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Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Meng Lin and Applied Materials have filed a patent application for Method of a Critical Dimension Measurement on a Substrate, a Method of Manufacturing One or More Sub-pixel Structures, and Apparatus for Inspecting the Substrate. This invention was developed by Knaub Nikolai, Cook Benjamin John, Meng Lin and ..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Hefei BOE Ruisheng Tech Co Ltd and BOE Technology Group have filed a patent application for Wiring Substrate and Electronic Device. This invention was developed by Wu Xintao, Luo Ningyu, Xu Zouming, Han Tingwei, Wang Jie and Xu Jiawei.
The patent application number is US202619656283 20260423. The paten..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Beijing BOE Tech Development Co Ltd and BOE Technology Group have filed a patent application for Display Substrate and Display Apparatus. This invention was developed by Xu Cheng, Zhou Dandan, Zhang Yue and You Juanjuan.
The patent application number is US202418993530 20240516. The patent publication n..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Tokyo Electron Ltd and Tokyo Electron US Holdings have submitted a patent application for Method and Apparatus for Hybrid Bonding. Gardner Mark I, Mukhopadhyay Partha and Fulford H Jim developed the invention.
The patent application number is WO2026US10227 20260106. The patent publication number is WO20261..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Applied Materials Israel Ltd and Applied Materials have submitted a patent application for Lubricating a Rail Interface. This invention was developed by Dvir Eran, Yonaei Amit, Nakash Shmuel, Wass Oren and Feldman Marat.
The patent application number is WO2025US51692 20251020. The patent publication number..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Kaifeng Kuake New Mat Co Ltd and Henan University have submitted a patent application for Monodisperse Silicon Dioxide Nano-particles for Photonic Crystals and Preparation Method of Monodisperse Silicon Dioxide Nano-particles. This invention was developed by Feng Ying, Ma Hengyin, Fan Guangyan, Chen Kai, Li ..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Guilin Moyuan Material Tech Co Ltd and Guilin Champion Union Diamond Co Ltd have submitted a patent application for Inclined Electroplating Grinding Piece Rigid Grinding Wheel and Assembling Method. Song Jingxin, Long Huiling, Song Youpeng and Liang Anning developed the invention.
The patent application n..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Nexjperia BV, Nexperia BV and Nexperia Technology (Shanghai) have submitted a patent application for Frame Module for a Semiconductor Integrated Circuit, Ic, as Well as a Power Module Comprising Such a Frame Module and a Method of Manufacturing Such a Frame Module. Gong Wei and Hogerl Jürgen developed th..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group have submitted a patent application for Display Substrate and Display Apparatus. This invention was developed by Wang Mengqi, Chen Wenbo, Hu Ming, Jiang Zhiliang, Yu Ziyang and Qiu Haijun.
The patent application number is US202619658754 2..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Hefei BOE Ruisheng Tech Co Ltd and BOE Technology Group have submitted a patent application for Light-emitting Substrate and Manufacturing Method Therefor, Backlight Module and Display Apparatus. Wang Xiao, Wang Chenyang, Zhang Bing and Gao Liang developed the invention.
The patent application number i..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Korea Research Instituite Of Standdards and Science and Icuf Hyu Industry Univ Cooperation Foundation Hanyang Univ have submitted a patent application for Skyrmion Memory Device and Crossbar Array Circuit Using Same. This invention was developed by Yang Seung Mo, Choi Jin Young, Park Jea Gun, Moon Kyoung-..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Sumitomo Electric Ind Ltd and Sumitomo Electric Printed Circuits Inc have submitted a patent application for Copper Nano-ink, Printed Circuit Board Substrate, and Method of Manufacturing Printed Circuit Board Substrate. This invention was developed by Aikawa Kenichiro, Okada Issei, Hidani Takuto and Mikag..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received Toshiba Electronic Devices & Storage Corp and Toshiba patent application for Chip-stacked Device. Shimooka Yoshiaki developed the invention.
The patent application number is US202619542754 20260218. The patent publication number is US20260271805 (A1). Inter..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Yangtze Memory Tech Holding Co Ltd has filed a patent application for Memory Devices, Fabrication Methods, and Operating Methods Thereof. This invention was developed by Fan Dongyu, Zheng Hao, Liu Lei, Xia Zhiliang, Zhou Wenxi, Huo Zongliang and Gao Tingting.
