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Semiconductor
| Mon 02 Nov 2026
Beijing, Nov. 2 -- Jiangsu Phoenix Yancheng Printing Co Ltd has secured a patent on Photoelectric-induction-based Tail Paper Collection Lifting Device of Lithographic Printing Machine. Chen Liang, Jin Xiang, Wan Jiafu, Zhang Zhen and Ge Chun developed the invention.
The patent application number is CN202520815575U 20250427. T..
Semiconductor
| Mon 02 Nov 2026
Beijing, Nov. 2 -- Chinese Patent for Conveying Roller for Glass Substrate Size Compatibility and Cleaning Machine Thereof has been issued to Changzhou SC Exact Equipment. This invention was developed by Mo Jianxin, Zuo Guojun, Chi Guangcai, Qi Huamei and Tsuneyoshi.
The patent application number is CN202520798023U 20250425. Th..
Semiconductor
| Mon 02 Nov 2026
Beijing, Nov. 2 -- State Intellectual Property Office of China has awarded a patent to Kunshan Li Tai Xiang Machinery & Equipment for Dust-free Room Electroplating Transfer Device. Liao Hongde developed the invention.
The patent application number is CN202520655670U 20250409. The patent publication number is CN223973416 (U). In..
Semiconductor
| Mon 02 Nov 2026
Beijing, Nov. 2 -- Chinese Patent for Hot Charging and Hot Conveying Device of Large Silicon Manganese Ore Heat Furnace has been issued to Yuxi Yida Ferroalloy Co Ltd. This invention was developed by Zhang Heng and Yang Xuejun.
The patent application number is CN202520593855U 20250401. The patent publication number is CN22397..
Semiconductor
| Mon 02 Nov 2026
Beijing, Nov. 2 -- State Intellectual Property Office of China has awarded a patent to Hefei Qiangyou Tech Co Ltd for Electronic Chip Tray. Chen Jianhong, Chen Huizhen, Chen Yixuan, Wang Yukai and Chen Yinzhen developed the invention.
The patent application number is CN202520793923U 20250424. The patent publication number is ..
Semiconductor
| Tue 03 Nov 2026
Beijing, Nov. 2 -- Zhejiang Xinci Intelligent Tech Co Ltd has been granted a patent for Special Vacuumizing Mechanism for Sensitive Sensor Chip. This invention was developed by Zhu Chengxia, Wu Qifan, Xu Bin and Li Min.
The patent application number is CN202520952967U 20250515. The patent publication number is CN223972803 (U)..
Semiconductor
| Tue 03 Nov 2026
Beijing, Nov. 2 -- Chinese Patent for Box Chip and Consumable Box has been issued to Jihai Microelectronics. This invention was developed by Li Bo, Wang Jun and Qing Peng.
The patent application number is CN202520653166U 20250408. The patent publication number is CN223972325 (U). International Patent Classification code is B41J..
Semiconductor
| Tue 03 Nov 2026
Beijing, Nov. 2 -- Nantong Jinweier Intelligent Equipment Co Ltd has secured a patent on PoE Solar Cell Packaging Adhesive Film Production Device. Liu Meiyuan and Xin Wensheng developed the invention.
The patent application number is CN202520637885U 20250407. The patent publication number is CN223972094 (U). International Pat..
Semiconductor
| Tue 03 Nov 2026
Beijing, Nov. 2 -- Dongguan Tianxi Electronic Tech Co Ltd has obtained a patent for easily-detached edge cutting machine for integrated circuit board. This invention was developed by Huang Fei.
The patent application number is CN202520205462U 20250210. The patent publication number is CN223971784 (U). International Patent Cla..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Device Bonding Apparatus and Method of Manufacturing a Package Using the Apparatus. Tseng Yu-fang, Wu Pei-wei, Ho Yi Chen and Chang Chih Yuan developed it.
The patent application number is US202519190604 20250426. The patent p..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has published Mitsubishi Electric patent application for Semiconductor Device and Method of Manufacturing Semiconductor Device. The invention was developed by Fujita Yasuo.
