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Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Jiangsu Yanyutong Electronic Tech Co Ltd has sought patent for Automatic Data Analysis Method for Integrated Circuit Chip Performance Test. This invention was developed by Que Chenbing.
The patent application number is CN202610195753 20260211. The patent publication number is CN122332853 (A). International..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Xiamen Aiyin Technology has submitted a patent application for Method and System for Enhancing Intensity of Received Signals of Infrared Geminate Transistors Based on Data Processing. This invention was developed by Lukuang, Gong Yile, Dai Huajun and Zhang Junjie.
The patent application number is CN202610701..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Realtek Semiconductor Corporation has applied Chinese patent for Electronic Device and Image Searching Method. Chen Hongying developed it.
The patent application number is CN20251002271 20250102. The patent publication number is CN122332595 (A). International Patent Classification codes are G06F16/538 and G0..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Hu Qing has applied Chinese patent for Storage Coherence Center Chip Based on Chip Particle Integration, Storage Coherence Arbitration Device and Self-adaptive Control Method.
The patent application number is CN202610430027 20260402. The patent publication number is CN122332342 (A). International Patent Cl..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has released Jihai Microelectronics patent application for Communication Method, Chip Assembly and Replaceable Accessory. This invention was developed by Liu Weichen, Zhai Haoxiang, Li Juhui and Chen Hao.
The patent application number is CN202610354706 20260320. Th..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Chinese Patent for Wood Chip Treatment Device for Furniture Production has been issued to Huzhou Meishuo Wood Ind Co Ltd. This invention was developed by Yao Fangfang.
The patent application number is CN202520416935U 20250311. The patent publication number is CN223812178 (U). International Patent Classific..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has received Shanghai Ju Yue Electronics Co Ltd patent application for Semiconductor Chip Gold Thread Segmentation Method and System Based on Deep Learning. Shang Yue and Yu Xixia developed the invention.
The patent application number is CN202610438920 20260403. ..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has awarded a patent to Shandong Guozhu Pipeline Tech Co Ltd for Plastic Lining Forming Machine with Synchronous Chip Removal Function. Wang Xie, Xiao Hejun, Wang Jun and Dai Zixiong developed the invention.
The patent application number is CN202520393550U 202503..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Shaanxi Tianshili Tech Co Ltd has secured a patent on Universal Clamp for Testing Semiconductor Device. Wang Wei developed the invention.
The patent application number is CN202520474599U 20250318. The patent publication number is CN223812024 (U). International Patent Classification code is B25B11/00.
T..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has received Beijing Hongtu Semiconductor Co Ltd patent application for Image Weak Dead Pixel Calibration Method, Correction Method, Image Sensor and Terminal Equipment. Liu Wei, Zhang Wei and Zhang Mingfeng developed the invention.
The patent application number ..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has received Suzhou Tongfu Chaowei Semiconductor patent application for Abnormal Traceability System and Method for Chip Carrier Tray Damage. Jiao Jie and Chen Shuo developed the invention.
The patent application number is CN202610483622 20260413. The patent public..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Qinhuangdao Xinglong Wheels has been granted a patent for Auxiliary Tool for Inspecting and Maintaining Auger of Chip Removal Machine. This invention was developed by Jiang Feng, Zhang Haifeng, Yuan Lijian, Zhang Yu, Zhang Jisheng and Li Gang.
The patent application number is CN202520400473U 20250310. The pa..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Jiangsu Weida Semiconductor Co Ltd has obtained a patent for edge grinding device for semiconductor processing. This invention was developed by Zhang Xingjie, Cheng Wanpo, Wang Rongyuan and Qin Biao.
The patent application number is CN202520402756U 20250310. The patent publication number is CN223811907 (U)..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Jiangxi Cunxin Semiconductor Co Ltd has submitted a patent application for Semiconductor Wafer Defect Detection Method and System Based on Machine Vision. Shu Zhonghua developed the invention.
