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Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Hue Inc has submitted a patent application for Micro Package Structure. Yue Yang developed the invention.
The patent application number is US202619701775 20260609. The patent publication number is US20260305481 (A1). International Patent Classification codes are H10K50/842, H10K59/80, H10W72/50, H10W72/..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Hue Inc has applied United States patent for Micro Package Structure. Yue Yang developed it.
The patent application number is US202619701763 20260609. The patent publication number is US20260305480 (A1). International Patent Classification codes are H10K50/842, H10K59/80, H10W72/50, H10W72/90 and H10W90..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Toshiba Electronic Devices & Storage Corp and Toshiba have sought patent for Semiconductor Device. This invention was developed by Ishii Yoshiaki, Sasaki Hiroshi, Akashi Yusuke and Sakanishi Ryota.
The patent application number is US202519365809 20251022. The patent publication number is US20260305354 (..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Deepwave Inc has submitted a patent application for Semiconductor Package. This invention was developed by Lee Kuk Hwan and Choi Dae-kyu.
The patent application number is US202519093988 20250328. The patent publication number is US20260305346 (A1). International Patent Classification codes are H10W40/22..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Huahong Integrated Circuit Chengdu Corp has applied United States patent for Method for Fabricating Dual-via Pattern Damascene Structure. Guo Xiaobo developed it.
The patent application number is US202619565352 20260312. The patent publication number is US20260305284 (A1). International Patent Classific..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has released Visera Technologies Co Limited patent application for Semiconductor Structure and Method for Forming the Same. This invention was developed by Wong Ming-yee, Chiu Yi-hua and Hsieh Hsin-yi.
The patent application number is US202519090961 20250326. The patent ..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Commissariat Energie Atomique, Centre Nat Rech Scient, University Grenoble Alpes and Institute Polytechnique Grenoble have filed a patent application for Detection Architecture for a Probabilistic-bit Spintronic Device. This invention was developed by Danouchi Kamal, Prenat Guillaume and Hutin Louis.
Th..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Ennostar Corp has submitted a patent application for Lighting Emitting Diode Package Structure. This invention was developed by Kuo Shiou-yi.
The patent application number is US202619630007 20260326. The patent publication number is US20260305045 (A1). International Patent Classification codes are H10H2..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Ennostar Corp has sought patent for Light-emitting Device. This invention was developed by Cheng Kai-hung, Lin Chun-min and Lin Ku-cheng.
The patent application number is US202619578540 20260325. The patent publication number is US20260305025 (A1). International Patent Classification codes are H10H20/81..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Ennostar Corp has sought patent for Package Structure. This invention was developed by Oberascher Markus and Lee Ming-jing.
The patent application number is US202619636461 20260401. The patent publication number is US20260304995 (A1). International Patent Classification codes are H10F39/90, H10F55/00, H..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Changzhou Pulansi Semiconductor Mat Co Ltd has been awarded a patent for Uniform Quantitative Powder Feeding System. This invention was developed by Jin Xing and Hu Lei.
The patent application number is CN202520438021U 20250313. The patent publication number is CN223811556 (U). International Patent Classif..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published Power Master Semiconductor Co Ltd patent application for SiC Trench MOSFET with Trench Bottom Protection Structure and Method for Manufacturing the Same. The invention was developed by Lee Hyung Jin and Kim Hong Ki.
The patent application number is US202619..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Samsung Electronics Co Ltd and Research & Business Found Sungkyunkwan University have submitted a patent application for Semiconductor Device. This invention was developed by Lee Ju-hee, Park Sang-yong and Park Jin-hong.
The patent application number is US202619698116 20260604. The patent publication nu..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Chongqing Simic Semiconductor Ltd has sought patent for Power Device and Manufacturing Method Thereof. This invention was developed by Yang Li.
The patent application number is US202619632410 20260330. The patent publication number is US20260304829 (A1). International Patent Classification codes are H10..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published Chongqing Simic Semiconductor Ltd patent application for Method for Manufacturing MOSFET Device and MOSFET Device Thereof. The invention was developed by Yang Li.
