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Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- State Intellectual Property Office of China has released Rongyao Semiconductor Material, Jiashan patent application for Semiconductor Precision Part Transfer Box Fixing Structure. This invention was developed by Zhu Mingwei, Hong Qiaoshui and Wang Haiyang. The patent application number is CN20261045235 202..

Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- China Tiesiju Civil Engineering Group has filed a patent application for Silo Interior Buffer Cleaning Segment Device and Using Method Thereof. This invention was developed by Li Yuhong, Zhou Xiangyu, Song Haibo, Li Shuo, Duan Lei, Shi Yan, Du Xingping, Yan Zhong, Zhang Longfan, Wang Song, Hu Xiaolong, Shen W..

Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- State Intellectual Property Office of China has released Focuslight Technologies patent application for Spatial Spectrum Test System for Semiconductor Laser. This invention was developed by Chai Xuefeng and Shen Zenan. The patent application number is CN202411258438 20240909. The patent publication number ..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Hitachi has sought patent for Power Converter, Diagnosis System, and Diagnosis Method. This invention was developed by Kimura Yoshinobu. The patent application number is WO2025JP40920 20251125. The patent publication number is WO2026121067 (A1). International Patent Classification code is H02M7/48. An a..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has received CXMT patent application for Integrated Circuit Package. Liu Xiaoping, Lee Tzung-han and Liu Chih-cheng developed the invention. The patent application number is WO2025CN121465 20250916. The patent publication number is WO2026118617 (A1). International Pa..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- CXMT has submitted a patent application for Semiconductor Structure and Preparation Method Therefor. This invention was developed by Li Huihui, Tang Yi, Meng Hao and See Kai Hung Alex. The patent application number is WO2025CN139534 20251203. The patent publication number is WO2026119163 (A1). International..

Semiconductor

  |  Thu 18 Jun 2026

Geneva, June 19 -- OMICRON Electronics has filed a patent application for Method and Arrangement for Testing an Earthing System. This invention was developed by Pikisch Moritz. The patent application number is WO2025EP84668 20251128. The patent publication number is WO2026119717 (A1). International Patent Classification codes a..

Semiconductor

  |  Thu 18 Jun 2026

Beijing, June 19 -- Chenwei Equipment Technology Suzhou has filed a patent application for Isolation Valve Device and Semiconductor Device. This invention was developed by Liang Junlong and Yin Yanchao. The patent application number is CN202610156620 20260204. The patent publication number is CN121631020 (A). International Pate..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Semiconductor Energy Laboratory has filed a patent application for Semiconductor Device and Method for Producing Semiconductor Device. This invention was developed by Abe Sota, Yamazaki Shunpei and Sawai Hiromi. The patent application number is WO2025IB62238 20251201. The patent publication number is WO202612..

Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- IRICO Hefei LCD Glass has filed a patent application for Glass Substrate Defect Detection Device. This invention was developed by Ji Hui, Xie Ning, Gu Quan and Xie Lingling. The patent application number is CN202511891543 20251216. The patent publication number is CN121633111 (A). International Patent Classi..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Tokyo Electron has filed a patent application for Substrate Processing Method. This invention was developed by Dobashi Kazuya, Sekiguchi Kenji, Itagaki Yuto and Tsuzuki Reiko. The patent application number is WO2025JP38103 20251030. The patent publication number is WO2026120948 (A1). International Patent Clas..

Semiconductor

  |  Thu 18 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has received ASML Netherlands patent application for Method of Selecting a Focal Position of a Charged Particle-optical Device, and Charged Particle-optical Device. Steunebrink Martin, Annema Piter and Zolotarev Evgeny developed the invention. The patent application nu..