The patent application number is CN202610452682 20260408. The patent publication number is CN122335767 (A). Intern..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Beijing Maizhuji Tech Co Ltd has submitted a patent application for Multi-modal Image Analysis System for Czochralski Silicon Single Crystal Growth Interface. This invention was developed by Liu Runfeng and Tao Ying.
The patent application number is CN202610817503 20260608. The patent publication number is..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has released Chongqing Jiagui Tech Co Ltd patent application for SMT Chip Mounter Fault Prediction Method and System Based on Image Recognition. This invention was developed by Peng Yang.
The patent application number is CN202610807597 20260605. The patent public..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Realtek Semiconductor Corporation has sought patent for Interface Card Device and Repairing Method Thereof. This invention was developed by Gao Junwei, Zhang Yilong and Wu Wanru.
The patent application number is CN20251001372 20250102. The patent publication number is CN122332324 (A). International Patent Cl..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- ChangXin Technology Group has filed a patent application for Data Processing Circuit and Semiconductor Memory. This invention was developed by Chen Qinchen, Ye Bingxiang, Ru Fei and Zhang Zhiqiang.
The patent application number is CN20251007689 20250102. The patent publication number is CN122332321 (A). Inte..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has published Haiguang Information Technology patent application for Processor, Data Processing Method, Chip and Electronic Equipment. The invention was developed by Xu Shuai.
The patent application number is CN202610429134 20260401. The patent publication number i..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has received Shenzhen Jiangyuan Tech Co Ltd patent application for Request Processing Method and Device, Electronic Equipment, Chip and Storage Medium. Wang Yongdong, Guo An, Li Ying and Zhou Jie developed the invention.
The patent application number is CN2026107..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has received Shenzhen Silicongo Microelectronics Inc patent application for Method and Device for Optimizing Use of Skip Column and NAND Flash Memory Controller. Wu Jian, Huang Linyong and Lin Yin developed the invention.
The patent application number is CN202610..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Guangzhou Runxin Information Tech Co Ltd has filed a patent application for Radio Frequency Chip Algorithm Software and Hardware Collaborative Verification System, Method and Equipment and Medium. This invention was developed by He Hongyin, Lin Ziqi, Chen Zifan, Liu Yi, Zhang Yong and Wang Riyan.
The paten..
Semiconductor
| Mon 12 Oct 2026
Beijing, Oct. 12 -- Zhongshan Yuanshi Micro Tech Co Ltd has applied Chinese patent for Fault Isolation and Recovery Method of Consumable Chip Data Analysis System Based on Multi-thread Parallel Architecture. Zhuo Dongjun developed it.
The patent application number is CN202610428718 20260402. The patent publication number is C..
Semiconductor
| Mon 12 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has received Changsha Jinwei Integrated Circuit Co Ltd patent application for Mapping Method and Device for Logical Channel and Physical Channel of Chip. Li Man, Gu Jiahua, Chen Yihao and Hu Yue developed the invention.
The patent application number is CN20261078..
Semiconductor
| Mon 12 Oct 2026
Beijing, Oct. 12 -- Shenzhen Aowei Lingxin Tech Co Ltd has applied Chinese patent for SOC Chip Mapping Instance Generation Method and Device and Storage Medium. Zhang Zesheng and Zhu Jiu developed it.
The patent application number is CN202610403662 20260330. The patent publication number is CN122332197 (A). International Pate..
Semiconductor
| Mon 12 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has published Xi'an Jiaotong University and Xijiao Network Space Safety Research Inst patent application for Enclave Non-perception Dynamic Kernel Resource Scheduling Method Based on RISC-V Chip. The invention was developed by Su Yaqin, Zhou Tian, Du Linkang, Han Bo..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Jiangyin Jinyu Photovoltaic New Mat Co Ltd has secured a patent on Rotary Clamping Device for Silicon Core Rod. Wang Juan developed the invention.
The patent application number is CN202423207428U 20241225. The patent publication number is CN223811984 (U). International Patent Classification code is B25B11/..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- State Intellectual Property Office of China has awarded a patent to Weiyang Precision Tech Changzhou Co Ltd for Grinding Machine with Waste Chip Recycling Function. Cai Liyang developed the invention.
