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Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Shanghai Huahong Grace Semiconductor Manufacturing has submitted a patent application for Method for Epitaxial-process Concentration Monitoring. Yang Sai, Li Hao and Lu Yi developed the invention. The patent application number is WO2025CN112892 20250806. The patent publication number is WO2026091742 (A1). In..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- ROHM has submitted a patent application for Semiconductor Device. This invention was developed by Fujisada Yoshimasa and Kondou Kiyofumi. The patent application number is WO2025JP37407 20251024. The patent publication number is WO2026094794 (A1). An abstract released by the World Intellectual Property Or..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- ROHM has submitted a patent application for Semiconductor Device. This invention was developed by Fujimura Jun and Saito Koshun. The patent application number is WO2025JP36773 20251020. The patent publication number is WO2026094683 (A1). An abstract released by the World Intellectual Property Organizatio..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Mitsubishi Electric has submitted a patent application for Semiconductor Device. This invention was developed by Sakai Yasuhiro. The patent application number is WO2024JP38931 20241031. The patent publication number is WO2026094219 (A1). An abstract released by the World Intellectual Property Organizatio..

Semiconductor

  |  Wed 13 May 2026

Beijing, May 13 -- Tokyo Electron has sought patent for Carrier Storage Apparatus, Substrate Processing Apparatus, and Carrier Transport Method. This invention was developed by Sato Junichi, Hanaki Tatsuya and Fujii Eiju. The patent application number is CN202510838542 20250623. The patent publication number is CN121292004 (A)...

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has released LG Electronics patent application for Ultraviolet Light-emitting Device. This invention was developed by Namkung Seok, Jung Muntae and Park Deokhai. The patent application number is WO2024KR16804 20241030. The patent publication number is WO2026095114 (A1..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- NVIDIA has sought patent for Integrated Circuit Design Using Neural Networks. This invention was developed by Yu Chong. The patent application number is WO2024CN129355 20241101. The patent publication number is WO2026091086 (A1). International Patent Classification code is G06N3/063. Cooperative Patent Classif..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Tokyo Electron has sought patent for Process Result Prediction Method, Information Processing Apparatus, and Program. This invention was developed by Itoh Satoshi, Matsui Hidefumi and Kyokane Hirokazu. The patent application number is WO2025JP36565 20251016. The patent publication number is WO2026094649 (A1). ..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- TDK has sought patent for Inductor Component and Component Built-in Substrate Provided with Same. This invention was developed by Hashimoto Yuki and Abe Toshiyuki. The patent application number is WO2025JP24329 20250707. The patent publication number is WO2026094335 (A1). International Patent Classification co..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Huawei Technologies has sought patent for Heat Dissipation Cover, Chip Packaging Structure, Circuit Board Assembly, and Electronic Device. This invention was developed by Xiong Wei, Chen Jinyu, Guo Qing, Lv Jianbiao and Lu Jun. The patent application number is WO2025CN96865 20250523. The patent publication num..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Tokyo Electron has sought patent for Substrate Processing Method and Substrate Processing System. This invention was developed by Yano Hidetsugu. The patent application number is WO2025JP36595 20251017. The patent publication number is WO2026094652 (A1). An abstract released by the World Intellectual Propert..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- ACM Research, Shanghai has sought patent for Substrate Processing Method. This invention was developed by Zhou Shihao and Zhang Xiaoyan. The patent application number is WO2025CN120419 20250910. The patent publication number is WO2026091909 (A1). An abstract released by the World Intellectual Property Organi..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Resonac has sought patent for Film Adhesive, Dicing Die Bonding Two-in-one Film, Semiconductor Device, and Manufacturing Method for Same. This invention was developed by Iizuka Reina, Guo Pengyi, Kuroda Takahiro and Choi Haemil. The patent application number is WO2025JP37850 20251028. The patent publication nu..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Resonac has sought patent for Film-shaped Adhesive, Dicing/die-bonding Integrated Film, and Semiconductor Device and Production Method Therefor. This invention was developed by Hosono Satoshi, Onuma Satoru and Mae Tomoya. The patent application number is WO2025JP37819 20251028. The patent publication number is..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Nissan Chemical has sought patent for Adhesive Composition, Laminate, Production Method for Laminate, and Production Method for Processed Semiconductor Substrate or Electronic Device Substrate. This invention was developed by Yanai Masaki, Kishioka Takahiro and Usui Yuki. The patent application number is WO202..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Yangtze Delta Industrial Innovation Center of Quantum Science and Technology has sought patent for Quantum Chip. This invention was developed by An Zhao, Wang Guangyue, Chen Jie and Zhang Xiang. The patent application number is WO2025CN131733 20251031. The patent publication number is WO2026092680 (A1). Intern..

