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Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Sharp has submitted a patent application for RF Front-end Module. This invention was developed by Yoshikawa Hirofumi.
The patent application number is WO2025JP39557 20251112. The patent publication number is WO2026133805 (A1). International Patent Classification codes are H01P5/12, H01Q23/00 and H01Q3/36.
..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Fuji Electric has submitted a patent application for Semiconductor Device and Manufacturing Method. This invention was developed by Kubouchi Motoyoshi.
The patent application number is WO2025JP43496 20251212. The patent publication number is WO2026134136 (A1). International Patent Classification codes are H1..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Korea University Research and Business Foundation has submitted a patent application for Infrared Photodiode Comprising Surface-modified Electron Transport Layer and Manufacturing Method Thereof. This invention was developed by Baek Se Woong and Lee Seo Young.
The patent application number is WO2024KR20991 2..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Semiconductor Manufacturing International (Shanghai) patent application for Semiconductor Structure and Forming Method Thereof. Zhao Meng developed the invention.
The patent application number is CN202411366395 20240927. The patent publication number ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Hefei Nexchip Integrated Circuit patent application for Semiconductor Structure, Preparation Method and Method for Improving Carrier Mobility of Device. Wang Wenzhi developed the invention.
The patent application number is CN202610249024 20260303. The..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Shenzhen Xinkailai Industry Machine patent application for Preparation Method of Gate-all-around Transistor. Zhu Jian, Xu Lei, Li Qi and Dai Yuqiong developed the invention.
The patent application number is CN202511657985 20251112. The patent publicat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Lattice Art Semiconductor patent application for Groove Type JFET Device and Preparation Method Thereof. Yi Kun, Bao Han, Luo Junyi and Liao Lei developed the invention.
The patent application number is CN20251245508 20251231. The patent publication n..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Samsung Electronics patent application for Semiconductor Package. Kim Young-bae developed the invention.
The patent application number is CN20251194499 20250806. The patent publication number is CN121772228 (A). International Patent Classification cod..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Nanya Technology patent application for Semiconductor Structure and Manufacturing Method Thereof. Liang Yuxuan developed the invention.
The patent application number is CN202411769725 20241204. The patent publication number is CN121772217 (A). Interna..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- NTT has submitted a patent application for Field-effect Transistor and Method for Manufacturing Same. This invention was developed by Sasaki Tarou and Sugiyama Hiroki.
The patent application number is WO2024JP44600 20241217. The patent publication number is WO2026133421 (A1). International Patent Classificat..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has released Ferrotec Corp patent application for Substrate Processing Device. This invention was developed by Sagisaka Keisuke.
The patent application number is WO2025JP43734 20251215. The patent publication number is WO2026134177 (A1). International Patent Classific..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has released Okmetic Oy patent application for Method for Manufacturing a Bonded Wafer Structure. This invention was developed by Vesapuisto Erkki and Mäkinen Jari.
The patent application number is WO2025FI60120 20251127. The patent publication number is WO2026132650..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Jiangsu Haojiao Precision Tech Co Ltd patent application for Composite Binder Grinding Wheel for Thinning Back Surface of Silicon Wafer and Preparation Method of Composite Binder Grinding Wheel. This invention was developed by Li Hanyang, Sheng Zemin, Ji..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has published Central Glass Co Limited patent application for Composition, Etching Method, Method for Manufacturing Semiconductor Device, Etching Device, and Cleaning Method. The invention was developed by Fujii Takumi and Oomori Hiroyuki.
The patent application numbe..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has published Okmetic Oy patent application for Manufacture Method for Manufacturing a Wafer Structure. The invention was developed by Parkkinen Katja.
