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(3)

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(2)

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EV Group E Thallner

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(2)

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(2)

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(2)

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(2)

MeetFuture Technology (Sh

(2)

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(2)

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Msquare Ltd Beijing [cn];

(2)

Muxi Integrated Circuit (

(2)

NAMICS Corporation

(2)

Nanjing University

(2)

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(2)

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(2)

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(2)

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(2)

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(2)

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(2)

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(2)

Taiwan Semiconductor Mfg

(2)

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(2)

Tencent Technology, Shenz

(2)

Tianjin Zhongke Jinghe El

(2)

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(2)

Tokyo Electron Ltd [jp];

(2)

Tokyo Electron Ltd [jp];

(2)

Tokyo Electron; Hacaras H

(2)

Trumpf Huettinger

(2)

Tsinghua University

(2)

Tuojing Technology, Shang

(2)

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(2)

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(2)

Xinjiang Hesheng Silicon

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(2)

(2)

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724th Research Institute

(1)

(1)

AOI Electronics

(1)

ASTI Global, Taiwan

(1)

Aalto University Foundati

(1)

(1)

Acm Res Shanghai Inc [cn]

(1)

Acm Res Shanghai Inc [cn]

(1)

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(1)

Advanced Micro Fabricatio

(1)

Advanced Micro-Fabricatio

(1)

Advanced View Tech Inc

(1)

Air Chongqing New Mat Co

(1)

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(1)

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(1)

(1)

Amazing Cool Tech Corpora

(1)

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(1)

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(1)

(1)

Ams Osram Int Gmbh [de];

(1)

(1)

(1)

Analogix Semiconductor Be

(1)

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(1)

Anhui Institute of Inform

(1)

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(1)

Anhui University

(1)

Anying Semiconductor Tech

(1)

Aotai Electric Co Ltd

(1)

Ap Systems Inc [kr]; Ctla

(1)

Applied Mat Inc [us]; Xua

(1)

Ar Display Co Ltd [tw]; T

(1)

Artience Co Ltd [jp]; TOY

(1)

Artmem Tech Co Ltd

(1)

Asionwise Semiconductor C

(1)

Asml Netherlands B V [nl]

(1)

Asml Netherlands B V [nl]

(1)

Asml Netherlands Bv [nl];

(1)

Avago Technologies Genera

(1)

Avago Technologies Intern

(1)

(1)

BOE Huacan Optoelectronic

(1)

BOE Tech Group Co Ltd [cn

(1)

BOE Tech Group Co Ltd [cn

(1)

BOE Tech Group Co Ltd [cn

(1)

BOE Tech Group Co Ltd [cn

(1)

BOE Tech Group Co Ltd [cn

(1)

BOE Technology Group Co L

(1)

BOE Technology Group Co L

(1)

BOE Technology Group Co L

(1)

BOE Technology Group Co L

(1)

BOE Technology Group Co L

(1)

BOE Technology Group Co L

(1)

BOE Technology Group Co L

(1)

BOE Technology Group Co L

(1)

BOE Technology Group; Bei

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BYD Company; BYD Semicond

(1)

Bangcui Shanghai Communic

(1)

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Baoji Xing Yu Teng Measur

(1)

Baotou Meike Silicon Ener

(1)

Baoyi New Mat Jiangsu Co

(1)

(1)

Beijing Aerospace Times O

(1)

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(1)

Beijing ESWIN Computing T

(1)

Beijing Fire Gene Dx Tech

(1)

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(1)

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(1)

Beijing Intellectual Prop

(1)

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(1)

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(1)

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(1)

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(1)

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(1)

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(1)

Beijing Smartchip Microel

(1)

Beijing Superstring Acade

(1)

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(1)

Beijing Unisoc Communicat

(1)

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(1)

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(1)

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(1)

Beijing Youzhuju Network

(1)

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(1)

Beijing Zhuhe Tech Co Ltd

(1)

Beijing Zitiao Network Te

(1)

Bgp Inc China Nat Pet Cor

(1)

Bialetska Julia

(1)

Biochain Beijing Science

(1)

Biospero Co Ltd [kr]; Kor

(1)

Blumitek Electronic Shang

(1)

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(1)

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(1)

Bolide Investment Co Ltd

(1)

Boya Advanced Mat Co Ltd

(1)

Brooks Automation (German

(1)

CETC Blue Sky Technology;

(1)

CETC Chip Technology Grou

(1)

CNOOC Changzhou Paint Che

(1)

Cambricon Xi\'an Semicond

(1)

(1)

(1)

(1)

Central Glass Co Limited

(1)

Central Glass; National U

(1)

Central South University

(1)

Cetc Fenghua Inf Equip Co

(1)

Changchun Changguang Chen

(1)

Changchun Haipurunsi Tech

(1)

Changdian Biological Wafe

(1)

Changzhou Correll Tech Co

(1)

Changzhou Jianuo Silicone

(1)

Changzhou Langjie Electro

(1)

Chc North Paint & Coating

(1)

(1)

(1)

Chengdu Boe Optoelectroni

(1)

Chengdu College of Univer

(1)

Chengdu Gaotong Isotope C

(1)

Chengdu Guanyan Tech Co L

(1)

Chengdu Hongchen Guangzi

(1)

Chengdu Shudun Zhixin Tec

(1)

Chengdu Tepin Microelectr

(1)

Chengdu Weiguang Jidian T

(1)

Chengdu Yicheng Integrate

(1)

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(1)

China CEC Engineering

(1)

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(1)

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(1)

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(1)

China Nanhu Academy of El

(1)

China Satellite Network A

(1)

China Satellite Network A

(1)

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(1)

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(1)

ChipMOS Technologies (Sha

(1)

Chipsea Technology Shenzh

(1)

Chongqing Hengnuo Electro

(1)

Chongqing Huafeng Dijiete

(1)

Chongqing Medical Univers

(1)

Chongqing Pingwei Enterpr

(1)

Chongqing Xinhui Material

(1)

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(1)

Chongqing Zhuangsifei Int

(1)

Chongyi Zhangyuan Tungste

(1)

Chouaib Houssam [us]; Kri

(1)

Chu Tao [us]; Ghani Tahir

(1)

Chuanzhou Semiconductor T

(1)

Chung King Enterprise

(1)

Cisco Technology

(1)

Cixin Tech Suzhou Co Ltd

(1)

Clark Nicholas [us]; Clar

(1)

Commissariat A L\'Energie

(1)

Consiglio Nazionale Ricer

(1)

Core Photoelectric Tech S

(1)

(1)

(1)

(1)

(1)

Daicel Corp [jp]; Osaka U

(1)

Daiichi Kigenso Kagaku Ko

(1)

Dainippon Ink & Chemicals

(1)

Dalian Hengkun New Mat Co

(1)

Dalian Huarui Heavy Indus

(1)

Dalian Institute of Chemi

(1)

Dalian University of Tech

(1)

Darwin Prec Industry Co L

(1)

Datang Huaxian Wind Power

(1)

Dc Branch Of State Grid H

(1)

(1)

(1)

Dingzhou Tech Co Ltd

(1)

Diyixin Shanghai Microele

(1)

Dnjo Technologies Co Ltd

(1)

(1)

(1)

Dongfang Jingyuan Microel

(1)

Dongguan Lirunda Screw Mf

(1)

Dongguan Xuhong Surface T

(1)

Dongguan Zhonghu Intellig

(1)

Dr Laser Singapore Pte Lt

(1)

Dsm Austria Gmbh

(1)

Dupont Electronic Materia

(1)

East China Inst Optoelect

(1)

Ebara Corp [jp]; Ckd Corp

(1)

Ebara Corp [jp]; National

(1)

(1)

Echo Tech Inc; Kurashiki

(1)

