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08:36:56 Mon 23 Feb 2026

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Guangdong University of Technology Submits United States Patent Application for Neural Network-based Error Compensation Method for Mass Transfer of Mini-light-emitting Diode (mini-..

Semiconductor

| Sun 22 Feb 2026

Alexandria, Feb. 23 -- Guangdong University of Technology has submitted a patent application for Neural Network-based Error Compensation Method for Mass Transfer of Mini-light-emitting Diode (mini-LED) Chips. This invention was developed by Chen Yun, Luo Xiangyuan, Ma Li, He Zilin, Xiao Jiawei, Hou Maoxiang and Chen Xin. The ..

Chery Automobile Seeks Patent for Memory Linkage Method, System and Equipment Based on SOA (service Oriented Architecture) and Medium

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- Chery Automobile has sought patent for Memory Linkage Method, System and Equipment Based on SOA (service Oriented Architecture) and Medium. This invention was developed by Ma Zhihao, Zhang Heng, Wang Jianxiong and Chen Fei. The patent application number is CN202510700417 20250528. The patent publication nu..

North CN Elec Power Res Institute and State Grid Corporation of China Apply for Patent on Method and Device for Identifying Second-class Short Circuit State of Insulated Gate Bipol..

Semiconductor

| Sat 21 Feb 2026

Beijing, Feb. 21 -- North CN Elec Power Res Institute and State Grid Corporation of China have applied Chinese patent for Method and Device for Identifying Second-class Short Circuit State of Insulated Gate Bipolar Transistor. Yuan Wenqian, Hao Zhen, Ji Yirun, Yuan Qian, Huai Qing, Li Pengfei, Jie Ziyao, Gao Yanfeng, Lu Yi, Song..

BOE Technology Group and Beijing BOE Technology Development Submit Patent Application for Light-emitting Substrate and Backlight Module

Semiconductor

| Sat 21 Feb 2026

Beijing, Feb. 21 -- BOE Technology Group and Beijing BOE Technology Development have submitted a patent application for Light-emitting Substrate and Backlight Module. Sun Yanliu developed the invention. The patent application number is CN202410244918 20240304. The patent publication number is CN120595511 (A). International Pa..

Fujikura Submits Patent Application for Chip Structure with Base

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- Fujikura has submitted a patent application for Chip Structure with Base. Kawakami Toshiyuki developed the invention. The patent application number is CN20248012089 20240119. The patent publication number is CN120604411 (A). International Patent Classification code is H01S5/0237. Cooperative Patent Classif..

Cloudflare Submits United States Patent Application for System for Cross-domain Identity Management (SCIM) Proxy Service

Semiconductor

| Mon 23 Feb 2026

Alexandria, Feb. 23 -- Cloudflare has submitted a patent application for System for Cross-domain Identity Management (SCIM) Proxy Service. This invention was developed by Johnson Kenny, Bauman Gabriel Andrew, Hiller Kyle, Holland Alexander Jay, Kerns Russell Louis, Li Jesse, Royal James Howard and Davisson Akemi Leigh. The pa..

Fuji Electric Files Chinese Patent Application for Semiconductor Device

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Fuji Electric has filed a patent application for Semiconductor Device. This invention was developed by Yoshikawa Koh. The patent application number is CN20248008986 20240710. The patent publication number is CN120604637 (A). International Patent Classification codes are H10D12/00, H10D30/60, H10D8/00, H10D..

State Intellectual Property Office of China Receives Mitsubishi Electric Patent Application for Avalanche Photodiode

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has received Mitsubishi Electric patent application for Avalanche Photodiode. Nishikawa Satoshi and Iwakawa Manabu developed the invention. The patent application number is CN20238092394 20230206. The patent publication number is CN120604642 (A). International Pa..

State Intellectual Property Office of China Publishes Xiamen Sanan Optoelectronics Patent Application for Semiconductor Light-emitting Element and Light-emitting Device

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has published Xiamen Sanan Optoelectronics patent application for Semiconductor Light-emitting Element and Light-emitting Device. The invention was developed by Yan Tongwei, Chen Yanchun, Huang Shaohua, Zeng Jianyao, Zhou Qilun, Cai Jiming and Zhang Zhongying. Th..

Nichia Seeks Patent for Sintered Substrate, Light-emitting Device, and Method for Producing Same

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Nichia has sought patent for Sintered Substrate, Light-emitting Device, and Method for Producing Same. This invention was developed by Katsumata Masaaki, Hosokawa Atsushi, Kawamata Ken and Kume Hiroto. The patent application number is CN20248011554 20240319. The patent publication number is CN120604651 (A)..

Beijing Youzhuju Network Technology Applies for Patent on Topological Structure for IP Core, and IP Core

Semiconductor

| Mon 23 Feb 2026

Alexandria, Feb. 23 -- Beijing Youzhuju Network Technology has applied United States patent for Topological Structure for IP Core, and IP Core. Zhang Ying, Mei Meng, Ren Yuanlin, Jing Yinglong and Wang Jian developed it. The patent application number is US202318996293 20230720. The patent publication number is US20260052769 (..

CanSemi Technology Submits United States Patent Application for Electro-static Discharge Device Based on PNPN Structure

Semiconductor

| Mon 23 Feb 2026

Alexandria, Feb. 23 -- CanSemi Technology has submitted a patent application for Electro-static Discharge Device Based on PNPN Structure. This invention was developed by Jiang Dezhou and Zhao Bin. The patent application number is US202419114948 20241217. The patent publication number is US20260052779 (A1). International Paten..

U.S. Patent and Trademark Office Releases DOWA Electronics Materials Patent Application for III-V Compound Semiconductor Light-emitting Element and Method of Producing Iii-v Compou..