The patent application number is WO2025FI60116 20251127. The patent publication number is WO2026132648 (A1). Interna..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has published Csem Ct Suisse Delectronique Microtechnique SA Rech Developpement patent application for Thin Film Electro-optic Photonic Integrated Circuit and Related Fabrication Methods. The invention was developed by Prieto Gonzalez Ivan, Ghadimi Amir, Sattari Hamed an..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Zhejiang Zhenghanyuan Semiconductor Co Ltd patent application for Optimized Ceramic Substrate and Preparation Method Thereof. This invention was developed by Wang Hua.
The patent application number is CN20251242880 20251231. The patent publication num..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Zibo Xiandao Intelligent Sensing Tech Co Ltd patent application for Cleaning Device and Method for Parts of Semiconductor Equipment and Semiconductor Equipment. This invention was developed by Zhang Jun and Zhang Dong.
The patent application number is..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Lide Health Tech Guangzhou Co Ltd patent application for Liquid Drop Electrofusion Chip and Liquid Drop Electrofusion Method. The invention was developed by Li Mengqi, Chen Binchao and Tang Zhenqian.
The patent application number is CN202511944999 20..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Zhejiang Liufang Semiconductor Tech Co Ltd patent application for Tail Gas Treatment System and Method for Chemical Vapor Deposition Silicon Carbide Equipment. The invention was developed by Qi Tiefeng, Cai Binxu, Yao Zhoufeng, He Shaolong, Xu Jijiang, ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Beijing BOE Display Tech Co, BOE Technology Group and Beijing BOE Technology Development patent application for Transistor Device, Preparation Method Thereof and Display Substrate. This invention was developed by Zou Jiabin, Guo Hui, Ma Yu, Li Feng, Wang..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Takatori Corp patent application for Semiconductor Wafer Manufacturing Method and Semiconductor Wafer Manufacturing Apparatus. The invention was developed by Matsuda Takeharu and Masuda Makoto.
The patent application number is CN20248054499 20240827...
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Nat Ct Advanced Packaging Co Ltd Ncap China patent application for Preparation Method of Semiconductor Packaging Structure and Semiconductor Packaging Structure. The invention was developed by Deng Jiancheng, Dai Fengwei, Zheng Fengxia and Liu Fengman.
..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Kunshan Jianghong Precision Tech Co Ltd patent application for Processing Technology of Integrally-formed Chip Micro-channel Heat Dissipation Device. This invention was developed by Li Jinqun, Zou Xinmu, Wei Juan and Chen Mingzhi.
The patent applicati..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Kunshan Jianghong Precision Tech Co Ltd patent application for Processing Technology of Laminated Chip Micro-channel Heat Dissipation Device. The invention was developed by Li Jinqun, Zou Xinmu, Wei Juan and Chen Mingzhi.
The patent application numbe..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released GMC Semiconductor Technology Wuxi Co Ltd patent application for Feeding and Discharging Equipment of Wafer Release System and Wafer Release System Applying Same. This invention was developed by Mo Kewei, Qi Zhiming, Li Songsong, Sun Yongsheng and Li Chen..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Chengdu BOE Optoelectronics Technology and BOE Technology Group patent application for Display Substrate and Display Device. This invention was developed by Wang Kui.
The patent application number is CN20261050031 20260114. The patent publication numb..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Jiangxi MTC Semiconductor and Jiangxi Yaochi Tech Co Ltd patent application for Flip Light Emitting Diode Chip and Preparation Method Thereof. This invention was developed by Li Wentao, Jin Conglong, Hu Jiahui, Xu Zhou and Zhang Cunlei.
The patent app..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Jiangxi MTC Semiconductor and Jiangxi Yaochi Tech Co Ltd patent application for Composite Patterned Substrate and Preparation Method Thereof. This invention was developed by Wen Guosheng, Jin Conglong, Liang Yi, Xu Zhou, Chen Tian and Li Hui.
The pate..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Shanghai Weijing Electronic Tech Co Ltd patent application for Silicon Optical Chip and Manufacturing Method Thereof. This invention was developed by Katsura.
The patent application number is CN20251235176 20251230. The patent publication number is CN..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Shanghai Weijing Electronic Tech Co Ltd patent application for Silicon Optical Chip and Manufacturing Method Thereof. This invention was developed by Katsura.
