GlobalIPNews

Sign Up
|
Login
|

17:21:32 Fri 10 Jul 2026

Home
About Us
Industry
Assignee
Country
Support
Products
Services
View ALl

News For Last 1 Week

Industry

X

Assignee

X

Samsung Electronics

(92)

Micron Technology

(66)

(55)

Taiwan Semiconductor Mfg

(52)

(48)

Taiwan Semiconductor Manu

(46)

(42)

Applied Materials

(37)

(35)

Texas Instruments

(32)

ASML Netherlands

(29)

Infineon Technologies

(26)

SK Hynix Nand Product Sol

(23)

Taiwan Semiconductor Manu

(23)

GlobalFoundries

(22)

Sony Semiconductor Soluti

(22)

Chongqing Xinlian Microel

(21)

(21)

(20)

Mitsubishi Electric

(19)

Chengdu Boe Optoelect Tec

(18)

Realtek Semiconductor Cor

(18)

STMicroelectronics Intern

(17)

Yangtze Memory Technologi

(17)

Semiconductor Energy Labo

(16)

Zhuhai Gree Electronic Co

(16)

(15)

Rongyao Terminal

(15)

BOE Technology Group

(14)

Huawei Technologies

(13)

Texas Instruments Incorpo

(13)

(12)

United Microelectronics C

(12)

Beijing NAURA Microelectr

(11)

SCREEN Holdings

(11)

Microchip Technology

(10)

Xincun Technology (Wuhan)

(10)

Beijing Xuanjie Technolog

(9)

Hefei Nexchip Integrated

(9)

Nat Ct Advanced Packaging

(9)

(9)

Shanghai Weijing Electron

(9)

Toshiba Electronic Device

(9)

Fujian Jinhua Integrated

(8)

Infineon Technologies, Au

(8)

Kokusai Electric

(8)

Nanya Technology

(8)

(8)

Chengdu BOE Optoelectroni

(7)

(7)

(7)

(7)

(7)

(7)

SanDisk Technologies

(7)

Semiconductor Components

(7)

Suzhou Guoxian Innovation

(7)

Taiwan Semiconductor Manu

(7)

Western Digital Tech Inc

(7)

Wuxi Xinzhuo Huguang Semi

(7)

(6)

Applied Materials Israel

(6)

ChangXin Memory Technolog

(6)

KK Nihon Micronics

(6)

(6)

Peking University Chongqi

(6)

Quanzhou Sanan Semiconduc

(6)

Shenzhen Xinkailai Indust

(6)

58th Research Inst Of Cet

(5)

Chengdu Boe Optoelect Tec

(5)

Chengdu Boe Optoelectroni

(5)

Jiangxi MTC Semiconductor

(5)

(5)

(5)

(5)

(5)

Renesas Electronics

(5)

Samsung Display

(5)

Sandisk Technologies Inc

(5)

(5)

(5)

Spreadtrum Semiconductor

(5)

(5)

Wuxi Canghai Yunfan Elect

(5)

ASM International Holding

(4)

Advanced Semiconductor En

(4)

BOE Technology Group Co L

(4)

(4)

Chengdu Yicheng Integrate

(4)

Forehope Semiconductor Ni

(4)

(4)

Gree Electric Appliances,

(4)

Guangdong Aiko Solar Ener

(4)

Hamamatsu Photonics

(4)

Harbin Inst Of Technology

(4)

Hf Smat Microtech Co

(4)

Hon Hai Precision Industr

(4)

Hongrun Semiconductor (Su

(4)

Hubei Jiangcheng Chip Pil

(4)

Jiangsu Third Generation

(4)

Jiangsu Tianxin Micro Sem

(4)

Jiangxi MTC Semiconductor

(4)

(4)

Mewburn Ellis Llp [gb]; R

(4)

Murata Manufacturing

(4)

(4)

Nippon Electric Glass

(4)

Nuvoton Technology

(4)

Puya Semiconductor, Shang

(4)

Semiconductor Manufacturi

(4)

Shanghai Xinaoxinyi Tech

(4)

Shanghai Xinwei Semicondu

(4)

Shengjisheng Ningbo Semic

(4)

Silergy Semiconductor Tec

(4)

Suzhou Focused Photonics

(4)

Suzhou Weishichuangxin Te

(4)

Wuhan China Star Optoelec

(4)

Yangtze Memory Holdings C

(4)

3peak Incorporated

(3)

ACM Research, Shanghai

(3)

Amkor Technology Singapor

(3)

Applied Materials Israel

(3)

BOE Huacan Optoelectronic

(3)

BOE Technology Group Co L

(3)

Beihang University

(3)

Beijing Boe Tech Developm

(3)

Beijing Xiaomi Mobile Sof

(3)

CSMC Technologies

(3)

Chengdu Jingxin Mingneng

(3)

Commissariat Energie Atom

(3)

Feizeng Semiconductor Sha

(3)

GlobalFoundries Singapore

(3)

Guangzhou China Star Opto

(3)

(3)

Hefei BOE Ruisheng Techno

(3)

Hefei Jiufu Semiconductor

(3)

Heilongjiang Huixin Semic

(3)

Hitachi High Technologies

(3)

Huzhou Chunhuo Photoelect

(3)

(3)

Infineon Technologies Ame

(3)

Institute of Microelectro

(3)

Jiangsu Wuxi Jingwei Tian

(3)

Jilin University

(3)

KLA Corporation

(3)

Lattice Art Semiconductor

(3)

Lianhe Storage Technology

(3)

Lumileds Singapore Pte Lt

(3)

(3)

Medtrum Tech Co Ltd

(3)

MeetFuture Technology (Sh

(3)

Microsoft Technology Lice

(3)

Nordic Semiconductor

(3)

(3)

Panasonic Intellectual Pr

(3)

Qingdao Xinxin Microelect

(3)

Rec Solar Pte Ltd [sg]; M

(3)

Rongxin Semiconductor Hua

(3)

Sandisk Technology

(3)

Shanghai Chuangxian Semic

(3)

Shanghai Optical Communic

(3)

Shanghai Xizhi Technology

(3)

Shenzhen Goodix Technolog

(3)

Shibaura Mechatronics

(3)

(3)

(3)

South China University of

(3)

Suteng Innovation Technol

(3)

Suzhou Nanowin Science An

(3)

TCL China Star Optoelectr

(3)

Taiwan Semiconductor Manu

(3)

Taizhou Guanyu Technology

(3)

The 55th Research Inst Of

(3)

Tohoku University

(3)

Tongfu Microelectronics

(3)

Unimicron Technology

(3)

Vanguard International Se

(3)

Weishi Advanced Intellige

(3)

Winbond Electronics

(3)

Wuhan Optics Valley Infor

(3)

Wuhan Xinchuangyuan Semic

(3)

Wuxi Photon Chip United R

(3)

Xiamen Sanan Integrated C

(3)

Xinlian Integrated Circui

(3)

Yangzhou Carbon Zhonghe T

(3)

Zhejiang Lishui Zhongxin

(3)

Zhuhai Nanxin Semiconduct

(3)

Zhuzhou CRRC Times Semico

(3)

(2)

(2)

Anhui Microchip Changjian

(2)

Anhui University

(2)

(2)

AutoNetworks Technologies

(2)

BOE Mled Technology Co Lt

(2)

BOE Technology Group; Bei

(2)

Beijing Boe Display Tech

(2)

Beijing Boe Technology De

(2)

Beijing Boe Technology De

(2)

Beijing Jiachuang Huaxin

(2)

Beijing Semiconductor Spe

(2)

Beijing Suanneng Tech Co

(2)

Beijing Xingyun Integrate

(2)

Beijing Yandong Microelec

(2)

CETC Blue Sky Technology;

(2)

Calterah Semiconductor Te

(2)

ChangXin Technology Group

(2)

Chengdu Chenxian Photoele

(2)

Chengdu Pbm Tech Ltd

(2)

Chengdu Shansiwei Tech Co

(2)

China Electronics Technol

(2)

ChipMOS Technologies (Sha

(2)

Chongqing Lingxin Microel

(2)

(2)

Dainippon Ink & Chemicals

(2)

(2)

Dongjin Semichem

(2)

Elite Semiconductor Micro

(2)

(2)

Enkris Semiconductor

(2)

Ennostar Corp [tw]; Lexta

(2)

(2)

Eternal Mat Co Ltd

(2)

Ferroelectric Memory

(2)

(2)

Guangdong Yuanqizhi Artif

(2)

Guangzhou Baiyun Tech Co

(2)

Guilin University of Elec

(2)

Haiguang Information Tech

(2)

Hangzhou Fullsemi Semicon

(2)

Hefei Xinsheng Optoelectr

(2)

Hoya Lens Thailand

(2)

Huagong Tech Co Limited;

(2)

Huatian Technology Xian C

(2)

Huazhong University of Sc

(2)

Hunan University; Changsh

(2)

Huzhou Jingzhou Semicondu

(2)

ICleague Technology

(2)

(2)

(2)

Jcet Microelectronics Jia

(2)

Jiangsu Leadmicro Nanomet

(2)

Jiangsu Maxscend Microele

(2)

Jiangsu Shanshui Semicond

(2)

Jiangsu Xinde Semiconduct

(2)

Jiangsu Yiwen Microelectr

(2)

Kunshan Jianghong Precisi

(2)

(2)

Lattice Semiconductor

(2)

(2)

Nanjing University

(2)

Nanjing University; Hefei

(2)

Nantong Weisi Paier Semic

(2)

(2)

Ningbo Sailamike New Mate

(2)

Nissan Chemical

(2)

(2)

NuFlare Technology

(2)

(2)

(2)

Piotech Shenyang Semicond

(2)

Power Trans Industrial Co

(2)

Powerchip Semiconductor M

(2)

Pure Optoelectronics Xiam

(2)

Qinghe Electronic Tech Sh

(2)

Resonac Hard Disk

(2)

(2)

SK Hynix Inc [kr]; Korea

(2)

STMicroelectronics Intern

(2)

(2)

Semiconductor Manufacturi

(2)

Semiconductor Mfg Int Tia

(2)

Shanghai Anbang Semicondu

(2)

Shanghai Great Composite

(2)

Shanghai Jet Plasma Tech

(2)

Shanghai Linecore Electro

(2)

Shenyang Heyan Tech Co Lt

(2)

Shenzhen Aixiesheng Techn

(2)

Shenzhen Chenyue Storage

(2)

Shenzhen Hengchangtong El

(2)

Shenzhen Pinghu Laborator

(2)

(2)

Smartsens Shenzhen Tech C

(2)

(2)

Southeast University

(2)

Suzhou Xinshinuo Semicond

(2)

Suzhou Zhenkun Tech Co Lt

(2)

Swm Holdco Luxembourg

(2)

Taiwan-Asia Semiconductor

(2)

