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Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- Wuhan Guide Sensmart Tech has submitted a patent application for Aiming Point Position Memory Backtracking Method and System. Pi Yuhu, Cui Chang Hao, Han Chengde and Huang Sheng developed the invention.
The patent application number is CN202511914596 20251218. The patent publication number is CN122062660 (..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- Forehope Electronic Ningbo Limited Co has submitted a patent application for Sensor Packaging Structure and Preparation Method Thereof. This invention was developed by He Zhenghong and Jiang Ruidong.
The patent application number is CN202610526555 20260421. The patent publication number is CN122079059 (A)...
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- Nanchang Shineon Photoelectric Tech Co Ltd has submitted a patent application for Cutting Fluid and Application and Device of Cutting Fluid in Cutting of Chip-scale Packaged LED (light-emitting Diode). This invention was developed by Fan Zhencan, Yuan Haibo and Zhu Lei.
The patent application number is CN2..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Toshiba Electronic Devices & Storage Corp and Toshiba have filed a patent application for Semiconductor Device and Method for Manufacturing Semiconductor Device. This invention was developed by Ezaki Akira and Okuyama Hiroki.
The patent application number is US202519355873 20251010. The patent publicati..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- The Florida International Univ Board Of Trustees and Applied Materials have filed a patent application for Power Delivery for AI Computing with Orthogonal Embedding and Edge Access. This invention was developed by Kengeri Subramani, Pulugurtha Markondeyaraj, Pial Mohammad Mohtasim Hamid, Al Duhni Ghaleb Sa..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Nagano Prefecture and Takano have submitted a patent application for Surface Treatment Method for Silicon Body and Method of Manufacturing Silicon Structural Body. This invention was developed by Sato Akira and Mizusaki Hideaki.
The patent application number is US202319149853 20231219. The patent public..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Soitec and Commissariat a Ienergie Atomique Et Aux Energies Alternatives have submitted a patent application for Method for Producing a Semiconductor Structure Comprising an Interface Region Including Agglomerates. This invention was developed by Radu Ionut, Gaudin Gweltaz, Fournel Franck, Widiez Julie and..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Research & Business Foundation Sungkyunkwan Univ and Samsung Electronics have filed a patent application for Electronic Device and Method for Generating Compact Model of Semiconductor Device Including Two-dimensional Material and Contact Metal. This invention was developed by Ha Yoonhoo, Shim Jaewoo, Jang ..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- Univ Libre De Bruxelles and Univ Norbert Zongo have submitted a patent application for Method for Leaching Gold from a Gold-bearing Substrate. Doneux Thomas, Bougouma Moussa, Soma Fousseni and Herman Claudine developed the invention.
The patent application number is US202419153935 20240214. The patent p..
Semiconductor
| Mon 10 Aug 2026
Alexandria, Aug. 11 -- The Regents Of The Univ Of Michigan and University of Rochester have submitted a patent application for Digital Molecular Fingerprinting on Organ on a Chip Systems. This invention was developed by Singer Benjamin H, Stephens Andrew, Mcgrath James L, Song Yujing, Su Shiuan-haur and Kurabayashi Katsuo.
Th..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- Suzhou Chengjun Semiconductor Equipment Co Ltd has submitted a patent application for Automatic Powder Supplementing Device for Silicon Carbide Crystal Growing Furnace. Dong Jianshu and Cheng Shishu developed the invention.
The patent application number is CN202610413529 20260331. The patent publication nu..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- Fujian Fushun Microelectronics Co Ltd has sought patent for Silicon Wafer Back Crystal Growth Prevention Air Curtain Isolation Device for Thick Epitaxial Growth. This invention was developed by Zheng Yi, Lin Ligui, Xiong Aihua and Mei Haijun.
The patent application number is CN202610512725 20260417. The pa..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- Zhongtian Jingke Ningbo Semiconductor Mat Co Ltd has submitted a patent application for Preparation Method and Preparation Device of Silicon Carbide Single Crystal and Silicon Carbide Single Crystal. Chen Dou, Tang Jun, Ma Yuan, Guan Weiwei, Pan Yaobo, Xue Weiming and Vouret developed the invention.
