, Gibson Iii Ray Gage, Knickerbocker Ward Tyson, Layouni Khaled, Murru Pavitra Tejaswi, Qaroush Youse..
Semiconductor
| Tue 10 Mar 2026
Geneva, March 10 -- Ayar Labs has submitted a patent application for Systems and Associated Methods for Through-backside Optical Fiber Coupling with Photonic Integrated Circuit Die/chip. This invention was developed by Vercruysse Dries, Sapra Neil, Greely Albert and Zhang Chong.
The patent application number is WO2025US43562 20..
Semiconductor
| Tue 10 Mar 2026
Geneva, March 10 -- Lam Research has submitted a patent application for Pseudo-fractal Showerhead for Substrate Processing Tool. This invention was developed by Patil Ravikumar, Hosur Shivalinge Gowda Arun Kumar, Kubasad Sachin Allamaprabhu, Patil Suneel, Leeser Karl Frederick, Vikraman Nivin and Mishra Shekhar.
The patent appl..
Semiconductor
| Tue 10 Mar 2026
Geneva, March 10 -- NVIDIA has submitted a patent application for Storage Instruction for Matrix Multiply-accumulate Operations. This invention was developed by Edwards Harold Carter, Thakkar Vijay Harshad, Hirisave Chandra Shekhara Gokul Ramaswamy, Gornish Edward H, Kulkarni Rishkul, Tyrlik Maciej Piotr, Treichler Sean Jeffrey ..
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