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Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Anti-plasma Coating. This invention was developed by Duan Ren-guan, Meng Chin-hao, Shiue Chiun-da and Hu Chih-kai.
The patent application number is TW20240114203 20240416. The patent publication number is TW202540478 (A). International ..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Kokusai Electric has submitted a patent application for Gas Supply Method, Method for Manufacturing Semiconductor Device, Program, Gas Supply System, and Processing Device. This invention was developed by Miyanishi Yuya.
The patent application number is TW20250102259 20250120. The patent publication number is..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Unimicron Technology has submitted a patent application for Package Structure. This invention was developed by Yang Kai-ming, Lin Chen-hao, Ko Cheng-ta, Lin Pu-ju, Tseng Tzyy-jang and Lau John Hon-shing.
The patent application number is TW20240112257 20240401. The patent publication number is TW202540713 (A)...
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Applied Materials has submitted a patent application for Dry Development for Metal-oxide Photo Resists. This invention was developed by Kazem Nasrin, Sharma Shashank, Sachan Madhur, Balesan Niranjana, Fung Nancy and Ng Kai.
The patent application number is TW20240146209 20241129. The patent publication number..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- ASML Netherlands has submitted a patent application for Systems and Methods for Motion Control in a Semiconductor Manufacturing Apparatus. Bustraan Krijn Frederik, Delpuerto Santiago E, Huang Yang-shan, Finney Nathan Robert, Burroughs John Robert and De Bruijn Ron Geeraard Catharina developed the invention.
T..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Silicon Motion has submitted a patent application for Method and Computer Program Product and Apparatus for Controlling Execution of Input-output Commands. Lee Ting-chu and Tsai Cheng-yu developed the invention.
The patent application number is TW20240112244 20240401. The patent publication number is TW202540..
Semiconductor
| Tue 16 Jun 2026
Beijing, June 17 -- Shenzhen Technology University has submitted a patent application for High-power Semiconductor Laser Structure. This invention was developed by Li Hui, Miao Wei, Qiu Zhenhuan, Feng Jian, Deng Shupeng, Ding Shihao, Lu Jinlong and Li Nannan.
The patent application number is CN202511761853 20251127. The patent ..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Memory Circuit and Operating Method Thereof. This invention was developed by Mori Haruki, Fujiwara Hidehiro, Hung Je-min and Chen Yen-huei.
The patent application number is TW20240130228 20240812. The patent publication number is TW2025..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Sony Semiconductor Solutions Corporation has submitted a patent application for Semiconductor Chip, Semiconductor Device, Information Processing System, and Semiconductor Chip Control Method. This invention was developed by Higashi Kentarou, Satou Haruki, Tanimoto Tadaaki, Hiraga Keizo, Bessho Kazuhiro, Doi Ta..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Chipone Technology, Beijing has submitted a patent application for Screen Chip Parameter Adjusting Method, Automatic Parameter Adjusting System, Electronic Equipment and Storage Medium. This invention was developed by Li Xin-hui and Feng Ji-xiong.
The patent application number is TW20240127558 20240723. The p..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Applied Materials Israel has submitted a patent application for Determination of Layer Properties Using Widening of an Electron Beam. This invention was developed by Shani Itamar, Yaron Lior, Chirko Konstantin and Meiry Ron.
The patent application number is TW20250100070 20250102. The patent publication numbe..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- SCREEN Holdings has submitted a patent application for Substrate Processing Method and Substrate Processing Apparatus. This invention was developed by Shibata Shuichi, Lin Tsung-ju, Yamaguchi Yu and Inaba Masaki.
The patent application number is TW20250108451 20250307. The patent publication number is TW20254..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- SCREEN Holdings has submitted a patent application for Training Device, Information Processing Apparatus, Substrate Processing System, Training Method, Recipe Determination Method and Training Program. Kunieda Shogo, Hanawa Yosuke, Sasaki Yuta and Uonami Koki developed the invention.
The patent application nu..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Applied Materials has submitted a patent application for Process Stage Transition Detection for Plasma Systems. This invention was developed by Kageyama Yuta, Neelamraju Bharati, Kulshreshtha Prashant Kumar and Kitagaki Takashi.
