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Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Suzhou Yancai Micro Nano Tech Co Ltd, Xi'an Boyan Weina Information Tech Co Ltd and Suzhou Memstools Semiconductor Tech Co Ltd have submitted a patent application for Metal-based Composite Photoresist and Application Thereof in Preparation of Patterned Metal Layer of Wafer and Wafer Bonding. This invention wa..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Guangdong Yuehao Electronic Equipment Co Ltd and Anhui Yuehao Electronic Equipment have submitted a patent application for Vacuum Overturning Chamber for Overturning Substrate to be Coated. This invention was developed by Yu Feng, He Yuwei, Huang Junkai and Zheng Bohong.
The patent application number is CN..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Chengde Iron & Steel Group Co Ltd, Chengde Branch Co Hbis Co Limited and Chengde Chenggang Vanadium Titanium Cold Rolling Sheet Co Ltd have sought patent for Production Method of Spangle-free Galvanized Sheet with Ultra-thin Substrate and Ultra-thick Zinc Layer. This invention was developed by Hua Zhenyu, Liu..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Shenzhen Anrui Biotechnology Co Ltd and Anrui Biotechnology Co Ltd have submitted a patent application for Functionalized Modified Nanoneedle Chip and Preparation Method and Application Thereof. This invention was developed by Zhai Xiaocheng and Zhang Wen.
The patent application number is CN202511702355 20..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Shanxi Zhonglai Solar Energy Battery Tech Co Ltd and Taizhou Zhong Lai Photoelectric Technology have applied Chinese patent for Silicon Quantum Dot with Core-shell Structure as Well as Preparation Method and Application of Silicon Quantum Dot. Zhang Geng, Guo Fei, Li Feng, Xu Zhuo, Yang Weiguang and Lin Jianw..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Guangdong Aiko Solar Energy Technology Co Ltd, Zhejiang Aiko Solar Energy Technology, Shandong Aiko Solar Energy Tech Co Ltd, Zhuhai Fushan Aixu Solar Energy Technology and Tianjin Aiko Solar Energy Technology have submitted a patent application for Solar Cell Module and Solar Cell System. Sun Qinkang, Yang X..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Zhejiang Uivoled Photoelectric Tech Co Ltd and Anhui Huaxian New Material Tech Co Ltd have filed a patent application for Electron Injection Material and OLED (organic Light Emitting Diode). This invention was developed by Zhang Lei, Zhang Huaxing, Wu Kongwu, Zhao Xiaoyu and Kong Xiangzhen.
The patent appl..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Suzhou Future Membrane Technology Innovation Center Of Nanjing University Of Technology and Njut Membrane Applied Technology Research Institute Co Ltd have sought patent for Preparation Method of Carbon Quantum Dot Modified Low-temperature Sintered Silicon Carbide Film. This invention was developed by Zhang H..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Zhongshan Bodun Optoelectronics Tech Co Ltd and Foshan Bodun Optoelectronics Tech Co Ltd have submitted a patent application for Method and Equipment for Preparing Sub-arc-second Gradient Substrate Through Ion Beam Etching. This invention was developed by Huang Yuxiang, Ji Ming, Liu Weiji and Yi Hongbo.
Th..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Northeast Electric Power University and Huaneng Jilin Power Generation Co Ltd have sought patent for High-efficiency Preparation Method of Nano Silicon Dioxide Based on Biomass Power Plant Ash. This invention was developed by Zhou Tao, Meng Xin, Jiang Liangang, Li Quanjie, Li Gang, Meng Yiqun, Bai Jingru and ..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Shenzhen Beice Testing Tech Co Ltd and East China Normal University have submitted a patent application for Self-repairing Chip and Preparation Method Thereof. This invention was developed by Cheng Yan, Liu Ying, Zhou Xinguang and Zhou Yehua.