The patent application number is US202619572901 20260320. The patent publication number is US2..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has released Yangtze Memory Tech Holding Co Ltd patent application for Semiconductor Device and Fabrication Method Thereof. This invention was developed by Liu Zichen, Chen Liang, Wei Danyang, Liu Wei, Huo Zongliang and Liu Yaqin.
The patent application number is US20251..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Aril Computer Corp has applied United States patent for Interlocking Cell-pair Layout of Buffered Read Port Static Random-access Memory (SRAM) with P and N Pass Gates to Same Write Bit Line. Doluca Sinan and Riordan Thomas developed it.
The patent application number is US202619702031 20260609. The paten..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Bojiexin Shenzhen Semiconductor Co Ltd has obtained a patent for mechanism for laterally clamping product by controlling lifting through single air cylinder. This invention was developed by Du Fei, Cui Fuguang and Yang Zidong.
The patent application number is CN202520363198U 20250304. The patent publicatio..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has published Jiangsu Leuven Instruments patent application for Semiconductor Process Equipment. The invention was developed by Shi Xiaoli, Ye Peng, Xu Kaidong, Dong Qi, Liu Haiyang, Hu Dongdong, Tao Zheng and Yin Gehua.
The patent application number is CN2024119..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Winbond Electronics has submitted a patent application for Semiconductor System and Test Method Thereof. This invention was developed by Lee Byeong-jae.
The patent application number is CN20251256344 20251231. The patent publication number is CN122337291 (A). International Patent Classification code is G11..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Yangtze Memory Technologies has sought patent for Memory Device, System and Control Method. This invention was developed by You Kaikai, Xiong Wenhao, Jia Jianquan, Wang Junbao and Cui Jiameng.
The patent application number is CN20251014778 20250103. The patent publication number is CN122337281 (A). Interna..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has released Macronix patent application for Semiconductor Device. This invention was developed by Cai Junhao, Hong Junxiong and Yang Shangji.
The patent application number is CN202510849820 20250624. The patent publication number is CN122337277 (A). Internationa..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Institute of Microelectronics, CAS has submitted a patent application for Resistive Random Access Memory Unit, Resistive Random Access Memory Array, Resistive Random Access Memory and Operation Method. This invention was developed by Xu Xiaoxin, Yang Jianguo, Liu Qi and Liu Ming.
The patent application num..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Samsung Electronics has submitted a patent application for Multi-chip Package and Memory System. This invention was developed by Byun Jin Do, Shin Chang Yong, Kwon Dae-hyun, Song Hong-joo, Kwon Hye-jung, Park Yong-in and Choi Jae-min.
The patent application number is CN202511538914 20251027. The patent pub..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has released ChangXin Technology Group patent application for Refresh Control Circuit, Memory and Refresh Control Method. This invention was developed by Wang Xudong, Wu Hao, Gu Yinchuan, Zhao Xiaojie and Zhou Runfa.
The patent application number is CN20251007643..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- ChangXin Technology Group has filed a patent application for Data Receiving Circuit and Memory. This invention was developed by Zhang Zhiqiang and Wu Shuguang.
The patent application number is CN20251007734 20250102. The patent publication number is CN122337267 (A). International Patent Classification code..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Samsung Electronics has submitted a patent application for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Yoon Chan-sic, Kang Jong In and Lee Ji-eun.
The patent application number is CN202511965668 20251224. The patent publication number is CN122337266 (A). Inter..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Dongfeng Motor Group has submitted a patent application for Chip Full-life-cycle Intelligent Management System Based on Big Data. This invention was developed by Zhang Yingchun, Wang Wei, Huang Yanan, Zhu Zeng and Wen Chen.
The patent application number is CN202610273208 20260306. The patent publication nu..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Ideal Power has applied United States patent for Cascode Device Package with DSDB BJT and Fets. Bu Jiankang, Yu Ruiyang, Parajuli Sulav and Khanna Mudit developed it.
The patent application number is US202619576389 20260324. The patent publication number is US20260305503 (A1). International Patent Class..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- AP Memory Technology has applied United States patent for Semiconductor Device with Supplemental Circuits Formed in Reserved Region. Huang Jian-jhang and Chen Wenliang developed it.