Semiconductor

| Mon 23 Feb 2026

Alexandria, Feb. 23 -- U.S. Patent and Trademark Office has released DOWA Electronics Materials patent application for III-V Compound Semiconductor Light-emitting Element and Method of Producing Iii-v Compound Semiconductor Light-emitting Element. This invention was developed by Koshika Yuta and Kadowaki Yoshitaka. The patent..

Samsung Electronics Submits United States Patent Application for Integrated Circuits (IC)

Semiconductor

| Mon 23 Feb 2026

Alexandria, Feb. 23 -- Samsung Electronics has submitted a patent application for Integrated Circuits (IC). This invention was developed by Park Panjae and Choi Subin. The patent application number is US202519012012 20250107. The patent publication number is US20260052978 (A1). International Patent Classification code is H10D..

ROHM Submits Patent Application for Semiconductor Device

Semiconductor

| Mon 23 Feb 2026

Alexandria, Feb. 23 -- ROHM has submitted a patent application for Semiconductor Device. Tanioka Tomonori and Egami Kazuo developed the invention. The patent application number is US202519368566 20251024. The patent publication number is US20260053008 (A1). Cooperative Patent Classification codes are H10W70/421 (US), H10W70/4..

Sunwave Solutions Files Chinese Patent Application for Directional Light Amplification Method and System Based on Cavity QED System and Storage Medium

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Sunwave Solutions has filed a patent application for Directional Light Amplification Method and System Based on Cavity QED System and Storage Medium. This invention was developed by Lee Ho-jin, Zeng Zequan, Zhang Xiaopei, Mao Jianyang, Jin Huaidong, Xu Xiqiang and Yan Junrong. The patent application number..

State Intellectual Property Office of China Publishes Zhejiang University and Zhejiang Chuangxin Integrated Circuit Patent Application for LDMOS (laterally Diffused Metal Oxide Sem..

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has published Zhejiang University and Zhejiang Chuangxin Integrated Circuit patent application for LDMOS (laterally Diffused Metal Oxide Semiconductor) Device Structure with Tooth-shaped Field Oxide and Preparation Method Thereof. The invention was developed by Zhon..

State Intellectual Property Office of China Releases Ween Semiconductors Tech Co Ltd Patent Application for Groove Type Insulated Gate Bipolar Transistor and Manufacturing Method T..

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has released Ween Semiconductors Tech Co Ltd patent application for Groove Type Insulated Gate Bipolar Transistor and Manufacturing Method Thereof. This invention was developed by Zhang Shuo, Chen Yuanzhao and Shen Xin. The patent application number is CN20251074..

State Intellectual Property Office of China Publishes Huahong Semiconductor Mfg Wuxi Co Ltd Patent Application for Method for Improving Stability of Electrical Thickness of Ono Lam..

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has published Huahong Semiconductor Mfg Wuxi Co Ltd patent application for Method for Improving Stability of Electrical Thickness of Ono Lamination in Memory Device. The invention was developed by Zhang Duanyin, Xu Jie, Wu Zhitao and Wu Xishuo. The patent applica..

State Intellectual Property Office of China Publishes Jiangsu Toubo Photoelectric Tech Co Ltd Patent Application for Method for Realizing Selective Electroplating of Ceramic Copper..

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has published Jiangsu Toubo Photoelectric Tech Co Ltd patent application for Method for Realizing Selective Electroplating of Ceramic Copper-clad Substrate. The invention was developed by Zhang Weixing and Shi Chuanming. The patent application number is CN2025108..

Qingdao Jingda Hongwang Innovation Tech Co Ltd Files Chinese Patent Application for Preparation Method of Low-loss Flexible Circuit Board Substrate for High-frequency Bandwidth and..

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- Qingdao Jingda Hongwang Innovation Tech Co Ltd has filed a patent application for Preparation Method of Low-loss Flexible Circuit Board Substrate for High-frequency Bandwidth and Substrate. This invention was developed by Oh Seung-ho and Song Jin-woo. The patent application number is CN202510546339 2025042..

Anhui Microchip Changjiang Semiconductor Mat Co Ltd Seeks Patent for Method for Rapidly Cutting Silicon Carbide Crystal Bar

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- Anhui Microchip Changjiang Semiconductor Mat Co Ltd has sought patent for Method for Rapidly Cutting Silicon Carbide Crystal Bar. This invention was developed by Jiang Chengchen and Yao Zhiyong. The patent application number is CN202510769454 20250610. The patent publication number is CN120606460 (A). Inte..

State Intellectual Property Office of China Publishes Shenzhen Jishi New Material Tech Co Ltd Patent Application for Method for Packaging Semiconductor Chilling Plate by Using High..

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has published Shenzhen Jishi New Material Tech Co Ltd patent application for Method for Packaging Semiconductor Chilling Plate by Using High-thermal-conductivity Metal Substrate. The invention was developed by Wu Yichao and Jin Qi. The patent application number i..

Wuxi Boda Xinneng Tech Co Ltd Files Chinese Patent Application for Electron Transport Layer and Preparation Method Thereof, and Perovskite Solar Cell

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- Wuxi Boda Xinneng Tech Co Ltd has filed a patent application for Electron Transport Layer and Preparation Method Thereof, and Perovskite Solar Cell. This invention was developed by Song Zhiwei and Qian Binhui. The patent application number is CN202511101609 20250807. The patent publication number is CN1206..

U.S. Patent and Trademark Office Releases Surepods LLC Patent Application for Methods and Systems for Flooring and Substrate Structures

Semiconductor

| Sun 22 Feb 2026

Alexandria, Feb. 23 -- U.S. Patent and Trademark Office has released Surepods LLC patent application for Methods and Systems for Flooring and Substrate Structures. This invention was developed by Bartlett Timothy, Helland Steve and Davis Chris. The patent application number is US202519301510 20250815. The patent publication n..