The pa..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has published Zhongtian Jingke Ningbo Semiconductor Mat Co Ltd patent application for Crucible for Silicon Carbide Crystal Growth and Silicon Carbide Crystal Growth Method. The invention was developed by Chen Dou, Tang Jun, Guan Weiwei, Pan Yaobo, Xue Weiming and Vo..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has published Jiangsu Tianke Heda Semiconductor and Beijing Tankeblue Semiconductor patent application for Method for Reducing Silicon Carbide Crystal Defects. The invention was developed by Zhou Xing, Sun Peiran, Peng Tonghua, Yang Jian, Lou Yanfang, Zhang Ping, Zo..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- Shenzhen Icreate Tech Co Ltd has submitted a patent application for Anode Plate and Horizontal Pulse Electroplating Anode Device. Zheng Liejian and Wang Zheng developed the invention.
The patent application number is CN202610127022 20260129. The patent publication number is CN122082078 (A). International P..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has published Dongguan Yuanxin Semiconductor Co Ltd patent application for Semiconductor Electroplating Method and System. The invention was developed by Chen Min, Xia Nengli and Lim Chun-woo.
The patent application number is CN202610407233 20260331. The patent p..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- Hunan Lianchuangxing Electronic Tech Co Ltd has filed a patent application for Double-sided Multi-layer PCB Electroplating Equipment and Process. This invention was developed by Cheng Jun and Xie Tuanying.
The patent application number is CN202610158780 20260204. The patent publication number is CN12208207..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has published Xindong Micro Shanghai Semiconductor Tech Co Ltd patent application for Electroplating Equipment and Method for Isolating External Oxygen and Prolonging Service Life of Circulating Electroplating Liquid. The invention was developed by Wei Yongyan, Yin ..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has received Riyuexin Advanced Tech Research Kunshan Co Ltd patent application for Novel Integrated Circuit Electroplating Method. Ling Jian developed the invention.
The patent application number is CN202610178229 20260208. The patent publication number is CN1220..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- Shanghai Hedong Electronic Material has submitted a patent application for Gas Uniformizing Assembly, Semiconductor Process Chamber and Semiconductor Thin Film Deposition Equipment. This invention was developed by Jia Shijun, Sun Yuanjun and Pang Bo.
The patent application number is CN202610294465 20260311. ..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- Jiaji Huankong Xian Tech Co Ltd has submitted a patent application for Plasma Enhanced Chemical Vapor Deposition Method and Device. Kim Dong-gyu, Tang Mingwei and Kim Tae-geon developed the invention.
The patent application number is CN202610562578 20260427. The patent publication number is CN122081901 (A)..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- Inner Mongolia Zhongqi Core Mat Co Ltd has submitted a patent application for Deposition Equipment Based on Diamond Semiconductor Wafer. Zhao Jianbo, Tian Jingfeng and Zhao Chunxia developed the invention.
The patent application number is CN202610437211 20260403. The patent publication number is CN12208189..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- Jiaji Huankong Xi'an Tech Co Ltd has sought patent for Method and Device for Performing Chemical Vapor Deposition on Wafer. This invention was developed by Kim Dong-gyu, Ren Mengyuan and Park Jong-oh.
The patent application number is CN202610554252 20260424. The patent publication number is CN122081890 (A)..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has received Anhui University patent application for Medium-temperature-zone High-performance N-type Mg3Sb2-based Magnetic Nano Composite Thermoelectric Material and Preparation Method Thereof. Qian Jun, Gao Yan, Song Jiming, Xu Qing, Li Zhou and Fang Xianxian devel..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- Heshengyuan Packaging Mat Xuzhou Co Ltd has sought patent for Substrate Size Measuring Device for Packaging Bag Processing. This invention was developed by Lee Ha-ha.
The patent application number is CN20261087270 20260122. The patent publication number is CN122083869 (A). International Patent Classificati..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has published Jierlin Chongqing New Energy Tech Co Ltd patent application for Automatic Detection Manipulator for Integrated Circuit Pins. The invention was developed by Li De.
The patent application number is CN202610356350 20260323. The patent publication numbe..
Semiconductor
| Tue 11 Aug 2026
Geneva, Aug. 12 -- VON ARDENNE Asset has submitted a patent application for Substrate, Method and Manufacturing Device for Manufacturing the Substrate. Wemme Alexander, Deus Carsten, Busch Alexander, Niederhausen Thomas, Kús Peter, Hrbek Tomás, MatolÃnová Iva and Himmler Anja developed the invention.
