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Semiconductor
| Fri 23 Jan 2026
Munich, Jan. 23 -- European Patent Office has published Bigrep GmbH patent application for Filament Buffer. The invention was developed by Zimmermann Martin.
The patent application number is EP20250723422 20250508. The patent publication number is EP4676716 (A1). International Patent Classification codes are B29C64/118, B29C6..
Semiconductor
| Fri 23 Jan 2026
Munich, Jan. 23 -- European Patent Office has released Hid Textile Services Sarl patent application for RFID Sorting System. This invention was developed by Moutot Christophe.
The patent application number is EP20240315340 20240711. The patent publication number is EP4679320 (A1). International Patent Classification codes are..
Semiconductor
| Fri 23 Jan 2026
Munich, Jan. 23 -- University Waseda has applied European patent for Analysis Chip, Analysis Method for Specimen, and Analysis System for Specimen. Ito Etsuro developed it.
The patent application number is EP20240766809 20240215. The patent publication number is EP4679091 (A1). International Patent Classification code is G01N..
Semiconductor
| Mon 26 Jan 2026
Alexandria, Jan. 26 -- Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group have submitted a patent application for Touch Substrate and Display Apparatus. Wang Siyu, Wang Wei, Wang Yu, Chen Tianci and Liu Jianghua developed the invention.
The patent application number is US202418996575 20240313. The patent publica..
Semiconductor
| Mon 26 Jan 2026
Alexandria, Jan. 26 -- Pan Yang and Inspiring Atoms Pte Ltd have submitted a patent application for Autonomous Process Recipe Generation for Semiconductor Process Systems Through Reinforcement Learning with Minimized Recipe Time. This invention was developed by Pan Yang.
The patent application number is US202418778961 2024072..
Semiconductor
| Mon 26 Jan 2026
Alexandria, Jan. 26 -- Pan Yang and Inspiring Atoms Pte Ltd have sought patent for AI-driven Control Module for Real-time Process Optimization in Semiconductor Process Systems. This invention was developed by Pan Yang.
The patent application number is US202418775892 20240717. The patent publication number is US20260023331 (A1..
Semiconductor
| Mon 26 Jan 2026
Alexandria, Jan. 26 -- Beijing BOE Display Tech Co Ltd and BOE Technology Group have applied United States patent for Array Substrate and Display Apparatus. Wang Xiao, Yan Yan, Ma Yu, Chen Weitao and Zhang Jiliang developed it.
The patent application number is US202519339042 20250924. The patent publication number is US20260..
Semiconductor
| Mon 26 Jan 2026
Munich, Jan. 26 -- BBOE Technology Group Co Ltd and Beijing BOE Technology Development have sought patent for Display Substrate and Driving Method Therefor, and Display Device. This invention was developed by Yang Mingkun, Huangfu Lujiang, Hao Xueguang and Liu Lang.
The patent application number is EP20230958492 20231113. The..
Semiconductor
| Mon 26 Jan 2026
Beijing, Jan. 26 -- Foshan Sanshui Foshui Water Supply Co Ltd and South China Normal University have submitted a patent application for Zr-PyDC-Au-Ag/GNS Composite SERS (surface Enhanced Raman Scattering) Substrate as Well as Construction Method and Application Thereof. This invention was developed by Xu Zebin, Lin Libin, Liang ..
Semiconductor
| Mon 26 Jan 2026
Munich, Jan. 26 -- Univ Chung Shan Medical and National Chung Hsing University have applied European patent for Electrochemistry Detection Chip. Lee Maw-sheng, Wu Ching-chou, Yang Ping-feng, Lee Chia-en, Cheng En-hui, Lin Yi-ping, Tsai Han-ni, Lee Tsung-hsien and Lee Chun-i developed it.
The patent application number is EP202..
Semiconductor
| Mon 26 Jan 2026
Munich, Jan. 26 -- Mitsubishi Electric R&D Ct Europe BV and Mitsubishi Electric have submitted a patent application for Device for Estimating Junction Temperature of a Power Semiconductor and Associated Method for Monitoring Such Junction Temperature. This invention was developed by Quemener Vincent and Degrenne Nicolas.
The ..
Semiconductor
| Mon 26 Jan 2026
Alexandria, Jan. 26 -- Samsung Display Co Ltd and ULVAC have sought patent for Alignment Apparatus, Substrate Processing Apparatus Including the Same, and Electronic Apparatus. This invention was developed by Chung Kyunghoon, Nishiguchi Masao, Shimizu Shuji, Wakamatsu Hironori, Iwase Daisuke, Koizumi Kazuhiko, Lee Jungseob, Jeon..
