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Semiconductor
| Sun 31 May 2026
Beijing, June 1 -- State Intellectual Property Office of China has published Changdian Microelectronics Jiangyin Co Ltd patent application for Wafer Thinning Method, Grinding Control Device and Related Equipment. The invention was developed by Hua Yongchun.
The patent application number is CN202511913202 20251217. The patent ..
Semiconductor
| Sun 31 May 2026
Beijing, June 1 -- State Intellectual Property Office of China has released Xi'an ESWIN Material Technology and Xi'an Eswin Silicon Wafer Technology patent application for Cleaning Device. This invention was developed by Cai Peifeng and Zhou Qinxue.
The patent application number is CN202511659712 20251113. The patent publicat..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Beijing Tankeblue Semiconductor and Jiangsu Tianke Heda Semiconductor have submitted a patent application for Silicon Carbide Crystal Growth Method and Device. This invention was developed by Wang Guangming, Lou Yanfang, Liu Chunjun, Peng Tonghua and Yang Jian.
The patent application number is CN20251199559..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Beijing Zhongboxin Semiconductor Tech Co Ltd has submitted a patent application for Algan Based on Porous Aln Growth and Preparation Method Thereof. This invention was developed by Zhang Ziyao and Zhang Lisheng.
The patent application number is CN202511396713 20250928. The patent publication number is CN121..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Zhongke Huizhu Guangzhou Semiconductor Co Ltd has filed a patent application for Silicon Carbide Epitaxial Layer and Preparation Method Thereof. This invention was developed by Xue Long, Song Huaping, Yang Junwei and Guo Songbo.
The patent application number is CN202511537059 20251027. The patent publicatio..
Semiconductor
| Sun 31 May 2026
Beijing, June 1 -- Shengjisheng Semiconductor Tech Beijing Co Ltd has submitted a patent application for End Effector Mounting and Fixing Device and Use Method Thereof. Wang Yu developed the invention.
The patent application number is CN202511883159 20251215. The patent publication number is CN121468623 (A). International Pat..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has published Anhui Youpin New Mat Co Ltd patent application for Manufacturing Process of Multi-heat-dissipation Base Structure for MPCVD Diamond Growth. The invention was developed by Wang Gang, You Shu and Miao Jianguo.
The patent application number is CN2025113..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Guangzhou Xinzhi Tech Co Ltd and Guangdong Greater Bay Area Inst Of Integrated Circuit and System have submitted a patent application for Liquid Injection System Applied to Photoresist Pump. This invention was developed by Liang Junming, Li Linfeng, Meng Xianghe, Guo Ang and Wang Jian.
The patent applicatio..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Chengdu Yicheng Integrated Circuit Co Ltd has submitted a patent application for Packaging Structure and Packaging Method of Integrated Passive Device. This invention was developed by Zhang Yongchao, Zhang Kang, Liu Qing and Qiu Yuling.
The patent application number is CN202511609490 20251105. The patent pu..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received Nanjing Hengxinyuan Tech Co Ltd patent application for Airborne Intelligent Control Module Packaging Method Based on Sip Technology. Shi Yuan, Wang Caizheng, Guo Song, Lyu Chengmei and Hu Ting developed the invention.
The patent application number is ..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has released Jiangsu Runpeng Semiconductor Co Ltd patent application for Chip Packaging Equipment. This invention was developed by Li Zhongqiu, Liang Qingqing and Cao Yongdi.
The patent application number is CN202511297405 20250911. The patent publication number i..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Beiyi Semiconductor Tech Guangdong Co Ltd has submitted a patent application for Econodual-form Sic Packaging Structure with Low Parasitic Inductance. Li Mingda developed the invention.
The patent application number is CN202511567752 20251030. The patent publication number is CN121463815 (A). International ..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Liaoning Video Tech Research Co Ltd has submitted a patent application for Special MEMS (micro Electro Mechanical System) Sensor for Heart Sound and Signal Processing Method Thereof. Yang Jie, Li Linxi, Gao Guangxin and Liu Shen developed the invention.