The patent application number is US20251933..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Toshiba Electronic Devices & Storage Corp and Toshiba have submitted a patent application for Semiconductor Device. This invention was developed by Tsujimura Toshihiro and Liu Jia.
The patent application number is US202519359831 20251016. The patent publication number is US20260271779 (A1). Internation..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Powertech Tech Inc has applied United States patent for Semiconductor Package Module and Method of Manufacturing the Same. Chang Chien Shang-yu and Chen Chih Hao developed it.
The patent application number is US202619555908 20260304. The patent publication number is US20260271774 (A1). International Pa..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- ProAsia Semiconductor Corp has applied United States patent for Wafer Processing Method. Chen Hsi-chih developed it.
The patent application number is US202619556196 20260304. The patent publication number is US20260271676 (A1). International Patent Classification codes are H10P74/20 and H10W46/00. Coop..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- ProAsia Semiconductor Corp has applied United States patent for Thermal Processing Apparatus. Lai Kang-cheng and Cheng Tun-yuan developed it.
The patent application number is US202519408996 20251204. The patent publication number is US20260271655 (A1). Cooperative Patent Classification codes are H10P72..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Xiamen Industrial Technology Research Instituite Co Ltd patent application for Memory and Control Method Thereof. This invention was developed by Bai Lixia, Pan Tianlong, Chen Yuhuang, Yin Jiayu, Zheng Zhexin and Liu Meidong.
The patent application number i..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- World Intellectual Property Organization has released CXMT patent application for Semiconductor Structure and Forming Method Therefor. This invention was developed by Liu Guoquan, Tang Zhengtao, Hu Yang, Lyu Hui, Qian Hongyun and Wu Xiaopeng.
The patent application number is WO2025CN131565 20251031. The pa..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- State Intellectual Property Office of China has received Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd patent application for Anti-deflagration Cyclone Filtering Device. Ma Xuwu, Cao Qigang, Zhang Youhai, Zhang Yankun, Yang Kai and Wang Liguang developed the invention.
The patent application number ..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Toshiba Electronic Devices & Storage Corp and Toshiba have filed a patent application for Semiconductor Device and Manufacturing Method. This invention was developed by Tsuda Hiroki, Oshino Kenta, Kozaki Keisuke and Okeda Hirofumi.
The patent application number is US202519309571 20250825. The patent pu..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- World Intellectual Property Organization has received Fuji Electric patent application for Semiconductor Device and Manufacturing Method for Same. Narita Syunki developed the invention.
The patent application number is WO2026JP02026 20260122. The patent publication number is WO2026186338 (A1). Internationa..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received Hur Jae, Yeung Chun Wing, Luo Yanbin, Chu Tao, Hung Ting Hsiang, Mleczko Michal, Lin Chung Hsun, Lin Chia Ching, Hu Lin, Ghani Tahir, Xu Guowei, Zhang Yang, Zhang Kan, Wang Qiwen and Zhang Feng patent application for NP Ratio Tuning Techniques for Nanoribbon-b..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Adeia Semiconductor Bonding Technologies Inc has applied WIPO patent for Integrated Cooling Assembly with Upper and Lower Channels. Haba Belgacem and Fountain Gaius Gillman developed it.
The patent application number is WO2026US16077 20260220. The patent publication number is WO2026187520 (A1). Internation..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Unidt Shanghai Co Ltd has submitted a patent application for Multimodal Explicit Memory System, Apparatus, Storage Medium, and Program Product. This invention was developed by Cai Hua, Xu Qing, Zhao Shuang, Zhang Haode, Wang Haoran, Li Shuaishuai, Xia Tian and Zhao Kangning.
The patent application number i..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Beijing Eswin System Tech Co Ltd and Beijing ESWIN Computing Technology have sought patent for Processing System, Processing Method, Chip, and Storage Medium. This invention was developed by Huang Tai and Liu Xin.
