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14:46:21 Sun 07 Jun 2026

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(1)

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(1)

(1)

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(1)

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(1)

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(1)

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(1)

(1)

(1)

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(1)

Central South University;

(1)

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(1)

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(1)

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(1)

(1)

(1)

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(1)

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(1)

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(1)

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(1)

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(1)

(1)

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(1)

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(1)

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(1)

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Florida State University

(1)

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Focuslight Singapore Pte

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Forehope Electronic, Ning

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Forty Eighth Research Ins

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Foshan Zhenmeizhijia Furn

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Foundation of Soongsil Un

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(1)

(1)

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(1)

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(1)

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(1)

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(1)

Giga Force Electronics Co

(1)

Gigaphoton; University Ky

(1)

Global Unichip Corp [tw];

(1)

Glorysoft Shanghai Co Ltd

(1)

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(1)

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Guilin University of Elec

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(1)

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(1)

Harbin Institute of Techn

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Henan Normal University

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(1)

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Huadian Xinneng Jiangxi Y

(1)

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Huaneng Zuoquan Coal and

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(1)

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(1)

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(1)

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(1)

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(1)

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(1)

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Taiwan Semiconductor Manufacturing Co Ltd Awarded Patent for Semiconductor Bonding Tool and Method of Operating the Same

Semiconductor

| Sat 06 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been awarded a patent for Semiconductor Bonding Tool and Method of Operating the Same. This invention was developed by Yu Tzu-wei, Wang Ching-hung, Lin Yeong-jyh and Li Ching I. The patent application number is US202217664162 20220519. The patent publication ..

Taiwan Semiconductor Manufacturing Co Ltd Granted United States Patent for Semiconductor Package and Manufacturing Method Thereof

Semiconductor

| Sat 06 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Semiconductor Package and Manufacturing Method Thereof. This invention was developed by Liu Zi-jheng, Yu Ting-yang, Lee Ming-tan and Kuo Hung-jui. The patent application number is US202217894084 20220823. The patent publication numbe..

Taiwan Semiconductor Manufacturing Co Ltd Gets Patent for Semiconductor Device Having an Inductor Disposed Within a First Bonding Layer and a Second Bonding Layer

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has received a patent for Semiconductor Device Having an Inductor Disposed Within a First Bonding Layer and a Second Bonding Layer. This invention was developed by Chuang Harry-haklay, Huang Wen-tuo, Teng Li-feng, Wu Wei-cheng and Wang Yu-jen. The patent applicat..

Taiwan Semiconductor Manufacturing Co Ltd Gains Patent for Analog-cells-boundary Region with Buried Power Grid Segment, Semiconductor Device Including Same and Method of Manufactur..

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- United States Patent for Analog-cells-boundary Region with Buried Power Grid Segment, Semiconductor Device Including Same and Method of Manufacturing Same has been issued to Taiwan Semiconductor Manufacturing Co Ltd. This invention was developed by Syu Ming-cheng, Yang Yu-tao, Lu Chung-ting, Kang Po-zeng, K..

Taiwan Semiconductor Manufacturing Co Ltd Granted Patent for Wafer Transport Method and Apparatus

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Wafer Transport Method and Apparatus. Hsiao Kai-hung, Jen Chi-chung, Shen Yu-chun, Kuo Yuan-cheng, Huang Chih-hsiung and Chiang Wen-chih developed the invention. The patent application number is US202318112980 20230222. The patent pu..

Ebara Corp, Ckd Corp and Ebara Refrigeration Equipment & Systems Co Ltd Awarded Patent for Temperature Regulating Apparatus for Semiconductor-device Manufacturing Equipment, and Se..

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Ebara Corp, Ckd Corp and Ebara Refrigeration Equipment & Systems Co Ltd have been awarded a patent for Temperature Regulating Apparatus for Semiconductor-device Manufacturing Equipment, and Semiconductor-device Manufacturing System. This invention was developed by Fukusumi Yukihiro, Nitta Shinichi and Kokub..

Taiwan Semiconductor Manufacturing Co Ltd Granted United States Patent for Structure and Formation Method of Device with Ferroelectric Layer

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Structure and Formation Method of Device with Ferroelectric Layer. This invention was developed by Madia Oreste and Vellianitis Georgios. The patent application number is US202217732873 20220429. The patent publication number is US12..

Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group Gain Patent for Display Substrate with Sub-pixels of Different Shapes and Display Device

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- United States Patent for Display Substrate with Sub-pixels of Different Shapes and Display Device has been issued to Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group. This invention was developed by Deng Jiangtao, Huang Yan, Yu Chi, Liu Biao, Cai Jianchang, Shu Xiaoqing and Zhang Yi. The ..

Huizhou China Star Optoelectronics Display Co Ltd and Shenzhen China Star Optoelectronics Semiconductor Display Technology Awarded Patent for Display Panel

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Huizhou China Star Optoelectronics Display Co Ltd and Shenzhen China Star Optoelectronics Semiconductor Display Technology have been awarded a patent for Display Panel. This invention was developed by Wang Guojie. The patent application number is US202218090548 20221229. The patent publication number is ..

Stmicroelectronics France ad Stmicroelectronics Alps SAS Gain Patent for Electronic Chips with Surface Mount Component

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- United States Patent for Electronic Chips with Surface Mount Component has been issued to Stmicroelectronics France and Stmicroelectronics Alps SAS. This invention was developed by Forest Jeremie, Knopik Vincent and Schwartz Laurent. The patent application number is US202117457203 20211201. The patent pu..

Taiwan Semiconductor Manufacturing Co Ltd Gets Patent for Trapping Layer for a Radio Frequency Die and Methods of Formation

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has received a patent for Trapping Layer for a Radio Frequency Die and Methods of Formation. This invention was developed by Cheng Yu-hung and Li Ching I. The patent application number is US202217869135 20220720. The patent publication number is US12648226 (B2). ..

