Semiconductor
| Thu 25 Jun 2026
Munich, June 26 -- Intel has applied European patent for Source/drain Contacts with Interface Liners and Cap Materials in Integrated Circuit Structures. Yeung Chun Wing, Luo Yanbin, Lin Chia-ching, Lin Chung-hsun, Chu Tao, Haratipour Nazila, Jang Minwoo, Ghani Tahir, Xu Guowei, Packan Paul, Rode Johann Christian, Zhang Yang, Rah..