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Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Tencent Technology, Shenzhen patent application for Cache Processing Method and Device, Chip, Equipment and Medium. This invention was developed by Ren Zimu.
The patent application number is CN20241088946 20240122. The patent publication number is CN..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has published Shanghai Xinwei Technology Research Cente patent application for Photoetching Method and Photomask. The invention was developed by Tai Li.
The patent application number is CN20241090503 20240122. The patent publication number is CN120353091 (A). Int..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- Fudan University has applied Chinese patent for Complex Amplitude Vector Light Field System Based on Terahertz On-chip Metasurface. Sun Shulin, Kim Sang-woo, Wang Zhuo, He Qiong and Zhou Lei developed it.
The patent application number is CN202510821954 20250619. The patent publication number is CN120353037..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Shanghai Huahong Grace Semiconductor Manufacturing Corporation patent application for Layout Structure and Forming Method of Nord Flash Memory. Zhang Lianbao developed the invention.
The patent application number is CN202510724717 20250530. The paten..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- Yangtze Memory Technologies has filed a patent application for Memory, Manufacturing Method Thereof and Memory System. This invention was developed by Xia Zhengliang, Zhou Wenbin, Wu Jiaji, Yang Han and Zou Xinwei.
The patent application number is CN20241063374 20240116. The patent publication number is CN..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- Wuhan Baizhen Semiconductor Tech Co Ltd has applied Chinese patent for Polarization-maintaining Storage Tank and Etching Machine Equipment. Wang Qingsong and Xiao Zhenfang developed it.
The patent application number is CN202410323718 20240320. The patent publication number is CN120349095 (A). International..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- National University of Defense Technology PLA has submitted a patent application for Equipment Time Sequence Fault Prediction Method and Device, Equipment and Storage Medium. This invention was developed by Yang Xin, Zhu Wei, Bai Jinyin, Nie Zongzhe, Liu Shuhong, Li Dong, Wu Qingfeng, Li Feng and Duan Zhou.
..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- Advanced Micro Devices has sought patent for Dynamic Memory Operation. This invention was developed by Prasad Divya Madapusi Srinivas and Ignatowski Michael.
The patent application number is CN20238077749 20231005. The patent publication number is CN120345025 (A). International Patent Classification codes ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- Suzhou Yuannao Intelligent Technology has applied Chinese patent for Integrated Circuit Bus System, Data Processing Method and Programmable Logic Unit. Dong Shuyong, Gao Yang and Yan Yuxuan developed it.
The patent application number is CN202510852023 20250624. The patent publication number is CN120353741 ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Jimei University patent application for Intelligent Task Scheduling Method Applied to Network-on-chip. This invention was developed by Chen Qingkun.
The patent application number is CN202510853053 20250624. The patent publication number is CN12035356..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has published Yangtze Memory Technologies patent application for Storage System, Controller, Host, and Operating Method. The invention was developed by Luo Xianwu and He Youxin.
The patent application number is CN20241075759 20240118. The patent publication numbe..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received LG Chemical patent application for Novel Compound and Organic Light-emitting Device Comprising Same. Lee Ho Jung, Jung Min Woo, Han Mi-yeon, Lee Jungha, Oh Joong-suk, Kim Hoon-jun, Cao Huimin, Park Hyung-jin and Heo Jeonghoe developed the invention.
..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- Shifamed has applied Chinese patent for Adjustable Shunt Systems with Shape Memory Actuators and Associated Systems and Methods. Alexander Mark, Mulvihill Ian, Baranowski Ingo and Fahey Brian developed it.
The patent application number is CN20238087780 20231220. The patent publication number is CN120344202..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- Central South University has filed a patent application for Flexible Fiber Memristor and Preparation Method and Application Thereof. This invention was developed by Jiang Chao, Ding Zizhao and Huang Shenglong.
The patent application number is CN202510469728 20250415. The patent publication number is CN1203..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Yangjiang Nuclear Power patent application for Method for Determining Polarity of Diode Connected in Parallel with Coil, Control Terminal and Diode Polarity Determination Device. Song Liang, Hu Cheng, Yi Zhuang, Qiu Guomin, Zhang Xuchen, Hu Gang, Wang C..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Semiconductor Manufacturing International (Shanghai) patent application for Semiconductor Structure and Forming Method Thereof. Wang Weiyi and Wang Aimei developed the invention.
