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Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- Shenzhen South China Microelectronics Co Ltd has applied Chinese patent for Silicon Carbide Chip Contact Resistance Test Unit, Mechanism and Method. Tian Liang, Huang Sheng, Xia Jinghua, Niu Yingxi, Cao Ye and Wu Chufen developed it.
The patent application number is CN202510979289 20250716. The patent publ..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- Golden Phoenix Laboratory has submitted a patent application for Power Consumption Monitoring Circuit and Temperature Compensation Method Applied to Large-area-array Image Sensor. This invention was developed by Tang Fang.
The patent application number is CN202511157082 20250819. The patent publication num..
Semiconductor
| Sun 08 Mar 2026
Alexandria, March 9 -- STMicroelectronics Asia Pacific Pte Ltd has submitted a patent application for Vertical Metal Sensing Method for DC-DC Converter. This invention was developed by Guedon Yannick.
The patent application number is US202519379152 20251104. The patent publication number is US20260066761 (A1). International P..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- Nantong Xingchen Electron Co Ltd has submitted a patent application for Clamping Device for Chip Capacitor Detection. This invention was developed by Li Jie.
The patent application number is CN202511221214 20250829. The patent publication number is CN120741900 (A). International Patent Classification codes..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Kk Toshiba and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device. This invention was developed by Kiya Ryota, Kitazawa Hideaki and Watanabe Daiki.
The patent application number is US202418976622 20241211. The patent publication number is US20260068748 (A1)..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Kk Toshiba and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device. This invention was developed by Miyake Eitaro.
The patent application number is US202519063174 20250225. The patent publication number is US20260068712 (A1). Cooperative Patent Classificatio..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Infineon Tech Americas Corp has submitted a patent application for Electromagnetic Compatibility Robustness of Die-to-die Interconnects. This invention was developed by Huang Shaowu and Wu Dance.
The patent application number is US202519312184 20250827. The patent publication number is US20260068680 (A1..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- U.S. Patent and Trademark Office has released Toshiba and Toshiba Electronic Devices & Storage patent application for Semiconductor Device. This invention was developed by Kitazawa Hideaki.
The patent application number is US202519285349 20250730. The patent publication number is US20260068662 (A1). Int..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Orient Semiconductor Electronics Ltd has applied United States patent for Semiconductor Package and Manufacturing Method Thereof. Tung Yueh-ming, Yang Chia-ming, Lin Chia-hung, Wang Pin-chun and Yen Po-yen developed it.
The patent application number is US202418928219 20241028. The patent publication num..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Volantis Semiconductor Inc has sought patent for Redundancy Methods for Wafer-scale Systems. This invention was developed by Ghosh Tapabrata.
The patent application number is US202418815939 20240827. The patent publication number is US20260068640 (A1). Cooperative Patent Classification codes are H10D88/..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Applied Mat Inc and National University of Singapore have submitted a patent application for Memristive Computing Schemes in the Back-end-of-the-line. This invention was developed by Astier Hippolyte P A G, Mangattuchali Muhammed Juvaid, Das Chandan, Sudijono John and Gradecak-garaj Silvija.
The patent ..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Weebit Nano Ltd has filed a patent application for Stack Structure for Retention of High and Low Resistive States of an Oxide-based Random-access Memory. This invention was developed by Molas Gabriel.
The patent application number is US202519314270 20250829. The patent publication number is US2026006854..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Yangtze Memory Tech Holding Co Ltd has submitted a patent application for Semiconductor Devices and Fabricating Methods Thereof. This invention was developed by Xiao Liang, Wen Min, Zhao Yi, Zhou Wenbin and Huo Zongliang.
The patent application number is US202418935284 20241101. The patent publica..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Yangtze Memory Tech Holding Co Ltd has submitted a patent application for Memory Devices and Fabrication Methods Thereof. This invention was developed by Miao Lina, Xiao Liang, Xiao Wenjing, Zhou Wenbin and Huo Zongliang.
The patent application number is US202418888399 20240918. The patent publication n..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Ju Donghyuk has submitted a patent application for Antifuse One-time Programmable Memory and Manufacturing Method Thereof. This invention was developed by Ju Donghyuk.
The patent application number is US202418822306 20240902. The patent publication number is US20260068152 (A1). International Patent Clas..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Yangtze Memory Tech Holding Co Ltd has applied United States patent for Semiconductor Structures and Fabrication Methods Thereof. Zhao Yi, Xiao Liang, Miao Lina, Zhou Wenbin and Huo Zongliang developed it.
