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Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has received Jiangxi Ked Tech Co Ltd and Jinggangshan University patent application for Cleaning Machine with Zero Discharge of Rinse Water for Cleaning PCBA (printed Circuit Board Assembly) and Semiconductor. Zhuang Xiangcheng, Han Runlin, Xiao Lihuang, Zhou Qingli..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Fujian Xienkai Electronic Co Ltd has sought patent for Cleaning Equipment for LCD Glass Substrate Processing. This invention was developed by You Renwen, Chen Wenhuai, Yu Hongxia, Tatono and Chen Fuliang.
The patent application number is CN202510334592 20250320. The patent publication number is CN119819631..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Xinyi Longteng Packaging Products Co Ltd has submitted a patent application for Wood Support Surface Wood Chip Spraying and Flushing Equipment. This invention was developed by Han Yaqian and Wang Daxiang.
The patent application number is CN20251026559 20250107. The patent publication number is CN119819621 ..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Xing Ying has submitted a patent application for Electroplating Equipment and Electroplating Process. The patent application number is CN20251053104 20250114. The patent publication number is CN119819606 (A). International Patent Classification codes are B08B1/12, B08B1/34, B08B13/00 and C25D5/34.
State I..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has published Xi'an ESWIN Material Technology and Xi'an ESWIN Silicon Wafer Technology patent application for Silicon Wafer Cleaning Device, Silicon Wafer Cleaning Equipment and Silicon Wafer Cleaning Method. The invention was developed by Zhou Miao and Sun Jienan.
..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Shenzhen Nsiway Tech Co Ltd has been granted a patent for Over-temperature Protection Circuit, Power Supply Chip and Electronic Equipment. This invention was developed by Kuang Xiaojun, Fu Lingyun, Qi Lingkang, Li Zhenghu and Wang Wenrong.
The patent application number is CN202422389343U 20240929. The pate..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Intel NDTM USA Inc has submitted a patent application for Edge Polishing Head, Wafer Edge Polishing Device and Wafer Edge Polishing Method. This invention was developed by Mei Xiaoxi, Zhang Shikai and Chang Fujia.
The patent application number is CN202311332668 20231013. The patent publication number is CN..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Zhejiang Xuhui Intelligent Equipment Co Ltd has filed a patent application for Numerical Control Cutting Machine Tool Convenient for Chip Removal. This invention was developed by Gao Bin, Wu Hongcheng, Wu Zaoqiao and Chen Dafeng.
The patent application number is CN202510204443 20250224. The patent publicat..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has awarded a patent to Shanxi Huarui Nano New Material Tech Co Ltd for Device for Reducing Feeding and Discharging Loss of Electrostatic Spinning Substrate Raw Materials. Zhao Xinglei, Jiang Pan, Hua Ting, Jiang Xubo, Han Yongxiang and Ma Weijie developed the inven..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Dongguan Yukun Nano Injection Tech Co Ltd has been granted a patent for Transfer Equipment for Tri Hanging Tool for Electroplating. Guo Tienan, Guo Tielong, Xu Guanglin and Tan Yonggang developed the invention.
The patent application number is CN20242215995U 20240820. The patent publication number is CN223..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Xiamen Lishengda Electroplating Co Ltd has been awarded a patent for Folding Electroplating Frame for Electroplating Processing. This invention was developed by Liu Pingming.
The patent application number is CN202422168153U 20240904. The patent publication number is CN223176244 (U). International Patent Cl..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Hefei Youle Jiahe Tech Co Ltd has been granted a patent for Water Tank for Electroplating Solution. Zhang Yi and Zhang Xiaobo developed the invention.
The patent application number is CN202421539157U 20240702. The patent publication number is CN223176240 (U). International Patent Classification codes are C..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Shanghai Tongshu Precision Electromechanical Tech Co Ltd has received a patent for High-speed Electroplating Line Blanking System. This invention was developed by Cai Shoubing.
The patent application number is CN202422497464U 20241015. The patent publication number is CN223176239 (U). International Patent ..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has awarded a patent to Guangdong Institute of Special Equipment Inspection and Res Guangdong Special Equipment Accident Inv for Micro-arc Oxidation Device and Semiconductor Film Preparation System. Xu Yao, Tan Yue, Li Wei and Xia Li developed the invention.