The patent applicatio..
Semiconductor
| Tue 11 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has released ROCKWOOL patent application for Growth Substrate. This invention was developed by Van Benthem Rudolfus Antonius, De Carvalho Esteves Ana Catarina and Moone Luuk.
The patent application number is WO2026EP52312 20260129. The patent publication number is WO20..
Semiconductor
| Tue 11 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has received Infineon Technologies patent application for Amplifier Circuit Having a Coil Structure with Mutually Inductively Coupled Coils. Musolff Christian developed the invention.
The patent application number is WO2026EP51852 20260126. The patent publication numbe..
Semiconductor
| Tue 11 Aug 2026
Geneva, Aug. 12 -- ASML Netherlands has submitted a patent application for Optical Assembly. This invention was developed by Scheffers Paul, Bastiaans Koen, Overes Frank, Del Tin Laura and Koning Johan.
The patent application number is WO2026EP50693 20260113. The patent publication number is WO2026162288 (A1). International Pat..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has received Suzhou Henteen Environmental Protection Engineering patent application for Waste Gas Combustion Furnace for Semiconductor Production. Sun Ping developed the invention.
The patent application number is CN202610532613 20260421. The patent publication num..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has released State Power Investment Heli Electric Wuxi Tech Co Ltd patent application for Microwave Plasma Semiconductor Tail Gas Treatment Device and Control Method Thereof. This invention was developed by Wang Xiaohui, Ishizuki So, Wang Zhiyu, Chen Yusong, Li Bao,..
Semiconductor
| Tue 11 Aug 2026
Geneva, Aug. 12 -- ASML Netherlands has submitted a patent application for Method for Bonding Semiconductor Substrates. Warming Till, Burgarth Volker, Blumberg Christian, Kieven David and Von Morze Natascha developed the invention.
The patent application number is WO2026EP50222 20260107. The patent publication number is WO20261..
Semiconductor
| Tue 11 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has released ASML Netherlands patent application for Semiconductor Substrate Handling System. This invention was developed by Harrold George, Wade Robert and Wiener Roberto B.
The patent application number is WO2026EP50091 20260106. The patent publication number is WO2..
Semiconductor
| Tue 11 Aug 2026
Geneva, Aug. 12 -- ASML Netherlands has sought patent for Actuators with Integrated Air Bearings in a Semiconductor Manufacturing Apparatus. This invention was developed by Verma Arjun, Finney Nathan, Chillara Venkata, Kelley John and Shin Taehee.
The patent application number is WO2026EP50090 20260106. The patent publication n..
Semiconductor
| Tue 11 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has published ASML Netherlands patent application for Die Carrier. The invention was developed by Seijger Olav and Dekkers Jeroen.
The patent application number is WO2026EP50085 20260106. The patent publication number is WO2026162252 (A1). International Patent Classifi..
Semiconductor
| Tue 11 Aug 2026
Geneva, Aug. 12 -- ASML Netherlands has submitted a patent application for Method for Determining Correction Weights. This invention was developed by Passariello Jansen Juliette Marie, Goorden Sebastianus and Donkerbroek Arend.
The patent application number is WO2026EP50040 20260105. The patent publication number is WO202616224..
Semiconductor
| Tue 11 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has released ASML Netherlands patent application for Die-to-wafer Bonding Process. This invention was developed by Venugopalan Syam Parayil, Vromen Joost and Wang Sheng.
The patent application number is WO2025EP88154 20251218. The patent publication number is WO2026162..
Semiconductor
| Tue 11 Aug 2026
Geneva, Aug. 12 -- ASML Netherlands has submitted a patent application for Apparatus and Method for Quantifying a Lateral Etch Depth. This invention was developed by Hinterding Stijn, Ozturk Fahri Emre, Tarabrin Sergey and Nayak Deepak.
The patent application number is WO2025EP87607 20251217. The patent publication number is WO..
Semiconductor
| Tue 11 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has released Wacker Chemie AG patent application for Roller for a Roll Crusher for Comminution of Semiconductor Material. This invention was developed by Mattes Joachim, Grübl Peter, Öchsner Eva and Pech Reiner.
The patent application number is WO2025EP52708 20250203..
Semiconductor
| Tue 11 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has released Texas Instruments patent application for Electronic Device and Method of Singulating. This invention was developed by Liao Liu, Wyant Michael, Guo Qi, He Shan and Brija Danny.