The patent application number is WO2025CN109885 20250722. The patent publication number is WO..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Toshiba Electronic Devices & Storage Corp and Toshiba have applied United States patent for Semiconductor Device. Kobayashi Yusuke, Inokuchi Tomoaki, Gangi Hiro, Ichinoseki Kentaro, Nishiwaki Tatsuya, Fukuda Taichi, Sakata Hiroki, Baba Shotaro and Nemoto Hiroki developed it.
The patent application numb..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Toshiba Electronic Devices & Storage Corp and Toshiba patent application for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Asano Naoki.
The patent application number is US202519301555 20250815. The patent publica..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Toshiba Electronic Devices & Storage Corp and Toshiba patent application for Semiconductor Device. The invention was developed by Arima Kazusa and Yoshikawa Daiki.
The patent application number is US202519229925 20250605. The patent publication number is U..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Toshiba Electronic Devices & Storage Corp and Toshiba have submitted a patent application for Semiconductor Device. This invention was developed by Kachi Tsuyoshi.
The patent application number is US202519300192 20250814. The patent publication number is US20260271351 (A1). International Patent Classif..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Iucf Hyu Industry Univ Cooperation Foundation Hanyang Univ and Samsung Electronics have sought patent for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Kim Sangwook, Lee Kwanghee, Ryu Seonghwan, Yang Jeeeun and Park Jinseong.
The patent application number is..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Toshiba Electronic Devices & Storage Corp and Toshiba patent application for Semiconductor Device. The invention was developed by Kobayashi Yusuke, Kato Takahiro, Gejo Ryohei, Fukuda Taichi, Sakano Tatsunori and Yamamoto Takato.
The patent application numb..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received Toshiba Electronic Devices & Storage Corp and Toshiba patent application for Semiconductor Device and Method for Manufacturing the Same. Minamikawa Kazuki and Tamai Ryuichi developed the invention.
The patent application number is US202519358701 20251015. T..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Toshiba Electronic Devices & Storage Corp and Toshiba patent application for Semiconductor Device. The invention was developed by Kobayashi Yusuke, Ohashi Teruyuki, Matsudai Tomoko, Kato Kota and Yamamoto Takato.
The patent application number is US20261944..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Advanced Micro Devices Inc and ATI Technologies have applied WIPO patent for Memory Device with Command Blocking. Litt Michael and Yao Yubin developed it.
The patent application number is WO2026US12801 20260128. The patent publication number is WO2026187465 (A1). International Patent Classification codes a..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Toshiba Electronic Devices & Storage Corp and Toshiba have filed a patent application for Semiconductor Device. This invention was developed by Arita Keigo, Gejo Ryohei, Fukuda Taichi, Sakano Tatsunori and Yamamoto Takato.
The patent application number is US202619444295 20260109. The patent publication..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Majestic Labs has submitted a patent application for Cable Configurations for Disaggregated Memory. This invention was developed by Rabii Shahriar and Johnston Margaret.
The patent application number is WO2026US17310 20260302. The patent publication number is WO2026187676 (A1). International Patent Classif..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Denka Co Limited has submitted a patent application for Composition for Provisional Fixation, Method for Producing Wafer, and Composition. This invention was developed by Yamamoto Shota, Shirota Mizuki, Tanigawa Hoshino Takako and Takahashi Yusuke.
The patent application number is WO2026JP08036 20260303. T..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Denka Co Limited has applied WIPO patent for Composition for Provisional Fixation, Method for Producing Wafer, and Composition. Yamamoto Shota, Shirota Mizuki, Tanigawa Hoshino Takako and Takahashi Yusuke developed it.
The patent application number is WO2026JP08013 20260303. The patent publication number i..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Denka Co Limited has sought patent for Composition for Temporary Fixation, Method for Producing Wafer, and Composition. This invention was developed by Yamamoto Shota, Shirota Mizuki, Tanigawa Hoshino Takako and Takahashi Yusuke.
The patent application number is WO2026JP08008 20260303. The patent publicati..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Xenergic AB has applied WIPO patent for Memory Device and Method with Improved Internal Timing. Luo Xiao, Mohammadi Babak and Meraji Reza developed it.
The patent application number is WO2026EP56215 20260306. The patent publication number is WO2026185449 (A1). International Patent Classification codes are ..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Hyting GmbH has applied WIPO patent for Device for Emitting Heat and Use of a Mixing Unit and a Method for Operating a Device for Emitting Heat. Hannig Tim developed it.