The patent application number is CN202511829593 20251205. The pa..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Liding Semiconductor Tech Shenzhen Co Ltd and Liding Semiconductor Tech Qinhuangdao Co Ltd have filed a patent application for Packaging Substrate and Manufacturing Method Thereof. This invention was developed by Wang Tao and Wu Peicheng.
The patent application number is CN202411267043 20240910. The patent..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Ningde Contemporary Amperex Technology and Ningde Contemporary Future Energy Shanghai Research Institute Co Ltd have submitted a patent application for Chip Packaging Assembly, Electronic Equipment and Preparation Method of Chip Packaging Assembly. This invention was developed by Wang Xueying, Zou Zhu, Wang Y..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- CSMC Technologies and Southeast University have submitted a patent application for Laterally Diffused Metal Oxide Semiconductor Device and Preparation Method Thereof. This invention was developed by Song Liang, Zhang Long, Ma Jie, Li Yongshun, Zhang Sen, Wang Dejin and Sun Weifeng.
The patent application n..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Xidian University and Guangzhou Research Institute Of Xidian University have submitted a patent application for Multi-state Memory Device Based on Negative Differential Resistance and Negative Photoconductive Effect, Preparation Method and Application. Zhao Yutian, Chang Jingjing, Su Jie, Ni Congqin, Lin Zhen..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Zhengpai Tech Ningbo Co Ltd and PN Junction Semiconductor, Zhejiang have submitted a patent application for Method for Manufacturing Silicon Carbide Device Through Blue Film and Laser Technology. This invention was developed by Huang Xing.
The patent application number is CN202511697289 20251119. The paten..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Kunyuan Jingke Semiconductor Deyang Co Ltd and Coreway Optech have applied Chinese patent for Manufacturing Method of Low-cost Semiconductor Cooler. Sun Shigang, Xu Jian and Wang Yu developed it.
The patent application number is CN202610187326 20260210. The patent publication number is CN121692983 (A). Int..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Zhejiang Dasheng New Energy Technology, Nantong Zhequan Intelligent Tech Co Ltd and Zhejiang Yige Xilong Intelligent Mfg Co Ltd have filed a patent application for Thin Film Preparation System and Preparation Method, Perovskite Solar Cell and Laminated Solar Cell. This invention was developed by Liu Chen, Xu ..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Chengdu BOE Optoelectronics Technology and BOE Technology Group have submitted a patent application for Display Substrate and Display Device. This invention was developed by Wang Benlian, Du Lili, Cao Xilei and Zhang Zhenhua.
The patent application number is CN202610187139 20220318. The patent publication ..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Hefei Xinsheng Optoelectronic Technology Co Ltd and BOE Technology Group have filed a patent application for Display Substrate and Display Device. This invention was developed by Yuan Zhidong, Zhang Dacheng, Yuan Can, Zhang Xiangze, Liu Xiuting and Ding Luke.
The patent application number is CN202511958536..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Huaneng Clean Energy Research Institute and Huaneng Lancangjiang Changdu New Energy Co Ltd have submitted a patent application for Anti-ultraviolet Coating, Preparation Method Thereof and Anti-ultraviolet Perovskite Solar Cell. This invention was developed by Ran Longming, Shi Congbo, Lin Zizhen, Jia Cheng, Q..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Jiangxi MTC Semiconductor and Jiangxi Zhaochi Integration Tech Co Ltd have sought patent for Flip Led Chip and Preparation Method Thereof. This invention was developed by Li Wentao, Jin Conglong, Hu Jiahui, Ao Yingquan and Zhang Cunlei.
The patent application number is CN202610194833 20260211. The patent p..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Guangdong Aiko Solar Energy Technology Co Ltd, Zhejiang Aiko Solar Energy Technology, Shandong Aiko Solar Energy Tech Co Ltd, Zhuhai Fushan Aixu Solar Energy Technology and Tianjin Aiko Solar Energy Technology have applied Chinese patent for Solar Cell Contact Structure, Preparation Method Thereof and Solar C..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Huazhong University of Science and Technology and Hubei Jiufengshan Laboratory have sought patent for Hierarchical Silicon Nanowire Metasurface, Manufacturing Method Thereof and Silicon-based Photoelectric Detector. This invention was developed by Song Boxiang, Ke Shitao, Zhou Yilong, Hu Hao and Tang Jiang.