The patent application number is WO2026US12615 20260127. The patent publicatio..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- Hunan Zerui New Mat Co Ltd has submitted a patent application for Preparation Method of Silicon Carbide Fiber with In-situ Boron Nitride Coating on Surface. Yi Jun, Tang Yun and Huang Xiaozhong developed the invention.
The patent application number is CN202610257922 20260304. The patent publication number ..
Semiconductor
| Tue 11 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has released Chengdu Zhongwei Crystal Mat Co Ltd patent application for Semiconductor Surface Treating Agent, Application Thereof and Silicon Carbide Laser Modified Layer Stripping Method. This invention was developed by Guo Meng, Yang Shuangze and Yang Huai.
The..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has released Hitachi High Technologies patent application for Semiconductor Information Provision Method and Semiconductor Information Provision System. This invention was developed by Senuma Yuhei, Okuda Tomoyuki, Li Yuan and Yamauchi Toshinori.
The patent applicati..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Sharp has submitted a patent application for Conductive Element Substrate and Method for Manufacturing Same. Suga Katsuyuki developed the invention.
The patent application number is WO2025JP02785 20250129. The patent publication number is WO2026163305 (A1). International Patent Classification codes are H10K..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Mitsubishi Electric has submitted a patent application for Modulator-integrated Semiconductor Laser Element and Method for Producing Modulator-integrated Semiconductor Laser Element. Hokama Yohei, Watatani Chikara and Tsuji Toshiya developed the invention.
The patent application number is WO2025JP02724 2025..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has received Beijing Semiconductor Special Equipment Research Inst The 45th Research Inst Of China Electronics Te patent application for Multi-path Air Pressure Acquisition System, Method and Equipment of Semiconductor Equipment and Medium. Jin Hanyi, Jing Haishi an..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- Beijing Automation Control Equipment Inst has sought patent for High-precision Silicon Piezoresistive Sensitive Film and Design Method Thereof. This invention was developed by Zu Jianjing, Zhu Xiao, Yu Zhangze and Bai Nan.
The patent application number is CN20251238786 20251231. The patent publication numb..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Semiconductor Energy Laboratory has submitted a patent application for Semiconductor Device and Semiconductor Device Production Method. This invention was developed by Ikezoe Satoshi, Jintyou Masami, Shingu Takashi, Koezuka Junichi, Yamade Naoto, Kakehata Tetsuya and Noguchi Kenichi.
The patent application nu..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Semiconductor Energy Laboratory has submitted a patent application for Light-emitting Device. This invention was developed by Kawata Takuya, Kimura Kunio and Ikeda Hisao.
The patent application number is WO2026IB50680 20260126. The patent publication number is WO2026163060 (A1). International Patent Classific..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Semiconductor Energy Laboratory has submitted a patent application for Semiconductor Device. This invention was developed by Kawashima Susumu, Shishido Hideaki, Kusunoki Koji, Uochi Hideki and Saito Motoharu.
The patent application number is WO2026IB50678 20260126. The patent publication number is WO202616305..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Semiconductor Energy Laboratory has filed a patent application for Semiconductor Device. This invention was developed by Kusunoki Koji and Watanabe Kazunori.
The patent application number is WO2026IB50677 20260126. The patent publication number is WO2026163057 (A1). International Patent Classification codes a..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has released Semiconductor Energy Laboratory patent application for Electronic Apparatus. This invention was developed by Kamada Taisuke, Nakamura Daiki and Kubota Daisuke.
The patent application number is WO2026IB50676 20260126. The patent publication number is WO2026..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- Beijing Inst Technology has sought patent for View Field Modulation Hyperspectral Imaging Technology Based on MEMS Micromirror Array. This invention was developed by Liu Qiangqiang, Chi Kunping, Zhou Yanchen, Ni Jihui and Xie Huikai.
The patent application number is CN202610331333 20260318. The patent publ..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- The 715th Research Inst Of China State Shipbuilding Corporation Limited has applied Chinese patent for Hot-wire Type MEMS Underwater Acoustic Sensor Self-calibration Method Based on Thermoacoustic Effect. Tong Haoyang, Cao Meng, Cao Zeng and Chen Yi developed it.
