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05:09:26 Mon 18 May 2026

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Nantong University

(3)

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(2)

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International Business Ma

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(2)

(2)

(2)

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(2)

(2)

(2)

Nanchang University; Nanc

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(2)

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(2)

Northwest Electronic Equi

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Sichuan Micron Biotechnol

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Tae Sung Co Ltd

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Tokyo Electron Ltd [jp];

(2)

Tokyo Electron Ltd [jp];

(2)

Toray Engineering

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(2)

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(2)

(2)

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Winbond Electronics

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(2)

Xiaomi Automobile Technol

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(2)

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(2)

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(2)

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Zhongke Shenzhen Wireless

(2)

Zhuhai Gree Electronic Co

(2)

(1)

(1)

AZUR SPACE Solar Power

(1)

(1)

Adeia Semiconductor Solut

(1)

(1)

Advanced Power Electronic

(1)

Advanced Semiconductor En

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Aerospace Haiying Zhenjia

(1)

Aihua Wuxi Semiconductor

(1)

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(1)

Allumax Tti Llc

(1)

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(1)

American Axle & Manufactu

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(1)

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(1)

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(1)

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(1)

Anji Microelectronics, Sh

(1)

(1)

(1)

Atomera Incorporated

(1)

(1)

AutoNetworks Technologies

(1)

Avago Technologies Intern

(1)

Avic Fushida Tech Co Ltd

(1)

Axalta Coating Systems Gm

(1)

(1)

BOE Tech Group Co Ltd [cn

(1)

BOE Tech Group Co Ltd [cn

(1)

BOE Tech Group Co Ltd [cn

(1)

BOE Tech Group Co Ltd [cn

(1)

BOE Tech Group Co Ltd [cn

(1)

BOE Tech Group Co Ltd [cn

(1)

BOE Tech Group Co Ltd [cn

(1)

BOE Technology Group Co L

(1)

BOE Technology Group Co L

(1)

BOE Technology Group Co L

(1)

BOE Technology Group; Che

(1)

BOE Technology Group; Che

(1)

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BYD Company; BYD Semicond

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(1)

Baixin Information Tech C

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Beijing Institute of Nano

(1)

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(1)

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(1)

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(1)

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(1)

Beijing Mxtronics Corp; B

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(1)

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(1)

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(1)

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(1)

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(1)

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(1)

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(1)

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(1)

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(1)

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(1)

(1)

Caihong Display Devices

(1)

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Central Glass Co Limited

(1)

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(1)

Changchun Normal Universi

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(1)

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(1)

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(1)

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(1)

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China Circuit Tech Sichua

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China Electronics Enginee

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Chinainstru & Quantumtech

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Chip Wealth Tech Ltd

(1)

ChipMOS Technologies (Sha

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Chipbond Technology

(1)

Chipone Technology, Beiji

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Chongqing Hkc Optoelectro

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(1)

Chongqing Konka Photoelec

(1)

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Chongqing University of P

(1)

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Cisdi Technology Research

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Commissariat A Lenergie A

(1)

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(1)

(1)

(1)

Cyg Changtong Tech Co Ltd

(1)

(1)

Dafa Tech Co Ltd

(1)

(1)

Dalian Neusoft University

(1)

Dalian Tongxiang Tech Co

(1)

Danuoer Hubei Microelectr

(1)

Debang Kunshan Mat Co Ltd

(1)

(1)

Disco Corp [jp]; Deckers

(1)

(1)

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(1)

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(1)

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(1)

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East China Institute of T

(1)

Ebner Ind Ofenbau

(1)

Eink Transcend Optronics

(1)

Eldolab Holding B V

(1)

Electric Power Planning &

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(1)

Elite Semiconductor Micro

(1)

Ememory Technology

(1)

Enf Tech Co Ltd [kr]; SK

(1)

Enkris Semiconductor

(1)

Enpu Qianrui Electronic T

(1)

Eversun Polycarbon Sci &

(1)

(1)

Feiluote Jiangsu Intellig

(1)

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(1)

Focused Photonics Hangzho

(1)

Forewin Electronics Corp

(1)

Foshan NationStar Optoele

(1)

Freiberger Compound Mat G

(1)

Fubo Heilongjiang Energy

(1)

Fudan University

(1)

Fuji Polymer Industries

(1)

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(1)

(1)

Fuzhou Tuoweikong Automat

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(1)

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Gaoneng Ruitai Shandong E

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GlobalFoundries Singapore

(1)

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Gree Electric Appliances,

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Guangdong University of T

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(1)

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(1)

(1)

(1)

Haiguang Information Tech

(1)

Haiguang Information Tech

(1)

Hainan Rutai Tech Co Ltd

(1)

Haining Guian Materials T

(1)

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(1)

Hangzhou Beihang Univ Int

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(1)

Hangzhou Jihai Semiconduc

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(1)

Hangzhou Longzhu Tech Co

(1)

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(1)

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Hanxu Tech Beijing Co Ltd

(1)

Harbin Institute of Techn

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Hefei University of Techn

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Hefei Zheta Tech Co Ltd;

(1)

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Hella GmbH & Co KGaA

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Henan Academy Of Sciences

(1)

Henan Ancai Hi Tech Co Lt

(1)

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(1)

Hengshuo Semiconductor (H

(1)

Henkel Ag & Co Kgaa [de];

(1)

Hewlett Packard Enterpris

(1)

(1)

Hong Kong University of S

(1)

Hongyang Display (Xianyan

(1)

(1)

Hoya Optical Laboratory U

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Hoya Optical Labs of Amer

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Huaian Aucksun Optoelectr

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(1)

Huangshan 777 Electronics

(1)

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(1)

Huawei Digital Power Tech

(1)

Huazhong University of Sc

(1)

Huazhong University of Sc

(1)

Hubei Jiangcheng Chip Pil

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Hubei Jiufengshan Laborat

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Hubei Nuode Copper Foil N

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Hubei Sanfbot Co Ltd

(1)

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(1)

Huizhou Glorysky Electron

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(1)

Hunan Sanlicheng Tech Co

(1)

Hunan Shuoke Jinglei Semi

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Hunan University of Techn

(1)

Hunan University; Changsh

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Hunan Yuemo Advanced Semi

(1)

Hunan Zhihaohang Precisio

(1)

(1)

(1)

Icare Finland Oy

(1)

(1)

(1)

(1)

Infineon Technologies Ame

(1)

Ingenic Semiconductor Co

(1)

Inner Mongolia Terun Ind

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Inner Mongolia Zhonghuan

(1)