Tan Kah Kee Innovation La

(2)

Tianfu Jiangxi Laboratory

(2)

Tianma New Display Techno

(2)

Tianyi Cloud Technology

(2)

Tokuyama Corporation

(2)

Tokyo Ohka Kogyo

(2)

Tongwei Solar, Chengdu

(2)

Toshiba; Toshiba Electron

(2)

Uif Univ Industry Foundat

(2)

Unimicron Technology Suzh

(2)

(2)

Wuxi China Resources Huaj

(2)

Wuxi Xichan Microchip Sem

(2)

Wuxi Zhixian Weilai Tech

(2)

Wuxi Zhongxing Micro Syst

(2)

Xiamen Anjieli Meiwei Tec

(2)

Xian Longwei Semiconducto

(2)

Xintianxia Tech Co Ltd

(2)

(2)

Yunnan Chuangshijie Optoe

(2)

Zhejiang Juexin Microelec

(2)

Zhejiang Liufang Semicond

(2)

Zhejiang University

(2)

Zhengzhou University

(2)

Zhonghao Xinying Hangzhou

(2)

Zhouhengdeyuan Environmen

(2)

Ziguang Tongxin Microelec

(2)

ACM Research, Shanghai; S

(1)

ASUSTeK Computer

(1)

(1)

AUO Corporation

(1)

(1)

Adeia Semiconductor Bondi

(1)

Advanced Micro Devices

(1)

Advanced Micro Devices In

(1)

Advanced Micro-Fabricatio

(1)

Advanced RISC Machines

(1)

(1)

Aifa Jiangsu Machinery Eq

(1)

Ainstec Perception Intell

(1)

Alibaba Damoyuan Hangzhou

(1)

Alipay Hangzhou Digital S

(1)

(1)

Allegro MicroSystems

(1)

Alliance For Energy Innov

(1)

Alos Semiconductor Ltd

(1)

(1)

(1)

Amber Intelligence Semico

(1)

American Axle & Manufactu

(1)

Ami Precision Control Tec

(1)

Angell Tech Shenzhen Co L

(1)

Anhui Dapeng Semiconducto

(1)

Anhui Jingxin Tech Co Ltd

(1)

Anhui Luoqian Control Sys

(1)

Anhui Xinxin Semiconducto

(1)

Anhui Xinyuchi Semiconduc

(1)

Anjiki Takashi [de]; Appl

(1)

Aoxinming Semiconductor E

(1)

Apogee Semiconductor Inc

(1)

Argo Semiconductors Sa

(1)

Ark Hdps Semiconductor Pt

(1)

Army Engineering Universi

(1)

(1)

Ase Semiconductor Shangha

(1)

Asml Netherland Bv [nl];

(1)

Asml Netherlands Bv [nl];

(1)

Asml Netherlands Bv [nl];

(1)

Avago Technologies Genera

(1)

Avago Technologies Intern

(1)

Avary Holding, Shenzhen;

(1)

BOE Mled Tech Co Ltd [cn]

(1)

BOE Mled Technology Co Lt

(1)

BOE Technology Group Co L

(1)

BOE Technology Group Co L

(1)

BOE Technology Group; Mia

(1)

(1)

Barry Cordage Ltd

(1)

(1)

Beifang University of Nat

(1)

Beijing Aerospace Times O

(1)

Beijing Baogang Steel Tec

(1)

Beijing Boe Display Tech

(1)

Beijing Boe Sensor Tech C

(1)

Beijing Boe Sensor Techno

(1)

Beijing Boe Tech Developm

(1)

Beijing E Town Semiconduc

(1)

Beijing ESWIN Computing T

(1)

Beijing Electric Control

(1)

Beijing Gl Microelectroni

(1)

Beijing Hongtu Semiconduc

(1)

Beijing Horizon Informati

(1)

Beijing Horizon Robotics

(1)

Beijing Huawei Digital Te

(1)

Beijing Huixintong Electr

(1)

Beijing Institute of Radi

(1)

Beijing Kaiyuan Chip Rese

(1)

Beijing Panxin Microelect

(1)

Beijing Remote Sensing Eq

(1)

Beijing Rongzhi Shikong T

(1)

Beijing Shuiying Liuxin T

(1)

Beijing Tsing Micro Intel

(1)

Beijing University

(1)

Beijing University of Tec

(1)

Beijing University; Beiji

(1)

Beijing Visionox Technolo

(1)

Beijing Xiaomi Songguo El

(1)

Beijing Xindatong Tech Co

(1)

Beijing Xinji Tech Co Ltd

(1)

Beijing Yichen Shidai Tec

(1)

Beijing Yiqi Tech Co Ltd

(1)

Beijing Yunchi Future Tec

(1)

Beijing Zesheng Tech Co L

(1)

Beijing Zhixin Semiconduc

(1)

Beijing Zhiyuan Artificia

(1)

Beijing Zhongke Xinweite

(1)

Beijing Ziguang Qingteng

(1)

Bestechnic Shanghai

(1)

(1)

(1)

Bohai New Energy (Hefei)

(1)

(1)

Brooks Automation US

(1)

(1)

Byd Co Limited; BYD Semic

(1)

Byd Co Limited; Ningbo By

(1)

CSG Holding; Yichang Csg

(1)

(1)

Cambricon Xi\'an Semicond

(1)

(1)

Carl Zeiss Smt Gmbh [de];

(1)

(1)

Central Glass Co Limited

(1)

Chalco Shanxi New Materia

(1)

Changchun Haipurunsi Tech

(1)

Changchun Huicheng Tech C

(1)

Changsha University of Sc

(1)

Changsha Yicheng Tech Co

(1)

Changsha Zhaotong Microel

(1)

Changxin Memory Tech Inc

(1)

Changzhou Chengxin Semico

(1)

Changzhou Correll Tech Co

(1)

Changzhou Hongcheng Elect

(1)

Changzhou Yuanjing Moer M

(1)

Changzhou Zhongtian Speci

(1)

(1)

Chengdu Aiwei Microelectr

(1)

Chengdu BOE Optoelectroni

(1)

Chengdu Boe Optoelect Tec

(1)

Chengdu Gaozhen Technolog

(1)

Chengdu Guokexin Tech Co

(1)

Chengdu Kanuopu Robot Tec

(1)

Chengdu Monolithic Power

(1)

Chengdu Shiyuan Frequency

(1)

Chengdu Silike Tech Co Lt

(1)

Chengdu University of Inf

(1)

Chengdu Xinhaichuangxin T

(1)

Chengdu Xinxing Lifly Rob

(1)

Chengdu Yingsijia Semicon

(1)

Chengdu Yunbao Chuangxin

(1)

Chenri Tech Nanjing Co Lt

(1)

Chery Automobile; Anhui K

(1)

China Electronic Technolo

(1)

China Jiliang University

(1)

China Resources Microelec

(1)

China Satellite Network I

(1)

China Southern Power Grid

(1)

(1)

China Three Gorges; Three

(1)

Chip Wealth Tech Ltd

(1)

(1)

Chongqing Lanshan Electro

(1)

Chongqing One Tale Electr

(1)

Chongqing Semi Chip Elect

(1)

Chongqing Tsingshan Indus

(1)

Chongqing University of P

(1)

(1)

Chuangsheng Semiconductor

(1)

Chuanze Tech Wuhan Co Ltd

(1)

Chuanzhou Semiconductor T

(1)

Chugoku Marine Paints

(1)

Chuzhou Huike Optoelectro

(1)

Cirrus Logic Int Semicond

(1)

Cixi Biomedical Research

(1)

Cixin Tech Group Co Ltd

(1)

Cnbm Zhejiang Material Te

(1)

Cnmc Ningxia New Mat Co L

(1)

Compal Electronics

(1)

(1)

Csem Ct Suisse Delectroni

(1)

(1)

Csmc Technologies Fab2 Co

(1)

Csmc Technologies Fab2 Co

(1)

Dachuan Semiconductor Equ

(1)

(1)

Dalian Polytechnic Univer

(1)

Dalian University of Tech

(1)

Dayun Prec Industry Xiame

(1)

Dazheng Xiamen Micro Nano

(1)

(1)

Dengfeng Chuangwei Carbid

(1)

Dier Laser Technology (Wu

(1)

Dingdao Zhixin (Shanghai)

(1)

(1)

Dongbu Hitek Co Ltd

(1)

Dongfeng Motor Group

(1)

Dongguan Lingying Tech Co

(1)

Dowa Electronics Material

(1)

Dynax Semiconductor

(1)

Dynex Semiconductor Ltd [

(1)

EV Group E Thallner

(1)

Eagle Xience Tech Limited

(1)

Earth Mountain (Suzhou) M

(1)

Ecu Electronics Ind Co Lt

(1)

Elane Beijing Data Tech C

(1)

Electronics & Telecommuni

(1)

Episil Tech Inc

(1)

(1)

(1)

Flashsilicon Inc

(1)

Forehope Electronic Ningb

(1)

Forty Eighth Research Ins

(1)

Foshan Tiansi Hardware

(1)

Francisco Andrew Louie Mo

(1)

Fraunhofer-Gesellschaft

(1)

Freedom Photonics

(1)

Fudan University

(1)

Fujian Liangjingjing Tech

(1)

Fujian Youda Environmenta

(1)

Fujifilm Commercial Innov

(1)

Fujifilm Electronic Mat U

(1)

Furukawa Electric

(1)

Furukawa Electric Co Ltd

(1)

(1)

Ge Infrastructure Technol

(1)

Gechuang Dongzhi Shanghai

(1)

Geke Semiconductor Shangh

(1)

Gexin USA Integrated Circ

(1)

Giesecke Devrient

(1)

GigaDevice Semiconductor

(1)

(1)

Gmc Semiconductor Technol

(1)

Great Wall Power Tech Co

(1)

Grinm Resources And Envir

(1)

Grinm Semiconductor Mater

(1)

Gsec German Semiconductor

(1)

Guangce Ind Intelligent E

(1)

Guangdong China Techwin P

(1)

Guangdong Fuxin Thermoele

(1)

Guangdong Jinming Machine

(1)

Guangdong Kezhuo Semicond

(1)

Guangdong OPPO Mobile Tel

(1)

Guangdong Senlin Greening

(1)

Guangdong University of T

(1)

Guangdong Xincheng Hanqi

(1)

Guangdong Xinji Shifeng T

(1)

Guangdong Xinyueneng Semi

(1)

Guangdong Yuefang Tech Co

(1)

Guangdong Zhigui Tech Co

(1)

Guangxi Yunxin Semiconduc

(1)

Guangxi Zhuang Autonomous

(1)

Guangzhou Fulede Tech Dev

(1)

Guangzhou Siluoke New Mat

(1)

Guangzhou Tuojie Weicai E

(1)

Guangzhou Zengxin Technol

(1)

Guangzhou Zhiming Microel

(1)

