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Semiconductor
| Mon 23 Feb 2026
Munich, Feb. 24 -- Geehy Microelectronics Inc has sought patent for Chip, Communication Method, and Consumable Box. This invention was developed by Huang Jingjing.
The patent application number is EP20240911302 20241226. The patent publication number is EP4697128 (A1). International Patent Classification code is G06F1/04. Coo..
Semiconductor
| Mon 23 Feb 2026
Munich, Feb. 24 -- Black Semiconductor Netherlands BV has submitted a patent application for Method and Apparatus for Mechanical Cleaning of 2D Materials Surfaces. This invention was developed by Van Rijn Richard, Barnes Matthew David and Wehenkel Dominique Joseph.
The patent application number is EP20240720913 20240411. The ..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has published Husheng Tech Shenzhen Co Ltd patent application for Metal Oxide Semiconductor (MOS) Tube Based on Gallium Nitride and Preparation Method Thereof. The invention was developed by Wu Sanzhong.
The patent application number is CN202510705111 20250529. T..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has published Wuyuan Semiconductor Tech Qingdao Co Ltd patent application for Memory Packaging Structure and Packaging Method Thereof. The invention was developed by Xu Ruijiao, Yan Guochao and Su Yunxing.
The patent application number is CN202510661672 20250522...
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Nanjing Langli Mat Co Ltd has filed a patent application for LTCC (low Temperature Co-fired Ceramic) Substrate Assembly and Eutectic Sintering Process Method Thereof. This invention was developed by Zhang Yifang, Shen Jian and Liu Yu.
The patent application number is CN202511107113 20250808. The patent pub..
Semiconductor
| Mon 23 Feb 2026
Munich, Feb. 24 -- Inst Fuer Solarenergieforschung GmbH has applied European patent for Solar Cell with Narrow Connecting Region Between Contact Finger and Busbar. Daschinger Thomas, Brendelmühl Till, Min Byungsul and Schulte-huxel Henning developed it.
The patent application number is EP20240718422 20240408. The patent publ..
Semiconductor
| Mon 23 Feb 2026
Munich, Feb. 24 -- European Patent Office has received Edgecortix Inc patent application for Integrated Circuits, Systems, and Methods for Multiple-precision Multiply-and-accumulate Operation. Cherlapally Anudeep, Nez Nikolay and Vilchez Antonio Tomas Nevado developed the invention.
The patent application number is EP20240789..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Hangzhou Herui Semiconductor Tech Co Ltd has sought patent for Semiconductor Packaging Control Parameter Self-adaption Method and System Based on Environment Perception. This invention was developed by Hu Xiaowen, Wang Xin and Lu Chunmao.
The patent application number is CN202510554402 20250429. The patent..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Baiwei Taizhou Beer Co Ltd has submitted a patent application for Light Guide System Capable of Uniformly Emitting Light. This invention was developed by Weng Xiaoqiang, Lu Xiaoming, Xu Dengshan, Liu Xinzhong, Wu Caizheng, Xu Shigong and Wang Junwu.
The patent application number is CN202510869030 20250626...
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Shanghai Yuezhi Semiconductor Tech Co Ltd has applied Chinese patent for Sealing Device. Ren Ru, He Shengcan and Zeng Zhiyong developed it.
The patent application number is CN202510825486 20250619. The patent publication number is CN120608955 (A). International Patent Classification codes are F16J15/06, F1..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Nanjing Nari Semiconductor Co Ltd and State Grid Electric Power Res Institute have submitted a patent application for Elastic Assembly for Modulating High-frequency Oscillation Characteristic. This invention was developed by Xu Hongwu, Mo Shenyang, Hua Qingyuan, Dong Zhiyi, Huang Shan and Cheng Yongfeng.
T..
Semiconductor
| Mon 23 Feb 2026
Munich, Feb. 24 -- Teikoku Taping System Co Ltd has submitted a patent application for Mounter Device, Tape Peeling Device, Substrate Transfer Device, Tape Peeling Method, and Substrate Transfer Method. This invention was developed by Lee Hiromitsu and Katsushima Yoshinori.
The patent application number is EP20240788666 20240..
Semiconductor
| Mon 23 Feb 2026
Munich, Feb. 24 -- Commissariat Energie Atomique has filed a patent application for Magnetoresistive Memory with Integrated Selectors. This invention was developed by Viala Bernard and Ly Denys.