Semiconductor

  |  Thu 18 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has received ASML Netherlands patent application for Methods and Systems for Removing Contaminants in a Radiation Source. Ma Yue, Aouaj Younes, Brown Joshua C and Yeremenko Sergiy developed the invention. The patent application number is WO2025EP80675 20251023. The pat..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has received Tokyo Electron patent application for Substrate Processor and Method for Opening/closing Lid. Honma Manabu developed the invention. The patent application number is WO2025JP40464 20251119. The patent publication number is WO2026121041 (A1). International P..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has received Caihong Display Devices patent application for Overflow Brick, Device and Method for Stably Producing Substrate Glass. Xu Jian, Zhao Longjiang, Luo Ting, Ren Yongjing, Hu Weidong and Zhang Zhijun developed the invention. The patent application number is WO..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has received LONGi Green Energy Technology patent application for Solar Cell, Photovoltaic Module and Semiconductor Substrate. Ding Chao, Li Wenqiang, Wang Yong, Dong Guangbin, Tong Hongbo and Yu Long developed the invention. The patent application number is WO2025CN13..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has received Shenzhen Smoore Technology patent application for Coffee Extract, Coffee Extract Diluent, Atomization Substrate and Electronic Atomization Device. Xia Yan, Lin Bin, Liu Boke, Lv Junwei, Li Yang, Lv Qiaolu and Yuan Jinfang developed the invention. The paten..

Semiconductor

  |  Thu 18 Jun 2026

Beijing, June 19 -- Qingdao University of Technology has applied Chinese patent for Method and System for Determining Thickness of Semiconductor Epitaxial Layer Based on Transmission Matrix Method. Xu Wei, Sang Chaohui, Shi Hanyang, Zhao Shijun and Zhang Chenglin developed it. The patent application number is CN202511859670 202..

Semiconductor

  |  Thu 18 Jun 2026

Beijing, June 19 -- Tuojing Chuangyi Shenyang Semiconductor Equipment has applied Chinese patent for Gas Distribution System, Process Equipment of Semiconductor Device and Process Method of Semiconductor Device. Wu Yue, Zhang Zhimin, Ju Zichen, Liu Qichao and Feng Peng developed it. The patent application number is CN2025118452..

Semiconductor

  |  Thu 18 Jun 2026

Geneva, June 19 -- Schott AG has applied WIPO patent for Coated Substrate with Transparent, Low-refractive Coating. Damm Thorsten, Schneider Thorsten, Gönüllü Yakup, Woywod Tanja and Rudigier-voigt Eveline developed it. The patent application number is WO2025EP84847 20251201. The patent publication number is WO2026119762 (A1..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Mitsubishi Gas Chemical has applied WIPO patent for Resin Composition, Cured Object, Resin Composite Sheet, Prepreg, Metal-foil-clad Laminate, Printed Wiring Board, and Semiconductor Device. Okamura Shoma, Komatsu Kouki and Hirano Shunsuke developed it. The patent application number is WO2025JP41327 20251127...

Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- Liaoning Normal University has applied Chinese patent for Preparation Method and Application of Mn2+-mos2-ag Surface Enhanced Raman Spectrum Substrate. Quan Yingnan, Zhao Jiaxu, Liu Huan, Zhao Shulin, Sun Jingchang and Cui Xiaofan developed it. The patent application number is CN202511950960 20251223. The pa..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Shenzhen Zhuojian Intelligent Manufacturing has applied WIPO patent for Ball Grid Array Packaged Chip Having Reinforcing Solder Balls, and Electrical Device and Mobile Platform. Ding Clark and Chen Jk developed it. The patent application number is WO2025CN121490 20250916. The patent publication number is WO20..

Semiconductor

  |  Thu 18 Jun 2026

Geneva, June 19 -- Nexperia has sought patent for a Method for Manufacturing a Semiconductor Device, a Semiconductor Device, a Lead Frame Structure and a Moulding Form. This invention was developed by Yuan Zhihui, Liu Xu, Gong Wei and Minotti Agatino. The patent application number is WO2025EP85752 20251205. The patent publicati..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Panasonic Intellectual Property Management has sought patent for Component Mounting Method, Method for Manufacturing Mounted Substrate, and Mounted Substrate. This invention was developed by Yanai Youichi, Sakai Tadahiko, Maeda Tadashi and Yoshioka Yuki. The patent application number is WO2025JP42077 20251203..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Tokyo Electron has sought patent for Film Deposition Method, Film Deposition Device and Film Deposition System. This invention was developed by Kaneko Miyako, Kikuchi Takamichi and Mitsunari Tadashi. The patent application number is WO2025JP41125 20251126. The patent publication number is WO2026121084 (A1). I..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Fasford Technology has sought patent for Semiconductor Manufacturing Device, Inspection Device, Inspection Method, and Method for Manufacturing Semiconductor Device. This invention was developed by Kobashi Hideharu. The patent application number is WO2025JP36993 20251021. The patent publication number is WO20..

Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- Beijing Institute of Mechanical Equipment has sought patent for Magnetic Control Device and Method for Micro-fluidic Chip. This invention was developed by Wang Zhongjing, Yang Mingzhu, Zang Jinliang, Xu Nuo, An Lingchun and Hou Hongqu. The patent application number is CN202511481801 20251016. The patent publ..

Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- Beijing Institute of Mechanical Equipment has sought patent for Reusable Micro-fluidic Chip and Use Method Thereof. This invention was developed by Han Danhong, Zang Jinliang, Wang Xinchang, Xu Nuo, Zhang Danmei and Wang Yifan. The patent application number is CN202511446828 20251010. The patent publication ..

Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- Northwestern Polytechnical University has sought patent for Heat-insulating Flexible Composite Substrate for Metal Additive Manufacturing and Application Method of Heat-insulating Flexible Composite Substrate. This invention was developed by Lu Xufei, Xu Yuting, Lin Xin, Liu Yongming and Liu Jianrui. The pat..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Huawei Technologies has sought patent for Window Control Method, Terminal Device, Chip System, and Storage Medium. This invention was developed by Chen Shaopeng and Xu Chao. The patent application number is WO2025CN118067 20250829. The patent publication number is WO2026118570 (A1). International Patent Class..

Semiconductor

  |  Thu 18 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has published ASML Netherlands patent application for Modular Laser System. The invention was developed by Brown Daniel, Purvis Michael, Mulder Heine and Wagner Christian. The patent application number is WO2025EP83289 20251117. The patent publication number is WO20261..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has published Semiconductor Energy Laboratory patent application for Light-emitting Device. The invention was developed by Kajiyama Kazuki, Hashimoto Naoaki, Suzuki Tsunenori, Hayashi Yuki and Kawakami Sachiko. The patent application number is WO2025IB62239 20251201. T..

Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- State Intellectual Property Office of China has published Southchip Semiconductor Technology, Shanghai patent application for Temperature Detection Circuit and Method, Chip and Electronic Equipment. The invention was developed by Zhang Hongkai. The patent application number is CN202610150830 20260203. The pa..

Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- State Intellectual Property Office of China has published Rongyao Terminal patent application for Ambient Light Detection Circuit, Electronic Equipment and Chip System. The invention was developed by Deng Jun. The patent application number is CN202411170493 20240823. The patent publication number is CN121632..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has published LG Electronics patent application for Substrate for Transferring Semiconductor Light-emitting Elements and Method for Producing Same. The invention was developed by An Jaeyong, Song Hooyoung, Jeon Kiseong and Chung Indo. The patent application number is W..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has published Fujifilm patent application for Resin Composition, Cured Product, Transfer Film, Laminate, Method for Producing Cured Product, Method for Producing Laminate, Method for Producing Semiconductor Device, and Semiconductor Device. The invention was developed b..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has published Fujifilm patent application for Resin Composition, Cured Product, Transfer Film, Laminate, Method for Producing Cured Product, Method for Producing Laminate, Method for Manufacturing Semiconductor Device, and Semiconductor Device. The invention was develop..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has published NVIDIA patent application for Application Programming Interface to Cause Measurement of Processor Activity. The invention was developed by Guo Huizhen, Stolle Brent, Wightman Douglas, Narayanaswamy Sreedhar, Van De Groenendaal Joannes, Oza Rucha and Patel ..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has published Huawei Technologies patent application for Communication Method, Communication Apparatus, Communication System, Chip System, Program Product, and Storage Medium. The invention was developed by Ma He, Ma Mengyao and Huang Huang. The patent application numb..

Semiconductor

  |  Thu 18 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has released Fraunhofer-Gesellschaft patent application for Method for Depositing Crystalline Semiconductors Onto a Substrate. This invention was developed by Hecker Dominic, Pingen Katrin, Bartzsch Hagen, Hinz Alexander Martin and Neidhardt Jörg. The patent applicati..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has released Nissan Chemical patent application for Composition for Forming Resist Underlayer Film, Resist Underlayer Film, Method for Forming Resist Pattern, and Method for Manufacturing Semiconductor Device. This invention was developed by Mitsutake Yuki and Morozumi ..

Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- State Intellectual Property Office of China has released Southwest China Research Institute Electronic Equipment patent application for Method for Surface Modification and Bonding Strength Enhancement of Curved Surface Circuit Polyimide Substrate. This invention was developed by Fang Jie, Pang Ting, Wan Yangt..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has released CXMT patent application for Three-dimensional Semiconductor Device and Manufacturing Method Therefor. This invention was developed by Chen Wenjing. The patent application number is WO2025CN128116 20251016. The patent publication number is WO2026118677 (A1)..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has released Beijing NAURA Microelectronics Equipment patent application for Exhaust Duct Cleaning Apparatus and Semiconductor Process Device. This invention was developed by Song Aijun, Zhao Hongyu, Tu Nan, Xu Lu, Lu Xisheng, Zhang Yutao, Wang Ruiting and Wang Yan. Th..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- World Intellectual Property Organization has released LONGi Green Energy Technology patent application for Solar Cell, Photovoltaic Module and Semiconductor Substrate. This invention was developed by Ding Chao, He Jinhua, Li Wenqiang, Wang Yong, Dong Guangbin, Tong Hongbo and Yu Long. The patent application n..

Semiconductor

  |  Thu 18 Jun 2026

Taipei, June 18 -- ACM Research Shanghai Inc, ACM Research Korea Co Ltd and Cleanchip Tech Limited have submitted a patent application for Substrate Cleaning Device, Cleaning Method and Gluing and Developing Equipment. Yuan Kai-jie, Wang Hui, Wu Yan, Xu Fei, Wu Jun and Lee Kang-sik developed the invention. The patent applicat..

Semiconductor

  |  Thu 18 Jun 2026

Taipei, June 18 -- ASML Netherlands BV,Univ Amsterdam, Stichting Nederlandse Wetenschappelijk Onderzoek Institute and Stichting Vu have sought patent for Multi Core Waveguides for Semiconductor Metrology Systems and Methods. This invention was developed by Goorden Sebastianus Adrianus, Abrashitova Ksenia, Sokolov Sergei, Amitono..

Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- State Intellectual Property Office of China has released Fudan University patent application for Paper-based Micro-fluidic Chip Device and Method for Immediately Detecting Blood Metabolism Markers by Using Paper-based Micro-fluidic Chip Device. This invention was developed by Wang Yulan, Tang Huiru and Kong B..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Semiconductor Energy Laboratory has submitted a patent application for Storage Device. This invention was developed by Inoue Hiroki and Matsuzaki Takanori. The patent application number is WO2025IB62237 20251201. The patent publication number is WO2026120431 (A1). International Patent Classification codes are..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Semiconductor Energy Laboratory has submitted a patent application for Metal Oxide Layer Formation Method. This invention was developed by Matsuki Mitsuhiro, Ishitani Tetsuji, Adachi Hiroki, Yamazaki Shunpei and Sawai Hiromi. The patent application number is WO2025IB62236 20251201. The patent publication numb..

Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- Zhejiang Dahua Technology has submitted a patent application for Substrate Corrosion Resistance Prediction Method, Electronic Equipment and Computer Readable Storage Medium. This invention was developed by Cao Jiajun, Chen Sihang, Su Guanghao, Ji Guowei, Zhang Wenjie and Shuai Shuxin. The patent application ..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Resonac has submitted a patent application for Resin Composition, Resin Film, Resin Film with Support, Printed Wiring Board, and Semiconductor Package. Uchiyama Tomomi, Kuzuoka Hiroki and Suzuki Takayuki developed the invention. The patent application number is WO2025JP41304 20251127. The patent publication n..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- ROHM has submitted a patent application for Semiconductor Device, Vehicle, and Method for Manufacturing Semiconductor Device. Sato Oji and Hiiragi Hikaru developed the invention. The patent application number is WO2025JP41096 20251126. The patent publication number is WO2026121081 (A1). International Patent C..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Tokyo Electron has submitted a patent application for Information Processing Method, Computer Program, and Information Processing Device. This invention was developed by Nakamura Hiroshi and Enomoto Masashi. The patent application number is WO2025JP40954 20251125. The patent publication number is WO2026121070..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Daikin India has submitted a patent application for Rubber Composition, Rubber Member, and Semiconductor Manufacturing-related Device. This invention was developed by Okuno Shingo and Nakayasu Hiroki. The patent application number is WO2025JP41690 20251128. The patent publication number is WO2026121163 (A1). ..

