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Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Jiangsu Jingfu New Material Tech Co Ltd has filed a patent application for Silicon Nitride Coating Used in Silicon Carbide Reaction Sintering Furnace. This invention was developed by Song Baoshan, Song Youxin, Yang Canpeng, Sun Liming, Song Yuxin and Dai Pengfei. The patent application number is CN2025107..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Guangdong Huanbo New Mat Co Ltd has filed a patent application for Grain Boundary Layer Ceramic Substrate with High Dielectric Constant and Preparation Method and Application Thereof. This invention was developed by Hu Chuandeng, Zhuo Weizhuang and Li Shanshan. The patent application number is CN202510783..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Weijing Tech Taizhou Co Ltd has sought patent for Automatic Processing Equipment for NTC (negative Temperature Coefficient) Thermistor Chip. This invention was developed by Jiang Hui. The patent application number is CN202511132313 20250813. The patent publication number is CN120755039 (A). International ..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Zhuiguang Biotechnology Shenzhen Co Ltd has submitted a patent application for Micro-fluidic Chip Clamp. Lin Jintian, Xie Hainan and Xie Wei developed the invention. The patent application number is CN202510990759 20250718. The patent publication number is CN120754925 (A). International Patent Classificat..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has received Zhejiang Fude Paint Ind Co Ltd patent application for Silver Electroplating Stoving Varnish and Production Process Thereof. Mao Shuiming, Zhu Yongzhong and Zhou Runyan developed the invention. The patent application number is CN20251186257 20250805...

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Qingyuan Loubang Building Material Tech Co Ltd has applied Chinese patent for Organic Silicon Modified Polyurethane Waterproof Coating and Preparation Method Thereof. Zhang Yuanlu, Yu Dehua, Yu Guoli and Feng Kaiying developed it. The patent application number is CN202511170386 20250820. The patent public..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Tianfu Jiangxi Laboratory has submitted a patent application for Preparation Method of Nano Silicon, Nano Silicon Oxide and Silicon-carbon Nano Composite Material. Xiang Yong, Chen Hang, Jiang Yan and Chen Pengkun developed the invention. The patent application number is CN202511283240 20250909. The paten..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Hangzhou Hikmicro Sensing Technology Co Ltd has filed a patent application for Preparation Method and Preparation Device of MEMS (micro Electro Mechanical System) Device. This invention was developed by Chi Hai, Xu Zhenyu and Li Yineng. The patent application number is CN202410384061 20240329. The patent ..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has published Hangzhou Hikmicro Sensing Technology Co Ltd patent application for MEMS Wafer Segmentation Method. The invention was developed by Chi Hai and Xu Zhenyu. The patent application number is CN202410382707 20240329. The patent publication number is CN12..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Jiangsu Mingyi Zhizao Tech Co Ltd has submitted a patent application for Suspension Conveying Insurance System for Gene Sequencing Chip Movement. Yu Wenyuan, Li Yang, Xie Jingchen and Zhang Qian developed the invention. The patent application number is CN202511254822 20250904. The patent publication numbe..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has released Guwei Semiconductor Tech Jiangsu Co Ltd patent application for Wafer Feeding and Discharging Mechanism of Wafer Electroplating Machine. This invention was developed by Tu Hui and Song Chao. The patent application number is CN202511270378 20250908. T..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has received Laser Mfg Institute Henan Academy Of Sciences patent application for Silicon Carbide Wafer Cutting Method and System Based on Light Beam Modulation. Jiang Haoqing, Yu Dengde, Huang Xunqing, Hao Hongwei and Lu Qihang developed the invention. The pate..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Jiangsu Institute Of Sixin Tech Applicatoins Co Ltd has submitted a patent application for Organic Silicon Defoaming Agent Based on Synergistic Effect of Double Prepolymers and Preparation Method of Organic Silicon Defoaming Agent. This invention was developed by Dong Fei, Huang Wei and Cao Tian. The pate..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Qidong Xianhao Prec Tool Co Ltd has filed a patent application for Simulation Firearm Electronic Fire Control Method Based on Light Sensing Chip. This invention was developed by Wang Lianqiang and Lu Jinhui. The patent application number is CN202510814273 20250618. The patent publication number is CN12075..