The patent application number is CN20251235038 20251230. The patent publication number is CN..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Guangdong Kezhuo Semiconductor Equipment Co Ltd patent application for Wafer Carrier Capable of Being Conveniently Matched with Wafer Cutting Machine. The invention was developed by Wei Yuhong and Zhu Yuqing.
The patent application number is CN202610..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Shanghai Chuangxian Semiconductor Co Ltd patent application for Power Semiconductor Chip Welding Mixed Material Bearing Device. The invention was developed by Zhang Chang, You Haitao, Sun Wenda, Liu Xingquan, Zhang Yihan and Wang Yijia.
The patent ap..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Yangtze Memory Holdings Co Ltd patent application for Semiconductor Structure and Preparation Method Thereof, Chip Packaging Structure and Storage System. This invention was developed by Liu Lei, Zhou Wenxi, Fan Dongyu, Liu Meiying, Huo Zongliang, Gao Ti..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Zhangjiagang Zhiheng Electronics Co Ltd patent application for Automatic Welding Control Method, Device and System for Integrated Circuit Board. This invention was developed by Huang Guan, Jiang Jianfei and Zhuang Mingkun.
The patent application numbe..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Suanmiao Tech Beijing Co Ltd patent application for Integrated Circuit Layout Design Method and Integrated Circuit. This invention was developed by Liu Haiyun and Zhang Yusheng.
The patent application number is CN202511984291 20251225. The patent publ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published United Semi Integrated Circuit Mfg Xiamen Co Ltd patent application for Wafer Cleaning Method and Wafer Cleaning System. The invention was developed by Xu Rongxin, Lan Wanfu and Tan Wenyi.
The patent application number is CN202411364290 20240927. The..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Shanghai Xinaoxinyi Tech Co Ltd patent application for Bonded Wafer and Preparation Method Thereof. The invention was developed by Zhou Yuhao, Wang Ziwen, Zhu Wei, Li Wei and Wei Xing.
The patent application number is CN20251221305 20251229. The pate..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Yunnan University and Huacai Luminous Energy Tech Yunnan Co Ltd patent application for Interface Modification Layer of Perovskite Solar Cell and Perovskite Solar Cell. The invention was developed by Lyu Yinhua, Guo Kaiyang, Yang Hang, Zhang Wenhua, Geng..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Suzhou Guoxian Innovation Tech Co Ltd patent application for Solar Cell, Packaging Method of Solar Cell and Electric Equipment. The invention was developed by Li Lianyue.
The patent application number is CN202511984783 20251225. The patent publicatio..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Jiangxi MTC Semiconductor and Jiangxi Zhaochi Integration Tech Co Ltd patent application for Preparation Method of Composite Patterned Substrate, Composite Patterned Substrate and Led Chip. The invention was developed by Wen Guosheng, Jin Conglong, Lian..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Jiangxi MTC Semiconductor and Jiangxi Zhaochi Integration Tech Co Ltd patent application for High-reliability Vertical Led Chip and Preparation Method Thereof. The invention was developed by Jin Conglong, Ru Hao, Hu Jiahui, Ao Yingquan and Wang Li.
T..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Yangzhou Carbon Zhonghe Technology Innovation Research Center Of Yangzhou Univ and Yangzhou University patent application for Thin Film Gallium Arsenide Cell Stripping and Transferring System and Method Based on Van Der Waals Force. The invention was de..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released No. 723 Research Inst Of Csic patent application for Universal Extensible Digital Beam Forming Chip Design Architecture and Method. This invention was developed by Xu Siyuan, Ma Ganjun, Hu Jinxian, Li Chunlai, Xue Cheng and Li Rengang.