The patent application number is US202418909397 20241008. The patent publication number is US20260..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- Zuoyebang Education Tech Beijing Co Ltd has submitted a patent application for Data Processing Method and Device, Electronic Equipment, Chip and Medium. This invention was developed by Huang Henan.
The patent application number is CN202510696058 20250528. The patent publication number is CN120743176 (A). I..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Coolstar Tech Inc has sought patent for Patterned Silicon-on-insulator Wafers. This invention was developed by Lin Hong, Dong Haike and Lin Xiaotong.
The patent application number is US202418817487 20240828. The patent publication number is US20260068041 (A1). International Patent Classification code is..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- Xiamen Ziguang Zhanrui Tech Co Ltd has submitted a patent application for Double-track Power Supply Control Method and Power Management Chip. This invention was developed by Lin Yixin and Wu Jiansheng.
The patent application number is CN202511249718 20250903. The patent publication number is CN120743084 (A..
Semiconductor
| Sun 08 Mar 2026
Alexandria, March 9 -- Innophase Inc has submitted a patent application for Integrated Circuit Transceiver Array Synchronization. This invention was developed by Anzil Claudio, Xu Yang and Zarkeshvari Farhad.
The patent application number is US202519256349 20250701. The patent publication number is US20260067058 (A1). Interna..
Semiconductor
| Sun 08 Mar 2026
Alexandria, March 9 -- U.S. Patent and Trademark Office has received Atlas Magnetics patent application for Method and System for Electroplating Uniformity. Mcdonald John Othniel developed the invention.
The patent application number is US202519316859 20250902. The patent publication number is US20260062830 (A1). Internationa..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- State Intellectual Property Office of China has published Shenzhen Chaoying Intelligent Tech Co Ltd patent application for Fault Detection Method and System for Integrated Chip. The invention was developed by Xia Junjie and Yang Xin.
The patent application number is CN202511235431 20250901. The patent publ..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- State Intellectual Property Office of China has published Shenzhen U Pick Tech Limited patent application for Magnetic Suspension Non-contact Integrated Circuit (IC) Probe Test Platform Device. The invention was developed by Sheng Weigang.
The patent application number is CN202510916421 20250703. The paten..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- State Intellectual Property Office of China has published Zhang Fen patent application for System and Method for Automatically Detecting Contact Height of Probe Card and Wafer Pin. The invention was developed by Wang Enli, Zhang Fen and Wang Ensheng.
The patent application number is CN202510826502 20250619..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- State Intellectual Property Office of China has received Yan Qun patent application for Non-damage Detection Device and Method for Electroluminescent Performance of Flip Led Chip. Yan Qun, Huang Zhonghang, Lang Taifu, Lin Chang, Yang Tianxi and Sun Jie developed the invention.
The patent application number..
Semiconductor
| Sun 08 Mar 2026
Alexandria, March 9 -- Viavi Solutions Suzhou Co Ltd has filed a patent application for Wafer Manufacturing Apparatus. This invention was developed by Ding Ailing, Huang Weibin, Xia Yinxiang and Tilsch Markus K.
The patent application number is US202519384044 20251110. The patent publication number is US20260062795 (A1). Inte..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- State Intellectual Property Office of China has published Hangzhou Ruimeng Tech and Hangzhou Zhongpei Electronic Co Ltd patent application for Ultrasonic Metering Method and Chip Thereof. The invention was developed by Ma Lingchao, Dong Yijie, Sun Zan, Yang Jianhui and Zhang Jiayi.
The patent application n..
Semiconductor
| Sun 08 Mar 2026
Alexandria, March 9 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Mfg Company Ltd, TSMC Nanjing Company Ltd and TSMC China Company patent application for Integrated Circuit and an Operation Method Thereof. The invention was developed by Zhou Kai, Pan Lei, Ma Ya-qi and Yan Zhang-ying.
The patent applic..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- State Intellectual Property Office of China has released Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd patent application for Method for Detecting Semiconductor Monocrystalline Silicon Ingot Before Slicing. This invention was developed by Shi Xin, Yang Kai, Zhao Yanxiang, Rui Yang, Cheng Bo, Bai Yu, Zha..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- State Intellectual Property Office of China has released Dongguan Mingxin Prec Intelligent Manufacturing Co Ltd patent application for Electroplating Solution Online Sampling and Detecting Device for Electroplating Equipment. This invention was developed by Jiang Ying and Zou Jie.