Semiconductor
| Sat 24 Jan 2026
London, Jan. 24 -- BOE Technology Group Co Ltd and Chengdu BOE Optoelectronics Technology have submitted a patent application for Display Substrate and Display Device. Mengqi Wang, Ziyang Yu, Zhiliang Jiang, Ming Hu and Fei Chen developed the invention.
The patent application number is GB20250014995 20240219. The patent publi..
Semiconductor
| Sat 24 Jan 2026
London, Jan. 24 -- BOE Technology Group Co Ltd and Beijing BOE Display Tech Co have sought patent for Display Substrate and Display Device. This invention was developed by Jintang Hu, Gang Hua, Junsheng Chen, Liguang Deng, Dong Wang, Shaobo Li, Min Wang, Liangliang Pan, Jinghao Liu, Xinyu Chen, Jiahao Bai and Xinrui Yu.
The p..
Semiconductor
| Sat 24 Jan 2026
London, Jan. 24 -- BOE Technology Group Co Ltd and Chengdu BOE Optoelectronics Technology have filed a patent application for Display Substrate and Manufacturing Method Therefor, and Display Device. This invention was developed by Yuxiao Li, Fei Fang, Ling Shi, Yu Wu, Haoyu Li and Changchang Liu.
The patent application number..
Semiconductor
| Sun 25 Jan 2026
Beijing, Jan. 26 -- Research & Development Institute of Northwestern Polytechnical University in Shenzhen and Northwestern Polytechnical University have sought patent for Preparation Method and Application of Three-dimensional Star-shaped Polyhedral Polymer Bulk Phase Modified Efficient and Stable Perovskite Solar Cell. This inv..
Semiconductor
| Sun 25 Jan 2026
Beijing, Jan. 26 -- Huahong Semiconductor, Wuxi and Shanghai Huahong Grace Semiconductor Manufacturing Corporation have submitted a patent application for Shield Gate Trench Structure Manufacturing Method for Improving Polycrystalline Silicon Residue. Zhao Xindong, Zhang Lei, Huang Hao, Wang Wenqiang, Pan Jia and Yang Jiye devel..
Semiconductor
| Sun 25 Jan 2026
Beijing, Jan. 26 --Huahong Semiconductor, Wuxi and Huahong Semiconductor Mfg Wuxi Co Ltd have submitted a patent application for Peripheral Terminal Structure of Shield Gate Groove Type MOS (metal Oxide Semiconductor) Device. This invention was developed by Cheng Guang, Wang Li, Qiu Lijun, Wei Leping, Liu Xiuyong and Wang Peng.
..
Semiconductor
| Sun 25 Jan 2026
Munich, Jan. 26 -- Sony Semiconductor Solutions Corp and Sony Europe BV have filed a patent application for Circuit Chip and Solid-state Imaging Device. This invention was developed by An Jae-sung and Kawazu Naoki.
The patent application number is EP20240707866 20240304. The patent publication number is EP4681442 (A1). Intern..
Semiconductor
| Sun 25 Jan 2026
Beijing, Jan. 26 -- Weihai Newbeiyang Zhengqi Robot Co Ltd and Shandong New Beiyang Information Technology have submitted a patent application for Industrial Image Sensor Correction Method and Industrial Image Scanning Device. Wang Chuntao, Zhao Qiangqiang, Yang Haolin, Wang Xiujing and Liu Bingqing developed the invention.
T..
Semiconductor
| Sun 25 Jan 2026
Beijing, Jan. 26 -- Beijing Xinchangcheng Tech Development Co Ltd and Xinchangcheng Shanghai Tech Co Ltd have applied Chinese patent for Method for Preventing Illegal Calling of Security Chip. Fan Xiaojie, Kong Lingqi, Liu Peng and Luo Yanjing developed it.
The patent application number is CN202510638816 20250519. The patent ..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- STMicroelectronics Crolles 2 SAS and STMicroelectronics Grenoble 2 have been granted a patent for Digital to Analog Converter. This invention was developed by Mandier Christophe and Vignetti Matteo Maria.
The patent application number is US202318390907 20231220. The patent publication number is US125315..