Inno Saike (Suzhou) Semic

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Innoscience Suzhou Techno

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Institute Of Advanced Res

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Institute of Microelectro

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Institute of Modern Physi

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Institute of Zoology, Chi

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(1)

Itest Semiconductor Techn

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(1)

Ji Hua Laboratory

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Jianghuai Frontier Techno

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Jiangnan University; Wuxi

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Jiangsu Aoguang Electroni

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Jiangsu Asia Electronics

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Johnson Controls Tyco Ip

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Kawasaki Jukogyo K K

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Kele Packaging Ningbo Co

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Kim Dong Hwan [kr]; Noh M

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Kk Toshiba [jp]; Toshiba

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Korea Institute of Fusion

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Kunming University of Sci

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Kyky Technology Co Ltd

(1)

(1)

LG Energy Solution

(1)

(1)

LYSTEEL; Wuhan University

(1)

Lam Wai Kin Raymond

(1)

Lansus Technologies

(1)

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Lanzhou University

(1)

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Leadtrend Technology

(1)

Lee Kyusang [us]; Future

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(1)

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Lisen Noco Company

(1)

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(1)

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(1)

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(1)

Microsoft Technology Lice

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(1)

NAMICS Corporation

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(1)

(1)

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(1)

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(1)

Nanjing Inst Advanced Las

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National Inst Of Advanced

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(1)

(1)

(1)

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State Intellectual Property Office of China Releases Phison Electronics Patent Application for Semiconductor Assembly

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Phison Electronics patent application for Semiconductor Assembly. This invention was developed by Liu Yujia and Wang Jingkai. The patent application number is CN202511507474 20251021. The patent publication number is CN121335504 (A). International Pat..

Shenyang Kingsemi Microelectronics Equipment Submits Patent Application for Liquid Processing Device and Liquid Processing Method

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Shenyang Kingsemi Microelectronics Equipment has submitted a patent application for Liquid Processing Device and Liquid Processing Method. Liu Kaining, Yu Weida, Zhang Huaidong, Wang Lihe and Tian Chong developed the invention. The patent application number is CN202511485570 20251017. The patent publication..

State Intellectual Property Office of China Receives Xinyang Vocational & Technical College Patent Application for Crbr3-based Spin Filtering Magnetic Tunnel Junction

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Xinyang Vocational & Technical College patent application for Crbr3-based Spin Filtering Magnetic Tunnel Junction. Feng Jindi, Wu Yuanyuan, Zhang Jun, Lyu Zheng and Xiong Jinzhu developed the invention. The patent application number is CN202511649206 ..

Xiamen Sanan Optoelectronics Submits Chinese Patent Application for Light Emitting Diode and Light Emitting Device

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Xiamen Sanan Optoelectronics has submitted a patent application for Light Emitting Diode and Light Emitting Device. This invention was developed by Zeng Mingjun, Zhong Wei, He Anhe, Ye Yuting, Lee Young-ah and Zhang Zhongying. The patent application number is CN202511403788 20250929. The patent publication ..

Xiamen Sanan Optoelectronics Applies for Patent on Light Emitting Diode and Light Emitting Device

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Xiamen Sanan Optoelectronics has applied Chinese patent for Light Emitting Diode and Light Emitting Device. Zeng Mingjun, Zhong Wei, He Anhe, Ye Yuting, Lee Young-ah and Zhang Zhongying developed it. The patent application number is CN202511403418 20250929. The patent publication number is CN121335309 (A). ..

State Intellectual Property Office of China Receives Suzhou Huatai Electronic Technology Patent Application for Semiconductor Structure and Manufacturing Method Thereof, and Manufa..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Suzhou Huatai Electronic Technology patent application for Semiconductor Structure and Manufacturing Method Thereof, and Manufacturing Method of Injection Separation Blade. Xiong Zhijun developed the invention. The patent application number is CN20251..

Suzhou Huatai Electronic Technology Submits Chinese Patent Application for Semiconductor Structure and Manufacturing Method Thereof

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Suzhou Huatai Electronic Technology has submitted a patent application for Semiconductor Structure and Manufacturing Method Thereof. This invention was developed by Xiong Zhijun. The patent application number is CN202511563907 20251029. The patent publication number is CN121335125 (A). International Patent ..

State Intellectual Property Office of China Releases Renesas Electronics Patent Application for Semiconductor Device and Manufacturing Method Thereof

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Renesas Electronics patent application for Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Kaneko Takao. The patent application number is CN202510870994 20250626. The patent publication number is CN121335182 (A)...

Suzhou Huatai Electronic Technology Seeks Patent for Semiconductor Device and Preparation Method Thereof

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Suzhou Huatai Electronic Technology has sought patent for Semiconductor Device and Preparation Method Thereof. This invention was developed by Xiong Zhijun. The patent application number is CN202511574234 20251030. The patent publication number is CN121335165 (A). International Patent Classification codes a..

State Intellectual Property Office of China Releases United Microelectronics Corporation Patent Application for Semiconductor Structure and Forming Method Thereof

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released United Microelectronics Corporation patent application for Semiconductor Structure and Forming Method Thereof. This invention was developed by Wang Jialin. The patent application number is CN20241169458 20240806. The patent publication number is CN121..

State Intellectual Property Office of China Publishes Qingdao University Patent Application for Organic-inorganic Van Der Waals Heterojunction Field Effect Transistor and Preparati..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Qingdao University patent application for Organic-inorganic Van Der Waals Heterojunction Field Effect Transistor and Preparation Method Thereof. The invention was developed by Fu Beibei, Zhang Cong and Sun Guangxin. The patent application number is C..

Memsic Semiconductor Wuxi Co Ltd Submits Chinese Patent Application for Second Order IIR Filter

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Memsic Semiconductor Wuxi Co Ltd has submitted a patent application for Second Order IIR Filter. This invention was developed by Hui Siqi, Xiao Silong, Zhong Yali and Li Jing. The patent application number is CN202511366150 20250923. The patent publication number is CN121333266 (A). International Patent Cla..

Jiangsu Sanmikesi Semiconductor Equipment Co Ltd Files Chinese Patent Application for High-precision Air Floatation Translation Table and Control Method Thereof

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Jiangsu Sanmikesi Semiconductor Equipment Co Ltd has filed a patent application for High-precision Air Floatation Translation Table and Control Method Thereof. This invention was developed by Wang Min and Zhu Jun. The patent application number is CN202511639049 20251110. The patent publication number is CN1..

