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Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- China Mobile Communications and China Mobile Group Yunnan Co Limited have filed a patent application for Network Chip Security Detection Method and Device, Electronic Equipment, Medium and Product. This invention was developed by Wang Yun and Han Rong.
The patent application number is CN202511941505 202512..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- China Unicom Hong Kong Operation Co Ltd, China Unicom and China Unicom Int Co Ltd have filed a patent application for Method and Device for Processing User Integrated Circuit Card Identifier Information and Medium. This invention was developed by Wang Zuojia, Zhao Jianyun and Wan Siyi.
The patent applicati..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Mingqijia Suzhou Digital Tech Co Ltd and Suzhou Weiwu Tech Co Ltd have submitted a patent application for Gas Meter Safety System Adopting Risc-v Architecture Safety Chip and Transmission Method. This invention was developed by Jiang Chenyi, Tai Zheng, Li Tingting, Han Yubiao and Kong Fankun.
The patent ap..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Hangzhou Dianzi University and Information Science Academy of China Electronics Technology Group have submitted a patent application for W-band Sixteen-channel Chip Circuit Model. Shan Yuanhao, Duan Qin, Liu Jun, Wang Zhiqiang, Li Xiao, Su Guodong, Qi Xiaolin and Yang Ning developed the invention.
The pate..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Taiyuan Guoke Semiconductor Optoelectronic Research Inst Co Ltd, Jincheng Optoelectronic Industry Coordination Service Center Jincheng Optical Electromechanical Indu and Hefei Nat Laboratory have applied Chinese patent for High-power Narrow-linewidth External Cavity Semiconductor Laser Based on Compact Coupli..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Northeast Electric Power University and Zhengbian Tech Co Ltd have submitted a patent application for Vacuum Paint Dipping Device and Application of Vacuum Paint Dipping Device in Silicon Steel Iron Core Transformer for Compact Box Transformer Substation. This invention was developed by Zhao Liyang, Li Hailin..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- CETC Chip Technology Group and No. 24 Research Inst Of Cetc have applied Chinese patent for Gold Electrode Chip Thick Film Fixed Resistor and Manufacturing Method Thereof. Liao Xiyi, Deng Zhaoqi, He Congyong, Hu Lixue, Mao Yijin and Li Xidi developed it.
The patent application number is CN202511985431 2025..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Beijing Boe Display Tech Co and BOE Technology Group have filed a patent application for Light-emitting Substrate and Driving Method Thereof, Backlight Module and Display Device. This invention was developed by Wang Zhiqiang, Wang Yakun, Xuan Weijie, Li Jiaqi, Wu Zhiwei, Ma Huixiao, Mu Jingfei, Liang Fei, Wan..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Suzhou Novosense Microelectronics and Shanghai Naxi Microelectronics Co Ltd have submitted a patent application for Electric Signal Transmission Structure, Chip and Electronic Equipment. This invention was developed by Lin Tao, Pang Jinling and Liu Qingran.
The patent application number is CN202511948233 2..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Guangli Ruihong Electronic Technology and Zhengzhou University have submitted a patent application for Composite Throttling Static Pressure Gas Radial Bearing for Air Floating Main Shaft of Wafer Thinning Machine. This invention was developed by Si Yahui, Zhang Guolong, Shi Minghui and Wang Chao.
The paten..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Jiangsu Tianke Heda Semiconductor and Beijing Tankeblue Semiconductor have submitted a patent application for Preparation Device and Preparation Method of Silicon Carbide Single Crystal. This invention was developed by Peng Tonghua, Yang Jian, Zhang Xuexia, Cai Zhenli, Xu Xue and Wang Bo.
The patent applic..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Shanghai Advanced Silicon Tech Co Ltd and Chongqing Advanced Silicon Technology have applied Chinese patent for Wafer Loading Device and Wafer Loading Method. Sheng Wenchao, Xie Lin, Chen Dehao and Chen Meng developed it.
