Semiconductor
| Fri 13 Mar 2026
Alexandria, March 14 -- U.S. Patent and Trademark Office has awarded a patent to Applied Materials for Method to Deposit Metal Cap for Interconnect. Qu Ge, Zhu Qihao, Ju Zheng, Zhou Yang, Cen Jiajie, Liu Feng Q, Wu Zhiyuan, Chen Feng, Kashefi Kevin, Tang Xianmin, Anthis Jeffrey W and Saly Mark Joseph developed the invention.
Th..