Semiconductor
| Tue 03 Feb 2026
Beijing, Feb. 4 -- Applied Materials has applied Chinese patent for Heat Insulation Plate. Nagappan Vivek, Kalsekar Vivek, Li Junyi, Prabhakar Vinay K, Praveesh Chandran, Sreechanam David R, Khan Afzal, Singh Saravjeet S, Chandrasekar Subramanya and Radhakrishnan Sridhar developed it.
The patent application number is CN20238088..