The patent application number is US202619531704 20260206. The patent publication number is US20260344..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Fujitsu has submitted a patent application for Semiconductor Device and Semiconductor Apparatus. This invention was developed by Minoura Yuichi.
The patent application number is US202619572720 20260319. The patent publication number is US20260344542 (A1). International Patent Classification codes are H10D3..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Bond Pads and Method of Manufacturing the Same. This invention was developed by Wang Ming-i, Ting Shyh-fann and Chang Chih-ping.
The patent application number is US202619737033 20260710. The patent publication number is US20..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Photoelectric Device, Optical Transceiver, and Method of Operating Photoelectric Device. Jung Ming Yang, Rusu Stefan, Lu You-cheng, Cho Lan-chou and Huang Tai-chun developed it.
The patent application number is US202619736891 ..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Integrated Circuit Packages and Methods. Chen Tsung-yu, Tsai Sheng-han, Hung Wensen and Chen Yen-pu developed the invention.
The patent application number is US202619732452 20260706. The patent publication number is US20260344531 (A1..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Intel has submitted a patent application for Architectures for Backside Power Delivery with Stacked Integrated Circuit Devices. Nad Suddhasattwa, Ecton Jeremy, Marin Brandon, Pietambaram Srinivas and Duan Gang developed the invention.
The patent application number is US202619731975 20260706. The patent pub..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing patent application for Integrated Circuit Package and Method. This invention was developed by Lin Po-yao, Chen Chien-sheng, Yan Kathy Wei and Lin Chia-hsiang.
The patent application number is US202619727185 20260701. The paten..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Samsung Electronics has submitted a patent application for Stiffener and Semiconductor Package Including the Same. Kwon Seok-hong and Kim Junbae developed the invention.
The patent application number is US202519371783 20251028. The patent publication number is US20260344517 (A1). International Patent Class..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Yangtze Memory Tech Holding Co Ltd has submitted a patent application for Semiconductor Devices, Chip Packages and Manufacturing Methods Thereof. This invention was developed by Liu Xiaoxin, Zheng Xuan, Wen Min and Pan Zhen.
The patent application number is US202519272462 20250717. The patent publication..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for System on Integrated Circuit Structure and Fabrication Method Thereof. Lu Yinlung, Chen Hsu-hsien, Hung Tuan-yu, Yang Tien-chung, Chen Chen-shien and Chuang Yao-chun developed the invention.
The patent application number is ..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Package Structure and Method for Fabricating the Same. Wang Yung-hsien, Hsueh Chang-jung, Chen Ko-chiao, Wei Tzu-chieh and Pan Chien-hsun developed the invention.
The patent application number is US202519192695 20250429. The..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Structure Including Pad Feature and Method for Manufacturing the Same. Lin Chia-hua, Hsiao Cheng-tai and Trinh Hai-dang developed the invention.
The patent application number is US202519189928 20250425. The pat..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Alpha and Omega Semiconductor International has submitted a patent application for Semiconductor Package Having Stacked High Side Field-effect Transistors and Stacked Low Side Field-effect Transistors and Method of Making the Same. This invention was developed by Alin Mary Jane R, Wang Lin, Bobde Madhur, Wa..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Package Component. This invention was developed by Hsu Kuo-ching, Peng Ming-wei and Hsu Hung En.
The patent application number is US202619736888 20260709. The patent publication number is US20260344500 (A1). International Pa..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Micron Technology has submitted a patent application for Hybrid Bonding Techniques That Utilize Multi-functional Barrier Materials. Su Ying-tsun developed the invention.
The patent application number is US202619631970 20260327. The patent publication number is US20260344498 (A1). International Patent Class..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Texas Instruments Incorporated has sought patent for Semiconductor Die with Trench Structures. This invention was developed by Griffin Alfred, Murugan Rajen Manicon and Li Guangxu.
The patent application number is US202519193485 20250429. The patent publication number is US20260344496 (A1). International P..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Samsung Electronics has submitted a patent application for Semiconductor Package Inspection Apparatus and Method of Manufacturing Semiconductor Package Using the Same. Lee Jongho, Han Wongil, Yoon Youehwang, Lim Heonuk, Kim Byongjoo and Kim Doojin developed the invention.