The patent application number is TW20250103113 20250123. The patent publication n..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- SCREEN Holdings has submitted a patent application for Brush Unit and Substrate Processing Apparatus Capable of Suppressing Substrate Damage and Particle Generation Caused by Variations in Hardness of Sponge-shaped Cleaning Section and Differences in Pressing Force Applied to Brush. This invention was develope..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Tokyo Electron has submitted a patent application for Etching Method and Plasma Treatment Device. Orui Takatoshi and Hosoya Masanori developed the invention.
The patent application number is TW20240136941 20240927. The patent publication number is TW202541146 (A). International Patent Classification codes are..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Kokusai Electric has submitted a patent application for Substrate Processing Method, Semiconductor Device Production Method, Substrate Processing Device, and Program. This invention was developed by Horii Sadayoshi, Karasawa Koichi, Suda Tetsuya, Ueda Tatsushi and Kakuda Toru.
The patent application number is..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Powerchip Semiconductor Manufacturing Corporation has submitted a patent application for Manufacturing Method of Semiconductor Structure. Lin Meng-han developed the invention.
The patent application number is TW20240112512 20240402. The patent publication number is TW202541139 (A). International Patent Classi..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Applied Materials has submitted a patent application for Underlayer Treatment for Improved Photoresist Adhesion. This invention was developed by Joshi Unnati, Rathi Sudha, Manna Pramit, Janakiraman Karthik and Fung Nancy.
The patent application number is TW20250105163 20250212. The patent publication number i..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Tokyo Electron has submitted a patent application for Substrate Processing System and Substrate Processing Method. Izuishi Yuki and Tsutsui Tsutomu developed the invention.
The patent application number is TW20240149415 20241218. The patent publication number is TW202541130 (A). International Patent Classific..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Applied Materials has submitted a patent application for Control of Anisotropic Deformation with Directional Stress Modulation for Device Manufacturing. This invention was developed by Subrahmanyan Pradeep Kumar, Sinclair Frank, Lischer D Jeffrey and Lee Wonjae.
The patent application number is TW20240146964 ..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Kokusai Electric has submitted a patent application for Substrate Processing Method, Method for Manufacturing Semiconductor Device, Program, and Substrate Processing Device. This invention was developed by Sano Atsushi, Watanabe Yosuke, Asai Masayuki and Kuroo Saaya.
The patent application number is TW2025010..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Lam Research has submitted a patent application for Particle Mitigation by Purging. This invention was developed by Alvandi Tabrizi Youness, Rumer Michael, Kanakasabapathy Sivananda Krishnan, Deen Raees Amer, Ng Michael and Mandia David Joseph.
The patent application number is TW20240148031 20241211. The pate..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Canon has submitted a patent application for Measurement Method, Alignment Method, Processing Method, Processing Apparatus, Method of Manufacturing Article, Determination Method, and Program Capable of Providing Technique Facilitating Measurement Regarding to Marks Formed on Substrate. This invention was devel..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- GlobalWafers has submitted a patent application for Systems and Methods for Processing Semiconductor Wafers Using Near Edge Region Roundness. This invention was developed by Hong Jing-ru, Kim Tae-hyeong and Chu Yung-hsing.
The patent application number is TW20250107187 20250226. The patent publication number ..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Tokyo Electron has submitted a patent application for Substrate Treatment Device and Tray. Sato Naoki, Matsumoto Naoki, Ito Koei, Teruuchi Satoru, Seguchi Taisei, Kitagawa Dai and Amikura Norihiko developed the invention.
The patent application number is TW20250106812 20250225. The patent publication number i..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Applied Materials has submitted a patent application for Deformable Substrate Chuck. Zuniga Steven M, Gurusamy Jay and Nagengast Andrew J developed the invention.
The patent application number is TW20250121400 20210623. The patent publication number is TW202541250 (A). International Patent Classification code..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Applied Materials has submitted a patent application for Workpiece Support System. This invention was developed by Fish Roger B.