National Chung Shan Institute Of Science and Tech Submits United States Patent Application for Preparation Method of Aluminum Nitride Substrate

Semiconductor

| Sun 22 Feb 2026

Alexandria, Feb. 23 -- National Chung Shan Institute Of Science and Tech has submitted a patent application for Preparation Method of Aluminum Nitride Substrate. This invention was developed by Lu Chung-yen, Ruan Jian-long and Shih Cheng-hung. The patent application number is US202418806727 20240816. The patent publication nu..

Institute Of Process Engineering Chinese Academy Of Sciences Submits Patent Application for Method for Fluorine Separation and Recovery from Phosphate Rock Enhanced with Microbubbl..

Semiconductor

| Sun 22 Feb 2026

Alexandria, Feb. 23 -- Institute Of Process Engineering Chinese Academy Of Sciences has submitted a patent application for Method for Fluorine Separation and Recovery from Phosphate Rock Enhanced with Microbubble Coupled Silicon Additive. Li Huiquan, Zhu Ganyu, Meng Ziheng, Yan Kun and Zhang Wenjuan developed the invention. T..

Pepper David M Applies for Patent on Wavefront Reversal Device Using a MEMS Spatial Phase Modulator Integrated with a Retroreflector Array

Semiconductor

| Sun 22 Feb 2026

Alexandria, Feb. 23 -- Pepper David M has applied United States patent for Wavefront Reversal Device Using a MEMS Spatial Phase Modulator Integrated with a Retroreflector Array. The patent application number is US202519368680 20251024. The patent publication number is US20260048980 (A1). International Patent Classification c..

Device Co Ltd Applies for Patent on Substrate Treatment Apparatus Having Heating Unit

Semiconductor

| Sun 22 Feb 2026

Alexandria, Feb. 23 -- Device Co Ltd has applied United States patent for Substrate Treatment Apparatus Having Heating Unit. Lee Taek Youb developed it. The patent application number is US202419000306 20241223. The patent publication number is US20260048421 (A1). International Patent Classification codes are B08B13/00, B08B3/..

Nanchang Kaixun Photoelectric Co Ltd Seeks Patent for Infrared Led Epitaxial Wafer for Remote Controller and Preparation Method Thereof

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- Nanchang Kaixun Photoelectric Co Ltd has sought patent for Infrared Led Epitaxial Wafer for Remote Controller and Preparation Method Thereof. This invention was developed by Wang Sujie, Lin Xiaoshan, Tong Jiaxin and Qu Qianfeng. The patent application number is CN20251186639 20250805. The patent publicatio..

Ordos Longji Photovoltaic Tech Co Ltd Submits Chinese Patent Application for Solar Cell, Photovoltaic Module and Manufacturing Method of Solar Cell

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- Ordos Longji Photovoltaic Tech Co Ltd has submitted a patent application for Solar Cell, Photovoltaic Module and Manufacturing Method of Solar Cell. This invention was developed by Yang Sanchuan. The patent application number is CN20251194829 20250806. The patent publication number is CN120603392 (A). Inte..

Shaanxi Xingbei Energy Tech Co Ltd Files Chinese Patent Application for Silicon Wafer Structure and Solar Cell

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- Shaanxi Xingbei Energy Tech Co Ltd has filed a patent application for Silicon Wafer Structure and Solar Cell. This invention was developed by Lyu Yaling. The patent application number is CN202510759499 20250609. The patent publication number is CN120603388 (A). International Patent Classification codes are..

State Intellectual Property Office of China Releases Huahong Semiconductor Mfg Wuxi Co Ltd and Huahong Semiconductor, Wuxi Patent Application for Metal Grid, Forming Method Thereof..

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has released Huahong Semiconductor Mfg Wuxi Co Ltd and Huahong Semiconductor, Wuxi patent application for Metal Grid, Forming Method Thereof and Back-illuminated Image Sensor Chip. This invention was developed by Liu Yang, Yu Hang, Wang Han and Huang Peng. The pa..

State Intellectual Property Office of China Releases Tianjin Honghao Tech Co Ltd Patent Application for Flexible Light Crystalline Silicon Assembly and Manufacturing Method of Sola..

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has released Tianjin Honghao Tech Co Ltd patent application for Flexible Light Crystalline Silicon Assembly and Manufacturing Method of Solar Cell String of Flexible Light Crystalline Silicon Assembly. This invention was developed by Jiao Xuetuan, Sheng Huakai, Zhao..

Ordos Longji Photovoltaic Tech Co Ltd Submits Patent Application for Solar Cell, Photovoltaic Module and Manufacturing Method of Solar Cell

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- Ordos Longji Photovoltaic Tech Co Ltd has submitted a patent application for Solar Cell, Photovoltaic Module and Manufacturing Method of Solar Cell. Yang Sanchuan developed the invention. The patent application number is CN20251194828 20250806. The patent publication number is CN120603330 (A). Internationa..

State Intellectual Property Office of China Publishes Super Semiconductor Shanghai Co Ltd Patent Application for Power Semiconductor Device

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has published Super Semiconductor Shanghai Co Ltd patent application for Power Semiconductor Device. The invention was developed by Wu Yuzhou and Yu Yue. The patent application number is CN20251199940 20250807. The patent publication number is CN120603320 (A). In..

State Intellectual Property Office of China Publishes Hangzhou Puxiguangjing Semiconductor Technology Co Ltd Patent Application for Silicon Carbide Metal Oxide Semiconductor Field ..

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has published Hangzhou Puxiguangjing Semiconductor Technology Co Ltd patent application for Silicon Carbide Metal Oxide Semiconductor Field Effect Transistor (SiCMOSFET) Device with Improved Gate Oxide Layer Reliability and Preparation Process. The invention was dev..