The patent application number is U..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Stats Chippac Man Pte Ltd has submitted a patent application for Method for Bonding a Semiconductor Die Onto a Substrate. This invention was developed by Min Hyungsuk and Park Jongchan.
The patent application number is US202619655734 20260423. The patent publication number is US20260344489 (A1). Internat..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Method of Forming Redistribution Layer Structure. This invention was developed by Tsai Hui-jung, Wang Chia-wei, Peng Jyun-siang and Kuo Hung-jui.
The patent application number is US202619731129 20260705. The patent publicati..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has released Qualcomm patent application for Integrated Circuit (IC) Package Having a Substrate with Embedded Metal Layers Under the Surfaces of the Substrate. This invention was developed by Buot Joan Rey Villarba, Patil Aniket and We Hong Bok.
The patent application num..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Shinko Electric Industries has submitted a patent application for Interconnect Substrate and Method of Making the Same. Sato Keigo developed the invention.
The patent application number is US202619646826 20260414. The patent publication number is US20260344468 (A1). International Patent Classification code..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Limited has applied United States patent for Package Including Composite Interposer And/or Composite Packaging Substrate and Methods of Forming the Same. Jeng Shin-puu, Wang Chin-hua, Lee Tsung-yen, Chen Ping Tai and Lee Yu Chen developed it.
The patent application n..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing has sought patent for Vias in Semiconductor Package. This invention was developed by Hsu Kuo-ching, Tang Kai-yi and Chen Yu-huan.
The patent application number is US202619727042 20260701. The patent publication number is US20260344463 (A1). International Patent Classifica..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing has applied United States patent for Redistribution Structures with Seal Rings and the Methods of Forming the Same. Lin Meng-liang, Yan Kathy Wei, Chen Hsien-wei and Lai Chieh-lung developed it.
The patent application number is US202619727408 20260701. The patent publicat..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Resonac has applied United States patent for Method for Manufacturing Semiconductor Package, Substrate Material for Semiconductor Package, and Method for Manufacturing Substrate Material for Semiconductor Package. Takahashi Masaki, Nakanishi Kota, Nakata Mitsuki, Kitajima Takayo, Otake Shunsuke, Tonouchi Sh..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Manufacturing Method of Heat Dissipation Layer and Manufacturing Method of Semiconductor Device. This invention was developed by Jhang Jin-hao, Yen Yu-hsiang and Woon Wei-yen.
The patent application number is US202619731123 ..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Lintec has submitted a patent application for Semiconductor Device Manufacturing Method and Semiconductor Device. Takyu Shinya developed the invention.
The patent application number is US202619704921 20260611. The patent publication number is US20260344455 (A1). International Patent Classification code is ..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- SK Hynix has applied United States patent for Storage Apparatus and Identifier Management System and Method Therefor. Hwang Ji Hoon developed it.
The patent application number is US202519319676 20250904. The patent publication number is US20260344452 (A1). International Patent Classification codes are H10W..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has published SK Hynix patent application for Semiconductor Device. The invention was developed by Chang Heon Yong.
The patent application number is US202519309644 20250826. The patent publication number is US20260344451 (A1). International Patent Classification codes are H..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has published Samsung Electronics patent application for Semiconductor Package Including Wiring Substrate Shield. The invention was developed by Park Eunkyeong, Yong Seokbeom, Ha Seungsoo and Ahn Sungoh.
The patent application number is US202619441255 20260106. The patent p..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Back-side Warpage Control Layer to Improve Bonding Bulge / Non-bonding. This invention was developed by Weng Wu-an, Chen Hsu-hsien, Chen Chen-shien, Hsu Feng-chang and Lin Chi-yen.
The patent application number is US202619731634 2026..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing patent application for Integrated Circuit Packages and Methods of Forming the Same. Liu Kuo-chio, Kuo Chien-li, Lee Kuang-chun, Lin Wen-yi and Li Chien-chen developed the invention.
The patent application number is US202619727..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing has applied United States patent for Seal Ring Structure and Method of Forming Same. Chen Tsung-yu, Tsai Sheng-han, Lin Tsung-shu, Pan Hsin-yu and Guo Hong-yu developed it.