The patent application number is TW20240143690 20241114. The patent publication number is TW202541242 (A). International Patent Classification codes are H01L21/265, H01L21/67, H01L2..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Fasford Technology has submitted a patent application for Die Bonding Apparatus, Method for Setting Bond Coordinates, and Fabrication Method for Semiconductor Device Which Comprises a Display Device Displaying a Bond Coordinate Setting Screen That Includes a First Display Window, a Second Display Window, a Thi..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Kokusai Electric has submitted a patent application for Substrate Processing Apparatus, Substrate Fall Preventer, Method of Processing Substrate, Method of Manufacturing Semiconductor Device, and Recording Medium. Hayashi Akinari, Kurosawa Toshiharu and Tezuka Shigenori developed the invention.
The patent app..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- HPSP has submitted a patent application for Gas Management Assembly for Substrate Processing Apparatus. Rivera Manuel Scott, Zhang Xiaoping and Coto Jose Salvador developed the invention.
The patent application number is TW20250113146 20250408. The patent publication number is TW202541225 (A). International P..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- SCREEN Holdings has submitted a patent application for Substrate Processing Method, Trained Model Generation Method, Nozzle Speed Acquisition Method, Training Data Creation Method, Substrate Processing Device, Trained Model, Nozzle Speed Acquisition Device, and Computer Program. This invention was developed by..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Alpha & Omega Semiconductor has submitted a patent application for Semiconductor Package Having Ultra-thin Substrate and Method of Making the Same. Zhou Shu-hua, Yang Zhen, Lv Lin and Wang Long-ching developed the invention.
The patent application number is TW20250105296 20250213. The patent publication numbe..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Dainippon Printing has submitted a patent application for Through Electrode Substrate, Semiconductor Package, and Manufacturing Method Thereof. Kuramochi Satoru developed the invention.
The patent application number is TW20240138804 20241011. The patent publication number is TW202541271 (A). International Pat..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Integrated Circuit and Method of Manufacturing the Same. This invention was developed by Kuo Ming-jhih and Tang Ting-wei.
The patent application number is TW20250100280 20250103. The patent publication number is TW202541320 (A). Interna..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- FCI USA has submitted a patent application for Compact High Speed Near Chip Connector. Jayaseelan Vasanth Paul, Zerebilov Arkady Y and Rowlands Michael developed the invention.
The patent application number is TW20250105395 20250213. The patent publication number is TW202541368 (A). International Patent Class..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Realtek Semiconductor Corporation has submitted a patent application for Network Apparatus and Operation Method Thereof Having Slave Circuits Broadcast Accessing Mechanism. This invention was developed by Chen Pen-ao, Lin I-hsueh, Kuo Che-lun and Cheng Kuo-chou.
The patent application number is TW20240113445 ..
Semiconductor
| Tue 16 Jun 2026
Beijing, June 17 -- Zhuhai Nanxin Semiconductor Technology has submitted a patent application for Charging Control Circuit, Chip and Electronic Equipment. This invention was developed by Sun Kai and Xiao Zhefei.
The patent application number is CN202511659100 20251112. The patent publication number is CN121529928 (A). Internati..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- SK Hynix has submitted a patent application for Receiver Circuit, Receiving Method and Semiconductor Apparatus and Semiconductor System Using the Same. This invention was developed by Choi Sung-phil.
The patent application number is TW20240147159 20241205. The patent publication number is TW202541468 (A). Int..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Realtek Semiconductor Corporation has submitted a patent application for Electronic Device and Communication Chip Thereof. Shih Yi-chang developed the invention.
The patent application number is TW20240113620 20240411. The patent publication number is TW202541466 (A). International Patent Classification codes..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Realtek Semiconductor Corporation has submitted a patent application for Method for Performing Memory Access Control with Limited Search Range Size During Video Encoding, and Associated System-on-chip. This invention was developed by Tseng Yi-chen.
The patent application number is TW20240113090 20240409. The ..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- AUO Corporation has submitted a patent application for Circuit Substrate and Manufacturing Method Thereof. This invention was developed by Hsieh Hao-lun, Chen Fu-yang, Chang Chun, Li Xiao-yun, Sun Shuo-yang, Lai Ying-hui, Chang Yu-hao and Jhan Jhih-jhu.
The patent application number is TW20240113477 20240411...
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Realtek Semiconductor Corporation has submitted a patent application for Microwave Sensing Device and Method for Avoiding Transmission Collision in Unlicensed Band. This invention was developed by Yang Ying, Guo Mingzhi and Guo Ming-zhi.
