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Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- Suzhou Shengtuo Semiconductor Technology has been awarded a patent for Leveling Air Valve. This invention was developed by Chen Qingsheng, Wang Yubin, Yu Yu, He Yunxiang, Liang Yong and Liu Peng.
The patent application number is CN202520121279U 20250117. The patent publication number is CN223622332 (U). In..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- Guangdong JL DC Advanced Mfg Co Ltd has received a patent for High-speed Driving Unit, Double-station Driving Module and Operation Device. This invention was developed by Zhou Hailong, Dong Min and Liu Jiaofeng.
The patent application number is CN202520418125U 20250311. The patent publication number is CN2..
Semiconductor
| Fri 04 Sep 2026
Beijing, Sept. 4 -- State Intellectual Property Office of China has awarded a patent to Huizhou Huahao Water Treat Equipment Co Ltd for Water Circulation Filtering Equipment of Chip Cooling Module. Wang Nenghe and Wang Nengshui developed the invention.
The patent application number is CN202520200854U 20250208. The patent publ..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 --Aiteman Semiconductor Tech Co Ltd, Aiteman Xiamen Photoelectric Tech Co Ltd and Etman Zhejiang Semiconductor Tech Co Ltd have secured a patent on Dangerous Object Recovery Processing Device and Vacuum Processing Equipment. Lou Sha, Ni Jian and Zhao Jintang developed the invention.
The patent application num..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- Shanghai Huaming Intelligent Terminal Equipment Co Ltd has secured a patent on PC Light-emitting Door Plate. Zhang Liang, Liang Lianjun, Li Zhenfeng and Ma Silong developed the invention.
The patent application number is CN202423130192U 20241217. The patent publication number is CN223621514 (U). Internatio..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- State Intellectual Property Office of China has awarded a patent to Shanghai Jita Semiconductor for Sample Fixing Device. Wu Fang and Zhou Shan developed the invention.
The patent application number is CN202520241765U 20250214. The patent publication number is CN223624924 (U). International Patent Classifi..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- Wuxi Fuxin Semiconductor Tech Co Ltd has secured a patent on Pneumatic Gate Valve. Cao Youbing developed the invention.
The patent application number is CN202520130293U 20250120. The patent publication number is CN223622239 (U). International Patent Classification codes are F16K3/02, F16K3/30, F16K3/314, F..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- Shanghai Nuoruike Semiconductor Equipment Co Ltd has secured a patent on Multi-layer Dip-angle-adjustable Filter Wheel Device. Zhang Junkang, Zhou Yin, Gao Feng and Ye Junjie developed the invention.
The patent application number is CN20252090477U 20250115. The patent publication number is CN223624482 (U)...
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- Jiangsu Goodwork Microelectronics Tech Co Ltd has secured a patent on Shaping Device for Diode Processing. Su Dinan developed the invention.
The patent application number is CN202423183314U 20241224. The patent publication number is CN223624961 (U). International Patent Classification codes are H01L21/67, ..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- State Intellectual Property Office of China has awarded a patent to Unimicron Technology for Tempered Glass Substrate Structure for Improving Edge Defects. Nian Hengming, Chen Zhilong and Chen Yuhua developed the invention.
The patent application number is CN20242398565U 20241216. The patent publication numb..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- Hunan Sanan Semiconductor has obtained a patent for power semiconductor packaging structure. This invention was developed by Huang Yiyu and Zhou Feisheng.
The patent application number is CN202422809959U 20241118. The patent publication number is CN223624992 (U). International Patent Classification codes are..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- State Intellectual Property Office of China has awarded a patent to Shenzhen Biwin Storage Technology for Embedded Chip Packaging Structure and Electronic Equipment. Sun Chengsi, He Han, Wang Can and Wei Jing developed the invention.
The patent application number is CN202520226100U 20250213. The patent publi..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- State Intellectual Property Office of China has awarded a patent to Shanghai Daozhi Technology for Packaging Structure of Semiconductor Module. Yan Yejun and Tang Zhuolun developed the invention.
The patent application number is CN20242387024U 20241213. The patent publication number is CN223624978 (U). Inter..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- Taiwan Semiconductor Manufacturing has obtained a patent for package assembly. This invention was developed by Peng Mingwei, Xu Hong'en and Xu Guojing.