Semiconductor
| Sat 24 Jan 2026
Beijing, Jan. 24 -- BOE Technology Group, Chengdu BOE Optoelectronics Technology and Beijing BOE Technology Development have submitted a patent application for Pixel Driving Circuit, Driving Method Thereof and Array Substrate. This invention was developed by Gao Yagui, Youn Sang-cheon, Song Erlong, Yuan Xuebin and Ning Linglin.
..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group have obtained a patent for display substrate and manufacturing method thereof, display module, and display apparatus. This invention was developed by Wang Wei, Yang Ming and Zhou Weifeng.
The patent application number is US202117795572 202..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- Western Digital Tech Inc and SanDisk Technology have received a patent for Non-volatile Memory with Multiple Data Resolutions. This invention was developed by Prakash Abhijith, Yuan Jiahui and Yang Xiang.
The patent application number is US202318361839 20230729. The patent publication number is US125311..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- TTaiwan Semiconductor Mfg Company Ltd and National Taiwan University have secured a patent on Sram Cell with Write-assist Transistors. Lin Hsin-cheng, Chou Tao, Chiu Kuan-ying and Liu Chee-wee developed the invention.
The patent application number is US202318240709 20230831. The patent publication numbe..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- Hefei BOE Joint Tech Co Ltd and BOE Technology Group have been granted a patent for Display Substrate Having Pixel Circuits with Mirror-symmetrical Orthographic Projections. This invention was developed by Li Yongqian, Yuan Can and Wu Zhongyuan.
The patent application number is US202418918667 20241017. ..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- Taiwan Semiconductor Mfg Company Ltd and Taiwan Semiconductor Manufacturing have secured a patent on Method of Performing Inter-site Backup Processing of Wafer Lots. Lin Mei-hsuan, Fan Rong Syuan and Chang Jen-yuan developed the invention.
The patent application number is US202217855075 20220630. The pa..
Semiconductor
| Fri 23 Jan 2026
Alexandria, Jan. 24 -- Beijing BOE Tech Development Co Ltd and BOE Technology Group have been granted a patent for Methods for Forming Via Hole and Filling Via Hole in Flexible Substrate. Zhang Shuo, Liang Kui, Sun Tuo and Zhou Chao developed the invention.
The patent application number is US202117921254 20211126. The patent ..
Semiconductor
| Fri 23 Jan 2026
Alexandria, Jan. 24 -- Kla Corp and Kla Coporation have been awarded a patent for Measurements of Semiconductor Structures Based on Spectral Differences at Different Process Steps. This invention was developed by Di Ming, Zhao Qiang, Zhang Tianhao, Hu Dawei, Chang Yih and Chen Xi.
The patent application number is US2023182105..
Semiconductor
| Fri 23 Jan 2026
Alexandria, Jan. 24 -- Yunnan Invensight Optoelectronics Tech Co Ltd and BOE Technology Group have been granted a patent for Array Substrate and Display Apparatus. Yang Zongshun, Zhang Dacheng, Huang Kuanta, Tao Xiong, He Yunchuan and Yang Chao developed the invention.
The patent application number is US202218004893 20220114...
Semiconductor
| Fri 23 Jan 2026
Alexandria, Jan. 24 -- Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group have been awarded a patent for Display Substrate and Display Device. This invention was developed by Liu Cong, Huang Yao, Wang Binyan, Wang Yu and Wang Benlian.
The patent application number is US202117796647 20210930. The patent publicati..
Semiconductor
| Fri 23 Jan 2026
Alexandria, Jan. 24 -- CChengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group have secured a patent on Display Substrate and Display Apparatus. Chu Zhiwen, Zhang Bo, Qu Yi, Wang Xinxin and Feng Aoyuan developed the invention.
The patent application number is US202218015541 20220225. The patent publication number is..
Semiconductor
| Fri 23 Jan 2026
Alexandria, Jan. 24 -- Shanghai Huali Microelectronics Corp and Shanghai Huali Integrated Circuit Corporation have been awarded a patent for Method for Manufacturing Gate of NAND Flash. This invention was developed by Xu Pengkai and Qiao Fulong.
The patent application number is US202318152870 20230111. The patent publication ..
Semiconductor
| Fri 23 Jan 2026
Alexandria, Jan. 24 -- SanDisk Tech LLC and SanDisk Technology have obtained a patent for memory device with through-stack contact via structures which contact plural stacks and method of making the same. This invention was developed by Ogawa Hiroyuki and Tsutsumi Masanori.
The patent application number is US202318455079 2023..