The patent application nu..
Semiconductor
| Sun 08 Mar 2026
Alexandria, March 9 -- Tyfast has applied United States patent for Lithium-ion-battery Anode Materials Containing Lithium Vanadium Oxide and Silicon. Liu Haodong, Liu Ping, La O' Gerardo Jose and Kim Kangwoon developed it.
The patent application number is US202519312428 20250828. The patent publication number is US20260066273..
Semiconductor
| Sun 08 Mar 2026
Alexandria, March 9 -- Tel Mfg and Engineering of America Inc has submitted a patent application for Method for Substrate Processing. Nigote Rupali and Heussner Robert developed the invention.
The patent application number is US202418816532 20240827. The patent publication number is US20260066217 (A1). International Patent Cl..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- Oem Semiconductor Equipment Tech Jingjiang Co Ltd has applied Chinese patent for Semiconductor Wafer Detection Mechanism and Equipment. Huang Nengquan, Zhu Aidong and Pan Yu developed it.
The patent application number is CN202510893560 20250630. The patent publication number is CN120741345 (A). Internation..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Toshiba and Toshiba Electronic Devices & Storage have applied United States patent for Semiconductor Device. Liu Jia developed it.
The patent application number is US202519056823 20250219. The patent publication number is US20260068350 (A1). International Patent Classification code is H10F55/25. Coopera..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Toshiba and Toshiba Electronic Devices & Storage have sought patent for Semiconductor Device. This invention was developed by Shimizu Yasuhiro.
The patent application number is US202519013151 20250108. The patent publication number is US20260068267 (A1). International Patent Classification codes are H10..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Taiwan Semiconductor Manufactruring Co Ltd has sought patent for Source/drain Shaping for Resistance Reduction. This invention was developed by Chang Hung-tai, Chang Chih-chiang and Yu Ming-hua.
The patent application number is US202419001733 20241226. The patent publication number is US20260068250 (A1)..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Kk Toshiba and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device. This invention was developed by Kawakami Akiyo and Gejo Ryohei.
The patent application number is US202519013077 20250108. The patent publication number is US20260068249 (A1). International P..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Kk Toshiba and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device and Manufacturing Method. Kamiya Shunsuke and Matsuo Kazuki developed the invention.
The patent application number is US202519067680 20250228. The patent publication number is US20260068219 (..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Kk Toshiba and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device. Sakata Hiroki developed the invention.
The patent application number is US202519053001 20250213. The patent publication number is US20260068218 (A1). International Patent Classification code..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Kk Toshiba and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device. This invention was developed by Gejo Ryohei.
The patent application number is US202519034715 20250123. The patent publication number is US20260068202 (A1). International Patent Classificatio..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- U.S. Patent and Trademark Office has published Semiconductor Tech Innovation Center Beijing Corporation Stic and Tsinghua University patent application for Silicon-germanium Heterojunction Bipolar Transistor and Method for Manufacturing the Same. The invention was developed by Fu Jun, Zhao Yue, Zheng Kai a..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Ling Peiching has submitted a patent application for Methods for Manufacturing Semiconductor Structures. This invention was developed by Ling Peiching, Wu Nanray and Yao Liang-gi.
The patent application number is US202419104359 20240219. The patent publication number is US20260068197 (A1). International..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Nd Hi Tech Lab Inc and Etron Technology have submitted a patent application for High-bandwidth Memory Stack with Side Edge Interconnection and Liquid Cooling Structure. Tong Ho-ming and Lu Chao-chun developed the invention.
The patent application number is US202519386015 20251111. The patent publication..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Boise State University has submitted a patent application for Soil Gas Logging System. This invention was developed by Anderson Jacob, Huber David and Walsh Owen.
The patent application number is US202519318214 20250903. The patent publication number is US20260063611 (A1). International Patent Classific..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Mcgowan Sensor Labs Ltd has submitted a patent application for Solid-state Oxygen Sensor Chip. Smith Peter John developed the invention.
The patent application number is US202418822734 20240903. The patent publication number is US20260063587 (A1). International Patent Classification codes are G01N27/406..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Yao Xiaotian Steve has submitted a patent application for Photonic Integrated Circuit Chip for Distributed Acoustic Sensing.