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Hangzhou Hiwetech Chemical Tech Co Ltd has applied Chinese patent for Acrylate Modified Polyurethane Resin Emulsion for Water-based Ink with Good Adhesion Performance to Plastic Substrate and Preparation Method of Acrylate Modified Polyurethane Resin Emulsion. Ying Mingyou, Xu Huajun, Song Zhipeng, Song Yuan..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Bengbu Aiyou New Mat Co Ltd has submitted a patent application for Low-temperature-resistant Organic Silicon Elastic Damping Body and Preparation Method Thereof. This invention was developed by Wang Xintao, Guo Yu, Zhu Nailu, Wu Hao, Ding Ran and Cheng Nianshou. The patent application number is CN20251112..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Debang Kunshan Mat Co Ltd has sought patent for Low-hardness High-resilience Heat-conducting Organic Silicon Gel and Preparation Method Thereof. This invention was developed by Wu Jiakai, Wang Jianbin and Jiang Guilin. The patent application number is CN202511167586 20250820. The patent publication number..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Yibin Jingyang New Material Tech Co Ltd has submitted a patent application for Bamboo Fiber Silicon Carbide Reinforced Epoxy Resin Composite Material and Preparation Method Thereof. This invention was developed by Lyu Lei, Wei Libo, He Liuyang and Chen Chuyang. The patent application number is CN202511456..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has published Lianyungang Huahai Kexin New Mat Co Ltd patent application for Mold Cleaning Material for Semiconductor Packaging Mold, Composition of Mold Cleaning Material, Preparation Method of Mold Cleaning Material and Application of Mold Cleaning Material. The ..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Airuisi Xiamen Tech Co Ltd has submitted a patent application for Contact Lens Silicon Hydrogel Material with Good Flexibility and Preparation Method Thereof. Wang Minzheng, Zheng Hongxuan, Yang Wenjie, Wang Junzhi and He Shuping developed the invention. The patent application number is CN202510986587 202..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has published Zing Semiconductor patent application for Multi-crystal-segment Auxiliary Positioning Device, Multi-crystal-segment Positioning System and Multi-crystal-segment Positioning Method. The invention was developed by Chen Ruiming, Weng Haitong and Xiao Xin..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Shandong Xinding Chemical Equipment Co Ltd has submitted a patent application for Slitting Equipment Based on Silicon Carbide Ceramic Product Production. Zhao Xiyou, An Xiaojing and Mao Fei developed the invention. The patent application number is CN20251100548 20250721. The patent publication number is C..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Kunshan Sichuang Refractory Mat Co Ltd has submitted a patent application for Pressing Device for Energy-saving Aluminum Silicon Carbide Carbon Bricks. This invention was developed by Chen Haizhu, Feng Changchun and Zhang Shijie. The patent application number is CN202511231521 20250831. The patent publica..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Shenzhen Hengyingxun Tech Co Ltd has sought patent for Substrate Ultrasonic-assisted Cutting Device. This invention was developed by Qiu Yongxuan, Huang Xianchao and Li Wei. The patent application number is CN202511230562 20250829. The patent publication number is CN120755940 (A). International Patent Cla..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has published Jiangxi Changlong Tech Co Ltd patent application for Resistor Material Cutting Device for Chip Resistor Production. The invention was developed by Jia Bixi, Tian Renzhong, Long Xiang, Li Weizhong and Jia Longtao. The patent application number is CN..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has received Nanjing Zhilingxin Tech Co Ltd, Wuxi Ruinengxin Electronic Tech Co Ltd, Nantong Ningxin Microelectronics Co Ltd and Nanning Zhiningxin Semiconductor Co Ltd patent application for Integrated Circuit Chip Clamp. Yang Quan, Liu Zhongwei, Wu Tong, He Bin a..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Dalian Dali Kaipu Tech Co Ltd has applied Chinese patent for Welding Method of Chip Ceramic Dielectric Capacitor Microstrip Product. Sun Fei, Wang Dawei, Wu Jiwei, Liang Xinyue, Song Yuhao, Zhang Yongfeng and Li Xiaoqing developed it. The patent application number is CN202511207392 20250827. The patent pu..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Taizhou Yangyin Metal Products Co Ltd has filed a patent application for Intelligent Cooling and Chip Removal Integrated Equipment for Metal Boring. This invention was developed by Yang Caifeng. The patent application number is CN202510936545 20250708. The patent publication number is CN120755387 (A). Int..