The patent application number is CN202422269133U 20240918. The patent publication number is CN223624977 (U). International Patent Classification codes are H0..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- State Intellectual Property Office of China has awarded a patent to Bowei Integrated Circuits for Vacuum Suction Crimping Structure for Automatic Test of Semiconductor Device. Zhang Bo, Zhao Yutao, Feng Peng, Zhou Xiaocun, Wang Yifei, Yao Xu, Guo Yuewei and Duan Lei developed the invention.
The patent applic..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- Chenwei Equipment Technology Suzhou has been granted a patent for Cover Opening Structure and Semiconductor Device. This invention was developed by Li Wangjun.
The patent application number is CN202422909218U 20241127. The patent publication number is CN223624933 (U). International Patent Classification code..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- StarPower Semiconductor has obtained a patent for automatic production line of vehicle-level module heat dissipation substrate. This invention was developed by Shen Jinxiao.
The patent application number is CN202422808381U 20241118. The patent publication number is CN223624928 (U). International Patent Class..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- Jiangsu Leadmicro Nanometer Technology has been granted a patent for Thermal Management System of Semiconductor Processing Workshop. Xu Xingwen and Han Fanghu developed the invention.
The patent application number is CN202423134059U 20241218. The patent publication number is CN223623455 (U). International Pa..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- Shenzhen Guanggan Semiconductor has secured a patent on Spectral Chip and Electronic Device. Yang Yonglin and Zhou Ying developed the invention.
The patent application number is CN20252080823U 20250110. The patent publication number is CN223623697 (U). International Patent Classification codes are G01J3/02 a..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- Suzhou Qingxing Qiji Technology has been awarded a patent for Multi-site Chip Contact Type Aging Cover Socket Body. This invention was developed by Zhou Yonghua, Wang Yong, Qiu Zhongyan, Dai Yun and Xiang Rui.
The patent application number is CN202422954106U 20241202. The patent publication number is CN22362..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- Suzhou Qingxing Qiji Technology has been granted a patent for Test Seat for Qfn Chip. This invention was developed by Zhou Yonghua, Wang Yong, Qiu Zhongyan, Dai Yun and Chen Lan.
The patent application number is CN202422902108U 20241127. The patent publication number is CN223624270 (U). International Patent ..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- State Intellectual Property Office of China has awarded a patent to Zhejiang Chuangxin Integrated Circuit for Pipeline Structure for Preventing Gas from Flowing Backwards and Semiconductor Manufacturing Equipment. Wang Ruoxi, Long Feifei and Wang Ping developed the invention.
The patent application number is..
Semiconductor
| Fri 04 Sep 2026
Beijing, Sept. 4 -- Hunan Shaohong Special Glass has obtained a patent for maintenance and transfer device for substrate glass transport trolley. This invention was developed by Li Panpan, Liu Wang and Lei Xiaotian.
The patent application number is CN20252082779U 20250114. The patent publication number is CN223620083 (U). Inter..
Semiconductor
| Sat 05 Sep 2026
Beijing, Sept. 5 -- Wuhan Hospital of Traditional Chinese and Western Medicine has been granted a patent for In-vitro Osteosarcoma Culture Chip. This invention was developed by Du Kun, Pu Feifei, Zhao Ying, Liu Jing, Yang Ning and Jin Jian.
The patent application number is CN20242386015U 20241213. The patent publication number ..
Semiconductor
| Fri 04 Sep 2026
Beijing, Sept. 4 -- Shinlone Intellectual Manufacture Precision Applied Materials (Suzhou) has received a patent for Double-injection Mold and Double-color Forming Machine. This invention was developed by Chen Yongen, Zhu Yagang and Zheng Jinglong.
The patent application number is CN202423308166U 20241231. The patent publicatio..
Semiconductor
| Fri 04 Sep 2026
Beijing, Sept. 4 -- Shinlone Intellectual Manufacture Precision Applied Materials (Suzhou) has been granted a patent for Die Capable of Prolonging Service Life. Chen Yongen, Zhu Yagang and Zheng Jinglong developed the invention.
The patent application number is CN202423308771U 20241231. The patent publication number is CN223618..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- Shanghai Meadville Science & Tech Co Ltd and Anjieli Meiwei Electronic Xiamen Co Ltd have been granted a patent for Ceramic Packaging Core Plate and Packaging Substrate. This invention was developed by Guo Wei, Fu Haitao and Xin Jun.