The patent application number is CN202520339196U 20250228. The patent publication number is CN223811937 (U..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Jiangsu Shunjia Intelligent Tech Co Ltd has been granted a patent for Efficient Chip Removal Device for Numerical Control Machining Center. Su Xiaoping, Ji Qin, Tian Xiaojun and Tian Shengfei developed the invention.
The patent application number is CN202520290573U 20250224. The patent publication number i..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Resonac has submitted a patent application for Method for Manufacturing Semiconductor Device and Semiconductor Device. This invention was developed by Fukuzumi Shizu, Maruyama Yoshiki, Okuda Tadashi and Fujita Yuta.
The patent application number is US202319479343 20230810. The patent publication number is..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published Resonac patent application for Method for Manufacturing Semiconductor Device, and Semiconductor Device. The invention was developed by Shibata Tomoaki, Fukuzumi Shizu, Okuda Tadashi and Shirasaka Toshiaki.
The patent application number is US202319478274 202..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published Micron Technology patent application for Memory-only Cubes and Methods of Forming the Same. The invention was developed by Zhou Wei.
The patent application number is US202619561502 20260310. The patent publication number is US20260305497 (A1). International P..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Micron Technology has submitted a patent application for Tcdram Device Assembly and Method Thereof. Lee Jungbae developed the invention.
The patent application number is US202619558134 20260305. The patent publication number is US20260305496 (A1). International Patent Classification codes are H10B80/00 an..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has released Resonac patent application for Semiconductor Device and Method for Manufacturing Semiconductor Device. This invention was developed by Chabana Koichi, Tazawa Tsuyoshi, Hayashide Akiko and Hirata Shuntaro.
The patent application number is US202419478263 2024090..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Micron Technology has submitted a patent application for Hybrid Wire Bonding Schemes for Semiconductor Devices, Including for Semiconductor Devices with Interface Chips. This invention was developed by Murray Jack E, Limaye Aparna U, Bhattacharjee Soham, Karim M Ataul, Ravella Chandana Rani and Zhao Gang.
..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Infineon Technologies has submitted a patent application for Semiconductor Module Arrangement. This invention was developed by Bürger Matthias and Troska Georg.
The patent application number is US202619573023 20260320. The patent publication number is US20260305489 (A1). International Patent Classificati..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor Manufacturing has sought patent for Method and Structure for a Three-dimensional Package. This invention was developed by Ting Kuo-chiang, Sahoo Ashish Kumar, Shih Chao-wen, Hsiao Min-chien, Pan Hsin-yu, Chen Yen-ming and Lin Chen-sheng.
The patent application number is US202619704014..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Manufacturing Co Limited patent application for Semiconductor Device Including Cross-die Bonding Ring and Methods for Forming the Same. This invention was developed by Wang Chih-hong, Lai Yu-chia, Kuo Ting Hao and Chen Chen-shien.
The pa..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published KIOXIA patent application for Semiconductor Memory Device. The invention was developed by Sanuki Tomoya, Maejima Hiroshi and Utsumi Tetsuaki.
The patent application number is US202619688510 20260526. The patent publication number is US20260305470 (A1). Intern..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Intel has submitted a patent application for Package Substrate with a Mold Extension and Die Height Equalization. This invention was developed by Agraharam Sairam, Mallik Debendra, Manepalli Rahul N and Sharan Sujit.
The patent application number is US202519093649 20250328. The patent publication number i..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Resonac has submitted a patent application for Method for Manufacturing Semiconductor Device, and Curable Resin Composition. This invention was developed by Sugano Ryo, Nagayama Shintaro and Aoyagi Chikashi.
The patent application number is US202319479348 20230929. The patent publication number is US20260..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published Texas Instruments patent application for Microelectronics Device Package Integrating Multiple Dies. The invention was developed by Zhang Rongwei and Tuncer Enis.
