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Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- European Patent Office has released NXP USA patent application for Fabrication Process for HEMT Devices Using Surface Treatments. This invention was developed by Green Bruce Mcrae, Rampley Colby Greg, Renaud Philippe and Zhu Congyong.
The patent application number is EP20250224757 20251218. The patent public..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- European Patent Office has received NXP USA patent application for Fabrication Process for HEMT Devices with Field Plates. Foster Elijah Blue, Ahamed Faruque, Zhu Congyong, Hale Gregory David, Currier David Robert and Cochran David Garret developed the invention.
The patent application number is EP2025022491..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- LG Chemical has submitted a patent application for Compound and Organic Light-emitting Device Comprising Same. This invention was developed by Heo Dong Uk, Kim Han-na, Hong Sung Kil, Lee Jae Tak, Yoon Jung-min, Yun Hee-kyung, Park Jong Jin and Han Su Jin.
The patent application number is CN20258004219 20250..
Semiconductor
| Mon 06 Jul 2026
Alexandria, July 6 -- United States Patent for Silicon Carbide Substrate and Method of Manufacturing the Same has been issued to Proterial Ltd and Hitachi Metals. This invention was developed by Hirooka Taisuke, Okino Hiroyuki and Konishi Kumiko.
The patent application number is US202217942308 20220912. The patent publication..
Semiconductor
| Mon 06 Jul 2026
Alexandria, July 6 -- United States Patent for Substrate and Electronic Apparatus has been issued to BOE Technology Group Co Ltd and Hefei BOE Ruisheng Technology. This invention was developed by Zhai Ming, Wu Zhongbao, Gao Liang, Huang Linjie, Tang Hai, Kong Chengcheng, Wang Chengguo and Sun Yiding.
The patent application nu..
Semiconductor
| Mon 06 Jul 2026
Alexandria, July 6 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Manufacturing Co Limited and Taiwan Semiconductor Manufacturing for High Density Capacitor and Methods of Forming the Same. Yaung Dun-nian, Liu Jen-cheng, Lin Hsing-chih, Liu Ko Chun and Lin Meng-hsien developed the invention.
..
Semiconductor
| Mon 06 Jul 2026
Alexandria, July 6 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing for Trench Capacitor Structure and Methods of Manufacturing. Jiang Yu, Lin Ming-hsun and Tseng Lee-chuan developed the invention.
The patent application number is US202318297282 202304..
Semiconductor
| Mon 06 Jul 2026
Alexandria, July 6 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing for Semiconductor Device, Method of Fabricating Semiconductor Device, and Semiconductor Structure Having Semiconductor Device. Chiang Tien-wei, Kalnitsky Alexander, Huang Sheng-haung and ..
Semiconductor
| Mon 06 Jul 2026
Alexandria, July 6 -- U.S. Patent and Trademark Office has awarded a patent to Changxin Memory Tech Inc and Changxin Jidian Beijing Memory Tech Co Ltd for Capacitor Structure and Method for Manufacturing Same, Semiconductor Structure and Method for Manufacturing Same. Cho Gyuseog developed the invention.
The patent applicatio..
Semiconductor
| Mon 06 Jul 2026
Alexandria, July 6 -- U.S. Patent and Trademark Office has awarded a patent to Taiwan Semiconductor Mfg and Taiwan Semiconductor Manufacturing for Interconnect Structures for Integration of Memory Cells and Logic Cells. Chen Jui-lin, Chang Feng-ming and Wang Ping-wei developed the invention.
The patent application number is U..
Semiconductor
| Mon 06 Jul 2026
Alexandria, July 6 -- Taiwan Semiconductor Manufactoring Co Ltd and Taiwan Semiconductor has been granted a patent for Profile Control of Epitaxial Structures in Semiconductor Devices. More Shahaji B and Lo Yi Hsuan developed the invention.