Electric Power Research I

(1)

Electronics And Telecommu

(1)

Emeishan Xinrui New Mat C

(1)

Emg Automation Gmbh

(1)

(1)

Etron Technology

(1)

Everbliss Green Co Ltd

(1)

Faraday Technology

(1)

Feng Shii Industrial Co L

(1)

Florida State University

(1)

Fong Prean Industrial Co

(1)

Forehope Semiconductor Ni

(1)

Forty Eighth Research Ins

(1)

Foshan Zhenmeizhijia Furn

(1)

Foundation of Soongsil Un

(1)

Fs Semi Semiconductor Cor

(1)

Fuji Polymer Industries

(1)

Fujian Hongguang Semicond

(1)

Fujian Institute of Resea

(1)

Fujifilm Corp [jp]; Fujif

(1)

Fuman Microelectronics Gr

(1)

Funing Xiexin Photovoltai

(1)

Gansu Inst Of Ecological

(1)

(1)

(1)

Getong Zhilian Tech Shang

(1)

Gigadevice Semiconductor

(1)

Gigaphoton; University Ky

(1)

Global Lighting Technolog

(1)

Global Unichip Corp [tw];

(1)

GlobalFoundries Singapore

(1)

Globalwafers Co Ltd [tw];

(1)

Glory Material Co Ltd

(1)

Glorysoft Shanghai Co Ltd

(1)

Grand Plastic Technology

(1)

Gree Electric Appliances,

(1)

Green Energy Huichong Dig

(1)

Greene Tweed Technologies

(1)

Guangdong Canwin Automati

(1)

Guangdong Haina Zhiwei Se

(1)

Guangdong Hanlin Material

(1)

Guangdong Hospital of Tra

(1)

Guangdong Hoyal Air Infor

(1)

Guangdong Inst Analysis C

(1)

Guangdong Jiansujing Biot

(1)

Guangdong Jinci 3d Tech C

(1)

Guangdong Jinwan Gaojing

(1)

Guangdong Xincheng Hanqi

(1)

Guangdong Zhihui Xinping

(1)

Guangliwei Shanghai Tech

(1)

Guangzhou China Star Opto

(1)

Guangzhou China Star Opto

(1)

Guangzhou Huike High Tech

(1)

Guangzhou Inst Of Technol

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Guangzhou Jointas Chemica

(1)

Guangzhou National Labora

(1)

Guangzhou Tongbada Elec T

(1)

Gudeng Precision Industri

(1)

Guilin University of Elec

(1)

Guiyang Aviation Electric

(1)

(1)

(1)

Haining Yisiwei Computing

(1)

Hamad Bin Khalifa Univ Hb

(1)

Hamamatsu Photonics

(1)

Hami Yizhou Zhengcheng Co

(1)

Hangzhou Dunyuan Juxin Se

(1)

Hangzhou Fangpei Tech Co

(1)

Hangzhou Fujia Gallium In

(1)

Hangzhou Geo Chip Tech Co

(1)

Hangzhou Guangzhiyuan Tec

(1)

Hangzhou Hesheng Tech Co

(1)

Hangzhou Jingshi Semicond

(1)

Hangzhou Research Institu

(1)

Hangzhou Shunan Automatio

(1)

Hanwha Semitech Co Ltd

(1)

Harbin Institute of Techn

(1)

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(1)

Hebei University of Techn

(1)

Hefei Anxun Precision Tec

(1)

Hefei Boe Display Tech Co

(1)

Hefei Boe Solar Tech Co L

(1)

Hefei Comprehensive Scien

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(1)

Hefei Quanzhi Kongtian In

(1)

Hefei Xinsheng Optoelectr

(1)

Hefei Yaozheng Quantum Te

(1)

Heidelberg University

(1)

Henan Academy Of Sciences

(1)

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(1)

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(1)

Hengdian Group DMEGC Magn

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(1)

(1)

Hesheng Silicon Ind Shans

(1)

(1)

Hirata Spinning

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(1)

Hon Young Semiconductor

(1)

Hong Kong University of S

(1)

Hongqi Integrated Circuit

(1)

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Hongyang Semiconductor Co

(1)

(1)

(1)

(1)

Hoya Corp [jp]; Hoya Opti

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Hoya Lens Thailand Ltd [t

(1)

Hoya Lens Thailand Ltd [t

(1)

Huace Xindong Semiconduct

(1)

Huadian Xinneng Jiangxi Y

(1)

Huaian Ruoan Electronic T

(1)

Huang Chen Cheng [tw]; Hu

(1)

(1)

Huasuo Suzhou Tech Co Ltd

(1)

Huatian Tech Jiangsu Co L

(1)

Huawei Digital Power Tech

(1)

Huayi Microelectronics Co

(1)

Huaying Research

(1)

Huazhong University of Sc

(1)

Hubei Changjiang Wanrun S

(1)

Hubei Gabrielle Optech Co

(1)

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(1)

Hubei Guoxin Juzhi New Ma

(1)

Hubei Hangju Tech Co Ltd

(1)

Hubei Jiangcheng Laborato

(1)

Hubei Jiufengshan Laborat

(1)

Hubei Sanan Optoelectroni

(1)

Hubei Sinophorus Electron

(1)

Hubei University of Autom

(1)

Hubei University; Guangzh

(1)

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(1)

Huizhou China Star Optoel

(1)

Hunan Greatwall Galaxy Te

(1)

Hunan Yuemo Advanced Semi

(1)

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(1)

Hye Technology Co Ltd

(1)

I-Chiun Precision Industr

(1)

(1)

(1)

IRICO Hefei LCD Glass

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(1)

Ibm Deutschland [de]; Ibm

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Ibm [us]; IBM UK

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Idzkowski Daniel Przemysl

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Iljin Global Holdings Co

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Inst Of Semiconductors He

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Institute of Computing Te

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(1)

JCET STATS ChipPAC, Korea

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Taiwan Patent Office Releases Adeia Semiconductor Bonding Technologies Inc Patent Application for Cavity Packages

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Taiwan Patent Office has released Adeia Semiconductor Bonding Technologies Inc patent application for Cavity Packages. This invention was developed by Huang Shaowu, Delacruz Javier A, Wang Liang, Katkar Rajesh and Haba Belgacem. The patent application number is TW20250105780 20181213. The patent publication..

Luxis Precision Intelligent Manufacturing Kunshan Co Ltd Submits Patent Application for Chip Unloading Equipment and Method

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Luxis Precision Intelligent Manufacturing Kunshan Co Ltd has submitted a patent application for Chip Unloading Equipment and Method. Bi Xiang-yang, He Liang-yu, Zhang Xian-zhu, Pan Xiao-bo, Qiao Qian-ming and Deng Dan-dan developed the invention. The patent application number is TW20240112027 20240329. The ..

Interface Optpelectronics Shenzhen Co Ltd, Interface Technology Chengdu Co Ltd and General Interface Solution Submit Taiwan Patent Application for SMT Device of Led Die Bonding Mac..

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Interface Optpelectronics Shenzhen Co Ltd, Interface Technology Chengdu Co Ltd and General Interface Solution have submitted a patent application for SMT Device of Led Die Bonding Machine and Mounting Method. This invention was developed by Chi Ko-hung. The patent application number is TW20230149912 202312..

Fong Prean Industrial Co Ltd Submits Taiwan Patent Application for Improved Screw Head Having the Ability to Cut Wood Fibers More Sharply and Easily, Ample Chip-accommodating Space..

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Fong Prean Industrial Co Ltd has submitted a patent application for Improved Screw Head Having the Ability to Cut Wood Fibers More Sharply and Easily, Ample Chip-accommodating Space in the Groove, Smooth and Low Resistance Reverse Spiral Cutting. This invention was developed by Lin Deng-hong. The patent app..