The patent application number is CN202511677883 202511..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Beijing Songguo Brain Machine Tech Co Ltd has submitted a patent application for Flexible Cerebral Cortex Brain-computer Interface Electrode Array Based on Polyimide Substrate and Preparation Process of Flexible Cerebral Cortex Brain-computer Interface Electrode Array. This invention was developed by Qin Min, ..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received Fuji Electric patent application for Longitudinal Device and Semiconductor Module. Sano Shinji developed the invention.
The patent application number is CN20248035631 20241018. The patent publication number is CN121464755 (A). International Patent Class..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Kulicke & Soffa Ind Inc has sought patent for Method of Detecting Cracks in Semiconductor Elements and Related. This invention was developed by Shah Ankur and Qin Wei.
The patent application number is CN20248044520 20240701. The patent publication number is CN121464751 (A). International Patent Classificati..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Unity Semiconductor Corp has filed a patent application for Substrate Size Adapter. This invention was developed by Oh Young S, Durand De Gevigne Marc and Isnard Cedric.
The patent application number is CN20248045186 20240613. The patent publication number is CN121464750 (A). International Patent Classifica..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has released ASML Netherlands patent application for Stage and Tool for Heterogeneous Integration of Variable Size Dies. This invention was developed by Ottens Joost J, De Jager Pieter Willem Herman, Humphries Benjamin, Benschop Johannes Petrus Henricus, Van Zwet Erw..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- SCREEN Holdings has submitted a patent application for Substrate Processing Method, Substrate Processing Apparatus, Semiconductor Device Manufacturing Method, and Semiconductor Manufacturing Apparatus. This invention was developed by Ueda Yusuke, Miyamoto Yasuharu and Yoshida Yukifumi.
The patent application ..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received Sony Semiconductor Solutions Corporation patent application for Image Forming Apparatus. Hayashida Mitsuki, Sakano Yorito and Koshikawa Eiichiro developed the invention.
The patent application number is CN20248045786 20240724. The patent publication n..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has published Semiconductor Energy Laboratory patent application for Semiconductor Device and Method for Manufacturing Semiconductor Device. The invention was developed by Furuya Kazuma, Yakubo Hiroto, Kurata Motomu, Sawai Hiromi and Murakawa Tsutomu.
The patent app..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Sony Semiconductor Solutions Corporation has sought patent for Communication Device and Communication System. This invention was developed by Hyakudai Toshihisa, Yamada Junya, Ohta Tetsushi and Hiraoka Tetsuya.
The patent application number is CN20248044367 20240711. The patent publication number is CN12146..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has released Zhejiang Tc Ceram Electronic Co Ltd and Shaoxing Dehui Semiconductor Mat Co Ltd patent application for Method for Preventing Side Wall from Being Silvered During Silver Melting of Copper-clad Ceramic Substrate. This invention was developed by Huang Shido..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has released SJ Semiconductor patent application for Manufacturing Method of 3D Stack Structure. This invention was developed by Chen Yanheng and Lin Zhengzhong.
The patent application number is CN20241131619 20240729. The patent publication number is CN121463821 ..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received Beijing BOE Optoelectronics Technology and BOE Technology Group patent application for Display Mother Board, Display Substrate and Display Device. Chih-chao Yang, Deng Qi, Zhang Yong, Nie Lingfang, An Yashuai, Bian Ruomei, Guo Zanwu, Liu Yang, Wang Deshe..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received Weihai Singa Electronic Co Ltd patent application for Double-sided Heat Dissipation Power Semiconductor Module with Temperature Detection Function and Manufacturing Method. Zhang Jinping, Liu Kairui, Gan Lian, Liu Yang, Nie Wenting and Nie Lianbo develop..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Jiangsu Shenzhou Semiconductor Technology has submitted a patent application for Uniform-temperature Liquid Cooling Device. This invention was developed by Wang Yaqun, Zhao Jiajia and Yin Qiaoxing.
The patent application number is CN202511702611 20251119. The patent publication number is CN121463811 (A). In..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Youtuo Innovation Tech Shenzhen Co Ltd has applied Chinese patent for Micro-channel Heat Dissipation Structure of Metal Oxide Semiconductor Field Effect Transistor (MOSFET). Yan Yongsheng developed it.