The patent application number is CN20241065597 20240116. The patent pub..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- Xidian University has filed a patent application for Novel Bipolar Tunneling Field Effect Transistor. This invention was developed by Wang Bin, Cui Jianguo and Wu Longsheng.
The patent application number is CN202510492274 20250418. The patent publication number is CN120343933 (A). International Patent Clas..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Koninklijke Philips has applied Chinese patent for Multi-die Package with Shaped Brightness. Monestier Florent, Shen Yuzhen and Di Maria Joseph developed it.
The patent application number is CN20238085682 20231130. The patent publication number is CN120345072 (A). International Patent Classification codes ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Jiangsu Pangu Semiconductor Tech Co Ltd patent application for Preparation Method of High-heat-dissipation Plate-level Packaging Structure and Product Thereof. Wang Hao, Wang Jiao and Ma Shuying developed the invention.
The patent application number ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Macronix has submitted a patent application for Memory Device and Operating Method Thereof. Zeng Baihao and Lee Bong-min developed the invention.
The patent application number is CN202410725778 20240606. The patent publication number is CN120340565 (A). International Patent Classification codes are G11C11/..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- II-VI Delaware has submitted a patent application for Secure Solid State Quantum Storage Device. This invention was developed by Chen Yongkai, Souzis Andrew E, Eng Julie, Khan Suhail, Barbarossa Giovanni, Chakrabaret Utpal, Mattella Vincent D, Michel Eric and Tat Naczak Anna.
The patent application number ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Shandong University patent application for Neural Network Circuit Based on Resistive Random Access Memory. Zhan Xuepeng, Wang Chengcheng, Hu Yuzhe, Sang Pengpeng, Wu Jixuan and Chen Jiezhi developed the invention.
The patent application number is CN2..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Yangtze Memory Technologies patent application for Memory Device, Operating Method Thereof, and Memory System. Zhou Xufeng and Dong Zhipeng developed the invention.
The patent application number is CN20241063710 20240116. The patent publication numbe..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- Shanghai Pengxi Semiconductor Co Ltd has submitted a patent application for Wafer Processing Process Technological Parameter Correlation Analysis Method and Related Equipment. This invention was developed by Tu Shijun, Li Peng and Liu Xinxin.
The patent application number is CN202510197997 20250221. The pa..
Semiconductor
| Thu 29 Jan 2026
Rijswijk, Jan. 29 -- Netherlands Patent Office has released Samsung Electronics Co Ltd patent application for Scan Flip-flop, Method Thereof and Devices Having the Same. This invention was developed by Kim Min Su.
The patent application number is NL20132010447 20130314. The patent publication number is NL2010447 (A). Internat..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Xi'an Ouye Semiconductor Co Ltd patent application for Online Calibration Method, Device and Equipment of Vehicle, Storage Medium and Program Product. Liu Jiahui and Zhou Difei developed the invention.
The patent application number is CN202510285299 ..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- Shanghai Shengjian Microelectronics Co Ltd has filed a patent application for Composition for Chemical Mechanical Polishing of Tungsten, Preparation Method Thereof and Chemical Mechanical Polishing Method. This invention was developed by Zhang Weiming, Zhang Xuechun, Zeng Zhengwu and Li Qiao.
The patent ap..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- RTP Company Suzhou Ltd has submitted a patent application for Preparation Method of Light-color ESD (electro-static Discharge) Electrostatic Protection Material. This invention was developed by Liu Daolong, Jia Yongpeng and Liu Weiwei.
The patent application number is CN202510617086 20250514. The patent pu..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Guojing Hechuang Qingdao Tech Co Ltd patent application for Laser Packaging Device and Method for Organic Light-emitting Device. Zhang Fuxuan, Cui Caoxiang, Zhu Ruiping, Guo Baijun, Lyu Yong, Zhang Chunyang and Li Xiaodong developed the invention.