The patent application number is US202519096331 20250331. The patent publication number is US2026..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Resonac has sought patent for Temporary Protection Film for Semiconductor Device Production and Semiconductor Device Production Method. This invention was developed by Takegasa Shinnosuke and Ito Kodai.
The patent application number is US202419477099 20240806. The patent publication number is US2026030544..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has released Resonac patent application for Temporary Protection Film for Semiconductor Device Manufacturing and Method for Manufacturing Semiconductor Device. This invention was developed by Takegasa Shinnosuke and Ito Kodai.
The patent application number is US20241947709..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Mitsubishi Electric has submitted a patent application for Semiconductor Device and Method of Manufacturing Semiconductor Device. Beppu Keiji and Kano Naoto developed the invention.
The patent application number is US202619439090 20260102. The patent publication number is US20260305444 (A1). International..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Resonac has applied United States patent for Method for Manufacturing Semiconductor Device. Hirano Kazue, Imazu Yuki, Toba Masaya and Togasaki Kei developed it.
The patent application number is US202319477790 20231208. The patent publication number is US20260305435 (A1). International Patent Classificatio..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has received Texas Instruments patent application for Electronic Device Having an Integrated Inductor Coil. Facal Charmaine Grace, Yabuuchi Nicole and Molina John Carlo developed the invention.
The patent application number is US202519093591 20250328. The patent publicatio..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Mitsubishi Electric has applied United States patent for Semiconductor Device and Method of Manufacturing Semiconductor Device. Maeda Atsushi and Imoto Yuji developed it.
The patent application number is US202319489083 20230901. The patent publication number is US20260305421 (A1). International Patent Cla..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has received Resonac patent application for Method for Manufacturing Multilayer Substrate, and Semiconductor Device. Noma Hirokazu and Shirasaka Toshiaki developed the invention.
The patent application number is US202319478461 20230607. The patent publication number is US2..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Texas Instruments has filed a patent application for Packages with Plated Die Pads, Terminals, and Inductors. This invention was developed by How You Chye, Tay Huay Yann and Julien Mok Wei Li.
The patent application number is US202519096284 20250331. The patent publication number is US20260305386 (A1). Co..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Texas Instruments has submitted a patent application for Dual Die Device with Conductive Plate Substrate Connection. Shibuya Makoto, Schemm Nathan, Kim Woochan, Sriraj Sahana and Kasper Abha developed the invention.
The patent application number is US202519095629 20250331. The patent publication number is..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published Mitsubishi Electric patent application for Semiconductor Device and Method of Manufacturing Semiconductor Device. The invention was developed by Saito Shoji, Inokuchi Seiichiro and Shirahama Ryoya.
The patent application number is US202218879142 20220914. The..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has received Texas Instruments patent application for Double Sided Multi Chip for Leaded Package. Lu Lila Iysobelle Espejo, Medina Francis Glyde Cubi and Cayabyab Mia Katrina Alsaga developed the invention.
The patent application number is US202519089353 20250325. The pate..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Texas Instruments has submitted a patent application for Quad Flat No-lead (QFN) Manufacturing Process. This invention was developed by Soo Wai Kong and Lau Hong Seng.
The patent application number is US202619704124 20260610. The patent publication number is US20260305379 (A1). International Patent Clas..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor Manufacturing Co Limited has applied United States patent for Energy Harvest and Storage Device for Semiconductor Chips and Methods for Forming the Same. Huang Kuo-ching, Chen Kuen-yi, Ong Yi Ching and Chuang Harry-hak-lay developed it.
The patent application number is US20261970316..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor has submitted a patent application for Hybrid Cut Metal Gate Method for Reducing Cell Pitch. This invention was developed by Chen Chun-yuan, Tien Li-chun, Tsai Ching-wei, Chen Chin-liang and Lu Chi-yu.
The patent application number is US202619709587 20260616. The patent publication nu..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- IBM has submitted a patent application for Voltage Differential Tolerant Net Lines in Semiconductor Structures. This invention was developed by Zhu Hai, Ogino Atsushi and Xu Yueming.