The patent application number is CN20251228144 20251230. The patent publication numbe..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Zhejiang Youxin Microelectronics Co Ltd and Zhejiang Juexin Microelectronics have filed a patent application for Device for Improving Stability of Tellurium-cadmium-mercury Vertical Liquid Phase Epitaxy. This invention was developed by Zhang Guojie, Chen Hui, Li Zhen, Li Yaoyao and Zhou Jin.
The patent app..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Harbin Inst Of Large Electrical Machinery Co Ltd and Harbin University of Science and Technology have applied Chinese patent for Preparation Method and Application of Aramid Fiber Reinforced High-thermal-conductivity Organic Silicon Mica Tape. Yue Dong, Yang Zhou, Chen Xuesong, Fu Qiang, Yao Yuanhang, Feng Yu..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Institute of Chinese Materia Medica, China Academy of Chinese Medical Sciences and Fudan University have filed a patent application for Blood Vessel-bone Coupled Microfluidic Organ Chip System and Construction Method and Application Thereof. This invention was developed by Mi Xianqiang, Chen Lin, Zhang Yanqio..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Guangdong Aiko Solar Energy Technology Co Ltd, Zhejiang Aiko Solar Energy Technology, Shandong Aiko Solar Energy Tech Co Ltd, Zhuhai Fushan Aixu Solar Energy Technology and Tianjin Aiko Solar Energy Technology have submitted a patent application for Packaging Adhesive Film, Preparation Method Thereof and Sola..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Hangzhou Kelin Electric and Hangzhou Keneng New Energy Co Ltd have submitted a patent application for Hf-sio2 Composite PoE Packaging Adhesive Film for Solar Cell and Preparation Method of Hf-sio2 Composite PoE Packaging Adhesive Film. This invention was developed by Qian Zhunde, Song You, Hu Junyi, Yu Yongga..
Semiconductor
| Tue 30 Jun 2026
Taipei, June 30 -- Mitsuboshi Diamond Industrial Co Ltd and Mitsuboshi Diamond Ind Co Ltd have received a patent for Substrate Pickup Device and Substrate Pickup Method Capable of Reducing the Follow-up of Another Substrate When Picking Up a Substrate in a Pickup Device. This invention was developed by Nakata Katsuyoshi.
The ..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Zhejiang Hailide New Materials and Zhejiang Hailide Film New Mat Co Ltd have submitted a patent application for PVC Wafer Protective Film and Preparation Method Thereof. This invention was developed by Gou Pengpeng, Wu Junying, Zhuang Ziqi and Zhou Zhongliang.
The patent application number is CN20251191719..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Meixin New Mat Co Ltd and Huizhou Meixin Electronics Co Ltd have submitted a patent application for Anchoring Agent and Preparation Method Thereof, Organic Silicon Composition, Organic Silicon Pressure-sensitive Adhesive and Vertical Orientation Heat-conducting Graphene. Lin Xuehao, Dai Ruyong, Lu Lanshuo and..
Semiconductor
| Mon 29 Jun 2026
Taipei, June 30 -- Taiwan Semiconductor Mfg Co Ltd and National Taiwan University have been awarded a patent for Method for Manufacturing Spintronic Device. This invention was developed by Li Tsung-ying, Liu Chia-you, Li Jiun-yun, Wu Yu-jui and Tai Chia-tse.
The patent application number is TW20230150584 20231225. The patent ..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Toshiba and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device and Method for Manufacturing Semiconductor Device. This invention was developed by Kadono Hiroshi.
The patent application number is CN202510163189 20250214. The patent publication number is CN12172..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- The Sixth Element Changzhou Semiconductor Co Ltd and Jiangsu Jiangnan Diene Graphene Technology have filed a patent application for Transfer Method of Two-dimensional Semiconductor Film. This invention was developed by Guo Bing, Tan Huabing and Qu Yan.
