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Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Robert Bosch Co Limited has applied Chinese patent for MOSFET with Self-aligned Extension Region. Alsmeier Jens-henning, Feiler Wolfgang, Costescu Dan, Bartolf Holger, Schwaiger Stephan and Martinez-limia Angela developed it.
The patent application number is CN20248065141 20240719. The patent publication nu..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Hexagem Ab has applied Chinese patent for Semiconductor Device Including Micro-led Structure. Bjork Mikael, Samuelson Lars and Herring Michael developed it.
The patent application number is CN20248064884 20241001. The patent publication number is CN122029969 (A). International Patent Classification codes ar..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Jiangsu Youzhong Micro Nano Semiconductor Tech Co Ltd has submitted a patent application for Medium Metasurface Structural Color Device and Structural Color Brightness Regulation and Control Method. This invention was developed by Ju Fayin, Li Ning and Liu Yichen.
The patent application number is CN20261046..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Shenzhen Neoway Tech Co Ltd has filed a patent application for Intelligent Response Method and Device Based on Memory System Drive, Equipment and Medium. This invention was developed by Jian Weidong, Guo Jianlin and Wang Chao.
The patent application number is CN20251246413 20251231. The patent publication n..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Verdinov Manufacturing Co has submitted a patent application for Method for Producing Edible, Malleable and Palatable Substrate for Animals and Use of Such Substrate. This invention was developed by Bircan Erdem and Berriot Laurent.
The patent application number is CN20248053386 20240813. The patent publica..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Lam Research has submitted a patent application for Positive Tone Dry Development on Metal Oxide Photoresist. Tan Samantha S H, Li Da, Liu Shanliangzi, Kim Ji Yeon, Coyle Jason Philip and Vrtis Raymond Nicholas developed the invention.
The patent application number is WO2026US12164 20260122. The patent publica..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Shenzhen Bynet Communication Technology has applied Chinese patent for Integrated Packaging System and Method Based on Glass Substrate. Tang Yueyun, Xiao Suqun, Chen Qu, Bi Pengjun, Zeng Hai and Fang Fulin developed it.
The patent application number is CN202610345668 20260320. The patent publication number is..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- GalaxyCore Shanghai has submitted a patent application for Packaging Method and Packaging Structure of Semiconductor Chip. Xia Huan developed the invention.
The patent application number is CN202411561397 20241101. The patent publication number is CN122028783 (A). International Patent Classification codes are..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Changzhou Chengxin Semiconductor has submitted a patent application for Semiconductor Device and Preparation Method Thereof. Zhou Yi, Pan Lin, Wu Xianghui and Qian Kang developed the invention.
The patent application number is CN202610214307 20260213. The patent publication number is CN122028781 (A). Intern..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Mitsubishi Electric has submitted a patent application for Semiconductor Device. This invention was developed by Sakai Norikazu, Nishimura Kazuhiro, Masumoto Hiroyuki, Egusa Minoru and Wada Fumio.
The patent application number is CN20251176517 20250801. The patent publication number is CN122028778 (A). Inte..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Mitsubishi Electric has submitted a patent application for Semiconductor Device and Method for Manufacturing Semiconductor Device. Sato Yuji, Uegaki Shin and Nakata Yosuke developed the invention.
The patent application number is CN202511520053 20251023. The patent publication number is CN122028774 (A). Inter..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Advanced Semiconductor Engineering has submitted a patent application for Package Structure. This invention was developed by Li Weijun and Zhang Weihao.
The patent application number is CN202510308537 20250317. The patent publication number is CN122028772 (A). International Patent Classification code is H10..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Guangdong Ada Semiconductor Equipment Co Ltd has applied Chinese patent for Lead Bonding Method and System for Chip Packaging of Integrated Stacked Suspended Structure. He Yunbo, Ji Haizhong, Yan Yijun, Liu Junjie and Ye Wentao developed it.
The patent application number is CN202610502956 20260416. The pate..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Ruckus IP has applied WIPO patent for Radiating Elements Having a Radiator and a Molded Plastic Substrate and Related Antenna Arrays and Methods. Chen Edmund and Noghanian Sima developed it.