Semiconductor

  |  Wed 13 May 2026

Beijing, May 13 -- Shanghai University has sought patent for Organ Chip for Simulating Wound Healing and Use Method Thereof. This invention was developed by Yue Tao, Yang Huiying, Gan Ting, Zhang Juan, Wang Yue and Liu Na. The patent application number is CN202511190377 20250825. The patent publication number is CN121294137 (A)..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Semiconductor Energy Laboratory has applied WIPO patent for Semiconductor Device. Toyotaka Kouhei and Uochi Hideki developed it. The patent application number is WO2025IB60891 20251027. The patent publication number is WO2026093870 (A1). International Patent Classification codes are G11C11/00, G11C11/405, G11C..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Sony Semiconductor Solutions Corporation has applied WIPO patent for Semiconductor Package, Semiconductor Chip, and Method for Manufacturing Semiconductor Package. Takayama Ayumi developed it. The patent application number is WO2025JP31473 20250905. The patent publication number is WO2026094424 (A1). Internati..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Beijing Superstring Academy of Memory Technology has applied WIPO patent for Memory Cell, Semiconductor Device, and Manufacturing Method Therefor. Zhu Zhengyong, Kang Bok Moon and Zhao Chao developed it. The patent application number is WO2025CN108766 20250716. The patent publication number is WO2026091683 (A1..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Tokyo Electron has applied WIPO patent for Plasma Source Device, Substrate Processing Device, and Control Method. Ikeda Taro developed it. The patent application number is WO2025JP36845 20251020. The patent publication number is WO2026094692 (A1). International Patent Classification codes are C23C16/44 and H05..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- HKC has applied WIPO patent for Array Substrate and Manufacturing Method Therefor, and Electronic Paper Display Panel. Chen Weijun and Ye Lidan developed it. The patent application number is WO2025CN126903 20251011. The patent publication number is WO2026092085 (A1). International Patent Classification code is..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Lansus Technologies has applied WIPO patent for Radio-frequency Front-end Module and Radio-frequency Chip. Shao Yixiang, Yu Zetian and Guo Jiashuai developed it. The patent application number is WO2025CN125180 20250929. The patent publication number is WO2026092044 (A1). International Patent Classification cod..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Sandisk Technology has applied WIPO patent for Read Retry with Physical Defect Judgement. Tian Xuan, Li Liang and Wang Ming developed it. The patent application number is WO2025US26930 20250429. The patent publication number is WO2026095987 (A1). International Patent Classification codes are G11C16/04, G11C16/..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Corning has applied WIPO patent for Methods and Apparatus of Determining a Stress-related Characteristic of a Substrate. Andrews Ryan Claude, Canales Benavides Arturo Alejandro and Furnas William John developed it. The patent application number is WO2025US52051 20251022. The patent publication number is WO2026..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has published Wuxi China Resources Huajing Microelectronics patent application for Shield Gate Trench Transistor, Manufacturing Method Therefor and Layout Thereof. The invention was developed by Xiao Xuan, Li Dan, Tan Junting, Ye Jun and Yang Zhiyu. The patent applica..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has received Resonac patent application for Film Adhesive, Dicing Die Bonding Two-in-one Film, Semiconductor Device, and Manufacturing Method for Same. Iizuka Reina, Guo Pengyi, Kuroda Takahiro and Choi Haemil developed the invention. The patent application number is WO..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has received Shin-Etsu Handotai patent application for Heteroepitaxial Substrate and Production Method for Same. Ohtsuki Tsuyoshi, Matsubara Toshiki, Suzuki Atsushi, Uehigashi Yota and Abe Tatsuo developed the invention. The patent application number is WO2025JP34283 20..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has received TDK patent application for Electronic Component and Component-embedded Substrate Equipped with Same. Hashimoto Yuki, Abe Toshiyuki, Sato Hironori and Kawaguchi Yuuichi developed the invention. The patent application number is WO2025JP24328 20250707. The pat..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has received Tokyo Electron patent application for Plasma Source Device, Substrate Processing Apparatus, and Control Method. Ikeda Taro developed the invention. The patent application number is WO2025JP36846 20251020. The patent publication number is WO2026094693 (A1). ..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has received Toray Engineering patent application for Method for Forming Artificial Cell Membrane Chip, and Artificial Cell Membrane Chip. Kamimura Mikoto, Kanamori Hajime and Hirata Hajime developed the invention. The patent application number is WO2025JP36476 20251016..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has received Beijing Superstring Academy of Memory Technology patent application for Memory Cell, Semiconductor Device and Manufacturing Method Therefor. Zhu Zhengyong, Kang Bok Moon and Zhao Chao developed the invention. The patent application number is WO2025CN108768 ..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has received Beijing NAURA Microelectronics Equipment patent application for Bellows Assembly and Semiconductor Processing Device. Chen Ping, Li Xinlong, Liu Wen and Ke Dongfang developed the invention. The patent application number is WO2025CN129186 20251022. The paten..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has received Applied Materials patent application for Hybrid Preclean Chamber and Methods. Li Liurui, Davey Eric and Xia Borui developed the invention. The patent application number is WO2025US52926 20251028. The patent publication number is WO2026096517 (A1). Internati..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has received Applied Materials patent application for Metal Silicide Post Treatment to Enhance Thermal Stability. Cen Xi, Jiang Ying-bing, Wang Yuxin, Xu Yao, Gelatos Avgerinos, Lee Joung Joo, Wu Kai and Cheng Cheng developed the invention. The patent application number..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has received ASML Netherlands patent application for Positioning System, Lithographic Apparatus, Method to Drive a Movable Support of a Positioning System and Method Comprising a Patterned Radiation Beam Onto a Substrate. Van Drent William and Koevoets Adrianus developed..