Bolide Investment Co Ltd Submits Taiwan Patent Application for Immersed Dielectric Composition Being Used as a Working Fluid for Freeze Protection, Auxiliary Heat Dissipation and H..

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Bolide Investment Co Ltd has submitted a patent application for Immersed Dielectric Composition Being Used as a Working Fluid for Freeze Protection, Auxiliary Heat Dissipation and Heat Transfer. This invention was developed by Ho Chien-te. The patent application number is TW20230151325 20231228. The patent ..

Solus Advanced Materials Co Ltd Submits Patent Application for Organic Light-emitting Compound and Organic Electroluminescent Device Comprising the Same

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Solus Advanced Materials Co Ltd has submitted a patent application for Organic Light-emitting Compound and Organic Electroluminescent Device Comprising the Same. Lee Ui-geon, Son Hyo-suk, Sim Sang-eun, Yang Seung-gyu, Yu Eun-soo, Lee Yong-hwan, Hyeong Do-seong and Sim Jae-yi developed the invention. The pat..

Shenzhen Mod Semiconductor Co Ltd Submits Patent Application for Normal-temperature Colloid Packaging Method and Packaging Structure of Multi-heterogeneous Module Intelligent Card

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Shenzhen Mod Semiconductor Co Ltd has submitted a patent application for Normal-temperature Colloid Packaging Method and Packaging Structure of Multi-heterogeneous Module Intelligent Card. Chen Yan developed the invention. The patent application number is CN202511707755 20251120. The patent publication num..

Carleton Univ Files European Patent Application for Organic Electrolyte-gated Field Effect Transistor Biosensor

Semiconductor

| Wed 10 Jun 2026

Munich, June 11 -- Carleton Univ has filed a patent application for Organic Electrolyte-gated Field Effect Transistor Biosensor. This invention was developed by Prakash Ravi and Massey Roslyn S. The patent application number is EP20240844153 20240725. The patent publication number is EP4751088 (A1). International Patent Class..

State Intellectual Property Office of China Releases Shenji Semiconductor Tech Xuzhou Co Ltd Patent Application for Semiconductor Growth Equipment Provided with Spraying Assembly

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has released Shenji Semiconductor Tech Xuzhou Co Ltd patent application for Semiconductor Growth Equipment Provided with Spraying Assembly. This invention was developed by Wang Shuai, Chen Liang, Liu Chao and Lou Jing. The patent application number is CN202610105..

Shenzhen Haowei Semiconductor Energy Saving New Material Tech Co Ltd Applies for Patent on Electrochromic Material and Preparation Method Thereof

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Shenzhen Haowei Semiconductor Energy Saving New Material Tech Co Ltd has applied Chinese patent for Electrochromic Material and Preparation Method Thereof. Xu Sheng, Li Xin, Liang Ruisheng, Fan Xianchang and Liu Wu developed it. The patent application number is CN202511716616 20251121. The patent publicati..

European Patent Office Releases Noctiluca SA Patent Application for a Boron-containing Compound and an Organic Light-emitting Device Including the Same

Semiconductor

| Wed 10 Jun 2026

Munich, June 11 -- European Patent Office has released Noctiluca SA patent application for a Boron-containing Compound and an Organic Light-emitting Device Including the Same. This invention was developed by Bosiak Mariusz, Glodek Marta and Ramanaskanda Braveenth. The patent application number is EP20240216799 20241202. The p..

Wuhan Xinchuangyuan Semiconductor Co Ltd Applies for Patent on Nickel Thickness Uniformity Method and System for Thin Gold High-corrosion-resistance Hard Gold Process

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Wuhan Xinchuangyuan Semiconductor Co Ltd has applied Chinese patent for Nickel Thickness Uniformity Method and System for Thin Gold High-corrosion-resistance Hard Gold Process. Jiang Jianqing, Li Zhidong, Xu Jingping, Luo Qi, Wang Rongbang and Fan Zisheng developed it. The patent application number is CN20..

Bojiexin Shenzhen Semiconductor Co Ltd Applies for Patent on Bilateral Belt Transmission Positioning Device Capable of Reading Two-dimensional Codes

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Bojiexin Shenzhen Semiconductor Co Ltd has applied Chinese patent for Bilateral Belt Transmission Positioning Device Capable of Reading Two-dimensional Codes. Wei Changbin and Yang Zidong developed it. The patent application number is CN20261047100 20260114. The patent publication number is CN121573411 (A)..

Zhongshang Tech Beijing Co Ltd and Zhongshang Tech Xuzhou Co Ltd File Chinese Patent Application for Dual-mode Temperature Control Decorative Wallboard System Based on Thermoelectr..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Zhongshang Tech Beijing Co Ltd and Zhongshang Tech Xuzhou Co Ltd have filed a patent application for Dual-mode Temperature Control Decorative Wallboard System Based on Thermoelectric Semiconductor and Control Method and Preparation Method of Dual-mode Temperature Control Decorative Wallboard System. This inve..

Shihezi University, Xinjiang Western Hesheng Silicon Industrial and Xinjiang Hesheng Silicon Industry New Mat Co Ltd Submit Chinese Patent Application for Environment-friendly Low-..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Shihezi University, Xinjiang Western Hesheng Silicon Industrial and Xinjiang Hesheng Silicon Industry New Mat Co Ltd have submitted a patent application for Environment-friendly Low-carbon Boiler Energy-saving Device for Organic Silicon Production. This invention was developed by Yang Shengchao, Li Congcong, ..

Guangzhou Jointas Chemical and Guangzhou Conghua Zhaoshun New Mat Co Ltd Apply for Patent on Addition Type Organic Silicon Pouring Sealant as Well as Preparation Method and Applica..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Guangzhou Jointas Chemical and Guangzhou Conghua Zhaoshun New Mat Co Ltd have applied Chinese patent for Addition Type Organic Silicon Pouring Sealant as Well as Preparation Method and Application Thereof. Liu Tingzhu, Hu Guoxin and Zhao Zhilei developed it. The patent application number is CN202511758100 ..

Guangdong Jinwan Gaojing Solar Energy Tech Co Ltd and Gaojing Solar Energy Submit Chinese Patent Application for Modified Polyurethane Coating, Preparation Method Thereof and Photo..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Guangdong Jinwan Gaojing Solar Energy Tech Co Ltd and Gaojing Solar Energy have submitted a patent application for Modified Polyurethane Coating, Preparation Method Thereof and Photovoltaic Silicon Wafer Cutting Main Roller. This invention was developed by Wang Daming, Quan Xiaodong, Bi Xixing, Fu Mingquan an..

Qinghai Huanghe Hydropower Dev and SPIC Huanghe Hydropower Development Seek Patent for Self-reinforcing and Toughening Organic Silicon Resin and Preparation Method Thereof

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Qinghai Huanghe Hydropower Dev and SPIC Huanghe Hydropower Development have sought patent for Self-reinforcing and Toughening Organic Silicon Resin and Preparation Method Thereof. This invention was developed by Xiao Guangyuan, Zhang Haifeng, Ma Baosheng, Zhao Wendong, Zhang Guosheng and Dong Shihua. The p..

Yamaha Robotics Holdings Co Ltd and Univ Tokyo Science Found Apply for Patent on Chip Holding Device, Chip Holding Method, and Apparatus for Producing Semiconductor Device

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Yamaha Robotics Holdings Co Ltd and Univ Tokyo Science Found have applied Taiwan patent for Chip Holding Device, Chip Holding Method, and Apparatus for Producing Semiconductor Device. Hishinuma Hayato, Kikuchi Hiroshi and Miyatake Masaaki developed it. The patent application number is TW20240142017 20241101..