Tropical Crops Genetic Resources Institute, CATAS Applies for Patent on Beautiful Millettia Root Liquid Phase Chip as Well as Preparation Method and Application Thereof

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Tropical Crops Genetic Resources Institute, CATAS has applied Chinese patent for Beautiful Millettia Root Liquid Phase Chip as Well as Preparation Method and Application Thereof. Li Zhiying, Xu Li, Meng Chunyang, Wang Jiabin, Fu Yunliu, Wang Minrui, Yang Qingquan, Chen Langxin, Wang Xiaobing, Huang Bilan and Z..

ASM International Holding Applies for Patent on Method of Filling Gap on Surface of Substrate

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- ASM International Holding has applied Chinese patent for Method of Filling Gap on Surface of Substrate. Sugiura Keiji, Kurumisawa Hirohiro, Saha Tuhin, Kikuchi Yoshiyuki, Remnev Alexander and Mishra Abhinav developed it. The patent application number is CN202510926642 20250707. The patent publication number i..

State Intellectual Property Office of China Publishes Spreadtrum Semiconductor (Nanjing) Patent Application for Interference Elimination Method and Device and Computer Equipment

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Spreadtrum Semiconductor (Nanjing) patent application for Interference Elimination Method and Device and Computer Equipment. The invention was developed by Gao Jiangjiang, Lu Huan and Han Huohuo. The patent application number is CN202511478575 202510..

Spreadtrum Semiconductor (Nanjing) Submits Patent Application for Communication Method and Device, Terminal Equipment and Network Equipment

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Spreadtrum Semiconductor (Nanjing) has submitted a patent application for Communication Method and Device, Terminal Equipment and Network Equipment. Lei Zhenzhu and Zhou Huayu developed the invention. The patent application number is CN202410941046 20240712. The patent publication number is CN121334819 (A)...

Dalian Neusoft University of Information Applies for Patent on Narrow-linewidth High-power Semiconductor Laser and Coupling Method Thereof

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Dalian Neusoft University of Information has applied Chinese patent for Narrow-linewidth High-power Semiconductor Laser and Coupling Method Thereof. Zhang Cai, Liu Long, Chen Yiling, Ju Ernan and Sun Jing developed it. The patent application number is CN202511530390 20251024. The patent publication number is ..

Shenzhen Xinkailai Industry Machine Applies for Patent on Brake Box, Motion Control System, Mechanical Arm and Semiconductor Equipment

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Shenzhen Xinkailai Industry Machine has applied Chinese patent for Brake Box, Motion Control System, Mechanical Arm and Semiconductor Equipment. Xu Jialin developed it. The patent application number is CN202511637440 20251107. The patent publication number is CN121333132 (A). International Patent Classificati..

SanDisk Technologies Applies for Patent on Dynamic Integrity and Data Encryption (ide) Aggregation Size

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- SanDisk Technologies has applied Chinese patent for Dynamic Integrity and Data Encryption (ide) Aggregation Size. Benisty Shay developed it. The patent application number is CN202510482098 20250417. The patent publication number is CN121333542 (A). International Patent Classification codes are H04L41/0896 and..

Samsung Electronics Applies for Patent on Semiconductor Memory Device

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Samsung Electronics has applied Chinese patent for Semiconductor Memory Device. Chang Sung-hwan and Park Hyo-jin developed it. The patent application number is CN202510276642 20250310. The patent publication number is CN121335091 (A). International Patent Classification code is H10B12/00. Cooperative Patent C..

GlobalWafers Applies for Patent on Ingot Pulling Apparatus with Dopant Feeder for Adding Multiple Dopant Batches

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- GlobalWafers has applied Chinese patent for Ingot Pulling Apparatus with Dopant Feeder for Adding Multiple Dopant Batches. Wu Junsheng, Huang Honghui, Zeng Xianda, Lin Zhengyi, Cai Fengjian, Wu Yuqiao, Meyer Benjamin Michael, Jung Young Goon, Zhang Zheming and Hudson Karlheinz Marie developed it. The patent a..

Nippon Electric Glass Applies for Patent on Glass for Coating Semiconductor Element and Sintered Body for Coating Semiconductor Element

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Nippon Electric Glass has applied Chinese patent for Glass for Coating Semiconductor Element and Sintered Body for Coating Semiconductor Element. Hirose Masayuki developed it. The patent application number is CN20248037730 20240604. The patent publication number is CN121335867 (A). International Patent Classi..

Umicore AG Applies for Patent on Coating Device for Substrate Body

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Umicore AG has applied Chinese patent for Coating Device for Substrate Body. Masson Stephane, Foerster Martin, Gensch Michael, Kuehn Clemens and Weigel Yvonne developed it. The patent application number is CN20248039852 20240604. The patent publication number is CN121335766 (A). International Patent Classific..

Hunan Yuemo Advanced Semiconductor Applies for Patent on High-integration-level Packaging Structure and Method Based on Main Chip Slotting

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Hunan Yuemo Advanced Semiconductor has applied Chinese patent for High-integration-level Packaging Structure and Method Based on Main Chip Slotting. Yin Zhenghao, Xu Zhiming and He Hongbing developed it. The patent application number is CN202511637639 20251110. The patent publication number is CN121335603 (A)..

Beijing NAURA Microelectronics Equipment Applies for Patent on Drying Device and Semiconductor Cleaning Equipment

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Beijing NAURA Microelectronics Equipment has applied Chinese patent for Drying Device and Semiconductor Cleaning Equipment. Zhang Jun developed it. The patent application number is CN202410910160 20240708. The patent publication number is CN121335438 (A). International Patent Classification codes are F26B21/0..

Kokusai Electric Applies for Patent on Processing Method, Method of Manufacturing Semiconductor Device, Processing Apparatus, and Recording Medium

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Kokusai Electric has applied Chinese patent for Processing Method, Method of Manufacturing Semiconductor Device, Processing Apparatus, and Recording Medium. Nakatani Kimihiko, Miyata Shoma and Hamada Keitaro developed it. The patent application number is CN202510241369 20250228. The patent publication number ..

United Microelectronics Corporation Applies for Patent on Structure with High, Medium and Low Voltage Transistors and

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- United Microelectronics Corporation has applied Chinese patent for Structure with High, Medium and Low Voltage Transistors and. Li Xinhong developed it. The patent application number is CN202410958613 20240717. The patent publication number is CN121335193 (A). International Patent Classification codes are H10..

Showa Denko K K Seeks Patent for Metal Removal Method, Dry Etching Method, and Production Method for Semiconductor Element

Semiconductor

| Mon 18 May 2026

Singapore, May 18 -- Showa Denko K K has sought patent for Metal Removal Method, Dry Etching Method, and Production Method for Semiconductor Element. This invention was developed by Matsui Kazuma. The patent application number is SG20211111745Y 20200417. The patent publication number is SG11202111745Y (A). International Patent ..