Guilin Xinfeiguang Electr

(1)

Guizhou Daipusen Digital

(1)

Guizhou Inst Of Technolog

(1)

Guizhou Police College

(1)

Guizhou Xinan Aviation Ma

(1)

Guo Can [cn]; Vuong Hung

(1)

Gwangju Inst Science & Te

(1)

HCL Technologies

(1)

(1)

(1)

Haiguang Yunxin Integrate

(1)

(1)

Handan Jinglv Tech Co Ltd

(1)

Hangzhou Daoming Microele

(1)

Hangzhou Guangzhiyuan Tec

(1)

Hangzhou Guojie Energy Te

(1)

Hangzhou Hikvision Digita

(1)

Hangzhou Kelin Electric;

(1)

Hangzhou Lingzhi Tech Co

(1)

Hangzhou Linx Robot Intel

(1)

Hangzhou Mps Semiconducto

(1)

Hangzhou Puyu Tech Dev Co

(1)

Hangzhou Saiken New Mater

(1)

Hangzhou Shuotian Tech Co

(1)

Hangzhou Zhishu Xingchen

(1)

Hangzhou Zhixinke Microel

(1)

Hangzhou Zhongxin Wafer S

(1)

Hanwha Q Cells Gmbh [de];

(1)

Hanwha Semitech Co Ltd

(1)

Harbin Aiwei Microelectro

(1)

Harbin Inst Of Technology

(1)

Harbin Institute of Petro

(1)

Harman International Indu

(1)

Hefei BOE Joint Technolog

(1)

Hefei Boe Optoelectronics

(1)

Hefei Chipsea Electronic

(1)

Hefei Fuxuan Automation T

(1)

Hefei Jinjinye Intelligen

(1)

Hefei Kaimeng Tech Co Ltd

(1)

Hefei Saimokesi Semicondu

(1)

Hefei Weiyun Semiconducto

(1)

Hefei Xianyao Display Tec

(1)

Hefei Xinsheng Optoelectr

(1)

Hejian Tech Suzhou Co Ltd

(1)

Hella GmbH & Co KGaA

(1)

Henan Hongtai Diamond Tec

(1)

Henan Normal University

(1)

Henan Xiangyu Medical Equ

(1)

Hi Trend Tech Shanghai Co

(1)

Hisense Broadband Multime

(1)

Hisense Visual Technology

(1)

(1)

Horizon Zhengcheng Shangh

(1)

Howsson Machinery Mfg Co

(1)

Hoya Optical Tech Weihai

(1)

Hoya Photoelectric Tech W

(1)

Huadian Fukang Power Gene

(1)

Huaian Aucksun Optoelectr

(1)

Huaian Xince Semiconducto

(1)

Huangshi Yongxinglong Ele

(1)

Huaqing Huishang Beijing

(1)

Huatong Xindian Nanchang

(1)

Huawei Digital Power Tech

(1)

Huaxin Jushu Hangzhou Mic

(1)

Huazhong University of Sc

(1)

Hubei Aerospace Chemical

(1)

Hubei Dinglong Co Ltd; Wu

(1)

Hubei Huazhong Changjiang

(1)

Hubei Jiangcheng Laborato

(1)

Hubei Jiangxin New Mat Co

(1)

Hubei Jinzuan Electronic

(1)

Hubei Jiufengshan Laborat

(1)

Hubei Kaiou New Mat Co Lt

(1)

Hubei Nuode Copper Foil N

(1)

Hubei Sanan Optoelectroni

(1)

Hubei Tonggewei Circuit T

(1)

Hue Inc [cn]; Jade Bird D

(1)

Huizhou China Star Optoel

(1)

Huizhou Happy Vaping Tech

(1)

Huizhou Jinghong Precisio

(1)

Huizhou Jufei Optoelectro

(1)

Hunan Charmhigh Electrome

(1)

Hunan Jinyu Environmental

(1)

Hunan Renying Tech Co Ltd

(1)

Hunan University; Yuelu M

(1)

Hunan Xinheji Tech Co Ltd

(1)

Hunan Yuemo Advanced Semi

(1)

Hygon Information Technol

(1)

IMEC VZW; University Leuv

(1)

IRICO Hefei LCD Glass

(1)

ISIS Innovation

(1)

(1)

(1)

Ibm Deutschland [de]; IBM

(1)

Ibm [us]; Ibm Israel Scie

(1)

(1)

(1)

Imagination Technologies

(1)

Industry Univ Cooperation

(1)

Infineon Technologies Ame

(1)

Ingenic Semiconductor Co

(1)

(1)

InnoCare Optoelectronics

(1)

Innoscience Suzhou Semico

(1)

Innoscience Suzhou Techno

(1)

Innoscience Zhuhai Techno

(1)

Inspur Smart Tech Nanjing

(1)

Inst Of Semiconductors Gu

(1)

Institute of Microelectro

(1)

Institute of Semiconducto

(1)

Int Rectifier Corp

(1)

International Business Ma

(1)

International Solar Energ

(1)

(1)

J Metrics Tech Co Ltd [tw

(1)

JSR Corporation

(1)

Jade Bird Display, Shangh

(1)

Jcet Man Co Ltd

(1)

Jenoptik Optical Systems

(1)

(1)

Jiangsu Daxin Semiconduct

(1)

Jiangsu Fulehua Power Sem

(1)

Jiangsu Haojiao Precision

(1)

Jiangsu Huachuang Microsy

(1)

Jiangsu Huyun Plate Makin

(1)

Jiangsu Kaijia Electronic

(1)

Jiangsu Leadmicro Nano Te

(1)

Jiangsu Novoray New Mat C

(1)

Jiangsu Pangu Semiconduct

(1)

Jiangsu Shengchuang Semic

(1)

Jiangsu Shouxin Semicondu

(1)

Jiangsu Tanglong Electron

(1)

Jiangsu Xianghuan Tech Co

(1)

Jiangsu Xinchengrui Mater

(1)

Jiangxi Copper Technology

(1)

Jiangxi Deercheng Semicon

(1)

Jiangxi Feiyu New Energy

(1)

Jiangxi MTC Semiconductor

(1)

Jiangxi Maite Microelectr

(1)

Jiangxi Tuomai Technology

(1)

Jiangxi Xinghuo Aerospace

(1)

Jiangxi Xinjuneng Tech Co

(1)

Jiangxi Xinshijia Optoele

(1)

Jiangxi Zhaochi Integrati

(1)

Jiaxing Research Inst Of

(1)

Jiaxing Wenliang Electron

(1)

Jieweite Tech Suzhou Co L

(1)

Jihua Hengyi Foshan Semic

(1)

Jilin Xuanji Zhichuang Te

(1)

Jingan Optoelectronics Co

(1)

Jingjian Semiconductor Ch

(1)

Jisixin Microelectronics

(1)

Jolywood Suzhou Sunwatt

(1)

Jurong Xingchen New Mat C

(1)

Kale Fans Environment Tec

(1)

Kaneka Corporation

(1)

Kanghao Polymer Mat Scien

(1)

Kateeva; Kedihua Display

(1)

Kehan Tongsheng Wuhan Tec

(1)

Kim Jun Sung [kr]; Ihw In

(1)

Kim Kyung Cheol

(1)

Kingwei Optical (Suzhou)

(1)

(1)

(1)

Koninklijke Philips

(1)

Korea Advanced Inst Of Sc

(1)

Korea Advanced Inst Of Sc

(1)

Korea Electronics Technol

(1)

Korea Inst Of Science And

(1)

Korea University Research

(1)

Korea University Research

(1)

Kuk Il Graphene Co Ltd [k

(1)

Kunshan Govisionox Optoel

(1)

Kunshan Govisionox Optoel

(1)

Kunshan Huixing Prec Mach

(1)

Kunshan Jiadejun Electron

(1)

Kunshan Xinxinan Electron

(1)

Kweichow Moutai

(1)

(1)

L&t Semiconductor Tech Li

(1)

(1)

LG Electronics Inc [kr];

(1)

(1)

Laiying Tech Shanghai Co

(1)

Laplace Xi\'an Technology

(1)

Leland Stanford Junior Un

(1)

(1)

(1)

Liangsheng Digital Artifi

(1)

Lianyungang Zhixin Electr

(1)

Liaoning Hanjing Semicond

(1)

Liaoning Mingshun Tech Co

(1)

Lide Health Tech Guangzho

(1)

(1)

(1)

Littelfuse Semiconductor,

(1)

(1)

Lodestar Licensing Group

(1)

Longxinwei Xian Electroni

(1)

(1)

Loudi Zhongxing Hydraulic

(1)

Lumentum Operations

(1)

Maanshan Green Friend Mac

(1)

Magnachip Semiconductor

(1)

Maijiaoli Shanghai Semico

(1)

Mairuijie Nanjing Semicon

(1)

Mansuri Mozhgan [us]; Pas

(1)

Massachusetts Inst Of Tec

(1)

Mattson Tech Inc [us]; Be

(1)

Max Planck Gesellschaft Z

(1)

Maxim Integrated Products

(1)

Maxio Technology (Hangzho

(1)

Meiken Semiconductor Tech

(1)

Mellanox Technologies

(1)

Micron Technology Inc [us

(1)

Microquanta Co Ltd

(1)

Mindu Innovation Laborato

(1)

Minhe Guangda Carbon Co L

(1)

Mitsubishi Heavy Industri

(1)

Mitsumi Electric

(1)

Mitu Guangdong Tech Co Lt

(1)

Mobileye Vision Technolog

(1)

Monolithic Power Systems

(1)

Morrison Neil [de]; Appli

(1)

(1)

NEO Semiconductor

(1)

(1)

NXP Usa Inc [us]; STMicro

(1)

Nabholz Construction Corp

(1)

Nanjing Guozhao Photoelec

(1)

Nanjing Huarui Microchip

(1)

Nanjing Huatian Advanced

(1)

Nanjing Inst Of Tourism &

(1)

Nanjing Intelligent Appar

(1)

Nanjing Jici Zaikang Medi

(1)

Nanjing Microbonding Semi

(1)

Nanjing Organic Nano Elec

(1)

Nanjing Pairui Semiconduc

(1)

Nanjing Pengchen Qizhi Te

(1)

Nanjing Power Supply Bran

(1)

Nanjing Shengxin Semicond

(1)

Nanjing University of Pos

(1)

Nanjing University of Pos

(1)

Nanjing Yili Xinchuang Se

(1)

Nanjing Youcun Tech Co Lt

(1)

Nankang Nanjing Electroni

(1)

Nantong Fuchuang Prec Man

(1)

Nantong Shangyangtong Int

(1)

National Center for Advan

(1)

National Inst Of Informat

(1)

National Taiwan Univ [tw]

(1)

National University Corpo

(1)

Newmat Beijing Environmen

(1)

(1)