The patent application number is US202619441112 20260106. The patent publication number is US20260305493 (A1). Internation..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Samsung Electronics has submitted a patent application for Multi-chip Stacking Method. This invention was developed by Bae Chisung and Huh Yeunhee.
The patent application number is US202619574955 20260323. The patent publication number is US20260305468 (A1). International Patent Classification codes are..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Shibaura Mechatronics has applied United States patent for Mounting Head and Mounting Apparatus Having the Mounting Head. Seto Naoki, Ohe Takuya, Kuroiwa Kyota and Okawara Toshifumi developed it.
The patent application number is US202619562691 20260310. The patent publication number is US20260305436 (A1..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Fuji Electric has filed a patent application for Semiconductor Device. This invention was developed by Itoh Taichi.
The patent application number is US202619549793 20260225. The patent publication number is US20260305417 (A1). International Patent Classification codes are H10W70/60, H10W70/654, H10W90/0..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- MediaTek has filed a patent application for Semiconductor Package. This invention was developed by Chang Wei-chen, Liao Ching-ku, Chiu Sang-mao and Kuo Yi-ting.
The patent application number is US202619571658 20260319. The patent publication number is US20260305402 (A1). International Patent Classificat..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Siliconware Precision Industries has applied United States patent for Electronic Package and Manufacturing Method Thereof. Wang Yu-po, Fu Yi-min, Tsai Wen-jung and Lin Jui-cheng developed it.
The patent application number is US202519287065 20250731. The patent publication number is US20260305396 (A1). I..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Samsung Electronics has submitted a patent application for Semiconductor Package with Alignment Marks. This invention was developed by Choi Younchan, Choi Jaeyoung, Park Wooseok, Ko Youngchan, Kim Dahee, Cho Myungdo and Shin Miso.
The patent application number is US202619577954 20260325. The patent publ..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has released Yangtze Memory Technologies patent application for Semiconductor Device and Fabrication Method Thereof. This invention was developed by Lu Cong.
The patent application number is US202519223926 20250530. The patent publication number is US20260305370 (A1). In..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Yangtze Memory Technologies has submitted a patent application for Three-dimensional Memory Devices, Systems, and Methods for Forming the Same. This invention was developed by Yan Bingjie, Xie Jingtao, Xia Zhiliang, Zhou Wenxi, Huo Zongliang and Zhang Kun.
The patent application number is US202619701360..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Intel has applied United States patent for Bridge Chiplet Shield Structures. Collins Andrew developed it.
The patent application number is US202519094406 20250328. The patent publication number is US20260305352 (A1). Cooperative Patent Classification codes are H10W42/121 (EP, US), H10W70/09 (EP), H10W70..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Microsoft Technology Licensing has applied United States patent for 3D Integrated Chips with Microfluidic Cooling. Ramakrishnan Bharath, Belady Christian L, Alissa Husam Atallah, Peterson Eric C and Trieu Dennis developed it.
The patent application number is US202619701337 20260608. The patent publicati..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Metal Industries Research & Development Centre has applied United States patent for Semiconductor Package Structure, Heat Dissipation Material, and Manufacturing Method Thereof. Chen Yu-han, Lyu Yu-ting, Luo Zhang Yuan, Liu Cheng-yi and Huang Yu-lung developed it.
The patent application number is US2025..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Fuji Electric has submitted a patent application for Semiconductor Device. This invention was developed by Tada Shinji.
The patent application number is US202619569730 20260317. The patent publication number is US20260305334 (A1). International Patent Classification codes are H10D80/20, H10W40/00, H10W4..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Samsung Electronics has submitted a patent application for Semiconductor Device. Kim Ki-il, Park Changbea, Lee Sanghyun, Oh Jisoo, Ra Hyonwook and Jeon Kyungyub developed the invention.
The patent application number is US202519350736 20251006. The patent publication number is US20260305310 (A1). Interna..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- IBM has submitted a patent application for Air-gapped Vias. Xie Ruilong, Clevenger Lawrence Alfred, Rudra Kamal, Choi Kisik, Mignot Yann and Motoyama Koichi developed the invention.
