Semiconductor
| Mon 13 Apr 2026
Beijing, April 13 -- State Intellectual Property Office of China has awarded a patent to Huizhou Yinpingshan Ind Co Ltd for Machining Platform for Electroplating of Mobile Phone Parts. Liu Kui, Liao Biaoguang, Chen Huiling, Qiu Lifeng, Tang Jun, Tian Xiaohua, Lai Peijie, Wang Dan, Wu Jianxue and Liao Jiancheng developed the inve..