News For Last 1 Week
Industry
X
Assignee
Country
Status
-
Select All
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- TP Link Systems Inc has submitted a patent application for Method of Rolling Back Processes of a Device of a Stacking System During a Master Device Change and Device of Stacking System. Long Xingzhi, Chen Chanpin and Zhang Qi developed the invention.
The patent application number is EP20260162900 20260306...
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Foshan Pusen Electronic Co Ltd has received a patent for Light Emitting Diode with Relatively High Light Output Rate. This invention was developed by Zhang Ting.
The patent application number is CN202423310794U 20241231. The patent publication number is CN223681448 (U). International Patent Classification..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Shanghai Laiao Electronic Tech Co Ltd has secured a patent on Integrated Circuit Heat Dissipation Device. Xing Zhenqing developed the invention.
The patent application number is CN20252010707U 20250103. The patent publication number is CN223681405 (U). International Patent Classification code is H05K7/20...
Semiconductor
| Sat 26 Sep 2026
Seoul, Sept. 25 -- Korean Intellectual Property Office has received Samsung Electronics Co Ltd and Research & Business Found Sungkyunkwan University patent application for Toggle Flip-flop and Counter Including the Same. Joo Bo Min, Kong Bai Sun and Lee Jae Ha developed the invention.
The patent application number is KR202301..
Semiconductor
| Sat 26 Sep 2026
Seoul, Sept. 25 -- Samsung Electronics Co Ltd and Ulsan National Institute of Science & Technology have applied Korean patent for Memory Device and an Operation Method Thereof. Lee Jong Eun, Lee Su Gil and Park Jae Woo developed it.
The patent application number is KR20230110569 20230823. The patent publication number is KR20..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Foshan Pusen Electronic Co Ltd has received a patent for Light Emitting Diode with Anti-falling Structure. This invention was developed by Zhang Ting.
The patent application number is CN202423310791U 20241231. The patent publication number is CN223681442 (U). International Patent Classification codes are ..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Dongguan Youshun Photoelectric Co Ltd has secured a patent on Led Support with Simplified Structure. Huang Xiangfei, Suo Xintao, Li Qiang and Zhao Junyang developed the invention.
The patent application number is CN202423220182U 20241226. The patent publication number is CN223681441 (U). International Pat..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Guangdong Niuhang Electronic Tech Co Ltd has secured a patent on High Electrostatic Field Effect Transistor. Yan Yunfeng, Li Xiaoqin, Li Xiaohong, Wang Xiaolei, Xiao Guiming, Zhao Lizhen, Liu Xingyang, Xiao Bing, Li Xiaochun, Yan Aojie and Yan Yunhan developed the invention.
The patent application number ..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has published China Jiliang University and Hangzhou Quality Measurement Science Research Instituite patent application for Convection Enhanced Liquid Bath Temperature Control Device for Micro-fluidic Chip and Reagent. The invention was developed by Xu Huijuan, Fan ..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Suzhou Zhongxing Huichuang Tech Co Ltd has submitted a patent application for Silicon-based Runner Plate, Preparation Method Thereof and Micro-fluidic Chip. This invention was developed by Fu Weixin.
The patent application number is CN202411978878 20241231. The patent publication number is CN122298530 (A)..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has released Shandong Bangkai New Mat Co Ltd patent application for Catalyst Carrier Silicon Dioxide Used in Petrochemical Industry and Preparation Method Thereof. This invention was developed by Cui Weihuan, Xie Mingmin, Tang Mengqi, Yu Xiunuan and Zhao Zhibo.
..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has published Shenzhen Zhongji New Mat Co Ltd patent application for Integrated Preparation Device of High-purity Silica Sol for Polishing Monocrystalline Silicon Substrate. The invention was developed by Yu Kun, Chen Bin and Chen Dongli.
The patent application ..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Beijing University of Technology has submitted a patent application for Microfluidic Reaction Chip for Heterogeneous Catalytic Conversion of Co2. Zhang Dongtang, Wang Xiayan, Cui Xiao, Jia Shuang and Guo Guangsheng developed the invention.
The patent application number is CN202610689230 20260519. The patent..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has received Taiwan Semiconductor Co Ltd patent application for Physiological Value Sensing Device and Sensing Method Thereof. Li Jiade and Huang Yuxin developed the invention.
