Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- Intel has filed a patent application for Thermal Management Structures Integrated in Semiconductor Devices. This invention was developed by Pantuso Daniel, Phan Anh, Metz Matthew V, Ramayya Edwin B, Landon Colin D, Mannebach Ehren, Kobrinsky Mauro J, Mills Shaun, D'silva Joseph, Sen Gupta Arnab and Jiang Lei.
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