Tuojing Technology, Shanghai Seeks Patent for Flow Resistance Adjusting Mechanism, Gas Distribution Device and Method and Processing Equipment of Semiconductor Device

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Tuojing Technology, Shanghai has sought patent for Flow Resistance Adjusting Mechanism, Gas Distribution Device and Method and Processing Equipment of Semiconductor Device. This invention was developed by Lee Wookbong. The patent application number is CN202511589777 20251031. The patent publication number is ..

Applied Materials Seeks Patent for Formation of Silicon-containing and Metallic Materials for Harddie Applications

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Applied Materials has sought patent for Formation of Silicon-containing and Metallic Materials for Harddie Applications. This invention was developed by Zhong Guangyan, Seo Jong-bum, Venkatasubrahmaniah Eswaran, Rajarajan Suresh K, Kedlaya Dinesh, Balasubramanian Ganesh and Mallick Abhijit Basu. The patent ap..

Huawei Technologies Seeks Patent for Auto-negotiation Method and System, Communication Device and Chip

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Huawei Technologies has sought patent for Auto-negotiation Method and System, Communication Device and Chip. This invention was developed by Tang Xiaoyan, He Xiang, Hu Jun and Mi Guangcan. The patent application number is CN202410928497 20240710. The patent publication number is CN121333480 (A). International..

Texas Instruments Seeks Patent for Integration of Directional Coupler with Power Combiner

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Texas Instruments has sought patent for Integration of Directional Coupler with Power Combiner. This invention was developed by Das Arnab and Dandu Krishnanshu. The patent application number is CN202510858116 20250625. The patent publication number is CN121332939 (A). International Patent Classification codes..

Shenzhen Xinkailai Industry Machine Seeks Patent for Reflecting Plate, Semiconductor Processing Chamber and Semiconductor Annealing Process Equipment

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Shenzhen Xinkailai Industry Machine has sought patent for Reflecting Plate, Semiconductor Processing Chamber and Semiconductor Annealing Process Equipment. This invention was developed by Yu Zhicheng, Wu Haiqin and Yang Guanlei. The patent application number is CN202511562747 20251028. The patent publication ..

The 55th Research Institute of China Electronics Technology Group Seeks Patent for Method for Realizing Low-stress Upright Transfer Stacking Integration of Semiconductor Film

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- The 55th Research Institute of China Electronics Technology Group has sought patent for Method for Realizing Low-stress Upright Transfer Stacking Integration of Semiconductor Film. This invention was developed by Chen Xin, Dai Jiayun, Wang Fei, Liu Chenbo, Kong Yuechan and Chen Tangsheng. The patent applicati..

Taiwan Semiconductor Manufacturing Seeks Patent for Semiconductor Device and Forming Method Thereof

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Taiwan Semiconductor Manufacturing has sought patent for Semiconductor Device and Forming Method Thereof. This invention was developed by Wang Pingwei, Chen Ruilin and Hong Lianrong. The patent application number is CN202511330210 20250917. The patent publication number is CN121335209 (A). International Paten..

STMicroelectronics International Seeks Patent for Electronic Device with Reduced Electric Field in Superficial Layer and Method of Manufacturing Same

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- STMicroelectronics International has sought patent for Electronic Device with Reduced Electric Field in Superficial Layer and Method of Manufacturing Same. This invention was developed by Milani Alessandro, Pizzi Elisabetta and Palumbo Vincenzo. The patent application number is CN202510940358 20250709. The pa..

Samsung Electronics Seeks Patent for Semiconductor Memory Device

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Samsung Electronics has sought patent for Semiconductor Memory Device. This invention was developed by Nam Kyung-tae and Piao Zhequan. The patent application number is CN202510299041 20250313. The patent publication number is CN121335092 (A). International Patent Classification codes are G11C11/404, G11C11/40..

Jiangxi Qianzhao Semiconductor Tech Co Ltd and Yangzhou Changelight Submit Chinese Patent Application for Multi-junction Solar Cell, Preparation Method Thereof and Power Supply Equ..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Jiangxi Qianzhao Semiconductor Tech Co Ltd and Yangzhou Changelight have submitted a patent application for Multi-junction Solar Cell, Preparation Method Thereof and Power Supply Equipment. This invention was developed by Han Xiaoya, Zhang Ce, Wen Zhongrui and Fan Chunhui. The patent application number is C..

State Intellectual Property Office of China Publishes Caihong Display Devices Patent Application for Spray Cleaning Device and Method for Glass Substrate

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Caihong Display Devices patent application for Spray Cleaning Device and Method for Glass Substrate. The invention was developed by Jiao Zongping, Hou Hongrong and Zhang Zhijun. The patent application number is CN202511582851 20251031. The patent publi..

State Intellectual Property Office of China Publishes East China Institute of Technology Patent Application for Heavy Isotope Substituted Organic Semiconductor Material and Organic..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published East China Institute of Technology patent application for Heavy Isotope Substituted Organic Semiconductor Material and Organic Electroluminescent Device Comprising Same. The invention was developed by Xu Qianqian, Ma Wei, Mi Zhiming, Liao Lintao, Li Zuo..

State Intellectual Property Office of China Publishes South West University Patent Application for Buffalo Whole Genome 20k Liquid-phase SNP Chip as Well as Design Method and Appli..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published South West University patent application for Buffalo Whole Genome 20k Liquid-phase SNP Chip as Well as Design Method and Application Thereof. The invention was developed by Zhang Gongwei, Zhang Wenxiu, Zuo Fuyuan, Chen Xining, Fu Shubin and Zhou Zeyang...

State Intellectual Property Office of China Publishes Texas Instruments Patent Application for Method and Device for Preventing Undesired Triggering of Short Circuit or Overcurrent..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Texas Instruments patent application for Method and Device for Preventing Undesired Triggering of Short Circuit or Overcurrent Protection. The invention was developed by Roy Sashwati, Chauhan Abhishek and Gupta Vivek. The patent application number is C..

State Intellectual Property Office of China Publishes Chengdu Aerospace Bomu Electronic Technology Patent Application for Compact Interconnection Transmission Structure of Multi-ch..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Chengdu Aerospace Bomu Electronic Technology patent application for Compact Interconnection Transmission Structure of Multi-channel Transceiving Multifunctional Chip. The invention was developed by Yan Yukai, Wang Ximao, Peng Yitong, Liu Qi, Li Hanxiang..