The patent application number is CN202510157738 20250213. The patent publication numb..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Handan Zhongtang Fastener Group Co Ltd has sought patent for Drill Bit Cooling and Waste Chip Collecting Mechanism for Photovoltaic Support Drilling. This invention was developed by Lin Xingliang, Song Ziqi, Yu Chia-hao and Shan Jingjing.
The patent application number is CN202610768622 20260530. The paten..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Shandong University has sought patent for Partitioned Closed-loop Uniform Cooling System and Method for Additive Manufacturing Large Component with Substrate Heat Treatment Cooling Stage. This invention was developed by Wu Defan, Wu Weiwei, Liu Guojie, Zhang Heng, Han Quanquan, Zhang Zhenhua and Wang Liqiao...
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has published Lanzhou Jinchuan Tech Park Co Ltd and Jinchuan Group patent application for Preparation Method of Spheroidic Polycrystalline Silver Powder for Solar Cell Electrode Paste. The invention was developed by Shen Yi, Wang Yue, Zhao Zhiyu, Zhang Yahong, Feng..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Shanghai Austor Tech Co Ltd has submitted a patent application for Adjustable Shaping Tool for Chip Pins. Fang Xu, Xu Yan and Huang Fei developed the invention.
The patent application number is CN202610650762 20260512. The patent publication number is CN122298892 (A). International Patent Classification c..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has published Semiconductor Mfg International Tianjin Co Ltd and Semiconductor Manufacturing International (Shanghai) patent application for Cleaning Device for Semiconductor Material Carrying System. The invention was developed by Zhao Mancang, Li Yonggang, Wang G..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Jinan Yachuang Environmental Prot Equipment Co Ltd has sought patent for Integrated Intelligent Air-washing Wood Chip Light and Heavy and Metal Pollutant Purification Equipment. This invention was developed by Li Shan, Zhang Fengkang, Wang Tao, Wei Yongmin and Zhang Fengmin.
The patent application number ..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Lingbao Jinyuan Zhaohui Copper Co Ltd has filed a patent application for Rolled Copper Foil Sealing Agent Based on Nano Silicon Oxide and Surface Treatment Method Thereof. This invention was developed by Zhao Xiaohui, Chen Wenjie, Hu Hao, Shao Songcai, Meng Weifen, Zhou Shihao, Yuan Tongtong and Wu Bing.
..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has published Zhejiang Provincial Hospital of Traditional Chinese Medicine First Affiliated Hospital of Zhejiang and Hangzhou Yuzhong New Mat Co Ltd patent application for Temperature and Humidity Dual-response Sanitary Pain Relieving Functional Chip and Sanitary T..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- NVIDIA has filed a patent application for Tray with Configurable Domains and On-tray Communication Bridge. This invention was developed by Norton John, Albright Ryan, Laning Ray, Herring David, Mentovich Elad and Hand Sam.
The patent application number is EP20260164567 20260313. The patent publication number..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- SK Hynix has submitted a patent application for Hub Device, Operating Method of Hub Device, and Cluster System Including Hub Device. This invention was developed by Jung In Ho, Park Jae Yong and Rho Jun Rye.
The patent application number is EP20260160037 20260223. The patent publication number is EP4807556 (..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has released Panasonic Intellectual Property Management patent application for Substrate Processing Apparatus, Jig, and Member Replacement Method. This invention was developed by Kuroda Seiya, Mine Takuo and Kimura Masatoshi.
The patent application number is CN202..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has released Toray Industries patent application for Laminate, Resin Composition, Laminate Having Semiconductor Element, and Method for Manufacturing Semiconductor Device Using Same. This invention was developed by Miyazaki Daichi, Arimoto Yukari, Nakajima Risano a..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- NVIDIA has submitted a patent application for Tile Program Optimization Using Sub-tiles. Shi Yining, Zhao Wenyi, Yin Wenzhi, Zhu Kai and Jiang Shuhao developed the invention.
The patent application number is EP20260164379 20260312. The patent publication number is EP4807535 (A1). International Patent Classif..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- NVIDIA has submitted a patent application for Scheduling Tile Program Operations. This invention was developed by Shi Yining, Zhao Wenyi, Yin Wenzhi, Zhu Kai and Jiang Shuhao.
The patent application number is EP20260164305 20260312. The patent publication number is EP4807534 (A1). International Patent Classi..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- NVIDIA has submitted a patent application for Generating Data Structures to Use Memory Accelerators. This invention was developed by Zhang Saijin and Xu Jiafan.