Guangdong Xinyueneng Semiconductor Co Ltd Applies for Patent on Preparation Method of Semiconductor Structure and Semiconductor Structure

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- Guangdong Xinyueneng Semiconductor Co Ltd has applied Chinese patent for Preparation Method of Semiconductor Structure and Semiconductor Structure. Pu Jiupeng, Tan Yulu, Peng Tianzhi and Zeng Xiang developed it. The patent application number is CN202510731396 20250603. The patent publication number is CN12..

Hangzhou Big Fish Biotechnology Co Ltd Submits Chinese Patent Application for PCR Detection Device Based on Ultrasonic Chip and Resistance Method

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Hangzhou Big Fish Biotechnology Co Ltd has submitted a patent application for PCR Detection Device Based on Ultrasonic Chip and Resistance Method. This invention was developed by Xie Lianyi, Li Ming, Wang Peng and Tong Guojun. The patent application number is CN202510810606 20250617. The patent publication..

State Intellectual Property Office of China Receives Hubei Shanhu Paint Co Ltd Patent Application for Environment-friendly Silicon Steel Sheet Insulating Paint and Preparation Meth..

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has received Hubei Shanhu Paint Co Ltd patent application for Environment-friendly Silicon Steel Sheet Insulating Paint and Preparation Method Thereof. Xu Chuyuan, Liu Jiangming and Zou Xinming developed the invention. The patent application number is CN202510596..

Guangdong Shangyou Environmental Protection Tech Co Ltd Submits Patent Application for Preparation Method of Modified Polyester Chip

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Guangdong Shangyou Environmental Protection Tech Co Ltd has submitted a patent application for Preparation Method of Modified Polyester Chip. Wang Liangping developed the invention. The patent application number is CN202510825355 20250619. The patent publication number is CN120607724 (A). International Pat..

Sipusen New Mat Shanghai Co Ltd Applies for Patent on Star-shaped Polyether Organic Silicon Copolymer as Well as Preparation Method and Application Thereof

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Sipusen New Mat Shanghai Co Ltd has applied Chinese patent for Star-shaped Polyether Organic Silicon Copolymer as Well as Preparation Method and Application Thereof. Liu Mulin developed it. The patent application number is CN20251130247 20250725. The patent publication number is CN120607714 (A). Internatio..

Suqian Liansheng Aux Co Ltd Seeks Patent for Organic Silicon Modification-based Hindered Amine Light Stabilizer and Preparation Method Thereof

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Suqian Liansheng Aux Co Ltd has sought patent for Organic Silicon Modification-based Hindered Amine Light Stabilizer and Preparation Method Thereof. This invention was developed by Jiang Sai, Hu Xinli, Su Bo, Jiang Jian, Zhang Yihong, Wang Yong and Liang Xiaolong. The patent application number is CN2025108..

Zhejiang Sanwei Material Tech Co Ltd Seeks Patent for Formula and Preparation Method of High-brightness Polyester Chip

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Zhejiang Sanwei Material Tech Co Ltd has sought patent for Formula and Preparation Method of High-brightness Polyester Chip. This invention was developed by Fan Yonggui, Du Yong, Li Bing, Pang Zhigang, Yu Yu and Ye Wenwen. The patent application number is CN202510742863 20250605. The patent publication num..

State Intellectual Property Office of China Publishes Oy ICS Intelligent Control Systems Ltd Patent Application for Optical Structure for Enhancing Solar Cell Efficiency

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has published Oy ICS Intelligent Control Systems Ltd patent application for Optical Structure for Enhancing Solar Cell Efficiency. The invention was developed by Rinko Kari, Tuohoja Tero and Prent Andreas. The patent application number is CN20248008820 20240124. ..

U.S. Patent and Trademark Office Releases Clark Nicholas Patent Application for Cognition-compatible Network Substrate and Memory-native Protocol Stack

Semiconductor

| Mon 23 Feb 2026

Alexandria, Feb. 23 -- U.S. Patent and Trademark Office has released Clark Nicholas patent application for Cognition-compatible Network Substrate and Memory-native Protocol Stack. The patent application number is US202519366760 20251023. The patent publication number is US20260052096 (A1). International Patent Classification..

Siemens AG Files United States Patent Application for Common-source Configuration of Two Transistors

Semiconductor

| Sun 22 Feb 2026

Alexandria, Feb. 23 -- Siemens AG has filed a patent application for Common-source Configuration of Two Transistors. This invention was developed by Breiter Julian Stefan, Handt Karsten and Nannen Hauke. The patent application number is US202519299602 20250814. The patent publication number is US20260051889 (A1). Internationa..

Fuzhou Rongci New Mat Co Ltd Submits Chinese Patent Application for Method for Preparing Thermocouple Protection Tube by Depositing and Pyrolyzing Boron Nitride Through CVD (chemic..

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- Fuzhou Rongci New Mat Co Ltd has submitted a patent application for Method for Preparing Thermocouple Protection Tube by Depositing and Pyrolyzing Boron Nitride Through CVD (chemical Vapor Deposition) Method. This invention was developed by Huang Xiangdong and Lan Lixing. The patent application number is C..

Smartsens Tech HK Co Limited Seeks Patent for Clock Detection Method, Clock Detection Circuit, and Image Sensor

Semiconductor

| Sun 22 Feb 2026

Alexandria, Feb. 23 -- Smartsens Tech HK Co Limited has sought patent for Clock Detection Method, Clock Detection Circuit, and Image Sensor. This invention was developed by Wang Yunqi and Li Xiaoxing. The patent application number is US202519012920 20250108. The patent publication number is US20260051878 (A1). International P..

State Intellectual Property Office of China Receives Shenzhen Yige Lubrication Tech Co Ltd Patent Application for Enhanced Glass Antifouling Coating Agent Based on Nano Silicon Dio..