Patentix Inc and Ritsumeikan Trust Submit Patent Application for Crystal Film, Laminated Structure, Semiconductor Device, Electronic Device and System

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Patentix Inc and Ritsumeikan Trust have submitted a patent application for Crystal Film, Laminated Structure, Semiconductor Device, Electronic Device and System. Kaneko Kentaro, Shimizu Yuki and Ibi Toyosuke developed the invention. The patent application number is TW20240134930 20240913. The patent publica..

SK Hynix Nand Product Solutions Corp Dba Solidigm and SK Hynix Submit Patent Application for Pattern Analysis Enabled Read Operation in NAND Component

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- SK Hynix Nand Product Solutions Corp Dba Solidigm and SK Hynix have submitted a patent application for Pattern Analysis Enabled Read Operation in NAND Component. Zhang Ming, Wakchaure Yogesh B, Wang Xiao-lei, Chen Lei, Kathawala Gulzar, Park Hee-joung and Cho Wan-ik developed the invention. The patent appli..

Taiwan Semiconductor Mfg Co Ltd and National Taiwan University Submit Taiwan Patent Application for Stacked Integrated Circuit Structure and Manufacturing Method Thereof

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Taiwan Semiconductor Mfg Co Ltd and National Taiwan University have submitted a patent application for Stacked Integrated Circuit Structure and Manufacturing Method Thereof. This invention was developed by Chang Rui-teng, Chang Tzu-hsuan, Kang Wei-cheng, Shih Chang-tsun, Chuang Han-lun, Guo Jhen-yu, Huang Lian..

Nitto Denko Corp and Nitto Seiki KK Apply for Patent on Tape Processing Apparatus for Semiconductor Work and Tape Exchange Method for Semiconductor Work

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Nitto Denko Corp and Nitto Seiki KK have applied Taiwan patent for Tape Processing Apparatus for Semiconductor Work and Tape Exchange Method for Semiconductor Work. Okuno Chouhei developed it. The patent application number is TW20240124227 20240628. The patent publication number is TW202525690 (A). Internat..

Beijing Automation Control Equipment Inst and Beijing Institute of Technology Submit Patent Application for Integrated Spatial Mode Filter Chip for Silicon Photon Gyroscope

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Beijing Automation Control Equipment Inst and Beijing Institute of Technology have submitted a patent application for Integrated Spatial Mode Filter Chip for Silicon Photon Gyroscope. Shang Kejun, Lei Ming, Zhao Hui, Li Haowei, Yu Xiaozhi, Wei Shaomou, Zhang Lizhe and Feng Lihui developed the invention. Th..

Electric Power Research Institute China Southern Power Grid, Dali Bureau of Ultra High Voltage Transmission Company China Southern Power Grid and Liuzhou Bureau EHV Power Transmiss..

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Electric Power Research Institute China Southern Power Grid, Dali Bureau of Ultra High Voltage Transmission Company China Southern Power Grid and Liuzhou Bureau EHV Power Transmission China Southern Power Grid have sought patent for Highly Packaged Magnetic Sensing Chip Based on Nv Color Center. This inventio..

Jiaxing University and Nanjing Miqiao Photoelectric Tech Co Ltd File Chinese Patent Application for Aunbps (at) Tio2-based Self-cleaning Recyclable SERS (surface Enhanced Raman Sca..

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Jiaxing University and Nanjing Miqiao Photoelectric Tech Co Ltd have filed a patent application for Aunbps (at) Tio2-based Self-cleaning Recyclable Sers (surface Enhanced Raman Scattering) Chip as Well as Preparation Method and Application Thereof. This invention was developed by Yao Yuanyuan, Li Jiani, Fang ..

Shin Etsu Polymer Co Ltd, Shinetsu Chemical Co and National Univ Corporation Saitama Univ Seek Patent for Method for Producing Diamond Substrate

Semiconductor

| Wed 10 Jun 2026

Munich, June 11 -- Shin Etsu Polymer Co Ltd, Shinetsu Chemical Co and National Univ Corporation Saitama Univ have sought patent for Method for Producing Diamond Substrate. This invention was developed by Ikeno Junichi, Yamada Yohei, Suzuki Hideki, Matsuo Rika and Noguchi Hitoshi. The patent application number is EP20240845539..

European Patent Office Receives Vertiv Int GmbH Patent Application for Integrated Single-phase Direct-to-chip Cooling Using R718

Semiconductor

| Wed 10 Jun 2026

Munich, June 11 -- European Patent Office has received Vertiv Int GmbH patent application for Integrated Single-phase Direct-to-chip Cooling Using R718. Bissaro Carlo, Barbato Pierpaolo and Tammaro Marcello developed the invention. The patent application number is EP20250218512 20251125. The patent publication number is EP475..

Vertiv Int GmbH Files European Patent Application for Integrated Two-phase Direct-to-chip Cooling Using R718

Semiconductor

| Wed 10 Jun 2026

Munich, June 11 -- Vertiv Int GmbH has filed a patent application for Integrated Two-phase Direct-to-chip Cooling Using R718. This invention was developed by Bisarro Carlo, Parise Andrea and Tammaro Marcello. The patent application number is EP20250219611 20251130. The patent publication number is EP4752460 (A1). Internationa..

New H3c Information Tech Co Ltd Seeks Patent for Method and Apparatus for Allocating Memory Resources

Semiconductor

| Wed 10 Jun 2026

Munich, June 11 -- New H3c Information Tech Co Ltd has sought patent for Method and Apparatus for Allocating Memory Resources. This invention was developed by Yu Yinting. The patent application number is EP20250166778 20250327. The patent publication number is EP4752738 (A1). International Patent Classification codes are G06F..

Jtec Corp Seeks Patent for Plasma Cvm Processing Method and Apparatus Therefor

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Jtec Corp has sought patent for Plasma Cvm Processing Method and Apparatus Therefor. This invention was developed by Tanaka Tomoyuki. The patent application number is TW20240139778 20241018. The patent publication number is TW202527085 (A). International Patent Classification codes are H01L21/302, H01L21/30..

Taiwan Patent Office Receives True Optinno Co Ltd Patent Application for Light-holder-and-light-emitting-member-separable Light Source Module

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Taiwan Patent Office has received True Optinno Co Ltd patent application for Light-holder-and-light-emitting-member-separable Light Source Module. Shih Jeng-chyan developed the invention. The patent application number is TW20230149797 20231220. The patent publication number is TW202526223 (A). International..

Taiwan Patent Office Publishes Globalwafers Co Ltd and Mradian Femto Sources Co Ltd Patent Application for Processing Method of Single Crystal Material and Processing Object

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Taiwan Patent Office has published Globalwafers Co Ltd and Mradian Femto Sources Co Ltd patent application for Processing Method of Single Crystal Material and Processing Object. The invention was developed by Lee Chien-chung, Wang Bo-kai and Shih Ying-ru. The patent application number is TW20240150304 2024..

State Intellectual Property Office of China Receives Shenji Semiconductor Tech Xuzhou Co Ltd Patent Application for Semiconductor Growth Apparatus

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has received Shenji Semiconductor Tech Xuzhou Co Ltd patent application for Semiconductor Growth Apparatus. Wang Shuai, Chen Liang and Xing Shuaikang developed the invention. The patent application number is CN202610107689 20260127. The patent publication number ..

Jiangsu Yingsu Integrated Circuit Equipment Co Ltd Submits Chinese Patent Application for Compensation Method and Compensation System for Improving Poor Exposure of Wafer Surface

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Jiangsu Yingsu Integrated Circuit Equipment Co Ltd has submitted a patent application for Compensation Method and Compensation System for Improving Poor Exposure of Wafer Surface. This invention was developed by He Jikui and Sang Kun. The patent application number is CN20251212630 20251229. The patent publ..