The patent application number is EP20260164097 20260311. The patent publication number is EP4807533 (A1). International Patent Classification code i..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- NVIDIA has submitted a patent application for Identification of Grid-invariant Operations. Xie Feng, Wang Qian and Shi Xiaolei developed the invention.
The patent application number is EP20260164073 20260311. The patent publication number is EP4807532 (A1). International Patent Classification code is G06F8/4..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- NVIDIA has submitted a patent application for Accessing Memory Using Memory Accelerators. Degioanni Théo, Zhang Ben, Zhao Wenyi, Zhu Kai, Herhut Stephan Andreas, Ozen Guray and Xu Jiafan developed the invention.
The patent application number is EP20260163801 20260310. The patent publication number is EP4807..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- MGI Tech has submitted a patent application for Acoustic Fluid Micro-fluidic Chip and System and Application Thereof. This invention was developed by Liu Yang, Zhou Suqiong and Yang Meng.
The patent application number is CN20248074399 20240229. The patent publication number is CN122295171 (A). International..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Sloveniaams AB has sought patent for Coin Pushing Machine with Chip Detection for Local and Remote Games. This invention was developed by Connelly John Joseph, Mizutani Katsuhiro, Kido Katsuhiro, Kojima Keiichi and Joko Satoshi.
The patent application number is CN20248062605 20240930. The patent publicati..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- European Patent Office has received ASML Netherlands patent application for Broadband Radiation Generation. Kohler Johannes Richard Karl and Uebel Patrick Sebastian developed the invention.
The patent application number is EP20250163796 20250314. The patent publication number is EP4807440 (A1). International..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- NVIDIA has applied European patent for Optical Patch Panel. Norton John, Albright Ryan, Laning Ray, Herring David, Mentovich Elad and Hand Sam developed it.
The patent application number is EP20260164615 20260313. The patent publication number is EP4807421 (A1). International Patent Classification code is G0..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- NVIDIA has sought patent for Passive Waveguides for High Optical Power. This invention was developed by Huang Mengyuan, Oluwole Olakanmi, Ma Chaoxuan and De Koninck Yannick Charles J.
The patent application number is EP20260164554 20260313. The patent publication number is EP4807413 (A1). International Paten..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Xiamen University has filed a patent application for Packaging Ring for Chip Heat Dissipation Packaging Structure and Chip Heat Dissipation Packaging Structure. This invention was developed by Xiao Xiong, Zeng Chuan, Wang Zhizhen, Xie Rongsheng, Xin Shiwei, Huang Jiapeng and Ma Shenglin.
The patent applicat..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has released Forehope Semiconductor Ningbo Limited Co patent application for Preparation Method of Heterogeneous Packaging Structure and Heterogeneous Packaging Structure. This invention was developed by He Zhenghong.
The patent application number is CN202610757..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Xi'an Hangsi Semiconductor Co Ltd has sought patent for Full-automatic Plastic Packaging Equipment for Semiconductor. This invention was developed by Jia Jia, Dang Peng and Ma Lei.
The patent application number is CN202610695835 20260520. The patent publication number is CN122294979 (A). International Pat..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Saiwei Tianjin Ind Co Ltd has filed a patent application for HBM Packaging Technology Intelligent Cooperation Implementation Method Oriented to High-density Integration. This invention was developed by Sun Zhou, Yang Hailiang, Du Qinghai and Wang Jinliang.
The patent application number is CN202610443268 2..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Guangdong Xincheng Hanqi Semiconductor Tech Co Ltd has sought patent for Wafer Warpage Processing Method, Wafer Warpage Packaging Method and Wafer Warpage Packaging Structure. This invention was developed by Zhang Wentao, Zhu Kai, Tan Xinyi, Han Lei, Wang Zhi and Wu Dongsheng.
The patent application numbe..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Shanghai Lingcan Tech Co Ltd has submitted a patent application for Protective Chip Packaging Equipment for Integrated Circuit. This invention was developed by Wu Lun.
The patent application number is CN202610420339 20260401. The patent publication number is CN122294976 (A). International Patent Classific..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has released Canon patent application for Method for Manufacturing Semiconductor Device. This invention was developed by Kawamura Yoshihisa, Kimura Tetsuya, Ishikawa Mayu, Saito Masaki and Matsuzaki Akira.