The patent application number is CN202423199330U 20241223. The patent pub..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- Chengdu Xinhaichuangxin Technology and Chipsea Technology Shenzhen have been awarded a patent for Analog-to-digital Converter, Signal Processing Circuit, Chip and Electronic Device. This invention was developed by Sun Yiyun.
The patent application number is CN202422902174U 20241127. The patent publication ..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Chengdu BOE Optoelect Tech Co, Beijing BOE Technology Dev Co Ltd and BOE Technology Group have applied WIPO patent for Display Substrate and Display Device. Zhang Yi, Wei Liheng, Chu Zhiwen, Wang Yiding, Zhang Tiaomei, He Fan and Guo Zhishen developed it.
The patent application number is WO2026CN75353 20260..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Chengdu BOE Optoelect Tech Co, Beijing BOE Technology Dev Co Ltd and BOE Technology Group have applied WIPO patent for Display Substrate and Display Device. Lee Ansu, Li Ting, Huang Yinglong, Huangfu Lujiang and Dong Xiangdan developed it.
The patent application number is WO2025CN78565 20250221. The patent ..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- Tulingzhisuan Quantum Tech Wuxi Co Ltd and Shanghai Tuling Zhisuan Quantum Tech Co Ltd have applied Chinese patent for Waveguide Chip Layout, Preparation and Test Method. Sun Yaodong, Yang Lesi and Zhang Lingxiao developed it.
The patent application number is CN202610668115 20260515. The patent publication..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Chengdu BOE Optoelect Tech Co and BOE Technology Group have filed a patent application for Display Substrate and Display Apparatus. This invention was developed by Ma Hongwei, Zhang Yi, Chu Zhiwen, Wei Liheng, Wu Jianpeng, Wang Yiding, Zhang Tiaomei, He Fan and Guo Zhishen.
The patent application number is ..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Chongqing BOE Display Tech Co Ltd and BOE Technology Group have filed a patent application for Display Substrate and Display Apparatus. This invention was developed by Wang Wentao, Li Qiujie, Li Shuanzhu and Xia Yun.
The patent application number is WO2026CN72704 20260115. The patent publication number is W..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Electric Power Research Instituite China Southern Power Grid and China Southern Power Grid Co Limited have filed a patent application for Simulation Modeling Method and System for Real-time Model of Silicon Carbide IGBT Module. This invention was developed by Wu Xiaoshan, Zhao Ligang, Zhou Baorong and Liang Ti..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- The Florida International Univ Board of Trustees and Applied Materials have filed a patent application for Reconfigurable Systems by Shifting Materials Inside a Cavity. This invention was developed by Kengeri Subramani, Pulugurtha Markondeyaraj, Al Duhni Ghaleb Saleh Ghaleb, Khasgiwala Mudit Sunilkumar, Ghosh ..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- ASML Netherlands and ASML have filed a patent application for Lithographic Equipment and Multi-wavelength Phase Modulation Scanning Measurement System and Method. This invention was developed by Sweeram Mark, Kok Haico V, Beekman Adrianus J A, Baselmans Johannes Jacobus Matheus, Gueden Sebastianus Adrianus, A..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Chengdu BOE Optoelect Tech Co and BOE Technology Group have submitted a patent application for Display Substrate and Display Device. This invention was developed by Yang Mingkun, Du Lili and Qing Haigang.
The patent application number is WO2025CN78109 20250219. The patent publication number is WO2026174468 ..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Tokyo Electron Ltd and Tokyo Electron US Holdings have submitted a patent application for Method for Prediction of Ion Energy Distribution in Plasma Process. This invention was developed by Sridhar Shyam, Ventzek Peter Lowell George, Chen Zhiying and Hartmann Gregory.
The patent application number is WO2025..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- Harbin Instituite of Technology and Beijing NAURA Microelectronics Equipment have submitted a patent application for High-precision Wafer Mark Positioning Method and System Based on Fourier Transform. Hou Chengwei, Geng Bo, Cui Yongqin, Sun Qiqi, Liu Huan, Song Henan, Wu Jianwei, Dong Tao and Li Nan developed..
Semiconductor
| Wed 02 Sep 2026
Beijing, Sept. 3 -- Dongguan Hehang Precision Technology has been granted a patent for Drying Machine Positioning Assembly for Electroplating Materials. This invention was developed by Zhou Haihu.