The patent application number is CN202511592135 20251103. The patent publication number is CN121463810 (A)..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Xidian University has sought patent for Semiconductor Device with Ultrathin Bonding Layer Embedded Heat Dissipation Structure and Preparation Method Thereof. This invention was developed by Wu Mei, Wei Jiamin, Li Shiming, Yang Ling, Ma Xiaohua and Hao Yue.
The patent application number is CN202511531851 202..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Semiconductor Manufacturing International (Shanghai) has submitted a patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Wang Weigang, Zhang Haiyang, Yang Jian and Xue Xiaofan.
The patent application number is CN20241140468 20240730. The patent publicat..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- SK Hynix has submitted a patent application for Semiconductor Device and Method of Manufacturing Semiconductor Device. This invention was developed by Kwak No Kyu, Park In-su, Liang Naying, Jang Jung-sik, Choi Seok-min and Choi Won-keun.
The patent application number is CN202411681224 20241122. The patent pub..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has released Samsung Semiconductor China Res and Development Co Ltd and Samsung Electronics patent application for Die Unit and Semiconductor Package Including the Same. This invention was developed by Zhang Peng.
The patent application number is CN202511604046 20..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Nanya Technology has submitted a patent application for Semiconductor Structure and Manufacturing Method Thereof. Shih Shing-yih and Huang Zeyao developed the invention.
The patent application number is CN202411466067 20241021. The patent publication number is CN121463800 (A). International Patent Classific..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received Guangzhou Zengxin Technology patent application for Deep Trench Isolation Structure, Preparation Method Thereof and Semiconductor Device. Hao Zhanyang developed the invention.
The patent application number is CN202511597372 20251103. The patent publicat..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Chongqing Xinlian Microelectronic Co Ltd has filed a patent application for Preparation Method of Semiconductor Device. This invention was developed by Qiao Yanxiu, Qiu Jingyao, Zheng Mingting and Ran Linjie.
The patent application number is CN202511379757 20250925. The patent publication number is CN121463..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Beijing Zhichuang Xinyuan Tech Co Ltd has applied Chinese patent for Turnover Device for Flip Chip Cleaning and Cleaning Method. Wang Chongxin developed it.
The patent application number is CN202511385451 20250926. The patent publication number is CN121463775 (A). International Patent Classification codes a..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Tokyo Electron has filed a patent application for Substrate Processing Method and Substrate Processing System. This invention was developed by Nagamatsu Tatsuya and Morimoto Daiki.
The patent application number is CN20251116606 20250723. The patent publication number is CN121463774 (A). International Patent C..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Wuyuan Semiconductor Tech Qingdao Co Ltd has submitted a patent application for Temporary Bonding Substrate and Manufacturing Method Thereof. This invention was developed by Qiu Lipeng, Guo Shunhua and Cao Xuewen.
The patent application number is CN202511605651 20251105. The patent publication number is CN1..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Tuojing Jianke Haining Semiconductor Equipment has sought patent for Chip Picking and Positioning Method and Device. This invention was developed by Li Xuan, Wang Zhaowei and Zhao Zhuochao.
The patent application number is CN202511648910 20251111. The patent publication number is CN121463771 (A). Internatio..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received ASM International Holding patent application for Apparatus and Method for Rotating Assembly Centering in a Substrate Processing System. Kim Seong-bae and Chun Joseph developed the invention.
The patent application number is CN20251130609 20250725. The p..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Shanghai Jet Plasma Tech Co Ltd has submitted a patent application for Semiconductor Wafer Double-layer Transmission System and Transmission Method. This invention was developed by Liu Qiang, Yang Ping and Hu Haiming.
The patent application number is CN202511538255 20251027. The patent publication number is..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Xi'an Junxin Electronic Technology has submitted a patent application for Small-batch Verification Type Three-temperature IC Chip Sorting Machine. This invention was developed by Song Xiaoli, Zhao Hang, Qiao Zhiyuan, Liu Yi, Ju Xiaolong, Wang Lei, Wang Chao, Chen Ruiqin and Chen Yucheng.