The patent application number is US202318128051 20230329. The patent publication numbe..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- Swm Holdco Luxembourg has sought patent for Paper or Nonwoven Filter Media with Plug Wrap Paper Comprising a Fibrous Substrate. This invention was developed by Blin Thomas.
The patent application number is EP20240307303 20241224. The patent publication number is EP4767845 (A1). International Patent Classific..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- International Solar Energy Res Center Konstanz Isc Konstanz EV has applied European patent for Method of Structuring and Doping of Polysilicon Regions for Backside Contact Solar Cell. Buchholz Dr Florian, Kuruganti Venkat Vaibhav and Mihailetchi Dr Valentin Dan developed it.
The patent application number is ..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- Ruhr Univ Bochum Koerperschaft Des Oeffentlichen Rechts has applied European patent for Devices and Methods for Plasma Processing and Surface Processing. Li Wang, Julian Schulze, Zoltán Donko and Peter Hartmann developed it.
The patent application number is EP20240222641 20241220. The patent publication num..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- Suzhou Suna Opto Electronics Co Ltd has submitted a patent application for Silicon Capacitor Electrode Structure and Silicon Capacitor. Jin Shan, He Tingting, Lu Jianya, Huang Yuyang, Fei Xiaobin and Huang Zhiyuan developed the invention.
The patent application number is EP20250769344 20250307. The patent pu..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- Nokia Networks France has submitted a patent application for Layered Semiconductor Structures and Methods for Fabricating Layered Semiconductor Structures. This invention was developed by Besancon Claire and Decobert Jean.
The patent application number is EP20240307163 20241218. The patent publication number..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- European Patent Office has released Fuji Electric patent application for Semiconductor Device. This invention was developed by Saito Takashi.
The patent application number is EP20250771641 20250127. The patent publication number is EP4765207 (A1). Cooperative Patent Classification codes are H10W90/00 (EP), H..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Quanzhou Hunan University Industrial Design and Machine Intelligent Innovation Inst and Quanzhou Xianglu Tech Co Ltd have submitted a patent application for Vision-based Wafer Edge Searching and Positioning Method and Device and Readable Medium. This invention was developed by Chen Jincan, Guo Huabin and Liu Y..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Toyochem Co Ltd and Artience have submitted a patent application for Electronic Component Cover Sheet, Laminated Sheet, and Electronic Component Mounting Substrate. Ando Kenji and Matsudo Kazunori developed the invention.
The patent application number is WO2025JP43574 20251212. The patent publication number ..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Tokyo Electron Ltd and Kyoto University have filed a patent application for Measurement Method and Measurement System. This invention was developed by Mukai Yu, Furukawa Yasunori, Nishimura Tetsuya and Takeuchi Shigeki.
The patent application number is WO2025JP42656 20251208. The patent publication number is..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 --Morrison Neil, Applied Materials Inc, Crouch Tarquin Lucas, Dieguez-campo Jose Manuel, Morrison Neil, Crouch Tarquin Lucas, Dieter Torsten Bruno and Verghese Rajan have submitted a patent application for Method of Manufacturing a Flexible Barrier Structure, Flexible Barrier Structure, and Apparatus for Manufactu..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Anjiki Takashi and Applied Materials have submitted a patent application for Measurement System for Measuring a Thickness of a Layer on a Substrate, Deposition Apparatus, Method of Measuring a Thickness of a Layer on a Substrate, and Method of Controlling a Thickness of a Layer on a Substrate. Anjiki Takashi de..
Semiconductor
| Sat 04 Jul 2026
Geneva, July 4 -- Safran and Safran Landing Systems have filed a patent application for Assembly for Detecting Corrosion or the Possibility of Corrosion of a Metal Substrate. This invention was developed by Guidoux Antoine and Exbrayat Loic.
The patent application number is WO2025FR51193 20251217. The patent publication numbe..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- ACM Research, Shanghai and Shengwei Semiconductor Equipment Shanghai Co Ltd have submitted a patent application for Semiconductor Substrate Processing Apparatus and Processing Method. Fang Bo, Wang Hui, Li Yazhou, Jia Shena, Lin Jinmu, Du Xuchu and Wang Jun developed the invention.
