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20:14:07 Wed 12 Aug 2026

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News For Last 1 Week

Industry

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(43)

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(40)

(34)

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(34)

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(31)

Micron Technology

(29)

(26)

Applied Materials

(19)

STMicroelectronics Intern

(19)

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(18)

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(17)

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(16)

Taiwan Semiconductor Manu

(16)

Huawei Technologies

(15)

Texas Instruments

(13)

Yangtze Memory Technologi

(13)

Kokusai Electric

(12)

Realtek Semiconductor Cor

(12)

Semiconductor Components

(12)

Mitsubishi Electric

(11)

Semiconductor Energy Labo

(11)

(10)

(10)

GlobalFoundries

(9)

SCREEN Holdings

(9)

ASEN Semiconductors Suzho

(8)

Applied Materials Inc [us

(8)

Infineon Technologies

(8)

Infineon Technologies, Au

(8)

(8)

STMicroelectronics Intern

(8)

Sandisk Technology

(8)

(8)

Beijing NAURA Microelectr

(7)

ChangXin Technology Group

(7)

(7)

Rongyao Terminal

(7)

Sony Semiconductor Soluti

(7)

Spreadtrum Semiconductor

(7)

Winbond Electronics

(7)

Huahong Semiconductor Mfg

(6)

Micron Technology Inc [us

(6)

(6)

(5)

Fujian Jinhua Integrated

(5)

Hangzhou Firstack Tech Co

(5)

Spreadtrum Communications

(5)

Taiwan Semiconductor Manu

(5)

Zhejiang Liufang Semicond

(5)

Baoding City Putianao Ele

(4)

Beijing Integrated Circui

(4)

Beijing Unisoc Communicat

(4)

Beijing Xiaomi Mobile Sof

(4)

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(4)

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(4)

Hamamatsu Photonics

(4)

Hefei Nexchip Integrated

(4)

(4)

Microchip Technology

(4)

NuFlare Technology

(4)

Semiconductor Manufacturi

(4)

Shanghai Huahong Grace Se

(4)

Shengjisheng Korea Semico

(4)

Shenzhen Hongxin Microass

(4)

SiEn QingDao Integrated C

(4)

Suzhou Guoxian Innovation

(4)

Wuhan DR Laser Technology

(4)

Alpha and Omega Semicondu

(3)

BOE Technology Group

(3)

BOE Technology Group Co L

(3)

Beijing Chaoxian Memory R

(3)

Beijing Xuanjie Technolog

(3)

CSMC Technologies

(3)

Chengdu Boe Optoelectroni

(3)

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(3)

EV Group E Thallner

(3)

Forehope Semiconductor Ni

(3)

Harbin Inst Of Technology

(3)

Hitachi High Technologies

(3)

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(3)

Huahong Semiconductor, Wu

(3)

IRICO Hefei LCD Glass

(3)

Infineon Tech Americas Co

(3)

Institute of Semiconducto

(3)

Jiaji Huankong Xian Tech

(3)

Jingling Ningbo New Energ

(3)

Jinhua Hongrui Electronic

(3)

Lisen Noco Company

(3)

Maxone Semiconductor Suzh

(3)

(3)

(3)

(3)

Nuvoton Technology

(3)

Renesas Electronics

(3)

(3)

Robert Bosch Co Limited

(3)

(3)

SK Hynix Nand Product Sol

(3)

SanDisk Technologies

(3)

Shandong Yunhai Guochuang

(3)

Shanghai Huahong Grace Se

(3)

Shenzhen Dapu Microelectr

(3)

Taiwan Semiconductor Co L

(3)

United Microelectronics C

(3)

University of Electronic

(3)

Wuhan Chuxing Technology

(3)

Xiaomi Automobile Technol

(3)

Zhejiang Ruitaixin Machin

(3)

ACM Research, Shanghai

(2)

ASM International Holding

(2)

Advanced Micro Devices

(2)

Anhui Lianghuo Semiconduc

(2)

Anhui University

(2)

(2)

(2)

BOE Technology Group; Bei

(2)

Beijing Boe Tech Developm

(2)

Beijing Inst Technology

(2)

Beijing Institute of Mech

(2)

Beijing Superstring Acade

(2)

Beijing University

(2)

Beijing Xingyun Integrate

(2)

Beijing Xinli Tech Innova

(2)

Beijing Yimeinuo Biotechn

(2)

Beijing Ziguang Qingteng

(2)

Chipone Technology, Beiji

(2)

Cnbm Zhejiang Material Te

(2)

Ferrotec Jiangsu Quartz T

(2)

Forehope Electronic Ningb

(2)

(2)

Gexin USA Integrated Circ

(2)

GigaDevice Semiconductor

(2)

Guangdong Aiko Solar Ener

(2)

Guangdong OPPO Mobile Tel

(2)

Guangxi Huaxin Zhenbang S

(2)

(2)

Hangzhou Fullsemi Semicon

(2)

Hangzhou Shuotian Tech Co

(2)

Hangzhou Weiheng Tech Co

(2)

Harbin Keyou Semiconducto

(2)

Hefei Haitu Microelectron

(2)

Heraeus Electronics

(2)

Hoergel Juergen [de]; Hua

(2)

Hoya Lens Thailand Ltd [t

(2)

Huaneng Jiayuguan New Ene

(2)

Hubei Jiangcheng Chip Pil

(2)

Hubei Xinqing Tech Co Ltd

(2)

(2)

(2)

(2)

Institute of Microelectro

(2)

International Business Ma

(2)

JSR Corporation

(2)

Jiangsu Leadmicro Nano Te

(2)

Jiangsu Third Generation

(2)

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(2)

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(2)

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(2)

Jiangxi Power Investment

(2)

Jiaxing Jingfeng Tongchua

(2)

Jixin Tuofang Tech Shangh

(2)

Kunshan Sokay Automation

(2)

(2)

Lam Res Corp [us]; Lam Re

(2)

Lianshuo Semiconductor Te

(2)

(2)

(2)

Nantong Limeng New Materi

(2)

(2)

Nanya Technology

(2)

Ningbo All Semi Micro Ele

(2)

Ningbo Inst Materials Tec

(2)

Novatek Microelectronics

(2)

Ookuma Diamond Device Co

(2)

Panasonic Intellectual Pr

(2)

Powerchip Semiconductor M

(2)

(2)

Quanzhou Sanan Semiconduc

(2)

Riyuexin Advanced Tech Re

(2)

Rtm Inc [kr]; PSK Inc

(2)

SAE Technologies Developm

(2)

Samsung Display

(2)

Shaanxi Photoelectron Lea

(2)

Shandong Inspur Science R

(2)

Shandong Liguan Microelec

(2)

Shandong University

(2)

Shanghai Bangxin Semicond

(2)

Shanghai Jingji Micro Sem

(2)

Shanghai New Silicon Poly

(2)

Shanghai Xinliji Semicond

(2)

(2)

Shenzhen Liande Semicondu

(2)

Shenzhen Pengxinwei Integ

(2)

Shenzhen Sts Microelectro

(2)

Sumitomo Electric Industr

(2)

Taiwan Semiconductor Manu

(2)

Tianjin Lantian Solar Tec

(2)

Tokyo Electron Ltd [jp];

(2)

(2)

Toshiba Electronic Device

(2)

(2)

(2)

Tsinghua University

(2)

Western Digital Tech Inc

(2)

(2)

(2)

Wuhan Xinxin Semiconducto

(2)

Xi\'an Jiaotong Universit

(2)

Xiamen Sky Semiconductor

(2)

Xian Xinxin Material Tech

(2)

Xincun Technology (Wuhan)

(2)

Xinsheng Intelligent Tech

(2)

Zhejiang Chuanghao Semico

(2)

Zhongke Xinci Tech Zhuhai

(2)

Zhongmao Green Energy Tec

(2)

Zhongtian Jingke Ningbo S

(2)

ams-OSRAM International

(2)

58th Research Inst Of Cet

(1)

(1)

AMS Sensors USA

(1)

(1)

AUO Corporation

(1)

Adeia Semiconductor Bondi

(1)

Advanced Micro Fabricatio

(1)

Advanced Semiconductor En

(1)

Aiwoge Sensing Tech Wuxi

(1)

Akm Electronics Ind Panyu

(1)

Alcatel Submarcom

(1)

(1)

Amer Tech Co Ltd

(1)

Amphenol Canada Corp

(1)

(1)

(1)

Angkun Vision Beijing Tec

(1)

Anhui Changfei Advanced S

(1)

Anhui Hoivway Optoelectro

(1)