The patent application number is CN202511973495 202512..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Jiangxi MTC Semiconductor and Jiangxi Zhaochi Integration Tech Co Ltd have applied Chinese patent for High-bin-rate Warehousing Method and System for Wafer Particles. Wen Guosheng, Jin Conglong, Qiu Lijia, Ao Yingquan, Li Zongkui, Zhao Xiaoming and Dong Guoqing developed it.
The patent application number i..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Hefei Pusikai New Energy Tech Co Ltd and Hefei University of Technology have submitted a patent application for Perovskite Thin Film Band Gap Gas Phase Broadening Processing Method and Solar Cell Based on Perovskite Thin Film Band Gap Gas Phase Broadening Processing Method. This invention was developed by Gu ..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Jiangxi MTC Semiconductor and Jiangxi Zhaochi Integration Tech Co Ltd have submitted a patent application for Flip High-voltage Light-emitting Diode Chip and Preparation Method Thereof. This invention was developed by Li Wentao, Jin Conglong, Hu Jiahui, Ao Yingquan and Zhang Cunlei.
The patent application ..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Jiangxi MTC Semiconductor and Jiangxi Zhaochi Integration Tech Co Ltd have filed a patent application for Micro-led Epitaxial Wafer and Preparation Method Thereof. This invention was developed by Jin Conglong, Liu Chunyang, Jwa Joo Woong, Gao Hong, Hu Jiahui, Zheng Wenjie, Shu Jun, Xiao Ruimin, Wang Xiaolan a..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- State Grid Hebei Electric Power Supply Co Ltd, Shenzhen Zhenxiang Tech Co Ltd, Beijing University of Posts and Telecommunications and China Electric Power Research Inst Co Ltd have submitted a patent application for Ultraviolet-enhanced Image Sensor Based on Organic Fluorescent Material and Preparation Method..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Visionox Technology Co Ltd and Hefei K&D Tech Co Ltd have applied Chinese patent for Array Substrate and Display Panel. Liu Yang, Chen Long, Mi Lei and Liu Yusheng developed it.
The patent application number is CN202511870245 20251211. The patent publication number is CN121728831 (A). International Patent ..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Research Inst Of China Mobile Communications Corporation and China Mobile Communications have submitted a patent application for Embedded Universal Integrated Circuit Card Data Downloading Method, Device, Equipment and Medium. Liu Yang developed the invention.
The patent application number is CN20251184545..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Fanxing Semiconductor Co Ltd has submitted a patent application for Zener Diode and Preparation Method Thereof. Lin Yihua developed the invention.
The patent application number is CN202510926886 20250707. The patent publication number is CN121728785 (A). International Patent Classification codes are H10D62..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Toshiba and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device. This invention was developed by Murai Shunta and Matsudai Tomoko.
The patent application number is CN202510194499 20250221. The patent publication number is CN121728788 (A). International Patent C..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Yangjie Tech Wuxi Co Ltd has submitted a patent application for Shield Gate Trench Type MOSFET Manufacturing Method for Controlling IPO Thickness. This invention was developed by Chen Runsheng, Wang Yi, Zhang Shengkai and Qin Xiaojing.
The patent application number is CN202511995306 20251226. The patent pu..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- BOE Huacan Optoelectronics Guangdong Co Ltd has submitted a patent application for Transistor and Preparation Method Thereof. This invention was developed by Wan Fudie, Cai Fuwang, Chen Kai and Wang Junnan.
The patent application number is CN202511594351 20251103. The patent publication number is CN1217287..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Jiangsu Huiyixin Tech Co Ltd has submitted a patent application for Shield Gate Trench MOSFET Device and Preparation Method Thereof. This invention was developed by Meng Yu and Zhang Pengcheng.