The patent application number is TW20240131269 20240820. The patent publ..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Texas Instruments has submitted a patent application for Flash Memory Including Self-aligned Floating Gates. This invention was developed by Cassel Robert, Liu Xi-meng, Damarla Gowrisankar, Wardle J, Rust Ryan, Ringhofer Robert, Ellingwood Brian and Albini Giulio.
The patent application number is TW2024014395..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- LG Innotek has submitted a patent application for a Circuit Board and a Semiconductor Package Including the Same. Jung Won-suk developed the invention.
The patent application number is TW20250101027 20250110. The patent publication number is TW202541561 (A). International Patent Classification codes are H01L2..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- AaltoSemi has submitted a patent application for Double Sided Edge Sealing Method for Substrate. This invention was developed by Chen Yin-ju, Chang Zhen-hu, Chang Andrew Chui-hong, Lai Chien-kuang, Yang Chung-hsier, Chang Andrew C, Fan Chen-yin, Luo Wen-lun, Lv Shi-wei and Chen Min-yao.
The patent application..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Diodes Inc has submitted a patent application for Trench Semiconductor Structure and the Method of Manufacturing the Same. This invention was developed by Kuo Ta-chuan and Chuang Chiao-shun.
The patent application number is TW20240117520 20240513. The patent publication number is TW202541630 (A). Internationa..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Japan Display has submitted a patent application for Semiconductor Device and Method for Manufacturing Semiconductor Device. This invention was developed by Hanada Akihiro, Yukawa Motochika and Kaitoh Takuo.
The patent application number is TW20250103943 20250204. The patent publication number is TW202541613 ..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Semiconductor Device Structure and Method for Forming the Same. This invention was developed by Yang Fu-kai, Chen Jui-lin, Lin Shih-che, Lien Chong-de, Huang Chih-hsiang and Hung Lien-jung.
The patent application number is TW20240120947..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Semiconductor Components Industries has submitted a patent application for Semiconductor Devices with Orthogonal Voltage Blocking Structures and Methods of Manufacturing Semiconductor Devices. This invention was developed by Moens Peter and Chochol Jan.
The patent application number is TW20240119011 20240523...
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- GlobalFoundries Singapore has submitted a patent application for Electrostatic Device. This invention was developed by Hwang Kyong Jin and Zeng Jie.
The patent application number is TW20240145638 20241127. The patent publication number is TW202541606 (A). International Patent Classification codes are H10D10/0..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Nanya Technology has submitted a patent application for Method of Forming Semiconductor Structure. This invention was developed by Su Cheng-chieh.
The patent application number is TW20240123434 20240624. The patent publication number is TW202539497 (A). International Patent Classification codes are H01L21/56 ..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Nanya Technology has submitted a patent application for Method of Forming Semiconductor Structure. This invention was developed by Su Cheng-chieh.
The patent application number is TW20250108058 20240624. The patent publication number is TW202539498 (A). International Patent Classification codes are H01L21/56 ..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Canon has submitted a patent application for Substrate Processing Method, Article Manufacturing Method, Substrate Processing Apparatus, and System. Wakabayashi Satoshi, Teramoto Yoji, Futaki Hajime and Kishimoto Katsushi developed the invention.
The patent application number is TW20240141859 20241101. The pat..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Tokyo Electron has submitted a patent application for Substrate Processing Device and Substrate Processing Method. This invention was developed by Choi Kwang-eun, Chung Jun-young and Seo Seung-woo.
The patent application number is TW20240135747 20240920. The patent publication number is TW202539880 (A). Inter..
Semiconductor
| Tue 16 Jun 2026
Beijing, June 17 -- Micron Technology has submitted a patent application for Data Circuit for Low-swing Data Bus. This invention was developed by Brox Martin.
The patent application number is CN202511699986 20220324. The patent publication number is CN121528270 (A). International Patent Classification codes are G11C11/4096 and ..
Semiconductor
| Tue 16 Jun 2026
Beijing, June 17 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Memory Circuit, Voltage Supply Circuit and Operation Method Thereof. This invention was developed by Yang Yixin and Zhang Mengsheng.