Anhui Huaxi Semiconductor

(1)

Anhui Huaxin Micro Nano I

(1)

Anhui Jingtian New Energy

(1)

Anhui Jinshi Super Hard N

(1)

Anhui Lianpeng Zhilian Te

(1)

Anhui Microchip Changjian

(1)

Anhui Mingrui New Display

(1)

Anhui Qingzhi Tech Develo

(1)

Anhui Rujiaosiqi New Mate

(1)

Anhui Sixiang Semiconduct

(1)

Anhui Xinyuanji Semicondu

(1)

Anhui Yinfeng Electronics

(1)

Anhui Yuehao Electronic E

(1)

Applied Materials Israel

(1)

Ardenne Asset Gmbh & Co K

(1)

Asml Netheriands B V [nl]

(1)

Atlas Magnetics

(1)

(1)

Avago Technologies Intern

(1)

Avary Tech Co Ltd; Avary

(1)

BOE Huacan Optoelectronic

(1)

BOE Technology Group Co L

(1)

BOE Technology Group; Hef

(1)

(1)

Banben Metal Changzhou

(1)

Baotou City Huashang Rare

(1)

Baya Systems Inc

(1)

Beijing Anku Yingxin Tech

(1)

Beijing Automation Contro

(1)

Beijing Boe Tech Developm

(1)

Beijing Changcheng Instit

(1)

Beijing ESWIN Computing T

(1)

Beijing Huahang Radio Mea

(1)

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(1)

Beijing Innomem Tech Co L

(1)

Beijing Inst Of Smart Ene

(1)

Beijing Inst Technology;

(1)

Beijing Intellectual Prop

(1)

Beijing Jingcai Semicondu

(1)

Beijing Micvic Biotech Co

(1)

Beijing Mingxin Qirui Tec

(1)

Beijing Quantum Informati

(1)

Beijing Semiconductor Spe

(1)

Beijing Shougang Co Limit

(1)

Beijing Technology & Busi

(1)

Beijing Tellhow Biologica

(1)

Beijing Tsing Micro Intel

(1)

Beijing University of Civ

(1)

Beijing University of Pos

(1)

Beijing Xianxin Technolog

(1)

Beijing Yaoneng Tech Co L

(1)

Beijing Yingtong Technolo

(1)

Beijing Youzhuju Network

(1)

Beijing Zhongyuan Yishang

(1)

Bosch Automotive Products

(1)

Bridge Semiconductor

(1)

British Telecommunication

(1)

Brooks Automation US

(1)

Browning Raymond

(1)

(1)

CETHIK Group; Huazhong Un

(1)

(1)

Casi Vision Tech Luoyang

(1)

Cccc Highway Bridges Nati

(1)

Ccteg Coal Mining Researc

(1)

Central Glass Co Limited

(1)

(1)

ChangXin Memory Technolog

(1)

Changchun Xinjie Tech Co

(1)

Changchun Yonggu Tech Co

(1)

Changfei Advanced Semicon

(1)

Changsha Huashi Semicondu

(1)

Changshu Institute of Tec

(1)

Changxin Jidian Beijing S

(1)

Changzhou Correll Tech Co

(1)

Changzhou Jianhualing Aut

(1)

Changzhou Nanfei Microele

(1)

Chaoyang Shuomei High Pur

(1)

Chengdu Analog Circuit Te

(1)

Chengdu BOE Optoelectroni

(1)

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(1)

Chengdu Chenxian Photoele

(1)

Chengdu Denway Newtype Me

(1)

Chengdu Haiguang Integrat

(1)

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(1)

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(1)

Chengdu Polytechnic

(1)

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(1)

Chengdu Wanzhong Weilai B

(1)

Chengdu Weiguang Jidian T

(1)

Chengdu Xinghuantianxia T

(1)

Chengdu Yicheng Integrate

(1)

Chengdu Yisiwei Computing

(1)

Chengdu Zhongwei Crystal

(1)

Chenri Tech Nanjing Co Lt

(1)

Chery Automobile

(1)

China Building Materials

(1)

China Electronics Technol

(1)

China Japan Friendship Ho

(1)

China Resources Microelec

(1)

China Satellite Network I

(1)

China Wafer Level CSP

(1)

Chipsea Technology Shenzh

(1)

Chongqing Inst Green & In

(1)

Chongqing Inst Of Graphen

(1)

Chongqing Kangjia Optoele

(1)

Chongqing Maite Photoelec

(1)

Chongqing Saibao Industri

(1)

Chongqing University of P

(1)

Chongqing Vocational Univ

(1)

Chongqing Yineng Tech Co

(1)

Chongqing Yuntong Technol

(1)

Chongqing Zixingzhe Tech

(1)

Chung Ang University Indu

(1)

Cirrus Logic Internationa

(1)

Cista System Corp [ky]; C

(1)

Cohpros Int Co Ltd

(1)

Core Photoelectric Tech S

(1)

(1)

(1)

Crsc Communication & Info

(1)

(1)

Dalian Institute of Chemi

(1)

Dalian Medical University

(1)

Daoke Jiangsu High Tech M

(1)

Denka Co Limited

(1)

Deyi Microelectronics Co

(1)

Dingdao Zhixin (Shanghai)

(1)

Dongguan Kewei Automation

(1)

Dongguan Tongke Electroni

(1)

Dongguan Tongxin New Mat

(1)

Dongguan Wen Tong Electro

(1)

Dongguan Yuanxin Semicond

(1)

Dongguan Yuncai Printing

(1)

Dongguan Zeyou Tech Co Lt

(1)

Dowa Electronics Material

(1)

Dugen Photoelectric Tech

(1)

(1)

Eaton Intelligent Power

(1)

Ecole Polytechnique Fed D

(1)

Effect Photonics B V

(1)

Einsnext Pte Ltd

(1)

Elane Beijing Data Tech C

(1)

Electric Power Research I

(1)

Ellenberger & Poensgen

(1)

Enkris Semiconductor

(1)

Envirologix Inc

(1)

(1)

Etron Tech Inc [tw]; Inve

(1)

Exsense Microelectronics

(1)

First Research Inst Of Th

(1)

Flat Glass Group

(1)

Forehope Electronic, Ning

(1)

Fujian Fushun Microelectr

(1)

Fujian Jingxu Semiconduct

(1)

Fujian Siboly Envirotech

(1)

Fujitsu Ltd [jp]; The Del

(1)

Fulian Yuzhan Technology

(1)

Fulongjie Suzhou Hydrogen

(1)

Furukawa Electric

(1)

Fushi Zhitong Electronic

(1)

Fuzhou Enxi Tech Co Ltd

(1)

GCL System Integration Te

(1)

GalaxyCore Shanghai

(1)

Gallant Micro Machining

(1)

Ganjiang Innovation Resea

(1)

Gaojing Solar Energy; Gua

(1)

Gaojing Solar Energy; Qin

(1)

General Electric Tech Gmb

(1)

Giga Force Electronics Co

(1)

GlobalFoundries Singapore

(1)

Globalfoundries Sg Pte Lt

(1)

Globalfoundries Us Inc [u

(1)

(1)

Guangdong Hongyixin Autom

(1)

Guangdong Juhua Printing

(1)

Guangdong Kezhuo Semicond

(1)

Guangdong Mingyang Film T

(1)

Guangdong Pusaida Materia

(1)

Guangdong Tengcai Technol

(1)

Guangdong University of T

(1)

Guangdong Xincheng Hanqi

(1)

Guangdong Xincheng Hanqi

(1)

Guangdong Xinyueneng Semi

(1)

Guangdong Xuhong Semicond

(1)

Guangdong Zhineng Semicon

(1)

Guangdong Zhongke Hongtai

(1)

Guangliwei Beijing Tech C

(1)

Guangzhou Aoshi Tech Co L

(1)

Guangzhou Bingo Software

(1)

Guangzhou Leyi Invest Co

(1)

Guangzhou Medical Univers

(1)

Guangzhou National Labora

(1)

Guangzhou Nuoding Intelli

(1)

Guangzhou Qinglanshidai S

(1)

Guangzhou Quanguan Intell

(1)

Guangzhou Shengtainuo New

(1)

Guangzhou Xulong Micro Na

(1)

Guangzhou Zhongneng Speci

(1)

Guangzhou Zhono Electroni

(1)

Gudeng Prec Industral Co

(1)

Gudeng Prec Industrial Co

(1)

Guizhou Hangrui Aviation

(1)

Guizhou Normal University

(1)

Haiguang Information Tech

(1)