State Intellectual Property Office of China Releases Huazhong University of Science and Technology Patent Application for Internal Gain Type Radiation Detector Integrated with Thin..

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has released Huazhong University of Science and Technology patent application for Internal Gain Type Radiation Detector Integrated with Thin Film Field Effect Transistor. This invention was developed by Zhang Youwei, Lei Yuntao, He Xin and Wang Shun. The patent a..

European Patent Office Releases Univ Koc Patent Application for a Scalable Logic and Memory Device Based on Magnetic Skyrmions

Semiconductor

| Wed 10 Jun 2026

Munich, June 11 -- European Patent Office has released Univ Koc patent application for a Scalable Logic and Memory Device Based on Magnetic Skyrmions. This invention was developed by Mousavi Cheghabouri Arash and Onbasli Mehmet Cengiz. The patent application number is EP20230761255 20230727. The patent publication number is E..

State Intellectual Property Office of China Receives Dalian Hengkun New Mat Co Ltd Patent Application for Silicon Precursor Composition, High-density Doped Silicon Nitride Film, an..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has received Dalian Hengkun New Mat Co Ltd patent application for Silicon Precursor Composition, High-density Doped Silicon Nitride Film, and Preparation Method and Application of High-density Doped Silicon Nitride Film. Huo Yan, Mao Hongchao, Ji Dongxu, Wang Yingji..

State Intellectual Property Office of China Receives Shanghai Chuangyi Micro Material Tech Co Ltd Patent Application for Gas Uniformizing Structure for Feeding Gas in Circumferenti..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has received Shanghai Chuangyi Micro Material Tech Co Ltd patent application for Gas Uniformizing Structure for Feeding Gas in Circumferential Direction of Cavity and Semiconductor Processing Equipment Thereof. Dai Qimin and Tao Tengyun developed the invention. T..

Beijing Integrated Circuit Equipment Innovation Center Co Ltd Applies for Patent on Silicon Nitride Thin Film, Manufacturing Method of Semiconductor Device and Semiconductor Proces..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Beijing Integrated Circuit Equipment Innovation Center Co Ltd has applied Chinese patent for Silicon Nitride Thin Film, Manufacturing Method of Semiconductor Device and Semiconductor Process Equipment. Zhang Yuanming and Qin Fang developed it. The patent application number is CN202511686375 20251117. The p..

Shanghai Chuangyi Micro Material Tech Co Ltd Submits Patent Application for Carbon/nitrogen Atom Substitution-based Amorphous Silicon Oxide Material and Preparation Method and Equi..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Shanghai Chuangyi Micro Material Tech Co Ltd has submitted a patent application for Carbon/nitrogen Atom Substitution-based Amorphous Silicon Oxide Material and Preparation Method and Equipment Thereof. Fan Chenyao, Chen Xu and Tao Tengyun developed the invention. The patent application number is CN2025112..

Chengdu Hongchen Guangzi Semiconductor Tech Co Ltd Seeks Patent for Semiconductor Laser Cavity Surface Coating Method for Non-airtight Packaging

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Chengdu Hongchen Guangzi Semiconductor Tech Co Ltd has sought patent for Semiconductor Laser Cavity Surface Coating Method for Non-airtight Packaging. This invention was developed by Gong Wei, Zhu Zeyu, Hu Jun, Cha Sang-hwi and Zhang Yan. The patent application number is CN202610122049 20260129. The patent..

State Intellectual Property Office of China Receives Wuxi Boda Xinneng Tech Co Ltd Patent Application for Fullerene Film, Preparation Method Thereof and Solar Cell

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has received Wuxi Boda Xinneng Tech Co Ltd patent application for Fullerene Film, Preparation Method Thereof and Solar Cell. Song Zhiwei, Qian Binhui and Wu Yiliang developed the invention. The patent application number is CN202511998733 20251226. The patent publ..

Beijing Baogang Steel Tech Co Ltd Applies for Patent on Technological Method for Reducing Edge Breakage Defect of Copper-containing Oriented Silicon Steel

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Beijing Baogang Steel Tech Co Ltd has applied Chinese patent for Technological Method for Reducing Edge Breakage Defect of Copper-containing Oriented Silicon Steel. Feng Haitao, Lu Bin, Liu Pengcheng, Lu Xiaoyu, Hao Juanjuan, Wu Yuxuan, Wang Jungang, Jia Shengjian and Guo Yong developed it. The patent appl..

State Intellectual Property Office of China Releases Beijing Baogang Steel Tech Co Ltd Patent Application for Method for Pretreatment of Molten Silicon Steel By'three-time Slagging..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has released Beijing Baogang Steel Tech Co Ltd patent application for Method for Pretreatment of Molten Silicon Steel By'three-time Slagging-off and Two-time Desulfurization '. This invention was developed by Wang Jungang, Xu Tao, Cai Xuehui, Lu Bin, Zhao Ming, Liu ..

State Intellectual Property Office of China Receives Ningbo Medical Treatment Center Lihuili Hospital Ningbo University Lihuili Hospital and Jiangsu Aiweide Biotechnology Patent Ap..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has received Ningbo Medical Treatment Center Lihuili Hospital Ningbo University Lihuili Hospital and Jiangsu Aiweide Biotechnology patent application for Establishment and Application of Olfaction Bionic Chip Model Based on Organoid Technology. Shen Zhisen, Wu Yi, L..

State Intellectual Property Office of China Receives Hefei Comprehensive Science Center Environment Res Institute Patent Application for Micro-fluidic Chip for High-throughput Cont..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has received Hefei Comprehensive Science Center Environment Res Institute patent application for Micro-fluidic Chip for High-throughput Continuous Detection of Intestinal Barrier Function. Cheng Xiaowen, Wu Lijun, Wang Jie and Jiang Ke'er developed the invention. ..

Darwin Prec Industry Co Ltd Submits Chinese Patent Application for Active Organ Wafer and System Thereof

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Darwin Prec Industry Co Ltd has submitted a patent application for Active Organ Wafer and System Thereof. This invention was developed by Yang Tingjie and Li Qingfeng. The patent application number is CN202511664435 20251113. The patent publication number is CN121574820 (A). International Patent Classifica..

Shanghai Biochip Co Ltd Files Chinese Patent Application for Vascularized Organ Chip Capable of Collecting Multi-cell Co-culture or Organoid Metabolites in Situ for Multiple Times

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Shanghai Biochip Co Ltd has filed a patent application for Vascularized Organ Chip Capable of Collecting Multi-cell Co-culture or Organoid Metabolites in Situ for Multiple Times. This invention was developed by Xu Yichun, Su Jun, Yue Tao, Han Junsong, Koichi, Yang Huiying, Meng Jiaxu, Joo Kyung-ah, Zhou Jiaji..

State Intellectual Property Office of China Publishes Wuhan Dingze New Material Tech Co Ltd, Dingze Xiantao New Material Tech Co Ltd and Hubei Dinglong Co Ltd Patent Application fo..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has published Wuhan Dingze New Material Tech Co Ltd, Dingze Xiantao New Material Tech Co Ltd and Hubei Dinglong Co Ltd patent application for Wafer Cleaning Agent, Preparation Method Thereof and Wafer Processing Method. The invention was developed by Hu Pan, Hu Huai..

Inst Mechanical Mfg Tech China Acad Eng Physics Submits Patent Application for Ultra-smooth Magneto-rheological Polishing Slurry for Inhibiting Surface Defects of Monocrystalline S..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Inst Mechanical Mfg Tech China Acad Eng Physics has submitted a patent application for Ultra-smooth Magneto-rheological Polishing Slurry for Inhibiting Surface Defects of Monocrystalline Silicon and Polishing Method. Ye Minheng, Zhang Lianxin, Peng Zerun, Hai Kuo, Zhang Yunfei, Wu Fei, Wang Chao and Huang Wen..