The patent application number is CN202510351431 20250324. The patent publication number is CN121528260..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Lintec has submitted a patent application for Composite Sheet for Forming Protective Film and Method for Manufacturing Semiconductor Device Having Excellent Static Electricity Suppression Properties and Capable of Improving Workability in the Semiconductor Manufacturing Process. Morishita Tomotaka and Nishida ..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Nissan Chemical has submitted a patent application for Laminate and Production Method for Processed Compound-semiconductor Substrate. This invention was developed by Okuno Takahisa, Yagyu Masafumi and Kishioka Takahiro.
The patent application number is TW20250106037 20250219. The patent publication number is ..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Soulbrain has submitted a patent application for Brittleness and Resistivity Improver, Method for Forming Heterogeneous Film Using Same, and Semiconductor Substrate and Semiconductor Device Manufactured Therefrom. Lee Seung-hyun, Jung Jae-sun, Park Ji-won, Kim Deok-hyun and Yeon Chang-bong developed the invent..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Nippon Electric Glass has submitted a patent application for Support Glass Substrate, Laminate, Method for Manufacturing Laminate, and Method for Manufacturing Semiconductor Package. This invention was developed by Takeda Miyako.
The patent application number is TW20250108029 20250305. The patent publication ..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Fujifilm has submitted a patent application for Resin Composition, Cured Product, Laminate, Method for Producing Cured Product, Method for Producing Laminate, Method for Producing Semiconductor Device, and Semiconductor Device, and Method for Producing Condensation Product. Ozawa Yu developed the invention.
T..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Shinetsu Chemical has submitted a patent application for Method for Forming Organic Film and Method for Manufacturing Substrate for Semiconductor Device. This invention was developed by Kobayashi Naoki, Takizawa Kanata, Yano Toshiharu and Satoh Hironori.
The patent application number is TW20250105656 20250217..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Semiconductor Energy Laboratory has submitted a patent application for Light-emitting Device. This invention was developed by Seo Hiromi, Fukuzaki Shinya, Sasaki Toshiki and Ohsawa Nobuharu.
The patent application number is TW20250101657 20250115. The patent publication number is TW202540099 (A). Internationa..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Fujifilm has submitted a patent application for Resin Composition, Cured Product, Laminate, Method for Producing Cured Product, Method for Producing Laminate, Method for Producing Semiconductor Device, Semiconductor Device, and Method for Producing Polyamic Acid Ester. This invention was developed by Asakawa D..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Nissan Chemical has submitted a patent application for Composition for Forming Resist Underlayer Film, Resist Underlayer Film, Method for Forming Resist Pattern, and Method for Manufacturing Semiconductor Device. This invention was developed by Kosai Jun, Izumi Koji and Tokunaga Hikaru.
The patent application..
Semiconductor
| Tue 16 Jun 2026
Beijing, June 17 -- Kunshan Jinlang Electronics has submitted a patent application for Manufacturing Device and Manufacturing Method of Novel Alloy Chip Resistor. This invention was developed by Chen Youlang and Ma Fusheng.
The patent application number is CN20251239301 20251231. The patent publication number is CN121528670 (A)..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Toray Industries has submitted a patent application for Photosensitive Resin Composition and Cured Film Thereof, and Interlayer Insulating Film and Semiconductor Protective Film Using Said Cured Film. This invention was developed by Koyama Yutaro and Masuda Yuki.
The patent application number is TW20250109760..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Fujifilm has submitted a patent application for Resin Composition, Cured Product, Laminate, Method for Producing Cured Product, Method for Producing Laminate, Method for Producing Semiconductor Device, Semiconductor Device, and Method for Producing Polyamic Acid Ester. Asakawa Daisuke developed the invention.
..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- NAMICS Corporation has submitted a patent application for Adhesive Film, Semiconductor Device, and Method for Manufacturing Semiconductor Device. This invention was developed by Ozaki Hiroshi, Teraki Shin, Yoshida Masaki and Komatsu Fumikazu.
The patent application number is TW20240134806 20240913. The patent..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- WM Barr has submitted a patent application for Corrosion-resistant Paint Remover Composition and Method for Removing Paint from a Substrate. This invention was developed by Bolgeo Dalton, Teague Timothy, Breon Jonathan and Farmer Rachel.
The patent application number is TW20250107653 20250303. The patent publ..