Haiguang Integrated Circu

(1)

Haipo Chuzhou Material Te

(1)

Haisuxin Hangzhou Tech Co

(1)

(1)

Hangzhou Beihang Universi

(1)

Hangzhou Changchuan Techn

(1)

Hangzhou Cobetter Semicon

(1)

Hangzhou Dianzi Universit

(1)

Hangzhou Fuxin Semiconduc

(1)

Hangzhou Guangzhiyuan Tec

(1)

Hangzhou International Sc

(1)

Hangzhou Jihai Semiconduc

(1)

Hangzhou Jinqi Electronic

(1)

Hangzhou Maitang Tech Co

(1)

Hangzhou Puxiguangjing Se

(1)

Hangzhou Xinyun Optoelect

(1)

Hanmei Semiconductor Wuxi

(1)

Hans Semiconductor Equipm

(1)

Hanwei Electronics Group

(1)

Hefei BOE Display Technol

(1)

Hefei Boe Ruisheng Tech C

(1)

Hefei Chipsea Electronic

(1)

Hefei Institutes of Physi

(1)

Hefei Kaimeng Tech Co Ltd

(1)

Hefei Kangxinwei Storage

(1)

Hefei Shengchuang Microel

(1)

Hefei Taiwo Intelligent E

(1)

Heidelberg University

(1)

Henan Weina Semiconductor

(1)

Hengdian Group DMEGC Magn

(1)

Heshengyuan Packaging Mat

(1)

Heyuen China Base Electro

(1)

Hisense Visual Technology

(1)

Honeycomb Battery Co

(1)

Hongqi Integrated Circuit

(1)

Hongrun Semiconductor (Su

(1)

Hospital Affiliated To Fu

(1)

Hoya Optical Lab Inc

(1)

Huabanyun Technology Co L

(1)

Huahong Semiconductor Mfg

(1)

Huaneng Qinbei Power Gene

(1)

Huatian Tech Nanjing Co L

(1)

(1)

Huaxin Micro Semiconducto

(1)

Hubei 3d Semiconductor In

(1)

Hubei Central China Tech

(1)

Hubei Huabo Auto Parts Co

(1)

Hubei Jiufengshan Laborat

(1)

Hubei New Huaguang Inf Ma

(1)

Hubei University of Techn

(1)

Hubei Xingchen Technology

(1)

Huizhou Funeng Tech Co Lt

(1)

Huizhou Hengxinglong Tech

(1)

Huizhou Jinsheng New Elec

(1)

Huizhou Xinjinquan Precis

(1)

Hunan Aochuangpu Tech Co

(1)

Hunan Charmhigh Electrome

(1)

Hunan Disaster Prevention

(1)

Hunan Greatwall Galaxy Te

(1)

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(1)

(1)

(1)

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(1)

Idemitsu Kosan; Japan Dis

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Imec Vzw [be]; KU Leuven

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Indian Inst Of Technology

(1)

Industrial Technology Res

(1)

Infineon Tech Ag [de]; In

(1)

Infineon Technologies Ame

(1)

Inha Univ Research And Bu

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Innatera Nanosystems

(1)

Inner Mongolia Baotou Ste

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Inner Mongolia Xinte Sili

(1)

Inner Mongolia Zhongqi Co

(1)

Innolume Gmbh [de]; Silor

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(1)

(1)

JSW Aktina System

(1)

(1)

Jenoptik Optical Systems

(1)

Ji Hua Laboratory

(1)

Jiangsu Acrel Elec Applia

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Jiangsu Aisen Semiconduct

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Jiangsu Changjiang Electr

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Jiangsu Changjing Tech Co

(1)

Jiangsu Fuxu Tech Manufac

(1)

Jiangsu Hanwei Semiconduc

(1)

Jiangsu Heyi Guangxian Te

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Jiangsu Huanneng Silicon

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Jiangsu Lilong Semiconduc

(1)

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Jiangsu Shunxing Refracto

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Jiangsu Tanglong Electron

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Jiangsu Wuxi Jingwei Tian

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Jiangsu Yuefan Semiconduc

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(1)

Jiangxi Changlong Tech Co

(1)

Jiangxi Haiduo Silicone M

(1)

Jiangxi Latticepower Semi

(1)

Jiangxi Pengbowei Technol

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Jiangxi Provincial Academ

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(1)

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(1)

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Jiangxi Yaochi Tech Co Lt

(1)

Jiangxi Yibo E Technology

(1)

Jiaxing Dazhe Solar Energ

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Jierlin Chongqing New Ene

(1)

Jihai Microelectronics

(1)

(1)

Jinan Jingbo Electronic C

(1)

Jinan Qianrui Xinguang Ne

(1)

Jindieshikong Beijing Tec

(1)

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(1)

Jingchewei Jiangsu Semico

(1)

Jingfeng Xinchi Shanghai

(1)

Jinglong Technology (Suzh

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(1)

Jinling Institute of Tech

(1)

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(1)

Jrh Tech Quzhou Co Ltd

(1)

Jsg Japan Co Ltd

(1)

Jushi Group Chengdu Co Lt

(1)

KK Nihon Micronics

(1)

(1)

Kenfa System Co Ltd

(1)

Kenmec Mech Engineering C

(1)

Kepeida Semiconductor Anh

(1)

Kexin Semiconductor Tech

(1)

(1)

King Abdullah University

(1)

Kingfar Int Inc [cn]; Nan

(1)

Koscn Industrial Mfg Shen

(1)

Kulicke And Soffa Ind Inc

(1)

Kulicke and Soffa Industr

(1)

Kunming University of Sci

(1)

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Kyoto Univ [jp]; Universi

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(1)

L&t Semiconductor Tech Li

(1)

(1)

(1)

Langfang Zetian Yinuo Mac

(1)

Laplace (Guangzhou) Semic

(1)

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(1)

Lenovo (Beijing) Limited

(1)

(1)

Lianglyu Eng System Co Lt

(1)

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(1)

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Linwu County Southern Min

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Lisen Noco Hardware Co Lt

(1)

Longyou Yunshen Platemaki

(1)

Loongson Technology

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Lumentum Operations

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Luster Lighttech

(1)

(1)

(1)

Mas Automation Equipment

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Masteel Hefei Iron & Stee

(1)

Mattson Tech Inc [us]; Be

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Maxio Technology (Hangzho

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Zhejiang Liufang Semiconductor Tech Co Ltd Applies for Patent on Polishing Liquid and Surface Post-processing Method of Semiconductor Structural Member

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Zhejiang Liufang Semiconductor Tech Co Ltd has applied Chinese patent for Polishing Liquid and Surface Post-processing Method of Semiconductor Structural Member. Chen Hui, Zheng Yanbo, He Shaolong and Li Xiangxiang developed it. The patent application number is CN202511961448 20251224. The patent publicati..

Wuhan Sanxuan Tech Co Ltd Files Chinese Patent Application for High-reliability Chip Bonding Film, Preparation Method Thereof and Application of High-reliability Chip Bonding Film ..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Wuhan Sanxuan Tech Co Ltd has filed a patent application for High-reliability Chip Bonding Film, Preparation Method Thereof and Application of High-reliability Chip Bonding Film in Storage Packaging. This invention was developed by Wu De, Liao Shuhang, Li Ting and Su Junxing. The patent application number ..

Xinghua Qingke Tianjin Electronic Mat Co Ltd Applies for Patent on Acidic Chemical Mechanical Polishing Solution for Gallium Arsenide Substrate and Application of Acidic Chemical M..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Xinghua Qingke Tianjin Electronic Mat Co Ltd has applied Chinese patent for Acidic Chemical Mechanical Polishing Solution for Gallium Arsenide Substrate and Application of Acidic Chemical Mechanical Polishing Solution. Liu Lei, Wang Peidong, Mu Yuanying and Liu Ni developed it. The patent application numbe..

State Intellectual Property Office of China Receives Shenzhen Jinwei Semiconductor Mat Co Ltd Patent Application for Wafer Polishing Solution as Well as Preparation Method and Appl..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Shenzhen Jinwei Semiconductor Mat Co Ltd patent application for Wafer Polishing Solution as Well as Preparation Method and Application Thereof. Xiao Kai, Zhou Fubing, Wei Huan, Xiao Wei and Tang Shengfeng developed the invention. The patent applicati..