The patent application number is US202519319424 20250904. The patent publication number is US20260063469 (A1). International Patent Classification code is G01H9/00. Cooperative P..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- State Intellectual Property Office of China has released Suzhou Xishi Tech Co Ltd patent application for Electronic Beam Detection Equipment for Integrated Circuit. This invention was developed by Yu Wenzhi and Zhao Yan.
The patent application number is CN202510757911 20250609. The patent publication numbe..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- Jiangsu Heyi Guangxian Tech Co Ltd has submitted a patent application for Automatic Optical Defect Detection Device for OLED Display Screen Production. Li Dean, Shen Fafu and Li Zheng developed the invention.
The patent application number is CN202511171305 20250821. The patent publication number is CN12074..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- Gran Zhongcun Electromechanical Suzhou Co Ltd has filed a patent application for Multi-station Rotation Driving Detection Device for Substrate Detection. This invention was developed by Guo Xun.
The patent application number is CN202510903999 20250701. The patent publication number is CN120741501 (A). Inte..
Semiconductor
| Sun 08 Mar 2026
Alexandria, March 9 -- U.S. Patent and Trademark Office has released Zheng Binge patent application for Chip Grinding Device and Grinding Method.
The patent application number is US202418819193 20240829. The patent publication number is US20260061555 (A1). International Patent Classification codes are B24B47/22, B24B51/00 an..
Semiconductor
| Sun 08 Mar 2026
Alexandria, March 9 -- Bluerock Security Inc has submitted a patent application for Control-flow Based Memory Access Manipulation for Isolating Code and Data. This invention was developed by Proskurin Sergej, Vogl Sebastian Wolfgang and Pfoh Jonas.
The patent application number is US202519316643 20250902. The patent publicati..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- U.S. Patent and Trademark Office has published Mixx Tech Inc patent application for System and Method for a Silicon Photonic Bridge in an Electronic Package. The invention was developed by Schaevitz Rebecca Kayla and Raghuraman Vivek.
The patent application number is US202519319184 20250904. The patent ..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- State Intellectual Property Office of China has published Beijing Riyuexin Intelligent Tech Engineering Co Ltd patent application for Computer Chip Cooling Heat Dissipation Control Method and System. The invention was developed by Zhang Wenzheng.
The patent application number is CN202510823958 20250619. Th..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- Shanghai Guangchuang Computing Tech Co Ltd has submitted a patent application for Data Transmission Method for Optical Computing Chip and Upper Computer. This invention was developed by Jiang Jun, Chen Qi, Liang Xianguo and Wang Yongliang.
The patent application number is CN202510927932 20250704. The paten..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- Shenzhen Qunlian Zhizao Tech Co Ltd has submitted a patent application for Intelligent Temperature Control System and Method Based on Chip Heat Energy Guide. This invention was developed by Lai Jiacheng, Lin Weiqiang and Tao Tan.
The patent application number is CN202510903283 20250701. The patent publicat..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Sony Group Corp and Sony Semiconductor Solutions Corporation have filed a patent application for Radar Apparatus and On-vehicle Sensing System. This invention was developed by Katsuta Atsushi, Okada Yasuhiro, Takahashi Yudai and Yokoyama Hiroki.
The patent application number is US202319105191 20230830. ..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- U.S. Patent and Trademark Office has released Nokomis Inc patent application for Methods for Determining Remaining Useful Life in Electronic Devices and Systems (rulas). This invention was developed by Keller Iii Walter J and Munson Jr Kenneth H.
The patent application number is US202418797127 20240807...
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- State Intellectual Property Office of China has received Wuxi Zhanshuo Tech Co Ltd patent application for High-precision Multi-area Semiconductor Heating Platform Control System. Ji Zhongwei developed the invention.
The patent application number is CN202511237398 20250901. The patent publication number is ..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- State Intellectual Property Office of China has released Shanghai Pengxi Semiconductor Co Ltd patent application for Virtual Wafer Three-dimensional Model Generation Method and Device, Medium and Program Product. This invention was developed by Zhang Fei and Sun Zixiao.
The patent application number is CN2..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Solvcor Tech LLC has submitted a patent application for Organic Dielectric Heat Transfer Fluids and Processes. This invention was developed by Novek Ethan J.