The patent application number is CN202511973456 20251225. The patent publication number is CN121728804 (A). Inter..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- BOE Huacan Optoelectronics Guangdong Co Ltd has submitted a patent application for Light Emitting Diode with High External Quantum Efficiency and Preparation Method Thereof. Wang Jiangbo, Cong Ying and Yao Zhen developed the invention.
The patent application number is CN202511602680 20251104. The patent pu..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- BOE Huacan Optoelectronics Guangdong Co Ltd has submitted a patent application for Light-emitting Panel and Manufacturing Method Thereof. This invention was developed by Song Yuhua, Wei Yang, Wu Zhihao, Tong Zhidi and Zhang Wei.
The patent application number is CN202511625471 20251107. The patent publicati..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Wuyuan Semiconductor Tech Qingdao Co Ltd has submitted a patent application for Semiconductor Epitaxial Growth Method and Epitaxial Structure. This invention was developed by Liu Jiyuan, Cao Xuewen, Gou Xuexin, Li Heng and Yang Lieyong.
The patent application number is CN202511877878 20251212. The patent p..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Toshiba and Toshiba Electronic Devices & Storage have submitted a patent application for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Endo Yoshinori.
The patent application number is CN20251076003 20250117. The patent publication number is CN121729120 (A). Inte..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Thc Semiconductor Nanjing Co Ltd has sought patent for Slitting Conveying Platform. This invention was developed by Qin Ting, Liu Xiaobin, Gao Jianmei, Guo Yajun, Ji Xiaoqian, Wang Yang and Yu Xiaopeng.
The patent application number is CN202610234337 20260227. The patent publication number is CN121735030 (..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has published Hubei Changjiang Wanrun Semiconductor Tech Co Ltd patent application for High-speed Parallel Emmc Test Method and System. The invention was developed by Wang Qi, Yang Wen, Xing Jipeng and Zhang Jie.
The patent application number is CN202511818865 20..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Vibit Nano Inc has submitted a patent application for Programming of High Resistance State Hrs for Resistive Memory Elements. This invention was developed by Moras Gemma, Picorboni Gianluca and Naveh Ishai.
The patent application number is CN202511345746 20250919. The patent publication number is CN1217258..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Shenglian Ningbo Intelligent Tech Co Ltd has applied Chinese patent for Interaction System and Method with Emotion Dynamic Evolution Memory Function, Medium and Processor. Ge Zihao, Chen Henghao, Hong Jiakai and Ye Zirui developed it.
The patent application number is CN20261085351 20260122. The patent publ..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Toshiba; Toshiba Electronic Devices & Storage has sought patent for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Kadono Hiroshi.
The patent application number is CN202510144171 20250210. The patent publication number is CN121729121 (A). International Patent Cla..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has released Toshiba and Toshiba Electronic Devices & Storage patent application for Semiconductor Device and Method of Manufacturing the Same. This invention was developed by Takada Kenji.
The patent application number is CN20251040983 20250110. The patent publi..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- The 55th Research Inst Of China Electronics Technology Group Corporation has sought patent for Manufacturing Method for SiC Device Electro-coppering Surface PI Passivation Protection. This invention was developed by Zhang Yang, Fan Lei, Liu Siwei, He Ziwei, Zhang Wenhao, Chen Zheng and Yang Yong.
The paten..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has released Toshiba and Toshiba Electronic Devices & Storage patent application for Semiconductor Device. This invention was developed by Kyo Tanabiki.
The patent application number is CN202510144172 20250210. The patent publication number is CN121729107 (A). In..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has published Toshiba and Toshiba Electronic Devices & Storage patent application for Semiconductor Device. The invention was developed by Inoue Daisuke.
The patent application number is CN202510158835 20250213. The patent publication number is CN121729097 (A). I..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Toshiba and Toshiba Electronic Devices & Storage have applied Chinese patent for Semiconductor Device. Takagi Hajime and Oyama Daisuke developed it.