Taiwan Semiconductor Manufacturing Co Ltd Granted United States Patent for Gate Patterning for Stacked Device Structure Using Self-assembled Monolayer

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Gate Patterning for Stacked Device Structure Using Self-assembled Monolayer. This invention was developed by Shih Che Chi, Chiu Tsungkai, Yang Ku-feng and Liao Szuya. The patent application number is US202318459952 20230901. The pate..

Taiwan Semiconductor Manufacturing Co Ltd Gets Patent for Method for Forming Semiconductor Device Structure

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has received a patent for Method for Forming Semiconductor Device Structure. This invention was developed by Cheng Chia-yun and Chang I-ming. The patent application number is US202318315524 20230511. The patent publication number is US12648216 (B2). International..

Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group Granted United States Patent for Display Substrate and Driving Method Therefor, and Display Device

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group has been granted a patent for Display Substrate and Driving Method Therefor, and Display Device. This invention was developed by Hu Yao, Li Ruoxiang, Chen Qian, Wang Feifan, Luo Guangshun, Sun Kuo and Ran Qifu. The patent application number..

Hefei Xinsheng Optoelectronics Tech Co Ltd and BOE Technology Group Gain Patent for Shift-register Unit, Grid Driving Circuit and Displaying Device

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- United States Patent for Shift-register Unit, Grid Driving Circuit and Displaying Device has been issued to Hefei Xinsheng Optoelectronics Tech Co Ltd and BOE Technology Group. This invention was developed by Xie Yongxian, Zou Zhixiang, Qu Feng, Tang Chuanjiang, Yang Tong, Ma Xiaoye, Lv Fengzhen and Zhang R..

Shanghai Rongzhouxin Tech Co Ltd Files Chinese Patent Application for Compound Semiconductor Photoresist Stripping Liquid as Well as Preparation Method, Application and Cleaning Me..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- Shanghai Rongzhouxin Tech Co Ltd has filed a patent application for Compound Semiconductor Photoresist Stripping Liquid as Well as Preparation Method, Application and Cleaning Method Thereof. This invention was developed by Zhao Yong, Tai Qile and Han Fusen. The patent application number is CN202511863334 2..

State Intellectual Property Office of China Releases Shanghai Xianfeng Tech Co Ltd Patent Application for Photoetching Alignment Mark, Chip and Photoetching Alignment Method for Pr..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Shanghai Xianfeng Tech Co Ltd patent application for Photoetching Alignment Mark, Chip and Photoetching Alignment Method for Preparation of Chip. This invention was developed by Chen Junhong, Gao Yongqiang, Tang Xinlu, Lin Zhengyi, Chen Zhihui and Li Yiy..

State Intellectual Property Office of China Receives Chengdu Yicheng Integrated Circuit Co Ltd Patent Application for Workbench Mechanism for Controlling Warping Degree of Glass Su..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received Chengdu Yicheng Integrated Circuit Co Ltd patent application for Workbench Mechanism for Controlling Warping Degree of Glass Substrate During Photoetching. Wang Yanhuan, Xiang Chen, Hu Xi, Jiang Junbo, Wu Yang and Zong Shibiao developed the invention. ..

Ningbo All Semi Micro Electronics Equipment Co Ltd Files Chinese Patent Application for Substrate Operation Method of Spin Coating and Developing Equipment, Spin Coating and Develo..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- Ningbo All Semi Micro Electronics Equipment Co Ltd has filed a patent application for Substrate Operation Method of Spin Coating and Developing Equipment, Spin Coating and Developing Equipment and System. This invention was developed by Wang Hongming, Wang Chong, Hao Binrong, Shen Yunqing and Zhou Peng. The..

Guangzhou China Star Optoelectronics Tech Co Ltd Files Chinese Patent Application for Array Substrate and Display Panel

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- Guangzhou China Star Optoelectronics Tech Co Ltd has filed a patent application for Array Substrate and Display Panel. This invention was developed by Li Jun and Hu Lei. The patent application number is CN202511843456 20251208. The patent publication number is CN121522926 (A). International Patent Classific..

Pro Micron GmbH Granted United States Patent for Method for Controlling and/or Monitoring a Workpiece Machining Process

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Pro Micron GmbH has been granted a patent for Method for Controlling and/or Monitoring a Workpiece Machining Process. This invention was developed by Wunderlich Rainer and Dix Martin. The patent application number is US202118251419 20211027. The patent publication number is US12643197 (B2). International..

State Intellectual Property Office of China Releases Xgiga Communication Tech Co Ltd Patent Application for Coupling Method for Improving High and Low Temperature Heat Effect and S..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Xgiga Communication Tech Co Ltd patent application for Coupling Method for Improving High and Low Temperature Heat Effect and Silicon Optical Module. This invention was developed by Zhou Rui, Guo Siyuan and Zhu Ningning. The patent application number ..

State Intellectual Property Office of China Publishes Intel NDTM USA Inc Patent Application for Pneumatic Valve, Gas Supply Device and Substrate Processing System

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has published Intel NDTM USA Inc patent application for Pneumatic Valve, Gas Supply Device and Substrate Processing System. The invention was developed by Li Wenzhe and Li Wanchao. The patent application number is CN202411100945 20240812. The patent publication nu..

Wuxi Huatong Pneumatic Mft Co Ltd Submits Chinese Patent Application for High-vacuum Electromagnetic Valve for Multi-product Silicon Ingot Furnace

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Wuxi Huatong Pneumatic Mft Co Ltd has submitted a patent application for High-vacuum Electromagnetic Valve for Multi-product Silicon Ingot Furnace. This invention was developed by Liu Zhicai, Chen Guiqin, Gao Xin, Huang Weifeng, Su Dongxu, Wang Bin and Yao Jinliang. The patent application number is CN202512..