The ..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has published Tangshan Wanshihe Electronics Co Ltd patent application for Blanking Device for Wafer Production. The invention was developed by Duan Hongwei, Chang Limin, Yuan Qingzhu, Li Jian, Jing Xueshun and Zhan Caifeng.
The patent application number is CN2025..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has published Beijing Jingheng Industrial Control Tech Co Ltd patent application for Laser Fine Tuning Method for Quartz Crystal Wafer. The invention was developed by Liao Zhanwu.
The patent application number is CN202510201083 20250224. The patent publication nu..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Guangzhou Sanyi Laser Tech Co Ltd has applied Chinese patent for Large-size Wafer Wide-area Laser Polishing Device and Polishing Method. Chen Cong, Li Guilin, Ouyang Ziqing and Dong Qinglin developed it.
The patent application number is CN20251043770 20250110. The patent publication number is CN119820081 (..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Shenzhen Jingrongli Tech Co Ltd has submitted a patent application for Laser Processing Device of Ceramic Substrate for Circuit Board. This invention was developed by Jiang Xiuqing, Xie Fei and Yang Meirong.
The patent application number is CN20251084170 20250120. The patent publication number is CN1198200..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Zhejiang Laoying Semiconductor Tech Co Ltd has obtained a patent for wafer carrier, wafer conveying device and wafer conveying system. This invention was developed by Gu Hongyi, Chen Shunli, Zhao Bo and Zhang Xiaoxiao.
The patent application number is CN20242292099U 20240828. The patent publication number ..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Shanghai Sinyang Semiconductor Mat Co Ltd has been granted a patent for Wafer Cleaning Device and Wafer Packaging Equipment. Wang Zhenrong, Sun Hongqi and Zhang Honglin developed the invention.
The patent application number is CN20242209578U 20240819. The patent publication number is CN223193765 (U). Inter..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Shanghai Sinyang Semiconductor Mat Co Ltd has obtained a patent for wafer cleaning device and wafer packaging equipment. This invention was developed by Wang Zhenrong and Liu Hongbing.
The patent application number is CN20242209501U 20240819. The patent publication number is CN223193764 (U). International ..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Shanghai Sinyang Semiconductor Mat Co Ltd has been granted a patent for Temperature Control Device and Wafer Cleaning Equipment. Wang Zhenrong and Liu Hongbing developed the invention.
The patent application number is CN20242209428U 20240819. The patent publication number is CN223193763 (U). International ..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has awarded a patent to Chongqing Xinlian Microelectronic Co Ltd for Fluid Circulation System and Semiconductor Device. Chi Guowei developed the invention.
The patent application number is CN202421900148U 20240807. The patent publication number is CN223193761 (U)..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has awarded a patent to Hangzhou Haiqian Semiconductor Co Ltd for Wafer Clamp of Silicon Carbide Epitaxial Wafer Carrier Concentration Test Board. Xu Yuelu, Liang Tuqin and Lin Yunhao developed the invention.
The patent application number is CN20242297896U 202408..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has awarded a patent to Nanjing Vision Potential Intelligent Tech Co Ltd for Monocrystal Original Silicon Wafer Electroluminescence Defect Detection Device. Xu Ming developed the invention.
The patent application number is CN202421830111U 20240731. The patent pub..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Supo Electronic Tech Shanghai Co Ltd has been granted a patent for Lifting Door and Wafer Carrier Lifting Transmission Equipment. This invention was developed by Zhu Yudong, Yan Meng, Liu Wei and Zhao Qu.
The patent application number is CN202422591351U 20241025. The patent publication number is CN22317574..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Chinese Patent for Anti-interference Chip Inductor Magnetic Core Structure has been issued to Dongguan Yuxin Electronics Co Ltd. This invention was developed by Ye Guoxin, Zhu Haiying and Yin Wenhua.
The patent application number is CN202422349925U 20240926. The patent publication number is CN223193615 (U)..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Chinese Patent for Vapor Chamber Used for Being Matched with Silicon Carbide Boat has been issued to Shaanxi UDC Materials Tech Co Ltd. This invention was developed by Wang Xinglong, Tong Kai, Liu Dian and Li Jiangbo.