The patent appl..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Infineon Technologies Americas Corp patent application for High Voltage Delta-sigma Modulator Analog-to-digital Converter. This invention was developed by Fini Luca, Hancioglu Erkan, Kijima Masako, Goniodetsky Dmitry, Singh Rajinder, Yasukochi Kazuhiko a..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Ningbo Sailamike New Material Tech Co Ltd patent application for Double-pulse Electroplating Ceramic Power Supply. This invention was developed by Shi Jianbo and Krasnikov Yury.
The patent application number is CN20251250681 20251231. The patent publi..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has released Heilongjiang Huixin Semiconductor Co Ltd patent application for Anti-dead-zone Circuit, PCB and Chip. This invention was developed by Li Bin, Feng Kexin, Xie Yingxi, Niu Bing, Guo Jiajie, Feng Yuxiang and Ma Bobin.
The patent application number is CN2..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Xinwei Bite Nano Tech Suzhou Co Ltd patent application for Machine Learning Force Field Molecular Dynamics Efficient Parallel Acceleration Method, System and Device Based on Taftogen S60 Chip Architecture and Storage Medium. The invention was developed ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published BYD Co Limited and BYD Semiconductor patent application for Image Flicker Detection Method and Acquisition Parameter Adjustment Method of Image Sensor. The invention was developed by Liu Yang, Bai Mei, Lyu Yupeng, Hu Yajie and Kuang Jianghua.
The pat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Chengdu Yunbao Chuangxin Intelligent Tech Co Ltd patent application for Network Processor and Chip. The invention was developed by Dong Deji and Zhang Xueli.
The patent application number is CN202511913464 20251218. The patent publication number is C..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Dongbu Hitek Co Ltd patent application for Silicon-on-insulator Semiconductor Device and Manufacturing Method Thereof. The invention was developed by Wi Hyun-sol and Jung Jin-hyo.
The patent application number is CN202411809052 20241210. The patent p..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has published Huatian Technology Xi'an Co Ltd patent application for Method and System for Automatically Binding Operation Map Coordinate Information of Automatic Chip Mounter and 2D System. The invention was developed by Huang Guoliang and Luo Zongru.
The patent ..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has received Nexus1 Co Ltd patent application for Automatic Illumination Control Device for Wafer Pin-hole Inspection, and Illumination Control Method. Han Sang Ei, Hwang Byoung Moon and Kim Hyun Jung developed the invention.
The patent application number is WO2024KR2..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has received Ge Infrastructure Technology LLC patent application for Enhanced Battery Control Box with Semiconductor Switches for Interfacing of Batteries to Inverters.
The patent application number is WO2025IB62376 20251203. The patent publication number is WO202613..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Anhui Microchip Changjiang Semiconductor Mat Co Ltd patent application for Non-standard Size Sic Wafer Self-adaptive Polishing and Fixing Device Based on Image Recognition and Matching Process of Non-standard Size Sic Wafer Self-adaptive Polishing and Fi..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Suzhou Saierte New Mat Co Ltd patent application for Method for Efficiently Polishing Curved-surface Diamond Wafer and Heterogeneous Grinding Wheel. Wang Kaiping, Lu Jing and Hu Guangqiu developed the invention.
The patent application number is CN2025..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- L&T Semiconductor Tech Limited has submitted a patent application for Identification Power Chip for Grid-integrated Energy Devices. This invention was developed by Carvallo Andres and Sharma Vibhu.
The patent application number is WO2025IB62940 20251216. The patent publication number is WO2026133118 (A1). In..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Kanghao Polymer Mat Science Co Ltd has submitted a patent application for Polishing Device Used for Wafer Polishing and Provided with PBT Film Sponge Disc. This invention was developed by Zhang Huandong, Wan Fangying and Wan Jinxing.
The patent application number is CN202511934256 20251220. The patent publi..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Anhui Xinxin Semiconductor Tech Co Ltd has submitted a patent application for LED Lamp Bead Chip and Support Welding Device. This invention was developed by Li Fei and Hou Xue.