Canon Granted Patent for Image Forming Apparatus Having Multi-beam Laser Light Emitting Point Pitch Identification

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Canon has been granted a patent for Image Forming Apparatus Having Multi-beam Laser Light Emitting Point Pitch Identification. Obara Mitsuhiro, Nishiguchi Tetsuya and Fukuhara Hiroyuki developed the invention. The patent application number is US202418828912 20240909. The patent publication number is US12..

Taiwan Semiconductor Manufacturing Co Ltd Granted Patent for Extreme Ultraviolet (EUV) Radiation Source Apparatus, EUV Lithography System, and Method for Generating Extreme Ultravi..

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Extreme Ultraviolet (EUV) Radiation Source Apparatus, EUV Lithography System, and Method for Generating Extreme Ultraviolet Radiation. Lu Chien-hsing, Tu Chih-chiang, Wen Chih-wei, Tseng Hsin-fu and Hsu Tzu Jeng developed the invention...

Taiwan Semiconductor Manufacturing Co Ltd Gains Patent for Thin-film Transistors for Detecting Miniature Targets

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- United States Patent for Thin-film Transistors for Detecting Miniature Targets has been issued to Taiwan Semiconductor Manufacturing Co Ltd. This invention was developed by Lee Wei, Cheng Chung-liang, Liu Pei-wen, Su Ke-wei and Cheng Kuan-lun. The patent application number is US202217876920 20220729. The..

Taiwan Semiconductor Manufacturing Co Ltd Granted United States Patent for Semiconductor Device Structure with Magnetic Structure and Method for Forming the Same

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Semiconductor Device Structure with Magnetic Structure and Method for Forming the Same. This invention was developed by Chen Wei-chung and Wu Jun-yi. The patent application number is US202318512281 20231117. The patent publication nu..

Taiwan Semiconductor Manufacturing Co Ltd Gains Patent for Trench-type BEOL Memory Cell

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- United States Patent for Trench-type BEOL Memory Cell has been issued to Taiwan Semiconductor Manufacturing Co Ltd. This invention was developed by Chen Tzu-yu, Shih Sheng-hung and Tu Kuo-chi. The patent application number is US202217672382 20220215. The patent publication number is US12648149 (B2). Inte..

Taiwan Semiconductor Manufacturing Co Limited Gains Patent for Gain Cell Memory Device Using Enhanced Sensing Scheme and Methods for Operating the Same

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- United States Patent for Gain Cell Memory Device Using Enhanced Sensing Scheme and Methods for Operating the Same has been issued to Taiwan Semiconductor Manufacturing Co Limited. This invention was developed by Hsieh Wei Ting, Chen Kuen-yi, Ting Yu-wei, Ong Yi Ching and Huang Kuo-ching. The patent appli..

Taiwan Semiconductor Manufacturing Co Ltd Granted United States Patent for Memory Circuit and Method of Operating the Same

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Memory Circuit and Method of Operating the Same. This invention was developed by Kao Yun-feng and Chiang Katherine H. The patent application number is US202418752079 20240624. The patent publication number is US12646550 (B2). Interna..

Taiwan Semiconductor Manufacturing Co Ltd Granted United States Patent for Pre-charger Circuit of Memory Device and Methods for Operating the Same

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Taiwan Semiconductor Manufacturing Co Ltd has been granted a patent for Pre-charger Circuit of Memory Device and Methods for Operating the Same. This invention was developed by Hamada Masaya, Hara Takumi and Yabuuchi Makoto. The patent application number is US202318331558 20230608. The patent publication..

Shenzhen Maxking Electronic Co Ltd Submits Chinese Patent Application for Intelligent Household Multi-device Linkage Power Utilization Control Method Based on MOS Tube

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- Shenzhen Maxking Electronic Co Ltd has submitted a patent application for Intelligent Household Multi-device Linkage Power Utilization Control Method Based on MOS Tube. This invention was developed by Wu Aihua. The patent application number is CN202511824010 20251205. The patent publication number is CN1215..

Guangbenwei Intelligent Tech Shanghai Co Ltd Seeks Patent for Photonic Device Based on Flexible Substrate and Design Method Thereof

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- Guangbenwei Intelligent Tech Shanghai Co Ltd has sought patent for Photonic Device Based on Flexible Substrate and Design Method Thereof. This invention was developed by Zhang Rizhen and Cheng Tangsheng. The patent application number is CN202511579789 20251030. The patent publication number is CN121522804 (..

U.S. Patent and Trademark Office Awards Patent for Dataflow Based Guidance for Buffer Allocation in Multicore Architectures

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Xilinx for Dataflow Based Guidance for Buffer Allocation in Multicore Architectures. Agarwal Ajit K developed the invention. The patent application number is US202218057199 20221118. The patent publication number is US12645859 (B2). International P..

Shenzhou Longxin Intelligent Tech Co Ltd Applies for Patent on Automatic Chip Testing Device

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- Shenzhou Longxin Intelligent Tech Co Ltd has applied Chinese patent for Automatic Chip Testing Device. Chen Jianhao, Xiang Mei and Li Rui developed it. The patent application number is CN20261015905 20260107. The patent publication number is CN121522427 (A). International Patent Classification codes are G01..

Guizhou Zhenhua Fengguang Semiconductor Co Ltd Submits Chinese Patent Application for Electrified Vibration Test Clamp for Surface-mounted Integrated Circuit with Pins

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- Guizhou Zhenhua Fengguang Semiconductor Co Ltd has submitted a patent application for Electrified Vibration Test Clamp for Surface-mounted Integrated Circuit with Pins. This invention was developed by Liu Guangya, Liu Ganggang, Yang Yun, Xia Zijin and Bao Qian. The patent application number is CN20251173415..