Semiconductor
| Fri 23 Jan 2026
Alexandria, Jan. 24 -- SanDisk Tech LLC and SanDisk Technology have received a patent for Three-dimensional Memory Device Containing Isolation Structures and Methods for Forming the Same. This invention was developed by Iwai Takaaki, Komeda Kazushi and Chen Zhen.
The patent application number is US202318347838 20230706. The p..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Zhejiang Zhongke Shanghong ION Equipment Engineering and Zhejiang Aibi Semiconductor Equipment Co Ltd have applied Chinese patent for Blanking Device and Method for Wafer Processing. Gong Zaisheng developed it.
The patent application number is CN202510790818 20250613. The patent publication number is CN120..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Huahong Semiconductor, Wuxi and Huahong Semiconductor Mfg Wuxi Co Ltd have sought patent for Method for Improving Back Sealing Defect of Substrate. This invention was developed by Cao Zhiwei, Zhang Zhao and Gao Chao.
The patent application number is CN202510295150 20250312. The patent publication number is..
Semiconductor
| Sat 24 Jan 2026
Beijing, Jan. 24 -- Shanghai Techson Micro Nano Tech Co Ltd and Shanghai Techsun Photoelectric Tech Co Ltd have filed a patent application for Anti-counterfeiting Method and System Based on RFID Chip. This invention was developed by Cen Wei, Qu Yinglei, Xu-lin Yihui, Hu Songyan, Liu Chunyan, Wang Jun and Zhou Lixiong.
The pat..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- CMC Mat Inc and CMC Materials have been awarded a patent for Composition and Method for Silicon Oxide and Carbon Doped Silicon Oxide CMP. This invention was developed by Kraft Steven, Hung Low Fernando, Pallikkara Kuttiatoor Sudeep, Brosnan Sarah, Reiss Brian and Naik Sajo.
The patent application number..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- Kingtek Electronics Tech Corp and Kingtek Elec Tech Co Ltd have been granted a patent for Pre-jig Wafer Carrier Disc Installation/uninstallation Device and Method Thereof. Sung Mao-yen developed the invention.
The patent application number is US202217812187 20220713. The patent publication number is US1..
Semiconductor
| Sun 25 Jan 2026
Munich, Jan. 26 -- Signify Holding has applied European patent for Clustering Set of LEDs to Enhance Color Uniformity. Ansems Johannes Petrus Maria developed it.
The patent application number is EP20240709426 20240311. The patent publication number is EP4680889 (A1). International Patent Classification code is F21S2/00. Coope..
Semiconductor
| Sun 25 Jan 2026
Munich, Jan. 26 -- Endress+Hauser has filed a patent application for Measurement Device for Determining Dielectric Constant and Conductivity. This invention was developed by Blödt Thomas, Klöfer Peter and Szymanski Sylwester.
The patent application number is EP20240706066 20240216. The patent publication number is EP4680949..
Semiconductor
| Sun 25 Jan 2026
Munich, Jan. 26 -- European Patent Office has received Signify Holding patent application for Light Emitting Device. Van Bommel Ties and Hikmet Rifat Ata Mustafa developed the invention.
The patent application number is EP20240708514 20240307. The patent publication number is EP4680891 (A1). International Patent Classificatio..
Semiconductor
| Sun 25 Jan 2026
Munich, Jan. 26 -- European Patent Office has received Yangtze Memory Technologies patent application for Memory Devices, Memory Controllers, Memory Systems, and Operation Methods Thereof. Guo Lu and Cheng Boxuan developed the invention.
The patent application number is EP20240733510 20240529. The patent publication number is..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- U.S. Patent and Trademark Office has awarded a patent to Yangtze Memory Technologies for Memory Device, Memory System, and Method of Operating the Same. Zhou Teng developed the invention.
The patent application number is US202418615660 20240325. The patent publication number is US12530131 (B2). Internat..
Semiconductor
| Sat 24 Jan 2026
London, Jan. 24 -- UK Patent Office has published BOE Technology Group Co Ltd and Chengdu BOE Optoelectronics Technology patent application for Display Substrate and Display Apparatus. The invention was developed by Shuo Li and Bin Liu.
The patent application number is GB20250013803 20240514. The patent publication number is ..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- Stmicroelectronics Alps SAS has been granted a patent for Electronic Device with Voltage Linear Regulator and Method of Operating Thereof. Pons Alexandre developed the invention.