(1)

Ningbo Chengfan Tech Co L

(1)

Ningbo Guangxin Nanometer

(1)

Ningbo Inst Materials Tec

(1)

Ningbo Inst Materials Tec

(1)

Ningbo Inst Of Fudan Univ

(1)

Ningbo Lawrence Surface T

(1)

Ningbo Qingyun Chuangxin

(1)

Ningbo Vulcan Tech Group

(1)

Ningxia Chuangsheng New M

(1)

Ningxia Crystal New Energ

(1)

Ningxia Zhongxin Jingyuan

(1)

Nippon Catalytic Chemical

(1)

(1)

(1)

No 24 Research Inst Of Ce

(1)

No 723 Research Inst Of C

(1)

Nokia Networks France

(1)

(1)

Northwest Electronic Equi

(1)

Nuvoton Technology Corpor

(1)

Omnivision Technologies

(1)

(1)

Panasonic Factory Solutio

(1)

Parker Hannifin

(1)

Partition Semiconductor B

(1)

Pearl River Fishery Resea

(1)

Peng Cheng Laboratory

(1)

(1)

Phoenix Pioneer Technolog

(1)

(1)

(1)

Pingtouge Shanghai Semico

(1)

Politeknik Metal Ve Ticar

(1)

Powdec Kk [jp]; Toyoda Go

(1)

Power Diamond Systems Inc

(1)

Proterial Ltd [jp]; Hitac

(1)

Puke (Qingxin) Circuit Bo

(1)

Purdue Research Foundatio

(1)

Qianliyan Guangzhou Artif

(1)

Qingdao Haier Air-Conditi

(1)

Qingdao Jukanyun Tech Co

(1)

Qingdao Sirui Intelligent

(1)

Qinghai Csg New Energy Te

(1)

Qingxin Tech Co Ltd; ACM

(1)

Qiyimoer Quzhou Integrate

(1)

Qiyimoer Shanghai Semicon

(1)

(1)

(1)

Qualcomm Technologies Inc

(1)

Quanli Microelectronics W

(1)

Quanxin Semiconductor Emp

(1)

Quanzhou Hunan University

(1)

Qujing Yangguang New Ener

(1)

Raymond Lam Wai Kin

(1)

(1)

Recogni Inc [us]; Tensord

(1)

Renesas Electronics Ameri

(1)

Rexon Ind Corporation Ltd

(1)

Rishang Optoelectronics C

(1)

Robert Bosch Co Limited

(1)

Rockchip Electronics

(1)

Rongcheng Geer Technology

(1)

Ruhr Univ Bochum Koerpers

(1)

(1)

(1)

SK Enpulse Co Ltd [kr]; Y

(1)

SK Hynix Inc [kr]; Ewha U

(1)

SK Hynix Inc [kr]; SK Tri

(1)

SK Hynix Inc [kr]; Seoul

(1)

SK Hynix Memory Solutions

(1)

SK Hynix Nand Product Sol

(1)

ST Microelectronics Greno

(1)

ST Microelectronics Pte L

(1)

ST Microelectronics Srl [

(1)

STMicroelectronics Crolle

(1)

SV Senstech (Wuxi)

(1)

Safran [fr]; Safran Landi

(1)

Samsung Electonics Co Ltd

(1)

(1)

Sanechips Technology

(1)

Sanhe Tongfei Refrigerati

(1)

Saultech Tech Co Ltd

(1)

Sbt Semiconductor Equipme

(1)

(1)

Semes Co Ltd [kr]; Samsun

(1)

Semes Co Ltd [kr]; Seoul

(1)

(1)

Semiconducto Energy Labor

(1)

Semikron Danfoss Electron

(1)

Sentec E&e Co Ltd [tw]; I

(1)

Shaanxi Dexinxiang Specia

(1)

Shaanxi Guangtai Lingxin

(1)

Shaanxi Lichuang Jingyuan

(1)

Shaanxi Shuyi Tech Co Ltd

(1)

Shaghai Huali Microelectr

(1)

Shagnhai Huitian New Chem

(1)

Shandong Connell Silicon

(1)

Shandong Juhe Huanqiu New

(1)

Shandong Liansheng Electr

(1)

Shandong Sinochip Semicon

(1)

Shandong Sport University

(1)

Shandong Zhisheng Electro

(1)

Shangai Huali Microelectr

(1)

Shanghai Advanced Silicon

(1)

Shanghai Archiwave Microe

(1)

Shanghai Atom Qizhi Semic

(1)

Shanghai Awinic Technolog

(1)

Shanghai Belling Co Ltd

(1)

Shanghai Chipanalog Micro

(1)

Shanghai Chipon Microelec

(1)

Shanghai Dingtai Jiangxin

(1)

Shanghai Eswin Computing

(1)

Shanghai Fine Chip Semico

(1)

Shanghai Fudan Microelect

(1)

Shanghai Fullhan Microele

(1)

Shanghai Huahong Grace Se

(1)

Shanghai Huali Integrated

(1)

Shanghai Huali Integrated

(1)

Shanghai Inst Of Microsys

(1)

Shanghai Institute of Sat

(1)

Shanghai Institute of Tec

(1)

Shanghai Jiao Tong Univer

(1)

Shanghai Jiaze Hexin Ind

(1)

Shanghai Jita Semiconduct

(1)

Shanghai Longwan Invest H

(1)

Shanghai Ncatest Technolo

(1)

Shanghai Quantum Scient R

(1)

Shanghai Simwings Tech Co

(1)

Shanghai Sunto Semiconduc

(1)

Shanghai Thinktech Inform

(1)

Shanghai Weice Semiconduc

(1)

Shanghai Wenyuange Biotec

(1)

Shanghai Xianfeng Tech Co

(1)

Shanghai Xinliji Semicond

(1)

Shanghai Xinqian Integrat

(1)

Shanghai Yanmu Optoelectr

(1)

Shanghai Zhixin Electric

(1)

Shangyu Semiconductor Mat

(1)

Shantou Ouyue Tech Co Ltd

(1)

Shaoxing Yuanfang Semicon

(1)

Shenzhen Apg Mat Co Ltd

(1)

Shenzhen Beidou Communica

(1)

Shenzhen Biological Mfg I

(1)

Shenzhen Boardtech Co Ltd

(1)

Shenzhen Bodawei Electron

(1)

Shenzhen China Star Optoe

(1)

Shenzhen Chip Testing Tec

(1)

Shenzhen Clear Tech Co Lt

(1)

Shenzhen Damei Semiconduc

(1)

Shenzhen Daxin Automation

(1)

Shenzhen Demingli Technol

(1)

Shenzhen GSD Tech

(1)

Shenzhen Hongjingwei Tech

(1)

Shenzhen Huicun Semicondu

(1)

Shenzhen Increcare Biotec

(1)

Shenzhen Ingenic Time Sem

(1)

Shenzhen Inst Inf Tech

(1)

Shenzhen Inst Of Artifici

(1)

Shenzhen Jiahejingwei Ele

(1)

Shenzhen Kaiyang Electron

(1)

Shenzhen Kangteshi Intell

(1)

Shenzhen Keluo Tuchuang T

(1)

Shenzhen Lisan Electromec

(1)

Shenzhen Lishang Precisio

(1)

Shenzhen Pengjin High Tec

(1)

Shenzhen Pengxinwei Integ

(1)

Shenzhen Pengxinxu Tech C

(1)

Shenzhen Qualisell Ind Co

(1)

Shenzhen Refond Optoelect

(1)

Shenzhen Rongwei New Mat

(1)

Shenzhen Sicarrier Ind Ma

(1)

Shenzhen Skyworth Digital

(1)

Shenzhen Staof New Materi

(1)

Shenzhen State Microchip

(1)

Shenzhen Sunmenta Electro

(1)

Shenzhen Technology Unive

(1)

Shenzhen Tongyuexin Tech

(1)

Shenzhen Tuoruipu Tech Co

(1)

Shenzhen Union Tenda Tech

(1)

Shenzhen United Blue Ocea

(1)

Shenzhen Vgsemi Semicondu

(1)

Shenzhen Wisdom Xintu Tec

(1)

Shenzhen Xingguanghua Opt

(1)

Shenzhen Xinhai Microelec

(1)

Shenzhen Xinsheng Semicon

(1)

Shenzhen Xintong Electron

(1)

Shenzhen Xinyan Semicondu

(1)

Shenzhen Xinyichang Techn

(1)

Shenzhen Xinyuan New Mat

(1)

Shenzhen Yongxing Tech Co

(1)

Country

X

China Patent News

WIPO Patent News

European Patent News

Status

X

1 - 100 of 2856 Items

Sign In / Subscribe

Select All

Share
Download as Excel
Download as PDF

Salmontech Inc Applies for Patent on Method for Manufacturing Laminated Substrate with Piezoelectric Film

Semiconductor

| Fri 10 Jul 2026

Geneva, July 10 -- Salmontech Inc has applied WIPO patent for Method for Manufacturing Laminated Substrate with Piezoelectric Film. Tanabe Masayuki developed it. The patent application number is WO2024JP45539 20241223. The patent publication number is WO2026140040 (A1). International Patent Classification code is H10N30/078. ..

CSL Plasma Inc Submits WIPO Patent Application for Methods and Systems for Plasma Processing

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- CSL Plasma Inc has submitted a patent application for Methods and Systems for Plasma Processing. This invention was developed by Tsui Chiahao and Brinkman Nathan. The patent application number is WO2025IB63357 20251223. The patent publication number is WO2026139868 (A1). International Patent Classification ..

Ningbo Qingyun Chuangxin Tech Co Ltd Files WIPO Patent Application for Modular MOS Transistor Layout Structure Having Standard Cell, and Usage Method

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- Ningbo Qingyun Chuangxin Tech Co Ltd has filed a patent application for Modular MOS Transistor Layout Structure Having Standard Cell, and Usage Method. This invention was developed by Huang Xueying, Chang Cheng and Zhou Tianjia. The patent application number is WO2025CN131818 20251031. The patent publicatio..

National University Corporation Kyoto Institute Of Technology Submits Patent Application for Method for Manufacturing Semiconductor Thin Film and Method for Manufacturing Semicondu..

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- National University Corporation Kyoto Institute Of Technology has submitted a patent application for Method for Manufacturing Semiconductor Thin Film and Method for Manufacturing Semiconductor Device. Hosaka Shoma, Nishinaka Hiroyuki and Kaneko Masahiro developed the invention. The patent application number..

Shenzhen United Blue Ocean Application Materials Tech Co Ltd Seeks Patent for Semiconductor Device Structure, Preparation Method Therefor, and Corresponding Chip

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- Shenzhen United Blue Ocean Application Materials Tech Co Ltd has sought patent for Semiconductor Device Structure, Preparation Method Therefor, and Corresponding Chip. This invention was developed by Ren Changyou, Wang Tong and Deng Chuan. The patent application number is WO2025CN128940 20251021. The patent..