The patent application number is WO2026US12108 20260122. The patent publication number is WO2026161527 (A1). Internation..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- China Resources Runan Tech Chongqing Co Ltd has submitted a patent application for Manufacturing Method of Semiconductor Structure. This invention was developed by Zhou Wenwu.
The patent application number is CN202411549836 20241031. The patent publication number is CN122028755 (A). International Patent Cla..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Suzhou Guoxian Innovation Tech Co Ltd has submitted a patent application for Package Carrier and Preparation Method Thereof, and Semiconductor Package Structure. Zhou Yanxu developed the invention.
The patent application number is CN202610499016 20260415. The patent publication number is CN122028754 (A). In..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Beijing Huafeng Jixin Electronics Co Ltd patent application for Bridging Chip and Chip Packaging Structure with Same. This invention was developed by He Qibin, Qiao Hailong and Zhao Xudong.
The patent application number is CN20251209753 20251229. The ..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released NXP USA patent application for Substrate Package. This invention was developed by Sun Yongqing, Liu Huanhuan, Li Yiming and Zang Yuan.
The patent application number is CN202411557500 20241104. The patent publication number is CN122028750 (A). Internatio..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has published Moqu Tech Shenzhen Co Ltd patent application for Metal Substrate Power Device Package. The invention was developed by Zhao Zhentao.
The patent application number is CN202510292694 20250312. The patent publication number is CN122028748 (A). Internatio..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has received Suzhou Guoxian Innovation Tech Co Ltd patent application for Manufacturing Method of Glass Substrate, Glass Substrate and Packaging Structure. Zhou Yanxu developed the invention.
The patent application number is CN202610495495 20260415. The patent pub..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- ChangXin Technology Group has submitted a patent application for Semiconductor Structure, Manufacturing Method Thereof and Semiconductor Device. This invention was developed by Zhang Zhong.
The patent application number is CN202411596593 20241108. The patent publication number is CN122028743 (A). Internationa..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has published Mitsubishi Electric patent application for Signal Transmission Element. The invention was developed by Yoshino Manabu and Shitomi Takuichiro.
The patent application number is CN202511265942 20250905. The patent publication number is CN122028740 (A). ..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Nanjing University has filed a patent application for Semiconductor Device and Preparation Method Thereof. This invention was developed by Tang Faquan, Wang Penglin, Chen Dunjun, Zhou Yugang and Zhang Rong.
The patent application number is CN202610214958 20260213. The patent publication number is CN12202873..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Semiconductor Components Industries has sought patent for Cooling Assembly and Method for Manufacturing a Cooling Device. This invention was developed by Im Seung-won.
The patent application number is CN202511652948 20251112. The patent publication number is CN122028734 (A). International Patent Classificatio..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has received Applied Materials patent application for Pulsed Voltage Source with Multiple Stages for Plasma Processing Applications. Dash Shreeram Jyoti developed the invention.
The patent application number is WO2026US12068 20260122. The patent publication number is WO..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Shenzhen Xianxing Equipment Tech Co Ltd has sought patent for Integrated Device for Integrated Circuit and Electromagnetic Shielding and Packaging Structure Thereof. This invention was developed by Yang Junkun.
The patent application number is CN202610151740 20260203. The patent publication number is CN1220..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Samsung Electronics has submitted a patent application for Film Package, Semiconductor Module Including Same, and Display Device. This invention was developed by Jo Min-woo, Ha Jeong-kyu, Cho Seung-hyun and Jeong Jae-min.
The patent application number is CN202510975467 20250715. The patent publication number ..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has published Inno Saike (Suzhou) Semiconductor patent application for Semiconductor Device and Manufacturing Method Thereof. The invention was developed by Li Qing.
The patent application number is CN202610475642 20260410. The patent publication number is CN12202..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Hefei Nexchip Integrated Circuit has sought patent for Semiconductor Structure and Preparation Method Thereof. This invention was developed by Song Furan and Liu Naishuo.