The patent application number is US202318461950 20230906. The patent publication number is US12531466 (B2). International Pat..
Semiconductor
| Fri 23 Jan 2026
Alexandria, Jan. 24 -- U.S. Patent and Trademark Office has awarded a patent to TDK for Magnetic Memory. Sasaki Tomoyuki, Shiokawa Yohei and Tsumita Atsushi developed the invention.
The patent application number is US202318103818 20230131. The patent publication number is US12532669 (B2). International Patent Classification c..
Semiconductor
| Fri 23 Jan 2026
Alexandria, Jan. 24 -- Hua Yang Prec Machinery Co Ltd has secured a patent on Method of Reducing Splicing Spacing of OLED Display Panel Splicing Unit. Chen Yu-jen developed the invention.
The patent application number is US202318336668 20230616. The patent publication number is US12532653 (B2). International Patent Classifica..
Semiconductor
| Fri 23 Jan 2026
Alexandria, Jan. 24 -- U.S. Patent and Trademark Office has awarded a patent to Hefei Xinsheng Optoelectronics Tech Co Ltd and BOE Technology Group for Display Substrate and Display Apparatus. Liu Ning developed the invention.
The patent application number is US202218040771 20220429. The patent publication number is US1253264..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- Kyungpook National University Industry Academic Cooperation Foundation has received a patent for Method of Designing Ternary Logic Circuit Using MOSFETs Having Depletion-mode and Multi-VTHs, and Device and Recording Medium for Performing the Same. This invention was developed by Song Taigon and Lee Hyundon..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- U.S. Patent and Trademark Office has awarded a patent to Hoya Lens Thailand Ltd and The Hong Kong Polytechnic University for Spectacle Lens, Design Method for the Same, and Design System for the Same. Qi Hua, To Chi Ho and Lam Siu Yin developed the invention.
The patent application number is US202118014..
Semiconductor
| Sat 24 Jan 2026
London, Jan. 24 -- Trend Tool Tech Ltd has filed a patent application for Devices and Methods for Forming a Recess in a Substrate. This invention was developed by Andrew Anthony Ryan Trainer and Jemimah Grace Minnigin.
The patent application number is GB20240009313 20240627. The patent publication number is GB2642259 (A). Int..
Semiconductor
| Sat 24 Jan 2026
London, Jan. 24 -- Trend Tool Tech Ltd has applied UK patent for Device and Methods for Forming a Recess in a Substrate. Andrew Anthony Ryan Trainer and Jemimah Grace Minnigin developed it.
The patent application number is GB20240009309 20240627. The patent publication number is GB2642257 (A). International Patent Classificat..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Anhui Lianxiao Tech Co Ltd has sought patent for Monocrystalline Silicon Furnace Top Element Power Supply Structure. This invention was developed by Lee Seung-je and Shao Hongchen.
The patent application number is CN202510383800 20250328. The patent publication number is CN120301104 (A). International Pate..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- State Intellectual Property Office of China has received Xiamen Yinke Qirui Semiconductor Tech Co Ltd patent application for High-power 808nm Semiconductor Laser Epitaxial Structure and Manufacturing Method Thereof. Zhang Yinqiao and Wang Jianhong developed the invention.
The patent application number is C..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Wuhan Eternal Tech Co Ltd has filed a patent application for Coupling Packaging Equipment. This invention was developed by Shan Na and Yan Liming.
The patent application number is CN202510424301 20250407. The patent publication number is CN120300594 (A). International Patent Classification codes are H01S5/..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Global Unichip; Taiwan Semiconductor Manufacturing has sought patent for Semiconductor Packaging Device and Semiconductor Wiring Board Thereof. This invention was developed by Wang Weiqiao, Yang Shengfan, Hong Zhiqiang, Lin Yuanhong, Lin Yizeng and Dong Haoyu.
The patent application number is CN20241030674..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Anji Xinrui Tech Co Ltd has applied Chinese patent for High-performance Processor Chip Packaging Structure and Packaging Method. Fang Jiafan, Gao Bo, Qian Jiankang, Li Qiang and Liu Chang developed it.
The patent application number is CN202510435738 20250409. The patent publication number is CN120300076 (A..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- State Intellectual Property Office of China has received Chengdu Qiansheng Tech Co Ltd patent application for Preparation Method of Semiconductor Device. Wang Tao and Niu Haobo developed the invention.