The patent application number is CN202511926308 20251219. ..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has released Shenzhen Duoxiangfu Tech Co Ltd patent application for Wafer-level Packaging Structure of GaN Microwave Monolithic Integrated Circuit. This invention was developed by Zhong Changxing.
The patent application number is CN202610386253 20260327. The pat..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Jiangsu Punuowei Electronic Co Ltd has submitted a patent application for High-density Interconnection Packaging Substrate and Processing Method Thereof. This invention was developed by Yang Fei, Zong Xinru, Ma Hongwei, Li Qianqian and Duan Pengfei.
The patent application number is CN202610668516 20260515..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Suzhou Ruijiewei Tech Group Co Ltd has applied Chinese patent for Splicing Manufacturing Method of Large-size Ceramic Packaging Substrate. Zhang Long, Han Zhanyou, Wang Jiahui and Qin Shengli developed it.
The patent application number is CN202610367284 20260324. The patent publication number is CN1222949..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Mata Huayan Tech Suzhou Co Ltd has been granted a patent for Quick Release Structure of External Filter for Semiconductor Cleaning Agent. Fan Qingsong and Sun Zheng developed the invention.
The patent application number is CN20252028796U 20250107. The patent publication number is CN223683166 (U). Internat..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Shenzhen Jinwei Semiconductor Mat Co Ltd has been granted a patent for Filtering System of Polishing Equipment. Tang Shengfeng, Zhou Fubing, Xiao Kai, Hu Shuai and Xiao Wei developed the invention.
The patent application number is CN20252039743U 20250107. The patent publication number is CN223683146 (U). ..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- Muffler Pirmin has submitted a patent application for Method and Apparatus for Drying Semiconductor Varnish on Glass Plate.
The patent application number is EP20260163870 20260311. The patent publication number is EP4807300 (A1). International Patent Classification codes are F26B3/28, F26B5/04, F26B9/06 a..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Shandong Shunxin Gongyan Microelectronics Co Ltd has filed a patent application for Sbb Laser Bump Structure for Improving Utilization Rate of Chip and Manufacturing Method of SBB Laser Bump Structure. This invention was developed by Zhang Yingxin, Qian Kai, Zhao Xu, He Rui and Ni Jie.
The patent applicat..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has received Huawei Technologies patent application for Chip, Chip Stacking Structure and Preparation Method Thereof, and Electronic Equipment. Lin Chen, Wu Ming, Ma Binze and Wang Peng developed the invention.
The patent application number is CN202411904269 20241..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Shgenzhen Zhongke Sihe Tech Co Ltd has sought patent for Glass Core TGV Panel Three-dimensional Integrated Packaging Structure with Embedded Heterogeneous Chip and Preparation Method of Glass Core TGV Panel Three-dimensional Integrated Packaging Structure. This invention was developed by Shao Dongdong.
Th..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Walton Advanced Engineering has submitted a patent application for Improved Structure of Semiconductor Memory Packaging Unit. This invention was developed by Gu Ruiting, Lin Junrong and Yu Hongqi.
The patent application number is CN202411896565 20241220. The patent publication number is CN122294961 (A). Int..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Zhang Jidong has submitted a patent application for Method for Producing Multilayer Ceramic-metal Integrated Substrate, Substrate Structure and Composite Substrate.
The patent application number is CN202610407409 20260331. The patent publication number is CN122294954 (A). International Patent Classifica..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Chinese Patent for Glass Substrate Guiding and Conveying Device has been issued to Wuhu Dongxu Photoelectric Sci & Tech Co Ltd and Tunghsu Technology Group. This invention was developed by Wang Dianpeng, Li Qing, Li Heran, Zhang Xichen, Dong Guangming, Zhang Jinjue, Chen Taotao, Zhang Chao, Fang Hongyi, Zhao..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- European Patent Office has released Infineon Technologies, Austria patent application for Elementary Cells for a Voltage Regulator. This invention was developed by Saggini Stefano, Rizzolatti Roberto, Ursino Mario, Iob Federico and Deboy Gerald Josef.
The patent application number is EP20250196847 20250819. ..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- Infineon Technologies, Austria has submitted a patent application for a Power Converter. This invention was developed by Saggini Stefano, Rizzolatti Roberto, Ursino Mario, Iob Federico and Deboy Gerald Josef.