The patent application number is CN20261082..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- Ningbo Research Inst Northwestern Polytechnical University has submitted a patent application for Low-pressure-drop Runner Assembly for Thermal Flow Sensing Chip. This invention was developed by Li Jiayao, Yan Yuchao, Chang Honglong, Deng Jinjun and Feng Lufan.
The patent application number is CN2026105266..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Browning Raymond has submitted a patent application for Photoelectron Wafer Inspection Tool.
The patent application number is WO2025IB51118 20250203. The patent publication number is WO2026162971 (A1). International Patent Classification code is H01J37/285. Cooperative Patent Classification codes are H01J2..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- Chongqing Zixingzhe Tech Co Ltd has sought patent for Packaging Structure Suitable for Silicon Optical Gyroscope Under Middle and High Pressure and Packaging Process Thereof. This invention was developed by Zou Wei, Liu Wenxuan, Xu Wenyuan, Ren Zhuoheng, Yu Huaiyong, Yuan Dequan and Pan Yang.
The patent ap..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- Northeastern University has filed a patent application for Laser Cladding Crack Inhibition Method Based on Prefabricated Stress Release Structure and Substrate Structure. This invention was developed by Kim Cheon-young, Xiang Dingding, Yan Jiahao, Li Yongsheng and Jin Jie.
The patent application number is CN..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- Shenzhen Nashe Intelligent Equipment Co Ltd has submitted a patent application for Supporting Structure and Chemical Vapor Deposition Reaction Equipment. This invention was developed by Zhong Guofang, Huang Shuaishuai, Liu Lianghui, Xiao Yunzhang and Chen Bingan.
The patent application number is CN20261023..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- BOE Huacan Optoelectronics Guangdong Co Ltd has submitted a patent application for Graphite Plate and Metal Organic Compound Chemical Vapor Deposition Equipment. This invention was developed by Mao Jiatian, Zhou Xuyang, Qu Limin and Chen-zhang Xiaoxiong.
The patent application number is CN202511840455 2025..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has received Wuxi China Resources Microelectronics Co Ltd patent application for Spray Head and Processing Method Thereof, Reaction Chamber of Semiconductor Machine and Film Forming Method in Reaction Chamber. Zhang Jian and Jin Xingcheng developed the invention.
..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has released Shenzhen Maike Shiwei Tech Co Ltd patent application for Protective Layer for Enhancing OLED Mask Technology Durability. This invention was developed by Li Shiyun.
The patent application number is CN202511685928 20251118. The patent publication numbe..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has published Sunplus Tech Co Ltd and Gao Xiteng patent application for African Swine Fever Virus Detection Chip and Application Thereof. The invention was developed by Lin Weihao, Li Yichan, Jung Chae-hwa, Qiu Mingtang, Ren Shuyi and Gao Xiteng.
The patent appli..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has published Resonac patent application for Resin Composition and Power Semiconductor Device. The invention was developed by Nagashima Kazushi and Nozaki Akihiro.
The patent application number is WO2025JP03443 20250203. The patent publication number is WO2026163424 (A..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Resonac has applied WIPO patent for Resin Composition and Power Semiconductor Device. Nagashima Kazushi and Nozaki Akihiro developed it.
The patent application number is WO2025JP03442 20250203. The patent publication number is WO2026163423 (A1). International Patent Classification code is C08G59/18.
The abs..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has published Resonac patent application for Sealing Resin Composition and Power Semiconductor Device. The invention was developed by Nagashima Kazushi and Yamaura Masashi.
The patent application number is WO2025JP03441 20250203. The patent publication number is WO2026..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Mitsubishi Electric has sought patent for Semiconductor Optical Integrated Element and Method for Manufacturing Semiconductor Optical Integrated Element. This invention was developed by Nagira Takashi, Matsumoto Keisuke and Kuramoto Kyosuke.
The patent application number is WO2025JP03432 20250203. The paten..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Kokusai Electric has submitted a patent application for Substrate Processing Method, Semiconductor Device Production Method, Program, and Substrate Processing Device. This invention was developed by Horii Sadayoshi, Karasawa Koichi, Ueda Tatsushi and Kakuda Toru.
The patent application number is WO2025JP03418..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Toyotsu Vehitecs Co Ltd has submitted a patent application for Photocurable Resin Containing Soft-magnetic Material and Method for Forming Photocurable Resin Containing Soft-magnetic Material on Substrate. This invention was developed by Nakagawa Masanori, Tani Naoki and Ito Ryuichi.