State Intellectual Property Office of China Publishes Henan Zhongke Qingneng Technology and Shenzhen Zhongke Qingchu Tech Co Ltd Patent Application for Whole Wafer Temperature Meas..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has published Henan Zhongke Qingneng Technology and Shenzhen Zhongke Qingchu Tech Co Ltd patent application for Whole Wafer Temperature Measurement Chip Batch Test Device and Automatic Test Method. The invention was developed by Ding Fei, Liu Nanchuan, Pan Weiwei, Zh..

State Intellectual Property Office of China Publishes Shanghai Institute Of Measurement and Testing Tech Co Ltd Patent Application for Accuracy Verification System and Method for I..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has published Shanghai Institute Of Measurement and Testing Tech Co Ltd patent application for Accuracy Verification System and Method for Integrated Circuit Radiation Immunity Test System. The invention was developed by Li Jinlong, Wang Zhong, Zhang Lanju and Gui Bi..

Zhao Zhuo Submits Chinese Patent Application for Technical Method for Cleaning Surface of Non-oriented Silicon Steel Through Plasma in Laboratory

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Zhao Zhuo has submitted a patent application for Technical Method for Cleaning Surface of Non-oriented Silicon Steel Through Plasma in Laboratory. This invention was developed by Zhou Yanwen, Li Fuqiang, Ren Tingdong, Liu Xuming, Geng Zhiyu and Li Yiming. The patent application number is CN202511807265 2025..

Jiuyang Sunshine Pcb Tech Co Ltd Submits Chinese Patent Application for High-temperature Oxygen-free Plasma Stress Release Method for PCB Pattern Electroplating Clamping Film

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Jiuyang Sunshine Pcb Tech Co Ltd has submitted a patent application for High-temperature Oxygen-free Plasma Stress Release Method for PCB Pattern Electroplating Clamping Film. This invention was developed by Su Wei and Song Xiuquan. The patent application number is CN202510547255 20250428. The patent public..

Beijing Integrated Circuit Equipment Innovation Center Co Ltd Seeks Patent for Process Chamber Protection Layer Preparation Method and Semiconductor Process Equipment

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Beijing Integrated Circuit Equipment Innovation Center Co Ltd has sought patent for Process Chamber Protection Layer Preparation Method and Semiconductor Process Equipment. This invention was developed by Dong Yunhe, Du Songmo, Du Xian and Deng Yuan. The patent application number is CN202511767295 20251127...

Nanchang Zhongwei Semiconductor Equipment Co Ltd Applies for Patent on Flow Guide Ring and Chemical Vapor Deposition Device

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Nanchang Zhongwei Semiconductor Equipment Co Ltd has applied Chinese patent for Flow Guide Ring and Chemical Vapor Deposition Device. Pan Lin, Luo Jiahao, Xie Zhennan, Liu Congling, Guo Quanyong, Zhou Ning and Jiang Yong developed it. The patent application number is CN20261046542 20260114. The patent publi..

Wuxi Xinhan Electronic Tech Co Ltd Submits Chinese Patent Application for Cvd (chemical Vapor Deposition) Jet Gasification Device and Method for Improving Uniformity of Semiconduct..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Wuxi Xinhan Electronic Tech Co Ltd has submitted a patent application for Cvd (chemical Vapor Deposition) Jet Gasification Device and Method for Improving Uniformity of Semiconductor Film. This invention was developed by Qian Qiang, Tang Jiancheng and Zheng Shaoping. The patent application number is CN20251..

Shandong Aobo Biotechnology Co Ltd Seeks Patent for Process for Preparing Mannitol by Taking Glucose as Substrate Through Efficient and Green Biological Method

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Shandong Aobo Biotechnology Co Ltd has sought patent for Process for Preparing Mannitol by Taking Glucose as Substrate Through Efficient and Green Biological Method. This invention was developed by Cao Meng, Wang Shuhua, Gao Qiang, Hu Wei, Guo Yumeng and Zhang Tingting. The patent application number is CN20..

Shanghai Bonaiya Biotechnology Co Ltd Seeks Patent for Rapid Nucleic Acid Amplification Chip

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Shanghai Bonaiya Biotechnology Co Ltd has sought patent for Rapid Nucleic Acid Amplification Chip. This invention was developed by Mi Jun and Zhang Jieying. The patent application number is CN202310481279 20230428. The patent publication number is CN121518260 (A). International Patent Classification codes a..

Shenzhen Daofengning Tech Co Ltd Submits Chinese Patent Application for Preparation Method of High-thermal-conductivity Filler Modified Organic Silicon Pouring Sealant

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Shenzhen Daofengning Tech Co Ltd has submitted a patent application for Preparation Method of High-thermal-conductivity Filler Modified Organic Silicon Pouring Sealant. This invention was developed by Huang Yingxue, Lu Jinbo and Deng Linlin. The patent application number is CN20251228102 20251230. The paten..

Tianfu Jiangxi Laboratory Files Chinese Patent Application for Binder Preparation Method, Binder, Positive Wafer Pole Piece and Wafer Semiconductor All-solid-state Battery

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Tianfu Jiangxi Laboratory has filed a patent application for Binder Preparation Method, Binder, Positive Wafer Pole Piece and Wafer Semiconductor All-solid-state Battery. This invention was developed by Chen Hang, Chen Yu, Xiang Yong and Jiang Yan. The patent application number is CN202511563050 20251029. T..

Hubei Hangju Tech Co Ltd Submits Chinese Patent Application for Reusable Ablation-resistant Silicon Resin Heat-proof Coating and Preparation Method Thereof

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Hubei Hangju Tech Co Ltd has submitted a patent application for Reusable Ablation-resistant Silicon Resin Heat-proof Coating and Preparation Method Thereof. This invention was developed by Xiang Shiping, Yin De, Huang Gengqiao, Qin Yi, Huang Yiyong, Wang Junxun, Wu Yi, Tian Kang, Xiao Yong and Chen Haiya. T..