Taiwan Patent Office Releases Novoray Lianyungang Co Ltd Patent Application for Alkali-resistant Spherical Silica Slurry for Package Substrate and Preparation Method Therefor

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Taiwan Patent Office has released Novoray Lianyungang Co Ltd patent application for Alkali-resistant Spherical Silica Slurry for Package Substrate and Preparation Method Therefor. This invention was developed by Sun Xiao-yao, Cao Jia-kai, Zhang Jian-ping, Fu En-xiang, Xu Dong, Hou Peng-xin, Dong Xing-da, Pan Y..

Taiwan Patent Office Releases DNJO Technologies Co Ltd Patent Application for Wafer Box and Manufacturing Method Thereof Wherein the Wafer Box Includes a Wafer Box Body, a Barrier ..

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Taiwan Patent Office has released DNJO Technologies Co Ltd patent application for Wafer Box and Manufacturing Method Thereof Wherein the Wafer Box Includes a Wafer Box Body, a Barrier Layer Containing a Metallic Material, a Carrying Unit, and a Sealing Door. This invention was developed by Chen Yen-fang. Th..

Industrial Technology Research Institute Seeks Patent for Buffer Assembly and Transmission Assembly

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Industrial Technology Research Institute has sought patent for Buffer Assembly and Transmission Assembly. This invention was developed by Tsai Chien-an, Wu Sung-yi, Peng Yen-chia, Zheng Sh-xian, Hu Ming-tao, Hung Chen-wei, Ko Wen-ching and Lee Shih-chi. The patent application number is TW20230150967 2023122..

Taiwan Patent Office Publishes Huang Chen Cheng, Huang Pao Hao and Huang Pao Han Patent Application for Flexible Faux Leather Fabric with Non-foaming Substrate and Flexible Body Ma..

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Taiwan Patent Office has published Huang Chen Cheng, Huang Pao Hao and Huang Pao Han patent application for Flexible Faux Leather Fabric with Non-foaming Substrate and Flexible Body Made of Thermoplastic Homogeneous Materials. The patent application number is TW20230149089 20231215. The patent publication numb..

Bangcui Shanghai Communication Co Ltd Seeks Patent for Rdl Layer Design Method for Back-end Layout of Integrated Circuit

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Bangcui Shanghai Communication Co Ltd has sought patent for Rdl Layer Design Method for Back-end Layout of Integrated Circuit. This invention was developed by Yang Yutuo, Liu Lihui, Zhang Shaowei, Fan Xiang and Li Baoxin. The patent application number is CN202511757136 20251127. The patent publication numb..

State Intellectual Property Office of China Publishes Beijing Zhuhe Tech Co Ltd Patent Application for MEMS (micro Electro Mechanical System) Three-cavity Atomic Gas Chamber, Prepa..

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has published Beijing Zhuhe Tech Co Ltd patent application for MEMS (micro Electro Mechanical System) Three-cavity Atomic Gas Chamber, Preparation Method of MEMS Three-cavity Atomic Gas Chamber and Rubidium Filling Method. The invention was developed by Lu Liwei, Ya..

Shanghai Tongkai Information Tech Co Ltd Submits Patent Application for Multi-wavelength Semiconductor Laser Digital Lighting Device

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Shanghai Tongkai Information Tech Co Ltd has submitted a patent application for Multi-wavelength Semiconductor Laser Digital Lighting Device. Wen Deyin developed the invention. The patent application number is CN20261032272 20260112. The patent publication number is CN121578579 (A). International Patent Cl..

CE Cell Eng GmbH Submits European Patent Application for Method for Improving the Ohmic Contact Behavior of a Contact Grid of a Silicon Solar Cell and Apparatus for Carrying Out th..

Semiconductor

| Wed 10 Jun 2026

Munich, June 11 -- CE Cell Eng GmbH has submitted a patent application for Method for Improving the Ohmic Contact Behavior of a Contact Grid of a Silicon Solar Cell and Apparatus for Carrying Out the Method. This invention was developed by Hofmuller Eckehard and Stockel Stefan. The patent application number is EP20240772204 2..

European Patent Office Receives CE Cell Eng GmbH Patent Application for Method for Improving the Contacting of a Silicon Solar Cell

Semiconductor

| Wed 10 Jun 2026

Munich, June 11 -- European Patent Office has received CE Cell Eng GmbH patent application for Method for Improving the Contacting of a Silicon Solar Cell. Krassowski Eve, Hofmuller Eckehard and Stockel Stefan developed the invention. The patent application number is EP20240764762 20240725. The patent publication number is EP..

Jiangxi Xinshijia Optoelectronics Tech Co Ltd Files Chinese Patent Application for Process Method for Improving Brightness of Silicon-based OLED

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Jiangxi Xinshijia Optoelectronics Tech Co Ltd has filed a patent application for Process Method for Improving Brightness of Silicon-based OLED. This invention was developed by Sun Sheng, Jin Fangming and Wu Jianjun. The patent application number is CN20251211117 20251229. The patent publication number is C..

Tuojing Jianke Haining Semiconductor Equipment Submits Patent Application for Control Device and Method and Storage Medium

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Tuojing Jianke Haining Semiconductor Equipment has submitted a patent application for Control Device and Method and Storage Medium. Ji Xiang developed the invention. The patent application number is CN202511913360 20251217. The patent publication number is CN121578466 (A). International Patent Classificati..

Shanghai Xihe Tech Co Ltd Submits Chinese Patent Application for Resonator and Photon Chip

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Shanghai Xihe Tech Co Ltd has submitted a patent application for Resonator and Photon Chip. This invention was developed by Qiu Chao, Liang Hong and Wu Aimin. The patent application number is CN20261070867 20260120. The patent publication number is CN121578448 (A). International Patent Classification codes..

Beijing Hotdoor Tech Co Ltd Submits Patent Application for Test Screening Method and System for Enhancing Electrical Interference Resistance of Chip

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Beijing Hotdoor Tech Co Ltd has submitted a patent application for Test Screening Method and System for Enhancing Electrical Interference Resistance of Chip. Zhou Zhendi developed the invention. The patent application number is CN202511743994 20251125. The patent publication number is CN121578092 (A). Inte..

Shenzhen Yintongshang Intelligent Card Co Ltd Submits Chinese Patent Application for Risc-v-based Controllable Smart Card Chip Security Scheduling System

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Shenzhen Yintongshang Intelligent Card Co Ltd has submitted a patent application for Risc-v-based Controllable Smart Card Chip Security Scheduling System. This invention was developed by Gao Pengsheng and Liang Youlin. The patent application number is CN20261083640 20260122. The patent publication number i..

Jiangsu Heyi Guangxian Tech Co Ltd Applies for Patent on Multi-piece Rotary OLED Test Probe Jig

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Jiangsu Heyi Guangxian Tech Co Ltd has applied Chinese patent for Multi-piece Rotary OLED Test Probe Jig. Cui Tasheng and Huang Xingyang developed it. The patent application number is CN202511807721 20251203. The patent publication number is CN121578029 (A). International Patent Classification codes are G0..

Jiangsu Heyi Guangxian Tech Co Ltd Submits Chinese Patent Application for Automatic Resistance Detection Art Machine Suitable for OLED Flexible Display

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Jiangsu Heyi Guangxian Tech Co Ltd has submitted a patent application for Automatic Resistance Detection Art Machine Suitable for OLED Flexible Display. This invention was developed by Zhou Kai and Fu Zhenhua. The patent application number is CN202511753737 20251126. The patent publication number is CN1215..