Th..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- University of Electronic Science and Technology of China and Tianfu Jiangxi Laboratory have filed a patent application for High-frequency Choking Coil Multiplexing Inter-stage Matching Circuit Suitable for Power Amplifier Chip and Design Method of High-frequency Choking Coil Multiplexing Inter-stage Matching ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have submitted a patent application for Array Substrate and Display Device. Fan Cong, Zhang Wei, Xu Guanghua and Wang Hongli developed the invention.
The patent application number is CN20238011785 20231117. The patent publication number is CN1..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have filed a patent application for Array Substrate and Display Panel. This invention was developed by Li Zhengkun, Shang Tinghua, Du Lili, Chen Jiaxing, Yang Zhongliu and Yasuichi.
The patent application number is CN20238011240 20231019. The ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- University of Electronic Science and Technology of China and Hunan Idea Electronic Tech Co Ltd have sought patent for Ni-series Ferrite Dielectric Ceramic Heterogeneous Co-fired Composite Substrate Material and Preparation Method Thereof. This invention was developed by Yu Zhong, Zhang Hanyu, Liu Peiyuan, Jia..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Beijing Smartchip Microelectronics Technology, State Grid Henan Electric Power Co and State Grid Corporation of China have filed a patent application for Lead-bonded Packaging Chip and Preparation Method Thereof. This invention was developed by Qiao Lei, Mou Linhai, Gao Wei and Hao Fuzhong.
The patent appl..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Daer Tech Chengdu Co Ltd, Shanghai Kaihong Electronic Co Ltd and Shanghai Kaihong Electronic Co Ltd have submitted a patent application for Wafer Back Adhesive Film Pasting Device and Wafer Back Adhesive Film Pasting Device. Xu Xiaolin and Yang Guang developed the invention.
The patent application number i..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Dongguan Suote Electronic Mat Co Ltd, Zhejiang Suote Material Tech Co Ltd and Sunpast Co Ltd have submitted a patent application for Conductive Paste, Conductive Electrode, Crystalline Silicon Solar Cell and Preparation Method of Crystalline Silicon Solar Cell. Guo Qijie developed the invention.
The paten..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- BOE Technology Group and Beijing BOE Technology Development have submitted a patent application for Shift Register, Gate Drive Circuit, Display Substrate and Display Device. This invention was developed by Huang Jie, Li Zhengliang, Ning Ce, Huang Rui, Meng Detian, Li Feifei, Fu Xu, Hu Hehe, Yao Nianqi and Zha..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have submitted a patent application for Display Driving Chip and Display Device. This invention was developed by Zhang Lu, Hu Yuanzhou and He Yuqian.
The patent application number is CN202510670758 20250522. The patent publication number is CN..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- Shaanxi Meilande New Mat Co Ltd and Xi'an Meilande New Mat Co Ltd have submitted a patent application for Preparation Method of Bottom Heater for Monocrystalline Silicon Furnace. Cheng Jikuan, Yun Pucha, Sun Yong, Aiki, Zhang Libo and Du Xin developed the invention.
The patent application number is CN20251..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- Harbin Institute of Technology and Harbin Institute Of Tech Suzhou Research Institute have submitted a patent application for System for Self-adaptive Thermal Control of Persistent Flight of Unmanned Aerial Vehicle by Integrated Circuit. Wang Wei, Wang Xin, Guo Xiaoxuan, Deng Aoqian and Luo Kang developed the..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- Huzhou Haoyang Material Tech Co Ltd and Huzhou University have submitted a patent application for Bamboo Chip Crushing Processing System and Processing Method Thereof. This invention was developed by Peng Huanghu, Yang Fan, Oh Sung-hee and Yang Wei.
The patent application number is CN202510576090 20250506...
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- Harbin Institute of Technology, Weihai and Shandong Tianhui Huineng Microelectronics Co Ltd have submitted a patent application for Front-end Readout Electronics Circuit Facing Silicon Pin Detector. This invention was developed by Wang Chenxu, He Wen, Luo Min, Wang Xiaoli, Shi Quanqi, Chu Bo, Xu Jia and Zhang..
Semiconductor
| Wed 28 Jan 2026
Beijing, Jan. 29 -- Xi'an ESWIN Material Technology and Xi'an Eswin Silicon Wafer Technology have submitted a patent application for Silicon Wafer Processing Method and Device. This invention was developed by Zhang Shenshen.