..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Yangzhou Carbon Zhonghe Technology Innovation Research Center Of Yangzhou University and Yangzhou University have submitted a patent application for Substrate Stripping and Regenerating Method of Gallium Arsenide Thin Film Battery. This invention was developed by Wen Xiangli, Jiang Yaoyao, Ding Jianning, Dong..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Semiconductor Manufacturing International (Shanghai) and Semiconductor Mfg North Integrated Circuit Mfg Beijing Co Ltd have filed a patent application for Chip and Structure Thereof, Wafer and Structure Thereof, Array Chip and Array Wafer. This invention was developed by Liu Jinhua, Tao Dongyan and Zhang Shao..
Semiconductor
| Wed 24 Jun 2026
Beijing, June 25 -- Shanghai Institute Of Microsystem And Information Technology Chinese Academy Of Sciences and Shanghai Qianzhan Innovation Research Institute Co Ltd have filed a patent application for Electrophysiological Signal Detection Chip Based on 3D Electrode and Preparation and Detection Method Thereof. This invention ..
Semiconductor
| Wed 24 Jun 2026
Beijing, June 25 -- Xi'an ESWIN Silicon Wafer Technology and Xi'an ESWIN Material Technology have applied Chinese patent for Wafer Detection Equipment and Wafer Detection Method. Liu Yuqian, Xue Botao, Chen Guanglin and Huang Zhaohao developed it.
The patent application number is CN202511904874 20251217. The patent publicatio..
Semiconductor
| Wed 24 Jun 2026
Beijing, June 25 -- Jiangxi MTC Semiconductor and Jiangxi Zhaochi Integration Tech Co Ltd have submitted a patent application for Led Chip Coordinate Bin Value Endowing Method and System. This invention was developed by Fu Zuyao, Wen Guosheng, Jin Conglong, Ding Changbing, Ao Yingquan, Zhao Xiaoming and Dong Guoqing.
The pate..
Semiconductor
| Wed 24 Jun 2026
Beijing, June 25 -- China Energy Engineering Group Tianjin Electric Power Construction and Hebei Zhuozhou Jingyuan Thermal Electricity Co Ltd have sought patent for Coupler Alignment Intelligent Auxiliary System Based on Dual-laser Displacement and MEMS Gyroscope. This invention was developed by Dai Yong, Wu Bin, Fan Youtian, Li..
Semiconductor
| Wed 24 Jun 2026
Beijing, June 25 -- Nanjing University of Science & Technology and Nanjing Interfero Photoelectric Tech Co Ltd have submitted a patent application for Partial Coherent Light Source and Wafer Morphology Anti-vibration Interference Measurement Method. This invention was developed by Zhu Rihong, Zhang Qing, Bai Tian, Han Zhigang, H..
Semiconductor
| Wed 24 Jun 2026
Beijing, June 25 -- Shanghai ESWIN Computing Tech Co Ltd and Beijing ESWIN Computing Technology have submitted a patent application for Touch Controller and Control Method Thereof, Chip and Display Device. This invention was developed by Syed Hamad.
The patent application number is CN202511851624 20251209. The patent publicat..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Nat Ct Advanced Packaging Co Ltd Ncap China has filed a patent application for Chip Packaging Structure and Preparation Method. This invention was developed by Dai Fengwei, Liu Fengman and Wang Huanhuan.
The patent application number is CN202511902350 20251216. The patent publication number is CN121693235 ..
Semiconductor
| Wed 24 Jun 2026
Beijing, June 25 -- Jiangsu Mingxin Advanced Tech Co Ltd has submitted a patent application for Testing Method of Qfn Packaging Millimeter Wave Radar. This invention was developed by Qin Junfeng, Liu Zhonghan, Wang Qingxi and Sun Zhengqiao.