State Intellectual Property Office of China Releases Xiamen Caiyang Electronics Co Ltd Patent Application for Integrated Shunt Type Current Detection Chip Module Carrying PWM (puls..

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has released Xiamen Caiyang Electronics Co Ltd patent application for Integrated Shunt Type Current Detection Chip Module Carrying PWM (pulse Width Modulation) Module. This invention was developed by Luo Jie, Wu Liangwen, Li Fenzhan and Zhou Yuwei. The patent app..

Unisic Electronics Suzhou Co Ltd Submits Patent Application for Multi-pin Connector Butt Joint Device for Testing Power Semiconductor Device

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Unisic Electronics Suzhou Co Ltd has submitted a patent application for Multi-pin Connector Butt Joint Device for Testing Power Semiconductor Device. Liu Yinhang and Mao Saijun developed the invention. The patent application number is CN202511968651 20251224. The patent publication number is CN121577937 (A..

State Intellectual Property Office of China Receives Shandong Huaguang Optoelectronics Patent Application for Temperature Oscillation Growth Method for Improving Uniformity of Gaas..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has received Shandong Huaguang Optoelectronics patent application for Temperature Oscillation Growth Method for Improving Uniformity of Gaas Epitaxial Layer. Yu Ying, Wu Dehua, Zheng Zhaohe, Yang Lei and Liu Fei developed the invention. The patent application num..

Qinghai Jinko Energy Co Ltd Seeks Patent for Single Crystal Furnace, Single Crystal Silicon Rod Drawing Method and Silicon Wafer

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Qinghai Jinko Energy Co Ltd has sought patent for Single Crystal Furnace, Single Crystal Silicon Rod Drawing Method and Silicon Wafer. This invention was developed by Geng Chengkang. The patent application number is CN202511946541 20251222. The patent publication number is CN121575480 (A). International Pa..

State Intellectual Property Office of China Publishes Jiaxing Zongjing Tech Co Ltd Patent Application for Method for Continuously Growing Super-thick Silicon Carbide Crystals

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has published Jiaxing Zongjing Tech Co Ltd patent application for Method for Continuously Growing Super-thick Silicon Carbide Crystals. The invention was developed by Zheng Xianming, Pang Haodong, Yang Heok, Zuo Leijie and Huo Aoxiang. The patent application numb..

State Intellectual Property Office of China Receives Yuangang Aodawan Area Guangdong Quantum Science Center Patent Application for Device and Method for Growing Silicon Carbide Sin..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has received Yuangang Aodawan Area Guangdong Quantum Science Center patent application for Device and Method for Growing Silicon Carbide Single Crystals by Liquid Phase Method. Li Chen, Lu Yuanhao, Li Haochao, Dong Lei, Ke Shanming and Tang Shuxian developed the inv..

DC Branch of State Grid Henan Electric Power Company Applies for Patent on Anodic Oxidation or Platinum Electroplating Tool Clamp Suitable for Complex Inner Cavity

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- DC Branch of State Grid Henan Electric Power Company has applied Chinese patent for Anodic Oxidation or Platinum Electroplating Tool Clamp Suitable for Complex Inner Cavity. Liao Huilian, Liu Tianzuo, Li Lin, Wang Shanlei, Chang Dongxu, Wang Tao, Zhang Qianxu, Wang Jiahui, Wei Zhen, Zhang Xu, Li Xiangyu, Li W..

Nanjing Arts and Crafts Co Ltd Submits Chinese Patent Application for Metal Product Electroplating Device and Method Facilitating Uniform Electroplating

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Nanjing Arts and Crafts Co Ltd has submitted a patent application for Metal Product Electroplating Device and Method Facilitating Uniform Electroplating. This invention was developed by Ni Jingjing and Gao Jiang. The patent application number is CN20251206059 20251229. The patent publication number is CN12..

Jiangsu Novoray New Mat Co Ltd Submits Patent Application for Hollow Silicon Dioxide Microsphere and Preparation Method Thereof

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Jiangsu Novoray New Mat Co Ltd has submitted a patent application for Hollow Silicon Dioxide Microsphere and Preparation Method Thereof. Cao Jiakai, Yang Chunhao and Zhang Jianping developed the invention. The patent application number is CN202511915410 20251218. The patent publication number is CN12157368..

China Catalyst Holding Co Ltd Submits Chinese Patent Application for Colloidal Silicon Dioxide with Controllable Association Degree as Well as Preparation Method and Application of..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- China Catalyst Holding Co Ltd has submitted a patent application for Colloidal Silicon Dioxide with Controllable Association Degree as Well as Preparation Method and Application of Colloidal Silicon Dioxide. This invention was developed by Wang Chunyan, Li Yanxin, Hu Yiming, Jiang Jiawei, Sun Hongliang, Xu Ji..

Chongqing Zhuangsifei Intelligent Equipment Co Ltd Applies for Patent on Preparation Method and System for Producing High-purity Silicon Carbide Raw Material by Using Silica Aeroge..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Chongqing Zhuangsifei Intelligent Equipment Co Ltd has applied Chinese patent for Preparation Method and System for Producing High-purity Silicon Carbide Raw Material by Using Silica Aerogel. Yuan Jiahu developed it. The patent application number is CN202511868188 20251211. The patent publication number is..

State Intellectual Property Office of China Publishes Hefei Quanzhi Kongtian Information Ultra High Frequency Semiconductor Res Institute Co Ltd and HatChip Patent Application for ..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has published Hefei Quanzhi Kongtian Information Ultra High Frequency Semiconductor Res Institute Co Ltd and HatChip patent application for Method for Processing Surface of Cavity on Silicon Substrate. The invention was developed by Zhang Tianchen. The patent app..

Huace Xindong Semiconductor Tech Suzhou Co Ltd Seeks Patent for Feeding Device Applied to Chip Detection

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Huace Xindong Semiconductor Tech Suzhou Co Ltd has sought patent for Feeding Device Applied to Chip Detection. This invention was developed by Kim Ki-yong. The patent application number is CN202511860267 20251210. The patent publication number is CN121573345 (A). International Patent Classification codes a..

Shengke Nano Suzhou Co Ltd Applies for Patent on Storage Device of Semiconductor Integrated Circuit Wafer

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Shengke Nano Suzhou Co Ltd has applied Chinese patent for Storage Device of Semiconductor Integrated Circuit Wafer. Hua Younan, Wang Chuanzeng, Chen Longji, Chen Chao and Li Xiaomin developed it. The patent application number is CN202511718249 20251121. The patent publication number is CN121573327 (A). Int..

European Patent Office Receives Imec VZW and Ghent University Patent Application for a Method for Preparing an Array of Integrated Circuit Devices for Transfer Printing, a Method f..

Semiconductor

| Wed 10 Jun 2026

Munich, June 11 -- European Patent Office has received Imec VZW and Ghent University patent application for a Method for Preparing an Array of Integrated Circuit Devices for Transfer Printing, a Method for Transfer Printing, and an Assembly of Integrated Circuit Devices for Transfer Printing. Chen Ye, Kannojia Harindra Kumar, Va..

State Intellectual Property Office of China Receives Haiguang Yunxin Integrated Circuit Design Shanghai Co Ltd Patent Application for Scanning Test Device and Method and Chip

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has received Haiguang Yunxin Integrated Circuit Design Shanghai Co Ltd patent application for Scanning Test Device and Method and Chip. Zheng Xin, Zhang Xinbiao and Zeng Hui developed the invention. The patent application number is CN202511844732 20251208. The pa..