The patent application number is CN202510335749 20250320. The patent publication number is CN120347662..
Semiconductor
| Thu 29 Jan 2026
Rijswijk, Jan. 29 -- ASML Netherlands has submitted a patent application for Inspection Apparatus, Inspection Method and Manufacturing Method. This invention was developed by Arie Jeffrey Den Boef.
The patent application number is NL20162017171 20160715. The patent publication number is NL2017171 (A). International Patent Cla..
Semiconductor
| Thu 29 Jan 2026
Rijswijk, Jan. 29 -- ASML Netherlands has submitted a patent application for Position Measurement System, Interferometer and Lithographic Apparatus. This invention was developed by Egelbertus Antonius Fransiscus Van Der Pasch and Robbert Edgar Van Leeuwen.
The patent application number is NL20162017261 20160729. The patent publ..
Semiconductor
| Thu 29 Jan 2026
Rijswijk, Jan. 29 -- ASML Netherlands has filed a patent application for Methods for Controlling Lithographic Apparatus, Lithographic Apparatus and Device Manufacturing Method. This invention was developed by Rene Marinus Gerardus Johan Queens and Wolfgang Helmut Henke.
The patent application number is NL20162017296 20160808. T..
Semiconductor
| Thu 29 Jan 2026
Rijswijk, Jan. 29 -- ASML Netherlands has submitted a patent application for Metrology Method and Apparatus, Substrates for Use in Such Methods, Lithographic System and Device Manufacturing Method. This invention was developed by Martin Jacobus Johan Jak, Hendrik Jan Hidde Smilde, Richard Johannes Franciscus Van Haren, Henricus ..
Semiconductor
| Thu 29 Jan 2026
Rijswijk, Jan. 29 -- ASML Netherlands has filed a patent application for Lithographic Method and Apparatus. This invention was developed by Robbert Jan Voogd and Wilhelmus Jacobus Maria Rooijakkers.
The patent application number is NL20162017222 20160725. The patent publication number is NL2017222 (A). International Patent Clas..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Xinchuangzhi Innovation Design Service Center Ningbo Co Ltd and Zhejiang Chuangxin Integrated Circuit patent application for Capacitive Coupling Island Chip Architecture with High-voltage Isolation Function and Packaging Method. Zhu Min, Wu Qiang, Wu Yo..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Xinchuangzhi Innovation Design Service Center Ningbo Co Ltd and Zhejiang Chuangxin Integrated Circuit patent application for Inductive Coupling Island Chip Architecture with High-voltage Isolation Function and Packaging Method. Zhu Min, Wu Qiang, Wu Yon..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has published Jiangsu Huachuang Microsystems patent application for Stacked Hole and Stacked Disc Chip Packaging Structure for Transmitting High-speed Signals. The invention was developed by Nie Shankun, He Guoqiang, Zhang Tao and Li Shiping.
The patent application..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has published Semiconductor Manufacturing International (Shanghai) patent application for Test Structure and Test Method. The invention was developed by Sun Lei, Lin Yihui, Wang Liang, Wang Shaobo, Zhai Guangyao, Ma Yongfang, Huang Ziqiang and Wu Jun.
The patent ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Semiconductor Manufacturing International (Shanghai) patent application for Test Structure and Forming Method and Test Method Thereof. Ke Bang, Lin Yihui, Wang Liang, Gao Jianqin, Sun Shi, Li Yuxi, Yu Jingqiu, Xie Jun and Liu Cong developed the inventio..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Mitsubishi Electric has applied Chinese patent for Power Semiconductor Device. Hasegawa Maki and Tadakuma Toshiya developed it.
The patent application number is CN20251009182 20250103. The patent publication number is CN120341213 (A). International Patent Classification codes are H01L23/538, H01L23/58 and H0..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- SK Hynix has submitted a patent application for Semiconductor Device, Semiconductor Package, and Method of Manufacturing Semiconductor Device. This invention was developed by Ahn Jae-yong, Yang Ju-heon and Yoon Kyo-sik.
The patent application number is CN20251062271 20250115. The patent publication number is..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Yangtze Memory Technologies has submitted a patent application for Semiconductor Packaging Structure with Glass Substrate and Packaging Method Thereof. Zeng Xinru and Chen Peng developed the invention.