Guangzhou Zhongneng Special Material Tech Co Ltd Submits Chinese Patent Application for Nano Silicon Modified Epoxy Resin GIS Equipment Arc-resistant Coating

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Guangzhou Zhongneng Special Material Tech Co Ltd has submitted a patent application for Nano Silicon Modified Epoxy Resin GIS Equipment Arc-resistant Coating. This invention was developed by He Xinxing, Wang Yonggao and Meng Hua. The patent application number is CN202610417483 20260401. The patent publicat..

State Intellectual Property Office of China Receives Guangzhou Shengtainuo New Material Tech Co Ltd Patent Application for High-powdering Silicon Rubber Based on Vinyl Silicone Oil..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Guangzhou Shengtainuo New Material Tech Co Ltd patent application for High-powdering Silicon Rubber Based on Vinyl Silicone Oil Modification and Preparation Method of High-powdering Silicon Rubber. Zhang Yi, Wang Bin, Wang Yi, Wang Chencheng, Li Xing, W..

State Intellectual Property Office of China Releases SanDisk Technologies Patent Application for Bio-based Epoxy Molding Compounds for Electronic Devices

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has released SanDisk Technologies patent application for Bio-based Epoxy Molding Compounds for Electronic Devices. This invention was developed by Kumaresan Vidya, Devarajan Manish and Janakiraman Vijaya C. The patent application number is CN202510468610 20250415. ..

Guangdong Zhongke Hongtai New Mat Co Ltd Seeks Patent for Preparation Method of Quaternized Amino Silicon Oil

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Guangdong Zhongke Hongtai New Mat Co Ltd has sought patent for Preparation Method of Quaternized Amino Silicon Oil. This invention was developed by Zhou Huosheng and Wang Meiling. The patent application number is CN202610435956 20260403. The patent publication number is CN122080411 (A). International Paten..

China Japan Friendship Hospital China Japan Friendship Institute of Clinical Medicine Files Chinese Patent Application for Phage Targeted Screening Chip and Method Based on Nanopor..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- China Japan Friendship Hospital China Japan Friendship Institute of Clinical Medicine has filed a patent application for Phage Targeted Screening Chip and Method Based on Nanopore and Aptamer. This invention was developed by Wang Weiguo, Li Zirong, Gao Fuqiang, Liu Tianyang, Li Chuan, Li Junyou and Xu Yuanzhu..

State Intellectual Property Office of China Publishes Zhejiang Liufang Semiconductor Tech Co Ltd Patent Application for Cleaning Solution and Cleaning Method for Removing Sio2 Film..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Zhejiang Liufang Semiconductor Tech Co Ltd patent application for Cleaning Solution and Cleaning Method for Removing Sio2 Film Layer on Surface of Silicon Carbide. The invention was developed by Chen Hui, Hu Renhao, He Shaolong and Li Xiangxiang. Th..

State Intellectual Property Office of China Releases Tianjin Muhua Qingyan Tech Co Ltd Patent Application for High-cleanliness Water-based Cutting Fluid for Multi-wire Cutting of S..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has released Tianjin Muhua Qingyan Tech Co Ltd patent application for High-cleanliness Water-based Cutting Fluid for Multi-wire Cutting of Silicon Wafer and Preparation Method of High-cleanliness Water-based Cutting Fluid. This invention was developed by Pu Yunping,..

Nanchang Shineon Photoelectric Tech Co Ltd Submits Chinese Patent Application for Cutting Fluid and Application and Device of Cutting Fluid in Cutting of Chip-scale Packaged LED (l..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Nanchang Shineon Photoelectric Tech Co Ltd has submitted a patent application for Cutting Fluid and Application and Device of Cutting Fluid in Cutting of Chip-scale Packaged LED (light-emitting Diode). This invention was developed by Fan Zhencan, Yuan Haibo and Zhu Lei. The patent application number is CN2..

CNBM Zhejiang Material Tech Co Ltd Submits Patent Application for Pre-magnesium Silicon Monoxide Negative Electrode Material and Preparation Method Thereof

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- CNBM Zhejiang Material Tech Co Ltd has submitted a patent application for Pre-magnesium Silicon Monoxide Negative Electrode Material and Preparation Method Thereof. Liu Yang, Zhang Lijun, Zhang Qingyu, Gu Ouyang, Zhang Chengdong and Zhou Jiayu developed the invention. The patent application number is CN202..

State Intellectual Property Office of China Releases Zhengzhou Hollowlite Materials Co Ltd Patent Application for Spherical Silicon Dioxide, Preparation Method Thereof and Applicat..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has released Zhengzhou Hollowlite Materials Co Ltd patent application for Spherical Silicon Dioxide, Preparation Method Thereof and Application of Spherical Silicon Dioxide in Battery Diaphragm. This invention was developed by Lyu Shuaikang, Wang Xiaochuan, Sun Xiao..

State Intellectual Property Office of China Receives Cnbm Zhejiang Material Tech Co Ltd Patent Application for Low-impedance Silicon Monoxide Lithium Ion Battery Negative Electrode..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Cnbm Zhejiang Material Tech Co Ltd patent application for Low-impedance Silicon Monoxide Lithium Ion Battery Negative Electrode Material and Preparation Method Thereof. Lee Hyun-a, Zhao Zhenhuan, Yang Xiaoliang, Wu Weiwei, Zhang Chengdong and Tian Wenlo..

Zhejiang Liufang Semiconductor Tech Co Ltd Submits Chinese Patent Application for Method and Device for Preparing Silicon Carbide with Controllable Particle Size by Chemical Vapor ..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Zhejiang Liufang Semiconductor Tech Co Ltd has submitted a patent application for Method and Device for Preparing Silicon Carbide with Controllable Particle Size by Chemical Vapor Deposition Reactor. This invention was developed by Huang Tianchang, Hu Renhao and He Shaolong. The patent application number i..

Linwu County Southern Mines Co Ltd Files Chinese Patent Application for Endophytic Silicon Doped Reed Mushroom Dreg Charcoal Capacitor Electrode Material and Preparation Method and..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Linwu County Southern Mines Co Ltd has filed a patent application for Endophytic Silicon Doped Reed Mushroom Dreg Charcoal Capacitor Electrode Material and Preparation Method and Application Thereof. This invention was developed by Yin Peng, Qin Pufeng, Tang Yisheng, Wu Zhibin, Lei Yanping, Lei Fengting and S..

State Intellectual Property Office of China Publishes Anhui Huaxin Micro Nano Integrated Circuit Co Ltd Patent Application for Piezoelectric MEMS Device and Preparation Method and ..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Anhui Huaxin Micro Nano Integrated Circuit Co Ltd patent application for Piezoelectric MEMS Device and Preparation Method and Application Thereof. The invention was developed by Jiang Nan and Zhang Shengbing. The patent application number is CN20261..

Shenzhen Qiandu Tech Co Ltd Files Chinese Patent Application for Far Infrared Narrow-band Light Source in MEMS

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Shenzhen Qiandu Tech Co Ltd has filed a patent application for Far Infrared Narrow-band Light Source in MEMS. This invention was developed by Zhao Tangming and Liu Lelin. The patent application number is CN202511967153 20251224. The patent publication number is CN122079061 (A). International Patent Classif..

Forehope Electronic Ningbo Limited Co Submits Chinese Patent Application for Sensor Packaging Structure and Preparation Method Thereof

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Forehope Electronic Ningbo Limited Co has submitted a patent application for Sensor Packaging Structure and Preparation Method Thereof. This invention was developed by He Zhenghong and Jiang Ruidong. The patent application number is CN202610526555 20260421. The patent publication number is CN122079059 (A)...

Suzhou Lingdu Perception Tech Co Ltd Submits Patent Application for MEMS Suspension Getter Structure for Wafer Level Packaging and Manufacturing Method Thereof

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Suzhou Lingdu Perception Tech Co Ltd has submitted a patent application for MEMS Suspension Getter Structure for Wafer Level Packaging and Manufacturing Method Thereof. Wang Tao, Zuo Yuancheng, Ding Xuefeng and Li Xin developed the invention. The patent application number is CN202610172348 20260206. The pa..

State Intellectual Property Office of China Publishes Beijing University of Posts and Telecommunications Patent Application for Non-fullerene Acceptor Material with Modified Side C..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Beijing University of Posts and Telecommunications patent application for Non-fullerene Acceptor Material with Modified Side Chain and Application of Non-fullerene Acceptor Material in Ternary Planar Heterojunction Organic Solar Cell. The invention was..

State Intellectual Property Office of China Publishes Shandong Forest Grass Germplasm Resources Center Shandong Province Yaoxiang Forest Farm Patent Application for Composting Devi..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Shandong Forest Grass Germplasm Resources Center Shandong Province Yaoxiang Forest Farm patent application for Composting Device and Composting Method for Planting Substrate. The invention was developed by Zhao Lijun, Zhang Wei and Xu Hui. The patent ..