The patent application number is EP20250195065 20250811. The patent publication number is EP4697332 (A1). International Patent Class..
Semiconductor
| Mon 23 Feb 2026
Munich, Feb. 24 -- CXMT has applied European patent for Memory. Shang Weibing, Wu Xianjun, Qiu Anping, Lu Yaohua, Liu Lu, Xu Jing and Shao Tong developed it.
The patent application number is EP20250770923 20250521. The patent publication number is EP4697331 (A1). International Patent Classification codes are G11C5/02 and G11C..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Ninghai Youxin Moulding Co Ltd has applied Chinese patent for Cleaning Device for Wafer Box Cover Mold. Wu Xianwu, Wu Xianxin and Jin Nengjie developed it.
The patent application number is CN202510952033 20250710. The patent publication number is CN120620558 (A). International Patent Classification codes a..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has published Jiangsu Fulehua Power Semiconductor Research Institute and Jiangsu Fulehua Semiconductor Technology patent application for Ceramic Substrate Laser Processing Method. The invention was developed by Guan Pengfei, Zhou Pengcheng, Liu Jingkun and Tang Dong..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has released Zhangjiagang Ultrasonic Electric Co Ltd patent application for Silicon Wafer Blocking Mechanism, Silicon Wafer Cleaning Equipment and Silicon Wafer Cleaning Method. This invention was developed by Zhou Xidong, Lu Jinjin, Ding Xiao and Wang Jiawei.
Th..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Beijing Shangyin Microchip Tech Co Ltd has submitted a patent application for Traffic Early Warning Method for Micro-service Interface and Related Device. This invention was developed by Dong Fangjie.
The patent application number is CN202510933593 20250707. The patent publication number is CN120614281 (A)..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has received University of Electronic Science and Technology of China patent application for Terahertz On-chip Diffraction Neural Network with Nonlinear Function. Gao Xin, Wang Lan, Lan Feng, Xia Chaoming, Huang Zitong, Liu Dongyang and Di Xudong developed the inven..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Huawei Technologies has submitted a patent application for Chip Layout Method and Device. This invention was developed by Hiraki Nagao, Tang Zhentao, Xu Siyuan, Wu Hongzhong and Wang Bin.
The patent application number is CN202410276429 20240308. The patent publication number is CN120611689 (A). Internation..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Shanghai Hongkuai Tech Co Ltd has submitted a patent application for Character Batch Modification Method and Device in Chip Packaging Design, Equipment and Medium. Liu Yili, Wu Tao, Wang Zhijun and Liu Yixin developed the invention.
The patent application number is CN202510818348 20250618. The patent publi..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has received Zhejiang Tengchen New Energy Tech Co Ltd patent application for Intelligent Gas Meter Seal Based on Embedded Chip and Data Processing Method. Wu Zuoping and Fang Hui developed the invention.
The patent application number is CN202510599118 20250510. T..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has published Nantong Ruisheng Power Tech Co Ltd patent application for Autonomous Navigation and Positioning Method for Semiconductor Mechanical Arm Based on AI Vision. The invention was developed by Chen Haixu.
The patent application number is CN20251181642 202..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Anhui Zhongke Hengan Safety Tech Co Ltd has submitted a patent application for Normal-pressure Preparation Method and Continuous Production Device of Silicon Dioxide Aerogel Heat Insulation Composite Material. This invention was developed by Zhang Heping, Pan Yuelei and Cheng Xudong.
The patent application..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has released Miracle Line Ba Shanghai New Mat Co Ltd patent application for Device and Process for Preparing Chip Binding Thermocuring Tough Adhesive. This invention was developed by Lou Jun, He Weilin and Zhang Tonglu.
The patent application number is CN20251075..
Semiconductor
| Tue 24 Feb 2026
Munich, Feb. 24 -- Huawei Technologies has applied European patent for Communication Method, Device, System, Chip, Medium, and Program Product. Zhang Zhiqin, Feng Zhao, Zhu Haoren and Wang Yuan developed it.
The patent application number is EP20240802815 20240428. The patent publication number is EP4697802 (A1). International..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Beijing Wyton Yuncheng Glass Products Co Ltd has filed a patent application for Process Method for Frosted Gold Stamping on Surface of Glass Substrate. This invention was developed by Yu Weiming, Wu Ying and Wang Jianzhao.