State Intellectual Property Office of China Releases Air Chongqing New Mat Co Ltd Patent Application for Isocyanate and Organic Silicon Composite Modified Epoxy Resin Closed Prime ..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Air Chongqing New Mat Co Ltd patent application for Isocyanate and Organic Silicon Composite Modified Epoxy Resin Closed Prime Paint and Preparation Method Thereof. This invention was developed by Liu Chaohui and Dong Xiyun. The patent application num..

State Intellectual Property Office of China Receives Chc North Paint & Coatings Industry Res and Design Institute Patent Application for Water-based Thermal Insulation Coating Prep..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received Chc North Paint & Coatings Industry Res and Design Institute patent application for Water-based Thermal Insulation Coating Prepared Based on Hydrophobic Silicon Dioxide Aerogel and Preparation Method of Water-based Thermal Insulation Coating. Li Zhibao, ..

Fujian Yuanxiang New Mat Co Ltd Applies for Patent on Preparation Method of Special Silicon Dioxide Delustering Agent for UV Paint

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Fujian Yuanxiang New Mat Co Ltd has applied Chinese patent for Preparation Method of Special Silicon Dioxide Delustering Agent for UV Paint. Wang Fangke, Ding Jiannan, Tan Yuquan and Hu Fei developed it. The patent application number is CN20251251656 20251231. The patent publication number is CN121517954 (A..

State Intellectual Property Office of China Releases Fujian Yuanxiang New Mat Co Ltd Patent Application for Preparation Method of High-transparency Silicon Dioxide Delustering Agen..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Fujian Yuanxiang New Mat Co Ltd patent application for Preparation Method of High-transparency Silicon Dioxide Delustering Agent. This invention was developed by Wang Fangke, Ding Jiannan, Tan Yuquan and Hu Fei. The patent application number is CN2025..

State Intellectual Property Office of China Receives Hesheng Silicon Ind Shanshan Co Ltd Patent Application for Light-weight High-flame-retardant Organic Silicon Composite Material..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received Hesheng Silicon Ind Shanshan Co Ltd patent application for Light-weight High-flame-retardant Organic Silicon Composite Material and Preparation Method Thereof. Zhou Yijie, Wu Fei, Zhang Zhixiong, Zhou Jing, Zhang Xiangdong, Zhang Botao, Zhang Xiangchun, ..

Xinjiang Hesheng Silicon Industry New Mat Co Ltd Applies for Patent on Process Control Method for Producing High-temperature-resistant Organic Silicon Raw Rubber by Dynamic Vulcani..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Xinjiang Hesheng Silicon Industry New Mat Co Ltd has applied Chinese patent for Process Control Method for Producing High-temperature-resistant Organic Silicon Raw Rubber by Dynamic Vulcanization Method. Zhang Zhandong, Luo Yedong, Qu Longxue, Qin Wei, Liu Shaolong and Yang Zhenguo developed it. The patent ..

Sisnap Ab Awarded Patent for 3D Semiconductor Detector System

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Sisnap Ab has been awarded a patent for 3D Semiconductor Detector System. This invention was developed by Danielsson Mats and Terenzi Luca. The patent application number is US202418669740 20240521. The patent publication number is US12645000 (B2). International Patent Classification codes are G01T1/24, H..

U.S. Patent and Trademark Office Awards Patent for Data Simulation Apparatus and Data Simulation Method

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Institute Of Semiconductors Chinese Academy Of Sciences and Institute Of Semiconductors Chinese Academy Of Sciences Beijing China for Data Simulation Apparatus and Data Simulation Method. Dou Runjiang, Yu Jingyi, Wu Nanjian, Liu Liyuan and Liu Jian de..

State Intellectual Property Office of China Receives Jiaxing Jiasai Information Tech Co Ltd Patent Application for Forged Signal Identification and Alarm Method for Single Beidou S..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received Jiaxing Jiasai Information Tech Co Ltd patent application for Forged Signal Identification and Alarm Method for Single Beidou Satellite Positioning Chip. Zhuang Min developed the invention. The patent application number is CN202511667355 20251114. The..

Shanghai Xihe Tech Co Ltd Seeks Patent for Laser Radar Chip and Detection Equipment

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- Shanghai Xihe Tech Co Ltd has sought patent for Laser Radar Chip and Detection Equipment. This invention was developed by Zhou Yi and Feng Dazeng. The patent application number is CN20261050178 20260115. The patent publication number is CN121522607 (A). International Patent Classification codes are G01S17/8..

Hangzhou Fujia Gallium Industry Tech Co Ltd Applies for Patent on Combined Crucible, Device and Method for Growing Semiconductor Single Crystal by Melt Method

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Hangzhou Fujia Gallium Industry Tech Co Ltd has applied Chinese patent for Combined Crucible, Device and Method for Growing Semiconductor Single Crystal by Melt Method. Deng Qiyuan, Huang Haotian and Qi Hongji developed it. The patent application number is CN202511637564 20251110. The patent publication num..

State Intellectual Property Office of China Releases Suzhou Xinjing Artificial Intelligence Tech Research And Development Co Ltd Patent Application for Directional Controllable Gro..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Suzhou Xinjing Artificial Intelligence Tech Research And Development Co Ltd patent application for Directional Controllable Growth Method of High-purity Polycrystalline Silicon. This invention was developed by Liu Zhenchun, Wang Changqing and Wang Meng. ..

State Intellectual Property Office of China Publishes Zhongke Huizhu Guangzhou Semiconductor Co Ltd Patent Application for Graphite Tray for Epitaxial Growth of Semiconductor Mater..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has published Zhongke Huizhu Guangzhou Semiconductor Co Ltd patent application for Graphite Tray for Epitaxial Growth of Semiconductor Material. The invention was developed by Hu Lingfeng, Yang Junwei, Guo Songbo and Song Huaping. The patent application number is ..

