Semiconductor
| Fri 21 Aug 2026
Alexandria, Aug. 22 -- Intel has been granted a patent for Substrate Trench for Improved Hybrid Bonding. Chiu Julia, Chidambaram Vivek, Bhatia Mohit, Zhang Botao, Shi Yi, Karhade Omkar, Zou Zhihua and Aghazadeh Mostafa developed the invention.
The patent application number is US202217854813 20220630. The patent publication numb..