The patent application number is CN202510855506 20250625. The patent publication num..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has released Guangdong Nanhai Etetb Tech Co Ltd and Foshan Yalanshi Tech Co Ltd patent application for Pattern Marking Method for Surface of Solar Cell. This invention was developed by Huang Lianghui, Jiang Yunzi, Liu Jiajing and Hu Yongneng.
The patent applicati..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Shanghai Mifang Elect Tech Co Ltd has submitted a patent application for Different-layer Positioning Compensation Method for Substrate Position Error Compensation in Printing Process. Li Zhiqiang and Zhou Wen developed the invention.
The patent application number is CN202510698765 20250528. The patent publ..
Semiconductor
| Mon 23 Feb 2026
Munich, Feb. 24 -- European Patent Office has released LG Innotek Co Ltd and National University Pusan Industry University Cooperation Foundation patent application for Antenna Substrate and Front End Module Including Same. This invention was developed by Yang Chan Woo, Lim Kyung Ho, Kim Sang Kil and Kim Do Hyun.
The patent a..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Jiangsu Heyi Guangxian Tech Co Ltd has submitted a patent application for Adjustable OLED (organic Light Emitting Diode) Screen Laminating Equipment. This invention was developed by Li Dean and He Runfei.
The patent application number is CN202510725215 20250603. The patent publication number is CN120620681..
Semiconductor
| Mon 23 Feb 2026
Munich, Feb. 24 -- Intel has sought patent for Airflow Distribution to Cool Memory Module Shadowed by the Processor. This invention was developed by Macdonald Mark, Heymann Douglas, Limaye Ameya, Beyer Debra and Kim Sung Ki.
The patent application number is EP20250188104 20250708. The patent publication number is EP4697137 (A..
Semiconductor
| Mon 23 Feb 2026
Munich, Feb. 24 -- Shen Zhen Holy Zen Tech Co Ltd has submitted a patent application for Non-film-forming Matrix, Photopolymer, Film, Preparation Method and Substrate. This invention was developed by Shen Bozhong.
The patent application number is EP20240895465 20240523. The patent publication number is EP4697097 (A1). Interna..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Fujian Haotian Construction Ind Co Ltd has submitted a patent application for Shearing Equipment for Producing Organic Silicon Asphalt Blanket. This invention was developed by Ning Zijian, Huang Yujing, Xu Bin, Chen Fangyuan, Zhan Chao, Zhou Jie, Li Sufang and Hou Suling.
The patent application number is C..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has received Jingdezhen Ceramic Institute patent application for Accurate Control Device for Mechanical Arm Joint Adjustment. Zhan Tangsen, Zhan Qingyuan, Qian Shuilong and Shi Jing developed the invention.
The patent application number is CN202510709919 20250529..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Jiaxing Ruiqing Medical Tech Co Ltd has sought patent for Gas-jet Silicon Nitride-hydrogel Microspheres and Preparation Method Thereof. This invention was developed by Cao Zheng, Tang Xunmeng, Yang Junyi and Wang Shuo.
The patent application number is CN202510674527 20250523. The patent publication number ..
Semiconductor
| Mon 23 Feb 2026
Munich, Feb. 24 -- Ecofusions GmbH I Gr has submitted a patent application for Colouring Composition for the Printing and/or Dyeing of Textiles, Method for the Printing and/or Dyeing of Textiles, and Printed Substrate. Steveninck Etienne developed the invention.
The patent application number is EP20240194924 20240816. The pat..
Semiconductor
| Mon 23 Feb 2026
Munich, Feb. 24 -- Yokogawa Electric has submitted a patent application for Cell Suction System. This invention was developed by Harami Satoru, Imai Yuya and Kuwata Masahiro.
The patent application number is EP20250193807 20250804. The patent publication number is EP4696767 (A1). International Patent Classification codes are ..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Zhejiang Fulede Quartz Tech Co Ltd has submitted a patent application for Processing Equipment and Processing Method of Quartz Bracket for Chip Manufacturing Process. Zhou Sheng, Wang Jun, Huang Peihong and Yang Jun developed the invention.
The patent application number is CN20251174700 20250801. The paten..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has received Xi'an ESWIN Material Technology and Xi'an Eswin Silicon Wafer Technology patent application for Adsorption Pad, Polishing Equipment and Silicon Wafer. Yuan Songbai developed the invention.
The patent application number is CN202510789288 20250613. The..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has received Hanglingwei (Taizhou) Technology patent application for Semiconductor Processing Equipment with Fine Trimming Function. Zhu Hongbo, He Ping, Li Changzhe, Hu Zhihua and Wang Zhongmao developed the invention.