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has received Jiangsu Shenzhou Semiconductor Technology patent application for Closed-loop Control Method and System for Plasma Surface Parameters. Yin Qiaoxing and Zhu Peiwen developed the invention. The patent application number is CN202510876027 20250627. The ..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has released Zhejiang Shike New Mat Co Ltd patent application for Preparation and Application of Transferable Composite Coating for Flexible Substrate. This invention was developed by Gou Yuwen and Pu Min. The patent application number is CN202510717822 20250530..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Shengyi Semiconductor Tech Wuxi Co Ltd has submitted a patent application for Semiconductor Dispensing Machine Infusion Stabilizing Device Based on Pressure Cooperative Adjustment. This invention was developed by Sun Tao and Wang Beiyi. The patent application number is CN20251110462 20250722. The patent p..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has received Beijing Iametal New Energy Co Ltd, Jiangxi Yijin New Energy Tech Co Ltd and Inner Mongolia Yijin New Energy Tech Co Ltd patent application for Rotary Furnace Device for Chemical Vapor Deposition. Xu Dixin, Du Xinwei, Zhao Yuming, Li Ge, Chen Hongxin an..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Xinju Prec Manufacturing Taizhou Co Ltd has applied Chinese patent for Ceramic Substrate Coating Equipment for Semiconductor Production. Zhu Yanjuan, Ma Lin and Qin Mingzhou developed it. The patent application number is CN202510958915 20250711. The patent publication number is CN120758846 (A). Internatio..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Yantai Daai Yiwei New Mat Co Ltd has submitted a patent application for Copper Composite Board for Heat-conducting Substrate and Preparation Method of Copper Composite Board. This invention was developed by Guo Jie. The patent application number is CN202510913480 20250703. The patent publication number is..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has released Beijing Demei Zhongmao Tech Co Ltd patent application for Str Integrated DNA Chip. This invention was developed by Xiao Lei, Yang Songzhu and Cai Lingling. The patent application number is CN20251136252 20250726. The patent publication number is CN1..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Zhuiguang Biotechnology Shenzhen Co Ltd has filed a patent application for Micro-fluidic Chip. This invention was developed by Liu Jing, Xie Hainan and Xie Wei. The patent application number is CN202510993419 20250718. The patent publication number is CN120758325 (A). International Patent Classification c..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Zhejiang GNM Tech Co Ltd has sought patent for Chip Bottom Filling Adhesive for Semiconductor Packaging and Preparation Method Thereof. This invention was developed by Zhou Gang, Shen Xiao, Guo Qipeng, Liu Sen and Lyu Benrong. The patent application number is CN202510979140 20250716. The patent publicatio..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Jiangsu Shanshui Semiconductor Tech Co Ltd has filed a patent application for Strong-corrosivity Rough Polishing Liquid Suitable for Rough Polishing of Silicon Wafer and Preparation Method of Strong-corrosivity Rough Polishing Liquid. This invention was developed by Wang Chenwei, Jiang Lijiao, Liu Fei, Li Sh..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has published Luoyang Ship Material Res Institute No. 725 Res Institute Of China State Shipbuilding Corporation Lim patent application for High-strength Organic Silicon Modified Antifouling Paint Resin, Composition and Preparation Method of High-strength Organic Si..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Shandong Zhongcheng Packaging Tech Co Ltd has filed a patent application for Ton Tank for Storing Electronic Chemicals for Semiconductors. This invention was developed by Gong Yanjun and Gong Yanhui. The patent application number is CN202511207166 20250827. The patent publication number is CN120756771 (A)..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Suzhou Guanke Ind Equipment Co Ltd has applied Chinese patent for Full-automatic Intelligent Boxing System and Method for Polycrystalline Silicon Blocks. Yang Xingguo, Chou Chien-hung and Yu Shuangjiang developed it. The patent application number is CN202511287375 20250910. The patent publication number i..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Jiangsu Fulehua Semiconductor Technology has submitted a patent application for Dpc Ceramic Substrate Double-sided Sand Blasting Equipment Capable of Recycling Sand Materials. This invention was developed by Yu Long, Wang Song, Li Yan, Wang Changshun and Cao Haiyang. The patent application number is CN202..