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has received Shenzhen Yige Lubrication Tech Co Ltd patent application for Enhanced Glass Antifouling Coating Agent Based on Nano Silicon Dioxide as Well as Preparation Method and Application of Enhanced Glass Antifouling Coating Agent. Zhang Lijun and Chen Sujuan de..

State Intellectual Property Office of China Publishes Imax Osram International BV Patent Application for Optoelectronic Semiconductor Device

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has published Imax Osram International BV patent application for Optoelectronic Semiconductor Device. The invention was developed by Schwarz Thomas. The patent application number is CN20248009201 20240118. The patent publication number is CN120604344 (A). Interna..

State Intellectual Property Office of China Receives Toshiba and Toshiba Electronic Devices & Storage Patent Application for Method for Manufacturing Semiconductor Device

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has received Toshiba and Toshiba Electronic Devices & Storage patent application for Method for Manufacturing Semiconductor Device. Mori Kentaro, Ohashi Kenichi, Nomura Kazuki and Yamashita Yuma developed the invention. The patent application number is CN20248008..

U.S. Patent and Trademark Office Publishes Zhejiang Zgmicro Company Ltd Patent Application for Battery Cell Reverse Connection Protection Circuit for a Chip

Semiconductor

| Sun 22 Feb 2026

Alexandria, Feb. 23 -- U.S. Patent and Trademark Office has published Zhejiang Zgmicro Company Ltd patent application for Battery Cell Reverse Connection Protection Circuit for a Chip. The invention was developed by Yin Hang, Liu Xin and Ling Zeming. The patent application number is US202519298700 20250813. The patent publica..

State Intellectual Property Office of China Publishes Husheng Tech Shenzhen Co Ltd Patent Application for Preparation Method of Silicon Carbide

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has published Husheng Tech Shenzhen Co Ltd patent application for Preparation Method of Silicon Carbide. The invention was developed by Wu Sanzhong. The patent application number is CN202510860002 20250625. The patent publication number is CN120607255 (A). Intern..

State Intellectual Property Office of China Receives Weihai Hengsheng New Material Tech Co Ltd Patent Application for Silicon-carbon Negative Electrode Composite Preparation Proces..

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has received Weihai Hengsheng New Material Tech Co Ltd patent application for Silicon-carbon Negative Electrode Composite Preparation Process for In-situ Growth of Nano Silicon Particles. Mo Haibo developed the invention. The patent application number is CN202510..

Gaska Consulting LLC Submits Patent Application for Electron Beam Devices with Semiconductor Ultraviolet Light Source

Semiconductor

| Sun 22 Feb 2026

Alexandria, Feb. 23 -- Gaska Consulting LLC has submitted a patent application for Electron Beam Devices with Semiconductor Ultraviolet Light Source. Gaska Remigijus developed the invention. The patent application number is US202519338235 20250924. The patent publication number is US20260051451 (A1). International Patent Clas..

Letuin Edu Co Ltd Seeks Patent for XR-based Semiconductor Manufacturing Process Training Device and Provision Method Thereof

Semiconductor

| Sun 22 Feb 2026

Alexandria, Feb. 23 -- Letuin Edu Co Ltd has sought patent for XR-based Semiconductor Manufacturing Process Training Device and Provision Method Thereof. This invention was developed by Kim Jun Ho and Seo Jeong Won. The patent application number is US202418801856 20240813. The patent publication number is US20260051262 (A1). ..

State Intellectual Property Office of China Releases Hoya and Hoya Photoelectric Tech Weihai Co Ltd Patent Application for Optical Glass and Optical Element

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has released Hoya and Hoya Photoelectric Tech Weihai Co Ltd patent application for Optical Glass and Optical Element. This invention was developed by Shoji Akihiro and Negishi Tomoaki. The patent application number is CN20248011528 20240205. The patent publicatio..

State Intellectual Property Office of China Receives Hoya and Hoya Photoelectric Tech Weihai Co Ltd Patent Application for Optical Glass and Optical Element

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has received Hoya and Hoya Photoelectric Tech Weihai Co Ltd patent application for Optical Glass and Optical Element. Shoji Akihiro and Negishi Tomoaki developed the invention. The patent application number is CN20248011470 20240205. The patent publication number..

Black Semiconductor Netherlands BV Submits Patent Application for Method and Apparatus for Transferring One or More Layers of Material from Initial Substrate to Target Substrate

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- Black Semiconductor Netherlands BV has submitted a patent application for Method and Apparatus for Transferring One or More Layers of Material from Initial Substrate to Target Substrate. Van Ryan Richard, Barnes Matthew David, Buscema Michel and Winkle Dominic Joseph developed the invention. The patent app..

State Intellectual Property Office of China Receives Amcor Technology Research & Development and Amco Huizhou New Material Tech Co Ltd Patent Application for Metal Substrate Packag..

Semiconductor

| Sun 22 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has received Amcor Technology Research & Development and Amco Huizhou New Material Tech Co Ltd patent application for Metal Substrate Packaging Sheet and Preparation Method Thereof. Zhu Miaoqing and Gao Hu developed the invention. The patent application number is..

Zhuiguang Biotechnology Shenzhen Co Ltd Files Chinese Patent Application for Photoelectric Tweezer Chip and Manufacturing Method Thereof

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Zhuiguang Biotechnology Shenzhen Co Ltd has filed a patent application for Photoelectric Tweezer Chip and Manufacturing Method Thereof. This invention was developed by Liu Jing, Xie Hainan and Xie Wei. The patent application number is CN202510524567 20250424. The patent publication number is CN120605775 (A..

Jiangxi Yanxun Silicon Mat Co Ltd Submits Chinese Patent Application for Preparation Device for High-quality Amino Silicon Oil

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Jiangxi Yanxun Silicon Mat Co Ltd has submitted a patent application for Preparation Device for High-quality Amino Silicon Oil. This invention was developed by Jiang Xiaoping, Nie Zhonghua and Wu Zhong. The patent application number is CN202510782579 20250612. The patent publication number is CN120605644 (..