The patent application number is US202619732286 20260706. The patent publication number is US202603..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has published SK Hynix patent application for Semiconductor Device and Method of Manufacturing Semiconductor Device. The invention was developed by Jung Yu Jung and Byun Da Yung.
The patent application number is US202519374851 20251030. The patent publication number is US20..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- International Business Machines has filed a patent application for Heat Dissipating Metal-core-organic-substrate. This invention was developed by Matsumoto Keiji, Knickerbocker John, Takken Todd Edward, Farooq Mukta Ghate and Golz John W.
The patent application number is US202519187081 20250423. The patent..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has published STMicroelectronics International NV patent application for Method of Manufacturing Semiconductor Devices and Corresponding Semiconductor Device. The invention was developed by Catalano Guendalina and Gottardi Thomas.
The patent application number is US20261946..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Limited has submitted a patent application for Package Structure Including a Package Lid Having a Patterned Bottom Surface and Methods of Forming the Same. This invention was developed by Lin Yu-wei, Hsiao Meng-hsuan, Liao Sih-hao and Yeh Ming Shih.
The patent applic..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- STMicroelectronics International NV has filed a patent application for Method of Semiconductor Manufacturing and Corresponding Semiconductor Device. This invention was developed by Vitello Dario.
The patent application number is US202619660768 20260428. The patent publication number is US20260344418 (A1). ..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Semiconductor Structure and Method of Manufacturing Same. This invention was developed by Hsu Ching-chung, Kuo Chien-hsien and Chang Chung-long.
The patent application number is US202519349020 20251003. The patent publicatio..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Integrated Capacitor and Method of Manufacturing the Same. Chen Chieh-en, Ting Shyh-fann and Lin Chen-hsien developed the invention.
The patent application number is US202519191534 20250428. The patent publication number is ..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has filed a patent application for Semiconductor Device Structure with Conductive Layer and Method for Forming the Same. This invention was developed by Liu Tzu-ting, Ding Pin-shun, Shen Hsiang-ku and Chiou Ying-han.
The patent application number is US20251918937..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Method of Forming Semiconductor Package and Structure Thereof. This invention was developed by Chiu Chih-pin, Lin Chi-feng, Chan Wei Hsiang and Wang Liang-wei.
The patent application number is US202519188675 20250424. The pa..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has received Infineon Technologies, Austria patent application for Positioning of Gate Bus Through Intermediate Point of Fingers in Finger Lateral Field Effect Transistor. Mizannojehdehi Ahmad, Abdali Mashhadi Iman, Macelwee Thomas and Lu Hongrui developed the invention.
Th..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Micron Technology has submitted a patent application for Microelectronic Devices, Memory Devices, and Associated Methods. This invention was developed by Light Scott L.
The patent application number is US202619631875 20260327. The patent publication number is US20260344401 (A1). International Patent Classi..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has released Sumitomo Electric Device Innovations patent application for Semiconductor Device and Method of Manufacturing Semiconductor Device. This invention was developed by Watanabe Kenichi.
The patent application number is US202619736060 20260709. The patent publication..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing has sought patent for Integrated Circuit Package and Method. This invention was developed by Wu Yu-bey, Hsiao Tsung-chieh, Chen Hsin-feng, Wen Ke-gang and Wang Liang-wei.
The patent application number is US202619727270 20260701. The patent publication number is US20260344..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has released Tokyo Electron patent application for Situ Etch Rate Differentiation Through Oxidation. This invention was developed by Marion Jason, Han Yun and Li Na.
The patent application number is US202619698195 20260604. The patent publication number is US20260344379 (A1..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing patent application for Method of Forming Multi-gate Transistors and Resulting Structures. The invention was developed by Hu Fang Hsuan, Wu Zhen-cheng, Huang Yen-chun and Lee Tze-liang.
The patent application number is US20261..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has received Taiwan Semiconductor Manufacturing patent application for Semiconductor Package and Method. Yu Chen-hua, Liu Chung-shi, Twu Jih-churng, Yu Chen-chiang, Yang Su-chun and Tsai Jui Hsuan developed the invention.