The patent application number is US202519380737 20251105. The patent publication number is US20260063376 (A1). International Patent Classification..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- State Intellectual Property Office of China has released Xgiga Communication Tech Co Ltd patent application for Loss Control Coupling Method for Light Receiving Optical Path of High-speed Silicon Optical Module and High-speed Silicon Optical Module. This invention was developed by Zhu Tengfei, Zhu Ningning an..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- State Intellectual Property Office of China has received Harbin Institute of Technology and Beijing Microelectronic Technology Institute patent application for Method for Testing Single-energy Electron Total Dose Shielding Rate of Packaged and Reinforced Integrated Circuit Based on Electrical Parameter Change..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- Hunan Zhongdian Xinghe Electronic Co Ltd has submitted a patent application for Doppler Positioning Solving Method and Device Based on Chip Platform. This invention was developed by Gao Yi, Peng Qiang, Liu Hao, Zhang Pan, Liu Zhigang, Lu Zaiqi, Sun Xiaojing and Cui Yu.
The patent application number is CN20..
Semiconductor
| Sun 08 Mar 2026
Alexandria, March 9 -- Baya Systems Inc has submitted a patent application for Hierarchical Mapping for Network on Chip. This invention was developed by Prasad Honnahuggi Harinath Venkata Naga Ambica, Gade Narayana Sri Harsha and Norige Eric.
The patent application number is US202418916066 20241015. The patent publication num..
Semiconductor
| Sun 08 Mar 2026
Alexandria, March 9 -- Yangtze Memory Tech Holding Co Ltd has submitted a patent application for Memory Devices, Operating Methods Thereof and Memory Systems. Min Yuanyuan, Xu Feng, Wang Wendong, Jin Lei and Huo Zongliang developed the invention.
The patent application number is US202519291239 20250805. The patent publication..
Semiconductor
| Sun 08 Mar 2026
Alexandria, March 9 -- Yangtze Memory Tech Holding Co Ltd has filed a patent application for Semiconductor Device and Operating Method Thereof, and System. This invention was developed by Zhang Yu, Xu Feng, Li Da, Liu Gang, Jin Lei and Huo Zongliang.
The patent application number is US202519264450 20250709. The patent publica..
Semiconductor
| Sun 08 Mar 2026
Alexandria, March 9 -- U.S. Patent and Trademark Office has released International Business Machines Corporation and Massachusetts Institute of Technology patent application for Reconfigurable Analog Current-domain In-memory Compute SRAM Design for Low-power Applications. This invention was developed by Amer Aya Galal Mahdy Elsa..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- State Intellectual Property Office of China has published Changsha Yikete New Mat Co Ltd patent application for Chip Inductor Packaging Material and Preparation Method Thereof. The invention was developed by Zhang Linhua, Dong Tao and Liu Xisha.
The patent application number is CN202510843251 20250623. The..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- Nanjing University Of Information Science & Technology Nantong Research Institute and Nantong Sipu Information Tech Co Ltd have filed a patent application for Cooling Device for Polycrystalline Silicon Production. This invention was developed by Gu Hongping and Yu Jue.
The patent application number is CN20..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- Zhongchuang Zhiling Zhengzhou Industrial Tech Group Co Ltd and Zhengzhou Coal Mining Machinery Group have submitted a patent application for Full-protection Electroplating Method for Deep Blind Hole Piston Rod of Hydraulic Support. This invention was developed by Bok-young Lee, Liu Sheng, Lan Zhiyu, Wang Piao..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- Ordos Xijin Mining and Metallurgy, Inner Mongolia Erdos Electric Power & Metallurgy Group and Inner Mongolia Low Carbon Ferroalloy Tech Co Ltd have applied Chinese patent for Method for Efficiently Recovering and Grading Ferrosilicon in Metallurgical Silicon Slag and Application of Method. Hu Ping, Yan Yizhua..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- BYD Company and BYD Auto Industry Co Ltd have submitted a patent application for Surfactant Composition, Silicon Carbide Wafer Cleaning Agent, Silicon Carbide Wafer, Cleaning Method of Silicon Carbide Wafer, Device and Equipment. This invention was developed by Song Kai, Liu Weihua, Zhou Wei, Wang Jun and Tan..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- Shenzhen JCN New Energy Tech Co Ltd and Jiangxi Jingchangneng Tech Co Ltd have submitted a patent application for High-flame-retardant Basalt Fiber Photovoltaic Substrate and Preparation Method Thereof. This invention was developed by Xiao Zhibai, Liu Youfang and Liu Yuanzhi.