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Anhui Microchip Changjiang Semiconductor Mat Co Ltd has filed a patent application for Centralized Supply System for Silicon Oxide Polishing Solution of Sic Substrate. This invention was developed by Zhang Lei, Zhou Zhengfei and Dong Zhiyong. The patent application number is CN202511114395 20250808. The p..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Zhejiang Fanyuan Xincai Tech Co Ltd has filed a patent application for Manufacturing Equipment of Chip Component. This invention was developed by Lyu Hang, Xu Xiaolin and Shen Yang. The patent application number is CN20251189709 20250805. The patent publication number is CN120755766 (A). International Pat..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Anhui Jingshi Tech Co Ltd has submitted a patent application for Fine Polishing Equipment for Large-size Photomask Glass Substrate. This invention was developed by Zhang Pengfei, Yan Chunli, Wang Xingbo, Gong Yupeng and Liu Yunhua. The patent application number is CN202510985749 20250717. The patent publi..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has published Tianjin Benlai Science & Tech Development Co Ltd patent application for High-precision Chip Manufacturing Method Based on Nanoimprint Technology. The invention was developed by Yu Boying. The patent application number is CN202510832432 20250620. Th..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has published Qingyuan Tech Hangzhou Co Ltd patent application for Multi-layer Composite Thermal Response Battery Diaphragm Based on Basalt Fiber Reinforced Substrate and Preparation Method of Multi-layer Composite Thermal Response Battery Diaphragm. The invention ..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has released Avic Xi'an Aircraft Industry Group Co Ltd patent application for W-band Siw Filter Chip Based on Gaas-based Thin Film Integrated Passive Technology. This invention was developed by Zhang Na, Chen Suming and Guo Quanqing. The patent application numbe..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has released Liaoning Hongtu Chuangzhan Surveying And Mapping Survey Co Ltd and Wuxi Qixin Tech Co Ltd patent application for Method for Improving Tracking Performance of GNSS Receiving Chip. This invention was developed by Ba Xiaohui, Liu Liping and Li Mingliang. ..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Hunan Beiyun Tech Co Ltd has submitted a patent application for Fault Detection Device for Baseband Signal Processing Module and Positioning Chip. This invention was developed by Zheng Bin and Xiang Wei. The patent application number is CN202510930724 20250707. The patent publication number is CN120762057..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has published Shenzhen City Meipusen Semiconductor Co Ltd patent application for Charging Voltage Control Method and System Based on Power Semiconductor. The invention was developed by He Chang, Cai Yuanfei and Zhang Guangya. The patent application number is CN2..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has released Huaxin Jushu Hangzhou Microelectronics Co Ltd patent application for Macro-cell Layout Method and Device for Integrated Circuit Design, Medium and Product. This invention was developed by Li Jingyao. The patent application number is CN202511265475 2..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Beijing Ziguang Qingteng Micro System Co Ltd has submitted a patent application for Signal Processing Method, Digital Module, Analog Module and Chip. Dong Yu, Lin Min and Huang Jinhuang developed the invention. The patent application number is CN202510835042 20250620. The patent publication number is CN12..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Coratech Co Ltd has sought patent for Organic Solid-state Semiconductor Laser and Method for Reducing Peak Width of Emission Spectrum of Organic Electroluminescent Element. This invention was developed by Auvray Morgan and Bencheikh Fatima. The patent application number is CN20248012573 20240216. The pate..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has received Sony Semiconductor Solutions Corporation patent application for Photodetector. Okubo Tomohiro, Tokata Hideaki, Kawai Nobuhiro and Ito Shinya developed the invention. The patent application number is CN20248013380 20240205. The patent publication num..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Kobelco Res & Development Co Ltd has filed a patent application for Method for Manufacturing Thin Film Transistor, Sputtering Target, and Sintered Body. This invention was developed by Ochi Mototaka. The patent application number is CN20248016909 20240312. The patent publication number is CN120753019 (A)...