Semiconductor

  |  Thu 18 Jun 2026

Geneva, June 19 -- ASML Netherlands has submitted a patent application for Laser Beam Transport System. This invention was developed by Brown Daniel, Purvis Michael, Mulder Heine and Wagner Christian. The patent application number is WO2025EP82628 20251111. The patent publication number is WO2026119518 (A1). International Paten..

Semiconductor

  |  Thu 18 Jun 2026

Geneva, June 19 -- ASML Netherlands has submitted a patent application for Interferometer System, Method of Measuring a Movement of a Measurement Surface with Respect to a Reference Surface, Projection System and Lithographic Apparatus. This invention was developed by Kwee Patrick, Widdershoven Ivo and Duys Anton. The patent ap..

Semiconductor

  |  Thu 18 Jun 2026

Geneva, June 19 -- Wacker Chemie AG has submitted a patent application for Computer-implemented Method for Evaluating Rods Made of Semiconductor Material. Wenzeis Markus, Filar Piotr, Bierschneider Johannes, Lau Wolfgang and Ackermann Daniel developed the invention. The patent application number is WO2024EP88124 20241220. The p..

Semiconductor

  |  Thu 18 Jun 2026

Geneva, June 19 -- Wacker Chemie AG has submitted a patent application for Method for Producing and Classifying Rods Made of Semiconductor Material. Wenzeis Markus, Sommerauer Stefan, Filar Piotr and Ackermann Daniel developed the invention. The patent application number is WO2024EP84938 20241205. The patent publication number ..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Meta Bounds has submitted a patent application for Photopolymer-type Holographic Recording Medium and Method for Treating Substrate. This invention was developed by Guan Jian, Guo Bin and Wang Zhaomin. The patent application number is WO2025CN102057 20250619. The patent publication number is WO2026118418 (A1)..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Actions Technology has submitted a patent application for Channel Selection Method and Chip. Chen Jinhong developed the invention. The patent application number is WO2025CN137470 20251125. The patent publication number is WO2026118944 (A1). International Patent Classification code is H04W72/0453. World Inte..

Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- Pingxiang University has submitted a patent application for Synthesis Method of Dark Blue Organic Light Emitting Diode Material Benzo [k] Fluoranthene Structure. Yu Qinqin, Jiang Bohan, Yan Genping, Li Yalun, Yang Xueqing and Yun Ga-lim developed the invention. The patent application number is CN202511630637..

Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- Ji Hua Laboratory has submitted a patent application for Large-size Substrate Lifting Device and Control Method and Carrying Device Thereof. This invention was developed by Huang Zixiang, Cao Donghao, Wang Shuhui and Li Qi. The patent application number is CN20261092078 20260123. The patent publication numbe..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- NVIDIA has submitted a patent application for Converting Non-unique Wireless Device Identifiers to Unique Wireless Device Identifiers. Schmitz David, Tomar Nidhi, Huang Yan, Gadiyar Rajesh Hejmady and Wu Jinyou developed the invention. The patent application number is WO2024CN137409 20241206. The patent publi..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Guangdong OPPO Mobile Telecommunications has submitted a patent application for Wireless Communication Method, and Device, Chip and Storage Medium. This invention was developed by Xing Jinqiang, Zhang Juan, Zhou Rui and Liu Qifei. The patent application number is WO2024CN136900 20241204. The patent publicatio..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- BOE Technology Group has submitted a patent application for Light-emitting Substrate. This invention was developed by Han Tianyang, Zhang Keyi, Liu Wenqi, Sun Zhongyuan, Wang Weijie, Gao Tianhang and Zhang Fengjie. The patent application number is WO2024CN136106 20241202. The patent publication number is WO20..

Semiconductor

  |  Fri 19 Jun 2026

Geneva, June 19 -- Guangdong OPPO Mobile Telecommunications has submitted a patent application for Data Transmission Method and Apparatus, and Device, Chip and Storage Medium. This invention was developed by Zhang Shichang. The patent application number is WO2024CN136091 20241202. The patent publication number is WO2026117887 (..