State Intellectual Property Office of China Releases Zhengzhou Rongxin Electronic Tech Co Ltd Patent Application for Accurate Positioning and Anti-deviation Structure for Seed Crys..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Zhengzhou Rongxin Electronic Tech Co Ltd patent application for Accurate Positioning and Anti-deviation Structure for Seed Crystal in Silicon Carbide Crystal Growth Furnace. This invention was developed by Zhao Yihui. The patent application number is ..

Yuze New Energy Kunming Co Ltd Seeks Patent for Heater, Monocrystalline Silicon Drawing Method and Monocrystalline Silicon

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Yuze New Energy Kunming Co Ltd has sought patent for Heater, Monocrystalline Silicon Drawing Method and Monocrystalline Silicon. This invention was developed by Wei Zihan. The patent application number is CN202511712208 20251120. The patent publication number is CN121519147 (A). International Patent Classif..

Kunshan Jiadejun Electronic Tech Co Ltd Submits Chinese Patent Application for Tunnel Type Electroplating System

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Kunshan Jiadejun Electronic Tech Co Ltd has submitted a patent application for Tunnel Type Electroplating System. This invention was developed by Qiu Jian, Xu Xiaoqi and Wang Hengjiang. The patent application number is CN20251252106 20251231. The patent publication number is CN121519133 (A). International P..

Shaoxing Tepulaide Surface Treat Co Ltd Files Chinese Patent Application for Metal Piece Surface Electroplating Equipment and Electroplating Process

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Shaoxing Tepulaide Surface Treat Co Ltd has filed a patent application for Metal Piece Surface Electroplating Equipment and Electroplating Process. This invention was developed by Deng Kehong. The patent application number is CN202511517543 20251023. The patent publication number is CN121519131 (A). Interna..

Yangtze River Delta Optoelectronics Academy Of Peking Univ Files Chinese Patent Application for Reusable Electroplating Template as Well as Preparation Method and Application There..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Yangtze River Delta Optoelectronics Academy Of Peking Univ has filed a patent application for Reusable Electroplating Template as Well as Preparation Method and Application Thereof. This invention was developed by Zhu Rui, Huangfu Yiming, Li Xingying, Sha Rui and Wu Jiang. The patent application number is C..

State Intellectual Property Office of China Receives Chongyi Zhangyuan Tungsten and Hunan University of Science and Technology Patent Application for Method for Removing Phosphorus..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received Chongyi Zhangyuan Tungsten and Hunan University of Science and Technology patent application for Method for Removing Phosphorus and Silicon from Sodium Tungstate Solution. Zhang Xin, Yang Qiumin, Xu Guozuan, Zhang Longhui, Lin Liping, Mao Li and Fu Yu de..

Zhejiang Zhenghe Silicon Mat Co Ltd Submits Chinese Patent Application for Phenyl Silicone Oil for Adjusting Stripping Force of Organic Silicon Release Agent and Preparation Method..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Zhejiang Zhenghe Silicon Mat Co Ltd has submitted a patent application for Phenyl Silicone Oil for Adjusting Stripping Force of Organic Silicon Release Agent and Preparation Method of Phenyl Silicone Oil. This invention was developed by Fang Wei, Xu Zhiliang, Yu Yangrong, Mao Xinxing and Wei Jiayong. The pa..

State Intellectual Property Office of China Releases Guangdong Hanlin Material Tech Co Ltd and Qingyuan High Tech Park Tech Collaborative Innovation Institute Co Ltd Patent Applica..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Guangdong Hanlin Material Tech Co Ltd and Qingyuan High Tech Park Tech Collaborative Innovation Institute Co Ltd patent application for Preparation Method of Fluorine-free Water Repellent Agent Based on Organic Silicon Modified Long-chain Alkyl Polyureth..

State Intellectual Property Office of China Publishes Chongqing Huafeng Dijiete Printing Mat Co Ltd Patent Application for Lipophilic Alkali-soluble Resin, Preparation Method and L..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has published Chongqing Huafeng Dijiete Printing Mat Co Ltd patent application for Lipophilic Alkali-soluble Resin, Preparation Method and Lithographic Printing Plate Photosensitive Resist. The invention was developed by Liu Siqi, Sha Yizhou, Liang Yong and Zheng Qic..

Changzhou Jianuo Silicone Co Ltd Submits Chinese Patent Application for Room-temperature Quick-drying Water-based Organic Silicon Resin and Preparation Method Thereof

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Changzhou Jianuo Silicone Co Ltd has submitted a patent application for Room-temperature Quick-drying Water-based Organic Silicon Resin and Preparation Method Thereof. This invention was developed by Hu Leijie, Hu Mengjin, Zhou Fuming and Cheng Yuhong. The patent application number is CN202511771734 2025112..

State Intellectual Property Office of China Releases Quzhou Nabeixiao Quartz Tech Co Ltd Patent Application for Manufacturing Method of Synthetic Silicon Dioxide Powder

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Quzhou Nabeixiao Quartz Tech Co Ltd patent application for Manufacturing Method of Synthetic Silicon Dioxide Powder. This invention was developed by Watabe Hiroyuki, Cheng Liqun and Chen Jiyuan. The patent application number is CN202511592196 20251103..

Hami Yizhou Zhengcheng Coal Sales Center Submits Chinese Patent Application for Composite Carbonaceous Reducing Agent for Silicon Smelting and Preparation Method Thereof

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Hami Yizhou Zhengcheng Coal Sales Center has submitted a patent application for Composite Carbonaceous Reducing Agent for Silicon Smelting and Preparation Method Thereof. This invention was developed by Yan Zhengming. The patent application number is CN202511915945 20251218. The patent publication number is..