The patent application number is CN202510153941 20250212. The patent publication number is CN121729092 (A). International Patent Classification codes are H10W..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has published Samsung Electronics and Samsung Semiconductor China Res and Development Co Ltd patent application for Semiconductor Package and Method of Manufacturing the Same. The invention was developed by Zhang Peng and Wu Deqi.
The patent application number is..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has released Guangdong Xincheng Hanqi Semiconductor Tech Co Ltd patent application for Wafer Thinning Method. This invention was developed by Han Lei.
The patent application number is CN202511671249 20251114. The patent publication number is CN121729031 (A). Inte..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has published Xuyu Optoelectronics Co Ltd and Xuyu Optoelectronics Shenzhen Co Ltd patent application for Integrated Circuit Visual Positioning Calibration Method Based on Pulse Displacement Reference and Medium. The invention was developed by Lin Jintian, Cai Jilon..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has published Jiangsu Gaoguang New Material Tech Co Ltd patent application for Organic Light-emitting Device. The invention was developed by Guo Shuai, Wang Jianjun, Xu Jun and Huang Jun.
The patent application number is CN202510594619 20250509. The patent public..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- BOE Huacan Optoelectronics Guangdong Co Ltd has sought patent for Light Emitting Diode with High Hole Concentration and Preparation Method Thereof. This invention was developed by Wang Jiangbo, Cong Ying and Yao Zhen.
The patent application number is CN202511602652 20251104. The patent publication number i..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Jiangxi MTC Semiconductor and Jiangxi Zhaochi Integration Tech Co Ltd have sought patent for Light-emitting Diode Epitaxial Wafer, Preparation Method Thereof and Light-emitting Diode. This invention was developed by Jin Conglong, Liu Chunyang, Gao Hong, Hu Jiahui, Zheng Wenjie, Shu Jun, Wang Xiaolan and Ao Yi..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- BOE Huacan Optoelectronics Guangdong Co Ltd has filed a patent application for Light Emitting Diode and Preparation Method Thereof. This invention was developed by Liu Hengshan, Zhang Yu and Jiang Yuanyuan.
The patent application number is CN202511602616 20251104. The patent publication number is CN1217288..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Semiconductor Manufacturing International (Shanghai) and Semiconductor Mfg Int Beijing Corp have sought patent for Semiconductor Structure and Forming Method Thereof. This invention was developed by Yu Donglin.
The patent application number is CN202411312022 20240919. The patent publication number is CN121..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Zhuhai Zero Boundary Integrated Circuit Co Ltd and Gree Electric Appliances, Zhuhai have sought patent for Semiconductor Field Effect Transistor Device and Preparation Method Thereof. This invention was developed by Liao Yongbo, Wang Yu and Xie Zixiang.
The patent application number is CN202511712109 20251..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Zhuhai Zero Boundary Integrated Circuit Co Ltd and Gree Electric Appliances, Zhuhai haVE sought patent for Trench Gate RC-IGBT Device and Manufacturing Method. This invention was developed by Li Chunyan, Liao Yongbo, Xie Zixiang and Dong Lihang.
The patent application number is CN202511712090 20251120. The..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Toshiba; Toshiba Electronic Devices & Storage has filed a patent application for Semiconductor Device. This invention was developed by Kono Hiroshi.
The patent application number is CN202411878687 20241219. The patent publication number is CN121728810 (A). International Patent Classification codes are H10D..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Toshiba; Toshiba Electronic Devices & Storage has filed a patent application for Semiconductor Device. This invention was developed by Kono Hiroshi and Asaba Shunsuke.
The patent application number is CN202411878678 20241219. The patent publication number is CN121728809 (A). International Patent Classifica..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has released Shanghai Dingyangtong Semiconductor Tech Co Ltd patent application for Jfet Device. This invention was developed by Zhou Tong, Zhou Chunying and Gu Hang.