Semiconductor
| Tue 16 Jun 2026
Beijing, June 17 -- Shenzhen Matrix Multi Technology has submitted a patent application for Plasma Etching Chamber, Cleaning Method and Semiconductor Process Equipment. This invention was developed by Xia Hui, Shao Shouqian, Gong Wenzhi, Hu Xiaobo, Li Jiaxiaolong and Zhang Xiaojun.
The patent application number is CN20251153808..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Applied Materials has submitted a patent application for Stress Control Method for Physical Vapor Deposition of Aluminum. Soh Jay Min, Choo Li Ying, Hoi Siew Kit, Tan Xiao, Zhong Yao-ying and Xu Hao-min developed the invention.
The patent application number is TW20240143349 20241112. The patent publication nu..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- SanDisk Technologies has submitted a patent application for Read for Memory Cell with Threshold Switching Selector. This invention was developed by Parkinson Ward, Tran Michael Nicolas Albert and Trent Thomas.
The patent application number is TW20240148640 20241213. The patent publication number is TW20253874..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Apple has submitted a patent application for Memory Apparatus with Layouts for Making Connection to Transistors on Semiconductor Substrates, and Memory System. Abu-rahma Mohamed H, Oliva Antonietta, Bhatia Ajay and Nazar Shahzad developed the invention.
The patent application number is TW20240148457 20230321...
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Realtek Semiconductor Corporation has submitted a patent application for Apparatus and Method for Own Voice Detection. Yang Chun-ming and Huang Shih-chieh developed the invention.
The patent application number is TW20240112228 20240329. The patent publication number is TW202538733 (A). International Patent Cl..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Applied Materials has submitted a patent application for High Selectivity Cryogenic Tungsten-boron-carbide Etch. This invention was developed by Zhang Jing, Lee Gene, Takeshita Kenji and Chlenov Anatoli.
The patent application number is TW20240142091 20241104. The patent publication number is TW202538827 (A)...
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Applied Materials has submitted a patent application for High Conformal Coating on Textured Surface of Processing Chamber Component. Chou Cheng-hsuan and Lin Yixing developed the invention.
The patent application number is TW20240149407 20241218. The patent publication number is TW202538813 (A). International..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Tokyo Electron has submitted a patent application for Plasma Processing with Phase-locked Waveforms. This invention was developed by Luan Ping-shan and Park Min-joon.
The patent application number is TW20240144362 20241119. The patent publication number is TW202538809 (A). International Patent Classification ..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Tokyo Electron has submitted a patent application for Sub-millisecond Optical Detection of Pulsed Plasma Processes. Machuca Francisco, Ng Joel, Mihaylov Mihail and Tian Xinkang developed the invention.
The patent application number is TW20240142085 20241104. The patent publication number is TW202538806 (A). I..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- ASML Netherlands has submitted a patent application for Sensing Element Level Circuitry Design for Electron Counting Detection Device. This invention was developed by Wang Yongxin.
The patent application number is TW20250107580 20210624. The patent publication number is TW202538801 (A). International Patent C..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- ASML Netherlands has submitted a patent application for Charging Particle-optical Device, Charged Particle-optical Module, Method of Projecting a Plurality of Charged Particle Beams Towards a Sample. Wieland Marco Jan-jaco developed the invention.
The patent application number is TW20240147356 20241206. The p..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Tokyo Electron has submitted a patent application for Semiconductor Device Manufacturing Method and Manufacturing System. Shimizu Rio and Yamaguchi Tatsuya developed the invention.
The patent application number is TW20250100850 20250109. The patent publication number is TW202538869 (A). International Patent C..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Tokyo Electron has submitted a patent application for Methods for Wet Atomic Layer Etching of Transition Metal Oxide Dielectric Materials. This invention was developed by Abel Kate.
The patent application number is TW20240148059 20241211. The patent publication number is TW202538859 (A). International Patent ..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Kokusai Electric has submitted a patent application for Processing Method, Semiconductor Device Manufacturing Method, Processing Device, and Program. Degai Motomu, Katagiri Eitetsu, Waseda Takayuki, Miyata Shoma and Nakatani Kimihiko developed the invention.
The patent application number is TW20250100194 2025..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Tokyo Electron has submitted a patent application for Methods for Patterning a Semiconductor Substrate Using Metalate Salt Ionic Liquid Crystals. This invention was developed by Abel Kate and Aryal Dipak.