Zhejiang Lingqi Tech Co Ltd Submits Chinese Patent Application for Preparation Method of Large-size Silicon Carbide Ceramic Thick Plate

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Zhejiang Lingqi Tech Co Ltd has submitted a patent application for Preparation Method of Large-size Silicon Carbide Ceramic Thick Plate. This invention was developed by Mei Xiaohui, Miao Yigao, Huang Youshun and Yuan Hao. The patent application number is CN202610448175 20260407. The patent publication numb..

State Intellectual Property Office of China Receives Pomesci Technology Patent Application for Triptycene Compound as Well as Preparation Method and Application Thereof

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Pomesci Technology patent application for Triptycene Compound as Well as Preparation Method and Application Thereof. Li Mingxin, Zhang Yiteng, Du Mengcheng, Wang Jianwei and Sheng Zedong developed the invention. The patent application number is CN202..

State Intellectual Property Office of China Publishes Zhejiang Baorun Applied Mat Co Ltd and Zhejiang Baorui Applied Mat Co Ltd Patent Application for Enhanced Silicon Dioxide Aero..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Zhejiang Baorun Applied Mat Co Ltd and Zhejiang Baorui Applied Mat Co Ltd patent application for Enhanced Silicon Dioxide Aerogel Composite Material and Preparation Method Thereof. The invention was developed by Ding Kai and An Yong. The patent appl..

State Intellectual Property Office of China Releases Yangzhou Genesis Microelectronics Co Ltd Patent Application for Lead-free Glass Powder for Passivation of Mesa Type Semiconduct..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has released Yangzhou Genesis Microelectronics Co Ltd patent application for Lead-free Glass Powder for Passivation of Mesa Type Semiconductor and Application of Lead-free Glass Powder. This invention was developed by Li Yuchao and Tao Yaoxuan. The patent applica..

Shayang Hongrun Building Material Applies for Patent on Glass Substrate Double-edge Automatic Edge Breaking Device and Edge Breaking Method

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Shayang Hongrun Building Material has applied Chinese patent for Glass Substrate Double-edge Automatic Edge Breaking Device and Edge Breaking Method. Yang Xiaoli, Yuan Hongbin, Yao Yonglong, Wang Weiping, Shen Dehong, Wang Huaqing, Wang Bo, Yin Xianpeng and Dai Chuanbo developed it. The patent application nu..

Shenzhen Shixian Technology Submits Chinese Patent Application for Glass Substrate Cutting and Splitting Device

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Shenzhen Shixian Technology has submitted a patent application for Glass Substrate Cutting and Splitting Device. This invention was developed by Zhu Hemin, Liu Xin, Wang Ziyong and Wang Lei. The patent application number is CN202610144343 20260202. The patent publication number is CN122079470 (A). Internatio..

Siemens Industry Software Submits Patent Application for Determining Analysis Windows of an Integrated Circuit (ic) Design for Analyzing the IC Design

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Siemens Industry Software has submitted a patent application for Determining Analysis Windows of an Integrated Circuit (ic) Design for Analyzing the IC Design. Abdallah Rehab developed the invention. The patent application number is WO2025US13715 20250130. The patent publication number is WO2026164605 (A1). I..

Applied Materials Applies for Patent on Precise Control of Etch Topography and Pattern Transfer

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Applied Materials has applied WIPO patent for Precise Control of Etch Topography and Pattern Transfer. Schwarz Benjamin Ce, Barot Nisarg Bhushankumar, Dhindsa Rajinder, Swaminathan Vikhram Vilasur, Choi Thomas and Mani Sathya developed it. The patent application number is WO2025US13337 20250128. The patent pu..

Hunan Zerui New Mat Co Ltd Submits Patent Application for Preparation Method of Silicon Carbide Fiber with In-situ Boron Nitride Coating on Surface

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Hunan Zerui New Mat Co Ltd has submitted a patent application for Preparation Method of Silicon Carbide Fiber with In-situ Boron Nitride Coating on Surface. Yi Jun, Tang Yun and Huang Xiaozhong developed the invention. The patent application number is CN202610257922 20260304. The patent publication number ..

State Intellectual Property Office of China Releases Chengdu Zhongwei Crystal Mat Co Ltd Patent Application for Semiconductor Surface Treating Agent, Application Thereof and Silico..

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has released Chengdu Zhongwei Crystal Mat Co Ltd patent application for Semiconductor Surface Treating Agent, Application Thereof and Silicon Carbide Laser Modified Layer Stripping Method. This invention was developed by Guo Meng, Yang Shuangze and Yang Huai. The..

Suzhou Chengjun Semiconductor Equipment Co Ltd Submits Patent Application for Automatic Powder Supplementing Device for Silicon Carbide Crystal Growing Furnace

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Suzhou Chengjun Semiconductor Equipment Co Ltd has submitted a patent application for Automatic Powder Supplementing Device for Silicon Carbide Crystal Growing Furnace. Dong Jianshu and Cheng Shishu developed the invention. The patent application number is CN202610413529 20260331. The patent publication nu..

Univ Shenzhen Polytechnic Submits Chinese Patent Application for Equipment and Method for Preparing Large-size Polycrystalline Diamond Wafers in Batches

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Univ Shenzhen Polytechnic has submitted a patent application for Equipment and Method for Preparing Large-size Polycrystalline Diamond Wafers in Batches. This invention was developed by Yu Hongyu, Wang Tao and Yuan Ning. The patent application number is CN202610219913 20260224. The patent publication numbe..

Fujian Fushun Microelectronics Co Ltd Seeks Patent for Silicon Wafer Back Crystal Growth Prevention Air Curtain Isolation Device for Thick Epitaxial Growth

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Fujian Fushun Microelectronics Co Ltd has sought patent for Silicon Wafer Back Crystal Growth Prevention Air Curtain Isolation Device for Thick Epitaxial Growth. This invention was developed by Zheng Yi, Lin Ligui, Xiong Aihua and Mei Haijun. The patent application number is CN202610512725 20260417. The pa..

Zhongtian Jingke Ningbo Semiconductor Mat Co Ltd Submits Patent Application for Preparation Method and Preparation Device of Silicon Carbide Single Crystal and Silicon Carbide Sing..

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Zhongtian Jingke Ningbo Semiconductor Mat Co Ltd has submitted a patent application for Preparation Method and Preparation Device of Silicon Carbide Single Crystal and Silicon Carbide Single Crystal. Chen Dou, Tang Jun, Ma Yuan, Guan Weiwei, Pan Yaobo, Xue Weiming and Vouret developed the invention. The pa..

State Intellectual Property Office of China Publishes Zhongtian Jingke Ningbo Semiconductor Mat Co Ltd Patent Application for Crucible for Silicon Carbide Crystal Growth and Silico..

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Zhongtian Jingke Ningbo Semiconductor Mat Co Ltd patent application for Crucible for Silicon Carbide Crystal Growth and Silicon Carbide Crystal Growth Method. The invention was developed by Chen Dou, Tang Jun, Guan Weiwei, Pan Yaobo, Xue Weiming and Vo..

State Intellectual Property Office of China Publishes Jiangsu Tianke Heda Semiconductor and Beijing Tankeblue Semiconductor Patent Application for Method for Reducing Silicon Carbi..

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Jiangsu Tianke Heda Semiconductor and Beijing Tankeblue Semiconductor patent application for Method for Reducing Silicon Carbide Crystal Defects. The invention was developed by Zhou Xing, Sun Peiran, Peng Tonghua, Yang Jian, Lou Yanfang, Zhang Ping, Zo..

Hefei Institutes of Physical Science, Chinese Academy of Sciences Files Chinese Patent Application for High-mobility Gallium-indium-antimony Single Crystal as Well as Growth Method..

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Hefei Institutes of Physical Science, Chinese Academy of Sciences has filed a patent application for High-mobility Gallium-indium-antimony Single Crystal as Well as Growth Method and Application Thereof. This invention was developed by Luo Xuan, Zhao Yu and Sun Yuping. The patent application number is CN20..

Shenzhen Icreate Tech Co Ltd Submits Patent Application for Anode Plate and Horizontal Pulse Electroplating Anode Device

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Shenzhen Icreate Tech Co Ltd has submitted a patent application for Anode Plate and Horizontal Pulse Electroplating Anode Device. Zheng Liejian and Wang Zheng developed the invention. The patent application number is CN202610127022 20260129. The patent publication number is CN122082078 (A). International P..