The patent application number is US202519095670 20250331. The patent publication number is US20260305307 (A1). Cooperative ..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor has filed a patent application for Semiconductor Structures and Methods of Forming the Same. This invention was developed by Chih Fang-i, Shen Hsiang-ku, Chang Wen-ling and Hsiao Chun-wen.
The patent application number is US202619704882 20260611. The patent publication number is US202..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- STMicroelectronics International has filed a patent application for Method for Manufacturing a System-on-chip Including Quantum Dot Regions and MOS Transistors. This invention was developed by Suarez Segovia Carlos Augusto.
The patent application number is US202619563849 20260311. The patent publication n..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor has submitted a patent application for Hree-dimensional Integrated Circuit with Hybrid Bond Metal Structure. This invention was developed by Lai Yu-chang, Chiu Chen-nan, Chang Jui Shen, He Jun and Chuang Yao-chun.
The patent application number is US202619708473 20260615. The patent pu..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor has sought patent for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Liao Wei-hao, Chen Cheng-hao, Dai Yu-teng, Chu Hwei-jay, Lu Chih Wei, Tien Hsi-wen and Yao Hsin-chieh.
The patent application number is US202619707425 20260615. The patent ..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor has applied United States patent for Integration of Via and Bottom Electrode for Memory Cell. Chu Wen-ting, Shih Sheng-hung, Chen Tzu-yu and Tu Kuo-chi developed it.
The patent application number is US202619695080 20260602. The patent publication number is US20260305297 (A1). Internat..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor has applied United States patent for Memory Device Having Backside Power Vias. Chen Jui-lin and Wang Ping-wei developed it.
The patent application number is US202619709396 20260616. The patent publication number is US20260305289 (A1). International Patent Classification codes are H10B..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor patent application for SRAM Middle Strap with Feedthrough Via. The invention was developed by Chen Jui-lin, Chang Feng-ming and Wang Ping-wei.
The patent application number is US202619701200 20260608. The patent publication number is US..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor has sought patent for Local Interconnect. This invention was developed by Lin Chung-yi, Wu Cheng-hsien and Wang Yen-sen.
The patent application number is US202619706012 20260612. The patent publication number is US20260305283 (A1). International Patent Classification codes are H10W20/..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has released STMicroelectronics Rousset and STMicroelectronics International patent application for Contact for Electronic Component. This invention was developed by Fornara Pascal and Rivero Christian.
The patent application number is US202619703547 20260610. The patent..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published Texas Instruments patent application for Deep Trench Intersections with Corner Rounding. The invention was developed by Muenz Josef and Enzelberger-heim Michael.
The patent application number is US202519096291 20250331. The patent publication number is US2026..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor has applied United States patent for Isolation Structures in Semiconductor Devices. Liu Chien-hsuan developed it.
The patent application number is US202619704722 20260611. The patent publication number is US20260305274 (A1). International Patent Classification codes are H10D30/01, H10..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Applied Materials has sought patent for Aluminum Nitride Bonding. This invention was developed by Wong Keith Kwong Hon, Li Kun and O'leary Matthew.
The patent application number is US202519095599 20250331. The patent publication number is US20260305273 (A1). International Patent Classification code is C23..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Samsung Electronics has submitted a patent application for Method of Forming Pattern and Method of Manufacturing Semiconductor Device. Lee Seok Hwan, Kim Yunho, Kim Younghun and Choi Samjong developed the invention.
The patent application number is US202519364682 20251021. The patent publication number is..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor patent application for Semiconductor Device and Method of Testing the Same. The invention was developed by Wang Wei, Chiang Chung-shih, Hsu Ruei-jyun, Ho Chia-chi, Yu Chang-hung, Chang Wei-jen and Liu Hsin-shan.
The patent application num..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Canon has submitted a patent application for Method of Separating a Chip from a Carrier and a System for Performing the Method. This invention was developed by Roy Nilabh K.