The patent application number is CN202610479111 20260413. The patent publication number is CN122028725 (A). International Patent Classifi..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has received United Microelectronics Corporation patent application for Semiconductor Element and Manufacturing Method Thereof. Lin Jianting, Lin Jufu and Lin Chuanlan developed the invention.
The patent application number is CN202411670983 20241121. The patent pu..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Fujian Jinhua Integrated Circuit has applied Chinese patent for Semiconductor Memory Structure and Preparation Method Thereof. Lai Huixian and Feng Liwei developed it.
The patent application number is CN202610169983 20220421. The patent publication number is CN122028720 (A). International Patent Classificat..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Hefei Nexchip Integrated Circuit has applied Chinese patent for Semiconductor Device and Manufacturing Method Thereof. Li Fei and Dong Zongyu developed it.
The patent application number is CN202610500449 20260416. The patent publication number is CN122028718 (A). International Patent Classification codes ar..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Jiangsu Tianke Heda Semiconductor and Beijing Tankeblue Semiconductor patent application for Method for Reducing Machining Stress of Large-size Silicon Carbide Wafer. This invention was developed by Chao Huan, Peng Tonghua, Yang Jian, Zhang Wenwen, Liu C..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Wuhan Xinxin Semiconductor has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. Yu Qinxu, Wang Sen, Luo Qingwei, Liu Nian, Pan Dong and Xiang Pengcheng developed the invention.
The patent application number is CN202511116206 20250808. The patent publication number is..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Shenzhen Pengxinwei Integrated Circuit Manufacturing has sought patent for Semiconductor Manufacturing Method and Semiconductor Device. This invention was developed by Wang Lei.
The patent application number is CN202411574073 20241105. The patent publication number is CN122028715 (A). International Patent Cla..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Taiwan Semiconductor Manufacturing patent application for Method for Manufacturing Semiconductor Device and Composition for Coating Patterned Photoresist. This invention was developed by Cheng Joy, Zhang Lilin and Wei Jialin.
The patent application numb..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Hefei Nexchip Integrated Circuit has submitted a patent application for Method for Monitoring Resistance Fluctuation of Gamma Resistor. This invention was developed by Shao Yingya, Wang Xuechun and Li Jian.
The patent application number is CN202610475623 20260413. The patent publication number is CN12202871..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Chongqing Eagle Valley Optoelectronic Ltd patent application for Method and System for Reducing Preparation Fragmentation Rate of Ultrathin Semiconductor Test Sample. This invention was developed by Gu Jialin, Bu Hui, Liu Congji, Gong Hongjie, Jian Maoyu..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has received Gechuang Dongzhi Wuhan Tech Co Ltd patent application for Multivariable-based Semiconductor Diagnosis Method, Device and Equipment and Storage Medium. Xu Mingguang developed the invention.
The patent application number is CN202610122401 20260128. The ..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has received Microchip Technology patent application for High Performance Schottky Barrier Diode Structure. Sharma Yogesh Kumar and Pandey Shesh Mani developed the invention.
The patent application number is WO2026US12028 20260121. The patent publication number is WO202..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Chroma ATE (Suzhou) has submitted a patent application for Semiconductor Packaging Component Pressure Testing Module with Multiple Pressure Blocks and Semiconductor Packaging Component Testing Equipment. Lyu Menggong and Chen Jianming developed the invention.
The patent application number is CN202411575354 20..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Xinlian Integrated Circuit Manufacturing has applied Chinese patent for Test Bonding Pad Structure for Semiconductor Device Test and Semiconductor Device. He Qiqing, Zhao Xiaoyan and Li Zhongren developed it.
The patent application number is CN20261075821 20260120. The patent publication number is CN122028704..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has received STMicroelectronics International patent application for Electronic Chip Comprising Crack Detection Device. Juan Guillaume developed the invention.
The patent application number is CN202511619384 20251106. The patent publication number is CN122028702 (A)..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Accelink Technologies has filed a patent application for Suction Nozzle Device Suitable for Pd Array Chip and Maintenance Method Thereof. This invention was developed by Li Shiyu, Zhong Xing, Hu Yan, Li Jing and Yue Aiwen.