The patent application nu..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Chengdu BOE Optoelectronics Technology and BOE Technology Group have submitted a patent application for Display Substrate and Display Device. This invention was developed by Xin Yanxia, Wu Tong, Zhang Feng, Shi Jikai, Zhao Yu, Wang Xiaoyun, Zhou Yuzhu, Li Haibo, Huang Liwei, Li Xueping and Wu Yihao.
The pat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- University of Science and Technology Beijing and Beijing University have submitted a patent application for Perovskite Solar Cell and Preparation Method Thereof. Hu Wei, Zhu Rui, Zhao Lichen, Chen Yuanwei and Yang Huai developed the invention.
The patent application number is CN20251239133 20251231. The pat..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Chengdu BOE Optoelectronics Technology and BOE Technology Group have submitted a patent application for Stretchable Display Substrate and Display Device. This invention was developed by Zhang Yahui, Liu Ganghu, Shi Zhenyan, Chen Wenyan, Li Hao, Liu Yu, Yan Rongjian and Li Huihui.
The patent application numb..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Jiangxi MTC Semiconductor and Jiangxi Yaochi Tech Co Ltd have filed a patent application for LED Chip with Bionic Structure and Manufacturing Method Thereof. This invention was developed by Jin Conglong, Hu Jiahui, Xu Zhou, Wu Zihan, Zou Yanling and Zhang Cunlei.
The patent application number is CN202512098..
Semiconductor
| Fri 03 Jul 2026
Geneva, July 4 -- Alliance For Energy Innovation LLC and Arizona State University have submitted a patent application for Electrolytic Methods and Systems for the Production of Metallurgical Grade Silicon. This invention was developed by Seetharaman Sridhar, Rippy Kerry Christine, Hoover Haley, Wu Lipin and Bell Robert Terry.
..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Chengdu BOE Optoelectronics Technology and BOE Technology Group have filed a patent application for Display Substrate and Display Device. This invention was developed by Hu Yao.
The patent application number is CN20228002385 20220727. The patent publication number is CN121773742 (A). International Patent Cl..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Chengdu BOE Optoelectronics Technology, BOE Technology Group and Beijing BOE Technology Development have submitted a patent application for Display Substrate and Display Device. This invention was developed by Liu Miao, Zhang Tiaomei, Jiang Zhiliang, Yu Ziyang, Ai Sifei and Chen Wenbo.
The patent applicatio..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Jiangxi MTC Semiconductor and Jiangxi Yaochi Tech Co Ltd have applied Chinese patent for Flip Light Emitting Diode Chip and Preparation Method Thereof. Li Wentao, Jin Conglong, Hu Jiahui, Xu Zhou and Zhang Cunlei developed it.
The patent application number is CN202511986225 20251226. The patent publication ..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Nanjing University and Hefei Nat Laboratory have applied Chinese patent for Electronically Integratable Double-sided Framework Silicon Carbide Thin Film Device and Preparation Method Thereof. Xu Renjie, Lu Hai, Guo Yue, Ren Fangfang, Zhou Feng, Xu Weizong, Zhou Dong and Zhang Rong developed it.
The patent a..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Shangyu Semiconductor Material Res Center and Zhejiang University have submitted a patent application for Efficient Gettering Method for Heterojunction Solar Cell and Silicon Wafer. Yu Xuegong, Yuan Shuai, Yang Deren, Zhou Fei, Li Guixiu and Zuo Yuanyuan developed the invention.
The patent application numbe..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Zhangjiang Nat Laboratory and Institute of Microelectronics, CAS have sought patent for Computing Core Particle, Computing Chip and Computing System. This invention was developed by Yu Chengshuo, Yi Hailan, Zhou Keji, Jiang Yu, Yang Jianguo and Cao Yue.
The patent application number is CN202411389775 202409..