The patent application number is US202519092913 20250327. The patent publication number is US20260305260 (A1). International Patent ..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor Mfg and TSMC China Co Limited patent application for Movable Rack System and Operating Method of the Same. This invention was developed by Zhu Rong, Chen Chen, Huang Wen-jing and Jin Xiao.
The patent application number is US202519192919 ..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published ASM International Holding patent application for Jigs and Methods of Teaching Substrate Handling in Semiconductor Processing Systems Using Jigs. The invention was developed by Chen Dongyang.
The patent application number is US202619690728 20260528. The patent..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Taiwan Semiconductor Manufacturing Co Limited has submitted a patent application for Apparatus and Methods for Handling Semiconductor Part Carriers. Liu Hsu-shui, Pai Jiun-rong, Chen Yan-han, Wu Feng-kuang, Hu Cheng-kang and Wu Ren-hau developed the invention.
The patent application number is US20261970..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published Samsung Display patent application for Electrostatic Chuck, Substrate Treating Apparatus and Method of Manufacturing Display Device Using the Same. The invention was developed by Park Taeyoung, Cho Jaeheung, Kim Byeong-hyun, Kim Byung Moo, Lee Jun-hee, Park Do..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published ASM International Holding patent application for Yokes, Yoke Assemblies and Semiconductor Processing Systems Including Yokes, and Related Methods of Making Yokes and Forming Semiconductor Structures Using Yokes. The invention was developed by Tantiwong Kyle, M..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published SCREEN Holdings patent application for Substrate Processing Apparatus and Substrate Processing Method. The invention was developed by Nakagawa Nozomu.
The patent application number is US202419478983 20240405. The patent publication number is US20260305239 (A1..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has received Tokyo Electron patent application for Substrate Processing System, Storage Module, and Substrate Processing Method. Nagayama Nobuyuki developed the invention.
The patent application number is US202619676896 20260514. The patent publication number is US20260305..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Kokusai Electric has applied United States patent for Substrate Holder, Substrate Processing Apparatus, Method of Processing Substrate, Method of Manufacturing Semiconductor Device, and Recording Medium. Sakurai Hajime and Nishino Tatsuya developed it.
The patent application number is US202619568417 20260..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- ASM International Holding has applied United States patent for Batch Substrate Processing for Area Selective Deposition. Pierreux Dieter developed it.
The patent application number is US202619629339 20260326. The patent publication number is US20260305230 (A1). International Patent Classification codes ar..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has received Tokyo Electron patent application for Bonding Apparatus, Bonding System, and Bonding Method. Maki Tetsuya developed the invention.
The patent application number is US202419488919 20240520. The patent publication number is US20260305226 (A1). International Pate..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has published Taiwan Semiconductor patent application for Semiconductor Processing Tool and Methods of Operation. The invention was developed by Cheng Kuang-wei, Liu Yung-tsun and Liu Yi-xuan.
The patent application number is US202519089740 20250325. The patent publication..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has received Shibaura Mechatronics patent application for Substrate Processing Apparatus and Substrate Processing Method. Kanai Takahiro and Tsushima Keisuke developed the invention.
The patent application number is US202619562690 20260310. The patent publication number is..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- SCREEN Holdings has filed a patent application for Cooling Apparatus, Substrate Processing Apparatus and a Method for Cooling a Processing Liquid. This invention was developed by Watanabe Tetsuya and Aihara Tomoaki.
The patent application number is US202619572380 20260319. The patent publication number is..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- U.S. Patent and Trademark Office has released Taiwan Semiconductor patent application for Spraying Member and Method of Processing Substrate Using the Spraying Member. This invention was developed by Wu You-jhang, Wen Chih-wei, Li Ming-che and Chen Cheng-kuang.
The patent application number is US202519091..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Resonac has submitted a patent application for Method for Cleaning Semiconductor Chip, and Method for Manufacturing Semiconductor Device. Sasaki Kazuhiro, Morosaki Tomohito, Kai Seiji, Kinoshita Takehiro, Makino Tatsuya, Deguchi Hiroyoshi, Aoyagi Chikashi, Naoda Koji and Shirasaka Toshiaki developed the in..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Tokyo Ohka Kogyo has submitted a patent application for Method for Processing Semiconductor Substrate. Chang Yuan-chia, Kumagai Tomoya and Suga Eita developed the invention.