The patent application number is EP20250196850 20250819. The patent publication number is EP4807960 ..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- Infineon Technologies, Austria has submitted a patent application for Operating a Power Converter. This invention was developed by Saggini Stefano, Rizzolatti Roberto, Ursino Mario, Iob Federico and Deboy Gerald Josef.
The patent application number is EP20250196849 20250819. The patent publication number is ..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- Infineon Technologies, Austria has applied European patent for a Power Converter. Saggini Stefano, Rizzolatti Roberto, Ursino Mario, Iob Federico and Deboy Gerald Josef developed it.
The patent application number is EP20250163429 20250313. The patent publication number is EP4807957 (A1). International Patent..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has received Hangzhou Xinyu Semiconductor Co Ltd patent application for Interconnection Substrate Manufacturing Method. Guo Ran developed the invention.
The patent application number is CN202411898762 20241220. The patent publication number is CN122294947 (A). I..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has received Shenzhen Hanhai Xinghe Tech Co Ltd patent application for Single-tube Power Chip with Self-protection Function and Connection Structure Thereof. Chen Haoreng and Wu Yihao developed the invention.
The patent application number is CN202610283111 20260..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Intel has submitted a patent application for Substrate Surface Treatment for Stiffener Bonding. This invention was developed by Hoang The Ban.
The patent application number is CN202511689279 20251118. The patent publication number is CN122294941 (A). International Patent Classification codes are H10W42/00, ..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has published Wuhan Chuxing Technology patent application for Thin Film, Preparation Method Thereof and Chip. The invention was developed by Li Hong, Xiong Yazhou and Xiao Yongkang.
The patent application number is CN202411885338 20241219. The patent publication n..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Advanced Micro-Fabrication Equipmen has submitted a patent application for Formation Method of Semiconductor Structure and Semiconductor System. Li Hao, Xu Can and He Weiye developed the invention.
The patent application number is CN202411886244 20241219. The patent publication number is CN122294920 (A). In..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Shanghai Xinaoxinyi Tech Co Ltd has filed a patent application for Bonded Wafer and Processing Method Thereof. This invention was developed by Xu Hongtao, Wang Kerui, Xu Xiaojie, Wang Ziwen, Zhou Pinghua, Li Wei, Zhang Weimin and Xiang Xiao.
The patent application number is CN202610361476 20260323. The pa..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has received CSMC Technologies patent application for Method for Carrying Out Pattern Transfer by Utilizing Stripping Process and Semiconductor Device. Li Yuexing, Ren Tao, Lai Yuannan and Ji Jun developed the invention.
The patent application number is CN20241191..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Zhongjing Zhaoda Beijing Tech Co Ltd has filed a patent application for Pick-and-place Device for Integrated Circuit Chip. This invention was developed by Wang Baofeng.
The patent application number is CN202610425832 20260402. The patent publication number is CN122294904 (A). International Patent Classifi..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has published Raintree Scient Instruments Shanghai patent application for Gas Path Control System of Semiconductor Equipment and Semiconductor Equipment. The invention was developed by Zhu Junling, Han Wei, Zhuang Yuan and Quan Pengfei.
The patent application numb..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Jiangsu Leuven Instruments has submitted a patent application for Cooling Liquid Circulation System of Electrostatic Chuck and Semiconductor Etching Machine. This invention was developed by Lyu Kangli, Xu Kaidong, Li Na, Wang Jinxin, Liu Wei, Hu Dongdong and Zhang Chen.
The patent application number is CN20..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has received Hefei Sineva Intelligent Machine patent application for Donor Substrate and Chip Transfer Method. Li Guozhu, Wang Haihong, Gao Jiangwen, Li Zhongqian, Tang Ming and Xiao Qiang developed the invention.
The patent application number is CN202411901873 20..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has received Dongguan Attach Point Intelligent Equipment Co Ltd patent application for Wedge Error Compensation Device, Wafer Bonding Equipment and Compensation Method Thereof. Chen Shubin, Zheng Tao, Wang Yihao, Jiang Ruiqian, Ye Tongdi, Wu Xiaohong and Wu Zeguang..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- SEMES has submitted a patent application for Transfer Module and Substrate Processing Apparatus Including Same. Li Xue and Kim Seung Won developed the invention.