The patent application number is CN202511941266 20251222. The patent publication number is CN121..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Shanghai Xinwei Semiconductor Co Ltd has filed a patent application for Photoresponse Hemt Device and Preparation Method Thereof. This invention was developed by Lei Jiacheng and Yu Zicheng.
The patent application number is CN202511889878 20251215. The patent publication number is CN121728795 (A). Internat..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Nacun Tech Hangzhou Co Ltd has sought patent for Semiconductor Device and Preparation Method Thereof. This invention was developed by Kong Lingbao, Zhu Wang, Zheng Zhiyao and Su Zhiqiang.
The patent application number is CN20251204636 20251226. The patent publication number is CN121728780 (A). Internationa..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Jiangsu Tianke Heda Semiconductor; Beijing Tankeblue Semiconductor has submitted a patent application for Stirring Structure for Crystal Growth and Liquid Phase Growth Device. This invention was developed by Guo Yu, Peng Tonghua, Yang Jian, Sui Xu, Liu Chunjun and Liu Yuhui.
The patent application number i..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Nanjing Advanced Semiconductor Tech Nast Co Ltd has applied Chinese patent for Automatic Calibration Method and System for Single Crystal Furnace. Jiang Hongwei, Zhu Hongmin, Pan Qingyue, Guo Haijun and Huang He developed it.
The patent application number is CN202511748518 20251126. The patent publication ..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Shaanxi Xuntian Broadcasting Technology has applied Chinese patent for Medium Wave Transmitter with Noise Reduction Anti-interference Structure. Qin Linqian, Bai Jinyu and Ma Shulian developed it.
The patent application number is CN202511940223 20251222. The patent publication number is CN121727563 (A). In..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Tianjin Jizhaoyuan Tech Co Ltd has submitted a patent application for Semiconductor Equipment, Microwave Remote Plasma Reaction Chamber and Device. This invention was developed by Li Shuyu, Zhao Haizhi and Wang Chao.
The patent application number is CN202610226731 20260226. The patent publication number is..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Nacun Tech Hangzhou Co Ltd has submitted a patent application for Semiconductor Device and Memory. This invention was developed by Cao Mingjie, Du Yuhui, Shi Qian and Su Zhiqiang.
The patent application number is CN20251200966 20251226. The patent publication number is CN121728776 (A). International Patent..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Fanyuan Tech Suzhou Co Ltd has filed a patent application for Efficient Defluorination Method Suitable for Semiconductor Fluorine-containing Wastewater. This invention was developed by Wang Junyu, Dong Pu, Woo Dae-yong and Zhang Qian.
The patent application number is CN202511872873 20251212. The patent pub..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- China Nuclear Power Institute and Guangdong Nuclear Power Joint Venture have applied Chinese patent for SiC Cladding Joint Preparation Method and SiC Cladding Joint. Gao Changyuan, Xue Jiaxiang, Wu Lixiang, Zhai Jianhan, Wang Jiwei, Shu Rui, Liao Yehong, Li Yun and Zhang Guoliang developed it.
The patent a..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has published Semiconductor Integrated Display Technology patent application for Image Edge Compensation Processing Method and System. The invention was developed by Li Hanguang, Tan Jinshan, Chen Qi, Liu Shengfang, Sun Lin and Zhao Zhengxiao.
The patent applicat..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has published Semiconductor Integrated Display Technology patent application for Image Edge Compensation Processing Method and System. The invention was developed by Li Hanguang, Tan Jinshan, Chen Qi, Liu Shengfang, Sun Lin and Zhao Zhengxiao.
The patent applicat..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Semiconductor Integrated Display Technology has sought patent for Image Edge Compensation Processing Method and System. This invention was developed by Li Hanguang, Tan Jinshan, Chen Qi, Liu Shengfang, Sun Lin and Zhao Zhengxiao.
The patent application number is CN202511887891 20251215. The patent publicat..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has published Semiconductor Integrated Display Technology patent application for Image Edge Compensation Processing Method and System. The invention was developed by Li Hanguang, Tan Jinshan, Chen Qi, Liu Shengfang, Sun Lin and Zhao Zhengxiao.
