Semiconductor
| Wed 19 Aug 2026
Geneva, Aug. 19 -- Applied Materials has submitted a patent application for Methods for Seam-free Gap Fill. This invention was developed by Devereaux Zachary J, Knisley Thomas, Garg Sourav, Yan Haoming, Devrajan Janardhan, Bhuyan Bhaskar Jyoti, Lin Yongjing, Li Lu, Liu Zhihui, How Gary, Kalutarage Lakmal C, Enman Lisa J, Sha Hao..