The patent application number is CN202511934556 20251220. The patent publication numbe..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has published Dingzhou Tech Co Ltd patent application for Wafer Box and Supporting Frame Thereof. The invention was developed by Chen Yanfang.
The patent application number is CN202411404777 20241010. The patent publication number is CN121693061 (A). Internationa..
Semiconductor
| Wed 24 Jun 2026
Beijing, June 25 -- Weile Tech Hunan Co Ltd has sought patent for Portable Heat-preservation Multipurpose Integrated Box and System. This invention was developed by Mao Weike, Yang Mingze, Lin Rong, Yang Zhiwei, Yan Yunlong and Xu Duo.
The patent application number is CN20261059269 20260116. The patent publication number is C..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Hubei Gaochuang Prec Manufacturing Co Ltd has filed a patent application for Semiconductor Heat Dissipation Packaging Device Based on High Thermal Conductivity Composite Material. This invention was developed by Chen Liang, Shi Song and Liu Keqiang.
The patent application number is CN202511738521 20251125...
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Beijing Ziyixin Integrated Circuit Co Ltd has submitted a patent application for Double-sided Cooling Packaging Structure and Forming Method. This invention was developed by Chen Kunneng and Zhou Meng.
The patent application number is CN202511905115 20251217. The patent publication number is CN121693146 (A..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Jiangsu Pangu Semiconductor Tech Co Ltd has applied Chinese patent for High-heat-dissipation Plate-level Packaging Structure and Manufacturing Method Thereof. Wang Hao, Wang Jiao and Ma Shuying developed it.
The patent application number is CN202511957567 20251223. The patent publication number is CN121693..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Suzhou Yimaixi Semiconductor Tech Co Ltd has applied Chinese patent for Manufacturing Method of Packaging Carrier Plate with High Flatness and Packaging Carrier Plate Thereof. Ji Aimin and Huan Xun developed it.
The patent application number is CN202511854088 20251210. The patent publication number is CN12..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has released Dongguan Ruixin Instr Co Ltd patent application for Semiconductor Packaging Structure, Device and Manufacturing Method. This invention was developed by Chen Feng.
The patent application number is CN202511703783 20251119. The patent publication number..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Beijing Guolian Wanzhong Semiconductor Tech Co Ltd has applied Chinese patent for Hemt Transistor Packaging Method and Hemt Transistor. Wang Chuanbao, Su Rili, Bi Shengying, Liao Longzhong, Liu Yuqing, Liu Xiangwu, Li Hui and Liu Jiajia developed it.
The patent application number is CN202610170778 20260206..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Shenzhen Samcien Semiconductor Mat Co Ltd has submitted a patent application for Interface Tackifier as Well as Preparation Method and Application Thereof. This invention was developed by Liang Disi, Zeng Riqing, Huang Mingqi and Deng Jinquan.
The patent application number is CN202511905796 20251217. The p..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has received Anhui Jingwei Tech Co Ltd patent application for Wafer Scribing Method. Liu Ying developed the invention.
The patent application number is CN202511573243 20251030. The patent publication number is CN121670836 (A). International Patent Classification ..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Shengjisheng Semiconductor Tech Beijing Co Ltd has filed a patent application for Rotary Air Inlet Device for Rapid Heat Treatment Equipment and Use Method of Rotary Air Inlet Device. This invention was developed by Yu Xiaojie and Li Jingshu.
The patent application number is CN202511697919 20251119. The pa..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Mattson Technology and Beijing E Town Semiconductor Technology have filed a patent application for Control System for Adaptive Control of Heat Treatment System. This invention was developed by Liebler Mark, Siebel Justin and Yang Michael X.
The patent application number is CN202511958960 20201029. The pate..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Suzhou Brightek Optoelectronic Co Ltd has sought patent for Led Automatic Braiding Equipment. This invention was developed by Sun Jian, Duan Lian, Shen Honghui and Xu Ping.