The patent application number is WO2026EP56074 20260305. The patent publication number is WO2026185387 (A1). International Patent Classif..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Runxin Microelectronics Dalian Co Ltd has sought patent for Depletion-mode GaN Device and Manufacturing Method Therefor. This invention was developed by Wang Ronghua, Ren Yongshuo and Liang Huinan.
The patent application number is WO2026CN81585 20260305. The patent publication number is WO2026184678 (A1). ..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- State Intellectual Property Office of China has received Nichia patent application for Fluoride Phosphor and Light-emitting Device. Yoshida Tomokazu developed the invention.
The patent application number is CN202511948389 20251223. The patent publication number is CN122278472 (A). International Patent Cla..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Jiangsu Sunera Technology has submitted a patent application for Amine Organic Compound and Organic Electroluminescent Device Containing Same. This invention was developed by Zhang Zhaochao, Wang Yiding, Shang Shuxia and Wang Fang.
The patent application number is CN202411918840 20241225. The patent publi..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- State Intellectual Property Office of China has published Changsha Huayi Semiconductor Co Ltd patent application for Trolley for Disassembling and Assembling Molecular Pump. The invention was developed by Fan Hao, Chen Yang and Yang Meigao.
The patent application number is CN202610308236 20260313. The pat..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Harbin Institute of Technology has submitted a patent application for CO2 Decomposition Device Based on Dielectric Barrier Discharge Technology. Zhou Zhongxiang, Zhou Chen, Araca, Yuan Chengxun, Wang Ying and Tian Ye developed the invention.
The patent application number is CN202610677897 20260518. The pa..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- State Intellectual Property Office of China has received Dongguan Guangda Intelligent Tech Co Ltd patent application for Chip Cleaning Equipment. Ding Panfeng, Pu Jixiong, Feng Wencan and Zhang Hua developed the invention.
The patent application number is CN202610725558 20260525. The patent publication nu..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- State Intellectual Property Office of China has published SAE Technologies Development, Dongguan patent application for Bonding Treatment Method. The invention was developed by Wang Yinguo.
The patent application number is CN202411913630 20241224. The patent publication number is CN122273777 (A). Internat..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Anhui Zhonghe Semiconductor Tech Co Ltd has submitted a patent application for Semiconductor Resin Vibration Dusting Device. Zong Shuqi, Chen Xiaofei, Sun Xiaoxiao and Zhan Weili developed the invention.
The patent application number is CN202610302458 20260312. The patent publication number is CN122273768..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Fuji Electric Co Ltd M and Fuji Electric patent application for Semiconductor Device. This invention was developed by Kato Ryoichi, Kato Ryusuke and Osaki Koji.
The patent application number is US202619662397 20260429. The patent publication number is US202..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Wuxi Indie Microelectronics Ltd has submitted a patent application for Brightness Control Method of Light-emitting Device and Light-emitting Module. Pan Jikuai and Zhuang Jian developed the invention.
The patent application number is US202519073779 20250307. The patent publication number is US202602711..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Shenzhen Feasycom Co Ltd has applied United States patent for Multi-bluetooth-chip Control System and Smart Device. Shao Yongqing and Wang Tan developed it.
The patent application number is US202619661612 20260428. The patent publication number is US20260270672 (A1). International Patent Classification..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Vishay Semiconductor GmbH and Vishay Intertechnology Inc have sought patent for Reflector System with Fully-encapsulated Silver Layer for Infrared-emitting Diodes. This invention was developed by Glöckler Tim and Leber Philipp.
The patent application number is WO2025US18541 20250305. The patent publicatio..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- World Intellectual Property Organization has released Oh Young Sook patent application for Wappen Patch Provided with Light-emitting Device.
The patent application number is WO2025KR02904 20250305. The patent publication number is WO2026186927 (A1). International Patent Classification codes are A41D27/08..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- NTT Innovative Devices Corp has applied WIPO patent for Light-receiving Element and Receiver. Ooba Naoki, Nakanishi Yasuhiko, Nakamura Takahiro and Tatsumi Shoko developed it.