Semiconductor

  |  Wed 13 May 2026

Beijing, May 13 -- State Intellectual Property Office of China has received Kunming University of Science and Technology patent application for Method and System for Measuring Thickness of Semiconductor Epitaxial Layer Based on Multi-beam Interference Correction. Deng Qiwen, Song Yaolian and Tang Jingmin developed the invention...

Semiconductor

  |  Wed 13 May 2026

Beijing, May 13 -- Wenzhou Institute of Technology has filed a patent application for Electrostatic Jet Printing Equipment for Printing Chip Insulating Layer. This invention was developed by Chen Fengjun, Xu Fanghao, Ye Yunyang and Liu Kangdong. The patent application number is CN202511602042 20251104. The patent publication nu..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Semiconductor Energy Laboratory has filed a patent application for Semiconductor Device. This invention was developed by Watanabe Kazunori, Kusunoki Koji and Shishido Hideaki. The patent application number is WO2025IB60893 20251027. The patent publication number is WO2026093872 (A1). International Patent Class..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Tokyo Electron has filed a patent application for Substrate Processing Method, Substrate Processing Apparatus, Program, and Computer Storage Medium. This invention was developed by Osada So, Choi Kwangeun, Nakamura Yosuke, Yamashita Yohei, Seki Taiji, Fukunaga Nobutaka and Sakai Fumiya. The patent application ..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- CXMT has filed a patent application for Test Circuit, Test Method and Chip Stack Structure. This invention was developed by Cao Kanyu and Zhang Jiarui. The patent application number is WO2025CN102347 20250620. The patent publication number is WO2026091566 (A1). International Patent Classification codes are G11..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Huawei Technologies has filed a patent application for Chip Structure, Chip Stack Structure and Preparation Method Therefor, and Electronic Device. This invention was developed by Liu Zhe, Huang Shuman and Yang Fan. The patent application number is WO2025CN100161 20250610. The patent publication number is WO20..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Nissan Chemical has filed a patent application for Composition for Forming Silicon-containing Resist Underlayer Film and Method for Manufacturing Semiconductor Element. This invention was developed by Takeda Satoshi, Furukawa Yuki and Saijo Taiki. The patent application number is WO2025JP37079 20251022. The pa..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Tokyo Electron has filed a patent application for Substrate Processing Device, Gas Supply Device, and Design Method. This invention was developed by Ogura Eito. The patent application number is WO2025JP36726 20251017. The patent publication number is WO2026094678 (A1). International Patent Classification code ..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Resonac has filed a patent application for Film-like Adhesive, Dicing and Die-bonding Integrated Film, Semiconductor Device, and Manufacturing Method for Same. This invention was developed by Onuma Satoru, Mae Tomoya and Taniguchi Kohei. The patent application number is WO2025JP37851 20251028. The patent publi..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Applied Materials has filed a patent application for Heater Pedestal with Improved Chucking. This invention was developed by Mustafa Muhannad and Baluja Sanjeev. The patent application number is WO2025US47499 20250923. The patent publication number is WO2026096117 (A1). International Patent Classification code..