State Intellectual Property Office of China Releases Hefei Huayu Semiconductor Co Ltd Patent Application for Pickup Device for Chip Testing

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has released Hefei Huayu Semiconductor Co Ltd patent application for Pickup Device for Chip Testing. This invention was developed by Tian Chao. The patent application number is CN202511842498 20251209. The patent publication number is CN121516554 (A). Internationa..

Dalian Huarui Heavy Industry Group Files Chinese Patent Application for Self-adaptive Blanking Buffer Device

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Dalian Huarui Heavy Industry Group has filed a patent application for Self-adaptive Blanking Buffer Device. This invention was developed by Zhang Yanmin, Yang Ruiping, Li Gaoyang, Yang Yanxin, Zhao Yutang, Wang Xiao, Han Na and Hao Li. The patent application number is CN202511879488 20251212. The patent pub..

State Intellectual Property Office of China Receives Nanjing Weice Semiconductor Tech Co Ltd Patent Application for Normal-high Temperature Automatic Temperature Control Method for..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received Nanjing Weice Semiconductor Tech Co Ltd patent application for Normal-high Temperature Automatic Temperature Control Method for Probe Station for Semiconductor Test. Zhang Yonggang, Zhang Shiyan and Qin Lin developed the invention. The patent applicat..

Shanghai GND Etech Co Ltd Submits Patent Application for Auxiliary Equipment for Semiconductor Chip Wafer Detection

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- Shanghai GND Etech Co Ltd has submitted a patent application for Auxiliary Equipment for Semiconductor Chip Wafer Detection. Cui Wei developed the invention. The patent application number is CN20261049947 20260115. The patent publication number is CN121522218 (A). International Patent Classification codes a..

Yangzhou Yicheng Tech Co Ltd Seeks Patent for Probe Platform for Semiconductor Detection

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- Yangzhou Yicheng Tech Co Ltd has sought patent for Probe Platform for Semiconductor Detection. This invention was developed by Xiong Jiongsheng and Lai Shengxiong. The patent application number is CN202511358070 20250923. The patent publication number is CN121522204 (A). International Patent Classification ..

Huasheng Electronic Tech Kunshan Co Ltd Submits Chinese Patent Application for Online Monitoring Device for Water Quality of Electroplating Bath

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- Huasheng Electronic Tech Kunshan Co Ltd has submitted a patent application for Online Monitoring Device for Water Quality of Electroplating Bath. This invention was developed by Ye Yunqiang and Yuan Linhong. The patent application number is CN202511634200 20251110. The patent publication number is CN1215221..

Tonghua Hongxin Abrasive Co Ltd Applies for Patent on Preparation Method of Silicon Carbide Granulation Powder

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Tonghua Hongxin Abrasive Co Ltd has applied Chinese patent for Preparation Method of Silicon Carbide Granulation Powder. Mo Zhenghao, Wang Xia and Sun Baoquan developed it. The patent application number is CN202511614609 20251106. The patent publication number is CN121517220 (A). International Patent Classi..

State Intellectual Property Office of China Publishes Ningbo Jiangfeng Tongchuang Special Ceramic Tech Co Ltd Patent Application for Preparation Method of Large-size High-purity Co..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has published Ningbo Jiangfeng Tongchuang Special Ceramic Tech Co Ltd patent application for Preparation Method of Large-size High-purity Compact Silicon Carbide Ceramic. The invention was developed by Yao Lijun, Gao Xiong and Liying Zhou. The patent application n..

State Intellectual Property Office of China Receives Wei Zijian and Unimicron Technology Patent Application for Metallized Glass Substrate and Manufacturing Method Thereof

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received Wei Zijian and Unimicron Technology patent application for Metallized Glass Substrate and Manufacturing Method Thereof. Wei Zijian developed the invention. The patent application number is CN202411104175 20240813. The patent publication number is CN12..

Tinko Instr Suzhou Co Ltd Files Chinese Patent Application for Power Frequency Alternating Current Load Power Regulation Control Circuit Based on Multiple Silicon Controlled Rectif..

Semiconductor

| Fri 05 Jun 2026

Beijing, June 6 -- Tinko Instr Suzhou Co Ltd has filed a patent application for Power Frequency Alternating Current Load Power Regulation Control Circuit Based on Multiple Silicon Controlled Rectifiers. This invention was developed by Fan Fan, Wu Xiaogang and Zhao Xueling. The patent application number is CN202311739400 20231..

Terry Tech Nanjing Co Ltd Files Chinese Patent Application for Micro-fluidic Chip and Tissue Dyeing Device and Method Comprising Micro-fluidic Chip

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Terry Tech Nanjing Co Ltd has filed a patent application for Micro-fluidic Chip and Tissue Dyeing Device and Method Comprising Micro-fluidic Chip. This invention was developed by Ma Shuoxin, Wang Tan, Cao Yongwei and Tai Yuan. The patent application number is CN202510375716 20250327. The patent publication ..

State Intellectual Property Office of China Receives Baoji Xing Yu Teng Measure And Control Instr Co Ltd Patent Application for Monocrystalline Silicon Differential Pressure Transm..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received Baoji Xing Yu Teng Measure And Control Instr Co Ltd patent application for Monocrystalline Silicon Differential Pressure Transmitter with High Stability. Li Ping, Niu Minliang and Su Lichuan developed the invention. The patent application number is CN..

Zhenjiang Yinhai Science & Tech Material Co Ltd Submits Patent Application for Unidirectional and Bidirectional Semispherical Grain Heat Dissipation Aluminum Substrate for Automobi..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- Zhenjiang Yinhai Science & Tech Material Co Ltd has submitted a patent application for Unidirectional and Bidirectional Semispherical Grain Heat Dissipation Aluminum Substrate for Automobile Plate Heat Exchanger. Zhang Qin, Tao Jia and Yang Yao developed the invention. The patent application number is CN202..