Shanghai Longwan Invest Holding Co Ltd Seeks Patent for Zero-carbon Perovskite Solar Cell and Six-constant Intelligent Control System

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- Shanghai Longwan Invest Holding Co Ltd has sought patent for Zero-carbon Perovskite Solar Cell and Six-constant Intelligent Control System. This invention was developed by Xu Shilong. The patent application number is WO2025CN127962 20251016. The patent publication number is WO2026138085 (A1). International ..

State Intellectual Property Office of China Receives Qingdao Jukanyun Tech Co Ltd Patent Application for Display Equipment and Wafer Image Acquisition Method

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has received Qingdao Jukanyun Tech Co Ltd patent application for Display Equipment and Wafer Image Acquisition Method. Eom Eun-bin developed the invention. The patent application number is CN202511786645 20251128. The patent publication number is CN121814945 (A)...

Nanjing Intelligent Apparatus Seeks Patent for Embedded Ethernet Port Expansion Method Based on VLAN (virtual Local Area Network) and Switch Chip

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Nanjing Intelligent Apparatus has sought patent for Embedded Ethernet Port Expansion Method Based on VLAN (virtual Local Area Network) and Switch Chip. This invention was developed by Yin Zhengqing and Zhang Hang. The patent application number is CN202511908835 20251217. The patent publication number is CN..

Hunan Charmhigh Electromechanical Co Ltd Submits Chinese Patent Application for Feida Arrangement Optimization System and Method of In-line Head-mounted Chip Mounter

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Hunan Charmhigh Electromechanical Co Ltd has submitted a patent application for Feida Arrangement Optimization System and Method of In-line Head-mounted Chip Mounter. This invention was developed by Liang Qing. The patent application number is CN202511973260 20251225. The patent publication number is CN121..

Haisemi Inc Submits Patent Application for Three-dimensional Integrated Circuit Fabrication Using Wafer-to-wafer Bonding

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- Haisemi Inc has submitted a patent application for Three-dimensional Integrated Circuit Fabrication Using Wafer-to-wafer Bonding. Wen Shengmin developed the invention. The patent application number is WO2025US60702 20251219. The patent publication number is WO2026142969 (A1). International Patent Classifica..

Zhanxun Semiconductor Chengdu Co Ltd Submits Patent Application for Frequency Band Information Reporting Method, Chip and Storage Medium

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Zhanxun Semiconductor Chengdu Co Ltd has submitted a patent application for Frequency Band Information Reporting Method, Chip and Storage Medium. Fu Xiping, Zhang Min and Wang Xing developed the invention. The patent application number is CN202511861166 20251210. The patent publication number is CN12181542..

Nanjing Institute Of Tourism & Hospitality Applies for Patent on Hierarchical Memory Self-adaptive Forgetting Control System and Method for Guest Room Service Robot

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Nanjing Institute Of Tourism & Hospitality has applied Chinese patent for Hierarchical Memory Self-adaptive Forgetting Control System and Method for Guest Room Service Robot. Jiao Mengxue, Zhang Jun and Xiao Wei developed it. The patent application number is CN202511873347 20251212. The patent publication ..

State Intellectual Property Office of China Publishes International Rectifier Corp Patent Application for Method for Forming Semiconductor Device and Structure Formed by the Method

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has published International Rectifier Corp patent application for Method for Forming Semiconductor Device and Structure Formed by the Method. The invention was developed by Qiu Wenjun and Hayashi Yoshiyuki. The patent application number is CN20248054179 20240802...

State Intellectual Property Office of China Releases BOE Technology Group and Beijing BOE Technology Development Patent Application for Light-emitting Assembly, Preparation Method ..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has released BOE Technology Group and Beijing BOE Technology Development patent application for Light-emitting Assembly, Preparation Method Thereof and Display Substrate. This invention was developed by Han Tianyang, Liu Liwei, Zhang Hui, Feng Xuan, Li Zhuo, Yang Mi..

State Intellectual Property Office of China Receives Alos Semiconductor Ltd Patent Application for Semiconductor Structure, Photoelectric Device and Manufacturing Method

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has received Alos Semiconductor Ltd patent application for Semiconductor Structure, Photoelectric Device and Manufacturing Method. Nishikawa Atsushi and Loesing Andreas developed the invention. The patent application number is CN20248056592 20240820. The patent p..

China Telecom Applies for Patent on Network Signal Quality Determination Method and Device and Nonvolatile Storage Medium

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- China Telecom has applied Chinese patent for Network Signal Quality Determination Method and Device and Nonvolatile Storage Medium. Luo Youmeng and Feng Jian developed it. The patent application number is CN202511923387 20251218. The patent publication number is CN121815308 (A). International Patent Classi..

World Intellectual Property Organization Receives Chengdu BOE Optoelect Tech Co and BOE Technology Group Patent Application for Display Substrate and Display Apparatus

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- World Intellectual Property Organization has received Chengdu BOE Optoelect Tech Co and BOE Technology Group patent application for Display Substrate and Display Apparatus. Shi Bo, Huang Yinglong and Song Gukhwan developed the invention. The patent application number is WO2025CN133335 20251107. The patent p..

World Intellectual Property Organization Receives Chengdu Xinxing Lifly Robotics Tech Co Ltd, Jiangsu Intellifusion Tech Co Ltd and Shenzhen Intellifusion Technologies Patent Appli..

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- World Intellectual Property Organization has received Chengdu Xinxing Lifly Robotics Tech Co Ltd, Jiangsu Intellifusion Tech Co Ltd and Shenzhen Intellifusion Technologies patent application for AI Chip Control Method, Signal Processing Method, and Task Processing System. Zhang Yingjun developed the invention...

Shenzhen Yspring Tech Co Ltd Applies for Patent on Pixel Signal Reading Circuit and Method, Image Sensor and Electronic Equipment

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Shenzhen Yspring Tech Co Ltd has applied Chinese patent for Pixel Signal Reading Circuit and Method, Image Sensor and Electronic Equipment. Zhuang Tengfei and Wang Xinqian developed it. The patent application number is CN202511950557 20251223. The patent publication number is CN121815113 (A). International..

State Intellectual Property Office of China Releases Hangzhou Zhishu Xingchen Tech Co Ltd Patent Application for Multi-region Time-sharing Exposure Control Method for Single-chip I..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has released Hangzhou Zhishu Xingchen Tech Co Ltd patent application for Multi-region Time-sharing Exposure Control Method for Single-chip Image Sensor and Application of Multi-region Time-sharing Exposure Control Method. This invention was developed by Ni Licheng, ..

Qinghe Electronic Tech Shandong Co Ltd Submits Patent Application for FCCSP Chip Support Plate Production Processing Analysis and Optimization Method and System Based on Etching Pr..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Qinghe Electronic Tech Shandong Co Ltd has submitted a patent application for FCCSP Chip Support Plate Production Processing Analysis and Optimization Method and System Based on Etching Process Data. Yang Ming and Zhou Shuailin developed the invention. The patent application number is CN202511969852 202512..

SWM Holdco Luxembourg Submits WIPO Patent Application for Paper or Nonwoven Filter Media with Plug Wrap Paper Comprising a Fibrous Substrate

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- SWM Holdco Luxembourg has submitted a patent application for Paper or Nonwoven Filter Media with Plug Wrap Paper Comprising a Fibrous Substrate. This invention was developed by Blin Thomas. The patent application number is WO2025EP88767 20251222. The patent publication number is WO2026139491 (A1). Internati..

World Intellectual Property Organization Receives Applied Materials Israel Ltd and Applied Materials Patent Application for Cleaning System for Cleaning an Optical Element of a Cha..

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- World Intellectual Property Organization has received Applied Materials Israel Ltd and Applied Materials patent application for Cleaning System for Cleaning an Optical Element of a Charged Particle Evaluation System. Reuveni Rony, Faigenblat Shachar, Nir Irit Ruach, Fuchs Dan Tuvia, Goldenshtein Alexander, Sha..

Salmontech Inc Submits WIPO Patent Application for Production Method for Multilayer Substrate with Piezoelectric Film

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- Salmontech Inc has submitted a patent application for Production Method for Multilayer Substrate with Piezoelectric Film. This invention was developed by Tanabe Masayuki. The patent application number is WO2025JP43737 20251215. The patent publication number is WO2026141011 (A1). International Patent Classif..

World Intellectual Property Organization Receives Shanghai Archiwave Microelectronics Co Ltd Patent Application for Signal Envelope Detection Circuit and Chip

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- World Intellectual Property Organization has received Shanghai Archiwave Microelectronics Co Ltd patent application for Signal Envelope Detection Circuit and Chip. Dong Yangtao developed the invention. The patent application number is WO2025CN88560 20250411. The patent publication number is WO2026137644 (A1..

Piotech Shenyang Semiconductor Equipment Co Ltd Seeks Patent for Heating Plate Structure for Improving Thin Film Uniformity, and Semiconductor Device

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- Piotech Shenyang Semiconductor Equipment Co Ltd has sought patent for Heating Plate Structure for Improving Thin Film Uniformity, and Semiconductor Device. This invention was developed by Lin Xuanyu, Li Benxin and Cai Xinchen. The patent application number is WO2025CN82832 20250317. The patent publication n..

Institute Of Semiconductors Guangdong Academy Of Sciences Applies for Patent on Signal Input Circuit for Can Transceiver, Chip and Electronic Control Unit

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Institute Of Semiconductors Guangdong Academy Of Sciences has applied Chinese patent for Signal Input Circuit for Can Transceiver, Chip and Electronic Control Unit. Huang Hongcheng, Zhuang Wei, Li Jizhou, Liu Dawei, Yan Biao, Wang Xi, Zhao Weijia and Fan Jianlin developed it. The patent application number ..

State Intellectual Property Office of China Publishes Shenzhen Hengchangtong Electronics Co Ltd Patent Application for Digital Baseband Transmission Circuit of Ultrahigh Frequency ..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has published Shenzhen Hengchangtong Electronics Co Ltd patent application for Digital Baseband Transmission Circuit of Ultrahigh Frequency Wireless Communication Chip and Signal Processing Method. The invention was developed by Hu Weiping, Xu Hong and Dai Fugui. ..

State Intellectual Property Office of China Receives Beijing Ziguang Qingteng Micro System Co Ltd Patent Application for ESD Circuit and Chip for Power Supply Clamping

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has received Beijing Ziguang Qingteng Micro System Co Ltd patent application for ESD Circuit and Chip for Power Supply Clamping. Huang Jinhuang and Dai Qiang developed the invention. The patent application number is CN20261029221 20260109. The patent publication ..