The patent application number is CN20261097754 20260124. The patent publication number is CN121671958 (A). International Patent Classi..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Jiangsu Dongyao Machinery Tech Co Ltd has applied Chinese patent for Multi-stage Filtering Water Tank for Chip Removal Machine. Li Huibo developed it.
The patent application number is CN202511834045 20251208. The patent publication number is CN121672672 (A). International Patent Classification codes are C0..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Hebei Hymax Optoelectronic Inc has submitted a patent application for Automatic Production Equipment and Method for COB (chip on Board) Light Receiving and Transmitting Integrated Module. This invention was developed by Li Haiguang, Zhang Zhenxing and Hu Xiaowei.
The patent application number is CN20251190..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has published Guangdong Youpulai Diamond Tech Co Ltd and Shenzhen Unipla Plasma Tech Co Ltd patent application for Transition-treated Single Crystal Diamond Secondary Growth Method and System, MPCVD Equipment and Medium. The invention was developed by Quan Feng, Gu ..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Laplace Wuxi Semiconductor Technology has sought patent for Transfer Device and Sheet Processing System. This invention was developed by Yu Shuaishuai, Liu Lu, Wang Ying and Xu Feng.
The patent application number is CN202411280288 20240912. The patent publication number is CN121672159 (A). International Pa..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has received Shengjisheng Ningbo Semiconductor Technology patent application for Locking Assembly for Gas Distribution Device and Use Method of Locking Assembly. Jeong Young-ki, Kim Soo-heon, Park Hae Yoon and Li Sifu developed the invention.
The patent applicati..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has received Hunan Sanan Semiconductor patent application for Crucible, Crystal Growing Apparatus, and Crystal Growing Method. Qin Haoran developed the invention.
The patent application number is CN202411262365 20240909. The patent publication number is CN1216750..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Shanghai Cheyitian Technology has sought patent for Semiconductor Process Parameter Adjusting Method, System and Device and Storage Medium. This invention was developed by Liu Xinyang and Zhang Liming.
The patent application number is CN202610172195 20260206. The patent publication number is CN121675075 (A..
Semiconductor
| Wed 24 Jun 2026
Beijing, June 25 -- Toshiba Memory has filed a patent application for Memory System and Control Method. This invention was developed by Takeda Nahomi and Shirakawa Masanobu.
The patent application number is CN202510261342 20250306. The patent publication number is CN121680714 (A). International Patent Classification code is G..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Advanced Micro-Fabrication Equipmen has submitted a patent application for Control System, Control Device and Semiconductor Equipment. This invention was developed by Lu Ming, Xu Zhipeng and Wang Xiao.
The patent application number is CN202411297518 20240914. The patent publication number is CN121680031 (A)...
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has received Beijing Institute of Radio Metrology and Measurement patent application for Packaging Method for Chip Atomic Clock Physical System. Li Shiguang, Liu Yaxuan, Hou Xin, Wang Liang and Cho Jung developed the invention.
The patent application number is CN20..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- SCREEN Holdings has submitted a patent application for Substrate Processing Apparatus and Substrate Processing Method. This invention was developed by Ikeda Fumihiko.
The patent application number is CN202511302045 20250912. The patent publication number is CN121680003 (A). International Patent Classificatio..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- No. 24 Research Institute Of Cetc has sought patent for Method for Eliminating Unexpected Printing Pattern of Chip Protection Ring. This invention was developed by Yang Dexin, Li Xingyue, Song Zhongkang, Zhang Guangsheng and Zhu Kunfeng.
The patent application number is CN202511844282 20251209. The patent ..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has received Dongfang Jingyuan Microelectronics Tech Shanghai Co Ltd patent application for Opc Processing Method for Integrated Circuit Layout and Computer Equipment. Zhang Ye, Wang Jianming and Zhu Penghui developed the invention.
The patent application number ..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Tokyo Electron has applied Chinese patent for Substrate Processing Method and Substrate Processing Apparatus. Yazaki Kohei, Yoshida Keisuke, Shimura Satoru, Dobashi Kazuya and Doandorfer Andreas A J developed it.
