Semiconductor
| Thu 11 Dec 2025
Beijing, Dec. 11 -- Beijing Poly Microchip Tech Co Ltd has submitted a patent application for Preparation Method of Metal Mold with Multi-layer Structure and Metal Mold with Multi-layer Structure. Chen Hui, Gao Yachai, Wu Dalin, Wu Xiao, Su Chenyu, Niu Fengxiao, Liu Zhiyu, Wu Jingxuan, Tan Xiaofeng and Liu Qiang developed the in..