The patent application number is CN202510411754 20250402. The patent publication number is CN120300064 (A..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Anhui Chaoyuan Semiconductor Co Ltd has filed a patent application for Wafer Grabbing and Clamping Device for Wafer Cp Test. This invention was developed by Qiao Ruyu, Li Youzhi, Jiang Lu and Tang Zhimin.
The patent application number is CN202510451740 20250411. The patent publication number is CN120300060..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Suzhou Yufangyuan Intelligent Tech Co Ltd has submitted a patent application for Chip Feeding Equipment for Chip Testing. Yang Yeyao, Wang Silu, Wei Wei, Wu Di and Xie Jincun developed the invention.
The patent application number is CN202510453456 20250411. The patent publication number is CN120300041 (A)...
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Memsic Semiconductor Shaoxing Co Ltd has submitted a patent application for Metal Flower Basket for Storing Silicon Wafers. This invention was developed by Chen Qi, Gu Wenbin, Ren Pingyuan, Men Yuanshuai and Zhao Weidong.
The patent application number is CN202510548138 20250428. The patent publication numb..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Weishi Advanced Intelligent Tech Suzhou Co Ltd has sought patent for Nitrogen Control System and Method for Semiconductor Wafer Nitrogen Stock. This invention was developed by Liu Ming, Yu Yongchao and Zhou Zhiyuan.
The patent application number is CN202510185106 20250219. The patent publication number is ..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- State Intellectual Property Office of China has received Zhangjiagang Integrated Circuit Ind Development Co Ltd patent application for Chip Mounting Jig for Packaging Integrated Circuit. Guo Hongyi and Luo Jiubin developed the invention.
The patent application number is CN202510778563 20250611. The patent ..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Meike Ceramic Tech Co Ltd has filed a patent application for Base for High-temperature Semiconductor Process. This invention was developed by Zhao Meina and Lee Sang Yup.
The patent application number is CN20251021337 20250107. The patent publication number is CN120300021 (A). International Patent Classifi..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Zhengzhou Xinghang Tech Co Ltd has submitted a patent application for Fow Process Anti-wire-collapse and Anti-glue-overflow Lead Bonding Method and Chip Product. This invention was developed by Zhao Jialei, Hong Won-gon, Ryu Ho-woo and Fu Yu.
The patent application number is CN202510433090 20250408. The pa..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- State Intellectual Property Office of China has published Shenzhen Hemei Jingyi Semiconductor Tech Co Ltd patent application for Copper Wire Bonding Method for Packaging Substrate and Packaging Substrate. The invention was developed by He Fuquan.
The patent application number is CN202510772884 20250611. Th..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Jiangsu Xingan Tech Co Ltd has filed a patent application for Pre-packaging Method of Power Chip, Chip and Electronic Equipment. This invention was developed by Zhao Zihao, Li Daohui and Wang Zhe.
The patent application number is CN202510475204 20250416. The patent publication number is CN120300011 (A). In..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Huatian Tech Jiangsu Co Ltd has submitted a patent application for Chip Packaging Structure Capable of Improving Heat Dissipation Capability and Improving Warpage and Preparation Method. This invention was developed by Chen Zhihua, Shi Yuting and Ma Shuying.
The patent application number is CN202510454210 ..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Huatian Tech Jiangsu Co Ltd has sought patent for Metal Interconnection Structure and Method Suitable for High-density Fan-out Packaging. This invention was developed by Fu Dongzhi and Ma Shuying.
The patent application number is CN202510454215 20250411. The patent publication number is CN120300001 (A). In..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- State Intellectual Property Office of China has released Zhuhai Yuexin Semiconductor Co Ltd patent application for Package Substrate with Groove and Manufacturing Method Thereof. This invention was developed by Chen Xianming, Zeng Yingshan and Huang Benxia.
The patent application number is CN202510294121 2..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Beijing Zhongboxin Semiconductor Tech Co Ltd has submitted a patent application for Preparation Method of P-type GaN Film and P-type GaN Film. This invention was developed by Chen Zhenghao, Yang Xuelin, Zhang Lisheng, Shen Bo and Lu Guojun.
The patent application number is CN202510253785 20250305. The pate..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- State Intellectual Property Office of China has released Mitsuboshi Diamond Ind Co Ltd patent application for Method for Breaking Substrate with Metal Film. This invention was developed by Murakami Kenji.