State Intellectual Property Office of China Publishes ASML Netherlands Patent Application for Optical Measurement Marks

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published ASML Netherlands patent application for Optical Measurement Marks. The invention was developed by Cabon Laurent, Nikipelov Alexandr, Cheung Derrick Y C, Van De Kerkhof Marcus Adrianus, Van Laar Marie-christine and Eilden Neil Peter. The patent applicat..

State Intellectual Property Office of China Publishes Semiconductor Components Industries Patent Application for Substrate and Manufacturing Method Thereof, and Package and Manufac..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Semiconductor Components Industries patent application for Substrate and Manufacturing Method Thereof, and Package and Manufacturing Method Thereof. The invention was developed by Kim Sung-sung, Shi Xiaomin, Xing Anan, Seo Seung-hwa and Lee Keunhyuk. T..

State Intellectual Property Office of China Publishes Taiwan Semiconductor Manufacturing Patent Application for Integrated Circuit Device, Method of Manufacturing Same, and Method ..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has published Taiwan Semiconductor Manufacturing patent application for Integrated Circuit Device, Method of Manufacturing Same, and Method of Generating Integrated Circuit Layout. The invention was developed by Huang Jingyu, Lin Junyan, Lin Weicheng and Zeng Jiantin..

State Intellectual Property Office of China Receives Shaanxi Zhongke Tiandi Aviation Module Patent Application for Anti-voltage Surge Control Circuit for Parallel Driving of Multip..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Shaanxi Zhongke Tiandi Aviation Module patent application for Anti-voltage Surge Control Circuit for Parallel Driving of Multiple MOS (metal Oxide Semiconductor) Transistors. Dai Aohua, Wu Xinxing, Zhang Chaoyang, Xiao Ke, Xia Mingyu and Jin Runkang deve..

State Intellectual Property Office of China Receives Cypress Semiconductor Corporation Patent Application for Improving Wireless Personal Area Network Performance in Dense Wireless..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Cypress Semiconductor Corporation patent application for Improving Wireless Personal Area Network Performance in Dense Wireless Environments. Munukutla Srikanth S and Konchara Ramesh developed the invention. The patent application number is CN2025109564..

State Intellectual Property Office of China Receives Beijing Xuanjie Technology Patent Application for Communication Method and Device, Electronic Equipment, Chip and Storage Mediu..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Beijing Xuanjie Technology patent application for Communication Method and Device, Electronic Equipment, Chip and Storage Medium. Ding Shaoyang, Dong Zhijiang and Luo Guanghua developed the invention. The patent application number is CN202511537910 2025..

State Intellectual Property Office of China Receives Huawei Technologies Patent Application for Connecting Film and Manufacturing Method Thereof, and Semiconductor Packaging Struct..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Huawei Technologies patent application for Connecting Film and Manufacturing Method Thereof, and Semiconductor Packaging Structure and Packaging Method Thereof. Ren Hui, Zong Fei, Gao Fei, Zhu Shaochen, Han Zuoyan and Li Xiaoyue developed the invention. ..

State Intellectual Property Office of China Receives Shenzhen Tong Fang Electronic New Material Patent Application for Bonding Wire Welding Method Based on Bare Chip Interconnectio..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Shenzhen Tong Fang Electronic New Material patent application for Bonding Wire Welding Method Based on Bare Chip Interconnection. Xiao Dawei, Huang Jiaqiang, Liu Yujie, Yu Gongliang, Xiao Dongming, Yu Haitao, Xiao Hanfei, Xiao Jian, Xiao Xue and Liu Jiad..

State Intellectual Property Office of China Receives Huawei Technologies Patent Application for Package Substrate and Manufacturing Method Thereof, Semiconductor Device and Electro..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Huawei Technologies patent application for Package Substrate and Manufacturing Method Thereof, Semiconductor Device and Electronic Equipment. Zhang Tonglong, Du Jiandi, Chen Tao, Wu Shenghao, Liu Siyan and Li Xiaoru developed the invention. The patent a..

State Intellectual Property Office of China Receives Hefei Nexchip Integrated Circuit Patent Application for Preparation Method of Semiconductor Structure

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Hefei Nexchip Integrated Circuit patent application for Preparation Method of Semiconductor Structure. Tang Pengfei, Li Mengmeng and Wei Wei developed the invention. The patent application number is CN202511861159 20251211. The patent publication number..

State Intellectual Property Office of China Receives Taiwan Semiconductor Manufacturing Patent Application for Complementary Field Effect Transistor

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has received Taiwan Semiconductor Manufacturing patent application for Complementary Field Effect Transistor. Kang Weicheng, Shen Menghong, Jiang Hongli, Lin Junyan and Zeng Jianting developed the invention. The patent application number is CN202511315108 20250915. ..

Intellectual Property Office Of Singapore Receives Hamamatsu Photonics Patent Application for Semiconductor Apparatus Examination Method and Semiconductor Apparatus Examination App..

Semiconductor

| Mon 18 May 2026

Singapore, May 18 -- Intellectual Property Office Of Singapore has received Hamamatsu Photonics patent application for Semiconductor Apparatus Examination Method and Semiconductor Apparatus Examination Apparatus. Takeshima Tomochika, Higuchi Takafumi and Hotta Kazuhiro developed the invention. The patent application number is S..

State Intellectual Property Office of China Releases Beijing Xuanjie Technology Patent Application for Communication Method, Device, Equipment, Chip and Medium

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Beijing Xuanjie Technology patent application for Communication Method, Device, Equipment, Chip and Medium. This invention was developed by Ni Wenli. The patent application number is CN202511393916 20250926. The patent publication number is CN121333488 ..

State Intellectual Property Office of China Releases Wuxi Photon Chip United Research Center Patent Application for Preparation Method for Processing Through Hole and Optical Chip

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Wuxi Photon Chip United Research Center patent application for Preparation Method for Processing Through Hole and Optical Chip. This invention was developed by Li Tao, Shi Changkun and Kim Hyun-min. The patent application number is CN202511412633 202509..

State Intellectual Property Office of China Releases Chipbond Technology Patent Application for Substrate Structure with Micro-bumps and Manufacturing Method Thereof

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Chipbond Technology patent application for Substrate Structure with Micro-bumps and Manufacturing Method Thereof. This invention was developed by Oh Sung In, Zhang Shizhong, Li Junde and Ye Xueshun. The patent application number is CN202410998415 202407..