State Intellectual Property Office of China Receives East China Institute Optoelectronic Integrated Device Patent Application for High-density Hybrid Integrated Circuit Type Digita..

Semiconductor

| Sat 06 Jun 2026

Beijing, June 6 -- State Intellectual Property Office of China has received East China Institute Optoelectronic Integrated Device patent application for High-density Hybrid Integrated Circuit Type Digital Pressure Sensor. Zhao Pengfei, Zhang Shaowen, Gao Yitong, Jiang Song, Li Xi, Yuan Man and Sun Wenwei developed the invention...

MediaTek Granted United States Patent for Semiconductor Package Using Substrate Block Integration

Semiconductor

| Sat 06 Jun 2026

Alexandria, June 6 -- MediaTek has been granted a patent for Semiconductor Package Using Substrate Block Integration. This invention was developed by Chen Wei-chih and Chen Shi-bai. The patent application number is US202318215830 20230629. The patent publication number is US12648497 (B2). International Patent Classification c..

AUO Corporation Gains Patent for Light Emitting Component Array Substrate

Semiconductor

| Sat 06 Jun 2026

Alexandria, June 6 -- United States Patent for Light Emitting Component Array Substrate has been issued to AUO Corporation. This invention was developed by Tseng Wen-hsien and Pai Chia-hui. The patent application number is US202318399910 20231229. The patent publication number is US12648494 (B2). International Patent Classifica..

Samsung Electronics Secures Patent for Semiconductor Package Including Buffer Chip Bonded to Memory Dies Using Wires

Semiconductor

| Sat 06 Jun 2026

Alexandria, June 6 -- Samsung Electronics has secured a patent on Semiconductor Package Including Buffer Chip Bonded to Memory Dies Using Wires. Lee Manho, Seo Jungmin, Shin Kwangseob, Choi Woosin and Choi Junghwan developed the invention. The patent application number is US202318206201 20230606. The patent publication number i..

U.S. Patent and Trademark Office Awards Patent for Semiconductor Device and Method of Manufacturing Semiconductor Device

Semiconductor

| Sat 06 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Mitsubishi Electric for Semiconductor Device and Method of Manufacturing Semiconductor Device. Tanigaki Tsuyoshi developed the invention. The patent application number is US202118569607 20210623. The patent publication number is US12648473 (B2). Inte..

Shinko Electric Industries Granted United States Patent for Wiring Substrate

Semiconductor

| Sat 06 Jun 2026

Alexandria, June 6 -- Shinko Electric Industries has been granted a patent for Wiring Substrate. This invention was developed by Shirotori Toshiki, Hoshina Ryota and Nakamura Kenta. The patent application number is US202418403954 20240104. The patent publication number is US12648468 (B2). International Patent Classification cod..

STMicroelectronics Grenoble 2 Awarded Patent for Electronic Circuit

Semiconductor

| Sat 06 Jun 2026

Alexandria, June 6 -- STMicroelectronics Grenoble 2 has been awarded a patent for Electronic Circuit. This invention was developed by Pulvermüller Corine-christine and Airault Pierre. The patent application number is US202318344253 20230629. The patent publication number is US12648466 (B2). Cooperative Patent Classification co..

LG Innotek Granted Patent for Circuit Board and Semiconductor Package Comprising Same

Semiconductor

| Sat 06 Jun 2026

Alexandria, June 6 -- LG Innotek has been granted a patent for Circuit Board and Semiconductor Package Comprising Same. Kwon Myung Jae, Nam Sang Hyuck and Yeo Ki Su developed the invention. The patent application number is US202218293165 20220729. The patent publication number is US12648462 (B2). International Patent Classifica..

U.S. Patent and Trademark Office Awards Patent for Integrated Circuit (ic) Package Including an Inductive Device Formed in a Conductive Routing Region

Semiconductor

| Sat 06 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Microchip Technology for Integrated Circuit (ic) Package Including an Inductive Device Formed in a Conductive Routing Region. Martin Matthew, Chen Bomy and Kovats Julius developed the invention. The patent application number is US202318351591 2023071..

U.S. Patent and Trademark Office Awards Patent for Semiconductor Package Enabling Reduction in Semiconductor Package Size

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Juniper Networks Inc and Hewlett Packard Enterprise Company (HPE) for Semiconductor Package Enabling Reduction in Semiconductor Package Size. Kugel Valery, Ahmed Omar and Su Peng developed the invention. The patent application number is US202318165..

U.S. Patent and Trademark Office Awards Patent for Thermal Dissipation in Power IC Using Pyroelectric Materials

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing Co Ltd for Thermal Dissipation in Power IC Using Pyroelectric Materials. Ong Yi Ching, Huang Kuo-ching and Chuang Harry-hak-lay developed the invention. The patent application number is US202217749418 20220520. Th..

Nanya Tech Secures Patent for Semiconductor Device Structure with Liner Layer Having Tapered Sidewall and Method for Preparing the Same

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Nanya Tech has secured a patent on Semiconductor Device Structure with Liner Layer Having Tapered Sidewall and Method for Preparing the Same. Huang Tse-yao developed the invention. The patent application number is US202519234594 20250611. The patent publication number is US12648433 (B2). International Pa..

Nanya Tech Granted Patent for Semiconductor Device and Method for Fabricating the Same

Semiconductor

| Fri 05 Jun 2026

Alexandria, June 6 -- Nanya Tech has been granted a patent for Semiconductor Device and Method for Fabricating the Same. Chuang Ying-cheng developed the invention. The patent application number is US202318398236 20231228. The patent publication number is US12648432 (B2). International Patent Classification codes are H10B12/00..

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