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Japan Display has filed a patent application for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Watakabe Hajime, Tsubuku Masashi, Sasaki Toshinari, Hanada Akihiro, Tamaru Takaya, Mochizuki Marina and Onodera Ryo. The patent application number is CN20248014051 20..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- Hitachi has applied Chinese patent for Semiconductor Device and Manufacturing Method Thereof. Watanabe Naoki developed it. The patent application number is CN20248013928 20240329. The patent publication number is CN120753016 (A). International Patent Classification codes are H10D12/00, H10D30/01, H10D30/6..

Semiconductor

  |  Wed 11 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has released Fuji Electric patent application for Semiconductor Device. This invention was developed by Ikura Yoshihiro, Naito Tatsuya, Sasaki Masahiro, Komiyama Norihiro and Zhang Hui. The patent application number is CN20248014585 20240802. The patent publicat..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Haixing Maritime Electric Group has submitted a patent application for Light-emitting Assembly with Adjustable Light Beam Angle and Searchlight. This invention was developed by Chen Xuechen and Fu Wenlong. The patent application number is CN202511240171 20250902. The patent publication number is CN1207600..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Shengxinke Intelligent Equipment Jiangsu Co Ltd has sought patent for Floating Device for Chip Testing. This invention was developed by Tang Qiuming, Lu Xijiang, Xu Jing and Xie Dayong. The patent application number is CN20251158147 20250730. The patent publication number is CN120761823 (A). International..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Hangzhou Dianzi University has sought patent for Open Set Three-dimensional Retrieval Method Based on Three-encoder Fusion and Memory Enhancement Framework. This invention was developed by Sui Yuan, Yan Chenggang, Gao Yuhan, Sheng Xichun, Sun Yaoqi, Zhang Baochang, Yin Jun and Jin Heng. The patent applica..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Guangdong Sophon Intelligent Technology Co Ltd has submitted a patent application for Expanded Graphite Silicon Composite Negative Electrode Material, Negative Electrode and Lithium Ion Battery. This invention was developed by Gao Xiaoyun, Pan Dongqing, Wang Xiangtao and Zhang Xin. The patent application ..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Shanghai Yunshen New Energy Tech Co Ltd has sought patent for Titanium-loaded Silicon Nanosheet/poly-3, 4-ethylenedioxythiophene as Well as Preparation Method and Application of Titanium-loaded Silicon Nanosheet/poly-3, 4-ethylenedioxythiophene. This invention was developed by Zhang Dengke, Zhang Huaqin, Zha..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has published Beijing Iametal New Energy Co Ltd and Jiangxi Yijin New Energy Tech Co Ltd patent application for Preparation Method of Vapor Deposition Silicon Carbon Material Based on Supercritical Carrier Gas. The invention was developed by Xu Dixin, Li Ge, Zhao Y..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Xintianweng Semiconductor Hangzhou Co Ltd has applied Chinese patent for Photovoltaic Bypass Chip. Zhang Yongliang, Chen Minhua and Tian Zhentao developed it. The patent application number is CN202510680081 20250526. The patent publication number is CN120767268 (A). International Patent Classification cod..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- 3peak Incorporated has sought patent for Manufacturing Method of Semiconductor Device and Semiconductor Device Structure. This invention was developed by Ma Xiaobo. The patent application number is CN202510947602 20250709. The patent publication number is CN120767254 (A). International Patent Classificati..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation has submitted a patent application for Deep Trench Isolation Structure and Manufacturing Method Thereof. This invention was developed by Wang Junjie. The patent application number is CN202510818448 20250618. The patent publication number is CN..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Suzhou Xixing Semiconductor Tech Co Ltd has submitted a patent application for Wafer Stage and Wafer Transfer Device. Chen Zhaoyun, Li Gaofei, Zhang Jin, Jin Yujie, Chen Chang, Chen Junru, Wu Dong, Wang Jing and Tao Dashuai developed the invention. The patent application number is CN202511185019 20250822...