U.S. Patent and Trademark Office Publishes Hangzhou HFC Semiconductor Co Patent Application for Method of Forming Bonding Contact, Bonding Structure and Semiconductor Device

Semiconductor

| Mon 23 Feb 2026

Alexandria, Feb. 23 -- U.S. Patent and Trademark Office has published Hangzhou HFC Semiconductor Co patent application for Method of Forming Bonding Contact, Bonding Structure and Semiconductor Device. The invention was developed by Cheng Yuexing, Wu Zhuojie, Hao Liting and Tan Falong. The patent application number is US20251..

Tel Mfg and Engineering Of America Inc Seeks Patent for Method for Processing a Substrate

Semiconductor

| Mon 23 Feb 2026

Alexandria, Feb. 23 -- Tel Mfg and Engineering Of America Inc has sought patent for Method for Processing a Substrate. This invention was developed by Lai Wei-jung, Landfried Jeffrey and Leith Allen. The patent application number is US202418807702 20240816. The patent publication number is US20260052906 (A1). International Pa..

U.S. Patent and Trademark Office Publishes Chongqing Boe Display Tech Co Ltd and BOE Technology Group Patent Application for Display Substrate and Display Device

Semiconductor

| Mon 23 Feb 2026

Alexandria, Feb. 23 -- U.S. Patent and Trademark Office has published Chongqing Boe Display Tech Co Ltd and BOE Technology Group patent application for Display Substrate and Display Device. The invention was developed by Chen Cheng, Cui Jiabin, Shuai Fei, Wang Qiaowen, Chen Aiguo and Li Guodong. The patent application number ..

Shenzhen Qilin Jingyuan Semiconductor Co Ltd Files Chinese Patent Application for Preparation Method of N-type Phosphorus-doped Silicon Carbide Crystal

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Shenzhen Qilin Jingyuan Semiconductor Co Ltd has filed a patent application for Preparation Method of N-type Phosphorus-doped Silicon Carbide Crystal. This invention was developed by Wang Hongwei, Zhang Han and Lyu Jianhua. The patent application number is CN202510872497 20250626. The patent publication nu..

Hypersics Semiconductor Co Ltd Files Chinese Patent Application for Laser Light Path, Device and Method for Growing Silicon Carbide Substrate by LCVD (liquid Chemical Vapor Deposit..

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Hypersics Semiconductor Co Ltd has filed a patent application for Laser Light Path, Device and Method for Growing Silicon Carbide Substrate by LCVD (liquid Chemical Vapor Deposition) Method. This invention was developed by Liu Xinyu and Yuan Zhenzhou. The patent application number is CN202510777686 2025061..

U.S. Patent and Trademark Office Releases Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group Patent Application for Display Substrate and Display Device

Semiconductor

| Mon 23 Feb 2026

Alexandria, Feb. 23 -- U.S. Patent and Trademark Office has released Chengdu BOE Optoelectronics Tech Co Ltd and BOE Technology Group patent application for Display Substrate and Display Device. This invention was developed by Zhang Wei, Dong Xiangdan, Wang Hongli, Wu Xintong, Wu Tong and Wang Yu. The patent application numbe..

Anhui Microchip Changjiang Semiconductor Mat Co Ltd Files Chinese Patent Application for Growth Device Capable of Accurately Controlling Pvt Crystal Growth Process

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Anhui Microchip Changjiang Semiconductor Mat Co Ltd has filed a patent application for Growth Device Capable of Accurately Controlling Pvt Crystal Growth Process. This invention was developed by Xin Jun, Kong Haikuan, Tu Xiaoniu and Hu Yang. The patent application number is CN202510898136 20250630. The pat..

State Intellectual Property Office of China Publishes Jiangsu Jingcheng Intelligent Equipment Co Ltd Patent Application for Single Crystal Furnace Cavity Furnace Cover Structure fo..

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has published Jiangsu Jingcheng Intelligent Equipment Co Ltd patent application for Single Crystal Furnace Cavity Furnace Cover Structure for Chip Production and Manufacturing Method. The invention was developed by Ye Jianhai, Yan Xiaomeng and Wang Feng. The pate..

Dongguan Changan Quality Electronic Mfg Co Ltd Submits Chinese Patent Application for Double-sided Mixed Electroplating Method for Lead Frame

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Dongguan Changan Quality Electronic Mfg Co Ltd has submitted a patent application for Double-sided Mixed Electroplating Method for Lead Frame. This invention was developed by Peng Haiping and Cai Minglei. The patent application number is CN202510463155 20250414. The patent publication number is CN120608310..

Shanghai Yuejiang Ind Co Ltd Files Chinese Patent Application for Integrated Temperature Control Platform and Temperature Control Method for Wafer Vacuum Coating Process Cavity

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Shanghai Yuejiang Ind Co Ltd has filed a patent application for Integrated Temperature Control Platform and Temperature Control Method for Wafer Vacuum Coating Process Cavity. This invention was developed by Wang Kaibing and Yu Hai. The patent application number is CN20251107635 20250722. The patent public..

Fuyuan Zhongshan Optoelectronics Tech Co Ltd Submits Chinese Patent Application for Preparation Method of High-refraction Non-conductive Coating Material and Application of High-re..

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Fuyuan Zhongshan Optoelectronics Tech Co Ltd has submitted a patent application for Preparation Method of High-refraction Non-conductive Coating Material and Application of High-refraction Non-conductive Coating Material in Hardening Anti-reflection Film on Surface of Substrate. This invention was developed b..

Hefei Xinying Tech Co Ltd Seeks Patent for Display Driving Method, Display Driving Device and Display Driving Chip

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Hefei Xinying Tech Co Ltd has sought patent for Display Driving Method, Display Driving Device and Display Driving Chip. This invention was developed by Li Tengda, Liao Junzhe and Xu Zaiwang. The patent application number is CN202510981627 20250716. The patent publication number is CN120599947 (A). Interna..