Semiconductor

  |  Wed 13 May 2026

Beijing, May 13 -- Applied Materials has filed a patent application for Apparatus and Method for Inspecting a Lamp. This invention was developed by Raj Govinda and Nestorov Viren K. The patent application number is CN202511294177 20210312. The patent publication number is CN121297672 (A). International Patent Classification cod..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has published Guangdong OPPO Mobile Telecommunications patent application for Communication Methods, Apparatuses and Device, Chip and Storage Medium. The invention was developed by Yu Xinlei, You Xin and Lin Xue. The patent application number is WO2024CN129545 20241103...

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has published Hamamatsu Photonics patent application for Laser Processing Method and Method for Manufacturing Semiconductor Device. The invention was developed by Sakamoto Takeshi and Sugimoto Yo. The patent application number is WO2025JP32067 20250910. The patent publi..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has published Kawasaki Jukogyo K K patent application for Substrate Transfer Device. The invention was developed by Koretake Ryouma, Murase Daiki, Niwa Sosei, Misao Kazushi, Matsumura Akitaka, Sumitomo Masahiko and Shimizu Ippei. The patent application number is WO2025J..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has published DMG Mori patent application for Installable Substrate. The invention was developed by Okuno Junichiro, Inoue Takashi, Boujnah Haythem and Okoshi Kazuya. The patent application number is WO2025JP38217 20251030. The patent publication number is WO2026095011 ..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has published Beijing NAURA Microelectronics Equipment patent application for Flow Homogenizing Structure, Process Chamber, and Semiconductor Process Device. The invention was developed by Feng Lvchen. The patent application number is WO2025CN130087 20251027. The patent..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has published Huawei Technologies patent application for Wireless Device, Signal Processing Method, and Chip. The invention was developed by Ni Yizhan, Klein Shaul, Liu Qi and Xu Shengkai. The patent application number is WO2025CN129074 20251021. The patent publication ..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has published PSK Holdings patent application for Substrate Cutting Method Using Laser Beam Deflection System. The invention was developed by Sul Bong Ho, Park Jongbum, Yoon Sung Jin, Yoon Hoi Jung and Jeon Jin Pyo. The patent application number is WO2025KR14495 2025091..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has published Beijing NAURA Microelectronics Equipment patent application for Chamber Abnormality Processing Method and Semiconductor Process Device. The invention was developed by Feng Lili. The patent application number is WO2025CN127529 20251014. The patent publicati..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has published Applied Materials patent application for Chemical Mechanical Polishing Slurry Buildup Cleaning. The invention was developed by Wu Haosheng, Van Der Veen Shaun, Pon Devin, Zhong Elton, Floyd Edward L, Augason Ilinsky Emily, Wong Justin H, Domin Jonathan P, W..

Semiconductor

  |  Wed 13 May 2026

Beijing, May 13 -- State Intellectual Property Office of China has published Tokyo Electron patent application for Substrate Processing System. The invention was developed by Morimoto Daiki and Nagamatsu Tatsuya. The patent application number is CN202510889764 20250630. The patent publication number is CN121297368 (A). Internat..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has released Wuhan China Star Optoelectronics Technology patent application for Array Substrate and Display Panel. This invention was developed by Luo Chuanbao. The patent application number is WO2024CN130769 20241108. The patent publication number is WO2026091170 (A1)...