Semiconductor
| Sat 04 Jul 2026
Beijing, July 4 -- Yunnan Xinyao Semiconductor Materials Co and Yunnan Zhongke Xinyuan Crystalline Mat Co Ltd have filed a patent application for Germanium Wafer Chamfering Method Based on Diameter Optimization and Double-grinding-wheel Step-by-step Grinding. This invention was developed by Wang Shunjin, Kong Weiqun, Ma Lu'e, Li..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- SK Hynix has submitted a patent application for Semiconductor Device and Method for Fabricating the Same. This invention was developed by Kwak Jun Ha, Choi Kang Sik, Lee Sang Soo and Seo Jung Won.
The patent application number is EP20250224186 20251217. The patent publication number is EP4765124 (A1). Internat..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Nanjing University of Posts and Telecommunications has submitted a patent application for Multipath Signal Processing Method for Ultra-wideband Chip Baseband. Jian Ang and Wang Junfeng developed the invention.
The patent application number is CN202511976013 20251225. The patent publication number is CN1217504..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has released Chengdu Xinhaichuangxin Technology patent application for Secure Communication Method, System and Chip. This invention was developed by Ding Zuxiong.
The patent application number is CN202511838867 20251208. The patent publication number is CN121750285 ..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Tianyi Cloud Technology has sought patent for Information Transmission Method and Device, Equipment, Medium and Chip. This invention was developed by Wang Gewei and Yang Tianyu.
The patent application number is CN202511810092 20251203. The patent publication number is CN121750275 (A). International Patent Cla..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has published Huawei Technologies patent application for Attack Detection Method and Device and Np Chip. The invention was developed by Chen Chunhui, Jin Rulong, Hu Jing and Yang Feiran.
The patent application number is CN202411337728 20240924. The patent publicatio..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has received Beijing Xuanjie Technology patent application for Video Processing Method and Device, Electronic Equipment, Storage Medium and Chip. Liu Yuqing developed the invention.
The patent application number is CN202511748841 20251125. The patent publication num..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Beijing Xiaomi Mobile Software has filed a patent application for Heartbeat Packet Sending Method and Device, Medium and Chip. This invention was developed by Chen Long, Zhuang Xudong and Zheng Xiaohui.
The patent application number is CN202411368058 20240927. The patent publication number is CN121750708 (A)...
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Wuxi Zhongxing Micro System Technology has submitted a patent application for Switching Device, Independent Switching Chip, Structural Switching Chip and Message Transmission Method. Zhang Ruibiao, Fei Xiang, Wu Zixian, Hu Lizhan, Sheng Haigang, Cai Xufeng and Lin Mulong developed the invention.
The patent ap..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has received Tianyi Cloud Technology patent application for Network State Detection Method, Device, Equipment and Chip. Xie Jiachen developed the invention.
The patent application number is CN202511745069 20251125. The patent publication number is CN121750520 (A). I..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- ASML Netherlands has filed a patent application for Systems and Methods for an Apparatus for Joining Substrates. This invention was developed by Beukman Arjan Johannes Anton and Bleeker Arno Jan.
The patent application number is EP20240220988 20241218. The patent publication number is EP4765197 (A1). Cooperati..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- European Patent Office has released ASML Netherlands patent application for Bonding Systems and Methods. This invention was developed by Hsu Chia-hao.
The patent application number is EP20240220431 20241217. The patent publication number is EP4765195 (A1). Cooperative Patent Classification codes are H10P72/044..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- European Patent Office has received SCREEN Holdings patent application for Monitoring Method in Substrate Processing Apparatus. Shimizu Shinji, Yen Hunghsiu and Chauhan Nachiketa developed the invention.
The patent application number is EP20240854054 20240520. The patent publication number is EP4765191 (A1). I..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- ASML Netherlands has sought patent for Detector Module. This invention was developed by Rodrigues Mansano Andre Luis, Visser Erwin Robert Alexander and Wang Shih-chi.