The patent application number is CN20251111..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has published Suzhou Jiahe Semiconductor Co Ltd patent application for Non-contact Plasma Polishing Device and Method for Gallium Oxide Wafer. The invention was developed by Qi Song, Tang Minglei, Liu Jiahang, Ji Xueqiang, Li Shan and Tang Weihua.
The patent appl..
Semiconductor
| Mon 23 Feb 2026
Munich, Feb. 24 -- European Patent Office has published Avicena Technology patent application for Optically Interconnected High Bandwidth Memory Architectures. The invention was developed by Min Sunghwan, Pezeshki Bardia, Kalman Rob and Afifi Emad.
The patent application number is EP20240789460 20240411. The patent publicatio..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Suzhou Xianzhun Electronic Tech Co Ltd has filed a patent application for Semiconductor Silicon Wafer Laser Welding Equipment. This invention was developed by Zhou Dongshuai, Yang Zhiwei, Sun Shuyang and Xu Tianjian.
The patent application number is CN202510581614 20250507. The patent publication number is..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has published Jiangsu Chuangying Solar Energy Tech Co Ltd patent application for Crystalline Silicon Cell Laser Modification Assembly and Application Method Thereof. The invention was developed by Long Junyao and Huang Zhirong.
The patent application number is CN..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has received Hebei Yutian Material Tech Co Ltd patent application for Diffusion Welding Method for Aluminum-based Silicon Carbide. Chen Xiaoguang, Wang Tao, Hu Tiankuo, Niu Tianxing, Zhang Shan, Ma Guangchao and Li Boyuan developed the invention.
The patent appli..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has published Shenzhen Hyuda Electronics & Tech Co Ltd patent application for Method for Welding Radiator on Chip and PCB (printed Circuit Board) Assembly. The invention was developed by Fang Chengfen.
The patent application number is CN202510821796 20250619. The..
Semiconductor
| Mon 23 Feb 2026
Munich, Feb. 24 -- Xilinx has submitted a patent application for Aligning Multi-chip Devices. This invention was developed by Voogel Martin L.
The patent application number is EP20240713357 20240229. The patent publication number is EP4695842 (A1). Cooperative Patent Classification codes are G06F30/347 (US), G06F30/396 (US), ..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has published Hangzhou Hesheng Tech Co Ltd patent application for Circuit System and Chip for Realizing On-chip Continuous Wave Doppler Ultrasound. The invention was developed by Xing Jianing, Tan Mingliang and Chen Chao.
The patent application number is CN202510..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has released Suzhou Gaobang Semiconductor Tech Co Ltd patent application for Curing Oven for Semiconductor Packaging and Curing Method. This invention was developed by Hu Guohui and Shen Wenming.
The patent application number is CN202510874960 20250627. The paten..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has published Jinan Lan Xing Electronics Co Ltd patent application for Automatic Photoresist Coating and Drying Equipment and Method for Wafer. The invention was developed by Gao Fei, Wei Xingzheng, Li Hao and Wang Peng.
The patent application number is CN2025114..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has received Wondersolar Co Ltd patent application for Spraying Film-forming Device and Method for Substrate. Sheng Yusong, Shi Xiaojun, Peng Yishu, Zhao Junqiang, Chen Xiayan and Jiang Youyu developed the invention.
The patent application number is CN20251083573..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Shanghai Xinyuan Micro Entpr Development Co Ltd has applied Chinese patent for Double-fluid Nozzle and Substrate Processing Equipment. Sun Jinzhou, Peng Bo, Liu Peng, Wu Fangling and Tang Xiliang developed it.
The patent application number is CN202511148895 20250818. The patent publication number is CN1206..
Semiconductor
| Mon 23 Feb 2026
Munich, Feb. 24 -- Safran Landing Systems has applied European patent for Method for Recycling an Effluent Gas Resulting from Chemical Vapour Deposition or Infiltration. Maisse Laurent, Chevrin Paul-andré, Baron Inès and Potin Jean-françois Daniel René developed it.
The patent application number is EP20240722692 20240409...
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Jiangsu Xingnong Matrix Tech Co Ltd has submitted a patent application for Dustproof Grinding Device for Crushed Crude Pearlite Raw Material for Seedling Raising Substrate and Using Method of Dustproof Grinding Device. Cai Zhong, Wei Yipeng and Cai Mengyan developed the invention.