State Intellectual Property Office of China Releases Hefei Ic Valley Microelectronics Patent Application for Automatic Feeding and Discharging Equipment for Microwave Chip Producti..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Hefei Ic Valley Microelectronics patent application for Automatic Feeding and Discharging Equipment for Microwave Chip Production. This invention was developed by Shang Chengwei, Peng Sheng, Song Jianwei, Huang Junheng and Liu Jiabing. The patent applic..

State Intellectual Property Office of China Releases Tokyo Electron Patent Application for Information Processing Apparatus and Performance Evaluation Method

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Tokyo Electron patent application for Information Processing Apparatus and Performance Evaluation Method. This invention was developed by Furuya Daigo, Yamamoto Masakazu, Karasawa Hiroyuki and Enomoto Tadashi. The patent application number is CN20251087..

State Intellectual Property Office of China Releases Qinghe Jingyuan Tianjin Semiconductor Material Patent Application for Bonding Method and Composite Substrate

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Qinghe Jingyuan Tianjin Semiconductor Material patent application for Bonding Method and Composite Substrate. This invention was developed by Wang Kun, Mu Fengwen, Liu Fuchao, Tan Xianghu and Guo Chao. The patent application number is CN202410895048 202..

State Intellectual Property Office of China Releases Huawei Technologies Patent Application for Chip, Semiconductor Packaging Structure and Electronic Equipment

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Huawei Technologies patent application for Chip, Semiconductor Packaging Structure and Electronic Equipment. This invention was developed by Hu Xiang, He Chao, Dong Yaoqi, Chen Xiao, Huang Hefu, Yang Jingwen and Xu Junhao. The patent application number ..

State Intellectual Property Office of China Releases Leadtrend Technology Patent Application for High Electron Mobility Transistor Structure and Depletion Type Semiconductor Transi..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Leadtrend Technology patent application for High Electron Mobility Transistor Structure and Depletion Type Semiconductor Transistor Structure. This invention was developed by Zhang Zhiyao, Gao Zhengsheng and Xiong Zhiwen. The patent application number i..

State Intellectual Property Office of China Releases Taiwan Semiconductor Manufacturing Patent Application for Diode Structure, Semiconductor Device and Manufacturing Method Thereo..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Taiwan Semiconductor Manufacturing patent application for Diode Structure, Semiconductor Device and Manufacturing Method Thereof. This invention was developed by Ye Yuhong, Huang Ruiqian and Lin Wenjie. The patent application number is CN202511330206 20..

State Intellectual Property Office of China Releases Beijing Chaoxian Memory Research Institute Patent Application for Semiconductor Structure and Preparation Method Thereof, Semic..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Beijing Chaoxian Memory Research Institute patent application for Semiconductor Structure and Preparation Method Thereof, Semiconductor Device and Preparation Method Thereof, and Electronic Equipment. This invention was developed by Yu Jiating, Li Yuke a..

State Intellectual Property Office of China Releases Taicang Haifeng Electroplating Patent Application for Automatic Electroplating Production Line and Production Process

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- State Intellectual Property Office of China has released Taicang Haifeng Electroplating patent application for Automatic Electroplating Production Line and Production Process. This invention was developed by Wang Haifeng and Guo Xiaoyang. The patent application number is CN202511444282 20251010. The patent pu..

Guangzhou Fangbang Electronics Co Ltd and Zhuhai Dachuang Electronics Co Ltd Seek Patent for Metal Foil, Metal-clad Laminate, Wiring Board, Semiconductor Material, and Negative Ele..

Semiconductor

| Fri 15 May 2026

Beijing, May 16 -- Guangzhou Fangbang Electronics Co Ltd and Zhuhai Dachuang Electronics Co Ltd have sought patent for Metal Foil, Metal-clad Laminate, Wiring Board, Semiconductor Material, and Negative Electrode Material. This invention was developed by Su Zhi, Zhou Hanyu and Cui Caiping. The patent application number is CN2..

Neenah Gessner GmbH and Swm Holdco Luxembourg File European Patent Application for Filter Comprising a Paper Substrate Comprising a Monolayer Base Web with Different Fibrous Portio..

Semiconductor

| Fri 15 May 2026

Munich, May 16 -- Neenah Gessner GmbH and Swm Holdco Luxembourg have filed a patent application for Filter Comprising a Paper Substrate Comprising a Monolayer Base Web with Different Fibrous Portions. This invention was developed by Niederhuber Armin and Leon Romuald. The patent application number is EP20240306871 20241107. T..

North Integrated Circuit Tech Innovation Center and Tsinghua University Apply for Patent on Method and Device for Calculating Metal Wiring Overhead of Silicon Substrate Interposer

Semiconductor

| Fri 15 May 2026

Beijing, May 16 -- North Integrated Circuit Tech Innovation Center and Tsinghua University have applied Chinese patent for Method and Device for Calculating Metal Wiring Overhead of Silicon Substrate Interposer. Hu Yang, Yang Qize, Jiang Dingcheng, Wei Taiquan, Han Huiming and Yin Shouyi developed it. The patent application n..

Nantong Nuotong Yimu Medical Tech Co Ltd and Nuotong Yimu Optical Tech Danyang Co Ltd File Chinese Patent Application for Design Method for Adaptively Generating Optical Micropatte..

Semiconductor

| Fri 15 May 2026

Beijing, May 16 -- Nantong Nuotong Yimu Medical Tech Co Ltd and Nuotong Yimu Optical Tech Danyang Co Ltd have filed a patent application for Design Method for Adaptively Generating Optical Micropattern Based on Substrate Parameters. This invention was developed by Di Make and Cai Xiaogu. The patent application number is CN202..

Shenzhen Lixin Semiconductor Co Ltd and Chongqing Anpai Xincheng Microelectronics Co Ltd File Chinese Patent Application for Fuse State Read-write Circuit and Integrated Chip

Semiconductor

| Fri 15 May 2026

Beijing, May 16 -- Shenzhen Lixin Semiconductor Co Ltd and Chongqing Anpai Xincheng Microelectronics Co Ltd have filed a patent application for Fuse State Read-write Circuit and Integrated Chip. This invention was developed by Zhu Xiaoan, He Guojun, Zhang Ding, Chen Wei, Zeng Houfeng and Yoo Heon. The patent application numbe..

Huazhong University of Science and Technology and Hubei Guanggu Laboratory Seek Patent for Laser Projection Imaging Method and Device Based on MEMS Scanning Micromirror

Semiconductor

| Sat 16 May 2026

Beijing, May 16 -- Huazhong University of Science and Technology and Hubei Guanggu Laboratory have sought patent for Laser Projection Imaging Method and Device Based on MEMS Scanning Micromirror. This invention was developed by Wang Junya, Song Jinwu, Wei Shaotang, Guo Hexiang, Mu Shengpeng, Qu Ziqiang and You Zheng. The pate..