The patent applicat..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has published Zhixin Hengrui Beijing Supply Chain Man Co Ltd patent application for Integrated Circuit High Aspect Ratio Filling Method Based on Pulse Plasma. The invention was developed by Wen He.
The patent application number is CN202511947615 20251223. The pat..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has published Wuyuan Semiconductor Tech Qingdao Co Ltd patent application for Physical Vapor Deposition Equipment and Deposition Method. The invention was developed by Cao Xuewen, Hua Fengzhao and Guo Shunhua.
The patent application number is CN202511963712 20251..
Semiconductor
| Mon 29 Jun 2026
Taipei, June 30 -- AUROS Technology has been granted a patent for Deep Learning-based Overlay Key Centering System and Method Thereof. Kim Ga-min, Mo Soo-yeon and Ham Hyo-sik developed the invention.
The patent application number is TW20230121154 20230607. The patent publication number is TWI875023 (B). International Patent C..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Advanced Semiconductor Engineering has applied Chinese patent for Semiconductor Device Package and Method of Manufacturing the Same. Liu Zhaowei developed it.
The patent application number is CN202511938538 20200401. The patent publication number is CN121729128 (A). International Patent Classification code..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Xiamen Sky Semiconductor Tech Co Ltd has filed a patent application for Chip Fan-out Packaging Method and Packaging Structure Thereof. This invention was developed by Wu Heng and Yu Daquan.
The patent application number is CN202511638524 20251110. The patent publication number is CN121729115 (A). Internati..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has received Xiamen Sky Semiconductor Tech Co Ltd patent application for System-level Fan-out Packaging Structure and Manufacturing Method Thereof. Wu Heng and Yu Daquan developed the invention.
The patent application number is CN202511638590 20251110. The patent..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Xiamen Sky Semiconductor Tech Co Ltd has applied Chinese patent for Chip Fan-out Packaging Structure and Manufacturing Method Thereof. Wu Heng and Yu Daquan developed it.
The patent application number is CN202511638589 20251110. The patent publication number is CN121729104 (A). International Patent Classif..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- He Chongwen has submitted a patent application for Chip Packaging Structure and Manufacturing Method Thereof.
The patent application number is CN202411309135 20240919. The patent publication number is CN121729101 (A). International Patent Classification codes are H10W70/05, H10W70/65, H10W72/00 and H10W95..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Shanghai Integrated Circuit Equipment Materials Industry Innovation Center has submitted a patent application for Auxiliary Mounting Device for Electrostatic Chuck. This invention was developed by Huang Likun, Li Tianliang, Zhang Peiming and Ye Jiemin.
The patent application number is CN202511992659 202512..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has released Suzhou Yancai Micro Nano Tech Co Ltd, Xi'an Boyan Weina Information Tech Co Ltd and Suzhou Memstools Semiconductor Tech Co Ltd patent application for Wafer De-bonding Method and Structure Based on Porous Metal Electrochemical Gas Production. This invent..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Zhonghuan Advanced Semiconductor Technology has applied Chinese patent for Device and Method for Controlling Width of Grinding Surface of Extension Resistance Test Sample. He Hai, Deng Chunxing, Xue Jinming, Gao Zongqiang and Wu Liang developed it.
The patent application number is CN202511713759 20251120. ..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Nanjing University has submitted a patent application for Source Electrode, Vertical Organic Field Effect Transistor and Preparation Method Thereof. This invention was developed by Zheng Qingdong, Zhou Wenwu, Zhang Fangcong and Zhang Lingxiang.
The patent application number is CN202511660130 20251113. The ..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Qingxin Tech Co Ltd, ACM Research, Shanghai and Acm Res Korea Inc have Submitted a patent application for Shielding Exhaust Ring and Reaction Cavity Structure. This invention was developed by Chen Yu, Wang Hui, Zhang Shan, Baek Hyun Woo, Kim Kyoung-jun, Dong Zhichao and Zhou Peilong.