State Intellectual Property Office of China Releases Haiguang Yunxin Integrated Circuit Design Shanghai Co Ltd Patent Application for Scanning Test Device and Method and Chip

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has released Haiguang Yunxin Integrated Circuit Design Shanghai Co Ltd patent application for Scanning Test Device and Method and Chip. This invention was developed by Zheng Xin, Zhang Xinbiao and Zeng Hui. The patent application number is CN202511844713 20251208..

State Intellectual Property Office of China Receives Ningbo Yuanxin Electronic Co Ltd Patent Application for Electronic Ink Screen Driving Substrate Batch Detection System and Meth..

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has received Ningbo Yuanxin Electronic Co Ltd patent application for Electronic Ink Screen Driving Substrate Batch Detection System and Method. Zhao Zhong, Lu Zhaojing, Ren Tao, Chen Zhiqiang and Chen Weining developed the invention. The patent application number..

Shenzhen Secon Technical Ind Co Ltd Submits Patent Application for Rotary Test Fixture for Air-cooled High and Low Temperature Chip

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Shenzhen Secon Technical Ind Co Ltd has submitted a patent application for Rotary Test Fixture for Air-cooled High and Low Temperature Chip. Jin Yingjie and Liang Zhixian developed the invention. The patent application number is CN202511875622 20251212. The patent publication number is CN121578097 (A). Int..

State Intellectual Property Office of China Receives Jiangxi Taikay New Mat Co Ltd Patent Application for High-refractive-index Nano Silicon Resin Optical Coating and Preparation M..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has received Jiangxi Taikay New Mat Co Ltd patent application for High-refractive-index Nano Silicon Resin Optical Coating and Preparation Method Thereof. Qiu Xiaoqing developed the invention. The patent application number is CN20261015192 20260107. The patent pu..

State Intellectual Property Office of China Publishes Nippon Paint China Co Ltd Patent Application for High-tolerance Organic Silicon Elastic Styrene-acrylic Emulsion Interior Wall..

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- State Intellectual Property Office of China has published Nippon Paint China Co Ltd patent application for High-tolerance Organic Silicon Elastic Styrene-acrylic Emulsion Interior Wall Coating and Preparation Method Thereof. The invention was developed by Zhang Li and Liu Songjie. The patent application nu..

Shandong Link Science And Tech Co Ltd Seeks Patent for Production Method of Silicon Dioxide Slurry for Wet Mixing of Rubber

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Shandong Link Science And Tech Co Ltd has sought patent for Production Method of Silicon Dioxide Slurry for Wet Mixing of Rubber. This invention was developed by Xu Hongxin, Guo Chengshun, Li Peng, Wang Pengguo, Guo Fengtao and Chen Hongwei. The patent application number is CN202511577359 20251031. The pat..

Dong Haiming Seeks Patent for Technology for Continuously Preparing Silicon Nitride Material by Adopting Direct Nitriding Method

Semiconductor

| Thu 11 Jun 2026

Beijing, June 11 -- Dong Haiming has sought patent for Technology for Continuously Preparing Silicon Nitride Material by Adopting Direct Nitriding Method. This invention was developed by Dong Haiming. The patent application number is CN202511314591 20250915. The patent publication number is CN121573995 (A). International Pate..

Samsung Electronics Files Taiwan Patent Application for Semiconductor Devices and Method of Operating the Same

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Samsung Electronics has filed a patent application for Semiconductor Devices and Method of Operating the Same. This invention was developed by Shon Yoo-seok, Kim Se-hun, Kwon Yun-ju, Kim Won-soo, Yuk Sae-na and Choi Youn-sik. The patent application number is TW20240135141 20240916. The patent publication nu..

Everbliss Green Co Ltd Submits Patent Application for Integrated Photolithography Process System That Can Reduce Unnecessary Transportation and Waiting Time, Helping to Reduce Prod..

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Everbliss Green Co Ltd has submitted a patent application for Integrated Photolithography Process System That Can Reduce Unnecessary Transportation and Waiting Time, Helping to Reduce Production Costs and Improve Production Efficiency, Especially in Terms of Facility Energy Consumption and Can Minimize the Req..

Hamamatsu Photonics Submits Taiwan Patent Application for Detection Device

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Hamamatsu Photonics has submitted a patent application for Detection Device. This invention was developed by Muramatsu Terukimi, Matsudaira Wataru, Kageyama Akihiro and Fukasawa Atsuhito. The patent application number is TW20240135252 20240918. The patent publication number is TW202526365 (A). International..

Taiwan Patent Office Releases Hye Technology Co Ltd Patent Application for Multi-optical Inspection Module for Semiconductor Equipment Comprising an Imaging Unit and an Illuminatio..

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Taiwan Patent Office has released Hye Technology Co Ltd patent application for Multi-optical Inspection Module for Semiconductor Equipment Comprising an Imaging Unit and an Illumination Unit for Optimizing the Inspection Resolution. This invention was developed by Zhu Jun-long and Zheng Jing-hong. The paten..

Taiwan-Asia Semiconductor Seeks Patent for Semiconductor Component Inpection Device and Inpection Method Thereof

Semiconductor

| Thu 11 Jun 2026

Taipei, June 11 -- Taiwan-Asia Semiconductor has sought patent for Semiconductor Component Inpection Device and Inpection Method Thereof. This invention was developed by Hsu Ya-wen. The patent application number is TW20230151700 20231229. The patent publication number is TW202526299 (A). International Patent Classification co..

Wuhan Institute Of Artificial Intelligence Peking Univ and Beijing University Applies for Patent on Multi-instruction Storage and Calculation Integrated Chip Architecture Based on ..

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Wuhan Institute Of Artificial Intelligence Peking Univ and Beijing University has applied Chinese patent for Multi-instruction Storage and Calculation Integrated Chip Architecture Based on Memristor Array. Yang Yuchao, Li Zhiyuan, Tao Yaoyu, Zhu Yihang, Xia Wenhua, Chen Rui and Wu Zhiqiang developed it. Th..

Shanghai Fangyi Wanqiang Microelectronic Co Ltd Applies for Patent on Multi-core-particle Management System Based on Micro Substrate Controller in Io Interconnection Core Particles

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Shanghai Fangyi Wanqiang Microelectronic Co Ltd has applied Chinese patent for Multi-core-particle Management System Based on Micro Substrate Controller in Io Interconnection Core Particles. He Wei and Chen Weirong developed it. The patent application number is CN202610106598 20260127. The patent publicati..

Dingdao Zhixin (Shanghai) Semiconductor Submits Chinese Patent Application for Temperature Control Method and System-on-chip

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Dingdao Zhixin (Shanghai) Semiconductor has submitted a patent application for Temperature Control Method and System-on-chip. This invention was developed by Liu Qian and Wang Peng. The patent application number is CN202511798117 20251201. The patent publication number is CN121578829 (A). International Pat..

Institute of Semiconductors, Chinese Academy of Sciences Submits Chinese Patent Application for Optical Neural Network Calculation System and Method Based on Time Domain Excitation..

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Institute of Semiconductors, Chinese Academy of Sciences has submitted a patent application for Optical Neural Network Calculation System and Method Based on Time Domain Excitation Characteristics. This invention was developed by Yang Hao, Zheng Wanhua, Wang Hailing, Sun Guangliang, Chen Ningning and Wang Zey..

Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd Applies for Patent on Method for Detecting Oxygen Precipitation of Heavily Doped Silicon Single Crystal

Semiconductor

| Wed 10 Jun 2026

Beijing, June 11 -- Ningxia Zhongxin Jingyuan Semiconductor Tech Co Ltd has applied Chinese patent for Method for Detecting Oxygen Precipitation of Heavily Doped Silicon Single Crystal. Xu Jiamei, Wang Ruonan, Chen Guozhe, Ma Wenlin, Liu Kun and Ran Zeping developed it. The patent application number is CN202511994225 20251226..

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