Beijing Zhijiao Heyi Tech Co Ltd Files Chinese Patent Application for Wafer Simulation Piece and Method for Demonstrating Chip Manufacturing Process

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Beijing Zhijiao Heyi Tech Co Ltd has filed a patent application for Wafer Simulation Piece and Method for Demonstrating Chip Manufacturing Process. This invention was developed by Sheng Yu, Li Yang, Wu Rongrong, Wang Xin, Li Huilei and Chen Xi. The patent application number is CN202510952409 20250710. The ..

State Intellectual Property Office of China Releases Beijing Integrated Circuit Equipment Innovation Center Co Ltd Patent Application for Semiconductor Film Layer Etching Method an..

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has released Beijing Integrated Circuit Equipment Innovation Center Co Ltd patent application for Semiconductor Film Layer Etching Method and Semiconductor Process Equipment. This invention was developed by Li Haiyan, Shen Tao and Dong Yunhe. The patent applicati..

State Intellectual Property Office of China Receives Beijing Integrated Circuit Equipment Innovation Center Co Ltd Patent Application for Substrate Etching Method and Semiconductor..

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has received Beijing Integrated Circuit Equipment Innovation Center Co Ltd patent application for Substrate Etching Method and Semiconductor Process Equipment. Liu Mingxuan and Shi Xiaoping developed the invention. The patent application number is CN202510638439 ..

Beijing Huacheng Electronic Co Ltd Submits Patent Application for Driving Circuit, Radio Frequency Power Supply and Semiconductor Process Equipment

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Beijing Huacheng Electronic Co Ltd has submitted a patent application for Driving Circuit, Radio Frequency Power Supply and Semiconductor Process Equipment. Bing Jigang, Zhang Facong, Yang Wanghong and Li Jiabo developed the invention. The patent application number is CN202510703811 20250528. The patent pu..

Silicon Motion Tech Corp Submits Chinese Patent Application for Decoding Method in Decoder, Flash Memory Controller, Host Device, and Method for Testing Flash Memory

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Silicon Motion Tech Corp has submitted a patent application for Decoding Method in Decoder, Flash Memory Controller, Host Device, and Method for Testing Flash Memory. This invention was developed by Guo Xuanhao. The patent application number is CN202410573693 20240510. The patent publication number is CN12..

Xi'an Heqi Optical Measurement Tech Co Ltd Submits Chinese Patent Application for Power Management Circuit and Embedded Wireless Wafer Temperature Measuring Device with Same

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Xi'an Heqi Optical Measurement Tech Co Ltd has submitted a patent application for Power Management Circuit and Embedded Wireless Wafer Temperature Measuring Device with Same. This invention was developed by Chen Houshuan, Wang Pan, Qu Hanghang, Duan Zhenghong and Chen Jun. The patent application number is ..

Youtou Ind Shenzhen Co Ltd Submits Chinese Patent Application for Novel Mode-hopping Compensation External Cavity Semiconductor Laser System and Compensation Method

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Youtou Ind Shenzhen Co Ltd has submitted a patent application for Novel Mode-hopping Compensation External Cavity Semiconductor Laser System and Compensation Method. This invention was developed by Xiao Xiao and Cheng Xingcai. The patent application number is CN202510672156 20250523. The patent publication..

Sinochip Semiconductor Tech Co Ltd Submits Chinese Patent Application for High-speed VCSEL (vertical Cavity Surface Emitting Laser) Semiconductor X Chip Device for Multi-cavity Par..

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Sinochip Semiconductor Tech Co Ltd has submitted a patent application for High-speed VCSEL (vertical Cavity Surface Emitting Laser) Semiconductor X Chip Device for Multi-cavity Partition Packaging and Packaging Method. This invention was developed by Wang Guanghui, Liang Gaoming, Yao Shun, Tian Zhengru and Ji..

Semiconductor Mfg Int Shanghai Co Ltd Submits Chinese Patent Application for Semiconductor Structure and Forming Method of Semiconductor Structure

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Semiconductor Mfg Int Shanghai Co Ltd has submitted a patent application for Semiconductor Structure and Forming Method of Semiconductor Structure. This invention was developed by Shen Zhaoxu, Li Yang and Lu Guoping. The patent application number is CN202410251787 20240305. The patent publication number is..

Beijing Lirui Microelectronics Tech Co Ltd Submits Chinese Patent Application for Package Substrate and Manufacturing Method Thereof

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Beijing Lirui Microelectronics Tech Co Ltd has submitted a patent application for Package Substrate and Manufacturing Method Thereof. This invention was developed by Yang Hongqiang, Zhao Qingfeng, Mo Jintian, Chen Yang, Fang Jianmin, Li Guangyao and Ouyang Keqing. The patent application number is CN2025105..

Huatian Tech Kunshan Elect Co Ltd Files Chinese Patent Application for Laser Pre-cutting Processing Method of Wafer

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Huatian Tech Kunshan Elect Co Ltd has filed a patent application for Laser Pre-cutting Processing Method of Wafer. This invention was developed by Zhai Yangdong, Sun Ni, Byun Ji-woon and Ma Shuying. The patent application number is CN202510708067 20250529. The patent publication number is CN120600694 (A). ..

Shenzhen Goodwork Electronic Co Ltd Applies for Patent on Correcting Device for Semiconductor Device Processing

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Shenzhen Goodwork Electronic Co Ltd has applied Chinese patent for Correcting Device for Semiconductor Device Processing. Su Meishu and Su Yihan developed it. The patent application number is CN20251199600 20250807. The patent publication number is CN120600683 (A). International Patent Classification codes..