The patent application number is CN202610193662 20260210. The patent publication number is CN121776750 (A). International Patent Cl..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Yiyang Xingzhiyuan Electronic Tech Co Ltd has submitted a patent application for Hole Site Control Auxiliary Device of Thermoelectric Separation Copper Substrate for Integrated Circuit Manufacturing. Liu Jianchun developed the invention.
The patent application number is CN20261022299 20260108. The patent pu..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Cnmc Ningxia New Mat Co Ltd has submitted a patent application for Silver Powder for Conductive Silver Paste of N-type Topcon Battery Under Leco Process and Preparation Method of Silver Powder. This invention was developed by Ma Yan, Liang Beining, Wang Feng, Zheng Wei, Wang Kun, Zhong Xiang and Zhao Jili.
..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Yinchuan Ascendus New Mat Development Co Ltd has submitted a patent application for Green Ceramic Chip Cleaning Device. This invention was developed by Yu Jing, Dai Weiming and Yang Feng.
The patent application number is CN202511265801 20250905. The patent publication number is CN121776186 (A). Internationa..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Zhuiguang Biotechnology Shenzhen Co Ltd patent application for Fluid Static Device for Micro-fluidic Chip Imaging and Micro-fluidic Imaging Method. Zhao Xibo, Xie Hainan, Xie Wei and He Xiangyu developed the invention.
The patent application number is..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Anstem Co Ltd patent application for Method for Manufacturing Semiconductor Module. Asano Masahiko, Shimura Takahiro, Nagasaki Masanori, Ide Eiichi and Tanaka Shintaro developed the invention.
The patent application number is CN202380101560 20231018. ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Medtrum Tech Co Ltd patent application for Multi-substrate Structure Enhanced Analyte Sensor. Yang Cuijun developed the invention.
The patent application number is CN202380101472 20230922. The patent publication number is CN121772869 (A). Internationa..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Nanjing University and Hefei Nat Laboratory patent application for Ceramic Substrate Structure and Integrated Packaging Structure Thereof. Lu Hai, Guo Yue, Ren Fangfang, Zhou Feng, Xu Weizong and Zhou Dong developed the invention.
The patent applicati..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Semikron Danfoss Electronics As patent application for Power Semiconductor Module with Two-part Conduction Device and Equipment with Power Semiconductor Module. Frenznik Eric, Klemm Georg and Holtyes Martin developed the invention.
The patent applicat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Shanghai Weijing Electronic Tech Co Ltd patent application for Chip Planarization Method and Integrated Circuit Chip. Katsura developed the invention.
The patent application number is CN20251235772 20251230. The patent publication number is CN12177271..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Zhang Peng patent application for Wafer Rotating Basket Turning and Taking Mechanism and Wafer Taking Method Thereof.
The patent application number is CN20251219267 20251230. The patent publication number is CN121772672 (A). International Patent Clas..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Changzhou Correll Tech Co Ltd patent application for Automatic Feeding Device Suitable for Miniature Semiconductor Element. Tang Guangming, Tian Jing, Ye Wei and Guo Zhenhua developed the invention.
The patent application number is CN202511919331 2025..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Shenzhen Xintong Electronic Tech Co Ltd patent application for Packaging Method of High-power MOS (metal Oxide Semiconductor) Tube. Wu Junfeng and Ai Shuyi developed the invention.
The patent application number is CN202511941660 20251222. The patent p..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Guilin Xinfeiguang Electronic Tech Co Ltd patent application for Chip on Chip (coc) Patch Modification Mechanism of Die Bonder. Chen Jiangzong, Zhang Haiyong, Wei Wenlong and Liu Jianying developed the invention.
The patent application number is CN202..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Chongqing Xinlian Microelectronic Co Ltd patent application for Method for Ashing Etched Wafer and Semiconductor Dry Etching Equipment. Zhang Nianheng, Fan Guanghao and Cai Xianzhu developed the invention.