The patent application nu..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Weifang New Innovative Material Tech Co Ltd has sought patent for Reaction Sintering Silicon Carbide Grinding Barrel. This invention was developed by Xu Zhipeng and Li Mingxin.
The patent application number is CN202510968618 20250714. The patent publication number is CN120618625 (A). International Patent C..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has published Zhuiguang Biotechnology Shenzhen Co Ltd patent application for Photoelectric Tweezer Chip and Manufacturing Method Thereof. The invention was developed by Zhang Weipeng, Xie Hainan and Xie Wei.
The patent application number is CN202510564573 2025043..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has released University of Electronic Science and Technology of China and JA Solar patent application for Perovskite Light Absorption Layer and Preparation Method Thereof, and Perovskite Solar Cell. This invention was developed by Liu Mingzhen, Zhang Haifeng, Mao Li..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has received Jiangsu Heyi Guangxian Tech Co Ltd patent application for Multi-station OLED Packaging Equipment and Operation Method Thereof. Li Dean and Bang Jun developed the invention.
The patent application number is CN202510794734 20250614. The patent publicat..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Guojing Hechuang Qingdao Tech Co Ltd has sought patent for Light Emitting Diode Chip Packaging Device for Manufacturing Transparent Display Screen. This invention was developed by Zhang Fuxuan, Lyu Yong, Cui Caoxiang, Zhang Chunyang, Guo Baijun and Li Xiaodong.
The patent application number is CN2025107902..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has received Huaian Aucksun Optoelectronics Tech Co Ltd patent application for Light-emitting Chip. Li Dongmei, Tao Yaquan, Bao Wei, Wang Sibo and Liao Hanzhong developed the invention.
The patent application number is CN202510742090 20250605. The patent publicat..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Hangdian Jiashan Res Co Ltd has submitted a patent application for Wafer-level Packaged Backlight Image Sensor Chip. This invention was developed by Ye Weifeng.
The patent application number is CN202510778203 20250611. The patent publication number is CN120614886 (A). International Patent Classification co..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Hangdian Jiashan Res Co Ltd has sought patent for Backlight Image Sensor Chip. This invention was developed by Ye Weifeng.
The patent application number is CN202510778202 20250611. The patent publication number is CN120614885 (A). International Patent Classification codes are H10F39/00, H10F39/12 and H10F3..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Huawei Technologies has submitted a patent application for Avalanche Photodiode. This invention was developed by Chen Guanyu, Xiang Wei, Wang Kai, Zhang Shengxiang, Wei Wei, Zhang Shiyong and Cao Junkai.
The patent application number is CN202510603206 20201221. The patent publication number is CN120614882 ..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Shanghai Peiyuan Electronic Co Ltd has submitted a patent application for Single-wafer Integrated High-frequency Bridge Arm Power Semiconductor Wafer and Power Conversion Module. Zeng Jianhong, Hong Shouyu and Xin Xiaoni developed the invention.
The patent application number is CN202510265807 20250307. The..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Semiconductor Mfg International Shanghai Co Ltd has submitted a patent application for Semiconductor Structure Unit, Forming Method Thereof and Semiconductor Structure. This invention was developed by Yu Yang, Xie Guolin and Su Junying.
The patent application number is CN202410252040 20240305. The patent p..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Fujian Jinhua Integrated Circuit has submitted a patent application for Semiconductor Device and Preparation Method Thereof. This invention was developed by Xu Yirong, Zhang Qinfu, Wang Youchang and Zhou Yanzhen.
The patent application number is CN202510757143 20250606. The patent publication number is CN1..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Institute of Microelectronics, CAS has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. Chai Junshuai, Wang Xiaolei, Du Yong, Xu Hao, Luo Jun, Wang Wenwu and Ye Tianchun developed the invention.
The patent application number is CN202510613071 20250513. The patent pu..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- United Microelectronics Corporation has filed a patent application for Semiconductor Element. This invention was developed by Chen Changyi, Li Guoxing, Lin Junxian, Cai Zhiqin, Kang Zhikai, Zeng Kunci, Xue Shengyuan and Wang Yaozhan.
The patent application number is CN202410320053 20240320. The patent publ..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- United Microelectronics Corporation has submitted a patent application for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Chen Xinxian and Li Guoxing.