The patent application number is CN202411557616 20241104. The patent publication number..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Ningbo All Semi Micro Electronics Equipment Co Ltd patent application for Plate Core Assembly, Cover Body Assembly, Hot Plate Module and Semiconductor Processing Equipment. This invention was developed by Dong Jinjin, Pan Zequan and Liang Bingbing.
Th..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Piao Longnan patent application for Substrate Bonding Apparatus.
The patent application number is CN202310447171 20230424. The patent publication number is CN122028691 (A). International Patent Classification codes are B81C3/00, H10P72/00 and H10P72/..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Shenyang Heyan Tech Co Ltd has sought patent for Loading and Unloading Sorting Device and Semiconductor Processing System. This invention was developed by Liu Jiameng, Li Jiabin, Chen Qiang, Li Yuan, Long Hao, Zhan Zhigang and Wu Hongbai.
The patent application number is CN202610357275 20260323. The patent ..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Shanghai Xinyuan Micro Entpr Development Co Ltd has sought patent for Substrate Processing System and Substrate Transfer Method. This invention was developed by Liu Tao, Peng Bo, Li Shuang, Wang Rongxiang and Li Ze.
The patent application number is CN202411593067 20241108. The patent publication number is C..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has received Guangdong Aiko Solar Energy Technology Co Ltd, Zhejiang Aiko Solar Energy Technology, Shandong Aiko Solar Energy Tech Co Ltd, Zhuhai Fushan Aixu Solar Energy Technology and Tianjin Aiko Solar Energy Technology patent application for Loading Basket for Lo..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Canon has submitted a patent application for Specification Method, Pattern Transfer Method, Article Manufacturing Method, Program, Information Processing Apparatus, and Lithographic System. This invention was developed by Kajitani Masaharu.
The patent application number is CN20248063000 20241001. The patent p..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- Changjiang Electronics Tech Jiangyin Co Ltd has filed a patent application for Glue Flushing Device, Semiconductor Equipment and Thickness Detection Method. This invention was developed by Chen Langlang, Ren Yu and Jin Huixiang.
The patent application number is CN202610198237 20260210. The patent publicatio..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released ACM Research, Shanghai patent application for Spraying Device and Substrate Processing Equipment. This invention was developed by Wang Hui, Zhang Fengrong, Pang Hao and Chen Fuping.
The patent application number is CN202411563876 20241104. The patent pu..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Xi'an ESWIN Silicon Wafer Technology and Xi'an ESWIN Material Technology patent application for Silicon Wafer Defect Treatment Method, Surface Treatment Liquid, Silicon Wafer and Cleaning Device. This invention was developed by Zhang Shenshen.
The pat..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- HKC has submitted a patent application for Epitaxial Substrate, Semiconductor Device and Preparation Method of Epitaxial Layer. Fan Shengcai and Xu Pei developed the invention.
The patent application number is CN202610469578 20260410. The patent publication number is CN122028666 (A). International Patent Clas..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Texas Instruments Incorporated has sought patent for Real Time Optimization of Imaging Parameters in 3D Optical Devices. This invention was developed by Martin Samuel and De La Cruz Vazquez Jaime.
The patent application number is WO2026US11930 20260121. The patent publication number is WO2026161409 (A1). Int..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has received Lam Research patent application for Area-selective Deposition Using Carbon as an Inhibitor. Acharya Mahendra, Reddy Kapu Sirish, Roberts Francis Sloan, Pandit Subhendu and Mclaughlin Kevin developed the invention.
The patent application number is WO2026US11..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has released Microchip Technology patent application for High Electron Mobility Transistor and Method for Manufacturing Same. This invention was developed by Pandey Shesh Mani.
The patent application number is WO2026US11877 20260120. The patent publication number is WO2..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Texas Instruments Incorporated has submitted a patent application for Direct Current Balancing Using a Zero Voltage Detection Signal. This invention was developed by Elantsev Vsevolod Igorevich.
The patent application number is WO2026US11775 20260120. The patent publication number is WO2026161332 (A1). Inter..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has received Texas Instruments Incorporated patent application for Electronic Device with Split Lead. Tay Huay Yann, Khoo Yien Sien and Wright Lance developed the invention.