The patent application..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Xiamen Sky Semiconductor Tech Co Ltd has sought patent for Chip Fan-out Packaging Method and Packaging Structure. This invention was developed by Wu Heng and Yu Daquan.
The patent application number is CN202511638592 20251110. The patent publication number is CN121729070 (A). International Patent Classific..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Quanzhou Sanan Semiconductor Technology has submitted a patent application for Light Emitting Diode. Huang Hanyi, Zheng Sheng and Ding Shaoying developed the invention.
The patent application number is CN202511704449 20251119. The patent publication number is CN121728877 (A). International Patent Classific..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Beijing University has submitted a patent application for Polarization Modulation Tunneling Structure for Improving Injection Efficiency of Algan-based Deep Ultraviolet Light-emitting Device and Application. This invention was developed by Wang Jiaming, Xu Fujun, Tang Ning, Lang Jing, Shen Bo and Kang Xiangni..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has published Vanguard International Semiconductor patent application for Semiconductor Device. The invention was developed by Zou Zhendong, Song Jianxian, Lai Yunkai, Chen Zixuan, Luo Zongren, Liao Zhicheng, Zhang Yurui and Li Jiahao.
The patent application numb..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Shenzhen Pengxinwei Integrated Circuit Manufacturing has sought patent for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Li Zhenquan, Wen Mingliang and He Xuebing.
The patent application number is CN202411311914 20240919. The patent publication number is CN121728790..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Yangtze Memory Technologies has applied Chinese patent for Semiconductor Device and Preparation Method Thereof, and Storage System. Xia Zhengliang, Zhang Quan and Shi Yanwei developed it.
The patent application number is CN202411339932 20240924. The patent publication number is CN121728781 (A). Internation..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Yangtze Memory Technologies has submitted a patent application for Semiconductor Device and Preparation Method Thereof, and Storage System. This invention was developed by Zhang He, Yan Yuan, Yu Chengxing, Li Yaomin, He Jiangyuan and Liu Xiuzhong.
The patent application number is CN202411329080 20240923. T..
Semiconductor
| Mon 29 Jun 2026
Beijing, June 30 -- Dalian University of Technology, Welcome to Northwest A&F University and Xi'an Shiyou University have applied Chinese patent for Dielectric Barrier Discharge-sliding Arc Coupled Plasma Reaction Device and Application Thereof. Wang Tiecheng, Liu Rui and Yi Yanhui developed it.
The patent application number ..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Hefei Nexchip Integrated Circuit has submitted a patent application for Square Resistance Prediction Model Training Method and Square Resistance Prediction Method. This invention was developed by Xu Ke, Chen Jian, Qin Xuwei, Liu Zheru, Qiu Rumeng and Huang Yiquan.
The patent application number is CN2026102..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has released South West University patent application for Three-valued Reconfigurable Logic Circuit Based on Memristor. This invention was developed by Duan Shukai, Luo Li, Wu Jiening, Zhang Fengyun and Wang Lidan.
The patent application number is CN202511936706 ..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- Xincun Technology (Wuhan) has sought patent for Operation Method of Memory and Memory. This invention was developed by Liu Jun, Li Tianyu, Yin Ran, Chen Bin and Yang Hongxin.
The patent application number is CN202511780647 20251128. The patent publication number is CN121725851 (A). International Patent Cla..
Semiconductor
| Tue 30 Jun 2026
Beijing, June 30 -- State Intellectual Property Office of China has released Huawei Technologies patent application for Magnetoelectric Disc, Magnetoelectric Memory and Data Storage System. This invention was developed by Xiong Jianbo and Wang Zhengquan.
The patent application number is CN202411335278 20240924. The patent pub..
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