The patent application number is CN2025117864..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Wuxi Zhixian Weilai Tech Co Ltd patent application for Correlation Analysis Method for Multi-source Defect Data of Semiconductor Wafer. Guan Jian and Li Yunhao developed the invention.
The patent application number is CN202511766463 20251127. The pate..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Beijing Suanneng Tech Co Ltd patent application for Data Transmission Method Between Chips, Chip and Electronic Equipment. Wang Yiwei, Xue Yunan, Shen Guangchong and Wang Jun developed the invention.
The patent application number is CN202610258457 202..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Power Diamond Systems Inc has sought patent for Diamond Semiconductor Device, Semiconductor Module, and Diamond Semiconductor Device Production Method. This invention was developed by Shoji Shunsuke and Oi Nobutaka.
The patent application number is WO2025JP43600 20251212. The patent publication number is WO2..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Brightplus Oy has sought patent for Recycling Method of a Porous Substrate with a Thermoplastic Coating. This invention was developed by Hannu-kuure Milja, Kuvaja Isto, Marin Tuire, Hietala Maiju, Sääski Jarmo, Mäkimartti Oskari and Leivo Jarkko.
The patent application number is WO2025FI60187 20251219. Th..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Wuxi Jiuxiao Tech Co Ltd has submitted a patent application for Full-automatic Chip Double-sided Detection Device. Chen Wei and Han Zhigang developed the invention.
The patent application number is CN20261034019 20260112. The patent publication number is CN121776138 (A). International Patent Classification ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Liu Huaiying has submitted a patent application for Vamp Automatic Chip Mounter Based on Visual Positioning. This invention was developed by Liu Huaiying.
The patent application number is CN202310399864 20230414. The patent publication number is CN121774293 (A). International Patent Classification codes are..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Guangdong Senlin Greening Co Ltd has submitted a patent application for Mangrove Forest Plant Seedling Substrate and Preparation Method Thereof. This invention was developed by Zhang Xiaowei, Huang Xin, Jiang Xiaolu, Wu Yanan, Wei Junfa, Li Lin and Liang Renzhong.
The patent application number is CN20261026..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Maanshan Green Friend Machine Mfg Co Ltd has submitted a patent application for Self-cleaning Chip Removal Cutting Edge Structure of Pasture Blade. This invention was developed by Hu Jiabing.
The patent application number is CN202610165345 20260205. The patent publication number is CN121773840 (A). Internat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Wuyuan Semiconductor Tech Qingdao Co Ltd has submitted a patent application for Multi-layer Wafer Stacking Structure and Trimming and Packaging Method Thereof. Cao Xuewen, Zhang Yurui and Guo Shunhua developed the invention.
The patent application number is CN20251253401 20251231. The patent publication num..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Shanghai Optical Communication Co Ltd has sought patent for Semiconductor Structure and Preparation Method Thereof, Chip, Integrated Circuit and Electronic Equipment. This invention was developed by Liu Yanhua.
The patent application number is CN202411329542 20240923. The patent publication number is CN1217..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Suzhou Guoxian Innovation Tech Co Ltd has submitted a patent application for Chip Carrier Plate and Manufacturing Method Thereof, and Chip Packaging Structure. Zhou Yanxu developed the invention.
The patent application number is CN202511924182 20251218. The patent publication number is CN121772796 (A). Inte..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Pingtouge Shanghai Semiconductor Technology Co Ltd has submitted a patent application for Interposer, Chip Package Structure and Electronic Device. This invention was developed by Ma Chao and Fu Huili.
The patent application number is CN202511679712 20251114. The patent publication number is CN121772792 (A)..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Shanghai Chuangxian Semiconductor Co Ltd has submitted a patent application for Method for Removing Oxidation Film of Power Semiconductor Wafer. This invention was developed by Zhang Chang, You Haitao, Sun Wenda, Liu Xingquan, Zhang Yihan and Wang Yijia.