The patent application number is CN202511265390 20250905. The patent publication number is CN121..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- TCL China Star Optoelectronics Technology has submitted a patent application for Array Substrate and Display Panel. This invention was developed by Liu Jing, He Binbin, Jiang Shaowei and Chen Saiping.
The patent application number is CN20261077410 20260120. The patent publication number is CN121679955 (A). I..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- HKC has applied Chinese patent for Array Substrate and Display Panel. Li Jiewei and Hu Yang developed it.
The patent application number is CN202511587579 20251031. The patent publication number is CN121679954 (A). International Patent Classification codes are G02F1/1343, G02F1/1362, H10D86/40 and H10D86/60. ..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has published Shanghai Institute Of Microsystem And Information Technology Chinese Academy Of Sciences patent application for Mach-zehnder Modulator Based on Silicon Carbide Substrate and Preparation Method Thereof. The invention was developed by Wang Xuqiang, Wang ..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has received Hoya Lens Thailand patent application for Spectacle Lens. Kono Shigetoshi and Ishizaki Takako developed the invention.
The patent application number is CN202511911817 20201225. The patent publication number is CN121679925 (A). International Patent Clas..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Hangzhou Mdk Opto Electronics Co Ltd has submitted a patent application for Substrate Surface Coating Film System Structure. Wang Gang, Zhou Yang, Zhou Xiaoqi, Song Xiaolong, Ding Yuneng and Weng Qinsheng developed the invention.
The patent application number is CN202511859554 20251210. The patent publicat..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has published Huazhi Biotechnology, Henan Sericulture Science Institute and Welcome to Northwest A&F University patent application for Silkworm SNP (single Nucleotide Polymorphism) Molecular Marker Combination, Chip and Application Thereof. The invention was develop..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Xinguang Bio Tech Shenzhen Co Ltd has submitted a patent application for Novel Black Light Photoelectric Tweezer Chip Structure and Manufacturing Method Thereof. This invention was developed by Wang Zeyong.
The patent application number is CN202511888331 20251215. The patent publication number is CN1216742..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Central South University has filed a patent application for Optical Flow Control Bacterium Rapid Detection Chip Based on Catalase Activity and Detection Method Thereof. This invention was developed by Li Zhenghao and Xiong Sha.
The patent application number is CN202511968850 20251224. The patent publication ..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has released China Building Mat Test & Certification Group Xiamen Hongye Co Ltd patent application for Water-based Emulsion Type Organic Silicon Release Agent and Preparation Method Thereof. This invention was developed by Xie Shuangxi, Lin Jun, Wu Yusheng, Wang She..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has received Jinghua Tech Co Ltd patent application for Composite Sheet for Forming Protective Film and Method for Manufacturing Semiconductor Wafer with Protective Film. Chen Denggui, Liu Yanquan, Lin Yueting, Liu Yuquan, Zheng Yijie and Wang Pinsheng developed the..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Nanjing Institute Technology has submitted a patent application for Modified Sio2-based Silicon Wafer Chemical Mechanical Polishing Agent as Well as Preparation Method and Application Thereof. Tao Yongqiang, Zhu Chengjia, Zhang Lulu, He Xiancong, Yao Hanyu, Cai Jia and Fan Xiaoli developed the invention.
T..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Shanghai Institute Of Microsystem And Information Technology Chinese Academy Of Sciences has sought patent for Chemical Mechanical Polishing Solution for Surface Treatment of Silicon Carbide. This invention was developed by Li Yedi, Huang Qi, Yu Wenjie and Zhu Lei.
The patent application number is CN202511..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has received Foshan Spring Tech Co Ltd patent application for Preparation Method of Durable Wear-resistant Super-amphiphobic Coating for Metal Substrate Surface. Ho Soo Yei and Liang Chen developed the invention.