The patent application ..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- JSG Japan Co Ltd has submitted a patent application for Silicon Nitride Substrate Manufacturing Method and Silicon Nitride Substrate. This invention was developed by Kusano Dai and Chen Xianbing.
The patent application number is WO2025JP03265 20250131. The patent publication number is WO2026163386 (A1). Int..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Kokusai Electric has submitted a patent application for Processing Device, Substrate Processing Device, Display Method, Semiconductor Device Manufacturing Method, and Program. This invention was developed by Yamaoka Yuji and Seki Takatoshi.
The patent application number is WO2025JP03055 20250130. The patent p..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has released Suzhou Zhongju Kexin Tech Co Ltd patent application for Equipment for Growing Silicon Carbide Crystals. This invention was developed by Dai Xiaosong, Sun Xiaoxiao, Zhang Yongwei and Wei Dayong.
The patent application number is CN202610182119 20260209..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- Jiangsu Wuxi Jingwei Tiandi Semiconductor Tech Co Ltd has submitted a patent application for Wafer Processing Method and Device and Electroplating Equipment. This invention was developed by Gu Rui, Han Yanfen and Liang Defu.
The patent application number is CN202610143645 20260202. The patent publication n..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- Fulongjie Suzhou Hydrogen Energy Tech Co Ltd has applied Chinese patent for Tool for Electroplating Electrode Net. Tang Yazhong, Qin Nan, Zhou Junjian, Wang Yanyue and Liu Pan developed it.
The patent application number is CN202610340236 20260319. The patent publication number is CN122061237 (A). Internati..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- Ningbo Riyue Electric Wire & Cables Mfg Co Ltd has submitted a patent application for Wire Electroplating Equipment for Cable Manufacturing and Use Method of Wire Electroplating Equipment. Ying Cunshi and Zhang Aihong developed the invention.
The patent application number is CN202610110516 20260127. The pa..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has published SCREEN Holdings patent application for Substrate Treatment Method, Substrate Treatment Device, and Substrate Treatment Solution. The invention was developed by Okusa Aoi and Sasaki Yuta.
The patent application number is WO2025JP38574 20251104. The patent ..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has published Kokusai Electric patent application for Substrate Processing Device, Substrate Processing Method, Production Method for Semiconductor Device, and Program. The invention was developed by Yanagisawa Yoshihiko and Sakano Atsuya.
The patent application number..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Panasonic Intellectual Property Management has applied WIPO patent for Chip Collection Device and Chip Collection Method. Ishitani Yasuyuki developed it.
The patent application number is WO2025JP36712 20251017. The patent publication number is WO2026163527 (A1). International Patent Classification code is H..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has released Kokusai Electric patent application for Film Formation Reaction Analysis Method, Substrate Processing Method, Semiconductor Device Manufacturing Method, Program, Substrate Processing Device, and Film Formation Reaction Analysis System. This invention was de..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has released Kokusai Electric patent application for Processing Method, Semiconductor Device Manufacturing Method, Program, and Processing Device. This invention was developed by Yamazaki Hirohisa.
The patent application number is WO2025JP33931 20250925. The patent pub..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Hamamatsu Photonics has submitted a patent application for Laser Processing Method, Method for Manufacturing Semiconductor Device, and Laser Processing Device. This invention was developed by Korematsu Katsuhiro, Mitsuyama Yasuhiro and Sakamoto Takeshi.
The patent application number is WO2025JP33593 20250924...
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- Core Photoelectric Tech Shandong Co Ltd has submitted a patent application for Wafer High-temperature Diffusion Furnace and Wafer High-temperature Processing Technology Based on Silicon Wafer Clamp. This invention was developed by Cao Xuelei and Zhang Wanchang.
The patent application number is CN2026104550..
Semiconductor
| Wed 12 Aug 2026
Beijing, Aug. 12 -- State Intellectual Property Office of China has released Huahong Semiconductor Mfg Wuxi Co Ltd and Huahong Semiconductor, Wuxi patent application for Polycrystalline Silicon Thin Film Deposition Method. This invention was developed by Liu Yaohua, Guo Zongtao, Gao Feng, Jin Chuangxin, Zhang Bin and Wu Jiahui.