The patent application number is CN202422398434U 20240930. The patent publication number ..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Shandong Jingyi New Mat Co Ltd has been granted a patent for Ceramic Support for Calcining Boron Nitride Substrate. This invention was developed by Hou Yuxuan, Hou Guangsheng, Li Pan, Huang Xiaohong and Chu Zongfu.
The patent application number is CN20242330324U 20241209. The patent publication number is C..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Ningxia Xigu Liufang Mech and Electrical Equipment Co Ltd has been granted a patent for Air Pressure Sintering Furnace for Preparing High-performance Silicon Nitride Ceramic Substrate. Shi Yi, Li Fei, Li Yu, Teng Fei and Qi Hao developed the invention.
The patent application number is CN202422464519U 20241..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Suzhou Aotuomaidi Software Co Ltd has submitted a patent application for Film Pasting Equipment Suitable for CPU Substrate. Zhong Xiaolong and Jia Chun developed the invention.
The patent application number is CN202411975291 20241231. The patent publication number is CN119821768 (A). International Patent C..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Shanghai Heli Tech Co Ltd has been awarded a patent for Annular Ornament with NFC (near Field Communication) Chip. This invention was developed by Li Zengbin.
The patent application number is CN202422650292U 20241031. The patent publication number is CN223195634 (U). International Patent Classification cod..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has awarded a patent to Hefei Xinsheng Optoelectronic Technology Co Ltd and BOE Technology Group for Display Substrate and Display Device. Fang Jingang, Su Tongshang, Wang Ming, Cheng Jun, Peng Xiangzong and Yan Liangchen developed the invention.
The patent appli..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Shenzhen Chengtai Semiconductor Tech Co Ltd has obtained a patent for high-power LED chip for extreme application. This invention was developed by Zhou Guoqiang and Cao Yinglong.
The patent application number is CN202422442987U 20241010. The patent publication number is CN223195085 (U). International Paten..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has awarded a patent to Jiangxi Qianzhao Semiconductor Tech Co Ltd for Flexible Solar Cell. He Sheng, Wu Zhenlong, Zhang Peng, Zhang Yong and Zhang Ce developed the invention.
The patent application number is CN202421761447U 20240724. The patent publication numbe..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has awarded a patent to Yuanshan New Material Tech Co Ltd for Sapphire Substrate GaN Hemt Epitaxial Wafer. Song Hui developed the invention.
The patent application number is CN202421615302U 20240709. The patent publication number is CN223195063 (U). International..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Shandong Ruisheng Electronic Tech Co Ltd has obtained a patent for feeding mechanism of chip mounter. This invention was developed by Song Zhen.
The patent application number is CN202422425338U 20241009. The patent publication number is CN223195061 (U). International Patent Classification codes are H05K13/..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has awarded a patent to Shanghai Ruilai Electronic Tech Co Ltd for Downward Pressing Type Chip Burning Seat. Wang Kuanyu developed the invention.
The patent application number is CN202422424798U 20241009. The patent publication number is CN223194984 (U). Internat..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Yastar Tech Co Ltd for Surface Mounting and Welding Integrated PCB Chip Mounting Equipment. Hu Xiao developed the invention.
The patent application number is CN202422439024U 20241010. The patent publication number is CN223194933 (..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Chinese Patent for Fixing Tool for Production of High-thermal-conductivity Metal Substrate has been issued to Zhejiang Dejia Electronic Tech Co Ltd. This invention was developed by Zhang Yujun and Zhang Qiang.
The patent application number is CN202422117681U 20240830. The patent publication number is CN223..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Maiyue Guangzhou Communication Tech Co Ltd has secured a patent on Signal Receiving and Transmitting Integrated Circuit and Signal Receiving and Transmitting Equipment. Feng Xiangfu, Liu Qijing, Huang Junming and Qiu Bing developed the invention.
The patent application number is CN202422489956U 20241014. T..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Chengdu Jihai Tech Co Ltd has been awarded a patent for OSC Power Supply Circuit, Integrated OSC Circuit and Integrated Circuit Chip. This invention was developed by Huo Xianjie and Xu Cheng.
The patent application number is CN202422407524U 20240930. The patent publication number is CN223194693 (U). Intern..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has awarded a patent to Shanghai Anqiwei Microelectronics Tech Co Ltd for Amplification Circuit and Radio Frequency Transceiver Chip. Ma Haoze, Li Nan and Lu Jianhua developed the invention.