The patent application number is US202519095717 20250331. The patent publication number is US20260305309 (A1). Internation..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has released Samsung Electronics patent application for Semiconductor Device Including Via. This invention was developed by Baek Jong Min, Jung Deok Young, Seo Hoon Seok, Kim Yeong Gil and Ahn Min Chul.
The patent application number is US202519393384 20251118. The patent..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has released Intel patent application for Metal Interconnects Structures Having Modified Interconnect Interfaces. This invention was developed by Ehamparam Ramanan, Zhou Shu, Gray Warren and Sarkar Biswajit.
The patent application number is US202519092642 20250327. The p..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has received Renesas Electronics patent application for Semiconductor Device. Hiraiwa Eiji developed the invention.
The patent application number is US202619462242 20260128. The patent publication number is US20260305290 (A1). International Patent Classification codes ar..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published Beijing NAURA Microelectronics Equipment patent application for Semiconductor Process Device and Process Chamber Thereof. The invention was developed by Hu Shuopeng, Li Qiang, Wang Lei, Yang Yilong, Li Bing and Zhao Kangning.
The patent application number i..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Advanced Semiconductor Engineering has submitted a patent application for Package Structure and Method of Manufacturing the Same. This invention was developed by Wu Tsung Chi, Huang Wen-pin, Chen Bo Hua and Chu Fu Tang.
The patent application number is US202519097849 20250401. The patent publication num..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published ASM International Holding patent application for Vapor Deposition Processes. The invention was developed by Blanquart Timothee, Gordon Peter, Bacic Goran, Vervuurt René Henricus Jozef, Barry Sean T and Dezelah Charles.
The patent application number is US20..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has received Samsung Electronics patent application for Magnetic Random Access Memory with Hybrid Free Layer. Apalkov Dmytro, Ikhtiar Fnu, Jeong Jaewoo and Chepulskyy Roman developed the invention.
The patent application number is US202519350400 20251006. The patent publ..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has received UIF University Industry Foundation, Yonsei University patent application for Ionoelastomer Material with Improved Ion Mobility, Diode Device Including the Same, Logic Gate Controlled by Light Using the Same, and Device Controlled by Light Including the Same. Le..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Wuxi Xinzhuo Huguang Semiconductor Co Ltd has secured a patent on Movable Door Assembly and Gluing Equipment. Sang Yuxin developed the invention.
The patent application number is CN202423273169U 20241227. The patent publication number is CN223814004 (U). International Patent Classification codes are E05F15..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Suzhou Mengfeiyi Semiconductor Tech Co Ltd has been granted a patent for Deviation Rectifying Structure for Automatic Conveying of Plates. This invention was developed by Yan Weiping and Shen Gang.
The patent application number is CN202520578496U 20250331. The patent publication number is CN223813038 (U). ..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Wuxi Xinzhuo Huguang Semiconductor Co Ltd has been granted a patent for Spraying Device. Kong Lingchen, Ma Jianchao, Xu Hongda, Wang Zhongping and Shi Xin developed the invention.
The patent application number is CN202423137002U 20241218. The patent publication number is CN223811183 (U). International Pate..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Xinhe Tech Jiangsu Co Ltd has been granted a patent for Semiconductor Spraying Disc Convenient to Clean. Yan Bin and Qin Mingzhou developed the invention.
The patent application number is CN202423183035U 20241223. The patent publication number is CN223811173 (U). International Patent Classification codes a..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Jiangsu Leuven Instruments has sought patent for Semiconductor Process Equipment and Lining Thereof. This invention was developed by Xu Kaidong, He Xiaoming, Wei Chuansong, Guo Xing, Shi Chao, Hu Dongdong, Yan Kuicheng and Ju Xiaojing.
The patent application number is CN202411997318 20241231. The patent pu..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Jiangsu Leuven Instruments has submitted a patent application for Ion Source Grid Mesh Structure, Control System Thereof and Ion Beam Etching System. This invention was developed by Yang Zhen, Xu Kaidong, Hu Dongdong and Chen Gaojie.