The patent application number is EP20240221048 20241218. The patent publication number is EP4765186 (A1). International Patent Classification co..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Rongyao Terminal has submitted a patent application for Image Processing Method, Electronic Equipment, Storage Medium and Chip. This invention was developed by Zuo Xiaojiang.
The patent application number is CN202411311203 20240919. The patent publication number is CN121750973 (A). International Patent Classi..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- Semiconductor Components Industries has sought patent for Bi-directional ESD and Surge Protection Device. This invention was developed by Chen Yupeng, Gill Chai Ean, Zhan Rouying and Keena Thomas.
The patent application number is EP20250220617 20251204. The patent publication number is EP4766094 (A1). Internat..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- GlobalFoundries has submitted a patent application for Circuit Structure and Method with a Resistor for Reducing Voltage at Control Node for Device. This invention was developed by Loiseau Alain F and Subramani Nandha Kumar.
The patent application number is EP20250184750 20250624. The patent publication number..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- GlobalFoundries has submitted a patent application for Structures for a High-electron-mobility Transistor. This invention was developed by Milo Gary, He Zhong-xiang, Rassel Richard and Hazbun Ramsey.
The patent application number is EP20250184723 20250624. The patent publication number is EP4766079 (A1). Inter..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- Intel has filed a patent application for Thermal Management Structures Integrated in Semiconductor Devices. This invention was developed by Pantuso Daniel, Phan Anh, Metz Matthew V, Ramayya Edwin B, Landon Colin D, Mannebach Ehren, Kobrinsky Mauro J, Mills Shaun, D'silva Joseph, Sen Gupta Arnab and Jiang Lei.
..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- Alps Alpine has submitted a patent application for Tear-prevention Structure for Multilayer Substrate. This invention was developed by Yasumoto Takashi.
The patent application number is EP20250220310 20251203. The patent publication number is EP4766033 (A1). International Patent Classification code is H05K1/02..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Spreadtrum Semiconductor (Nanjing) has filed a patent application for Cell Measurement Method, Device, Equipment, Chip and Chip Module. This invention was developed by Zhang Ke.
The patent application number is CN202610225959 20260225. The patent publication number is CN121751239 (A). International Patent Cla..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Beifang University of Nationalities has applied Chinese patent for Method for Preparing Graphdiyne by Taking High-entropy Oxide as Substrate and Application of Graphdiyne. Jin Fei, Wang Peizhen and Jin Zhiliang developed it.
The patent application number is CN202511888967 20251215. The patent publication numb..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Beijing Gl Microelectronics Tech Co Ltd has submitted a patent application for Sealing Structure for MEMS Device and Preparation Method Thereof. This invention was developed by Xu Pengfei and Cao Zhengwei.
The patent application number is CN202511839461 20251208. The patent publication number is CN121778660..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Beijing Xuanjie Technology has submitted a patent application for Communication Method and Device, Terminal, Chip and Storage Medium. Yang Yinfei developed the invention.
The patent application number is CN202511971960 20251224. The patent publication number is CN121751164 (A). International Patent Classifica..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- NVIDIA has submitted a patent application for Identifying Directions to Transmit Wireless Signals. Chen Yongce developed the invention.
The patent application number is EP20250224267 20251217. The patent publication number is EP4765746 (A1). International Patent Classification code is H04L25/02. Cooperative Pa..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- NVIDIA has filed a patent application for Encryption Key Rotation Without Inband Synchronization Over a Communication Interconnect. This invention was developed by Zevulun Adir, Rom Noam, Chadha Ish, Krishnamurthy Adithya Hrudhayan and Lim Sungmin.
The patent application number is EP20250224813 20251218. The p..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Smartsens Shenzhen Tech Co Ltd has sought patent for MIPI Circuit and Image Sensor. This invention was developed by Wu Qiuwei and Tang Liming.