The patent application number is CN202422358363U 20240925. The patent pu..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Tunghsu Azure New Energy Co Ltd has obtained a patent for synergistic device for solar cell panel and solar cell panel group. This invention was developed by Chen Shijie, Li Qing, Yan Yonghai and Yuan Fengling.
The patent application number is CN20242204054U 20240816. The patent publication number is CN223..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Anhui Jixin Microelectronics Tech Co Ltd has submitted a patent application for Automatic Wafer Processing Equipment Suitable for Monocrystalline Silicon Packaging. This invention was developed by Zhang Jun and He Na.
The patent application number is CN20251061434 20250115. The patent publication number is..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Chinese Patent for Release Paper Silicon Coating and Humidifying Device has been issued to Matsumoto Coating Tech Kunshan Co Ltd. This invention was developed by Sun Shouwen and Dai Mingshui.
The patent application number is CN202422397190U 20240930. The patent publication number is CN223176498 (U). Intern..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has received Zhuhai Dingtai Xinyuan Crystal Co Ltd patent application for Polishing Method of Gallium Antimonide Wafer and Gallium Antimonide Polished Wafer. Feng Xiupeng and Duan Manlong developed the invention.
The patent application number is CN202510105720 20..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Changdian Microelectronics Jiangyin Co Ltd has applied Chinese patent for Grinding Method and Corresponding Wafer Structure. Mu Xingchen, Guo Liangkui, Li Wenjie, Dai Yuhao, Zhang Sisu and Lyu Liangwei developed it.
The patent application number is CN20251042565 20250110. The patent publication number is C..
Semiconductor
| Tue 18 Nov 2025
Beijing, Nov. 19 -- Jiangsu Runpeng Semiconductor Co Ltd has filed a patent application for Silicon Wafer Polishing Equipment for Integrated Circuit Chip Production. This invention was developed by Kang Jian and Wu Longjun.
The patent application number is CN202510201193 20250221. The patent publication number is CN119820452 ..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Taizhou Boxin Electronic Co Ltd has been granted a patent for Novel Wafer Angle Measuring Machine. Zhou Wei developed the invention.
The patent application number is CN202422485317U 20241015. The patent publication number is CN223179513 (U). International Patent Classification code is G01B15/00.
The ab..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has received Guangzhou Tiger Head Battery Group Co Ltd and Yunan Hutou Power Supply Tech Co Ltd patent application for Lithium Battery Pack Chip Equalization Control Method and Control System Thereof. Xie Yingjun, Li Shumin, Huang Kaida and Jiang Jianke developed th..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Huatian Tech Jiangsu Co Ltd has submitted a patent application for Interconnection Via Hole Structure for Improving Wafer Level Packaging Interconnection Density. Zhao Kai, Liu Shiyu and Ma Shuying developed the invention.
The patent application number is CN202411946962 20241227. The patent publication num..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Shanghai Tsinghua International Innovation Center has sought patent for Chip Adapter Plate and Chip Packaging Structure. This invention was developed by Zhou Shengjuan and Wang Xu.
The patent application number is CN202411883460 20241219. The patent publication number is CN119812157 (A). International Pate..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Nanjing Yuanluoxin Tech Co Ltd has submitted a patent application for Low-resistance Gate Metal Oxide Semiconductor Transistor and Manufacturing Method Thereof. Pan Jun developed the invention.
The patent application number is CN202411965019 20241230. The patent publication number is CN119812148 (A). Inter..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Shanghai Tianyue Semiconductor Mat Co Ltd has submitted a patent application for Silicon Carbide-diamond Composite Substrate and Application. This invention was developed by Wang Qi, Sui Xiaoming, Zong Yanmin, Su Lina, Liu Shuo, Wang Kai, Zhang Lin, Pan Yani, Dang Yifan and Zhu Can.
The patent application ..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- LX Semiconductor Tech Co Ltd has submitted a patent application for Heat Dissipation Substrate, Power Semiconductor Module, and Power Converter. This invention was developed by Zhang Minye.
The patent application number is CN202410696546 20240531. The patent publication number is CN119812141 (A). Internati..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- LX Semiconductor Tech Co Ltd has filed a patent application for Heat Dissipation Substrate, Power Semiconductor Module, and Power Converter. This invention was developed by Zhang Minye.