Nanjing Inst Advanced Laser Tech and Nanjing Zhongke Shenguang Technology Apply for Patent on Full-spectrum Scattering Imaging Fusion Measurement System and Method for Semiconducto..

Semiconductor

| Sat 16 May 2026

Beijing, May 16 -- Nanjing Inst Advanced Laser Tech and Nanjing Zhongke Shenguang Technology have applied Chinese patent for Full-spectrum Scattering Imaging Fusion Measurement System and Method for Semiconductor Error Detection. Gao Peili, Liu Hua, Chen Kuan and Gu Changqing developed it. The patent application number is CN2..

Beijing Lingchuan Tech Co Ltd and Shanghai Lingchuan Yuheng Tech Co Ltd Seek Patent for Floating-point Number Multiplier, Calculation Chip and Floating-point Number Multiplication ..

Semiconductor

| Sat 16 May 2026

Beijing, May 16 -- Beijing Lingchuan Tech Co Ltd and Shanghai Lingchuan Yuheng Tech Co Ltd have sought patent for Floating-point Number Multiplier, Calculation Chip and Floating-point Number Multiplication Operation Method. This invention was developed by Liu Jiarui and Guo Kai. The patent application number is CN202511323492..

Beijing ESWIN Computing Technology and Chengdu Yisiwei Computing Tech Co Ltd Seek Patent for Memory Copying Method, Memory Copying Device, Chip and Electronic Equipment

Semiconductor

| Sat 16 May 2026

Beijing, May 16 -- Beijing ESWIN Computing Technology and Chengdu Yisiwei Computing Tech Co Ltd have sought patent for Memory Copying Method, Memory Copying Device, Chip and Electronic Equipment. This invention was developed by Cong Yuyang, Hu Jiamiao and Geng Zonglin. The patent application number is CN202511500885 20251020...

Rwth Aachen and Forschungszentrum Juelich Submit European Patent Application for a Method for Determining Valley-splitting in a Semiconductor Device

Semiconductor

| Fri 15 May 2026

Munich, May 16 -- Rwth Aachen and Forschungszentrum Juelich have submitted a patent application for a Method for Determining Valley-splitting in a Semiconductor Device. This invention was developed by Schreiber Lars Reiner, Struck Tom, Volmer Mats and Bluhm Jörg Hendrik. The patent application number is EP20230789874 2023092..

North Integrated Circuit Tech Innovation Center and Tsinghua University Submit Patent Application for Method, Device, Equipment, Medium and Program for Determining Packaging Parame..

Semiconductor

| Fri 15 May 2026

Beijing, May 16 -- North Integrated Circuit Tech Innovation Center and Tsinghua University have submitted a patent application for Method, Device, Equipment, Medium and Program for Determining Packaging Parameters of Silicon Substrate Chip. Hu Yang, Liu Jingyao, Han Huiming and Yin Shouyi developed the invention. The patent a..

North Integrated Circuit Tech Innovation Center and Tsinghua University Submit Chinese Patent Application for Chip System Architecture Feasibility Evaluation Method Based on Large-..

Semiconductor

| Fri 15 May 2026

Beijing, May 16 -- North Integrated Circuit Tech Innovation Center and Tsinghua University have submitted a patent application for Chip System Architecture Feasibility Evaluation Method Based on Large-size Silicon Substrate. This invention was developed by Hu Yang, Yu Xingmao, Han Huiming and Yin Shouyi. The patent applicatio..

BOE Technology Group Co Ltd and Beijing BOE Technology Development Submit Patent Application for Display Substrate and Manufacturing Method Therefor, and Display Device

Semiconductor

| Fri 15 May 2026

Munich, May 16 -- BOE Technology Group Co Ltd and Beijing BOE Technology Development have submitted a patent application for Display Substrate and Manufacturing Method Therefor, and Display Device. Zhao Jiao, Zhao Meng, Guo Yuzhen, Zhang Chenyang, Cui Xiaorong, Gao Lipeng, Zheng Haoliang, Xuan Minghua, Zhou Ying, Guan Feng, Du J..

Hangzhou Silan Microelectronics and Hangzhou Silan Integrated Circuit Submit Chinese Patent Application for MEMS Micromirror and Electromagnetic MEMS Micromirror

Semiconductor

| Sat 16 May 2026

Beijing, May 16 -- Hangzhou Silan Microelectronics and Hangzhou Silan Integrated Circuit have submitted a patent application for MEMS Micromirror and Electromagnetic MEMS Micromirror. This invention was developed by Xue Shengfang, Wang Minchang, Zhou Min, Wang Shuai and Deng Dengfeng. The patent application number is CN202511..

Institute of Semiconductors, Chinese Academy of Sciences Files Chinese Patent Application for Signal Processing Chip System, Channelized Frequency Measurement Method and Radio Freq..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Institute of Semiconductors, Chinese Academy of Sciences has filed a patent application for Signal Processing Chip System, Channelized Frequency Measurement Method and Radio Frequency Selection Method. This invention was developed by Zheng Xiang, Zhao Zeping, Liu Jianguo, Wang Hanyu and Yang Tianyu. The paten..

Taiwan Semiconductor Manufacturing Files Chinese Patent Application for Semiconductor Device and Forming Method Thereof

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Taiwan Semiconductor Manufacturing has filed a patent application for Semiconductor Device and Forming Method Thereof. This invention was developed by Mao Jinghan, Zhang Zhiyi, Huang Zhaojun, Shi Jianxue and Lin Junjie. The patent application number is CN202510427582 20250407. The patent publication number is..

Xinlian Pioneer Integrated Circuit Manufacturing, Shaoxing Files Chinese Patent Application for Reliability Testing Equipment of Semiconductor Device and Probe Adjusting Method The..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Xinlian Pioneer Integrated Circuit Manufacturing, Shaoxing has filed a patent application for Reliability Testing Equipment of Semiconductor Device and Probe Adjusting Method Thereof. This invention was developed by Tian Yu, Wang Xiaobao and Chen Leigang. The patent application number is CN202511371892 202509..

Suzhou Huatai Electronic Technology Files Chinese Patent Application for Preparation Method of Semiconductor Device

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Suzhou Huatai Electronic Technology has filed a patent application for Preparation Method of Semiconductor Device. This invention was developed by Xiong Zhijun. The patent application number is CN202511574277 20251030. The patent publication number is CN121335126 (A). International Patent Classification codes..