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Beijing Semiconductor Special Equipment Res Institute 45th Res Institute China Elec has applied Chinese patent for Rotary Lifting Swing Arm Device and Single Wafer Processing Equipment. Chen Suwei, Mi Xue, An Wenpeng and Wang Liang developed it. The patent application number is CN202510941192 20250709. Th..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Nantong Huayue Semiconductor Tech Co Ltd has applied Chinese patent for Single-chip Semiconductor Rapid Annealing System. Yao Shangbing developed it. The patent application number is CN202511242253 20250902. The patent publication number is CN120767226 (A). International Patent Classification codes are H0..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Xinruidi Shanghai Tech Co Ltd has applied Chinese patent for Substrate Sensor Capable of Rapidly Switching Recipe and Automatically Capturing Position, and Online Diagnosis System and Method. Gu Zhen developed it. The patent application number is CN202510984298 20250717. The patent publication number is C..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has published Yixing Wangzhe Laminating Film Co Ltd patent application for Device and Method for Taking Down Wafer from Cutting Adhesive Tape. The invention was developed by Bu Zhen and Wang Junlin. The patent application number is CN202510932013 20250707. The p..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Shanghai Huahong Grace Semiconductor Manufacturing Corporation has submitted a patent application for Semiconductor Heat Treatment Equipment Calibration Method. This invention was developed by Zhang Zhihao, Yao Lei and Guo Ziming. The patent application number is CN202510856128 20250624. The patent public..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Huizhou Geruite Ind Co Ltd has sought patent for Automatic Cleaning and Detecting Integrated Device for Silicon Wafer Box. This invention was developed by Ge Jianyuan. The patent application number is CN202510723721 20250531. The patent publication number is CN120767216 (A). International Patent Classific..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Shenzhen Paisidi Power Semiconductor Co Ltd has applied Chinese patent for Chip Packaging Process Monitoring Method and System. Zhang Jianzhe and Huang Xiaoting developed it. The patent application number is CN202510626145 20250515. The patent publication number is CN120767214 (A). International Patent Cl..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Nanjing Yunjixin Semiconductor Tech Co Ltd has submitted a patent application for Method for Manufacturing Novel Circuit Cover Plate Hole in Ceramic Substrate. Sun Yang developed the invention. The patent application number is CN202511270663 20250908. The patent publication number is CN120767207 (A). Inte..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Nantong Shennan Circuits Company Ltd has sought patent for Package Substrate and Preparation Method Thereof. This invention was developed by Tang Changsheng, Qi Yaorong and Zhao Yitao. The patent application number is CN202510660209 20250521. The patent publication number is CN120767204 (A). International..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Beijing Normal University has sought patent for AI Long-time Memory System and Method for Psychological Consultation Scene. This invention was developed by Cao Lei, Ye Yishan, Qiao Zhihong, Li Qi, Zong Yi, Han Xu, Dong Lin, Li Yingxian, Zhu Ziyan, Liu Yifan and Qiu Zhaofeng. The patent application number ..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Haiguang Information Technology has submitted a patent application for Method of Handling Failure of Memory, Memory Controller and Memory System. This invention was developed by Fan Minmin and Xie Fei. The patent application number is CN202510873074 20250626. The patent publication number is CN120766743 (..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Jiangsu Heyi Guangxian Tech Co Ltd has submitted a patent application for Electroluminescence Characteristic Rapid Detection Equipment for OLED (organic Light Emitting Diode) Screen. Li Dean and Fu Zhenhua developed the invention. The patent application number is CN20251166008 20250731. The patent publica..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has received Beijing Weili Photoelectric Tech Co Ltd patent application for Thin Film Lithium Niobate Chip for Hybrid Integrated Laser Doppler Velocimeter. Li Yanqiang developed the invention. The patent application number is CN202510988535 20250717. The patent ..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has published Dingdao Zhixin (Shanghai) Semiconductor patent application for Image Processing Method and Device. The invention was developed by Fang Feifei. The patent application number is CN202510901847 20250630. The patent publication number is CN120765503 (A..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has received Shenzhen Shengyuan Semiconductors Co Ltd patent application for Tool Clamp for Semiconductor Packaging Test. Jia Runjie and Chen Libin developed the invention. The patent application number is CN202511179458 20250822. The patent publication number i..