The patent application number is WO2026US11771 20260120. The patent publication number is WO2026..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has published Blue Cheetah Analog Design Inc patent application for Circuits and Methods for Transmitting Data Over 3D Semiconductor Die Interconnects. The invention was developed by Alon Elad, Kusching John L and Lupienski John.
The patent application number is WO202..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- KLA Corporation has submitted a patent application for Simultaneous, Multiple Channel Measurements of Semiconductor Structures at Different Nominal Azimuth Angles. Kuznetsov Alexander and Abramov Avi developed the invention.
The patent application number is WO2026US11717 20260119. The patent publication number..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Microchip Technology has submitted a patent application for Enhanced Pci Express (pcie) Forward Error Correction (fec). Graumann Peter developed the invention.
The patent application number is WO2026US11635 20260116. The patent publication number is WO2026161308 (A1). International Patent Classification codes ..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Texas Instruments Incorporated has sought patent for Surface-cured Acid Anhydride Epoxies. This invention was developed by Chen Ying-chang and Liu Jane.
The patent application number is WO2026US11574 20260116. The patent publication number is WO2026161296 (A1). International Patent Classification codes are B..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- SK Hynix Memory Solutions Inc has applied Chinese patent for Device-specific Firmware Distribution. Silveira Alejandro, Yang Wei and Antoniewski Marcin developed it.
The patent application number is CN20248065572 20240530. The patent publication number is CN122029537 (A). International Patent Classification..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- LG Electronics has sought patent for Glass Substrate Module Arranged on Vehicle. This invention was developed by Jung Kangjae, Lee So-yeon, Kim Eui-sun, Choi Kukheon, Kim Dong-jin and Jung Byung-woon.
The patent application number is CN202380103066 20231030. The patent publication number is CN122029044 (A). I..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has released Jeong In Kwon patent application for Polishing Device for Polishing Semiconductor Wafer.
The patent application number is CN20248058023 20240905. The patent publication number is CN122029007 (A). International Patent Classification codes are B24B37/3..
Semiconductor
| Wed 05 Aug 2026
Beijing, Aug. 5 -- State Intellectual Property Office of China has received Cepheid patent application for Thermal Switch for Diagnostic Detection Chip Arrangements and Related Manufacturing. Dority Douglas B, Piccini Matthew, Subramaniam Gautam and Zhang Jing developed the invention.
The patent application number is CN20248066..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- NVIDIA has submitted a patent application for Neural Network Prediction of Surface Mesh Vertices. This invention was developed by Law Mark Teva, Sharp Nicholas Mark Worth, Lucas James Robert, Shen Tianchang and Sáez De Ocáriz Borde Haitz.
The patent application number is WO2026US12480 20260126. The patent pu..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Lam Research has submitted a patent application for Electrical Isolation in Semiconductor Processing Apparatus. This invention was developed by Altecor Aleksey V, Shankar Nagraj, Ratliff Brian Lewis, Gerber Kevin, Beaudette Chad Adrien, Odum Kyle Starr and Bingham Bruce Christopher.
The patent application numb..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has released ASML Netherlands patent application for Apparatus for a Laser-produced Plasma Radiation Source. This invention was developed by Coronel Joshua, Harrison Kramer, Jurna Martin, Subkhangulov Ruslan Rifovich, Utina Andrei and Kockerols Jean.
The patent applicat..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- P&G IP GmbH has applied WIPO patent for Method and System for Planting a Rooted Cutting into a Substrate. Pluijmert Christian, Fredrikze Egbert, Gijsbert De Graaff Jan and Reiner Stefan developed it.
The patent application number is WO2025EP51656 20250123. The patent publication number is WO2026158781 (A1). ..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Calterah Semiconductor Technology, Shanghai has submitted a patent application for Ranging Method and Ranging System. Yu Zhongxing, Xiao Junming and Li Wenzheng developed the invention.