The patent application number is CN20251253137 202512..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Jiangxi Deercheng Semiconductor Co Ltd has submitted a patent application for Pre-packaged Chip Heat Dissipation Module. Yao Ruihong, Gyojo Takeru and Yao Ruiqi developed the invention.
The patent application number is CN202511680147 20251117. The patent publication number is CN121772745 (A). International ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Nankang Nanjing Electronic Tech Co Ltd patent application for Preparation Method of Formamide-ethylene Glycol System Al2o3 Film for Semiconductor Product. Zhong Shiwen and Rui Yawen developed the invention.
The patent application number is CN202512362..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Chengdu BOE Optoelectronics Technology and BOE Technology Group patent application for Display Substrate and Display Device. Liu Tingliang, Zhang Yuxin, Zhang Yuanqi and Xu Peng developed the invention.
The patent application number is CN202411376292 ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Suzhou Guoxian Innovation Tech Co Ltd patent application for Solar Cell Module, Preparation Method Thereof and Solar Cell. Li Lianyue developed the invention.
The patent application number is CN202511984457 20251225. The patent publication number is C..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Xixian Tech Co Ltd patent application for Active Heat Dissipation and Positioning Integrated Device of Ultraviolet Led Array for Semiconductor Packaging. Sun Lubin, Xu Qiang, Tao Dongdong, Li Rongrong, Xie Yu, Tian Ziyan, Shen Long and Tian Ruoxian devel..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received 3peak Incorporated patent application for Semiconductor Device, Preparation Method and Integrated Circuit. Cui Yongjiu, Liu Kun, Zhao Yonghao, Ma Xiaobo and Tong Xu developed the invention.
The patent application number is CN20251232170 20251230. The ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Huangshi Yongxinglong Electronics Co Ltd patent application for Printed Circuit Board Electroplating Method and Method for Preventing Printed Circuit Board from Bending. Wu Yongqiang developed the invention.
The patent application number is CN20251191..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Ase Semiconductor Shanghai Co Ltd patent application for Integrated Circuit Board and Integrated Circuit Board Manufacturing Method. Weng Jimeng, Yin Zhihua, Lin Jiade and Chang Chao developed the invention.
The patent application number is CN20261019..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received State Power Invest Group Qinghai Photovoltaic Industry Innovation Center Co Ltd, SPIC Huanghe Hydropower Development, Qinghai Huanghe Hydropower Dev and Photovoltaic Industry Tech Branch Of Qinghai Huanghe Hydropower Development Co Ltd patent application..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- State Intellectual Property Office of China has received Shanghai Fullhan Microelectronics Co Ltd patent application for Image Processing Chip Semi-offline Debugging System and Method Based on Data Reinjection. Ju Caixia, Dong Pengyu, Xue Jiayuan, Wang Xiufeng and Wang Zeyu developed the invention.
The pate..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- World Intellectual Property Organization has received Nordamps AB patent application for Semiconductor Structure Forming a Plurality of Transistors. Tired Tobias, Olson Simon, Saxena Aditya and Vera Edith developed the invention.
The patent application number is WO2025SE51161 20251218. The patent publication..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Beijing Xinji Tech Co Ltd has sought patent for Diamond Glass Composite Substrate and Preparation Method Thereof. This invention was developed by Wang Qi, Yang Xiaoyu and Wang Zhongqiang.
The patent application number is CN202511991162 20251226. The patent publication number is CN121772744 (A). Internationa..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Chongqing Xinlian Microelectronic Co Ltd has sought patent for Forming Method of Interlayer Dielectric Layer and Semiconductor Structure. This invention was developed by Zhao Chunxue and Shi Qingyun.
The patent application number is CN202511771216 20251128. The patent publication number is CN121772717 (A). ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Huatong Xindian Nanchang Electronic Tech Co Ltd has submitted a patent application for Method and Chip for Improving Trap Density of 4h-sic Interface. Liu Kunming, Hou Hancheng, Mao Tonghai and Song Jiaming developed the invention.
The patent application number is CN202511962862 20251224. The patent publica..
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