The patent application number is WO2026JP08551 20260305. The patent publication number is WO2026186870 (A1). International Patent C..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Resonac has applied WIPO patent for Semiconductor Device Manufacturing Method, Slurry, and Organic Material. Maruyama Yoshiki developed it.
The patent application number is WO2025JP08569 20250307. The patent publication number is WO2026186135 (A1).
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Microoled has submitted a patent application for Tandem Light-emitting Device with Improved Resolution and Reliability. This invention was developed by Haas Gunther.
The patent application number is WO2026IB52075 20260304. The patent publication number is WO2026185752 (A1). International Patent Classificat..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Yangtze Memory Technologies has submitted a patent application for Semiconductor Devices, Systems, and Methods for Forming the Same. Chen Liang, Wei Danyang, Liu Wei, Li Wen, Huang Shiqi, Huo Zongliang, Chen Jiahao and Miao Lin developed the invention.
The patent application number is WO2025CN81285 2025030..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Yangtze Memory Technologies has submitted a patent application for Memory Devices and Fabricating Methods Thereof. This invention was developed by Wang Fazhan, Sun Chao, Zhang Dong, Wang Ya, Yan Meng, Zhou Wenbin, Yin Hang and Tang Zhaoyun.
The patent application number is WO2025CN80984 20250306. The paten..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Yangtze Memory Technologies has filed a patent application for Semiconductor Device and Fabrication Method Thereof. This invention was developed by Huang Hongye, Xu Wenxiang, Wang Yiming, Tang Zhaoyun and Ling Chenxi.
The patent application number is WO2025CN80674 20250305. The patent publication number is..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Yinwang Intelligent Tech Co Ltd has submitted a patent application for Memory Resource Processing Method and Apparatus. This invention was developed by Xu Xudong, Dai Chao and Xu Xing.
The patent application number is WO2025CN80585 20250304. The patent publication number is WO2026183717 (A1). International..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Yangtze Memory Technologies has submitted a patent application for Semiconductor Structures in Memory Devices. This invention was developed by Huang Zishan, Wang Yu and Li Danyang.
The patent application number is WO2025CN80256 20250303. The patent publication number is WO2026183667 (A1). International Pat..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Yangtze Memory Technologies has sought patent for Semiconductor Structures in Memory Devices. This invention was developed by Hou Xu, Liao Bin and Zhang Fangyao.
The patent application number is WO2025CN80227 20250303. The patent publication number is WO2026183661 (A1). International Patent Classification ..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- Heroic Design Inc has applied WIPO patent for System and Method for Augmented Product Design. Zhang Ningyu, Poudel Sijan and Mclean Christopher developed it.
The patent application number is WO2026CA50364 20260309. The patent publication number is WO2026183644 (A1). International Patent Classification code..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- State Intellectual Property Office of China has released Shanghai Yuwei Semiconductor Tech Co Ltd patent application for High-precision Repeated Positioning Adjusting Device. This invention was developed by Wang Wei, Sun Gang, Ye Lu, Nie Qiuping and Duan Lifeng.
The patent application number is CN20261071..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- Tianjin Jingxin Tech Development Co Ltd has filed a patent application for Finishing Assembly and Manufacturing Method Thereof. This invention was developed by Xu Zhanfeng.
The patent application number is CN202610551117 20260424. The patent publication number is CN122274847 (A). International Patent Clas..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- World Intellectual Property Organization has released Pi Imaging Tech SA patent application for High Drain Gate Voltage-tolerant Driver MOSFET with Current Limit Capabilities. This invention was developed by Antolovic Michel, Carimatto Augusto J and Keshavarzian Pouyan.
The patent application number is WO2..
Semiconductor
| Mon 21 Sep 2026
Geneva, Sept. 21 -- World Intellectual Property Organization has published Biasci Alessandro and Yinwang Intelligent Tech Co Ltd patent application for Memory System and Method for Memory System. The invention was developed by Morelli Bruno and Biasci Alessandro.
The patent application number is WO2025EP55742 20250304. The pa..