The patent application number is WO2026CN74951 20260126. The patent publication number is WO2026158662 (A1). International ..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Micron Technology has submitted a patent application for Host-side Alignment to a Multi-phase Internal Clock of a Memory System. This invention was developed by Salobrena Garcia Casto and Gajera Kevin.
The patent application number is WO2026US11463 20260115. The patent publication number is WO2026161284 (A1). ..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Qualcomm has submitted a patent application for Workload Partitioning for Dual System on a Chip (soc). This invention was developed by Hanumanthaiah Shruti and Lanka Subbarao.
The patent application number is WO2026US11384 20260115. The patent publication number is WO2026161278 (A1). International Patent Class..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has released Lam Research patent application for Radio Frequency Shielding in Semiconductor Fabrication Apparatuses. This invention was developed by Hiester Jacob Lee, Belostotskiy Sergey Georgiyevich, Baker Noah Elliot, Breiling Patrick Girard, Saurabh Ashish, French Da..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Micron Technology has submitted a patent application for Charge Trapping Nor Flash Memory for Stacked Memory Architectures. This invention was developed by Pellizzer Fabio, Fratin Lorenzo, Tortorelli Innocenzo and Pirovano Agostino.
The patent application number is WO2026US10435 20260107. The patent publicatio..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Applied Materials has applied WIPO patent for Apparatus for Extracting Low Energy Ion Beam. Campbell Christopher W, Distaso Daniel and Chang Shengwu developed it.
The patent application number is WO2026US10403 20260107. The patent publication number is WO2026161213 (A1). International Patent Classification cod..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has received Applied Materials patent application for Inorganic Resist Positive Tone Conversion. Wojtecki Rudy and Chang Ching-yu developed the invention.
The patent application number is WO2025US61294 20251224. The patent publication number is WO2026161199 (A1). Intern..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Applied Materials has submitted a patent application for Underlayer for Ultraviolet (uv) Polymeric Resist. Wang Likun, Wojtecki Rudy and Chang Ching-yu developed the invention.
The patent application number is WO2025US61250 20251223. The patent publication number is WO2026161197 (A1). International Patent Cl..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Adeia Semiconductor Bonding Technologies has submitted a patent application for Disaggregated Caches for Processor Cores. This invention was developed by Katkar Rajesh and Haba Belgacem.
The patent application number is WO2025US61139 20251223. The patent publication number is WO2026161194 (A1). International..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has released Applied Materials patent application for Wrap Around Contact Epi Process Sequence. This invention was developed by Shusterman Yuriy, Kim Kyoung Ha, Lee Byeong Chan, Kanakasabapathy Sivanandha Krishnan, Sporre John, Breil Nicolas Louis, Basker Veeraraghavan S..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has released Microchip Technology patent application for Device, System and Methods for a Temperature-compensated Current Reference. This invention was developed by Mehrotra Shubham, Quiquempoix Vincent and Vaucher Fabien.
The patent application number is WO2025US51194 ..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Microchip Technology has submitted a patent application for Apparatus, System and Methods for a Temperature-compensated Current Reference. This invention was developed by Mehrotra Shubham, Quiquempoix Vincent and Vaucher Fabien.
The patent application number is WO2025US50996 20251015. The patent publication nu..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Applied Materials has submitted a patent application for Flexible Heatsink Interface. This invention was developed by Kengeri Subramani and Leshniak Itai.
The patent application number is WO2025US49562 20251006. The patent publication number is WO2026161112 (A1). International Patent Classification codes are H..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Applied Materials has sought patent for Cavity Contact Formation Using Plasma Doping Process. This invention was developed by Shim Kyu-ha, You Shi, Mittal Deven Raj, Bhosle Vikram M, Zhang Yan and Varghese Sony.
The patent application number is WO2025US49434 20251003. The patent publication number is WO2026161..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Applied Materials has applied WIPO patent for Substrate Stress Management Using High Temperature Implantation. Todorov Stanislav S, Evans Morgan, Lee Wonjae, Osonkie Adaeze, Kucher Olga, Karurshanmugam Ramkumar and Subrahmanyan Pradeep developed it.