Semiconductor

  |  Fri 19 Jun 2026

Beijing, June 19 -- China Japan Friendship Hospital China Japan Friendship Institute of Clinical Medicine has submitted a patent application for 3D Synovial Membrane Cartilage Organ Chip with Bionic Structure as Well as Preparation Method and Application of 3D Synovial Membrane Cartilage Organ Chip. Liu Huancai, Wang Weiguo, Gao..

Semiconductor

  |  Wed 17 Jun 2026

Beijing, June 18 -- Shanghai Jifeng Technology and Chengdu Jifeng Detection Tech Co Ltd have submitted a patent application for Preparation Method of Silicon Through Hole Cross Section Sample of Bonding Wafer. This invention was developed by Ni Weihua, Zheng Chaohui and Yang Heng. The patent application number is CN2026107762..

Semiconductor

  |  Wed 17 Jun 2026

Taipei, June 18 -- Tsmc China Company Ltd and Taiwan Semiconductor Manufacturing have submitted a patent application for Integrated Circuit and Method for Forming the Same. This invention was developed by Li Lian-jie, Gui Lin-chun, Li Xue-peng and Huang Tsung-yi. The patent application number is TW20250103416 20250124. The pa..

Semiconductor

  |  Wed 17 Jun 2026

Taipei, June 18 -- Hoya Optical Technology Weihai Co Ltd and Hoya have submitted a patent application for Optical Glass and Optical Element. This invention was developed by Negishi Tomoaki and Kinezuka Shohei. The patent application number is TW20250109064 20250312. The patent publication number is TW202547803 (A). Internatio..

Semiconductor

  |  Wed 17 Jun 2026

Taipei, June 18 -- Global Unichip Corp and Taiwan Semiconductor Manufacturing have submitted a patent application for Heterogeneous Thermal Interface Material Element and Pressing Test Device Having the Same. This invention was developed by Liao Chih-chieh, Sun Yu-min and Cheng Chih-feng. The patent application number is TW20..

Semiconductor

  |  Wed 17 Jun 2026

Taipei, June 18 -- Taiwan Semiconductor Mfg Co Ltd and National Cheng Kung University have submitted a patent application for Semiconductor Device and Operating Method Thereof. This invention was developed by Cheng Kuang-wei and Wang Sin. The patent application number is TW20240143438 20241112. The patent publication number i..

Semiconductor

  |  Wed 17 Jun 2026

Taipei, June 18 -- Semes Co Ltd and Samsung Electronics have submitted a patent application for Substrate Bonding Apparatus. This invention was developed by Lee Se-hyun, Park Sang-hoon and Baek In-hwa. The patent application number is TW20250104235 20250206. The patent publication number is TW202546959 (A). International Pate..

Semiconductor

  |  Wed 17 Jun 2026

Beijing, June 18 -- Changchun Institute of Optics, Fine Mechanics & Physics of the Chinese Academy of Sciences and Jilin Changguang Jixin Tech Co Ltd have submitted a patent application for Quantitative Analysis Method for Migration Characteristics of Indium Component in Epitaxial Wafer. Liang Lei, Lei Yuxin, Chen Yongyi, Wang Y..

Semiconductor

  |  Wed 17 Jun 2026

Beijing, June 18 -- State Power Investment Tech Incubation Co Ltd and Shanghai Nuclear Engineering Research & Design Institute have submitted a patent application for Analysis Method and System for Failure Probability of Silicon Carbide Pressurized Water Reactor Fuel Rod Cladding. This invention was developed by Jin Dali, Yue Zi..

Semiconductor

  |  Wed 17 Jun 2026

Taipei, June 18 -- Univ Nat Tsing Hua and Taiwan Semiconductor Manufacturing have submitted a patent application for Photoresist Composition, Lithography Method and Extreme Ultraviolet Lithography Method. Tseng Yu-fang, Chou Chun-fu, Liu Jui-hsiung, Gau Tsai-sheng, Chen Po-hsiung, Lin Burn-jeng, Lin Burn Jeng and Liu Chen-yu dev..

Semiconductor

  |  Thu 18 Jun 2026

Beijing, June 18 -- Beijing Xiaomi Mobile Software and Beijing Xiaomi Songguo Elect Co Ltd have submitted a patent application for Sound Area Determination Method and Device, Equipment, Storage Medium and Chip. Wu Junnan, Gao Peng, Wang Peng, Hwang Myung-woon and Yu Bolun developed the invention. The patent application number..