Semiconductor
| Mon 21 Sep 2026
Beijing, Sept. 21 -- State Intellectual Property Office of China has received Jiangsu Tianke Heda Semiconductor and Beijing Tankeblue Semiconductor patent application for Multi-wire Cutting Equipment and Method for Improving Stability of Multi-wire Cutting Process. Sun Jianjian, Peng Tonghua, Yang Jian, Lou Yanfang, Zhang Wen, L..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 21 -- Anhui Medical University has submitted a patent application for Magnetothermal Micro-fluidic Chip and Application Thereof. Chen Zhongrong, Fang Zhixiang, Zhao Gang, Cheng Yue and Wei Mulin developed the invention.
The patent application number is CN202610346616 20260320. The patent publication number is CN1..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 21 -- Hangzhou Institute of Medical Chinese Academy of Sciences has applied Chinese patent for Method for Separating and Detecting Exosome in Whole Blood by Using Micro-fluidic Chip. Tan Yuhong, Jiang Yifei, Li Peixiang, Liu Yating and Wang Chenjing developed it.
The patent application number is CN202610222672 20..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 21 -- State Intellectual Property Office of China has published Shenzhen Yilifang Biotech Co Ltd patent application for Reaction Control Device of Centrifugal Micro-fluidic Chip. The invention was developed by Liao Shengyun and Huang Yubin.
The patent application number is CN202610173429 20260206. The patent pu..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 21 -- Shenzhen Shuxin Biotechnology Co Ltd has submitted a patent application for Pre-cutting Chip and Preparation Method and Application Thereof. This invention was developed by Zeng Qingda, Liu Kun, Huang Yuxia, Kuang Jiehui, Zhao Zhi, Lin Yubin, Jiang Tongtong, Yuan Chaofeng, Wang Haiyang and He Mengting.
Th..
Semiconductor
| Tue 22 Sep 2026
Beijing, Sept. 21 -- Guo Shanshan has applied Chinese patent for Preparation Method and System of Silicon Carbide Micro Powder.
The patent application number is CN202610324964 20260317. The patent publication number is CN122273644 (A). International Patent Classification codes are B02C19/06, B02C21/00, B02C23/14 and B02C23/2..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Nexperia BV patent application for Method for Manufacturing a Semiconductor Package Assembly as Well as Such Semiconductor Package Assembly. This invention was developed by Brown Adam, Chang Ting Wei and Ting Jia Yunn.
The patent application number is US20261..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received Sony Semiconductor Solutions Corporation patent application for Semiconductor Device and Laminated Structure. Fujimagari Junichiro developed the invention.
The patent application number is US202318876755 20230623. The patent publication number is US20260271..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Power Pickup for Dual Side Power Structure. Tzeng Jiann-tyng, Lin Wei-cheng and Huang Ching-yu developed it.
The patent application number is US202519071004 20250305. The patent publication number is US20260271702 (A1). Inte..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Ltd patent application for Ruthenium Oxide Film and Ruthenium Liner for Low-resistance Copper Interconnects in a Device. The invention was developed by Chin Shu-cheng.
The patent application number is US202619660406 20..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- SK Hynix has submitted a patent application for Semiconductor Package and Fabricating Method Thereof. This invention was developed by Chang Heon Yong.
The patent application number is US202519243617 20250619. The patent publication number is US20260271698 (A1). International Patent Classification codes a..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Yangtze Memory Technologies has filed a patent application for Semiconductor Device, Fabrication Method Thereof, and Memory System. This invention was developed by Guo Yali, Wang Fazhan, Yuan Bin, Sun Baoqing, Wei Danyang, Huo Zongliang and Xu Wei.
The patent application number is US202519435514 202512..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Sandisk Technology has submitted a patent application for Bonded Assemblies Including Through-die Via Structures and Methods for Forming the Same. This invention was developed by Nishida Akio, Higashitani Masaaki and Mushiga Mitsuteru.
The patent application number is US202519071286 20250305. The patent ..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Applied Materials has submitted a patent application for In-trench Quality Improvement of Silicon-and-oxygen-containing Materials. This invention was developed by Ghosh Supriya, Singhal Akhil, Wang Rui, Dhawan Sukrant and Singha Roy Susmit.
The patent application number is US202519072150 20250306. The pa..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Samsung Electronics patent application for Semiconductor Device and Method of Fabricating the Same. This invention was developed by Bae Joonyong, Kim Hanseong and Lee Seonwoong.