The patent application number is CN202411977375 20241230. The patent publ..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Hefei Nexchip Integrated Circuit has applied Chinese patent for Semiconductor Process Exception Handling Method, Device, Equipment, Medium and Program Product. Wang Youxiang developed it.
The patent application number is CN202610795944 20260604. The patent publication number is CN122333300 (A). Internation..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- China University of Mining and Technology, Beijing has submitted a patent application for Ground Penetrating Radar Dielectric Property Inversion Method Based on Fdtd Physical Constraint. This invention was developed by Li Fanruo, Shi Wenxing, Peng Suping and Yang Feng.
The patent application number is CN20..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Hangzhou Cobetter Semiconductor Separation Membrane has been awarded a patent for Pneumatic Combination Valve. This invention was developed by Jia Jiandong, Wang Zhening, Shan Wen and Cai Shiming.
The patent application number is CN202520582709U 20250331. The patent publication number is CN223814382 (U). I..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Hangzhou Cobetter Semiconductor Separation Membrane has been granted a patent for Metal Diaphragm Valve. Jia Jiandong, Zhou Wenqiang and Liu Mingming developed the invention.
The patent application number is CN202520348794U 20250228. The patent publication number is CN223814376 (U). International Patent Cl..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Seratu Prec Electronic Xiamen Co Ltd has been awarded a patent for Light-emitting and Power-generating Water Outlet Nozzle. This invention was developed by Gao Chidi.
The patent application number is CN202520415148U 20250311. The patent publication number is CN223813793 (U). International Patent Classifica..
Semiconductor
| Mon 12 Oct 2026
Beijing, Oct. 12 -- Beijing Zitiao Network Technology has applied Chinese patent for Recovery Method and Equipment of Video Memory, Storage Medium and Computer Program Product. Liu Zhaoyu, Song Yuanzheng, Liu Qi and Li Wenjie developed it.
The patent application number is CN20251009989 20250102. The patent publication number ..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Jiangsu Donghai Semiconductor has been granted a patent for Chip Placing Rack with Adjusting Structure. Xia Huaqiu and Huang Haibiao developed the invention.
The patent application number is CN202422840076U 20241120. The patent publication number is CN223817272 (U). International Patent Classification code..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Suzhou Guishi Technology has secured a patent on Chip Membrane Expansion Separation Device. Deng Zelong, Yan Changming and Huang Lingshan developed the invention.
The patent application number is CN202520209030U 20250210. The patent publication number is CN223816390 (U). International Patent Classification..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Center has submitted a patent application for Chip Prototype Verification Method and Device, Product, Equipment and Medium. Zhang Jin, Li Changyun and Chen Bei developed the invention.
The patent application number is CN202610737947 20..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published Yangtze Memory Tech Holding Co Ltd patent application for Semiconductor Devices and Fabricating Methods Thereof. The invention was developed by Sun Changzhi, Xia Zhiliang, Zhou Wenxi and Wang Di.
The patent application number is US202519236810 20250612. The..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Chinese Patent for Tail Gas Treatment Equipment for Semiconductor Chip Welding has been issued to Zhangjiagang Dazheng Electrical Appliance Complete Set Equipment Co Ltd. This invention was developed by Feng Kunpeng.
The patent application number is CN202520368667U 20250305. The patent publication number i..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Guizhou Provincial Tobacco Company, Liupanshui has obtained a patent for mushroom substrate turning device. This invention was developed by Huang Zhanping, Pu Weisong, Zhang Jiali, Gao Qiang, Lou Fangneng and Yi Kai.
The patent application number is CN202520126503U 20250120. The patent publication number is ..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- ROHM has submitted a patent application for Semiconductor Device. Murasaki Kohei developed the invention.
The patent application number is US202619679862 20260518. The patent publication number is US20260304963 (A1). International Patent Classification codes are H10D12/00, H10D8/00, H10D84/00 and H10D89..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor has sought patent for Standard Cells with Multi-well Size Placements. This invention was developed by Wang Xiaodong, Liaw Jhon Jhy and Tung Yu-lung.