LumiLEDs Singapore Pte Ltd and LumiLEDs Seeks Patent for Near-ultraviolet Microled Array with Novel Quantum Well Design

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- LumiLEDs Singapore Pte Ltd and LumiLEDs has sought patent for Near-ultraviolet Microled Array with Novel Quantum Well Design. This invention was developed by Armitage Robert. The patent application number is WO2025US55790 20251117. The patent publication number is WO2026142811 (A1). International Patent Cla..

World Intellectual Property Organization Publishes Ideaded SL Patent Application for Field Effect Device and Method of Manufacturing

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- World Intellectual Property Organization has published Ideaded SL patent application for Field Effect Device and Method of Manufacturing. The invention was developed by Parmar Jemish Mahendrabhai and Albareda Piquer Guillermo. The patent application number is WO2025EP88947 20251223. The patent publication n..

Ideaded SL Submits WIPO Patent Application for Selective Etching of Dielectric Materials on Carbon-based Low Dimensional Materials

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- Ideaded SL has submitted a patent application for Selective Etching of Dielectric Materials on Carbon-based Low Dimensional Materials. This invention was developed by Parmar Jemish Mahendrabhai and Maniyara Rinu Abraham. The patent application number is WO2025EP88946 20251223. The patent publication number ..

World Intellectual Property Organization Publishes Ideaded SL Patent Application for Thin Film Transistor and Method of Manufacturing the Same

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- World Intellectual Property Organization has published Ideaded SL patent application for Thin Film Transistor and Method of Manufacturing the Same. The invention was developed by Parmar Jemish Mahendrabhai, Maniyara Rinu Abraham and Claramunt Ruiz Sergi. The patent application number is WO2025EP88944 202512..

World Intellectual Property Organization Publishes Mewburn Ellis LLP and Reliance Industries Patent Application for Solar Cell and Manufacturing Method Thereof

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- World Intellectual Property Organization has published Mewburn Ellis LLP and Reliance Industries patent application for Solar Cell and Manufacturing Method Thereof. The invention was developed by Mandal Sourav, Chong Min Sung David and Sng Guan Kian Ernest. The patent application number is WO2025EP88890 202..

Mewburn Ellis LLP and Reliance Industries Submit WIPO Patent Application for Solar Cell and Manufacturing Method Thereof

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- Mewburn Ellis LLP and Reliance Industries have submitted a patent application for Solar Cell and Manufacturing Method Thereof. This invention was developed by Mandal Sourav, Chong Min Sung David and Sng Guan Kian Ernest. The patent application number is WO2025EP88877 20251223. The patent publication number ..

World Intellectual Property Organization Publishes Rec Solar Pte Ltd and Mewburn Ellis Patent Application for Method of Manufacturing a Solar Cell, Solar Cell and Solar Module Ther..

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- World Intellectual Property Organization has published Rec Solar Pte Ltd and Mewburn Ellis patent application for Method of Manufacturing a Solar Cell, Solar Cell and Solar Module Thereof. The invention was developed by Sng Guan Kian Ernest and Chong Shu-yunn. The patent application number is WO2025EP88872 ..

Mewburn Ellis LLP and Reliance Industries File WIPO Patent Application for Solar Cell and Manufacturing Method Thereof

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- Mewburn Ellis LLP and Reliance Industries have filed a patent application for Solar Cell and Manufacturing Method Thereof. This invention was developed by Mandal Sourav, Chong Min Sung David and Sng Guan Kian Ernest. The patent application number is WO2025EP88869 20251223. The patent publication number is W..

World Intellectual Property Organization Releases Politeknik Metal Ve Ticaret Anonim Sirketi Patent Application for a Process for Sealing an Aluminum Substrate to Improve Resistanc..

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- World Intellectual Property Organization has released Politeknik Metal Ve Ticaret Anonim Sirketi patent application for a Process for Sealing an Aluminum Substrate to Improve Resistance Properties. This invention was developed by Subhramannya Raddiar Mahima, Azarudeen Mohamed, Akyil Can, Goral Levent, Afsin Pi..

Pilo Co Ltd Files WIPO Patent Application for Method for Manufacturing Glass Substrate Having Through Electrode and Glass Substrate Having Through Electrode Manufactured Thereby

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- Pilo Co Ltd has filed a patent application for Method for Manufacturing Glass Substrate Having Through Electrode and Glass Substrate Having Through Electrode Manufactured Thereby. This invention was developed by Park Jae Hoon and Kim Gil Jun. The patent application number is WO2025KR22311 20251219. The pate..

Koes Co Ltd Submits Patent Application for Rear-contact Crystalline Silicon Solar Cell

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- Koes Co Ltd has submitted a patent application for Rear-contact Crystalline Silicon Solar Cell. Kim Dong Min, Jang Nam Hak and Ko Ji Hoon developed the invention. The patent application number is WO2025KR21767 20251216. The patent publication number is WO2026142123 (A1). International Patent Classification ..

World Intellectual Property Organization Receives BOE Mled Technology Co Ltd, Beijing BOE Technology Dev Co Ltd and BOE Technology Group Patent Application for Display Substrate an..

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- World Intellectual Property Organization has received BOE Mled Technology Co Ltd, Beijing BOE Technology Dev Co Ltd and BOE Technology Group patent application for Display Substrate and Display Apparatus. Zhang Shubai, Mi Lantian, Yu Lu, An Xiaojun, Li Jian, Xiong Zhijun, Wang Meng, Zhang Wei, Yang Shanwei and..

World Intellectual Property Organization Releases Chengdu BOE Optoelect Tech Co and BOE Technology Group Patent Application for Display Substrate and Display Apparatus

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- World Intellectual Property Organization has released Chengdu BOE Optoelect Tech Co and BOE Technology Group patent application for Display Substrate and Display Apparatus. This invention was developed by Zhou Weifeng, Qi Puyu, Chen Liqiang and Zhao Yunshan. The patent application number is WO2024CN142443 2..

World Intellectual Property Organization Publishes Raymond Lam Wai Kin Patent Application for Substrate Assembly with Metal Heat Sink, and Method for Manufacturing Metal Heat Sink

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- World Intellectual Property Organization has published Raymond Lam Wai Kin patent application for Substrate Assembly with Metal Heat Sink, and Method for Manufacturing Metal Heat Sink. The patent application number is WO2024CN142219 20241225. The patent publication number is WO2026137230 (A1). International..

Piotech Shenyang Semiconductor Equipment Co Ltd Files WIPO Patent Application for Sealing Valve for Corrosive Gases and Thin Film Deposition Apparatus

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- Piotech Shenyang Semiconductor Equipment Co Ltd has filed a patent application for Sealing Valve for Corrosive Gases and Thin Film Deposition Apparatus. This invention was developed by Jiang Wei and Zhou Weijie. The patent application number is WO2024CN142204 20241225. The patent publication number is WO202..

World Intellectual Property Organization Publishes Beijing BOE Technology Dev Co Ltd, BOE Technology Group Co Ltd and Yunnan Invensight Optoelectronics Technology Co Ltd Patent App..

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- World Intellectual Property Organization has published Beijing BOE Technology Dev Co Ltd, BOE Technology Group Co Ltd and Yunnan Invensight Optoelectronics Technology Co Ltd patent application for Display Substrate and Display Device. The invention was developed by Li Yunlong, Zhang Dacheng, Liu Wei, Huang Yin..

Wuhan Optics Valley Information Photoelectron Innovation Center Co Ltd Files Chinese Patent Application for Optical Chip

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Wuhan Optics Valley Information Photoelectron Innovation Center Co Ltd has filed a patent application for Optical Chip. This invention was developed by Hua Xin, Xiao Xi and Chen Daigao. The patent application number is CN20251247651 20251231. The patent publication number is CN121814216 (A). International ..

State Intellectual Property Office of China Releases Hi Trend Tech Shanghai Co Ltd Patent Application for Successive Approximation Analog-to-digital Converter, Chip and Electronic ..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has released Hi Trend Tech Shanghai Co Ltd patent application for Successive Approximation Analog-to-digital Converter, Chip and Electronic Product. This invention was developed by Li Shuhui, Dai Jianbin, Ma Xia and Tian Ye. The patent application number is CN202..

Xiamen Hualian Semiconductor Tech Co Ltd Applies for Patent on Photosensitive Chip

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Xiamen Hualian Semiconductor Tech Co Ltd has applied Chinese patent for Photosensitive Chip. Duan Guo, Chen Yuping and Huang Fabao developed it. The patent application number is CN202511690985 20251118. The patent publication number is CN121814077 (A). International Patent Classification codes are H02S40/3..

Shanghai Chipanalog Microelectronics Co Ltd Submits Chinese Patent Application for High-voltage Comparator, Chip and Electronic Equipment

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Shanghai Chipanalog Microelectronics Co Ltd has submitted a patent application for High-voltage Comparator, Chip and Electronic Equipment. This invention was developed by Chen Bingtian and Chen Dongpo. The patent application number is CN202610282839 20260310. The patent publication number is CN121814068 (A..

Chengdu Guokexin Tech Co Ltd Submits Chinese Patent Application for Four-phase Phase Shifter Chip Based on Lange Bridge

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Chengdu Guokexin Tech Co Ltd has submitted a patent application for Four-phase Phase Shifter Chip Based on Lange Bridge. This invention was developed by Xie Chen and Yan Xiaoyun. The patent application number is CN202511887422 20251215. The patent publication number is CN121814057 (A). International Patent..

The 55th Research Institute Of China Electronics Technology Group Corporation Submits Chinese Patent Application for Preparation Method of Bulk Acoustic Wave Resonator Based on Sca..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- The 55th Research Institute Of China Electronics Technology Group Corporation has submitted a patent application for Preparation Method of Bulk Acoustic Wave Resonator Based on Scandium-doped Aluminum Nitride Piezoelectric Film. This invention was developed by Jiang Lili, Li Sa, Zhang Yichao, Zhang Hongze, Hu..

Laiying Tech Shanghai Co Ltd Submits Chinese Patent Application for Operational Amplifier, Chip and Electronic Device

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Laiying Tech Shanghai Co Ltd has submitted a patent application for Operational Amplifier, Chip and Electronic Device. This invention was developed by Guan Tiantian, Lin Chenhua, Ma Jie, Bai Rui and Wu Yifan. The patent application number is CN202610289553 20260311. The patent publication number is CN12181..

Changsha Zhaotong Microelectronics Co Ltd Submits Patent Application for Frequency Multiplier and Wireless Communication Chip

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Changsha Zhaotong Microelectronics Co Ltd has submitted a patent application for Frequency Multiplier and Wireless Communication Chip. Zhou Liguo developed the invention. The patent application number is CN20251209145 20251229. The patent publication number is CN121814035 (A). International Patent Classifi..