The patent application number is CN202410687438 20240530. The patent publication number is CN119812140 (A). International..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Nat Ct Advanced Packaging Co Ltd Ncap China has sought patent for Heat Dissipation Cover, Chip Packaging Structure and Chip Packaging Method. This invention was developed by Ma Bangchu and Lu Xueshan.
The patent application number is CN20251031109 20250108. The patent publication number is CN119812137 (A)...
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has published Huatian Tech Jiangsu Co Ltd patent application for Stacked Chip Lead Bonding Packaging Structure and Preparation Method. The invention was developed by Fu Dongzhi, Ma Shuying and Chen Zhihua.
The patent application number is CN202411934906 20241226...
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Wuxi Xinzhuo Huguang Semiconductor Co Ltd has submitted a patent application for Manufacturing Method of Semiconductor Device and Semiconductor Device. Ning Hongyan developed the invention.
The patent application number is CN202411905585 20241223. The patent publication number is CN119812108 (A). Internati..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Wuxi Xinzhuo Huguang Semiconductor Co Ltd has submitted a patent application for Trench Etching Method of Semiconductor Device. This invention was developed by Yuan Lefan, Lin Qiang, Shen Yuli, Cheng Hanyue, Ma Rui and Ding Chao.
The patent application number is CN202411812474 20241210. The patent publicat..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Wuxi Xinzhuo Huguang Semiconductor Co Ltd has submitted a patent application for Semiconductor Structure and Preparation Method of Semiconductor Structure. This invention was developed by Yuan Lefan, Shen Yuli, Cheng Hanyue, Ma Rui and Ding Chao.
The patent application number is CN202411791506 20241206. Th..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Nanjing Institute of Intelligent Tech CAS has filed a patent application for High-performance Chip Package Implementation Method. This invention was developed by Hu Jinhua, Chandron and Zhou Yumei.
The patent application number is CN202411730906 20241129. The patent publication number is CN119812105 (A). I..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Shanghai Xinaoxinyi Tech Co Ltd has applied Chinese patent for Soi Wafer and Method for Manufacturing Same. Chen Meng, Miao Yuan, Wei Xing and Li Wei developed it.
The patent application number is CN202411940440 20241225. The patent publication number is CN119812097 (A). International Patent Classification..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Anhui Changfei Advanced Semiconductor Co Ltd has filed a patent application for Epitaxial Wafer Structure, Wafer Manufacturing Method and Manufacturing Device. This invention was developed by Xie Wei and Luo Chengzhi.
The patent application number is CN20251009110 20250103. The patent publication number is..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Kunshan Dachuan Plastic Ind Co Ltd has filed a patent application for Clamping Adjusting Device and Method of Wafer Carrier. This invention was developed by Zhang Wei, Lyu Xiuzhen and Qu Baonan.
The patent application number is CN202411909087 20241224. The patent publication number is CN119812092 (A). Inte..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has received Jiangsu Tuokute Tech Development Co Ltd patent application for High-stability Packaging Device for Semiconductor Device Production. Xu Changhao and Du Xiangyu developed the invention.
The patent application number is CN202411975554 20241231. The pate..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has released Jiangsu Shengchi Microelectronic Co Ltd patent application for Diffusion Device and Method for Reducing Wafer Surface Defects. This invention was developed by Wang Liming.
The patent application number is CN202510292984 20250313. The patent publicati..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has published Nanjing Qingyanguang Tech Co Ltd patent application for Chip Picking and Positioning Equipment for Chip Packaging. The invention was developed by Cheng Huibin, Bu Tianlei, Mei Yingxi and Wang Yongyu.
The patent application number is CN20251018367 20..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Jinan Lan Xing Electronics Co Ltd has applied Chinese patent for Wafer Etching Device and Etching Method for Chip Production. Wei Xingzheng, Gao Fei and Li Hao developed it.
The patent application number is CN20251017518 20250106. The patent publication number is CN119812058 (A). International Patent Class..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Guizhou Anxin Electronics Co Ltd has filed a patent application for Led Chip Die Bonder Swing Arm Control System and Control Method. This invention was developed by Hong Shihuai and Zhao Guobing.
The patent application number is CN202411940987 20241226. The patent publication number is CN119812053 (A). Int..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Nantong Fulirong Tech Development Co Ltd has applied Chinese patent for Chip Feeder of Circuit Board Chip Mounter. Yuan Jie developed it.