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has released Nissan Chemical patent application for Adhesive Agent Composition, Laminate, Method for Manufacturing Laminate, and Method for Manufacturing Processed Semiconductor Substrate. This invention was developed by Yanai Masaki, Kishioka Takahiro and Usui Yuki. Th..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has released Tokyo Electron patent application for Substrate Processing Device and Substrate Processing Method. This invention was developed by Takahashi Nobuaki and Miura Hitoshi. The patent application number is WO2025JP37428 20251024. The patent publication number is..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has released Huawei Technologies patent application for First Chip, Second Chip, Chip System, Display Device, and Display Method. This invention was developed by Sun Yifang, Xu Lu and Yang Zhiyong. The patent application number is WO2025CN98793 20250603. The patent publ..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has released ACM Research, Shanghai patent application for Spraying Apparatus and Substrate Processing Device. This invention was developed by Chen Fuping, Pang Hao, Zhang Fengrong and Wang Hui. The patent application number is WO2025CN123144 20250923. The patent public..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has released Microchip Technology patent application for Adaptive Step Delay in Peripheral Trigger Generator. This invention was developed by Halageri Avinash and Bhat Swathi G. The patent application number is WO2025US21445 20250326. The patent publication number is WO..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- World Intellectual Property Organization has released Applied Materials patent application for Methods for Substrate Bonding. This invention was developed by Sherwood Tyler, Sreenivasan Raghav, Gorchichko Mariia, Li Kun, Nguyen Anh, Shepard Joseph, Krishnan Siddarth and Chudzik Michael. The patent application ..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Applied Materials has submitted a patent application for Method for Forming Through Vias in a Die Stack. Varghese Sony and Khasgiwale Niranjan R developed the invention. The patent application number is WO2025US48838 20250930. The patent publication number is WO2026096139 (A1). International Patent Classificat..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Lam Research has submitted a patent application for Variable Resistance Network. This invention was developed by Liu Chang, Caron James and Sharetsky Aleksander. The patent application number is WO2025US50590 20251010. The patent publication number is WO2026096186 (A1). International Patent Classification code..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Lam Research has submitted a patent application for Electrostatic Shields for Plasma Processing Chambers. Cui Linying and Benjamin Neil M P developed the invention. The patent application number is WO2025US51774 20251021. The patent publication number is WO2026096236 (A1). International Patent Classification c..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Applied Materials has submitted a patent application for System for Target Arcing Mapping and Plasma Diagnosis. This invention was developed by Pan Junjie, Xie Xiangjin and Zhang Fuhong. The patent application number is WO2025US51985 20251022. The patent publication number is WO2026096257 (A1). International P..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Microchip Technology has submitted a patent application for Integrated On-chip/in-package Transformer Driver for Can Applications. This invention was developed by Jordan Declan and Gammie David. The patent application number is WO2025US52635 20251027. The patent publication number is WO2026096359 (A1). Interna..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Applied Materials has submitted a patent application for Substrate Bow Measurement and Control. Sanchez Erica De Leon, Kirschenheiter Thomas, Maldonado-garcia Maribel, Zhu Zuoming and Dube Abhishek developed the invention. The patent application number is WO2025US52737 20251027. The patent publication number i..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Carl Zeiss SMT has submitted a patent application for Method and Device for the Inspection of Semiconductor Substrates. This invention was developed by Matejka Ulrich, Hetzler Jochen, Roeder Robert, Schmidt Carsten, Werschnik Jan, Schmidt Soeren and Kattmann Tobias. The patent application number is WO2025EP811..

Semiconductor

  |  Wed 13 May 2026

Geneva, May 13 -- Lam Research has submitted a patent application for Foreline for Semiconductor Processing. This invention was developed by Sharma Pawan, Wongsenakhum Panya and Lafferty William. The patent application number is WO2025US53038 20251029. The patent publication number is WO2026096580 (A1). International Patent Cla..

Semiconductor

  |  Wed 13 May 2026

Geneva, May 13 -- Micron Technology has submitted a patent application for Analog Multiply and Accumulate Architecture for Compute-in-memory Machine Learning. This invention was developed by Tanaka Tomoharu. The patent application number is WO2025US53187 20251029. The patent publication number is WO2026096681 (A1). Internationa..

Semiconductor

  |  Tue 12 May 2026

Beijing, May 13 -- State Intellectual Property Office of China has received Hunan University of Technology patent application for Intelligent Atmospheric Water Collection System and Method Based on Beidou Communication and MOF Adsorption Technology. Jiang Changbo and Zhao Tian developed the invention. The patent application n..