The patent application number is CN20241069355 20240117. The patent publication number is CN120341207 (A). ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- China Zhenhua Group Yongguang Electronics, State Run No 873 Factory has applied Chinese patent for Plastic Package DFN Package Based on Cu-clip Structure. He Weiwei, Wei Xingxing, Zhang Li, Wu Dayan, Zhang Peng and Wen Wenhui developed it.
The patent application number is CN202510557529 20250429. The paten..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Nanya Technology has submitted a patent application for Semiconductor Element with Pad Contact and Preparation Method Thereof. Zhuang Yingzheng developed the invention.
The patent application number is CN202410689608 20240530. The patent publication number is CN120341203 (A). International Patent Classific..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Zhongke Weicaoqun Beijing Energy Saving Tech Development Co Ltd has filed a patent application for Small-size Light-weight High-power Chip Microstructure Air Cooling Radiator. This invention was developed by Hu Xuegong and Xiang Lifeng.
The patent application number is CN202510705982 20250529. The patent p..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Samsung Electronics has submitted a patent application for Semiconductor Module. Park Hwan-joo, Ko Byung-han, Wen Yu and Lee Hee-chul developed the invention.
The patent application number is CN202411327538 20240923. The patent publication number is CN120341198 (A). International Patent Classification code..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Anshan Leadsun Electronics Co Ltd has submitted a patent application for High-voltage Silicon Stack. This invention was developed by Chen Gang and Xia Bingcheng.
The patent application number is CN202510805782 20250617. The patent publication number is CN120341197 (A). International Patent Classification c..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Jiangsu Xinde Semiconductor Technology has filed a patent application for Wafer-level Inductor Packaging Structure and Preparation Method Thereof. This invention was developed by Zhao Yue, Xu Qianqian, Xie Yulong and Zhang Zhong.
The patent application number is CN202510840130 20250623. The patent publicat..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Mitsubishi Electric has submitted a patent application for Semiconductor Device. Zhang Hongbo developed the invention.
The patent application number is CN202411949141 20241227. The patent publication number is CN120341184 (A). International Patent Classification codes are H01L23/29, H01L23/31, H01L23/367 a..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Xinai Tech Nanjing Co Ltd patent application for Package Substrate and Manufacturing Method Thereof. This invention was developed by Chen Minyao and Zhang Chuihong.
The patent application number is CN202510510315 20250422. The patent publication numb..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Beijing Institute of Technology has submitted a patent application for Stacked Packaging Type Information Self-destruction Chip and Chip Self-destruction Method. This invention was developed by Feng Hengzhen, Chai Yichen, Lou Wenzhong, Lyu Sining and Xiao Chuan.
The patent application number is CN20251038814..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Rirong Semiconductor (Shanghai) has submitted a patent application for Novel Substrate Design Method and Substrate Structure. Du Liang developed the invention.
The patent application number is CN202510482330 20250417. The patent publication number is CN120341180 (A). International Patent Classification codes..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Haiguang Information Tech Suzhou Co Ltd has submitted a patent application for Interconnection Method and Interconnection Structure After Chip Screening. This invention was developed by Jia Weijie and Xue Xiaodi.
The patent application number is CN202510518142 20250423. The patent publication number is CN1..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Shanghai Jita Semiconductor has submitted a patent application for Semiconductor Structure and Preparation Method Thereof. Liu Cong developed the invention.
The patent application number is CN202510450248 20250410. The patent publication number is CN120341176 (A). International Patent Classification code i..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Nanya Technology patent application for Semiconductor Element with Pad Contact and Preparation Method Thereof. This invention was developed by Zhuang Yingzheng.
The patent application number is CN202510139938 20240530. The patent publication number i..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Hefei Nexchip Integrated Circuit patent application for Manufacturing Method of Semiconductor Structure. This invention was developed by Zhang Wei, Yun Guangtao, Shao Zhangpeng, Su Shengzhe and Luo Qinxian.
The patent application number is CN2025108118..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Shanghai Xinaoxinyi Tech Co Ltd has applied Chinese patent for Preparation Method of Bonded Wafer. Chen Meng, Wei Xing and Li Wei developed it.