State Intellectual Property Office of China Receives Shenzhen Hengchangtong Electronics Co Ltd Patent Application for Low-power-consumption High-precision Digital Temperature Compe..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has received Shenzhen Hengchangtong Electronics Co Ltd patent application for Low-power-consumption High-precision Digital Temperature Compensation Frequency Control Chip and Method. Xu Sheng, Liao Junxiu and Liu Wei developed the invention. The patent applicatio..

Shenzhen Wisdom Xintu Tech Co Ltd Submits Patent Application for Working Circuit Based on Load Modulation, Chip and Atomization Device

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Shenzhen Wisdom Xintu Tech Co Ltd has submitted a patent application for Working Circuit Based on Load Modulation, Chip and Atomization Device. Zhong Weijin and Lai Qinwei developed the invention. The patent application number is CN202411371088 20240929. The patent publication number is CN121813892 (A). In..

Guizhou Police College Submits Chinese Patent Application for Two-stage Hybrid Heuristic Method for Detecting Crack Path of Solar Cell

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Guizhou Police College has submitted a patent application for Two-stage Hybrid Heuristic Method for Detecting Crack Path of Solar Cell. This invention was developed by Zhang Jiayue. The patent application number is CN20251207900 20251229. The patent publication number is CN121811070 (A). International Pate..

Nanjing Jici Zaikang Medical Tech Co Ltd Seeks Patent for Pulsed Magnetic Field Stimulation Coil Device Based on Silicon Steel Magnetic Core and Air Gap Structure

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Nanjing Jici Zaikang Medical Tech Co Ltd has sought patent for Pulsed Magnetic Field Stimulation Coil Device Based on Silicon Steel Magnetic Core and Air Gap Structure. This invention was developed by Sun Jianfei. The patent application number is CN20251206909 20251229. The patent publication number is CN1..

Guangxi Yunxin Semiconductor Tech Co Ltd Submits Chinese Patent Application for Gallium Nitride Resistor Chip and Preparation Method Thereof

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Guangxi Yunxin Semiconductor Tech Co Ltd has submitted a patent application for Gallium Nitride Resistor Chip and Preparation Method Thereof. This invention was developed by Liang Faquan, Qiu Deheng, Huang Youyuan and Zhuang Jiaming. The patent application number is CN20261001407 20260104. The patent publi..

State Intellectual Property Office of China Receives Shenzhen APG Mat Co Ltd Patent Application for Conductive Paste and Solar Cell

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has received Shenzhen APG Mat Co Ltd patent application for Conductive Paste and Solar Cell. Zhou Xianjie, Wu Fan, Liu Jie, Zhang Zhiqiang, Sun Lizhi and Yang Congguo developed the invention. The patent application number is CN202610279816 20260309. The patent pu..

State Intellectual Property Office of China Releases Chenri Tech Nanjing Co Ltd and Shenzhen Earlysun Tech Co Ltd Patent Application for Nanometer Copper Slurry for Pressureless Si..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has released Chenri Tech Nanjing Co Ltd and Shenzhen Earlysun Tech Co Ltd patent application for Nanometer Copper Slurry for Pressureless Sintering Type Chip Interconnection and Preparation Method Thereof. This invention was developed by Qian Xuehang, Han Fei and Re..

World Intellectual Property Organization Releases Kuk Il Graphene Co Ltd and Heo Chae Jeong Patent Application for Spectroscopic Analysis Substrate for Diagnosing Dementia Includin..

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- World Intellectual Property Organization has released Kuk Il Graphene Co Ltd and Heo Chae Jeong patent application for Spectroscopic Analysis Substrate for Diagnosing Dementia Including Hydrophilized Graphene Layer and Spectroscopic Device Including Same. This invention was developed by Heo Chae Jeong, Chae Se..

Jiangxi Zhaochi Integration Tech Co Ltd Files Chinese Patent Application for Distributed Feedback Type Laser Chip Based on Buried Heterojunction and Preparation Method

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Jiangxi Zhaochi Integration Tech Co Ltd has filed a patent application for Distributed Feedback Type Laser Chip Based on Buried Heterojunction and Preparation Method. This invention was developed by Jin Conglong, Li Jiachen, Hu Jiahui, Gao Jian and Liu Yuchen. The patent application number is CN20261027687..

State Intellectual Property Office of China Receives Suzhou Focused Photonics Inc Patent Application for Negative Chirp Laser Based on Top Surface Metal Grating

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has received Suzhou Focused Photonics Inc patent application for Negative Chirp Laser Based on Top Surface Metal Grating. Yu Shoushan developed the invention. The patent application number is CN202511865072 20251211. The patent publication number is CN121813122 (..

Suzhou Focused Photonics Inc Submits Patent Application for External Cavity Laser for Realizing Narrow Linewidth by Regulating and Controlling Phase Difference of Double-metal Brag..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Suzhou Focused Photonics Inc has submitted a patent application for External Cavity Laser for Realizing Narrow Linewidth by Regulating and Controlling Phase Difference of Double-metal Bragg Grating. Yu Shoushan developed the invention. The patent application number is CN202511763651 20251127. The patent pu..

Suzhou Focused Photonics Inc Submits Chinese Patent Application for Laser Based on Top Plane Metal Grating and High-reflection Dielectric Film

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Suzhou Focused Photonics Inc has submitted a patent application for Laser Based on Top Plane Metal Grating and High-reflection Dielectric Film. This invention was developed by Yu Shoushan. The patent application number is CN202511762702 20251127. The patent publication number is CN121813119 (A). Internatio..

Suzhou Focused Photonics Inc Files Chinese Patent Application for Adjustable Ecl Semiconductor Laser Based on Metal Grating Pzt Film

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Suzhou Focused Photonics Inc has filed a patent application for Adjustable Ecl Semiconductor Laser Based on Metal Grating Pzt Film. This invention was developed by Yu Shoushan. The patent application number is CN202511865337 20251211. The patent publication number is CN121813113 (A). International Patent C..

World Intellectual Property Organization Receives Hangzhou Guangzhiyuan Tech Co Ltd Patent Application for Photonic Integrated Circuit Chip, Optical Interconnection Module, Optical..

Semiconductor

| Thu 09 Jul 2026

Geneva, July 10 -- World Intellectual Property Organization has received Hangzhou Guangzhiyuan Tech Co Ltd patent application for Photonic Integrated Circuit Chip, Optical Interconnection Module, Optical Interconnection Device, Computing Device, and System. Meng Huaiyu, Wang Long, Shen Yichen, Lv Wenqing and Hu Tao developed the..

State Intellectual Property Office of China Publishes Northwest Electronic Equipment Technology Research Institute Second Research Institute Of China Electronics Te Patent Applicat..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has published Northwest Electronic Equipment Technology Research Institute Second Research Institute Of China Electronics Te patent application for Coaxial Alignment Device of Chip and Wafer, Thermocompression Bonding Equipment and Method. The invention was develope..

State Intellectual Property Office of China Releases Harbin Institute Of Technology Patent Application for Three-degree-of-freedom Micro-motion Bonding Head for Wafer Bonding Machi..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has released Harbin Institute Of Technology patent application for Three-degree-of-freedom Micro-motion Bonding Head for Wafer Bonding Machine. This invention was developed by Hou Chengwei, Liu Huan, Song Henan, Wu Jianwei, Zhao Bo and Tan Jiubin. The patent appl..

58th Research Institute Of Cetc Files Chinese Patent Application for Compound Semiconductor Packaging Method and Structure

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- 58th Research Institute Of Cetc has filed a patent application for Compound Semiconductor Packaging Method and Structure. This invention was developed by Ju Tingyi, Yang Cheng, Ye Dongdong, Gao Ran and Ji Yong. The patent application number is CN202511991576 20251226. The patent publication number is CN121..

Zhejiang Guoxin Semiconductor Tech Co Ltd Applies for Patent on Integrated Circuit Packaging Method

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Zhejiang Guoxin Semiconductor Tech Co Ltd has applied Chinese patent for Integrated Circuit Packaging Method. Shen Guoping developed it. The patent application number is CN202511947811 20251222. The patent publication number is CN121816095 (A). International Patent Classification codes are G06F30/392, G06F..

China Electronics Technology Group Corporation No. 13 Research Institute Submits Chinese Patent Application for High-frequency Chip Heterogeneous Integrated Circuit and Preparation..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- China Electronics Technology Group Corporation No. 13 Research Institute has submitted a patent application for High-frequency Chip Heterogeneous Integrated Circuit and Preparation Method Thereof. This invention was developed by Song Xubo, Hao Xiaolin, Liu Shuai, Zhang Lisen, Xu Jing, Xue Haodong and Feng Zhi..

State Intellectual Property Office of China Publishes Jiangxi Xinjuneng Tech Co Ltd Patent Application for Single-sided Roll-to-roll Ultra-small Windowing Fcob Packaging Carrier Pl..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has published Jiangxi Xinjuneng Tech Co Ltd patent application for Single-sided Roll-to-roll Ultra-small Windowing Fcob Packaging Carrier Plate Production Process Control System. The invention was developed by Ouyang Xiangtang, Xie Chengyang, Dong Dasheng, Peng Lian..

State Intellectual Property Office of China Releases Shanghai Linecore Electronic Tech Co Ltd Patent Application for Power Semiconductor Device Packaging Structure and Preparation ..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has released Shanghai Linecore Electronic Tech Co Ltd patent application for Power Semiconductor Device Packaging Structure and Preparation Method Thereof. This invention was developed by Hou Jianan, Fang Pengli, Fang Jianqiang, Zhang Xiangdong, Du Liangliang, Ma Ho..

Shanghai Linecore Electronic Tech Co Ltd Applies for Patent on Semiconductor Packaging Structure and Preparation Method Thereof

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Shanghai Linecore Electronic Tech Co Ltd has applied Chinese patent for Semiconductor Packaging Structure and Preparation Method Thereof. Hou Jianan, Fang Jianqiang, Zhang Xiangdong, Du Liangliang, Xin Hongtao, Ma Hongwei, Zhang Zhao, Zhang Zhanqi, Ma Zhaowang and Zhu Benhua developed it. The patent applic..

Shenzhen Huicun Semiconductor Co Ltd Files Chinese Patent Application for Packaging Structure and Packaging Method of Chip Surface Mounting Device

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Shenzhen Huicun Semiconductor Co Ltd has filed a patent application for Packaging Structure and Packaging Method of Chip Surface Mounting Device. This invention was developed by Luo Xiyan and Xue Wu. The patent application number is CN20251250969 20251231. The patent publication number is CN121816075 (A). ..

Wuhan Xinchuangyuan Semiconductor Co Ltd Files Chinese Patent Application for Fine Circuit Fcbga Packaging Substrate and Preparation Method Thereof

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Wuhan Xinchuangyuan Semiconductor Co Ltd has filed a patent application for Fine Circuit Fcbga Packaging Substrate and Preparation Method Thereof. This invention was developed by Huang Shiming, He Gang, Yu Liyang and Xu Yong. The patent application number is CN20251245138 20251231. The patent publication n..