Semiconductor

  |  Wed 13 May 2026

Beijing, May 13 -- Xinjiang Institute of Technology has submitted a patent application for Electronic Detonator Chip Anti-impact Device. This invention was developed by Zhao Jingkun, Yan Sujie, Chen Zhiwen, Ge Yunfeng, Wu Jiangwei and Wang Kaixi. The patent application number is CN202511613693 20251105. The patent publication n..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Huawei Technologies has submitted a patent application for Communication Method and Apparatus, Storage Medium, Program Product, Chip, and Chip System. This invention was developed by Li Kexin, Luo Hejia, Wang Xiaolu and Kong Chuili. The patent application number is WO2025CN103906 20250626. The patent publicati..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Resonac has submitted a patent application for Film Adhesive, Dicing and Die-bonding Film, Semiconductor Device, and Production Method for Semiconductor Device. This invention was developed by Kuroda Takahiro and Kosuga Yohsuke. The patent application number is WO2025JP37821 20251028. The patent publication nu..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Honor Device has submitted a patent application for Photographic Cache Management Method, and Chip System, Device and Storage Medium. This invention was developed by Jia Xingwei. The patent application number is WO2025CN113504 20250808. The patent publication number is WO2026091758 (A1). International Patent C..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- LG Innotek has submitted a patent application for Circuit Board and Semiconductor Package Comprising Same. This invention was developed by Song Jin Ho, Na Se Woong and Lee Kee Han. The patent application number is WO2025KR16571 20251020. The patent publication number is WO2026095455 (A1). International Patent ..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- LG Chem has submitted a patent application for Glass Substrate Singulation Process and Glass Substrate Unit Manufactured Thereby. This invention was developed by Jung Dae Chul, Kwon Oh Tak, Ryu Sanguk, Yoo Sangmoon, Lee Chang Hee and Choi A Nam. The patent application number is WO2025KR17449 20251029. The pate..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Silicon Storage Technology has submitted a patent application for Bias Circuit for Non-volatile Memory Array in a Neural Network. Vu Hoa, Tran Hieu, Vu Thuan, Hong Stanley and Trinh Stephen developed the invention. The patent application number is WO2025US13469 20250128. The patent publication number is WO2026..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Silicon Storage Technology has submitted a patent application for Program Refresh for Non-volatile Memory Cells. This invention was developed by Surico Stefano, Bartoli Simone, Sivero Stefano, Moioli Guiseppe, Liu Xian, Le Thai and Vo An. The patent application number is WO2025US12232 20250117. The patent publ..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- ASML Netherlands has submitted a patent application for Metrology Method and Associated Metrology Device. Tinnemans Patricius, Van Putten Eibert, Coene Willem, El Gawhary Omar, Nienhuys Han-kwang, Porter Christina, Van Rijswijk Loes, Invernizzi Andrea and Coenen Teis developed the invention. The patent applica..

Semiconductor

  |  Wed 13 May 2026

Beijing, May 13 -- Institute of Engineering Thermophysics, Chinese Academy of Sciences has sought patent for Tube Bundle Type Stress Buffering Device. This invention was developed by Li Zhigang, Zheng Mingyu, Liang Shiqiang, Guo Chaohong, Zhang Haisong, Tian Yong, Wang Bo and Xu Xiang. The patent application number is CN20251..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- BOE Technology Group has submitted a patent application for Display Substrate and Manufacturing Method Therefor, and Display Apparatus. This invention was developed by Dong Shuilang, Cao Zhanfeng, Xue Dapeng, Xuan Minghua and Lu Xinhong. The patent application number is WO2024CN128962 20241031. The patent publ..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- TDK has submitted a patent application for Inductor Component and Embedded Component Substrate Comprising Same. This invention was developed by Hashimoto Yuki, Abe Toshiyuki, Sato Hironori and Kawaguchi Yuuichi. The patent application number is WO2025JP24327 20250707. The patent publication number is WO2026094..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Wuhan Tianma Microelectronics has submitted a patent application for Array Substrate and Method for Preparing Same, Display Panel, and Display Device. This invention was developed by Zheng Ying, Yu Yun and Yi Shijuan. The patent application number is WO2025CN76616 20250210. The patent publication number is WO2..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Shin-Etsu Handotai has submitted a patent application for Heteroepitaxial Substrate and Method for Manufacturing Heteroepitaxial Substrate. Ohtsuki Tsuyoshi, Matsubara Toshiki, Uehigashi Yota, Suzuki Atsushi and Abe Tatsuo developed the invention. The patent application number is WO2025JP34282 20250929. The pa..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Tokyo Electron has submitted a patent application for Substrate Processing Apparatus, Fluid Supply System, and Substrate Processing Method. This invention was developed by Hayashida Takahiro and Shimomura Shinichiro. The patent application number is WO2025JP36652 20251017. The patent publication number is WO20..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Tokyo Electron has submitted a patent application for Computer Program, Information Processing Method, and Information Processing Device. This invention was developed by Oigawa Hitomi. The patent application number is WO2025JP36513 20251016. The patent publication number is WO2026094644 (A1). International Pat..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- ROHM has submitted a patent application for Semiconductor Device and Method for Manufacturing Semiconductor Device. This invention was developed by Nakano Yuki. The patent application number is WO2025JP37357 20251023. The patent publication number is WO2026094782 (A1). International Patent Classification codes..