The patent application number is WO2025US49325 20251003. The ..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Tel Mfg And Engineering Of America Inc has submitted a patent application for Overlay Correction in Semiconductor Device Manufacturing. This invention was developed by Raley Angelique, Heussner Robert, Kitano Junichi and Fernandez Luis.
The patent application number is WO2025US49313 20251003. The patent publ..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Microchip Technology has submitted a patent application for Recessed Smoke Detector. Mcfarland Patrick and Eck Arthur B developed the invention.
The patent application number is WO2025US38776 20250723. The patent publication number is WO2026161100 (A1). International Patent Classification code is G08B17/113...
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Microchip Technology has filed a patent application for Transferring Configuration Information from a First Device to a Second Device Based on the Status of the First Device. This invention was developed by Lam Andy Wah, Lee Tik Man and Wong Chi Lung.
The patent application number is WO2025US36597 20250707. Th..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has received Hanwha Semitech Co Ltd patent application for Substrate Processing Apparatus. Seo Dong Won and Kim Sang Yeop developed the invention.
The patent application number is WO2026KR95012 20260122. The patent publication number is WO2026160945 (A1). Internationa..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Hoseo University Academic Cooperation Foundation has applied WIPO patent for Thin Film Transistor Manufacturing Method Using Heat Treatment and Thin Film Transistor Structure. Bae Byung Seong developed it.
The patent application number is WO2026KR00984 20260116. The patent publication number is WO2026160777 ..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- Seoul Semiconductor has submitted a patent application for Light-emitting Module. This invention was developed by Lee Chunghoon.
The patent application number is WO2026KR01362 20260123. The patent publication number is WO2026160893 (A1). International Patent Classification codes are F21K9/60, F21S2/00, F21V2..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has published Seoul Viosys patent application for Light-emitting Module. The invention was developed by Kim Jaekwon.
The patent application number is WO2026KR01279 20260121. The patent publication number is WO2026160857 (A1). International Patent Classification codes ..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- LG Innotek has filed a patent application for Circuit Board and Semiconductor Package Comprising Same. This invention was developed by Lee Yong Jun, Kim Moo Seong and Yoo Jong Heun.
The patent application number is WO2025KR18363 20251110. The patent publication number is WO2026160579 (A1). International Patent..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has published Korea Institute Of Materials Science patent application for High-stability Carbon Nanotube Electrode for Solar Cell, Manufacturing Method Therefor, and Solar Cell Comprising Same. The invention was developed by Lee Kyun-bae, Kim Tae-hoon, Jung Byung-mun, Ju..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has received Korea Institute Of Materials Science patent application for Carbon Nanotube Electrode for Perovskite Solar Cell with Improved Reflectivity, Manufacturing Method Therefor, and Perovskite Solar Cell Including Same. Lee Kyun-bae, Kim Tae-hoon, Jung Byung-mun, J..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- PSK Holdings has submitted a patent application for Substrate Processing Device and Operating Method Thereof. This invention was developed by Jeon Jin Pyo, Jang Dong Hyun, Yoon Sung Jin, Kim Ji Hoon, Sul Bong Ho, Park Bum Joon, Lee Dong Hee and Na Jun Young.
The patent application number is WO2025KR01671 20250..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has published LG Electronics patent application for Source Substrate Holder and Display Device Including Same. The invention was developed by Kang Minhyun, Kim Hyungu, Yoon Hyunkwan and Han Kidoo.
The patent application number is WO2025KR01344 20250123. The patent publi..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- World Intellectual Property Organization has received LG Innotek patent application for Substrate and Electronic Element Having Inductor Mounted on Surface Thereof. Lee Song Yi, Hwang Jung Ho and Son Young Joon developed the invention.
The patent application number is WO2025KR22373 20251219. The patent publica..
Semiconductor
| Wed 05 Aug 2026
Geneva, Aug. 5 -- LX Semicon has applied WIPO patent for Display Apparatus and Control Method Thereof. Yoo Yoon Jong, Jeon Ho Hyub and Choi Ji Hoon developed it.
The patent application number is WO2025KR21364 20251211. The patent publication number is WO2026160621 (A1). International Patent Classification codes are G09G3/00 a..
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