State Intellectual Property Office of China Publishes Dongguan Yuanxin Semiconductor Co Ltd Patent Application for Semiconductor Electroplating Method and System

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Dongguan Yuanxin Semiconductor Co Ltd patent application for Semiconductor Electroplating Method and System. The invention was developed by Chen Min, Xia Nengli and Lim Chun-woo. The patent application number is CN202610407233 20260331. The patent p..

Hunan Lianchuangxing Electronic Tech Co Ltd Files Chinese Patent Application for Double-sided Multi-layer PCB Electroplating Equipment and Process

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Hunan Lianchuangxing Electronic Tech Co Ltd has filed a patent application for Double-sided Multi-layer PCB Electroplating Equipment and Process. This invention was developed by Cheng Jun and Xie Tuanying. The patent application number is CN202610158780 20260204. The patent publication number is CN12208207..

State Intellectual Property Office of China Publishes Xindong Micro Shanghai Semiconductor Tech Co Ltd Patent Application for Electroplating Equipment and Method for Isolating Exte..

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Xindong Micro Shanghai Semiconductor Tech Co Ltd patent application for Electroplating Equipment and Method for Isolating External Oxygen and Prolonging Service Life of Circulating Electroplating Liquid. The invention was developed by Wei Yongyan, Yin ..

State Intellectual Property Office of China Receives Riyuexin Advanced Tech Research Kunshan Co Ltd Patent Application for Novel Integrated Circuit Electroplating Method

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Riyuexin Advanced Tech Research Kunshan Co Ltd patent application for Novel Integrated Circuit Electroplating Method. Ling Jian developed the invention. The patent application number is CN202610178229 20260208. The patent publication number is CN1220..

Shanghai Hedong Electronic Material Submits Chinese Patent Application for Gas Uniformizing Assembly, Semiconductor Process Chamber and Semiconductor Thin Film Deposition Equipment

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Shanghai Hedong Electronic Material has submitted a patent application for Gas Uniformizing Assembly, Semiconductor Process Chamber and Semiconductor Thin Film Deposition Equipment. This invention was developed by Jia Shijun, Sun Yuanjun and Pang Bo. The patent application number is CN202610294465 20260311. ..

Jiaji Huankong Xian Tech Co Ltd Submits Patent Application for Plasma Enhanced Chemical Vapor Deposition Method and Device

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Jiaji Huankong Xian Tech Co Ltd has submitted a patent application for Plasma Enhanced Chemical Vapor Deposition Method and Device. Kim Dong-gyu, Tang Mingwei and Kim Tae-geon developed the invention. The patent application number is CN202610562578 20260427. The patent publication number is CN122081901 (A)..

Jiaji Huankong Xi'an Tech Co Ltd Seeks Patent for Pecvd-based Electrostatic Neutralization Method and Device

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Jiaji Huankong Xi'an Tech Co Ltd has sought patent for Pecvd-based Electrostatic Neutralization Method and Device. This invention was developed by Chen Bo, Lai Zheng, Cai Shuai and Liang Penggang. The patent application number is CN202610562539 20260427. The patent publication number is CN122081900 (A). In..

ASM International Holding Seeks Patent for Semiconductor Processing Equipment

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- ASM International Holding has sought patent for Semiconductor Processing Equipment. This invention was developed by Terhorst Herbert, Jdira Lucian, Oosterlaken Theodorus Gerardus Maria, Proserpio David, Ukananto Risto and Banklas Roy G. The patent application number is CN202511716376 20251121. The patent p..

Inner Mongolia Zhongqi Core Mat Co Ltd Submits Patent Application for Deposition Equipment Based on Diamond Semiconductor Wafer

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Inner Mongolia Zhongqi Core Mat Co Ltd has submitted a patent application for Deposition Equipment Based on Diamond Semiconductor Wafer. Zhao Jianbo, Tian Jingfeng and Zhao Chunxia developed the invention. The patent application number is CN202610437211 20260403. The patent publication number is CN12208189..

Jiaji Huankong Xi'an Tech Co Ltd Seeks Patent for Method and Device for Performing Chemical Vapor Deposition on Wafer

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Jiaji Huankong Xi'an Tech Co Ltd has sought patent for Method and Device for Performing Chemical Vapor Deposition on Wafer. This invention was developed by Kim Dong-gyu, Ren Mengyuan and Park Jong-oh. The patent application number is CN202610554252 20260424. The patent publication number is CN122081890 (A)..

Shenzhen Weice Semiconductor Tech Co Ltd and Tianjin Weice Semiconductor Tech Co Ltd Submit Chinese Patent Application for Particle Swarm Neural Network Pid Parameter Optimization ..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Shenzhen Weice Semiconductor Tech Co Ltd and Tianjin Weice Semiconductor Tech Co Ltd have submitted a patent application for Particle Swarm Neural Network Pid Parameter Optimization System Based on FPGA. This invention was developed by Zhong Bangyu, Wang Xuerang, Zhu Haozhen and Zeng Zihui. The patent appl..

State Intellectual Property Office of China Releases Huzhou Micro Nano Zhenxin New Mat Co Ltd Patent Application for Method and System for Controlling CVD (chemical Vapor Depositio..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has released Huzhou Micro Nano Zhenxin New Mat Co Ltd patent application for Method and System for Controlling CVD (chemical Vapor Deposition) Growth of Silicon Carbide Particles Based on Multi-mode Perception. This invention was developed by Zhang Xiaoyan, Zhang Pe..

National Defense Science and Technology Innovation Inst Academy Of Military Sciences Pla China Files Chinese Patent Application for SOC Chip Temperature Control Method

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- National Defense Science and Technology Innovation Inst Academy Of Military Sciences Pla China has filed a patent application for SOC Chip Temperature Control Method. This invention was developed by Wang Teng, Wang Dongsheng, Xu Yemao and Xu Huadong. The patent application number is CN202610518933 20260420..

Institute of Microelectronics, CAS Files Chinese Patent Application for Preparation Method of Semiconductor Device

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Institute of Microelectronics, CAS has filed a patent application for Preparation Method of Semiconductor Device. This invention was developed by Ye Dinghai. The patent application number is CN202610242131 20260228. The patent publication number is CN122063818 (A). International Patent Classification codes a..

State Intellectual Property Office of China Releases Chengdu Xinziguang Semiconductor Tech Co Ltd Patent Application for Overlay Error Compensation Method and Device, Medium, Equip..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has released Chengdu Xinziguang Semiconductor Tech Co Ltd patent application for Overlay Error Compensation Method and Device, Medium, Equipment and Program Product. This invention was developed by Wei Yunong. The patent application number is CN202411658820 20241..

Riyuexin Advanced Tech Research Kunshan Co Ltd Submits Patent Application for Novel Photoresist Edge Washing Method

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Riyuexin Advanced Tech Research Kunshan Co Ltd has submitted a patent application for Novel Photoresist Edge Washing Method. Huang Zhangbin developed the invention. The patent application number is CN202610225217 20260225. The patent publication number is CN122063816 (A). International Patent Classificatio..

World Intellectual Property Organization Releases GlobalFoundries Singapore Patent Application for Optical Interlink Structure

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released GlobalFoundries Singapore patent application for Optical Interlink Structure. This invention was developed by Tan You Sian James and Li Chao. The patent application number is WO2025SG50078 20250203. The patent publication number is WO2026164556 (A1). Inter..

Wonik IPS Submits Patent Application for Plasma Source and Substrate Processing Device

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Wonik IPS has submitted a patent application for Plasma Source and Substrate Processing Device. Kim Ji Hyun, Hwang Soo Young, Shin Gi Won, Kim Jeong Hun, Jung Eun Sun and Kim Hak Min developed the invention. The patent application number is WO2025KR95768 20251204. The patent publication number is WO2026164391..

Jiangsu Aisen Semiconductor Mat Co Ltd and Aisen Semiconductor Mat Nantong Co Ltd Apply for Patent on Flash Etching Liquid as Well as Preparation Method and Application Thereof

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- Jiangsu Aisen Semiconductor Mat Co Ltd and Aisen Semiconductor Mat Nantong Co Ltd have applied Chinese patent for Flash Etching Liquid as Well as Preparation Method and Application Thereof. Cai Jie, Xiang Wensheng, Wang Yuanyuan, Zhang Bing and Hu Qinghua developed it. The patent application number is CN20..

State Intellectual Property Office of China Receives Anhui University Patent Application for Medium-temperature-zone High-performance N-type Mg3Sb2-based Magnetic Nano Composite Th..