..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Socionext has submitted a patent application for Semiconductor Integrated Circuit Device. Ono Masachika developed the invention.
The patent application number is WO2026JP01100 20260115. The patent publication number is WO2026163835 (A1). International Patent Classification codes are H10D84/83, H10D84/85 and H..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Tokyo Electron has submitted a patent application for Plasma Processing System, Device for Detecting End Point of Plasma Processing, and Method for Detecting End Point of Plasma Processing. Sugita Kippei and Shimatsu Yuhei developed the invention.
The patent application number is WO2026JP01021 20260115. The p..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Tokyo Electron has sought patent for Etching Method and Plasma Treatment Device. This invention was developed by Arima Noriyoshi and Mukaiyama Koki.
The patent application number is WO2026JP01016 20260115. The patent publication number is WO2026163826 (A1). International Patent Classification code is H10P50/2..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Tokyo Electron has submitted a patent application for Plasma Processing System and Pressure Control Method. This invention was developed by Sugawara Eiichi.
The patent application number is WO2026JP00979 20260115. The patent publication number is WO2026163822 (A1). International Patent Classification code is ..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has released Tokyo Electron patent application for Electrostatic Chuck. This invention was developed by Tomioka Taketoshi.
The patent application number is WO2026JP00969 20260115. The patent publication number is WO2026163817 (A1). International Patent Classification c..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Murata has applied WIPO patent for Multilayer Substrate and Electronic Device. Hoshiba Hiroyuki, Yosui Kuniaki and Ichikawa Keiichi developed it.
The patent application number is WO2026JP00793 20260114. The patent publication number is WO2026163807 (A1). International Patent Classification code is H05K1/02...
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has received National Inst Of Advanced Industrial Science and Technology patent application for Device and Method for Manufacturing Perovskite Solar Cells, and Substrate Tray. Ohashi Yusuke, Murakami Takurou, Bamba Noboru, Kitano Masahiro, Yamamoto Kohei and Zhao Baibin..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has published Tokyo Electron patent application for Processing Device, Processing System, and Method for Controlling Processing Device. The invention was developed by Zaizen Hiroshi and Kodama Munehisa.
The patent application number is WO2025JP45551 20251225. The paten..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Murata has submitted a patent application for Ltcc Substrate Module. This invention was developed by Yamamoto Tomoki and Nagata Tsuyoshi.
The patent application number is WO2025JP44096 20251217. The patent publication number is WO2026163688 (A1). International Patent Classification codes are H05K1/11, H05K3..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Nihon Micronics has applied WIPO patent for Probe. Kishi Yasutaka and Wakazawa Masahiro developed it.
The patent application number is WO2025JP43874 20251216. The patent publication number is WO2026163678 (A1). International Patent Classification code is G01R1/067.
The abstract of the patent published b..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- World Intellectual Property Organization has received Tasmit Inc and Toray Engineering patent application for Substrate Holding Device. Ochi Tatsuya developed the invention.
The patent application number is WO2025JP43486 20251212. The patent publication number is WO2026163656 (A1). International Patent Clas..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Furukawa Electric has submitted a patent application for Optical Semiconductor Element and Method for Producing Optical Semiconductor Element. This invention was developed by Kiyota Kazuaki and Nishizawa Yo.
The patent application number is WO2025JP43224 20251211. The patent publication number is WO2026163652..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Fuji Electric has applied WIPO patent for Semiconductor Device and Method for Manufacturing Semiconductor Device. Yoshikawa Koh developed it.
The patent application number is WO2025JP43183 20251210. The patent publication number is WO2026163651 (A1). International Patent Classification code is H10D12/00.
Th..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Fujifilm has submitted a patent application for Treatment Solution for Semiconductor Device, Method for Producing Treatment Solution, Method for Treating Object to be Treated, and Method for Producing Semiconductor Device. This invention was developed by Ohtsu Akihiko, Takahashi Tomonori and Takahashi Kazutaka..
Semiconductor
| Wed 12 Aug 2026
Geneva, Aug. 12 -- Panasonic Intellectual Property Management has filed a patent application for Photosensitive Resin Composition, and Resin-attached Film, Resin-attached Metal Foil, Wiring Board and Semiconductor Device Using Same. This invention was developed by Uraoka Yusuke, Yamaguchi Atsushi, Kurizoe Junko and Kuroda Maki.
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