The patent application number is CN202510489003 20250417. The patent publication number is CN120341173 (A). International Patent Classification codes are H01L21/02..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Beijing Integrated Circuit Equipment Innovation Center Co Ltd patent application for Preparation Method of Semiconductor Device and Semiconductor Device. This invention was developed by Xu Wenqing, Sun Chunyu, Zhao Leichao and Shi Xiaoping.
The paten..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Shanghai Xinaoxinyi Tech Co Ltd patent application for Preparation Method of Soi Wafer. This invention was developed by Xiang Xiao, Zhang Yarong, Zhou Pinghua, Xu Hongtao, Zhang Weimin and Li Wei.
The patent application number is CN202510486761 20250..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Shanghai Xinaoxinyi Tech Co Ltd patent application for Method for Forming Bonded Wafer. Chen Meng, Wei Xing and Li Wei developed the invention.
The patent application number is CN202510486755 20250417. The patent publication number is CN120341170 (A)..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Beijing Yandong Microelectronic Technology has submitted a patent application for Trench Filling Method and Semiconductor Structure Manufacturing Method. This invention was developed by Gong Li, Qiu Fanglin, Wang Qian and Li Jingyi.
The patent application number is CN202510286675 20250311. The patent publica..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Sumitomo Osaka Cement has sought patent for Substrate, Electrostatic Chuck Device, and Method for Manufacturing Substrate. This invention was developed by Nakazawa Yuya and Harada Kenji.
The patent application number is CN20251061338 20250115. The patent publication number is CN120341165 (A). International P..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Changxin Xinqiao Storage Tech Co Ltd has submitted a patent application for Positioning Jig and Correction Method of Active Wafer Centering System. This invention was developed by Hu Guogang.
The patent application number is CN202510828003 20250619. The patent publication number is CN120341155 (A). Interna..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Door Opening Mechanism, Loading and Unloading Chamber and Semiconductor Process Equipment. This invention was developed by Qian Cuncun, Chang Jiang and Kong Xiangtian.
The patent application number is CN202510593000 20250508. The..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Suzhou Simaitu Tech Co Ltd has applied Chinese patent for Silicon Wafer Transmission System. Xiao Changli, Chen Xiaohui and Yi Zheng developed it.
The patent application number is CN202510448362 20250410. The patent publication number is CN120341150 (A). International Patent Classification code is H01L21/6..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Suzhou Dexin Chip Tech Co Ltd has sought patent for Quartz Boat, Boat Taking Device and Wafer Moving Assembly. This invention was developed by Yang Jie.
The patent application number is CN202510432155 20250408. The patent publication number is CN120341147 (A). International Patent Classification codes are ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Beijing NAURA Microelectronics Equipment has submitted a patent application for Semiconductor Cleaning Carrier and Semiconductor Cleaning Equipment. This invention was developed by Zhang Yang.
The patent application number is CN20241073078 20240118. The patent publication number is CN120341146 (A). Internati..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Chongqing Xinlian Microelectronic Co Ltd patent application for Method for Monitoring Temperature of Semiconductor Process Cavity. This invention was developed by Li Gang.
The patent application number is CN202510445416 20250410. The patent publicati..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Hangzhou Ounuo Semiconductor Equipment Co Ltd has applied Chinese patent for Mixed Process Efficient Double-cavity Furnace Tube for Wafer Processing. Yu Meng, Zhao Hui, Ma Yalan, Li Jun and Luo Dong developed it.
The patent application number is CN202510419773 20250403. The patent publication number is CN1..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Jiangsu Lilong Semiconductor Tech Co Ltd has submitted a patent application for Processing Equipment for Wafer Production. This invention was developed by Xiao Di, Chen Erjing and Zou Xinyi.
The patent application number is CN202510409861 20250402. The patent publication number is CN120341136 (A). Internat..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Zhuhai Hongjun New Energy Co Ltd has applied Chinese patent for Photovoltaic Silicon Wafer Detecting and Sorting Equipment. Zhang Wei, Hou Hongtao, Li Changhong and Jiang Qingtang developed it.