The patent application number is CN202511558130 20251029. The patent publication number is CN122294885 (A). International Patent Classification co..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has published Shenzhen Zhuoxing Advanced Packaging Technology patent application for Zr Axis Module and Rotating Disc Type Bonding Head Mechanism. The invention was developed by Zeng Yi, Chen Guanhai and Xiao Zhengxiong.
The patent application number is CN202610..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Dongguan Attach Point Intelligent Equipment Co Ltd has submitted a patent application for Self-adaptive Pressing Plate and Chip Packaging Equipment. Chen Shubin and Ouyang Xiaolong developed the invention.
The patent application number is CN202610390430 20260327. The patent publication number is CN1222948..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Zhenjiang Meiernai Tech Co Ltd has applied Chinese patent for Cover Removing Device for Wafer Cleaning Rod Processing. Ni Ting and Zhang Honggang developed it.
The patent application number is CN202610178242 20260208. The patent publication number is CN122294868 (A). International Patent Classification co..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- SEMES has filed a patent application for Substrate Processing Apparatus. This invention was developed by Jang Kyu-hwan, Eom Sung-hoon and Kang Ki-moon.
The patent application number is CN202511963653 20251224. The patent publication number is CN122294867 (A). International Patent Classification codes are B0..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- SCREEN Holdings has submitted a patent application for Substrate Processing Apparatus and Substrate Processing Method. This invention was developed by Endo Toru.
The patent application number is CN202511948113 20251223. The patent publication number is CN122294866 (A). International Patent Classification co..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- SEMES has submitted a patent application for Plate Conveying Device and Semiconductor Element Processing System. Roh Hee-beom and Park Young-hwa developed the invention.
The patent application number is CN202511896764 20251216. The patent publication number is CN122294864 (A). International Patent Classific..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Zhaomo Semiconductor Equipment Shanghai Co Ltd has been granted a patent for Carrying Structure for Semiconductor Disc Material. Miao Xufeng developed the invention.
The patent application number is CN202423189160U 20241224. The patent publication number is CN223687574 (U). International Patent Classifica..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Chinese Patent for Three-dimensional Air Floating Platform Based on Ceramic Silicon Carbide Moving Bridge has been issued to Qingdao Xinguozha Prec Instrument Co Ltd. This invention was developed by Yu Joo-young.
The patent application number is CN202520346292U 20250303. The patent publication number is C..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has awarded a patent to Henan GCL Photovoltaic Tech Co Ltd for Automatic Punching Device for Square Silicon Core Cross Beam. Guo Yanqi and Lyu Zhuoran developed the invention.
The patent application number is CN202423134919U 20241218. The patent publication numb..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Chinese Patent for Diamond Hole Drill with Chip Removal Function has been issued to Hebei Bolaiwei Diamond Tools Co Ltd. This invention was developed by Lu Cunjie, Zhao Liqiang and Zhao Kuo.
The patent application number is CN202520258108U 20250218. The patent publication number is CN223685749 (U). Intern..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Wuhu Token Sciences has been granted a patent for Device for Adjusting Position of Transverse Rod of Coated Substrate Trolley. Zheng Jianjun, Lyu Rujun, Zhu Changqing, Qin Jiachun, Chen Wandong and Jiang Yuqiang developed the invention.
The patent application number is CN202423270960U 20241230. The patent p..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- Infineon Technologies, Austria has submitted a patent application for a Power Converter. Saggini Stefano, Rizzolatti Roberto, Ursino Mario, Iob Federico and Deboy Gerald Josef developed the invention.
The patent application number is EP20250196848 20250819. The patent publication number is EP4807967 (A1). In..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- Bitdeer Semiconductor Tech Pte Ltd has sought patent for Virtual Currency Computing Chip Package and Circuit Device. This invention was developed by Dai Qiang.
The patent application number is EP20240887234 20240221. The patent publication number is EP4807790 (A1). Cooperative Patent Classification codes a..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- ASML Netherlands has applied European patent for Substrate Holder. Mück Marcel, Klemm Hagen William and Franke René developed it.
The patent application number is EP20250163275 20250312. The patent publication number is EP4807789 (A1). Cooperative Patent Classification codes are H10P72/0428 (EP), H10P72/72..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Cover Device, Process Chamber and Semiconductor Process Apparatus. This invention was developed by Liu Dongxu and Wang Guangyong.