The patent application number is US202619455390 20260121. The patent publicatio..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has received Texas Instruments Incorporated patent application for Merged Trenches Surrounded by Wider Trench for Isolating Semiconductor Devices. Mathur Guruvayurappan, Ali Abbas, Yang Hao, Haider Asad, Sadovnikov Alexei and Aghroam Umamaheswari developed the invention.
..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Infineon Technologies patent application for Semiconductor Device with a First Isolation Trench and Method of Manufacturing. The invention was developed by Schlösser Till, Disney Donald Ray and Weis Rolf.
The patent application number is US202619442047 2026..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Deep Trench Isolation Structures and Methods of Forming the Same. Tseng Yen Chang developed the invention.
The patent application number is US202519070755 20250305. The patent publication number is US20260271685 (A1). Inte..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Samsung Electronics has applied United States patent for Semiconductor Device. Park Dongsik, Jang Hyeonwoo, Chang Jihoon, Shin Sooho, Kim Dongwan and Yoon Chansic developed it.
The patent application number is US202619468389 20260203. The patent publication number is US20260271684 (A1). International P..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Taiwan Semiconductor Manufacturing Co Ltd has applied United States patent for Dendrite Mitigation of Passive Components. Chiu Chen-nan, Huang Li-hsien, Chang Jui Shen, Lu Yinlung and Chuang Yao-chun developed it.
The patent application number is US202619665175 20260501. The patent publication number i..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor Manufacturing Co Ltd patent application for Method for Manufacturing Semiconductor Structure Using Multi-layered Hard Mask. The invention was developed by Lee Shen-yang, Lin Pinyen, Chao Huang-lin, Chang Hsu-kai, Chang Hsiang-pi and Lu Ch..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published Applied Materials patent application for Methods for Reshaping Masking Layer Openings. The invention was developed by Hsu Chen-chih, Sherman Steven, Lin Yung-chen and Liang Shurong.
The patent application number is US202519071085 20250305. The patent publica..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published International Business Machines patent application for Reusable Flexible Probe with Ferromagnetic Alignment for Chip Testing. The invention was developed by Vega Reinaldo, Ando Takashi, Wolpert David and Rana Uzma.
The patent application number is US20251907..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Applied Materials has filed a patent application for Die-level Warp Control in Device Manufacturing. This invention was developed by Subrahmanyan Pradeep Kumar and Sun Changwoo.
The patent application number is US202519254493 20250630. The patent publication number is US20260271675 (A1). Cooperative Pate..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Yamaha Robotics Co Ltd and Tokyo University of Science Foundation patent application for Chip Holding Tool, Chip Holding Device, and Device for Manufacturing Semiconductor Device. This invention was developed by Kikuchi Hiroshi, Miyatake Masaaki and Li Jin.
..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Lam Research has submitted a patent application for Multl-station Tool with Rotatable Top Plate Assembly. This invention was developed by Leeser Karl Frederick and Lavoie Adrien.
The patent application number is US202619662946 20260429. The patent publication number is US20260271672 (A1). International P..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has released Beijing NAURA Microelectronics Equipment patent application for Processing Chamber and Semiconductor Processing Equipment. This invention was developed by Wang Fulai.
The patent application number is US202318875527 20230616. The patent publication number is U..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Taiwan Semiconductor Manufacturing Co Ltd has submitted a patent application for Wafer Transport Method and Apparatus. Shen Yu-chun, Chiang Wen-chih, Kuo Yuan-cheng, Hsiao Kai-hung, Jen Chi-chung and Huang Chih-hsiung developed the invention.
The patent application number is US202619662616 20260429. Th..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- U.S. Patent and Trademark Office has published UTAC Headquarters patent application for Semiconductor Device Carriers and Methods of Making and Using. The invention was developed by Robles Roel Adeva and Chow Chee Kay.
The patent application number is US202619664425 20260430. The patent publication num..
Semiconductor
| Tue 22 Sep 2026
Alexandria, Sept. 21 -- Daikin Finetech has submitted a patent application for Substrate Processing Module and Substrate Processing Device. This invention was developed by Toyotama Hidefumi and Deguchi Yasunori.
The patent application number is US202419167158 20240322. The patent publication number is US20260271665 (A1). Intern..
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