The patent applicatio..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Hangzhou Dunyuan Juxin Semiconductor Tech Co Ltd has sought patent for Rocker Arm Etching Device and Silicon Ring Etching Processing Method. This invention was developed by Fan Mingming, Wang Pengfei and Huo Liyong.
The patent application number is CN202511649688 20251112. The patent publication number is C..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Tuojing Jianke Haining Semiconductor Equipment has sought patent for Measuring Device, Bonding Method and Device and Storage Medium. This invention was developed by Wang Chen.
The patent application number is CN202511648894 20251111. The patent publication number is CN121463754 (A). International Patent Cla..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Shanghai Huali Integrated Circuit Manufacturing has submitted a patent application for Semiconductor Production Line Inline Delivery Energy Prediction Method and Storage Medium. This invention was developed by Li Yuhui and Yu Yinsheng.
The patent application number is CN202511484004 20251016. The patent pub..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has published Guojing Shengtai Qingdao Digital Display Tech Co Ltd patent application for Packaging Equipment for Integrated Circuit Production and Processing and Production Process Thereof. The invention was developed by Liu Kangzhong, Wang Shiyu, Lyu Yong, Cui Caox..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Tokyo Electron has submitted a patent application for Information Processing Method, Substrate Processing System, and Recording Medium. This invention was developed by Funakoshi Wataru, Kuroki Takafumi, Masaki Takayuki, Sakaguchi Kiminari, Eto Hirobumi, Kitada Yasuhiro and Okamura Koji.
The patent application..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has released Kokusai Electric patent application for Substrate Processing Apparatus, Detection Method, Method of Manufacturing Semiconductor Device, and Program Product. This invention was developed by Yoneda Akihiko.
The patent application number is CN202510949421 ..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Beijing NAURA Microelectronics Equipment has applied Chinese patent for Abnormality Detection Method, Semiconductor Detection Equipment and Semiconductor Process Equipment. Lu Lingyun, Chen Yujing and Liu Mengjia developed it.
The patent application number is CN20241161069 20240802. The patent publication num..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received Chongqing Xinlian Microelectronic Co Ltd patent application for Method and System for Cleaning Surface of Silicon Substrate. Liang Huan developed the invention.
The patent application number is CN202511379132 20250925. The patent publication number is..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Shanghai Integrated Circuit Equipment Materials Industry Innovation Center has submitted a patent application for Sigma Groove Etching Process Control Method, System, Equipment and Medium. This invention was developed by Tian Mengzhao, Li Yangbai, Zhang Jie, Li Qiang and Wu Binchen.
The patent application n..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has published Shanghai Bangxin Semiconductor Technology patent application for Semiconductor Structure and Manufacturing Method Thereof. The invention was developed by Xu Yaoguang, Wang Zhaoxiang, Peng Guofa, Fang Wenqiang, Zhu Yadi, Zhang Zhengyi and Pei Kai.
The..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Wuyuan Semiconductor Tech Qingdao Co Ltd has submitted a patent application for Film Deposition Method for Wafer Surface. Che Guoliang, Cao Xuewen and Guo Shunhua developed the invention.
The patent application number is CN202511606413 20251105. The patent publication number is CN121463733 (A). Internationa..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received Micron Technology patent application for Method of Depositing Carbon Conductive Film. Lehn Jean-sebastien M developed the invention.
The patent application number is CN20251147447 20250729. The patent publication number is CN121463732 (A). International..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Origin Quantum Computing Technology Hefei Co Ltd has applied Chinese patent for Substrate Etching Method, Superconducting Circuit Preparation Method and Device. Jia Zhilong developed it.