The patent application number is CN202510331923 20250320. The patent publication number is CN120341135 (A). Inter..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- SCREEN Holdings has submitted a patent application for Substrate Processing Apparatus and Substrate Processing Method. This invention was developed by Kawagishi Ryoya, Takamura Yukihiro and Oe Muneaki.
The patent application number is CN20251056526 20250114. The patent publication number is CN120341134 (A). ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- SCREEN Holdings has sought patent for Substrate Processing Apparatus and Substrate Processing Method. This invention was developed by Kawagishi Ryoya, Takamura Yukihiro and Oe Muneaki.
The patent application number is CN20251056524 20250114. The patent publication number is CN120341133 (A). International Pat..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received SCREEN Holdings patent application for Substrate Processing Apparatus and Substrate Processing Method. Kawagishi Ryoya, Oe Muneaki and Takamura Yukihiro developed the invention.
The patent application number is CN20251056193 20250114. The patent public..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has published Shibaura Mechatronics patent application for Substrate Processing Apparatus. The invention was developed by Fukukita Nobutaka, Iso Akinori, Nakatsuka Yasuyuki and Fukuzaki Hiroyuki.
The patent application number is CN202411913135 20241224. The patent ..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Kokusai Electric patent application for Substrate Processing Apparatus, Ambient Gas Control Method, Substrate Processing Method, Semiconductor Device Manufacturing Method, and Recording Medium. Yamamoto Kaoru and Ohashi Naofumi developed the invention.
..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Samsung Electronics has filed a patent application for Substrate Processing Apparatus and Substrate Processing Method. This invention was developed by Lee Jun-ho, Noh Sung-jun, Jeong Ji-hoon, Kang Song Yun, Kim Tae Heon, Kim Young-hoo, Yun Jun Ho, Lee Jong-won, Zheng Zhixiong and Hong Tinghe.
The patent appl..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Hefei Peidun Storage Technology patent application for Method for Improving Bonding Force Between Bump and Bottom and Chip Structure. This invention was developed by Geng Baocheng, Liu Yue, Zheng Shuhao, Wang Lin, Wei Xiaobo and Yao Weiyong.
The patent..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Zhuhai Yuanjiyi Electronic Tech Co Ltd has submitted a patent application for Manufacturing Method of Diamond Ceramic Semiconductor Packaging Tube Shell and Method for Packaging Computing Power Chip. This invention was developed by He Dongge and Liu Xuanting.
The patent application number is CN202510823237..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Semiconductor Manufacturing International (Shanghai) patent application for Deposition Equipment, Semiconductor Deposition Process and Semiconductor Structure. Zhu Haiyang developed the invention.
The patent application number is CN20241063759 20240116..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Xiamen Tianma Display Technology patent application for Display Panel, Integrated Chip and Display Device. This invention was developed by Yuan Yong.
The patent application number is CN202510541104 20220824. The patent publication number is CN120340414..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Beijing ESWIN Computing Technology patent application for Display Driving Circuit and Method, Chip and Display Equipment. Gan Linchong, Zhang Tianyou, Liu Wenming, Yu Jinquan, Zhang Xing and Zeng Wenbin developed the invention.
The patent application n..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has released Wuhan China Star Optoelectronics Semiconductor Display Technology patent application for Display Panel. This invention was developed by Fang Li.
The patent application number is CN202510705281 20250528. The patent publication number is CN120340402 (A..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- Nanjing Cold Source Matrix Tech Co Ltd has sought patent for Air Conditioning System Based on Semiconductor Refrigerating and Heating Technology. This invention was developed by Luo Wen.
The patent application number is CN202510739306 20250604. The patent publication number is CN120351585 (A). Internationa..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- State Intellectual Property Office of China has received Zhejiang Chuangxin Integrated Circuit patent application for Formation Method of Semiconductor Structure. Bai Hao and Shi Xiaoming developed the invention.
The patent application number is CN202510533955 20250425. The patent publication number is CN120..
Semiconductor
| Thu 29 Jan 2026
Beijing, Jan. 29 -- ChangXin Technology Group has applied Chinese patent for Manufacturing Method of Semiconductor Structure and Semiconductor Structure. Lian Lei, Zhang Jun, Wang Ruiming and Zhong Baojian developed it.
The patent application number is CN202510525612 20250424. The patent publication number is CN120341114 (A). I..
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