The patent application number is CN202510452319 20181016. The patent publication number is CN120299991..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Henan Tianjian Diamond Ind Co Ltd has submitted a patent application for Method for Growing Single Crystal Diamond from Silicon Wafer. Sung Chien-min, Zhang Hongtao, Tong Yi, Fu Yihao and Li Xiaotong developed the invention.
The patent application number is CN202510450576 20250411. The patent publication n..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- State Intellectual Property Office of China has published Huahong Semiconductor, Wuxi and Huahong Semiconductor Mfg Wuxi Co Ltd patent application for Method for Improving Back Sealing Defect of Substrate. The invention was developed by Cao Zhiwei, Zhang Zhao and Gao Chao.
The patent application number is ..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- RDA Microelectronics Beijing Co Ltd has been awarded a patent for Communication Chip. This invention was developed by Tian Zhen, Wong Ka Man, Tian Hongyu, Li Yong, Wang Xianjin, Cui Yujiao and Zhou Guoli.
The patent application number is US202118041388 20210730. The patent publication number is US125315..
Semiconductor
| Sat 24 Jan 2026
Beijing, Jan. 24 -- Central South University has submitted a patent application for Nonlinear Constraint Coupling Driven Implicit Modeling Optimization Method and System and Memory. This invention was developed by Huang Juexuan, Deng Hao, Mao Xiancheng, Zheng Yang, Chen Jin and Liu Zhankun.
The patent application number is CN..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- NXP USA has been granted a patent for Elastic Buffers. Dasgupta Arindam, Sahoo Ranjan Kumar and Shirwal Anand developed the invention.
The patent application number is US202318301108 20230414. The patent publication number is US12530307 (B2). International Patent Classification codes are G06F1/10, G06F1..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- U.S. Patent and Trademark Office has awarded a patent to Western Digital Tech Inc and Sandisk Technology for Memory Die with On-chip Binary Vector Database Search. Sprouse Steven T, Li Yan and Tsai Frank W developed the invention.
The patent application number is US202318526821 20231201. The patent publ..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- Lawrence Semiconductor Res Laboratory Inc has been awarded a patent for Engineered Substrates, Free-standing Semiconductor Microstructures, and Related Systems and Methods. This invention was developed by Arena Chantal, Bhargava Nupur and Fischer Alec.
The patent application number is US202418599805 202..
Semiconductor
| Sat 24 Jan 2026
London, Jan. 24 -- UK Patent Office has released BOE Technology Group Co Ltd and Beijing BOE Technology Development patent application for Light-emitting Substrate and Preparation Method Therefor, and Light-emitting Apparatus. This invention was developed by Shaoyong Lu, Zhuo Chen, Zhuo Li, Xu Yuan and Yichi Zhang.
The patent..
Semiconductor
| Sat 24 Jan 2026
London, Jan. 24 -- UK Patent Office has released BOE Technology Group Co Ltd and Beijing BOE Technology Development patent application for Wiring Substrate and Manufacturing Method Therefor, Light-emitting Substrate, and Display Device. This invention was developed by Mengping Li, Jiaxiang Zhang, Qi Qi and Zhanfeng Cao.
The p..
Semiconductor
| Sat 24 Jan 2026
London, Jan. 24 -- UK Patent Office has released BOE Technology Group Co Ltd and Chengdu BOE Optoelectronics Technology patent application for Display Substrate and Driving Method Therfor, and Display Apparatus. This invention was developed by Haigang Qing, Gukhwan Song, Benlian Wang, Hai Zheng, Ming Hu and Haijun Qiu.
The pa..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Beijing Ziguang Qingteng Micro System Co Ltd has submitted a patent application for Power Supply System for Universal Integrated Chip Card and Terminal Equipment. Sun Zhiliang, Zhu Yongcheng and Huang Jinhuang developed the invention.
The patent application number is CN202510374978 20250327. The patent pub..
Semiconductor
| Fri 23 Jan 2026
Beijing, Jan. 24 -- Radio Weixun Ningbo Communication Tech Co Ltd has submitted a patent application for Axial Vertical Spiral Balun Based on Glass Substrate. This invention was developed by Chen Lianlian.
The patent application number is CN202510305317 20250314. The patent publication number is CN120300432 (A). International..
Semiconductor
| Sat 24 Jan 2026
Beijing, Jan. 24 -- State Intellectual Property Office of China has received Dandong Dadong Coil Eng Co Ltd patent application for Chip Inductor Automatic Packaging Device. Zhang Lingyu, Liu Renwei and Ma Shu developed the invention.