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Xianzhike Semiconductor Tech Dongguan Co Ltd has filed a patent application for Accurate-positioning Reciprocating Rapid Wafer-taking and Wafer-fixing Device for Semiconductor Device and Wafer-fixing Process Thereof. This invention was developed by Chai Li. The patent application number is CN202510977763 ..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Shenzhen Zhisai Prec Equipment Co Ltd has submitted a patent application for Wafer Back Contact Type Positioning and Clamping Fixing Device and Wafer Bonding Method. Zheng Yanggao and Lou Zhengjun developed the invention. The patent application number is CN202510936476 20250708. The patent publication num..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Laplace Xi'an Technology has filed a patent application for Feeding and Discharging Equipment and Process Production Line. This invention was developed by Liu Junqing, Dong Xuedi and Lin Jiaji. The patent application number is CN202510907295 20250630. The patent publication number is CN120767233 (A). Inte..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has published Chongqing Liansansheng Photoelectric Tech Co Ltd patent application for Production and Test Device and Method of to Packaging Chip. The invention was developed by Yuan Youping, Yang Fan, Xiang Jie, Liu Bin and He Tao. The patent application number ..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Jiangsu Xingan Tech Co Ltd has submitted a patent application for Etching Process Development Method, Etching Process and Semiconductor Product. This invention was developed by Luo Xing, Li Wei, Deng Chunfeng, Zhang Feng, Wang Jia and Wang Yu. The patent application number is CN202511276786 20250908. The ..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has released Beijing Integrated Circuit Equipment Innovation Center Co Ltd patent application for Deep Silicon Etching Method and Semiconductor Process Equipment. This invention was developed by Ge Pengfei and Sang Aishu. The patent application number is CN20251..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Beijing Integrated Circuit Equipment Innovation Center Co Ltd has submitted a patent application for Etching Method of Doped Polycrystalline Silicon, Semiconductor Device, Forming Method of Semiconductor Device and Semiconductor Process Equipment. Wang Yajie, Yang Haichao, Li Hongzhi and Zhong Tao developed ..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has released Shengjisheng Semiconductor Tech Wuxi Co Ltd patent application for Process Method for Protecting Silicon Carbide Plate. This invention was developed by Gao Lei, Chan Ming, Qian Di and Luo Jingfang. The patent application number is CN202510355092 202..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Beijing Integrated Circuit Equipment Innovation Center Co Ltd has filed a patent application for Photoetching Reworking Method and Semiconductor Process Equipment. This invention was developed by Zhu Zidi, Luo Yongjian, Zhu Wenming and Qi Li. The patent application number is CN202510839025 20250620. The p..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has published Beijing Integrated Circuit Equipment Innovation Center Co Ltd patent application for Etching Method and Semiconductor Process Equipment. The invention was developed by Wu Zhigang. The patent application number is CN202510829009 20250619. The patent..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Beijing Integrated Circuit Equipment Innovation Center Co Ltd has sought patent for Germanium-silicon Epitaxial Growth Method of Silicon-oxygen-carbon-nitrogen Side Wall and Semiconductor Device. This invention was developed by Xu Nanjuan and Sun Wei. The patent application number is CN202510772621 202506..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has published Yangzhou Delijia Power Transf Co Ltd patent application for Protective Safety Type Silicon Steel Sheet Oil-immersed Transformer. The invention was developed by Qian Lei, Huang Yinjie and Wang-zhang Gengchen. The patent application number is CN20251..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has received Suzhou Juzhen Photoelectric Co Ltd patent application for 3D Hall Chip and Array Chip. Zhu Xin developed the invention. The patent application number is CN202511253770 20250903. The patent publication number is CN120761932 (A). International Patent ..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has released Chengdu Gaotou Xinwei Semiconductor Co Ltd patent application for IGBT Tube Electric Leakage Detection Method and Device, Medium and Equipment. This invention was developed by Hu Aoxue, Feng Minghui, Fu Jie and Meng Fanxin. The patent application nu..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- State Intellectual Property Office of China has published China Electric Power Research Institute and State Grid Corporation of China patent application for System and Method for Monitoring Leakage Current of Power Distribution Cabinet in Real Time Based on Magnetoelectric Coupling Chip. The invention was de..

Semiconductor

  |  Tue 10 Mar 2026

Beijing, March 11 -- Shenzhen Yunbao Intelligent Co Ltd has submitted a patent application for Method for Adjusting Timeout Time Range of Root Complex, Network Chip and Electronic Equipment. This invention was developed by Liu Jingtao, Chen Anqing and Shao Wanxing. The patent application number is CN202510855780 20250624. The..
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