Semiconductor
| Tue 24 Mar 2026
Geneva, March 24 -- Applied Materials has submitted a patent application for Carbon Gapfill Layer Formation. This invention was developed by Wu Lihua, Kulshreshtha Prashant Kumar, Park Chando, Neelamraju Bharati, Menon Karthik Suresh, Narayanan Rajaram, Hu Liangfa, Dong Yutao, He Lei, Yu Kaili, Ge Zaoyuan, Ha Sungwon and Benjami..