The patent application number is CN202510787040 20250613. The patent publication number is CN..
Semiconductor
| Sat 24 Jan 2026
Beijing, Jan. 24 -- State Intellectual Property Office of China has released Ningbo Dingsheng Microelectronic Tech Co Ltd patent application for High-reliability Chip Resistor with High-voltage-resistant Characteristic. This invention was developed by Zhu Tianyu, Xu Gangjun, Liu Xin, Xu Ning, Luo Sifan, Xia Fang, Jin Sha and Wan..
Semiconductor
| Sat 24 Jan 2026
Beijing, Jan. 24 -- State Intellectual Property Office of China has published Institute of Semiconductors, Chinese Academy of Sciences patent application for Acupuncture Point Positioning Method and Device, Electronic Equipment and Storage Medium. The invention was developed by Dong Xiaoli, Xu Jian, Sun Linjun, Qin Hong, Fei Yan..
Semiconductor
| Sat 24 Jan 2026
Beijing, Jan. 24 -- State Intellectual Property Office of China has published Guojing Hechuang Qingdao Tech Co Ltd patent application for Organic Electroluminescent Substrate Detection Method and System Based on Image Processing. The invention was developed by Zhang Fuxuan, Zhu Ruiping, Cui Caoxiang, Lyu Yong, Guo Baijun, Zhang ..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- U.S. Patent and Trademark Office has awarded a patent to Landauer Inc for Digital Neutron Dosimeter Based on 3D NAND Flash Memory. Akselrod Mark Samuilovich, Fomenko Vasiliy Vasilyevich and Harrison Jonathan Mitchell developed the invention.
The patent application number is US202318338924 20230621. The ..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- Scienta Omicron AB has been awarded a patent for Angle-resolving Photoelectron Spectrometer and Method. This invention was developed by Olofsson Mikael and Karlsson Patrik.
The patent application number is US202218274580 20220119. The patent publication number is US12529664 (B2). International Patent Cl..
Semiconductor
| Fri 23 Jan 2026
Alexandria, Jan. 24 -- U.S. Patent and Trademark Office has awarded a patent to SanDisk Tech LLC and SanDisk Technology for Three-dimensional Memory Device with Separated Source Lines and Method of Making the Same. Kai James, Alsmeier Johann, De La Rama Lito, Higashitani Masaaki, Matsuno Koichi, Gunji-yoneoka Marika, Koto Makoto..
Semiconductor
| Fri 23 Jan 2026
Alexandria, Jan. 24 -- U.S. Patent and Trademark Office has awarded a patent to SanDisk Tech LLC and SanDisk Technology for Bonded Assembly Containing Conductive Via Structures Extending Through Word Lines in a Staircase Region and Methods for Making the Same. Tsutsumi Masanori developed the invention.
The patent application ..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- United States Patent for Non-volatile Memory with Auxiliary Select Gate Line Driver has been issued to Ememory Technology. This invention was developed by Ong Wei-chiang and Chen Hsueh-wei.
The patent application number is US202418765358 20240708. The patent publication number is US12531123 (B2). Intern..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- Macronix has been granted a patent for Memory Device and Operating Method Thereof. Lin Yu-hsuan, Lin Yu-yu and Lee Feng-min developed the invention.
The patent application number is US202318469613 20230919. The patent publication number is US12531112 (B2). International Patent Classification codes are G..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- NXP USA has been awarded a patent for Management of Refresh Operations in an Embedded Dynamic Random Access Memories (DRAMs) Having Canary Cells. This invention was developed by Mahatme Nihaar N and Roy Anirban.
The patent application number is US202418649586 20240429. The patent publication number is U..
Semiconductor
| Sat 24 Jan 2026
Alexandria, Jan. 24 -- U.S. Patent and Trademark Office has awarded a patent to Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group for Display Substrate and Display Device. Cao Dan, Gao Wenhui, Wang Miao, Liu Cong, Wang Binyan, Zhang Jingwen, Guo Yonglin, Song Gukhwan and Liu Zhen developed the invention.
The pa..
Semiconductor
| Sun 25 Jan 2026
Beijing, Jan. 26 -- Yangtze Memory Technologies has sought patent for Semiconductor Device and Preparation Method Thereof, and Memory System. This invention was developed by Liu Zichen, Wang Yanhong, Liu Yaqin, Chen Lian, Wei Danyang and Liu Wei.
The patent application number is CN20241041740 20240110. The patent publication ..
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