Semiconductor

  |  Mon 11 May 2026

Beijing, May 12 -- State Grid Hebei Electric Power Supply Co Ltd Electric Power Res Institute and State Grid Corporation of China have sought patent for Variable-frequency Power Supply Current Sharing Method, Device and Equipment Based on Silicon Carbide Inversion Unit. This invention was developed by Lu Shijie, Pang Xianhai, Li..

Semiconductor

  |  Tue 12 May 2026

Beijing, May 12 -- Binzhou Weiqiao Guoke Advanced Tech Research Institute and Shandong Hongqiao New Material have submitted a patent application for Method for In-situ Rapid Growth of Double-network Hydrogel Coating on Surface of Substrate and Application of Double-network Hydrogel Coating. This invention was developed by Cheng ..

Semiconductor

  |  Tue 12 May 2026

Beijing, May 12 -- North Integrated Circuit Tech Innovation Center and Tsinghua University have submitted a patent application for Wiring Parameter Determination Method and Device for Large-size Substrate and Computer Equipment. This invention was developed by Hu Yang, Jiang Dingcheng, Han Huiming and Yin Shouyi. The patent a..

Semiconductor

  |  Tue 12 May 2026

Beijing, May 12 -- North Integrated Circuit Tech Innovation Center and Tsinghua University have submitted a patent application for High-speed Ddr Wiring Structure Optimization Method and Device Based on Silicon Substrate. This invention was developed by Hu Yang, Wu Guanghong, Jiang Dingcheng, Han Huiming and Yin Shouyi. The p..

Semiconductor

  |  Tue 12 May 2026

Beijing, May 12 -- North Integrated Circuit Tech Innovation Center and Tsinghua University have submitted a patent application for Chip Integration System Design Method and Device Based on Silicon Substrate. Hu Yang, Yu Xingmao, Han Huiming and Yin Shouyi developed the invention. The patent application number is CN20251138558..

Semiconductor

  |  Tue 12 May 2026

Beijing, May 13 -- Kokusai Electric has submitted a patent application for Gas Supply Unit, Processing Apparatus, Gas Supply Method, and Method for Manufacturing Semiconductor Device. This invention was developed by Okajima Yusaku, Urushihara Mika and Moriya Taketoshi. The patent application number is CN202510546949 20250428. T..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Semiconductor Energy Laboratory has submitted a patent application for Semiconductor Device. This invention was developed by Yamazaki Shunpei, Murakawa Tsutomu, Hodo Ryota, Moriwaka Tomoaki and Kurata Motomu. The patent application number is WO2025IB60892 20251027. The patent publication number is WO2026093871..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Semiconductor Energy Laboratory has submitted a patent application for Organic Compound. Takeda Kyoko, Tosu Keito, Yoshiyasu Yui, Kubota Tomohiro, Watabe Takeyoshi and Ohsawa Nobuharu developed the invention. The patent application number is WO2025IB60890 20251027. The patent publication number is WO2026093869..

Semiconductor

  |  Tue 12 May 2026

Geneva, May 13 -- Spreadtrum Semiconductor (Nanjing) has applied WIPO patent for Communication Method and Apparatus, and Storage Medium and Computer Program Product. Lei Zhenzhu, Zhou Huan, Xu Zhikun, Pan Zhengang and Ren Qiwei developed it. The patent application number is WO2025CN129653 20251023. The patent publication numb..
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