State Intellectual Property Office of China Releases HF Smat Microtech Co Patent Application for Radio Frequency Chip Integrated Packaging Structure and Technology

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has released HF Smat Microtech Co patent application for Radio Frequency Chip Integrated Packaging Structure and Technology. This invention was developed by Tan Xiaochun. The patent application number is CN202511821562 20251205. The patent publication number is C..

Jisixin Microelectronics Guangdong Co Ltd Files Chinese Patent Application for Sip Chip Packaging Method and Structure

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Jisixin Microelectronics Guangdong Co Ltd has filed a patent application for Sip Chip Packaging Method and Structure. This invention was developed by Zhang Minran. The patent application number is CN20261040276 20260113. The patent publication number is CN121816068 (A). International Patent Classification ..

Qiyimoer Quzhou Integrated Circuit Design Co Ltd Applies for Patent on Three-dimensional Core Particle Packaging Structure and Manufacturing Method

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Qiyimoer Quzhou Integrated Circuit Design Co Ltd has applied Chinese patent for Three-dimensional Core Particle Packaging Structure and Manufacturing Method. Tian Mochen, Xu Jian, Peng Chunxi, Wen Dexin, Yue Shaopeng and Zhu Jundong developed it. The patent application number is CN202511864591 20251211. Th..

Qiyimoer Shanghai Semiconductor Tech Co Ltd Submits Chinese Patent Application for Heat Dissipation Gasket, Preparation Method Thereof and Chip Packaging Structure

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Qiyimoer Shanghai Semiconductor Tech Co Ltd has submitted a patent application for Heat Dissipation Gasket, Preparation Method Thereof and Chip Packaging Structure. This invention was developed by Tian Mochen, Peng Chunxi, Xu Jian, Wen Dexin, Zhu Jundong and Yue Shaopeng. The patent application number is C..

Suzhou Zhenkun Tech Co Ltd Seeks Patent for Semiconductor Packaging Structure and Semiconductor Packaging Method

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Suzhou Zhenkun Tech Co Ltd has sought patent for Semiconductor Packaging Structure and Semiconductor Packaging Method. This invention was developed by Zhao Wanxue. The patent application number is CN20261006816 20260105. The patent publication number is CN121816054 (A). International Patent Classification ..

Suzhou Fatedi Tech Co Ltd Seeks Patent for Heat Dissipation Substrate and Heat Dissipation Device

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Suzhou Fatedi Tech Co Ltd has sought patent for Heat Dissipation Substrate and Heat Dissipation Device. This invention was developed by Chen Wei, Li Yuanhai, Jin Yongbin, He Tao, Rao Tong, Wang Qiang, Hou Yanbing and Ding Ning. The patent application number is CN202511967310 20251224. The patent publicatio..

Forehope Semiconductor Ningbo Limited Co Submits Chinese Patent Application for Flip Chip Ball Grid Array Packaging Structure and Preparation Method Thereof

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Forehope Semiconductor Ningbo Limited Co has submitted a patent application for Flip Chip Ball Grid Array Packaging Structure and Preparation Method Thereof. This invention was developed by He Zhenghong, Zhong Lei and Xu Yupeng. The patent application number is CN202511996339 20251226. The patent publicati..

Jiangsu Third Generation Semiconductor Research Institute Co Ltd Seeks Patent for Diamond-based Nitride Composite Substrate, Preparation Method and Semiconductor Device

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Jiangsu Third Generation Semiconductor Research Institute Co Ltd has sought patent for Diamond-based Nitride Composite Substrate, Preparation Method and Semiconductor Device. This invention was developed by Liang Jianbo and Sun Kewei. The patent application number is CN20251232336 20251230. The patent publ..

Zhejiang Lishui Zhongxin Jingyuan Semiconductor Tech Co Ltd Applies for Patent on Wafer Thinning Parameter Optimization Method and System for Semiconductor Production

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Zhejiang Lishui Zhongxin Jingyuan Semiconductor Tech Co Ltd has applied Chinese patent for Wafer Thinning Parameter Optimization Method and System for Semiconductor Production. Shi Hainan, Lu Aijun and He Jingjing developed it. The patent application number is CN20261033331 20260112. The patent publication..

Chongqing Lingxin Microelectronic Co Ltd Submits Chinese Patent Application for Back Etching Method Suitable for Ultrathin and Large-warping-degree Wafer

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Chongqing Lingxin Microelectronic Co Ltd has submitted a patent application for Back Etching Method Suitable for Ultrathin and Large-warping-degree Wafer. This invention was developed by Jia Shulun, Zheng Wenquan and Cai Menglin. The patent application number is CN20261024962 20260109. The patent publicati..

State Intellectual Property Office of China Releases Suzhou Weishichuangxin Tech Co Ltd Patent Application for Preparation Method of Semiconductor Substrate with Cavity Structure a..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has released Suzhou Weishichuangxin Tech Co Ltd patent application for Preparation Method of Semiconductor Substrate with Cavity Structure and Substrate. This invention was developed by Wei Zelin. The patent application number is CN20251203644 20251229. The paten..

State Intellectual Property Office of China Releases Suzhou Weishichuangxin Tech Co Ltd Patent Application for Preparation Method of Composite Substrate and Composite Substrate

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has released Suzhou Weishichuangxin Tech Co Ltd patent application for Preparation Method of Composite Substrate and Composite Substrate. This invention was developed by Yao Zuying. The patent application number is CN202511948165 20251223. The patent publication ..

State Intellectual Property Office of China Publishes China Electronics Technology Group Corporation No. 13 Research Institute Patent Application for Method for Detecting Defects o..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has published China Electronics Technology Group Corporation No. 13 Research Institute patent application for Method for Detecting Defects of Power Semiconductor Device Based on Transparent Electrode. The invention was developed by Liu Hongyu, Dun Shaobo, Han Shida,..

State Intellectual Property Office of China Receives Jiangxi MTC Semiconductor and Jiangxi Yaochi Tech Co Ltd Patent Application for Method and System for Testing Led Wafer with Ve..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has received Jiangxi MTC Semiconductor and Jiangxi Yaochi Tech Co Ltd patent application for Method and System for Testing Led Wafer with Vertical Structure, and Computer Equipment. Wen Guosheng, Jin Conglong, Zhu Bingbing, Xu Zhou and Guo Lei developed the inventio..

Suzhou Echip Semiconductor Tech Co Ltd Seeks Patent for Annular Vacuum Chuck for Carrying Non-contact Silicon Wafers

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Suzhou Echip Semiconductor Tech Co Ltd has sought patent for Annular Vacuum Chuck for Carrying Non-contact Silicon Wafers. This invention was developed by Yao Junru and Zhang Jie. The patent application number is CN202610148894 20260203. The patent publication number is CN121816019 (A). International Paten..

Shenzhen Jiahejingwei Electronic Tech Co Ltd Applies for Patent on Chip Grabbing System for Chip Repair

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Shenzhen Jiahejingwei Electronic Tech Co Ltd has applied Chinese patent for Chip Grabbing System for Chip Repair. Liu Xianting and Ding Zhiyong developed it. The patent application number is CN20261025773 20260109. The patent publication number is CN121816017 (A). International Patent Classification codes ..

Suzhou Weixu Intelligent Equipment Co Ltd Seeks Patent for High-flatness Fixing Device for Blue Film Wafer

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Suzhou Weixu Intelligent Equipment Co Ltd has sought patent for High-flatness Fixing Device for Blue Film Wafer. This invention was developed by Gong Rubo, Wang Wei, Chen Shouheng and Ye Chao. The patent application number is CN20251249225 20251231. The patent publication number is CN121816015 (A). Interna..

Maijiaoli Shanghai Semiconductor Tech Co Ltd Files Chinese Patent Application for Device for Driving Wafer Carrying Disc

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Maijiaoli Shanghai Semiconductor Tech Co Ltd has filed a patent application for Device for Driving Wafer Carrying Disc. This invention was developed by Guo Junchao, Shi Zhubin, Hu Zhenxian and Liu Xianghua. The patent application number is CN202610293189 20260311. The patent publication number is CN1218160..

Suzhou Bozhong Semiconductor Co Ltd Seeks Patent for Blue Film Chip Stripping Device and Chip Production Equipment

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Suzhou Bozhong Semiconductor Co Ltd has sought patent for Blue Film Chip Stripping Device and Chip Production Equipment. This invention was developed by Zhu Geyou, Qi Feiyao, Fu Jiangbo and Liu Zhibin. The patent application number is CN20251223090 20251230. The patent publication number is CN121816008 (A)..

Beijing Semiconductor Special Equipment Research Institute The 45th Research Institute Of China Electronics Te Submits Chinese Patent Application for Wafer Rotary Plectrum Mechanis..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Beijing Semiconductor Special Equipment Research Institute The 45th Research Institute Of China Electronics Te has submitted a patent application for Wafer Rotary Plectrum Mechanism and Wafer Cleaning Device. This invention was developed by Ai Haifeng, Yuan Lian, Zhang Hongxiao, Hu Tianshui, Wang Hongjian, Li..

State Intellectual Property Office of China Receives Xinying Zhicheng Chongqing Tech Co Ltd Patent Application for Edge Searching Machine for Semiconductor Processing and Edge Sear..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- State Intellectual Property Office of China has received Xinying Zhicheng Chongqing Tech Co Ltd patent application for Edge Searching Machine for Semiconductor Processing and Edge Searching Method. Hu Yunxin, Zeng Yalin, Li Ping, Xu Weizhe, Gu Xuezhe and Liu Jianhong developed the invention. The patent app..

Suzhou Xinshinuo Semiconductor Equipment Co Ltd Applies for Patent on Storage Box Conveying System and Semiconductor Product Processing System

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Suzhou Xinshinuo Semiconductor Equipment Co Ltd has applied Chinese patent for Storage Box Conveying System and Semiconductor Product Processing System. Zhang Li, Wang Hongyu, Wang Haiyang and Wang Changsheng developed it. The patent application number is CN20261021333 20260108. The patent publication numb..

Beijing Semiconductor Special Equipment Research Institute The 45th Research Institute Of China Electronics Te Submits Chinese Patent Application for Wafer Storage Device and Wafer..

Semiconductor

| Fri 10 Jul 2026

Beijing, July 10 -- Beijing Semiconductor Special Equipment Research Institute The 45th Research Institute Of China Electronics Te has submitted a patent application for Wafer Storage Device and Wafer Transmission System. This invention was developed by Wang Qiubo, Wang Hongyu, Zhang Xuesong, Li Lin and Zhang Wei. The patent ..

1 to 100 of 2856 Items Next >>

Home
|
About Us
|
Privacy Policy
|
Support
|
Products
|
Careers
|
Contact Us

© Copyright 2015. All Right Reserved.

Email selected articles