The patent application number is US202619732470 2026..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Fin Structures. This invention was developed by Chang Huicheng, Lu Chun-yang, Chen Tz-shian, Yeo Yee-chia and Wang Li-ting.
The patent application number is US202619735480 20260708. The patent publication number is US2026034..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Applied Materials has submitted a patent application for Repairing Low-K Materials After Integration Operations. This invention was developed by Xia Li-qun, Xie Bo, Lang Chi-i and Lu Xinyi.
The patent application number is US202519184464 20250421. The patent publication number is US20260344375 (A1). Coop..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has published Yangtze Memory Technologies patent application for Semiconductor Device and Method for Detecting Alignment Accuracy in the Semiconductor Device. The invention was developed by Wang Qijun, Wang Jiawen, Li Yang and Hu Xiaolong.
The patent application number is U..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has released Samsung Electronics patent application for Operating Method of Electronic Device Configured to Manufacture Semiconductor Device. This invention was developed by Park Dongjin, Cho Hyeonho and Chung Ingyun.
The patent application number is US202519411624 20251208..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Applied Materials has submitted a patent application for Substrate Support Assemblies Having Internal Shaft Areas with Isolated Environments That Mitigate Oxidation. Parkhe Vijay D developed the invention.
The patent application number is US202619731262 20260706. The patent publication number is US20260344..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Robot, Apparatus Including Robot, and Method for Manufacturing Semiconductor Structure Using the Same. This invention was developed by Cheng Chia-yun, Lu Yu-wei, Sano Kenichi and Lo Yi-chen.
The patent application number is ..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Lam Research has applied United States patent for Semiconductor Processing Chamber Component with a Laser Glazed Metal Oxide Intermediate Layer. Irudayaraj Jesu Titus and Pape Eric A developed it.
The patent application number is US202419490292 20240703. The patent publication number is US20260344360 (A1)...
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Applied Materials has applied United States patent for Vented Heater Rings for Processing Chambers. Tham Benjamin Ean, Cong Zhepeng and Brillhart Paul L developed it.
The patent application number is US202519192514 20250429. The patent publication number is US20260344358 (A1). International Patent Classifi..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Swaysure Technology has applied United States patent for Susceptor, Plasma Processing Apparatus, and Plasma Processing Method. Fukasawa Takayuki developed it.
The patent application number is US202619634646 20260331. The patent publication number is US20260344355 (A1). International Patent Classification c..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Wuhan Xinxin Semiconductor Manufacturing has applied United States patent for Bonding Apparatus and Bonding Method for Chip. Long Junzhou, Wang Li and Tao Chao developed it.
The patent application number is US202619698854 20260605. The patent publication number is US20260344353 (A1). International Patent C..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Front Opening Unified Pod (FOUP) and Controlling Method Thereof. This invention was developed by Hsu Jyh-shiou, Lu Chao-po, Ma Jeng-shin and Ni Chyi-tsong.
The patent application number is US202519188369 20250424. The patent..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has released Kokusai Electric patent application for Substrate Type Identification Apparatus, Substrate Processing Apparatus, Method of Processing Substrate, Method of Manufacturing Semiconductor Device, and Recording Medium. This invention was developed by Tsuchiya Tomoki a..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- U.S. Patent and Trademark Office has released Tokyo Electron patent application for Information Processing Method, Computer Program, Information Processing Apparatus, and Substrate Processing System. This invention was developed by Suwa Wataru.
The patent application number is US202619701846 20260609. The ..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- Kokusai Electric has submitted a patent application for Substrate Processing Apparatus, Maintenance Method, Substrate Processing Method and Method of Manufacturing Semiconductor Device. This invention was developed by Kawanishi Yuta, Sakashita Keisuke, Kasai Takeshi and Fujino Toshiki.
The patent applicati..
Semiconductor
| Tue 03 Nov 2026
Alexandria, Nov. 2 -- SCREEN Holdings has submitted a patent application for Substrate Processing Apparatus. This invention was developed by Wakita Asuka, Morita Kosei and Nakano Hiroki.
The patent application number is US202619659049 20260427. The patent publication number is US20260344335 (A1). International Patent Classifica..