The patent application number is CN202410319973 20240320. The patent publication number is CN120614869 (A). Inter..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has received Shanghai Yidu Power Semiconductor Tech Co Ltd patent application for Power Semiconductor Gate Control Device Integrated with Gate Resistor. Shi Xinyu, Li Congcong, Qu Zhihao and Li Xinming developed the invention.
The patent application number is CN2..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has received Institute of Microelectronics, CAS patent application for Anti-radiation Four-terminal Sic Umosfet Device and Manufacturing Method Thereof. Liu Xinyu, Tang Yidan, Wang Xinhua, Liu Wenlong, Cao Lu, Bai Yun, Li Xuan and Tian Xiaoli developed the invention..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Shanghai Xinwei Semiconductor Co Ltd has submitted a patent application for Bidirectional TVS Diode Chip. This invention was developed by Wang Jun.
The patent application number is CN202410945635 20240715. The patent publication number is CN120614838 (A). International Patent Classification codes are H10D6..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Xincun Technology (Wuhan) has submitted a patent application for Phase Change Memory. This invention was developed by Hu Mingyao, Yang Hongxin, Ming Fan and Liu Jun.
The patent application number is CN202510761080 20250609. The patent publication number is CN120614834 (A). International Patent Classificati..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has received Yangtze Memory Technologies patent application for Semiconductor Device, Preparation Method Thereof and Storage System. Zhang Kun, Gao Tingting, Zhou Wenxi, Xia Zhiliang and Huo Zongliang developed the invention.
The patent application number is CN20..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Zhejiang Chuangxin Integrated Circuit has applied Chinese patent for Semiconductor Structure and Forming Method Thereof. Xu Qingshuang, Qi Dianyu and Wu Yongyu developed it.
The patent application number is CN202510776747 20250611. The patent publication number is CN120614830 (A). International Patent Clas..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has received Yangtze Memory Technologies patent application for Semiconductor Device and Preparation Method Thereof, Three-dimensional Memory and Storage System. Xiong Wenhao, Jia Jianquan, Li Kaiwei, Wang Junbao, Wang Wendong, Feng Junbo and Cui Jiameng developed t..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Samsung Electronics has submitted a patent application for Semiconductor Device Manufacturing Method. Choi Dae-hwan developed the invention.
The patent application number is CN20251074931 20250117. The patent publication number is CN120614825 (A). International Patent Classification codes are H10B41/27, H1..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Yangtze Memory Technologies has submitted a patent application for Semiconductor Device and Preparation Method Thereof, Three-dimensional Memory and Storage System. This invention was developed by Sun Chao, Li Beibei, Gong Fan, Yang Xinwei, Xu Zongke, Xu Wei and Huo Zongliang.
The patent application number..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Fujian Jinhua Integrated Circuit has submitted a patent application for Semiconductor Device. This invention was developed by Tong Yucheng and Lai Huixian.
The patent application number is CN202510776819 20190927. The patent publication number is CN120614821 (A). International Patent Classification codes a..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Shenzhen Shengweixu Technology has filed a patent application for Semiconductor Structure and Preparation Method Thereof. This invention was developed by Qiu Junwen and Yang Qian.
The patent application number is CN202510759362 20250606. The patent publication number is CN120614820 (A). International Paten..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Samsung Electronics has submitted a patent application for Semiconductor Device. This invention was developed by Jang Ji-hoon, Na Jae-won, Piao Zhequan and Choi Kyosun.
The patent application number is CN202510143624 20250210. The patent publication number is CN120614818 (A). International Patent Classific..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Nanya Technology has submitted a patent application for Memory Element Including Recessed Gate Structure with High K Gate Dielectric Layer and Method. This invention was developed by Zhuang Yingzheng.
The patent application number is CN202510139950 20240507. The patent publication number is CN120614816 (A)..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has released Samsung Electronics and Univ Hanyang Ind Univ Coop Found patent application for Integrated Circuit Semiconductor Device and Method of Manufacturing Integrated Circuit Semiconductor Device. This invention was developed by Park Jin Sung, Kim Tae-won, Ko J..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has received Yangtze Memory Technologies patent application for Semiconductor Structure and Preparation Method Thereof, and Memory System. Zhang Quan, Shi Yanwei, Zhou Wenbin, Yao Lan, Chen Liang and Gan Cheng developed the invention.