The patent application number is CN202422727468U 20241108. The patent publication number is CN223610471 (U). International Patent Cl..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- East China University of Science and Technology has been granted a patent for Multifunctional Chip Defect Detector. Teng Xin developed the invention.
The patent application number is CN202520232878U 20250213. The patent publication number is CN223611423 (U). International Patent Classification codes are G01N..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- Shenzhen Merrytek Technology has been awarded a patent for Transmitting and Receiving Integrated Microwave Chip Packaged with Isolator and Microwave Detection Module. This invention was developed by Zou Gaodi and Sun Yi.
The patent application number is CN202422946275U 20241128. The patent publication number..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- State Intellectual Property Office of China has awarded a patent to Chipone Technology, Beijing for Touch Display Device, Chip and Electronic Equipment. Chen Zuwang developed the invention.
The patent application number is CN202520264443U 20250218. The patent publication number is CN223611917 (U). Internatio..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- Chinese Patent for Dye-sensitized Solar Cell Packaging Process Equipment has been issued to Suzhou Zhengxia Electronic Technology. This invention was developed by Liu Sheng and Zhu Kai.
The patent application number is CN20242370884U 20241212. The patent publication number is CN223612248 (U). International P..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- Chinese Patent for Artemisia Argyi Chip Insole has been issued to Hubei Aishubao Life Articles. This invention was developed by Li Guoping, Li Zhi and Li Hui.
The patent application number is CN202520283414U 20250221. The patent publication number is CN223614260 (U). International Patent Classification codes..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- Shenzhen First Union Technology has received a patent for Liquid Substrate Supplement Container and Aerosol-generating Device. This invention was developed by Bao Longmin.
The patent application number is CN202422907524U 20241127. The patent publication number is CN223614204 (U). International Patent Classif..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- State Intellectual Property Office of China has released STMicroelectronics International patent application for Integrated Photonics Device, Corresponding Circuit and Method. This invention was developed by Antonio Fincato.
The patent application number is CN202511817275 20251204. The patent publication num..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- ACM Research, Shanghai has submitted a patent application for Substrate Coating Apparatus. Xu Fei, Wu Jun, Cheng Cheng, Wu Lei and Yang In-jung developed the invention.
The patent application number is CN202411824707 20241211. The patent publication number is CN122194571 (A). International Patent Classificat..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- Goertek Microelectronics has submitted a patent application for Temperature Control Device, Chip System and Electronic Equipment. This invention was developed by Li Changshun.
The patent application number is CN202610241020 20260228. The patent publication number is CN122195148 (A). International Patent Clas..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- NVIDIA has submitted a patent application for Hint-based Power Consumption State Management of Communication Interface. This invention was developed by Gopireddy Bharath and Idgunji Sayed.
The patent application number is CN202511859129 20251210. The patent publication number is CN122195240 (A). Internationa..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- State Intellectual Property Office of China has received Rongyao Terminal patent application for Interface Display Method, Electronic Equipment, Chip System and Readable Storage Medium. Liu Qingxiang and Guo Daoxin developed the invention.
The patent application number is CN202411823947 20241211. The patent ..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- State Intellectual Property Office of China has received STMicroelectronics International patent application for Opening and Closing Detection of Foldable Equipment. Lee Hyun-ji, Oh Kyoung-min and Byun Sung-yong developed the invention.
The patent application number is CN202511827906 20251205. The patent pub..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- Samsung Electronics has submitted a patent application for System on Chip and Memory System Including Same. Lee Keon-hee and Yoo Jun-hee developed the invention.
The patent application number is CN202511531729 20251024. The patent publication number is CN122195921 (A). International Patent Classification cod..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- Samsung Electronics has submitted a patent application for Processor Providing Data Replication, Operating Method Thereof, and System on Chip Including the Processor. Kim Seung-hun and Yoo Jun-hee developed the invention.
The patent application number is CN202511796571 20251202. The patent publication number..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- NVIDIA has submitted a patent application for Memory Addressing. This invention was developed by Maksimo Andrew D A.
The patent application number is CN202511859458 20251210. The patent publication number is CN122195871 (A). International Patent Classification codes are G06F12/06, G06F12/10 and G06F9/50. Coo..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- Mellanox Technologies has filed a patent application for Access Protection Control for Non-volatile Memory. This invention was developed by Chahal Bharat, Eliyahu Metin, Kupperschmidt Holger, Golombek Oleg, Itkin Yaron, Rard, Winnik David, Maor Uzi, Shagorodetsky Alexey, Liron G ¨, Lucco Michele and Porat Yo..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- State Intellectual Property Office of China has published Beijing Xuanjie Technology patent application for Chip Starting Method and Device, Electronic Equipment, Chip and Storage Medium. The invention was developed by Jia Chouchou.