Semiconductor

| Tue 11 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Anhui University patent application for Medium-temperature-zone High-performance N-type Mg3Sb2-based Magnetic Nano Composite Thermoelectric Material and Preparation Method Thereof. Qian Jun, Gao Yan, Song Jiming, Xu Qing, Li Zhou and Fang Xianxian devel..

World Intellectual Property Organization Releases LX Semicon Patent Application for Display Device and Control Method Therefor

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released LX Semicon patent application for Display Device and Control Method Therefor. This invention was developed by Heo Jun Ho and Yoo Yoon Jong. The patent application number is WO2025KR21365 20251211. The patent publication number is WO2026164369 (A1). Inter..

World Intellectual Property Organization Publishes Wonik IPS Patent Application for Substrate Support and Substrate Processing Apparatus

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has published Wonik IPS patent application for Substrate Support and Substrate Processing Apparatus. The invention was developed by Choi Jia, Oh Yeong Taek, Park Jung Won and Jung Eun Sun. The patent application number is WO2025KR06955 20250522. The patent publication ..

Core Photoelectric Tech Shandong Co Ltd Submits Chinese Patent Application for Wafer High-temperature Diffusion Furnace and Wafer High-temperature Processing Technology Based on Si..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Core Photoelectric Tech Shandong Co Ltd has submitted a patent application for Wafer High-temperature Diffusion Furnace and Wafer High-temperature Processing Technology Based on Silicon Wafer Clamp. This invention was developed by Cao Xuelei and Zhang Wanchang. The patent application number is CN2026104550..

Shanghai Xijia Semiconductor Co Ltd Submits Patent Application for Wafer Processing Method and Wafer Processing Device

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Shanghai Xijia Semiconductor Co Ltd has submitted a patent application for Wafer Processing Method and Wafer Processing Device. Qiu Jiayi, Huang Fang and Pan Xingxing developed the invention. The patent application number is CN202610227027 20260226. The patent publication number is CN122077507 (A). Interna..

State Intellectual Property Office of China Receives Tiantong Yinsha New Mat Co Ltd Patent Application for Double-sided Polishing Method and System for Large-size Sapphire Wafer

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Tiantong Yinsha New Mat Co Ltd patent application for Double-sided Polishing Method and System for Large-size Sapphire Wafer. Wang Wenhua, Han Bin and Dai Wenyan developed the invention. The patent application number is CN202610293972 20260311. The p..

State Intellectual Property Office of China Publishes Zibo Yileite Health Tech Co Ltd Patent Application for Numerical Control Machining Center with Waste Chip Collecting Device

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Zibo Yileite Health Tech Co Ltd patent application for Numerical Control Machining Center with Waste Chip Collecting Device. The invention was developed by Lyu Qingdong. The patent application number is CN202610533647 20260422. The patent publicatio..

Guangzhou Quanguan Intelligent Tech Co Ltd Submits Chinese Patent Application for Chip Removal Machine Intelligent Self-repairing Method and System Based on Multi-signal Linkage

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Guangzhou Quanguan Intelligent Tech Co Ltd has submitted a patent application for Chip Removal Machine Intelligent Self-repairing Method and System Based on Multi-signal Linkage. This invention was developed by Zhou Jian and Hu Debing. The patent application number is CN202610241721 20260228. The patent pu..

Zhejiang Weiming Semiconductor Co Ltd Submits Patent Application for NAND Performance Optimization Method Based on Static Data Identification and Independent MCU Compressed Storage

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Zhejiang Weiming Semiconductor Co Ltd has submitted a patent application for NAND Performance Optimization Method Based on Static Data Identification and Independent MCU Compressed Storage. Zhu Jiawei and Xu Junjie developed the invention. The patent application number is CN202610541816 20260423. The paten..

Zhongshan Yuanshi Micro Tech Co Ltd Files Chinese Patent Application for Ink Box Data Interaction Method, Ink Box Control Chip and Ink Box

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Zhongshan Yuanshi Micro Tech Co Ltd has filed a patent application for Ink Box Data Interaction Method, Ink Box Control Chip and Ink Box. This invention was developed by Zhang Xiaodong. The patent application number is CN202610436482 20260402. The patent publication number is CN122064300 (A). International..

Shandong Inspur Science Research Inst Co Ltd Submits Chinese Patent Application for Storage Control Method and Device of Sram (static Random Access Memory), Equipment and Medium

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Shandong Inspur Science Research Inst Co Ltd has submitted a patent application for Storage Control Method and Device of Sram (static Random Access Memory), Equipment and Medium. This invention was developed by Li Bingkun, Wei Chaofei, Xu Guilong, Jiang Kai and Dong Junyi. The patent application number is ..

Tianjin Sitande Tech Co Ltd Files Chinese Patent Application for Data Storage Optimization Method and System in Chip Memory

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Tianjin Sitande Tech Co Ltd has filed a patent application for Data Storage Optimization Method and System in Chip Memory. This invention was developed by Wang Jieyuan, Wu Fang, Li Wenxi and Wang Ying. The patent application number is CN202610171620 20260206. The patent publication number is CN122064293 (A..

Deyi Microelectronics Co Ltd Submits Chinese Patent Application for Flash Memory Controller and Memory Management Method Based on Flash Memory Controller

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Deyi Microelectronics Co Ltd has submitted a patent application for Flash Memory Controller and Memory Management Method Based on Flash Memory Controller. This invention was developed by Luo Ting. The patent application number is CN202511932876 20251219. The patent publication number is CN122064284 (A). In..

Beijing Ziguang Qingteng Micro System Co Ltd Submits Chinese Patent Application for Interconnected Chip-oriented Low-power-consumption Control System

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Beijing Ziguang Qingteng Micro System Co Ltd has submitted a patent application for Interconnected Chip-oriented Low-power-consumption Control System. This invention was developed by Lin Min, Dong Yu, Huang Jinhuang and Guo Lei. The patent application number is CN202610105017 20260126. The patent publicati..

Hefei Kangxinwei Storage Tech Co Ltd Submits Chinese Patent Application for Storage Chip Power Consumption Optimization Method and Storage Medium

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Hefei Kangxinwei Storage Tech Co Ltd has submitted a patent application for Storage Chip Power Consumption Optimization Method and Storage Medium. This invention was developed by Xu Zhanrong and Yu Yu. The patent application number is CN202511999526 20251226. The patent publication number is CN122064220 (A..

State Intellectual Property Office of China Publishes Shenzhen Xinhongxing Multilayer Circuit Co Ltd Patent Application for Pressing Plate Structure of Integrated Circuit Packaging..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Shenzhen Xinhongxing Multilayer Circuit Co Ltd patent application for Pressing Plate Structure of Integrated Circuit Packaging Wire Bonder. The invention was developed by Chen Tao. The patent application number is CN202610166702 20260205. The patent..

State Intellectual Property Office of China Releases Shenzhen Tong Fang Electronic New Material Patent Application for High-reliability Lead-free Solder Paste for Semiconductor Pac..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has released Shenzhen Tong Fang Electronic New Material patent application for High-reliability Lead-free Solder Paste for Semiconductor Packaging and Preparation Method of High-reliability Lead-free Solder Paste. This invention was developed by Liu Yujie, Xiao Dong..

Cohpros Int Co Ltd Applies for Patent on Substrate Processing Device and Method, and Processed Substrate

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Cohpros Int Co Ltd has applied Chinese patent for Substrate Processing Device and Method, and Processed Substrate. Lin Shih-sheng and You Zhiwei developed it. The patent application number is CN202411689793 20241125. The patent publication number is CN122077230 (A). International Patent Classification code..

Suzhou Boli Tech Co Ltd Submits Patent Application for Laser Cutting System for Cutting Semiconductor Material Crystal Ingot

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Suzhou Boli Tech Co Ltd has submitted a patent application for Laser Cutting System for Cutting Semiconductor Material Crystal Ingot. Shim Il Woo developed the invention. The patent application number is CN202610484459 20260414. The patent publication number is CN122077226 (A). International Patent Classif..

Guangdong Xincheng Hanqi Semiconductor Tech Co Ltd Submits Chinese Patent Application for Multi-project Wafer Cutting Method

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Guangdong Xincheng Hanqi Semiconductor Tech Co Ltd has submitted a patent application for Multi-project Wafer Cutting Method. This invention was developed by Han Lei and Tong Yuting. The patent application number is CN202610389561 20260327. The patent publication number is CN122077219 (A). International Pa..