The patent application number ..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- Guangdong Nanhai Etetb Tech Co Ltd and Foshan Ruina New Material Tech Co Ltd have submitted a patent application for Emulsified and Dispersed Organic Carrier for Solar Cell Silver Paste as Well as Preparation and Application of Emulsified and Dispersed Organic Carrier. This invention was developed by Huang Li..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- Jiangsu Sanmu Chemical Co Ltd and Jiangsu Sanmu Group Corp have submitted a patent application for Organic Silicon Anti-doodling Resin and Preparation Method Thereof. This invention was developed by Qian Feng, Hui Zhengquan, Tang Tewei and Zhao Peng.
The patent application number is CN20251173286 20250801...
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Toshiba and Toshiba Electronic Devices & Storage have sought patent for Manufacturing Method of Semiconductor Device Using Dicing Tape, and Dicing Tape. This invention was developed by Yamashita Yuma, Oohashi Kenichi, Mori Kentaro and Nomura Kazushiro.
The patent application number is US202519319854 202..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Toshiba and Toshiba Electronic Devices & Storage have filed a patent application for Method for Manufacturing Semiconductor Device and Semiconductor Device. This invention was developed by Kawakami Akiyo and Gejo Ryohei.
The patent application number is US202519013065 20250108. The patent publication nu..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Hefei Xinsheng Optoelectronics Tech Co Ltd and BOE Technology Group have submitted a patent application for Array Substrate and Display Device. This invention was developed by Lei Jie, Xu Zouming, Tian Jian, Liu Chunjian, Wu Xintao, Wang Jie, Zeng Qin, Zhang Jianying, Zhang Zhi, Wang Qingpu, Zhang Chuanwen..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Taiwan Semiconductor Mfg Company Ltd, TSMC Nanjing Company Ltd and TSMC China Company have sought patent for Integrated Circuit Device and Manufacturing Method Thereof. This invention was developed by Chen Cuncun, Wang Xinyong, Han Liu, Chen Huan-neng and Tu Junfang.
The patent application number is US2..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Taiwan Semiconductor Mfg Company Ltd and TSMC China Company have applied United States patent for Linear Voltage Regulator Circuit and Multiple Output Voltages. Jin Yong-liang, Ma Ya-qi, Li Wei and Fan Di developed it.
The patent application number is US202519383110 20251107. The patent publication numb..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- Beijing Hualin Jiaye Technology and Dazheng Huajia Tech Xianghe Co Ltd have applied Chinese patent for Full-automatic Wafer Contour Measuring Device. Liu Jianmin, Geng Chao, Niu Yingxi, Niu Shenjun, Guo Shenggang, Wang Qiang and Geng Biao developed it.
The patent application number is CN202511187034 202508..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- Xi'an ESWIN Material Technology and Xi'an Xinxin Material Tech Co Ltd have submitted a patent application for Method and Device for Measuring Thickness of Silicon Wafer. This invention was developed by Meng Liangliang, Wang Lei, Su Xuwen, Jia Cong and Tang Bei.
The patent application number is CN2025109641..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- The University of Queensland and Tokyo Electron have sought patent for Monomer and Polymer Compositions for Reversible Overcoat Wafer Patterning. This invention was developed by Whittaker Andrew, Blakey Idriss, Peng Hui, Markus Josua, Hossain Md Daloar, Murphy Michael, Grzeskowiak Jodi, Cutler Charlotte an..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Taiwan Semiconductor Mfg Company Ltd and TSMC China Company have submitted a patent application for Built-in Self-test (BIST) Circuit, Integrated Circuit Device and Method. This invention was developed by Chen Huan-neng, Li Shao-yu and Chen Cuncun.
The patent application number is US202418930085 2024102..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- STMicroelectronics International NV and University Degli Studi Di Bergamo have submitted a patent application for Flow Meter and Associated Method. Sanvito Stefano and Passoni Marco developed the invention.