The patent application number is CN202511739515 20..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has received Dongguan Jiutian Quantum Tech Co Ltd patent application for Yellowing-resistant Light-cured Organic Silicon Resin and Preparation Method Thereof. Weng Zhuqiang and Zheng Zhen developed the invention.
The patent application number is CN20261006403 202..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has released Shenzhen Institute Of Advanced Electronic Materials patent application for Epoxy Resin Composition and Packaging Chip. This invention was developed by Fu Kexin, Zhu Pengli, Zhang Leicong, Wei Chunxiang, Luo Yanjie, Wan Yanjun, Liu Mingqiang and Sun Rong..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Jiangxi Xinjiayi New Mat Co Ltd has applied Chinese patent for Cationic Organic Silicon as Well as Preparation Method and Application Thereof. Tan Jinglin, Li Jiangqun and Qian Liang developed it.
The patent application number is CN202511915060 20251218. The patent publication number is CN121673570 (A). In..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Shenzhen Changrun Hardware Co Ltd has submitted a patent application for Hardware Electroplating Tail Liquid Treatment Device and Method. This invention was developed by Tang Tao, Liao Minyue, Zhang Ting and Zhou Meng.
The patent application number is CN202511738919 20251125. The patent publication number ..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has released Shanghai Shiyu Precision Equipment patent application for Automatic Focusing System and Method and Chip Inspection Machine. This invention was developed by Zhao Kai, Wan Zhongyu, Liang Meng, Lin Haitao, Lyu Zhongxun and Lu Sheng.
The patent application..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has released Shenzhen Huanguang Shidai Tech Co Ltd patent application for Silicon Optical Chip Packaging Structure and Silicon Optical Chip Packaging Method. This invention was developed by Zheng Zibo, Liang Bo and Chen Jialing.
The patent application number is C..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Jiangsu Dilong Heavy Machinery Co Ltd has submitted a patent application for Novel Horizontal Directional Drilling Machine for Closed Slurry Returning and Chip Removal. This invention was developed by Jiang Zhiguang.
The patent application number is CN202610114006 20260128. The patent publication number is..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Shaanxi Indium Semiconductor Co Ltd has submitted a patent application for Method and Device for Horizontally Synthesizing Large-size High-purity Indium Phosphide Polycrystalline Semiconductor Material. This invention was developed by Chen Long, Liu Zhiyong, Liu Yangfeng, Huang Xiaohua, Ning Xiaowei and Yang ..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has received Zhejiang Lishui Zhongxin Jingyuan Semiconductor Tech Co Ltd patent application for Double-layer Epitaxial Wafer Growth Control Method Adopting Machine Learning. Xia Ruyi, Zhang Huifang and Zhang Weiqiong developed the invention.
The patent applicatio..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Wuhu Xunye Plastic Products Co Ltd has submitted a patent application for Automobile Plastic Part Machining Electroplating Device and Method. Liu Jing, Gao Daiying, Xu Yuqin, Xia Dianyin and Teng Chuanli developed the invention.
The patent application number is CN202511876599 20251212. The patent publicati..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Sanwang Electronic Wuxi Co Ltd has submitted a patent application for Feeding Mechanism for Electroplating Production Line. This invention was developed by Qin Yaxing, Li Xian and Yan Zhimin.
The patent application number is CN202511553622 20251029. The patent publication number is CN121675057 (A). Interna..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Anhui Ocean Electronic Technology has submitted a patent application for Circuit Board Pulse Electroplating Process and Device Thereof. This invention was developed by Li Zan, Bao Huaidong, Liu Hanlong and Jiang Lianping.
The patent application number is CN202511910325 20251217. The patent publication number..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Paltech Precise Electronic Co Ltd has submitted a patent application for Method for Electroplating Gold on Surface of Wafer Test Circuit Board. Zeng Zhenghua, Wang Guohu and Lu Qianmin developed the invention.