The patent application number is CN20251036301 20250109. The patent publication number is CN119815821 (A). International Patent Classification code is H05K13/02.
The..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Rayval Tech Suzhou Co Ltd has applied Chinese patent for Printed Circuit Board (PCB) Chip Mounter Convenient for Adjusting Distance Between Guide Rails. Wang Shengliang, Wang Yafei and Deng Jie developed it.
The patent application number is CN202411851003 20241216. The patent publication number is CN119815..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Shenzhen Xinchuangyuan Prec Intelligent Manufacturing Co Ltd has filed a patent application for Packaging and Cooling Device for Semiconductor. This invention was developed by Chang Guoqiang, He Zhiping and Li Mingjun.
The patent application number is CN202510292836 20250313. The patent publication number ..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Shenzhen Jinghe Chip Tech Co Ltd has submitted a patent application for High-precision Microcirculation Sensor Chip Based on Variable Frequency Temperature and Monitoring Value. Liu Chunliang, Yang Mingxi and Xue Weibin developed the invention.
The patent application number is CN20251001760 20250102. The p..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Dongguan Cojoin Circuits Co Ltd has submitted a patent application for Manufacturing Method of Packaging Substrate with False Four-layer Plate Structure. This invention was developed by Zhou Jianhui, Xu Chengsheng and Liao Faben.
The patent application number is CN202411923145 20241225. The patent publicat..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has published Shenzhen Sunshine Circuit Tech Co Ltd patent application for Manufacturing Method for Enhancing Heat Dissipation of Groove Body Electroplating Plug Copper Block for PCB (printed Circuit Board). The invention was developed by Xu Beishui, He Liuyu and Xu..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Shenzhen Zhijin Electronics Co Ltd has sought patent for Bearing Plate for Preparing Coreless Packaging Substrate and Preparation Method and Application Thereof. This invention was developed by Kang Xiaoheng and Qu Gang.
The patent application number is CN202510287341 20250312. The patent publication numbe..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has published Shenzhen Zhongruan Xinda Electronics Co Ltd patent application for Method and Device for Controlling High-speed Transmission Stability of FPC (flexible Printed Circuit) High-performance Computing Chip Interface. The invention was developed by Lu Hongle..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Greatshine Semiconductor Tech Co Ltd has applied Chinese patent for Self-adaptive Spectrum Adjustment Method, Device and Equipment for Wafer Detection UV Light Source. Xia Zhenghao, Lin Wei, Zhang Kang and Luo Minghao developed it.
The patent application number is CN202510295283 20250313. The patent public..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Shenzhen Shengma Tech Co Ltd has applied Chinese patent for Earphone for Interphone, Earphone Chip and Intercommunication Method. Luo Weiyu developed it.
The patent application number is CN202510303309 20250314. The patent publication number is CN119815241 (A). International Patent Classification codes are..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Shenzhen Yspring Tech Co Ltd has submitted a patent application for Pixel Signal Sampling Circuit, Sampling Method, Image Sensor and Electronic Equipment. Shi Le, Shen Junsong and Deng Qingxiu developed the invention.
The patent application number is CN202411799521 20241209. The patent publication number i..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has published Rockchip Electronics Co Ltd patent application for Method and Device for Displaying Interface Data and Chip. The invention was developed by Huang Jiachai.
The patent application number is CN202411849541 20241216. The patent publication number is CN1..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Xi'an Silergy Semiconductor Tech Co Ltd has filed a patent application for Over-temperature Protection Circuit and Switching Power Supply Using Same. This invention was developed by Chen Zhan, Zhang Shaobin and Hu Guojuan.
The patent application number is CN202411998057 20241231. The patent publication num..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has released Hangzhou Guangzhiyuan Tech Co Ltd patent application for Photon Integrated Circuit, Photon Chip and Method for Monitoring Modulator. This invention was developed by Meng Huaiyu, Shen Yichen, Peng Bo and Yu Shanshan.