The patent application number is CN20261099175 20260123. The patent publicat..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- Huazhong University of Science and Technology has sought patent for Reconfigurable Neuromorphic Calculation Method and System, Chip and Storage Medium. This invention was developed by Tong Lei, Miao Xiangshui, Yang Gaochen, Liu Guanting, Ye Lei, Sun Mingjun, Ma Chenlong and Wu Jiaming.
The patent application..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Center has sought patent for Superconducting Quantum Chip and Electronic Equipment. This invention was developed by Liu Qiang, Yu Xiaoyan and Li Yong.
The patent application number is CN202610241379 20260228. The patent publication numbe..
Semiconductor
| Thu 03 Sep 2026
Beijing, Sept. 3 -- Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Center has submitted a patent application for Superconducting Quantum Chip and Electronic Equipment. Liu Qiang, Yu Xiaoyan and Li Yong developed the invention.
The patent application number is CN202610240475 20260228. The patent publicat..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Huawei Technologies has submitted a patent application for Dynamic Effect Display Method, Electronic Device, Readable Storage Medium and Chip. Liu Yusi and Chen Xiang developed the invention.
The patent application number is WO2025CN126081 20250930. The patent publication number is WO2026174804 (A1). Internat..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- World Intellectual Property Organization has received Chipsea Technologies (Shenzhen) patent application for Signal Processing Circuit, Chip and Electronic Device. Liu Yuke, Sun Yiyun, Liu Weihui and Chen Min developed the invention.
The patent application number is WO2025CN140140 20251204. The patent publica..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- World Intellectual Property Organization has received ASML Netherlands patent application for Substrate Stage System and Method, and Exposure Apparatus Including the System. Kramer Gijs, Jansen Erik, Huang Yang-shan, Nouwen Stijn and Smeets Benjamin developed the invention.
The patent application number is WO..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- ASML Netherlands has applied WIPO patent for Exposure Method and Apparatus. Van Den Nieuwelaar Norbertus, Nagy István, Huiberts Sjoerd, Mattaar Thomas and Vandevelde Benjamin developed it.
The patent application number is WO2026EP51286 20260120. The patent publication number is WO2026175583 (A1). Internation..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Advanced RISC Machines has submitted a patent application for Chiplet Integrated Circuit (ic) Including Multiple Chiplets and Shared External Bus. Lotlikar Hemang Ganesh, Goel Deepak and Williams Peter Andrew Rees developed the invention.
The patent application number is WO2025EP78106 20250930. The patent pub..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- World Intellectual Property Organization has received Ruijie Networks patent application for Communication Method, Apparatus, Medium, and Chip. Yang Shu developed the invention.
The patent application number is WO2026CN77994 20260209. The patent publication number is WO2026175225 (A1). International Patent Cl..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- ASML Netherlands has filed a patent application for Polarization Switch. This invention was developed by Dhindsa Navneet, Huang Chien, Walsh James, Jenkins Gregory, Lomans Bram and Pelella Andrew.
The patent application number is WO2026EP51358 20260120. The patent publication number is WO2026175588 (A1). Inte..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- ASML Netherlands has applied WIPO patent for Lithographic Module with Vibration-reducing Isolation Structure. Franklin Joseph, Aitirhli Hatim, Van Dongen Paul and De Hoon Cornelius developed it.
The patent application number is WO2026EP51356 20260120. The patent publication number is WO2026175587 (A1). Intern..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Soitec Silicon On Insulator has applied WIPO patent for Method for Preparing a Carrier Substrate Made of Polycrystalline Material and Method for Manufacturing a Composite Structure from the Carrier Substrate. Rey Adrien, Rouchier Séverin and Barge Thierry developed it.
The patent application number is WO2026..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- ASML Netherlands has submitted a patent application for Flexible Supply Structure, Positioning Module and Lithographic Apparatus. This invention was developed by Nikipelov Andrey.
The patent application number is WO2026EP51547 20260122. The patent publication number is WO2026175595 (A1). International Patent ..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- World Intellectual Property Organization has released Archroma IP patent application for Bio- Strenghtening Agent for Pulp Fiber Related Paper Substrate. This invention was developed by Salam Abdus.