The patent application number is US202619696644 20260603. The patent publication number is US20260304962 (A1). International Patent Clas..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Microsoft Technology Licensing has sought patent for Systems Including Two-die Integrated Circuit (IC) Packages and Homogeneously-oriented Memory Connectors and Related Methods. This invention was developed by Shah Hima, Li Peng, Lee Cliff C, Shaik Gouse Babu and Remaklus Jr Perry Willmann.
The patent a..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor Manufacturing Co Limited has applied United States patent for Shielded Deep Trench Capacitor Structure and Methods of Forming the Same. Lee Chien-chang, Chang Jen-yuan and Lai Chia-ping developed it.
The patent application number is US202619705923 20260612. The patent publication nu..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Nantong Limeng New Material Technology has obtained a patent for auxiliary device for compound preparation of semiconductor viscosity-reducing film. This invention was developed by Sun Zhihuai, Kim Yong-ki and Mao Rongzhen.
The patent application number is CN20242313916U 20241207. The patent publication numb..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor has submitted a patent application for Semiconductor Structure. Liaw Jhon-jhy developed the invention.
The patent application number is US202519093886 20250328. The patent publication number is US20260304954 (A1). International Patent Classification codes are H10D84/90 and H10D89/10. ..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Intel has submitted a patent application for Gate-all-around Integrated Circuit Structures Having Detuned Devices. This invention was developed by Bennett David, Wei Liqiong, Huang Cheng-ying, Wiedemer Jami, Qayyum Munzarin, Kobrinsky Mauro J, Mahadevan Pillai Anandkumar, Subramaniam Seenivasan, Morrow Pat..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has received Intel patent application for Tub Forksheet and CFET Architectures for Reduced Spacing of Complementary Transistors. Lavric Dan, Glass Glenn and Guler Leonard developed the invention.
The patent application number is US202519092834 20250327. The patent publicat..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Samsung Electronics has filed a patent application for Semiconductor Device. This invention was developed by Yang Nakyoung, Yang Youngjin, Park Wooseok and Koo Jehyoung.
The patent application number is US202519301302 20250815. The patent publication number is US20260304945 (A1). International Patent Cl..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor has filed a patent application for Semiconductor Structure and Method for Forming the Same. This invention was developed by Tsai Ming-heng, Chen Hong-chih, Lin Ta-chun and Liaw Jhon-jhy.
The patent application number is US202519093740 20250328. The patent publication number is US20260..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor has sought patent for Semiconductor Device Structure and Method for Forming the Same. This invention was developed by Chang Chih-hao, Lu Yu-hsuan, Shen Jyun-yang, Lin Ta-chun and Liaw Jhon-jhy.
The patent application number is US202519092117 20250327. The patent publication number is ..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- IBM has filed a patent application for Backside Contact with Epitaxial Liner. This invention was developed by Xie Ruilong, Cho Eunsoo, Natarajan Kishore, Zhou Huimei, Gluschenkov Oleg and Nguyen Thanh.
The patent application number is US202519091917 20250327. The patent publication number is US202603049..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Intel has sought patent for Integrated Circuit Structures Having Hybrid Spine-FET Architecture. This invention was developed by Nguyen Peter, Khandelwal Nidhi, Karumuri Sriharsha, Luthra Prabhjot Kaur, Pursel Sean, Guler Leonard P, Jayanti Srikant, Sung Seung Hoon, Shu Andrew, Rho Kyeonglan and Shoer Leah...
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published Samsung Electronics patent application for Semiconductor Device Including a Buried Pattern. The invention was developed by Kim Byoung-gi, Chae Myeonggyoon, Kim Beomjin and Kim Junsoo.
The patent application number is US202519437024 20251230. The patent publ..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Samsung Electronics has sought patent for Semiconductor Device Including Internal Spacer Layers. This invention was developed by Kim Youngjun and Park Sangjine.
The patent application number is US202519357601 20251014. The patent publication number is US20260304932 (A1). International Patent Classificat..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Dongxin Microelectronic Yiwu Co Ltd has secured a patent on Coating Device for Integrated Circuit Packaging. Liang Yi developed the invention.