The patent application number is C..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has published Geely Holding Group and Geely Automobile Research Institute (Ningbo) patent application for Control Method and Product of Parallel Circuit of Silicon Switching Device and Silicon Carbide Switching Device. The invention was developed by Zhu Lujia, Gan J..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Shenzhen HI Semicon Electronics Co Ltd has submitted a patent application for Self-adaptive Bias Voltage Optimization Method Based on MOS (metal Oxide Semiconductor) Tube and Related Equipment. This invention was developed by Zhang Xigang and Li Gaoyu.
The patent application number is CN202510294734 202503..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Wuxi Photon Chip United Res Center has submitted a patent application for Filter Chip and Preparation Method Thereof. This invention was developed by Lu Yue, Ma Shaopeng, Kim Hyun-min, Ouyang Chunfang and Shu Yang.
The patent application number is CN202411873068 20241218. The patent publication number is C..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Guangdong Jiutian Power Supply Co Ltd has sought patent for Rectifier and Electroplating System. This invention was developed by Li Zhen, Xiao Weisheng, Yin Haojie, Lin Rongzhao and Wu Yuxin.
The patent application number is CN202410976576 20240720. The patent publication number is CN119813795 (A). Interna..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has received Heilongjiang Huixin Semiconductor Co Ltd patent application for Two-stage Charge Pump Bootstrap High-voltage Integrated Circuit. Feng Yuxiang and Zhang Tuming developed the invention.
The patent application number is CN202411954780 20241227. The pate..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Hunan Chuanghua Low Carbon Environmental Protection Tech Co Ltd has submitted a patent application for Microcrystalline Semiconductor Storage Battery. This invention was developed by Liu Xiaojiang, Chen Xinyou, Wu Zhige and Yang Yizi.
The patent application number is CN202411932032 20241225. The patent pub..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has published Beijing Chaoxian Memory Research Institute and Institute of Microelectronics, CAS patent application for Manufacturing Method of Double-layer Stacked Oxide Semiconductor Device and Semiconductor Device. The invention was developed by Lu Yupeng, Xu Gaob..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Angell Tech Co Ltd has filed a patent application for Wafer Substrate for Improving Warpage Generated in Epitaxial Layer Growth Process and Application Thereof. This invention was developed by Liang Jiajin, Wu Zhenwei and Shan Jianan.
The patent application number is CN20251002106 20250102. The patent publ..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Jiangxi Sarui Semiconductor Tech Co Ltd has submitted a patent application for Super-junction MOS Device and Preparation Method Thereof. Yu Kuai, Huang Zongyuan, Xie Liangyu and Li Zanfang developed the invention.
The patent application number is CN202510287094 20250312. The patent publication number is CN..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has published Nanjing Nari Semiconductor Co Ltd and Electric Power Scient Res Institute State Grid Jiangxi Electric Power Co Ltd patent application for Groove Type Silicon Carbide Device and Preparation Method Thereof. The invention was developed by Gao Mingyang, Wa..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Hefei Jixin Tech Co Ltd has applied Chinese patent for Nitride Semiconductor Device and Manufacturing Method Thereof. Fan Yonghui developed it.
The patent application number is CN202411952869 20241227. The patent publication number is CN119815868 (A). International Patent Classification codes are H10D30/01..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- Shenzhen Zhenhuaxing Intelligent Tech Co Ltd has sought patent for Vision-assisted Chip Patch Positioning Method and System. This invention was developed by Deng Qichao, Yuan Longbin and Liu Yanjun.
The patent application number is CN20251041554 20250110. The patent publication number is CN119815823 (A). I..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has released United Semi Integrated Circuit Mfg Xiamen Co Ltd patent application for Method for Manufacturing Semiconductor Element. This invention was developed by Yuan Linshan, Yang Guang, Zhang Liangfeng, Ouyang Jinjian, Huang Qingjun and Tan Wenyi.
The patent..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has released Beijing Smartchip Microelectronics Technology and Zhejiang University patent application for N-type Semiconductor Device, Semiconductor Device and Manufacturing Method Thereof, Chip and Electronic Equipment. This invention was developed by Chen Yanning,..
Semiconductor
| Wed 19 Nov 2025
Beijing, Nov. 19 -- State Intellectual Property Office of China has received Xiamen University and Jiujiang Research Institute of Xiamen University patent application for Microstructure Silicon Carbide Ultraviolet Photoelectric Detector with High Quantum Efficiency and Preparation Method Thereof. Zhang Feng, Liu Jia, Hong Rongdu..
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