The patent application number is CN202410991528 20240723. The patent publication number is CN121463725 (A). International..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has published Shenglan Semiconductor Changzhou Co Ltd patent application for Piezoelectric Structure with Flexible Substrate and Preparation Method and Preparation Device Thereof. The invention was developed by Huang Haoyu, Gong Zheng, Li Tianyi, Song Qingyang, Huang..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Fuzhou University has sought patent for Polycrystal N-type Lead Selenide Thermoelectric Material and Preparation Method and Application Thereof. This invention was developed by Luo Zhongzhen, Zhou Jing, Zheng Yunpeng, Xiao Jie, Cui Honghua and Zou Zhigang.
The patent application number is CN202511592398 20251..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received Zhejiang Solar Energy Technology, Guangdong Aiko Solar Energy Technology Co Ltd, Tianjin Aiko Solar Energy Technology, Zhuhai Fushan Aixu Solar Energy Technology and Shandong Aiko Solar Energy Tech Co Ltd patent application for Preparation Method of Pero..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Southeast University has submitted a patent application for Intrinsic Stretchable Phototransistor Based on Semiconductor Film and Preparation Method Thereof. This invention was developed by Kan Eiji, Li Na, Zhao Yudong and Qiao Jing.
The patent application number is CN202511613920 20251106. The patent publica..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has published Chengdu Jingxin Mingneng Photovoltaic Tech Co Ltd patent application for Perovskite Layer and Preparation Method Thereof, Solar Cell and Photovoltaic Module. The invention was developed by Li Haohui, Yang Tian and Gan Yu.
The patent application numbe..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received Peking Univ Chongqing Carbon Based Integrated Circuit Research Institute patent application for Preparation Method of Semiconductor Structure. Wang Chengbo, Xiong Zhili, Wang Chunlin, Wang Xing and Zhang Jing developed the invention.
The patent applic..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has published Japan Display patent application for Mother Substrate and Method for Manufacturing Mother Substrate. The invention was developed by Okubo Masakazu and Imai Nobuo.
The patent application number is CN202510994258 20250718. The patent publication number i..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has released BOE Technology Group and Beijing BOE Technology Development patent application for Light-emitting Substrate and Light-emitting Device. This invention was developed by Zhu Youqin.
The patent application number is CN20241147984 20240731. The patent publ..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received BOE Technology Group patent application for Array Substrate and Display Device. Zhou Tianmin, Tong Binbin, Wang Lizhong, Yang Wei, Liang Pengxia and Yang Kun developed the invention.
The patent application number is CN20241144794 20240731. The patent pu..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has released Jiujiang Roushuo Photoelectric Tech Co Ltd patent application for Flexible Perovskite Solar Cell and Preparation Method Thereof. This invention was developed by Chen Yiwang, Meng Xiangchuan, Hu Xiaotian and Sheng Wangping.
The patent application numbe..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Samsung Display has sought patent for Light-emitting Element Transfer Apparatus and Method of Transferring Light-emitting Element. This invention was developed by Han Jeong-won.
The patent application number is CN20251139524 20250728. The patent publication number is CN121463616 (A). International Patent Cl..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- LG Display has filed a patent application for Pick-up Control Method and Transfer Device for Light-emitting Element Chip. This invention was developed by Yoon Se-jun.
The patent application number is CN202510891139 20250630. The patent publication number is CN121463615 (A). International Patent Classification..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- BOE Huacan Optoelectronics Suzhou has submitted a patent application for Light Emitting Diode and Light Emitting Diode Preparation Method. Xing Zhenyuan, Zheng Yongsheng, Wang Jiayu, Ma Chao, Fan Wenchao and Jiang Jian developed the invention.
The patent application number is CN202511274020 20250908. The pate..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Huazhong University of Science and Technology has sought patent for Flexible Photoelectric Detector Based on Teseox Amorphous-crystal Hybrid Semiconductor and Preparation Method. This invention was developed by Zeng Yuhui and Dai Jiangnan.
The patent application number is CN202511583099 20251031. The patent p..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- SJ Semiconductor has submitted a patent application for Photoelectric Integrated Semiconductor Packaging Structure and Preparation Method Thereof. This invention was developed by Chen Yanheng and Lin Zhengzhong.
The patent application number is CN20241125833 20240729. The patent publication number is CN121463..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Hefei Nexchip Integrated Circuit has filed a patent application for Preparation Method of Semiconductor Device. This invention was developed by Diao Qinchao and Cheng Zhi.