The patent application number is EP20240902686 20241205. The patent publication number is EP4807788..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- Fujifilm has submitted a patent application for Chemical Liquid, Method for Treating Object to be Treated, and Method for Producing Semiconductor Device. This invention was developed by Miyazaki Kosuke, Ohtsu Akihiko, Takahashi Tomonori and Takahashi Kazutaka.
The patent application number is EP20240888583 2..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Chugoku Marine Paints has applied Chinese patent for Anti-corrosion Coating Composition Set, Method for Producing Anti-corrosion Coating Composition, Anti-corrosion Coating Film, Substrate with Anti-corrosion Coating Film, and Method for Producing Substrate with Anti-corrosion Coating Film. Urano Shoki, Hara..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Chinese Patent for Splash-proof Electroplating Brightener Filling Device has been issued to Anhui Tuopu Surface Treat Technology Co Ltd. This invention was developed by He Hui.
The patent application number is CN202520241751U 20250217. The patent publication number is CN223688096 (U). International Patent..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has awarded a patent to Shenlishijie (Shenzhen) Culture Technology and Shenzhen Tailong Visual Sense Tech Co Ltd and Dayu Lejia Vision Tech Guangdong Co Ltd for LED Driving Chip. Wu Tao and Zhang Zhe developed the invention.
The patent application number is CN20..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Shenzhen Greda Ind Co Ltd has been granted a patent for Electromagnetic Oven Integrated Circuit. This invention was developed by Hao Jinbing.
The patent application number is CN202422850853U 20241121. The patent publication number is CN223681221 (U). International Patent Classification codes are H05B6/04 ..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- ASML Netherlands has submitted a patent application for Measurement Device and Associated Method. Kumble Aaron B, Gueden Sebastianus Adrianus and Tukker Teunis Willem developed the invention.
The patent application number is CN20248076437 20241113. The patent publication number is CN122295554 (A). Internati..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has released Panasonic Intellectual Property Management patent application for Cured Product of Resin Composition, Wiring Board, and Semiconductor Package. This invention was developed by Saito Hirosuke and Takashiro Junichi.
The patent application number is CN202..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- European Patent Office has received SK Hynix patent application for Memory Device and Programing Method of Memory Device. Kim Jong Woo and Jo Eun Woo developed the invention.
The patent application number is EP20250212207 20251030. The patent publication number is EP4807744 (A1). International Patent Classif..
Semiconductor
| Sat 26 Sep 2026
Munich, Sept. 25 -- Samsung Electronics has sought patent for Semiconductor Memory Device with Strap Element. This invention was developed by Tang Hoyoung, Baeck Sang-yeop, Lee Eojin and Kim Tae-hyung.
The patent application number is EP20260157817 20260211. The patent publication number is EP4807740 (A1). International Patent ..
Semiconductor
| Sat 26 Sep 2026
Beijing, Sept. 25 -- Versum Materials US has filed a patent application for Hydrofluorocarbon Compounds and Their Use in Integrated Circuit Fabrication Processes. This invention was developed by Mergner Thomas, Finze Maik, Kirsch Peter, Knoopletz Thomas, Stender Matthias, Schneider Lawrence N, Braun Frank and Ignatyev Nikolai.
..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- State Intellectual Property Office of China has awarded a patent to Zhejiang Yingfujia Supply Chain Tech Co Ltd for Protective Device for Circular Packaging of Silicon Wafers. Gong Donglin and Zhang Enbo developed the invention.
The patent application number is CN202520119522U 20250117. The patent publica..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Yangzhou Shenghuan Tech Co Ltd has been granted a patent for Bentonite Powder Silicon Reduction Equipment. Dong Wenxin and Wu Shilang developed the invention.
The patent application number is CN20252035129U 20250108. The patent publication number is CN223683389 (U). International Patent Classification cod..
Semiconductor
| Fri 25 Sep 2026
Beijing, Sept. 25 -- Changchun Fusheng Anchuang Auto Parts has obtained a patent for spraying system at top of electroplating line waste gas tower. This invention was developed by Lyu Jingwei and Wang Bin.
The patent application number is CN202422684394U 20241105. The patent publication number is CN223683293 (U). International ..
1
to
100 of
1710 Items
Next >>
![Close [X]](../images/close.gif){kind=small}
![Close [X]](https://www.globalipnews.com/images/close.gif){kind=small}