The patent application number is WO2026EP54659 20260220. The patent publication number is WO2026176038 (A1). In..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Tokyo Electron has submitted a patent application for Information Processing Method, Computer Program, and Information Processing Device. This invention was developed by Ohmi Norifumi and Kondo Taisei.
The patent application number is WO2026JP04592 20260209. The patent publication number is WO2026176982 (A1)...
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Tokyo Electron has submitted a patent application for Substrate Processing Apparatus and Substrate Processing Method. Hamasaki Masakazu developed the invention.
The patent application number is WO2026JP04048 20260204. The patent publication number is WO2026176933 (A1). International Patent Classification code..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- World Intellectual Property Organization has released Tokyo Electron patent application for Surface Modification Method and Surface Modification Device. This invention was developed by Yamasaki Yutaka, Maeda Hiroshi, Mimura Yuji and Sakamoto Ryoichi.
The patent application number is WO2026JP04730 20260210. Th..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Tokyo Electron has submitted a patent application for Plasma Processing Device. This invention was developed by Araki Shingo and Fujisawa Takashi.
The patent application number is WO2026JP04699 20260210. The patent publication number is WO2026177002 (A1). International Patent Classification code is H10P50/20...
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Ebara has submitted a patent application for Substrate Cleaning Method and Substrate Cleaning Device. Kajikawa Takayuki developed the invention.
The patent application number is WO2026JP03522 20260202. The patent publication number is WO2026176904 (A1). International Patent Classification code is H10P70/00...
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Japan Steel Works has submitted a patent application for Bonded Substrate, Bonded Substrate with Device, and Method for Manufacturing Bonded Substrate with Device. This invention was developed by Iwata Hirokazu and Maruko Takuya.
The patent application number is WO2026JP04989 20260212. The patent publicatio..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Toppan Holdings has submitted a patent application for Printed Material and Solar Cell Module. This invention was developed by Ogasawara Motoyuki.
The patent application number is WO2026JP04632 20260209. The patent publication number is WO2026176989 (A1). International Patent Classification codes are B32B27..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- World Intellectual Property Organization has released GlobalFoundries Singapore patent application for Power-efficient Variable Optical Attenuator. This invention was developed by Tan You Sian James, Xie Wu and Li Chao.
The patent application number is WO2025SG50128 20250224. The patent publication number is ..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Microchip Technology has submitted a patent application for Systems and Methods to Control Data Retention by Setting Pass Through Voltage. This invention was developed by Shukla Pitamber, Cirella Michele, Scommegna Salvatrice and Aldarese Antonio.
The patent application number is WO2025US49665 20251006. The p..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Applied Materials has submitted a patent application for Vertical Device Formed by Self-aligned Sequential Patterning of Top Transistor and Bottom Transistor. This invention was developed by Pranatharthiharan Balasubramanian, Bazizi El Mehdi, Pal Ashish, Costrini Gregory and Colombeau Benjamin.
The patent app..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- World Intellectual Property Organization has published Applied Materials patent application for Simplified Swapper Module Design. The invention was developed by Lindenberg Ralph and Heimel Oliver.
The patent application number is WO2025US47624 20250924. The patent publication number is WO2026177767 (A1). Inte..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Microchip Technology has submitted a patent application for Addition of Heat Transfer Particles in a Vertical Cavity Surface Emitting Laser (VCSEL). This invention was developed by Nagel Steve and Chen Bomy.
The patent application number is WO2025US41439 20250811. The patent publication number is WO20261777..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- SanDisk Technologies has submitted a patent application for Fast Duo-read Mode for Bit Flips Detection. This invention was developed by Li Liang, Yuan Jiahui and Tian Xuan.
The patent application number is WO2025US35171 20250625. The patent publication number is WO2026177753 (A1). International Patent Classif..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- SanDisk Technologies has applied WIPO patent for Multiple Read Bandwidth for Non-volatile Memory. New Richard, Yang Xiang, Cao Wei, Kwon Ohwon and Dutta Deepanshu developed it.
The patent application number is WO2025US34374 20250619. The patent publication number is WO2026177751 (A1). International Patent Cla..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Microchip Technology has sought patent for Monitoring the Health of a Data Storage Device to Increase Reliability and Performance. This invention was developed by Belhadj Mohamed Hichem, Shukla Pitamber and Yang Nian Niles.