Semiconductor

  |  Thu 18 Jun 2026

Taipei, June 18 -- Hoya Optical Technology Weihai Co Ltd and Hoya have submitted a patent application for Optical Glass and Optical Element Having a High Relative Partial Dispersion (PC,T) and a Low Relative Partial Dispersion (PG,F). This invention was developed by Shimada Keita and Shoji Akihiro. The patent application numb..

Semiconductor

  |  Thu 18 Jun 2026

Taipei, June 18 -- Tokyo Electron Ltd and Geminatio have submitted a patent application for Anti-spacer Masking Process Using Resist Layer with Solubility Shifting Agent. This invention was developed by Greenough Jordan B, Hustad Phillip D and Klemes Max J. The patent application number is TW20240150362 20241224. The patent p..

Semiconductor

  |  Thu 18 Jun 2026

Beijing, June 18 -- Xian Xinxin Material Tech Co Ltd and Xi'an ESWIN Material Technology have submitted a patent application for Crystal Pulling Control Method and Device for Monocrystalline Silicon and Related Equipment. Yang Song and Zhao Liang developed the invention. The patent application number is CN202511826516 2025120..

Semiconductor

  |  Thu 18 Jun 2026

Taipei, June 18 -- Global Unichip Corp and Taiwan Semiconductor Manufacturing have submitted a patent application for Substrate Structure and Semiconductor Package. This invention was developed by Li Bo-yan, Tseng Li-ya, Lin Yi-tzeng, Jian Wen-yi, Chen Liang-kai, Hung Chih-chiang, Lin Yuan-hung and Yang Sheng-fan. The patent ..

Semiconductor

  |  Thu 18 Jun 2026

Taipei, June 18 -- Tsmc China Company Ltd and Taiwan Semiconductor Manufacturing have submitted a patent application for Apparatus and Method for Handling Wafer Storage Box. This invention was developed by Jin Xiao and Sun Qin. The patent application number is TW20250102609 20250121. The patent publication number is TW2025449..

Semiconductor

  |  Wed 17 Jun 2026

Taipei, June 18 -- Niko Semiconductor Co Ltd and Super Group Semiconductor Co Ltd have sought patent for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Chen Ho-tai, Tang Sung-nien and Hsu Hsiu-wen. The patent application number is TW20240119086 20240523. The patent publication number is..

Semiconductor

  |  Wed 17 Jun 2026

Taipei, June 18 --TSMC China Company Ltd and Taiwan Semiconductor Manufacturing have sought patent for Monitor System and Operation Method Thereof. This invention was developed by Chen Lei, Ma Lin, Zhu Hong-hua and Zhu Honghua. The patent application number is TW20240126093 20240711. The patent publication number is TW2025469..

Semiconductor

  |  Wed 17 Jun 2026

Beijing, June 18 -- Yuelu Mountain Ind Innovation Center and Hunan Normal University have sought patent for Silicon Optical Integrated Magneto-optical Sensing Chip and Manufacturing Method Thereof. This invention was developed by Ouyang Sihui, Guan Xinzhou, Pan Anlian and Gan Ziyang. The patent application number is CN2026107..

Semiconductor

  |  Thu 18 Jun 2026

Beijing, June 18 -- Hunan Institute of Engineering and Central South University have sought patent for Gas Detection System for Compound Semiconductor Film Deposition. This invention was developed by Huang Xinyan, Lin Lixin, Wang Hui, Zhao Zhenxing, Zheng Jiapeng, Zhang Hao, Liu Fangting, Song Kailin, Liu Deyu, He Yujie and Liu ..

Semiconductor

  |  Wed 17 Jun 2026

Taipei, June 18 -- Avanstrate Taiwan Inc and Avanstrate Inc have filed a patent application for Methods of Manufacturing Glass Substrate for Minimizing Platinum Inclusions and Devices Using the Methods. This invention was developed by Kim Se-hyuk, Yun Jong-chan, Seok Jin-won and Baek Sung-ki. The patent application number is ..

Semiconductor

  |  Wed 17 Jun 2026

Taipei, June 18 -- National Yang Ming Chiao Tung Univ and Taiwan Semiconductor Manufacturing have filed a patent application for Semiconductor Device and Forming Method Thereof. This invention was developed by Sun Man-ling, Chiu Kuan-hsiang, Chiu Hsin-yuan, Chien Chao-hsin, Chou Chen-han, Huang Han-yi and Wu Guan-zhen. The pa..