The patent application number is CN202511915927 20251218. The patent publication number is CN1216..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Wuhu Xintong Semiconductor Mat Co Ltd has submitted a patent application for Method for Removing Copper Film of Semiconductor PVD (physical Vapor Deposition) Equipment. Wu Xiaojie, Zhai Liming, Wang Qing and Liu Xian developed the invention.
The patent application number is CN202511761761 20251127. The pat..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Zhuhai Smart Electronic Mat Co Ltd has submitted a patent application for Gold Plating Method of Lead Frame for Packaging Battery Protection Chip. Wu Shixiang and Yang Hui developed the invention.
The patent application number is CN202511926263 20251219. The patent publication number is CN121674951 (A). In..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Zhejiang Fanyuan Xincai Tech Co Ltd has submitted a patent application for Aluminum-based Silicon Carbide Surface Composite Coating Process. Teng Yanqing and Li Xiao developed the invention.
The patent application number is CN202511539245 20251027. The patent publication number is CN121674950 (A). Internat..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Pressure Control Method, Semiconductor Process Equipment and Storage Medium. This invention was developed by Li Xiaobo, Chen Lulu, Yuan Fushun, Cao Keren, Chen Muqian, Jeon Sung-chul and Wang Leilei.
The patent application number..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Tuojing Chuangyi Shenyang Semiconductor Equipment has sought patent for Base and Processing Equipment of Semiconductor Device. This invention was developed by Li Quan, Zhu Zhaoyu and Zhang Tianbo.
The patent application number is CN202511938018 20251219. The patent publication number is CN121674941 (A). Inte..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Beijing NAURA Microelectronics Equipment has sought patent for Semiconductor Process Equipment. This invention was developed by Shi Lei, Kong Xiangtian, Li Hongli, Han Xing and Jia Haibo.
The patent application number is CN202411288555 20240913. The patent publication number is CN121674936 (A). Internation..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has published Chengdu Great Wall Cutting Tools Co Ltd patent application for Coating Structure of CVD (chemical Vapor Deposition) Coated Cutter and Preparation Method of Coating Structure. The invention was developed by Wang Dahui, Wang Yunzhi, Zhang Xuhui, Deng Lic..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has published Shengjisheng Ningbo Semiconductor Technology patent application for Clamping Device for Deposition Ring in Thin Film Deposition Equipment and Use Method of Clamping Device. The invention was developed by Zhang Jian.
The patent application number is ..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Zhuhai Fangweicheng Semiconductor Mat Co Ltd has sought patent for Automatic Multi-sapphire Surface Sputtering Equipment for Preparing Gallium Nitride Substrate. This invention was developed by Dong Yue, Yan Haifeng, Wang Bin, Jia Zhou, Dong Yinkuan, Du Zhixing and Lan Haiyun.
The patent application number..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- Dainippon Ink & Chemicals has submitted a patent application for Propylene-based Resin, Composition, Cured Product, Printed Wiring Board, Semiconductor Sealing Material, and Build-up Film. This invention was developed by Igari Masahito.
The patent application number is CN202510829695 20250620. The patent pub..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has published Hunan Xingxin Aetrospece New Mat Co Ltd patent application for Silicon Aryne Resin, Silicon Aryne Resin Composite Material and Preparation Method of Silicon Aryne Resin and Silicon Aryne Resin Composite Material. The invention was developed by Liao Yup..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- State Intellectual Property Office of China has released Guangxi Lier New Mat Co Ltd patent application for Inorganic Silicon Resin Modified Acrylic Emulsion for Soft Porcelain Overlay and Preparation Method of Inorganic Silicon Resin Modified Acrylic Emulsion. This invention was developed by Yang Qisheng, Pa..
Semiconductor
| Thu 25 Jun 2026
Beijing, June 25 -- University of Electronic Science and Technology of China has submitted a patent application for Preparation Method of Organic Eutectic Material and Application of Organic Eutectic Material in Spin-coating Light-emitting Film. This invention was developed by Chen Jinglong, Zheng Caijun, Xiang Wenxin, Yang Yuel..
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