The patent application number is TW20240142086 20241104. The patent publication number is TW202538843 (A)..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Sony Group has submitted a patent application for Semiconductor Substrate, Semiconductor Device, and Method for Manufacturing Semiconductor Device. Shiomi Michinori, Kishimoto Haruki, Kasahara Daiji, Watanabe Tomomasa and Yokozeki Mikihiro developed the invention.
The patent application number is TW2024014985..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Tokyo Electron has submitted a patent application for Substrate Processing System. Wu Tong developed the invention.
The patent application number is TW20250105102 20250212. The patent publication number is TW202538921 (A). International Patent Classification codes are B25J13/08, H01L21/3065, H01L21/67 and H01..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- ASM International Holding has submitted a patent application for Load Lock Arrangement, Semiconductor Processing System, and Method of Performing Parallel Operations Within Load Lock Arrangement Including Alignment Assembly. This invention was developed by Harb Salam, Banna Samer and Nambiath Pradeep.
The pat..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Zeus has submitted a patent application for Substrate Processing Device. Lee Yang-ho, Lee Seung-hoon, Kim Jong-back, Son Young-un and Yun Hyun-woo developed the invention.
The patent application number is TW20240144488 20241119. The patent publication number is TW202538913 (A). International Patent Classifica..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Nihon Micronics has submitted a patent application for Probe and Electrical Connection Device. This invention was developed by Nasu Mika.
The patent application number is TW20250102829 20250122. The patent publication number is TW202538906 (A). International Patent Classification codes are G01R1/06 and H01L21..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Removal Device and Removal Method. Lee Szu-hsien, Li Chia-hsiu, Wu Shao-yu, Lee Pei-wei and Cheng Ming-da developed the invention.
The patent application number is TW20240117211 20240509. The patent publication number is TW202538884 (A)..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Tokyo Electron has submitted a patent application for Substrate Processing Apparatus. This invention was developed by Matsuyama Nobuhiro, Shimada Koichi, Taniyama Tomoshi and Yoshida Takashi.
The patent application number is TW20250105305 20250213. The patent publication number is TW202538874 (A). Internation..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- SCREEN Holdings has submitted a patent application for Substrate Processing Apparatus, Method for Controlling Substrate Processing Apparatus, and Substrate Conveyance Apparatus. Kuwahara Joji developed the invention.
The patent application number is TW20240151391 20241230. The patent publication number is TW2..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Kokusai Electric has submitted a patent application for Transfer Apparatus, Substrate Processing Apparatus, Substrate Processing Method, Method for Manufacturing Semiconductor Device, and Recording Medium. This invention was developed by Ota Takayuki, Aburatani Yukinori and Nishino Tatsuya.
The patent applica..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Semiconductor Package, Integrated Circuit Chip, and Method of Forming the Same. Lee Chia-chen, Wu Chia-tien, Chou Chih-chao, Chu Wei-chen and Tsai Ching-wei developed the invention.
The patent application number is TW20240116769 2024050..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Semiconductor Protection Devices and Semiconductor Process Apparatus. This invention was developed by Xu Yao, Liu Xiao-huan, Zhang Ming, Shan Si, Jin Ze-wen, Sun Meng-fei and Zhang Yan-chao.
The patent application number is TW2025..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Tokyo Electron has submitted a patent application for Substrate Processing Apparatus. This invention was developed by Matsuyama Nobuhiro, Shimada Koichi, Yoshida Takashi and Taniyama Tomoshi.
The patent application number is TW20250105301 20250213. The patent publication number is TW202538922 (A). Internation..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Heat-dissipating Lid, Package Structure and Method for Forming the Same. Sheng Wei-kong, Lin Hsin-ting and Hung Wen-sen developed the invention.
The patent application number is TW20240126188 20240712. The patent publication number is T..
Semiconductor
| Tue 16 Jun 2026
Taipei, June 17 -- Realtek Semiconductor Corporation has submitted a patent application for Packaged Chip. This invention was developed by Wang Hao-lian and Cheng Kuo-chou.
The patent application number is TW20240112210 20240329. The patent publication number is TW202538984 (A). International Patent Classification codes are H01..
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