Semiconductor
| Fri 01 May 2026
Beijing, May 2 -- Shenyang Heyan Tech Co Ltd has applied Chinese patent for Method and Device for Adjusting Cutting Height of Cutting Knife, Wafer Processing Equipment and Medium. Liu Xuefei, Zheng Qingyang, Zhang Hongsheng, Liu Guopeng, Wang Song, Wang Zhiwei, Yuan Huizhu and Xu Peng developed it.
The patent application numb..