The patent application number is US202619576022 20260324. The patent publication number is US20260305218 (A1). International Patent ..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Disco has filed a patent application for Stock Roll for Protective Film Transfer, Protective Film Arranging Method, and Chip Manufacturing Method. This invention was developed by Kaneko Tomohiro, Motoike Shingo and Kimura Masamitsu.
The patent application number is US202619553951 20260302. The patent publ..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Tokyo Electron has sought patent for Methods for Reducing Critical Dimension Variation. This invention was developed by Wang Peng and Hirsch Emilia.
The patent application number is US202519096984 20250401. The patent publication number is US20260305208 (A1). Cooperative Patent Classification codes are H1..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Lam Research has filed a patent application for Systems and Methods for Etching a High Aspect Ratio Structure. This invention was developed by Joi Aniruddha, Wong Merrett, Hudson Eric A, Dole Nikhil and Yanagawa Takumi.
The patent application number is US202619698128 20260604. The patent publication numbe..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Applied Materials has submitted a patent application for Laser Ablation of Backside Dielectric to Adjust Substrate Warpage. This invention was developed by Zheng Yi, Rice Michael, Lei Wei-sheng, Kucher Olga and Subrahmanyan Pradeep.
The patent application number is US202519094655 20250328. The patent publ..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Tokyo Electron has filed a patent application for Apparatus and Methods for Processing Bonding Semiconductor Wafers. This invention was developed by Lefevre Scott, Mimura Yuji and Hoshino Satohiko.
The patent application number is US202619707959 20260615. The patent publication number is US20260305197 (A1..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Zhu Yongmao has been awarded a patent for Conveying Device for LED Substrate and Dispensing System.
The patent application number is CN202423316174U 20241231. The patent publication number is CN223811219 (U). International Patent Classification codes are B05C13/02 and B05C5/02.
State Intellectual Propert..
Semiconductor
| Tue 13 Oct 2026
Beijing, Oct. 12 -- Hefei Luxiao Semiconductor Mat Co Ltd has received a patent for Glue Scraping Tool for Silicon Carbide Seed Crystal Graphite Cover. This invention was developed by Zheng Jiansheng, Rouillon and Chen Qi.
The patent application number is CN202422857655U 20241122. The patent publication number is CN223811208 ..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Intel has submitted a patent application for Package Substrate with a Backside and Front Side Mold Extension. This invention was developed by Agraharam Sairam, Mallik Debendra and Manepalli Rahul N.
The patent application number is US202519093632 20250328. The patent publication number is US20260305419 (A..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Shinko Electric Industries has submitted a patent application for Wiring Substrate and Semiconductor Device. Kamioka Yuna, Kodani Kotaro and Shimodaira Tomoyuki developed the invention.
The patent application number is US202619573905 20260320. The patent publication number is US20260305415 (A1). Internati..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Ibiden has submitted a patent application for Wiring Substrate Having Multiple Build-up Parts. This invention was developed by Kuwabara Masashi and Kagohashi Susumu.
The patent application number is US202619704624 20260611. The patent publication number is US20260305414 (A1). International Patent Classifi..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Texas Instruments has submitted a patent application for Semiconductor Packages with Separately Plated Metal Pillars. This invention was developed by Cayabyab Jamel and Cayabyab Jarevic.
The patent application number is US202519096118 20250331. The patent publication number is US20260305410 (A1). Internat..
Semiconductor
| Mon 12 Oct 2026
Alexandria, Oct. 12 -- Intel has sought patent for Embedded Vertical Strips for Through Substrate Electrical Routing. This invention was developed by Krishnamurthy Sandesh Geejagaaru, Balakrishnan Ranjul, Kamgaing Telesphor and V Bharath.
The patent application number is US202519092830 20250327. The patent publication number is..
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