The patent application numbe..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Beijing Chaoxian Memory Research Institute has submitted a patent application for Semiconductor Structure and Preparation Method Thereof. Liu Xiaomeng, Ai Xuezheng, Wang Guilei, Wang Xiangsheng, Wang Hailing, Song Yanpeng and Zhao Chao developed the invention.
The patent application number is CN20241026548..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Yitong Semiconductor Shenzhen has applied Chinese patent for Welding Heat Dissipation Structure and Preparation Method Thereof. Qiu Jianwen and Wang Chang developed it.
The patent application number is CN202510979997 20250716. The patent publication number is CN120614769 (A). International Patent Classific..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has released Nanjing Langhe Intelligent Control Res Institute Co Ltd patent application for Equipment and Method for Cleaning Etching Solution of Integrated Circuit Board. This invention was developed by Zhang Shuaibiao and Yoon Se-an.
The patent application numb..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Xinzhiyuan Intelligent Equipment Mfg Suzhou Co Ltd has applied Chinese patent for Hole Opening Method and Device for Substrate and Electronic Equipment. Zhang Shuihong and Pu Yubing developed it.
The patent application number is CN202510766946 20250610. The patent publication number is CN120614759 (A). Int..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Xinzhiyuan Intelligent Equipment Mfg Suzhou Co Ltd has submitted a patent application for Hole Opening Method and Device of Substrate and Sound Hole Structure. This invention was developed by Zhang Shuihong and Pu Yubing.
The patent application number is CN202510766945 20250610. The patent publication numb..
Semiconductor
| Mon 23 Feb 2026
Beijing, Feb. 24 -- Semisilicon Technology has filed a patent application for Light Emitting Diode Circuit with Parallel Sequencing Function, Circuit Package and Light String. This invention was developed by Peng Wenqi.
The patent application number is CN202410254000 20240306. The patent publication number is CN120614723 (A)...
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Sanechips Technology has submitted a patent application for Data Transmission Method Between Core Particles, Chip, Medium and Program Product. Zhang Zhenfeng, Wang Kun, Liu Junqiang and Liu Zhongzheng developed the invention.
The patent application number is CN202411147918 20240820. The patent publication ..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Shanghai Xinyuan Micro Entpr Development Co Ltd has sought patent for Circuit Switching Device and Semiconductor Device. This invention was developed by Kang Ying, Li Yunlong and Du Haohao.
The patent application number is CN202511120409 20250812. The patent publication number is CN120613998 (A). Internati..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Shandong Huaguang Optoelectronics has sought patent for VCSEL Device with Mode Control and Preparation Method Thereof. This invention was developed by Zhang Yuhan, Ren Fuyang, Su Jian, Zhang Xiaodong, Liu Qi and Wu Dehua.
The patent application number is CN202510666403 20250522. The patent publication numb..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has released Shenzhen Zhongke Guangxin Semiconductor Tech Co Ltd patent application for Temperature Regulation and Control Device and Method for Semiconductor Laser. This invention was developed by Zheng Junxiong, Guo Dingkai, Huang Shuang and Zheng Chunhai.
The ..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Xinai Tech Nanjing Co Ltd has submitted a patent application for Embedded Circuit Packaging Substrate Containing Substrate Core and Manufacturing Method Thereof. This invention was developed by Chen Minyao and Xia Tingzhou.
The patent application number is CN202510831960 20250620. The patent publication nu..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Renesas Electronics has submitted a patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Kuroda Ryota.
The patent application number is CN202510132779 20250206. The patent publication number is CN120613319 (A). International Patent Classification cod..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- Shanghai Jita Semiconductor has submitted a patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Qi Dongyang, Yang Liming, Li Zhao and Huang Yongbin.
The patent application number is CN202510652965 20250520. The patent publication number is CN120613310 ..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has received Anhui North Microelectronics Res Institute Group Co Ltd patent application for Dielectric Isolation Method in Bipolar Circuit Chip Preparation. Ma Jianxiong, Zhu Jiyang, Feng Qiankun, Zhang Lei, Hu Yongrui and Yue Chuan developed the invention.
The p..
Semiconductor
| Tue 24 Feb 2026
Beijing, Feb. 24 -- State Intellectual Property Office of China has published Qingdao Jinhuiyuan Electronics Co Ltd patent application for Automatic Silicon Wafer Separating and Feeding Device. The invention was developed by Li Zhongliang, Wang Min, Xu Haitao, Cheng Wenjuan and Zhang Guangzhan.
The patent application number i..
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