Yangtze Memory Technologies Files Singaporean Patent Application for Methods of Semiconductor Device Fabrication

Semiconductor

| Mon 18 May 2026

Singapore, May 18 -- Yangtze Memory Technologies has filed a patent application for Methods of Semiconductor Device Fabrication. This invention was developed by Wang Qiguang and Wu Gonglian. The patent application number is SG20211111703Y 20190628. The patent publication number is SG11202111703Y (A). International Patent Classi..

Anji Microelectronics, Shanghai Submits Chinese Patent Application for Metal Electroplating Composition and Use Method

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Anji Microelectronics, Shanghai has submitted a patent application for Metal Electroplating Composition and Use Method. This invention was developed by Sun Peng, Peng Libbert Hongxiu and Shen Menghan. The patent application number is CN202311838876 20231228. The patent publication number is CN121344697 (A). I..

IRICO Hefei LCD Glass Submits Chinese Patent Application for Automatic Cleaning System for Industrial Television Coking Materials of Substrate Glass Kiln

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- IRICO Hefei LCD Glass has submitted a patent application for Automatic Cleaning System for Industrial Television Coking Materials of Substrate Glass Kiln. This invention was developed by Zhang Xiang, Huang Huiyang and Wang Zhongyao. The patent application number is CN202511558221 20251029. The patent publicat..

Changchun Normal University Submits Chinese Patent Application for Ternary Organic Solar Cell Based on High Dielectric Constant Non-fullerene Receptor and Preparation Method Thereo..

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Changchun Normal University has submitted a patent application for Ternary Organic Solar Cell Based on High Dielectric Constant Non-fullerene Receptor and Preparation Method Thereof. This invention was developed by Zhang Youdi, Ye Nan, Wang Hao, Wang Tonghui, Liu Feng, Xu Shuai, Zhang Peng and Zhu Junfei. The..

Fujian Huaqing Electronic Material Technology Submits Patent Application for Preparation Method of Super-tough Aluminum Oxide Substrate

Semiconductor

| Sun 17 May 2026

Beijing, May 18 -- Fujian Huaqing Electronic Material Technology has submitted a patent application for Preparation Method of Super-tough Aluminum Oxide Substrate. Zhou Qing developed the invention. The patent application number is CN202511903423 20251217. The patent publication number is CN121339090 (A). International Patent C..

Shenzhen Goodix Technology Submits Chinese Patent Application for Data Transmission Method, Networking System, Chip and Computer Storage Medium

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Shenzhen Goodix Technology has submitted a patent application for Data Transmission Method, Networking System, Chip and Computer Storage Medium. This invention was developed by Wang Jihui and Dai Xuewei. The patent application number is CN20251004779 20250102. The patent publication number is CN121334259 (A)...

Spreadtrum Communications (Shanghai) Submits Chinese Patent Application for Audio Signal Processing Circuit and Chip

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Spreadtrum Communications (Shanghai) has submitted a patent application for Audio Signal Processing Circuit and Chip. This invention was developed by Xu Fangcheng, Ye Shunzhou, Yang Kexin and Tang Xu. The patent application number is CN202511613463 20251105. The patent publication number is CN121334563 (A). I..

Taiwan Semiconductor Manufacturing Submits Chinese Patent Application for Semiconductor Device and Forming Method

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Semiconductor Device and Forming Method. This invention was developed by Zhou Zhixun, Zhao Yixiang, Lin Kanru, Zhang Qian, Dai Yining, Xu Bowei, Yang Minzheng, Xu Qiaofang and Jian Ruihong. The patent application number is CN20251038091..

Guangzhou Zengxin Technology Submits Patent Application for Deep Trench Isolation Structure, Preparation Method Thereof and Semiconductor Device

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Guangzhou Zengxin Technology has submitted a patent application for Deep Trench Isolation Structure, Preparation Method Thereof and Semiconductor Device. Hao Zhanyang developed the invention. The patent application number is CN202511597339 20251103. The patent publication number is CN121335521 (A). Internatio..

Guangzhou Zengxin Technology Submits Patent Application for Deep Trench Isolation Structure, Preparation Method Thereof and Semiconductor Device

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Guangzhou Zengxin Technology has submitted a patent application for Deep Trench Isolation Structure, Preparation Method Thereof and Semiconductor Device. Hao Zhanyang developed the invention. The patent application number is CN202511597319 20251103. The patent publication number is CN121335520 (A). Internatio..

Tokyo Electron Submits Chinese Patent Application for Substrate Processing Apparatus and State Determination Method

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Tokyo Electron has submitted a patent application for Substrate Processing Apparatus and State Determination Method. This invention was developed by Kawawa Takahiro. The patent application number is CN202510838544 20250623. The patent publication number is CN121335509 (A). International Patent Classification ..

Nissin Ion Equipment Submits Chinese Patent Application for Substrate Supporting Device

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Nissin Ion Equipment has submitted a patent application for Substrate Supporting Device. This invention was developed by Onoda Masatoshi, Ueno Koyu and Hirose Daiki. The patent application number is CN202510916378 20250703. The patent publication number is CN121335474 (A). International Patent Classification ..

Kokusai Electric Submits Chinese Patent Application for Substrate Processing Apparatus, Ejection Apparatus, Substrate Processing Method, Semiconductor Device Manufacturing Method, ..

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Kokusai Electric has submitted a patent application for Substrate Processing Apparatus, Ejection Apparatus, Substrate Processing Method, Semiconductor Device Manufacturing Method, and Recording Medium. This invention was developed by Moriya Taketoshi, Okajima Yusaku and Urushihara Mika. The patent application..

Enkris Semiconductor Submits Patent Application for Manufacturing Method of Semiconductor Structure

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Enkris Semiconductor has submitted a patent application for Manufacturing Method of Semiconductor Structure. Cheng Kai developed the invention. The patent application number is CN202410924486 20240710. The patent publication number is CN121335427 (A). International Patent Classification code is H10P14/692. Co..

Zhejiang Sinopoly Materials Submits Chinese Patent Application for Preparation Method of Main-grid-free Integrated Film of Solar Cell

Semiconductor

| Mon 18 May 2026

Beijing, May 18 -- Zhejiang Sinopoly Materials has submitted a patent application for Preparation Method of Main-grid-free Integrated Film of Solar Cell. This invention was developed by Shi Hongtao, Cai Shuyi, Jiao Hua and Wu Zenggang. The patent application number is CN202511180810 20250822. The patent publication number is CN..

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