Wuhan East Science and Technology Submits Chinese Patent Application for Multi-layer Glass Substrate Blind Hole Processing Method, Equipment, Device, System and Production Line

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Wuhan East Science and Technology has submitted a patent application for Multi-layer Glass Substrate Blind Hole Processing Method, Equipment, Device, System and Production Line. This invention was developed by Zhang Liguo. The patent application number is CN20261015608 20260107. The patent publication number..

Hanmei Semiconductor Wuxi Co Ltd Seeks Patent for Multifunctional Vacuum Reflow Soldering Furnace and Operation Method

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Hanmei Semiconductor Wuxi Co Ltd has sought patent for Multifunctional Vacuum Reflow Soldering Furnace and Operation Method. This invention was developed by Wu Baomin and Xie Liuping. The patent application number is CN202411704626 20241126. The patent publication number is CN122077110 (A). International P..

Beijing Mingxin Qirui Tech Co Ltd Seeks Patent for 3D Stacked Chip and Power Consumption Control Method and System Thereof

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Beijing Mingxin Qirui Tech Co Ltd has sought patent for 3D Stacked Chip and Power Consumption Control Method and System Thereof. This invention was developed by Liu Jing and Feng Lei. The patent application number is CN202610230127 20260226. The patent publication number is CN122064217 (A). International P..

State Intellectual Property Office of China Releases Beijing Ziguang Qingteng Micro System Co Ltd Patent Application for Register Low-power-consumption Management Method and Device..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has released Beijing Ziguang Qingteng Micro System Co Ltd patent application for Register Low-power-consumption Management Method and Device for Chip and Chip. This invention was developed by Lin Min, Yang Shuzhen, Dong Yu and Huang Jinhuang. The patent applicati..

State Intellectual Property Office of China Receives Jiangsu Acrel Elec Appliance Mft Co Ltd, Acrel Co Ltd and Jiangsu Ankerui Microgrid Research Inst Co Ltd Patent Application for..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Jiangsu Acrel Elec Appliance Mft Co Ltd, Acrel Co Ltd and Jiangsu Ankerui Microgrid Research Inst Co Ltd patent application for Chip-based Multifunctional Reset Circuit and Method. Yu Chenglong, Li Haiquan, Zhao Wenyi, Yang Weitao, Liu Yannan and Cheng ..

State Intellectual Property Office of China Publishes Shenzhen Xingyao Semiconductor Patent Application for Memory Dynamic Heat Dissipation Method, Heat Dissipation System, Medium ..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Shenzhen Xingyao Semiconductor patent application for Memory Dynamic Heat Dissipation Method, Heat Dissipation System, Medium and Product. The invention was developed by Liu Chao, Huang Xiang and Li Zhilong. The patent application number is CN202610..

State Intellectual Property Office of China Receives Northwestern University Patent Application for Transcendental Function Calculation Device Based on Lookup Table and Self-recons..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has received Northwestern University patent application for Transcendental Function Calculation Device Based on Lookup Table and Self-reconstruction Self-evolution AI Chip. Shan Rui, Guo Zhihao, Jiang Lin, Jia Yanting and Deng Junyong developed the invention. The..

STMicroelectronics International Submits Chinese Patent Application for Low Power Voltage Regulator Circuit with Fast Transient Response and Corresponding Method of Operation There..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- STMicroelectronics International has submitted a patent application for Low Power Voltage Regulator Circuit with Fast Transient Response and Corresponding Method of Operation Thereof. This invention was developed by Gaudiano Richard. The patent application number is CN202511664889 20251113. The patent public..

Hanwei Electronics Group Submits Patent Application for Temperature Control Method for Semiconductor Laser

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Hanwei Electronics Group has submitted a patent application for Temperature Control Method for Semiconductor Laser. Dong Chao, Zhang Tao, Wang Junyang, Fang Yanqun and Ding Shichao developed the invention. The patent application number is CN202610199435 20260211. The patent publication number is CN122064171 ..

Chongqing Inst Green & Intelligent Technology Cas Submits Chinese Patent Application for Zero Calibration Method for Multichannel Mass Flow Control System of Wafer Chamfering Machi..

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- Chongqing Inst Green & Intelligent Technology Cas has submitted a patent application for Zero Calibration Method for Multichannel Mass Flow Control System of Wafer Chamfering Machine. This invention was developed by Lu Wenqiang, Jiang Chengming and Li Qikun. The patent application number is CN20251239524 2..

State Intellectual Property Office of China Publishes Luster Lighttech Patent Application for Controller and Control Method for Industrial Production Line

Semiconductor

| Wed 12 Aug 2026

Beijing, Aug. 12 -- State Intellectual Property Office of China has published Luster Lighttech patent application for Controller and Control Method for Industrial Production Line. The invention was developed by Yue Kuoming. The patent application number is CN20261006047 20260105. The patent publication number is CN122064037 (..

Kyocera Files WIPO Patent Application for Substrate for Mounting Electronic Component and Light-emitting Device

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Kyocera has filed a patent application for Substrate for Mounting Electronic Component and Light-emitting Device. This invention was developed by Umeki Haruki, Nguyen Thi Minh Phuong, Ishizaki Yuichiro and Itou Seiichirou. The patent application number is WO2026JP03470 20260130. The patent publication number ..

World Intellectual Property Organization Receives Asahi Kasei KK Patent Application for Negative Photosensitive Resin Composition, Method for Manufacturing Cured Relief Pattern, an..

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has received Asahi Kasei KK patent application for Negative Photosensitive Resin Composition, Method for Manufacturing Cured Relief Pattern, and Semiconductor Device. Murakami Kohei developed the invention. The patent application number is WO2026JP03367 20260130. The p..

World Intellectual Property Organization Releases Hamamatsu Photonics Patent Application for Photodetection Element

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has released Hamamatsu Photonics patent application for Photodetection Element. This invention was developed by Tsuji Yuta, Kanamori Hiroki, Kanari Kengo, Ishikawa Yuna and Tsuchiya Ryutaro. The patent application number is WO2026JP02932 20260128. The patent publicat..

Hamamatsu Photonics Submits Patent Application for Photodetection Element

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Hamamatsu Photonics has submitted a patent application for Photodetection Element. Tsuji Yuta, Kanamori Hiroki, Kanari Kengo, Ishikawa Yuna and Tsuchiya Ryutaro developed the invention. The patent application number is WO2026JP02905 20260128. The patent publication number is WO2026164166 (A1). International..

Central Glass Co Limited Submits Patent Application for Cleaning Method, Etching Method, Method for Manufacturing Semiconductor Device, and Etching System

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Central Glass Co Limited has submitted a patent application for Cleaning Method, Etching Method, Method for Manufacturing Semiconductor Device, and Etching System. Yamauchi Kunihiro and Kikuchi Akiou developed the invention. The patent application number is WO2026JP02898 20260128. The patent publication num..

World Intellectual Property Organization Receives Tasmit Inc and Toray Engineering Patent Application for Substrate Holding Device

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- World Intellectual Property Organization has received Tasmit Inc and Toray Engineering patent application for Substrate Holding Device. Ochi Tatsuya developed the invention. The patent application number is WO2025JP43486 20251212. The patent publication number is WO2026163656 (A1). International Patent Clas..

Furukawa Electric Submits WIPO Patent Application for Optical Semiconductor Element and Method for Producing Optical Semiconductor Element

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Furukawa Electric has submitted a patent application for Optical Semiconductor Element and Method for Producing Optical Semiconductor Element. This invention was developed by Kiyota Kazuaki and Nishizawa Yo. The patent application number is WO2025JP43224 20251211. The patent publication number is WO2026163652..

Fuji Electric Applies for Patent on Semiconductor Device and Method for Manufacturing Semiconductor Device

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Fuji Electric has applied WIPO patent for Semiconductor Device and Method for Manufacturing Semiconductor Device. Yoshikawa Koh developed it. The patent application number is WO2025JP43183 20251210. The patent publication number is WO2026163651 (A1). International Patent Classification code is H10D12/00. Th..

Fujifilm Submits WIPO Patent Application for Treatment Solution for Semiconductor Device, Method for Producing Treatment Solution, Method for Treating Object to be Treated, and Met..

Semiconductor

| Wed 12 Aug 2026

Geneva, Aug. 12 -- Fujifilm has submitted a patent application for Treatment Solution for Semiconductor Device, Method for Producing Treatment Solution, Method for Treating Object to be Treated, and Method for Producing Semiconductor Device. This invention was developed by Ohtsu Akihiko, Takahashi Tomonori and Takahashi Kazutaka..

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