The patent application number is CN20251222079 20251230. The patent publication number is CN121463550 (A). International Patent Classifica..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Texas Instruments has applied Chinese patent for Thermal Shutter for Electrostatic Discharge Clamp and Method of Manufacturing the Same. Mou Xuehao and Sankaralingam Raghu developed it.
The patent application number is CN202510994764 20250718. The patent publication number is CN121463531 (A). International ..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Guangzhou China Star Optoelectronics Semiconductor Display Technology has filed a patent application for Display Panel and Preparation Method Thereof. This invention was developed by Tang Jia.
The patent application number is CN202511680255 20251114. The patent publication number is CN121463527 (A). Interna..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has published Infineon Technologies, Austria patent application for Power Semiconductor Device. The invention was developed by Anton Mauder and Miaton Daniele.
The patent application number is CN20251154792 20250730. The patent publication number is CN121463521 (A)...
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has released Shanghai Integrated Circuit Equipment Materials Industry Innovation Center patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Zhang Sheng, Liu Huixiong, Xu Sunkai, Xia Siyu and Chen Wujia.
The pa..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has released Wuhan Xinxin Semiconductor patent application for Manufacturing Method of Semiconductor Device and Semiconductor Device. This invention was developed by Zhang Le, Wang Wei and Xue Guangjie.
The patent application number is CN202511325165 20250916. The p..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has released Wuhan Xinxin Semiconductor patent application for Manufacturing Method of Semiconductor Device and Semiconductor Device. This invention was developed by Zhang Le, Wang Wei and He Weijun.
The patent application number is CN202511325114 20250916. The pate..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has released Taiwan Semiconductor Manufacturing patent application for Semiconductor Device and Forming Method Thereof. This invention was developed by Wei Zhengyu, Lin Zhengyi, Chen Shuhan, Wu Junyi and Xu Zhi'an.
The patent application number is CN202510563739 202..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Tianjin Jinhang Institute Computing Technology has submitted a patent application for Minimum System Packaging Structure of Processor. Zhang Nan, Liu Jianfeng, Xu Yixuan, Fu Yue and Qiu Haoxuan developed the invention.
The patent application number is CN202511611983 20251105. The patent publication number i..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Texas Instruments has submitted a patent application for Nitrogen-containing Gate Oxide Layer for Semiconductor Devices. Nandakumar Madhumitha, Curtis Ian, Mishra Divya and West Peter developed the invention.
The patent application number is CN202510902501 20250701. The patent publication number is CN121463..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received Beijing Yandong Microelectronic Technology patent application for High-voltage MOS Device and Integrated Circuit. Yu Jiangyong, Dai Jia, Li Mengyao, Li Yawei, Liu Yuanyuan, Zheng Liang and Li Xuemin developed the invention.
The patent application number..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received University of Electronic Science and Technology of China patent application for Power Device Terminal Structure. Ren Min, Luo Yuchu, Nie Nan, Tao Ye, Liu Siwei, Li Zehong and Zhang Bo developed the invention.
The patent application number is CN2025113..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- STMicroelectronics International has sought patent for Electronic Device with Improved Reliability. This invention was developed by Bellocchi Giovanni, Simone Rascuna and Puglisi Vittorio.
The patent application number is CN20251145107 20250729. The patent publication number is CN121463498 (A). International ..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received Shanghai Huahong Grace Semiconductor Manufacturing Corporation patent application for Self-aligned Isolation Method. Zhang Zhenxing developed the invention.
The patent application number is CN202511511909 20251022. The patent publication number is CN1..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Shanghai Wayon Semiconductor has filed a patent application for High-softness Factor Fast-recovery Vdmos Device and Preparation Method Thereof. This invention was developed by Wang Shasha, Liu Wenjiao, Zhang Lei, Liu Heng and Shen Haibo.