The patent application number is CN202423205819U 20241225. The patent publication number is CN223818958 (U). International Patent Classification codes are B05B12/32..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor has submitted a patent application for Multi-gate Devices with Reduced Parasitic Capacitance and Methods of Forming the Same. Lin Shih-che, Huang Hsu-chia, Chen Chia-cheng, Wang Bau-ming and Yen Te-jui developed the invention.
The patent application number is US202519279590 20250724. ..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Intel has sought patent for Semiconductor Devices with Gate Cut Structures Integrated with Fin Cut Structures. This invention was developed by Bouche Guillaume, Jun Hwichan and Fang Sheng-po.
The patent application number is US202519092426 20250327. The patent publication number is US20260304927 (A1). I..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor has applied United States patent for Nanosheet Semiconductor Device and Method for Manufacturing the Same. Chu Lung-kun, Hsu Chung-wei, Yu Jia-ni, Chiang Kuo-cheng and Wang Chih-hao developed it.
The patent application number is US202519092202 20250327. The patent publication number i..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Samsung Electronics has submitted a patent application for Semiconductor Device Including Active Pattern and Insulation Structure. This invention was developed by Ji Sungyub, Huh Daihong, Kim Dahye and Yun Cheoljin.
The patent application number is US202619631847 20260327. The patent publication number ..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Uhoyan Technology Suzhou has been awarded a patent for Nozzle Fixing Device of Gluing Developer. This invention was developed by Zhou Xiubin and An Liyu.
The patent application number is CN20252095535U 20250116. The patent publication number is CN223818948 (U). International Patent Classification codes are B..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Intel has submitted a patent application for Channel Width and Quantity Variation in Gate-all-around and Forksheet Transistors. This invention was developed by Wallace Charles H, Shi Quan, Li Xia and Morrow Patrick.
The patent application number is US202519092442 20250327. The patent publication number is..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor patent application for Method for Forming Semiconductor Structure. The invention was developed by You Jia-chuan, Pan Kuan-ting, Chiang Kuo-cheng, Wang Chih-hao and Chang Chia-hao.
The patent application number is US202619705837 20260612. ..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Texas Instruments has submitted a patent application for Monolithic Integration of III-N Devices Including a Conductive Layer. This invention was developed by Lee Dong Seup.
The patent application number is US202519096024 20250331. The patent publication number is US20260304919 (A1). International Paten..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has awarded a patent to Jet Life Tech Hangzhou Co Ltd for Spray Head State Maintenance Device and DNA Chip Printing Synthesis System. Jiao Zhihua, Chen Li, Wang Jing, Wang Qingbo and Wen Zhiming developed the invention.
The patent application number is CN20252016..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Microchip Technology has sought patent for Device with FET Gate and Schottky Barrier Diode in Same Trench. This invention was developed by Pandey Shesh Mani.
The patent application number is US202619571276 20260318. The patent publication number is US20260304917 (A1). International Patent Classification c..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Microchip Technology has filed a patent application for Apparatus Including FET and Integrated Sbd Located Inside of FET Unit Cell. This invention was developed by Pandey Shesh Mani.
The patent application number is US202619556900 20260304. The patent publication number is US20260304916 (A1). Internationa..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor Manufacturing has applied United States patent for Fin Isolation Regions with Improved Depth Distribution and Methods Forming the Same. Lin Tzu-ging, Chen Yi-chun and Lin Jih-jse developed it.
The patent application number is US202619704080 20260610. The patent publication number is U..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Stacked Transistor Isolation Features and Methods of Forming the Same. This invention was developed by Hung Yi-ching, Chuang Yen, Lim Zheng Hui, Jhan Shun-siang, Tsai Ji-yin and Chen Chun Wei.
The patent application number is US2026..
Semiconductor
| Tue 13 Oct 2026
Alexandria, Oct. 12 -- GlobalFoundries has submitted a patent application for Transistor Structures with Interleaved Body Contacts and Gate Contacts. This invention was developed by Shank Steven M and Vanukuru Venkata Narayana Rao.
The patent application number is US202619707516 20260615. The patent publication number is US2026..
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