The patent application number is CN202411346096 20240925. The patent publication number is CN121751019 (A). International Patent Classification codes are H04N25/70 a..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Smartsens Shenzhen Tech Co Ltd has applied Chinese patent for Dead Pixel Distribution Method, Image Sensor and Computer Readable Storage Medium. Peng Peihong, Zhao Jianhua and Ma Le developed it.
The patent application number is CN202411355066 20240926. The patent publication number is CN121751018 (A). Inte..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has released Hangzhou Linx Robot Intelligent Tech Co Ltd patent application for Fpga-based Image Sensor Fixed Pattern Noise Calibration System and Method. This invention was developed by Lan Junjie, Fan Bin and Fu Weinan.
The patent application number is CN2026102..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- European Patent Office has received Huawei Technologies patent application for Encoding Method, Apparatus and System, and Chip. Zhang Sen, Zhuang Yan, Wang Renlei, Pan Dongcheng and Zhang Tingting developed the invention.
The patent application number is EP20240862045 20240905. The patent publication number is..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- European Patent Office has received Shanghai Xizhi Technology patent application for Optical Module, Photoelectric Integrated Semiconductor Structure, and Optical Switching System. Xu Yelong, Zhang Weifeng, Meng Huaiyu, Shen Yichen, Su Zhan and Zhu Jian developed the invention.
The patent application number ..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has received Qingdao Xinxin Microelectronics Tech Co Ltd patent application for Display Chip and Pop Sound Processing Method. Zuo Jian and Shen Youqi developed the invention.
The patent application number is CN202411339429 20240924. The patent publication number i..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has released CSG Holding and Yichang Csg Polysilicon Co Ltd patent application for Automatic Silicon Wafer Packaging System and Method Based on Automatic Equipment. This invention was developed by Zhang Dong and Li Pu.
The patent application number is CN2025119010..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Beijing Huawei Digital Technology Co Ltd has applied Chinese patent for Message Transmission Method and Device, Equipment, Chip and Storage Medium. Hu Zhibo, Kong Jimei, Wang Haibo, Bao Lei and Xu Feng developed it.
The patent application number is CN202411348038 20240925. The patent publication number is C..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has released Taizhou Xingkong Zhilian Tech Co Ltd, Zhejiang Shikong Daoyu Tech Co Ltd and Geely Holding Group patent application for Solar Wing Substrate Embedded Part, Solar Wing Substrate, Assembling Tool and Assembling Method. This invention was developed by Zhang..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Zhonghao Xinying Hangzhou Tech Co Ltd has submitted a patent application for Chip Flow Analysis Method and Device and Chip. Zheng Hanxun and Chen Chaohui developed the invention.
The patent application number is CN202610225312 20260225. The patent publication number is CN121750530 (A). International Patent ..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- STMicroelectronics International has filed a patent application for Encryption/decryption Unit. This invention was developed by Cheval Eloise.
The patent application number is EP20250225989 20251219. The patent publication number is EP4764925 (A1). International Patent Classification codes are G06F21/60 and ..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- Intel has sought patent for Integrated Circuit Packages Having an Organic Substrate and a Bridge Die with Non-solder Interconnects. This invention was developed by Chen Li, Yoon Chee Kheong, Gowda Mohan Prashanth Javare, Lin Han-wen, Goebel Klaus Heinz, Bacha Abdallah, Nagarajan Kavitha and Waidhas Bernd.
The ..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- European Patent Office has published Intel patent application for Through Glass Vias with Multilayered Organic/inorganic Liner for Integrated Circuit Device Packages. The invention was developed by Kaviani Shayan, Wall Marcel, Shanmugam Rengarajan, Zamani Ehsan, Mohammadighaleni Madhi, Grujicic Darko, Pietambar..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- European Patent Office has published Nichia patent application for Nitride Semiconductor Light-emitting Element. The invention was developed by Funakoshi Ryota.