Semiconductor

  |  Wed 17 Jun 2026

Taipei, June 18 -- Global Unichip Corp and Taiwan Semiconductor Manufacturing have filed a patent application for Resistor Array Circuit, Digital-to-analog Converter Circuit and Layout Method of the Same. This invention was developed by Wang Ting-hao and Lin Yi-shen. The patent application number is TW20240119023 20240523. Th..

Semiconductor

  |  Wed 17 Jun 2026

Taipei, June 18 -- Tokyo Electron Ltd and TOMOEGAWA have filed a patent application for Processing Method. This invention was developed by Sakai Yuzuru, Fukuoka Tetsuo, Tsuchida Minoru, Terashima Ryo, Shiratori Kimiaki, Okumura Katsuya, Nagaseki Kazuya and Himori Shinji. The patent application number is TW20250106593 20250221..

Semiconductor

  |  Thu 18 Jun 2026

Beijing, June 18 -- Jiangxi Zhaochi Integration Tech Co Ltd and Jiangxi MTC Semiconductor have filed a patent application for Flip Light Emitting Diode Chip and Preparation Method Thereof. This invention was developed by Li Wentao, Zhang Cunlei, Hu Jiahui, Jin Conglong and Ao Yingquan. The patent application number is CN20251..

Semiconductor

  |  Thu 18 Jun 2026

Taipei, June 18 -- Tokyo Electron Ltd and Inpria Corporation have filed a patent application for Method for Developing a Radiation Exposed Organometallic Patterning Layer. This invention was developed by Narasimhan Amrit K, Anderson Jeremy T, Jiang Kai, Mcquade Lauren B, Meyers Stephen T, Koscis Mike and Cardineau Brian J. Th..

Semiconductor

  |  Wed 17 Jun 2026

Beijing, June 18 -- Shenzhen Jifeng Detection Tech Co Ltd and Shanghai Jifeng Technology have applied Chinese patent for TEM (transmission Electron Microscope) Sample Preparation Method for Photoetching Patterned Wafer. Meng Yu, Zhang Zhengfei and Zheng Chaohui developed it. The patent application number is CN20261077803 2026..

Semiconductor

  |  Wed 17 Jun 2026

Beijing, June 18 -- Hefei Comprehensive National Science Center Energy Research Institute, Anhui Energy Laboratory and Hefei University of Technology have applied Chinese patent for Power Semiconductor Heat-conducting Silicone Grease Migration Simulation Method Based on Multi-physics Field Coupling. Wang Jianing, Wei Zhaoyang an..

Semiconductor

  |  Wed 17 Jun 2026

Taipei, June 18 -- Hoya Corp and HOYA Electronics Singapore have applied Taiwan patent for Conductive Film Coated Substrate, Multilayer Reflective Film Coated Substrate, Reflective Mask Blank, Reflective Mask, and Semiconductor Device Manufacturing Method. Nakagawa Masanori and Kishida Hibiki developed it. The patent applicat..

Semiconductor

  |  Wed 17 Jun 2026

Taipei, June 18 -- Tokyo Electron Ltd and National Institute Of Tech have applied Taiwan patent for Method for Supplying Active Species Using Mist and Film Deposition Device. Oowada Shin, Katori Shigetaka and Asako Ryuichi developed it. The patent application number is TW20250108328 20250306. The patent publication number is ..

Semiconductor

  |  Thu 18 Jun 2026

Taipei, June 18 -- Zheng Kun Xian and Shyawei Optronics Corp have applied Taiwan patent for Bubble Detection Device of Wafer and Chip Packaging and Detecting Method of Bubble Defect of Wafer and Chip Packaging. Zheng Kun-xian developed it. The patent application number is TW20240129252 20240805. The patent publication number ..

Semiconductor

  |  Wed 17 Jun 2026

Taipei, June 18 -- Darwin Precisions Corp has sought patent for Bionic Organ Device. This invention was developed by Yang Ting-chieh and Huang Chung-yi. The patent application number is TW20240119390 20240524. The patent publication number is TW202546214 (A). International Patent Classification codes are C12M3/04, C12N5/07, H..
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