The patent application number is US202418816734 20240827. The patent publication number is US2026..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- Beijing BOE Sensing Tech Co Ltd, BOE Technology Group and Beijing BOE Technology Development have filed a patent application for Mask Plate and Display Substrate. This invention was developed by Jiang Kuo, Hou Xuecheng, Ning Yunlong, Qin Yifeng, Wang Qi, Sun Tonghu, Wu Shenkang, Ji Quanzeng, Xing Dongming, Ge..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- Handan Power Supply Branch Of State Grid Hebei Electric Power Supply Co Ltd and State Grid Corporation of China have submitted a patent application for Multi-parameter Chip Sensing Overhead Line Holographic Monitoring Operation and Maintenance Method and System. Li Ming, Pei Dongfeng, Yao Meng, Zhang Hanrui, ..
Semiconductor
| Sun 08 Mar 2026
Beijing, March 9 -- Huahong Semiconductor, Wuxi and Huahong Semiconductor Mfg Wuxi Co Ltd have submitted a patent application for Junction Dyeing Method for Physical Failure Analysis of Semiconductor Sample. Xu Rui, Shu Yun and Xia Lan developed the invention.
The patent application number is CN202510783115 20250611. The pate..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Qorvo has submitted a patent application for Advanced RF Packaging with Air Cavity for Wide Bandgap Semiconductors and Double-sided Cooling. Hasnine Md and Salazar Neftali developed the invention.
The patent application number is US202519303832 20250819. The patent publication number is US20260068658 (A..
Semiconductor
| Mon 09 Mar 2026
Beijing, March 9 -- The 41st Institute of China Electronics Technology Group has applied Chinese patent for Coupling Packaging Device Compatible with Multiple Types of Light Quantum Chips. Xue Guangtai, Han Shunli, Xu Chunsheng, Chai Jiwang, Liu Guixiang and Zhang Yingyun developed it.
The patent application number is CN20251..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- U.S. Patent and Trademark Office has released Samsung Electronics patent application for Package Semiconductor. This invention was developed by Lee Jihyun.
The patent application number is US202519061191 20250224. The patent publication number is US20260068778 (A1). Cooperative Patent Classification codes..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Texas Instruments Incorporated has submitted a patent application for Electronic Device with Indented Die Backside. This invention was developed by Suzuki Yutaka, Li Guangxu, Travis Blake, Kronenberg Thomas, Williamson Jaimal, Murugan Rajen Manicon and Ankamah-kusi Sylvester.
The patent application number..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Innolux has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Yueh Jui-jen and Wang Cheng-chi.
The patent application number is US202519283231 20250728. The patent publication number is US20260068764 (A1). Cooperative Patent Classif..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Samsung Electronics has submitted a patent application for Semiconductor Package and Method of Fabricating the Same. This invention was developed by Shin Sangho, Park Yongjin, Yu Hae-jung and Jung Yanggyoo.
The patent application number is US202519200938 20250507. The patent publication number is US2026..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Samsung Electronics has filed a patent application for Semiconductor Package. This invention was developed by Heo Daewoong and Kim Gihwan.
The patent application number is US202519180937 20250416. The patent publication number is US20260068761 (A1). Cooperative Patent Classification codes are H10W70/611..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- U.S. Patent and Trademark Office has released Samsung Electronics patent application for Semiconductor Package and Method of Fabricating the Same. This invention was developed by Oh Seungryong.
The patent application number is US202519178096 20250414. The patent publication number is US20260068760 (A1)...
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Samsung Electronics has applied United States patent for Semiconductor Package and Method of Fabricating the Same. Baek Eunkyung, Park Youngjun, Jung Yoonha and Bae Sunghawn developed it.
The patent application number is US202519095290 20250331. The patent publication number is US20260068759 (A1). Coope..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- Samsung Electronics has filed a patent application for High Bandwidth Memory and Method for Manufacturing the Same. This invention was developed by Lee Jaesic.
The patent application number is US202519093529 20250328. The patent publication number is US20260068758 (A1). International Patent Classificati..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- SK Hynix has submitted a patent application for Stacked Semiconductor Devices. Park Ju Hyung and Jeong Ha Jun developed the invention.
The patent application number is US202519032323 20250120. The patent publication number is US20260068757 (A1). International Patent Classification code is G11C11/406. Coop..
Semiconductor
| Mon 09 Mar 2026
Alexandria, March 9 -- SK Hynix has submitted a patent application for Memory Device and Method of Manufacturing the Same. This invention was developed by Chang Heon Yong.
The patent application number is US202519012907 20250108. The patent publication number is US20260068756 (A1). International Patent Classification code is H1..
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