The patent application number is EP20250223792 20251216. The patent publication number is EP4766105 (A1). International Patent Classification codes ar..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- European Patent Office has published Commissariat Energie Atomique patent application for Crystalline Si Solar Cell with Improved Resistance to Irradiation. The invention was developed by Cariou Romain, Enjalbert Nicolas and Dubois Sébastien.
The patent application number is EP20250223565 20251215. The pate..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- SK Hynix has filed a patent application for Image Sensing Device and Imaging System Including the Same. This invention was developed by Jang Jae Hyung.
The patent application number is EP20250224073 20251216. The patent publication number is EP4766100 (A1). International Patent Classification code is H10F39/00..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has published Beijing Xuanjie Technology patent application for Communication Method, Device, Equipment and Chip. The invention was developed by Kwon Kil-soo, Tang Yongquan and Hou Xuyan.
The patent application number is CN202511984350 20251225. The patent publicati..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- Semiconductor Components Industries has submitted a patent application for Double Well Bipolar Junction Transistor for ESD and Surge Protection. This invention was developed by Patoary Naim, Gill Chai Ean, Chen Yupeng, Zhan Rouying and Keena Thomas.
The patent application number is EP20250220882 20251204. The ..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- European Patent Office has released GlobalFoundries patent application for Bipolar Transistors with a Common Extrinsic Base Region. This invention was developed by Shank Steven M, Raghunathan Uppili Srinivasan, Mctaggart Sarah Ann, Lydon-nuhfer Megan Elizabeth and Deangelis Jacob Matthew.
The patent applicat..
Semiconductor
| Sun 05 Jul 2026
Munich, July 6 -- Commissariat Energie Atomique has submitted a patent application for Non-volatile Memory Device and Method of Making Same. This invention was developed by Chêne Thibaut, Chevolleau Thierry, Nemouchi Fabrice, Segaud Roselyne, Boixaderas Christelle and Grenouillet Laurent.
The patent application number is EP2..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has published Ningbo Guangxin Nanometer Mat Co Ltd, Jiangsu Boqian New Mat Stock Co Ltd and Jiangsu Guangyu Energy Storage Mat Co Ltd patent application for Preparation Method of Silicon Nanowire and Silicon Nanowire. The invention was developed by Xu Hao, Wang Jiale..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has published Huaqing Huishang Beijing Tech Co Ltd patent application for Manufacturing Method of High-anti-interference MEMS Cantilever Beam Photoacoustic Sensing Chip. The invention was developed by Li Yanmin.
The patent application number is CN20261021427 20260..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Suzhou Sicui Chegui Semiconductor Industry Technology Research Inst Co Ltd has applied Chinese patent for Cmos-mems Optical Sensor and Preparation Method Thereof. Li Junjie, Shen Xulin, You Jie, Wang Kaihou, Wang Yu and Xie Guoliang developed it.
The patent application number is CN20251237087 20251230. The ..
Semiconductor
| Mon 06 Jul 2026
Alexandria, July 6 -- U.S. Patent and Trademark Office has awarded a patent to Phoenix Pioneer Technology for Hollow Antenna Substrate and its Manufacturing Method for Antenna Packaging Applications. Chou Pao-hung, Hsu Shih-ping and Chang Ming-yeh developed the invention.
The patent application number is US202418963334 20241127..
Semiconductor
| Mon 06 Jul 2026
Alexandria, July 6 -- IBM has secured a patent on Symmetric Multi-ic Modules Using Hierarchical Digital Reconfiguration of Integrated Circuit Chips. Paidimarri Arun, Yeck Mark and Sadhu Bodhisatwa developed the invention.
The patent application number is US202217741677 20220511. The patent publication number is US12658561 (B2)...
Semiconductor
| Mon 06 Jul 2026
Alexandria, July 6 -- Infineon Technologies has obtained a patent for chip packages including substrate integrated waveguides. This invention was developed by Erdöl Tuncay, Seler Ernst and Möeller Ulrich.
The patent application number is US202418665349 20240515. The patent publication number is US12658550 (B2). International ..