The patent application number is WO2025US31243 20250528. The patent publication number..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Micron Technology has submitted a patent application for Information Logging Via a Sideband Within a Memory System. Ross Frank F, Ayyapureddi Sujeet V, Schaefer Scott E, Rooney Randall J, Prather Matthew A and Lashkarian Navid developed the invention.
The patent application number is WO2026US14932 20260211. T..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Applied Materials has submitted a patent application for Pre-heat Ring Structures for Alignment, and Related Liners, Chamber Kits, Processing Chambers, and Methods. This invention was developed by Collins Richard O.
The patent application number is WO2026US14840 20260211. The patent publication number is WO20..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- World Intellectual Property Organization has published Texas Instruments patent application for Phase Shifter Circuit Architectures. The invention was developed by Dandu Krishnanshu and Das Arnab.
The patent application number is WO2026US14523 20260209. The patent publication number is WO2026177902 (A1). In..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- World Intellectual Property Organization has received Micron Technology patent application for Apparatus Including Sense Amplifier and Isolation Transistor. Asaki Kenji and Mochida Yoshifumi developed the invention.
The patent application number is WO2026US14378 20260206. The patent publication number is WO20..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Micron Technology has submitted a patent application for Apparatus with Early LIO Precharge Operation. Asaki Kenji, Mochida Yoshifumi and Hara Tetsuro developed the invention.
The patent application number is WO2026US14353 20260206. The patent publication number is WO2026177893 (A1). International Patent Cl..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Applied Materials has submitted a patent application for Capping for Selective Sam Deposition and Removal. Kashefi Kevin, Ju Zheng, Zhou Ruinan, Cen Jiajie and Qu Ge developed the invention.
The patent application number is WO2026US15519 20260217. The patent publication number is WO2026178038 (A1). Internatio..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Texas Instruments has sought patent for Switching Converter Mode Transition Control. This invention was developed by Sun Yueming, Pang Chuansong, Du Chaofan and Wu Yuqing.
The patent application number is WO2026US15444 20260217. The patent publication number is WO2026178004 (A1). International Patent Classi..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- Micron Technology has applied WIPO patent for Data Buffer Error Correction Functionality. Veches Anthony D, Ross Frank F, Ayyapureddi Sujeet V, Schaefer Scott E, Rooney Randall J, Prather Matthew A and Lashkarian Navid developed it.
The patent application number is WO2026US15422 20260216. The patent publicati..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- World Intellectual Property Organization has received Micron Technology patent application for Memory Device Including Segmented Conductive Contacts. Gupta Sidhartha, Jain Harsh Narendrakumar, List Tyler, Kim Terry Hyunsik and King Matthew J developed the invention.
The patent application number is WO2026US15..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- World Intellectual Property Organization has received Micron Technology patent application for Non-periodic Read Disturb Scan. Hu Guang, Liao Dongxiang, Lin Lei and Chen Zhengang developed the invention.
The patent application number is WO2026US16212 20260223. The patent publication number is WO2026178468 (A1..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- World Intellectual Property Organization has received Microchip Technology patent application for Ajinomoto Build-up Film (ABF) Bridge Frame. Nagel Steve and Chen Bomy developed the invention.
The patent application number is WO2026US15936 20260219. The patent publication number is WO2026178295 (A1). Intern..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- World Intellectual Property Organization has published Jusung Engineering patent application for Substrate Treatment Apparatus and Substrate Treatment Method. The invention was developed by Kim Ki-bum, Hwang Chul-joo, Choi Seong-hyuk, Sa Seung-youb, Lee Jae-yeop, Yang Geun-su and Jang Dae-soo.
The patent appl..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- World Intellectual Property Organization has released Tokyo Electron patent application for Film Formation Method and Film Formation Device. This invention was developed by Murakami Hiroki and Okoshi Ken.
The patent application number is WO2026JP04334 20260206. The patent publication number is WO2026176958 (A..
Semiconductor
| Wed 02 Sep 2026
Geneva, Sept. 3 -- World Intellectual Property Organization has released Hitachi High Technologies patent application for Plasma Processing Device, Method for Operating Plasma Processing Device, Inspection Device, and Inspection Method. This invention was developed by Yonemoto Takahiro, Ueda Kazuhiro and Ikenaga Kazuyuki.
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