The patent application number is CN202511391909 20250926. The patent p..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received Zhuzhou CRRC Times Semiconductor patent application for Semiconductor Device Structure and Preparation Method Thereof. Lan Zhong, Song Guan, Liu Chen, Wang Yafei, Yao Yao, Li Chengzhan, Xiao Qiang and Luo Haihui developed the invention.
The patent app..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has published Hangzhou Fuxin Semiconductor patent application for Trench Gate Device and Preparation Method Thereof. The invention was developed by Shi Yule and Tian Binwei.
The patent application number is CN202511576834 20251030. The patent publication number is..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has published Shanghai Huahong Grace Semiconductor Manufacturing Corporation patent application for Method for Inhibiting Hysteresis Effect of Trench Metal Oxide Semiconductor Field Effect Transistor. The invention was developed by Liu Jingwang, Gao Bin, Li Liang, Xi..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Shanghai Jita Semiconductor has applied Chinese patent for Semiconductor Structure and Forming Method Thereof. Liu Cong, Chu Yudong, Tang Ning and Wang Zhen developed it.
The patent application number is CN202511404896 20250928. The patent publication number is CN121463479 (A). International Patent Classifi..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has received Henan Normal University patent application for Novel Common-drain Double-mosfet Device and Preparation Method Thereof. Zhang Linqing, Yue Qinghua, Xi Han, Liu Jiajia, Tian Yating and Xu Ruiya developed the invention.
The patent application number is C..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Semiconductor Device and Forming Method Thereof. This invention was developed by Chen Pin-wen, Li Zhijie, Xu Hongzhang, Lin Weirong, Wu Peiwen, Chang Pei-shan, Zhu Liwei, Li Peixuan, Ji Zhijian, Lu Weiye, Huang Junxian, Zhang Zhiwei and ..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has released Semiconductor Manufacturing International (Shanghai) patent application for Semiconductor Device, Forming Method Thereof and Chip. This invention was developed by Wang Zhidong and Zhang Haiyang.
The patent application number is CN20241137964 20240730. T..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Micron Technology has submitted a patent application for Construction Method of Cross-point Memory Structure. This invention was developed by Venegara Reddy, Tolum Mehmet and Jounton Isabelle.
The patent application number is CN20251156608 20250730. The patent publication number is CN121463460 (A). Internatio..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Micron Technology has submitted a patent application for Board Wiring Architecture of Multi-level Memory. This invention was developed by Salimath Vinay, Kitagawa Makoto and Fisher Matthew.
The patent application number is CN20251155095 20250730. The patent publication number is CN121463457 (A). International..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has published SK Hynix patent application for Semiconductor Device and Method for Manufacturing Semiconductor Device. The invention was developed by Yoo Hyun Seung, Kwon Eun Mee and Choi Eun-seok.
The patent application number is CN202510182960 20250219. The patent ..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Semiconductor Manufacturing International (Shanghai) has filed a patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Kim Kil-song.
The patent application number is CN20241154961 20240801. The patent publication number is CN121463452 (A). International P..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has released Wuhan Xinxin Semiconductor patent application for Storage Unit and Storage Device. This invention was developed by Gong Fengcong and Cao Kaiwei.
The patent application number is CN202511543546 20230816. The patent publication number is CN121463444 (A)..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Fujian Jinhua Integrated Circuit has filed a patent application for Semiconductor Structure. This invention was developed by Fang Xiaopei, Lin Gangyi and Wang Congcong.
The patent application number is CN202511634914 20220217. The patent publication number is CN121463439 (A). International Patent Classifica..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- Micron Technology has filed a patent application for Multi-step Etch in Memory Architecture. This invention was developed by Hill Richard J, Heinecke Lars P and Fukuzumi Yoshiaki.
The patent application number is CN20251133046 20250725. The patent publication number is CN121463435 (A). International Patent Cl..
Semiconductor
| Mon 01 Jun 2026
Beijing, June 1 -- State Intellectual Property Office of China has released Samsung Electronics patent application for Semiconductor Memory Device. This invention was developed by Ahn Sang Bin and Kim Ji-young.
The patent application number is CN202510428751 20250408. The patent publication number is CN121463434 (A). Internatio..
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