Semiconductor
| Mon 06 Jul 2026
Alexandria, July 6 -- Murata Manufacturing has obtained a patent for multilayer substrate and electronic device. This invention was developed by Okamoto Masanori and Ikemoto Nobuo.
The patent application number is US202318223075 20230718. The patent publication number is US12658549 (B2). International Patent Classification code..
Semiconductor
| Mon 06 Jul 2026
Alexandria, July 6 -- IBM has secured a patent on Electroplated Metal Layer on a Niobium-titanium Substrate. Gordon Ryan T, Luo Yu, Sandstrom Robert L and Hall Shawn Anthony developed the invention.
The patent application number is US202318316060 20230511. The patent publication number is US12658547 (B2). International Patent C..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has published Taiwan Semiconductor Manufacturing patent application for Semiconductor Structure and Forming Method Thereof. The invention was developed by Lin Zhichang.
The patent application number is CN202511401248 20250928. The patent publication number is CN1217..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has published Guizhou Daipusen Digital Energy Co Ltd patent application for Self-adaptive Chip Mounting Device for Computer Mainboard Processing. The invention was developed by Zheng Zhouyuan, Chen Song and Shi Xiongjun.
The patent application number is CN20261022..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has published Shenzhen Clear Tech Co Ltd patent application for SMT Chip Mounter. The invention was developed by Zhang Xinsheng and Lu Xun.
The patent application number is CN20261022889 20260108. The patent publication number is CN121751614 (A). International Pat..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Grinm Resources and Environment Technology Research Inst Beijing Co Ltd has filed a patent application for Target Material for Thin-film Solar Cell as Well as Preparation Method and Application of Target Material. This invention was developed by Han Cang, Chu Maoyou, Zhang Xinnan, Liu Yuyang, Wu Yanke and Peng..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has released Sichuan Huagou Residential Ind Co Ltd patent application for Cement-free Geopolymer Excited by Nanometer Silicon Mortar and Preparation Method of Cement-free Geopolymer. This invention was developed by Wang Min, Yuan Mei, Guo Fucheng and Zou Yang.
The..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has received Minhe Guangda Carbon Co Ltd patent application for Electrode Paste for Smelting Metal Silicon and Manufacturing Method Thereof. Zhu Zongyun, Zhang Xuewen and Ran Wanqiang developed the invention.
The patent application number is CN202511924782 2025121..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Unimicron Technology Suzhou has submitted a patent application for Circuit Board Packaging Method. This invention was developed by Du Dengke, Dong Qi'en, Sun Yue, Guo Xucheng, Chen Mengna and Xu Yiqing.
The patent application number is CN202511883279 20251215. The patent publication number is CN121751519 (A)...
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- State Intellectual Property Office of China has published Infineon Technologies patent application for Circuitry for Allocating Bitmaps for Multiple Pixelated Light Sources. The invention was developed by Walleser Peter, De Cicco Adolfo, Sana Sabrina, Unterweger Gernot and Scenini Andrea.
The patent applicati..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Texas Instruments has sought patent for Circuit Detection and Light Emitting Diode Controller. This invention was developed by Zhang Yurong, Tang Yichao, Liang Shangquan and Xu Wentao.
The patent application number is CN202511270861 20250908. The patent publication number is CN121751429 (A). International P..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Shanghai Sunto Semiconductor Tech Co Ltd has applied Chinese patent for Double-loop Control Method and System for Medium-frequency Induction Heating of Semiconductor Liquid Source. Li Zhen, Gan Wan, Jiang Furong and Shen Jie developed it.
The patent application number is CN202610230862 20260227. The patent ..
Semiconductor
| Sun 05 Jul 2026
Beijing, July 6 -- Rongyao Terminal has submitted a patent application for Communication Method, Device and System, Chip System and Computer Readable Storage Medium. Hu Shicheng, Zhang Qi and Qian Biao developed the invention.
The patent application number is CN202610230836 20260227. The patent publication number is CN121751389..
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