Qingdao Sirui Intelligent Tech Co Ltd Applies for Patent on Wafer Taking and Placing Deviation Motion Method and System Under High-temperature Expansion of Wafer Box

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Qingdao Sirui Intelligent Tech Co Ltd has applied Chinese patent for Wafer Taking and Placing Deviation Motion Method and System Under High-temperature Expansion of Wafer Box. Dai Bohong, Yao Lizhu, Deng Yi, Kunimasa, Chen Zhimin, Tian Jinyang and Du Xiaolei developed it. The patent application number is C..

Xinyidong Beijing Tech Co Ltd Submits Chinese Patent Application for Method, Device, System and Equipment for Measuring and Calibrating Silicon Wafer Alignment System and Medium

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Xinyidong Beijing Tech Co Ltd has submitted a patent application for Method, Device, System and Equipment for Measuring and Calibrating Silicon Wafer Alignment System and Medium. This invention was developed by Zhang Qi, Fu Youyin, Du Tingting and Shen Quanan. The patent application number is CN20251074661..

State Intellectual Property Office of China Receives Wuxi Genxinyue Tech Co Ltd Patent Application for Wafer Transmission System and Semiconductor Equipment

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has received Wuxi Genxinyue Tech Co Ltd patent application for Wafer Transmission System and Semiconductor Equipment. Chen Yanwei and Huang Junpeng developed the invention. The patent application number is CN202511106145 20250808. The patent publication number is..

Guojing Hechuang Qingdao Tech Co Ltd Seeks Patent for Substrate Flexible Separation Equipment for Flexible Substrate Manufacturing

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Guojing Hechuang Qingdao Tech Co Ltd has sought patent for Substrate Flexible Separation Equipment for Flexible Substrate Manufacturing. This invention was developed by Zhang Fuxuan, Lyu Yong, Cui Caoxiang, Zhang Chunyang, Guo Baijun and Li Xiaodong. The patent application number is CN202510774285 20250611..

State Intellectual Property Office of China Releases Guangzhou Hongcheng Electronic Co Ltd Patent Application for Automatic Detection Device for Wafer Chip Production

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has released Guangzhou Hongcheng Electronic Co Ltd patent application for Automatic Detection Device for Wafer Chip Production. This invention was developed by Di Shaojie, Zhou Wen and Hu Fanghua. The patent application number is CN202510817740 20250618. The pate..

State Intellectual Property Office of China Publishes Wuxi Genxinyue Tech Co Ltd Patent Application for Vacuum Wafer Detection Platform

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has published Wuxi Genxinyue Tech Co Ltd patent application for Vacuum Wafer Detection Platform. The invention was developed by An Junjie. The patent application number is CN202510740929 20250605. The patent publication number is CN120600651 (A). International Pa..

State Intellectual Property Office of China Releases Shanghai Optical Communication Co Ltd Patent Application for Wafer Fragment Testing Method and Wafer Testing Equipment

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has released Shanghai Optical Communication Co Ltd patent application for Wafer Fragment Testing Method and Wafer Testing Equipment. This invention was developed by Xu Yuwu. The patent application number is CN202410225043 20240228. The patent publication number i..

Zhengzhou Xinghang Tech Co Ltd Submits Chinese Patent Application for Bare Copper Carrier Thermal Ultrasonic Bonding and Chip Packaging Method and Chip

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Zhengzhou Xinghang Tech Co Ltd has submitted a patent application for Bare Copper Carrier Thermal Ultrasonic Bonding and Chip Packaging Method and Chip. This invention was developed by Zhou Shaoming, Zheng Zhiguo, Luo Mengyu, Shi Yingduo, Cao Xiaojun and Zhang Li. The patent application number is CN2025108..

East China Institute Optoelectronic Integrated Device Submits Chinese Patent Application for Frame-free Potting Method for Integrated Circuit

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- East China Institute Optoelectronic Integrated Device has submitted a patent application for Frame-free Potting Method for Integrated Circuit. This invention was developed by Wang Xingxin, You Guangwei, Wang Ran, Weeden and Feng Li. The patent application number is CN202510799202 20250616. The patent publi..

Nanjing Langli Mat Co Ltd Submits Patent Application for Process Method for Controlling Surface Flatness of LTCC (low Temperature Co-fired Ceramic) Substrate

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Nanjing Langli Mat Co Ltd has submitted a patent application for Process Method for Controlling Surface Flatness of LTCC (low Temperature Co-fired Ceramic) Substrate. Zhang Yifang, Shen Jian and Liu Yu developed the invention. The patent application number is CN20251193606 20250806. The patent publication ..

Jiangsu Toubo Photoelectric Tech Co Ltd Submits Chinese Patent Application for Method for Removing Brazing Material on Copper-clad Ceramic Substrate Step by Step

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- Jiangsu Toubo Photoelectric Tech Co Ltd has submitted a patent application for Method for Removing Brazing Material on Copper-clad Ceramic Substrate Step by Step. This invention was developed by Zhang Weixing and Shi Chuanming. The patent application number is CN202510816326 20250618. The patent publicatio..

State Intellectual Property Office of China Publishes Mstar Tech Inc Patent Application for High-speed Single-slope Adc, Control Method Thereof and CMOS Image Sensor

Semiconductor

| Mon 23 Feb 2026

Beijing, Feb. 23 -- State Intellectual Property Office of China has published Mstar Tech Inc patent application for High-speed Single-slope Adc, Control Method Thereof and CMOS Image Sensor. The invention was developed by Zhou Rougang, Zhou Caijian, Zeng Dongsheng, Zhao Shuwen, Zhang Lu and Chen Enzan. The patent application ..

Investweiler Participacoes Ltda Submits United States Patent Application for Machine, Means for Controlling the Compaction of a Substrate and Product Obtained

Semiconductor

| Mon 23 Feb 2026

Alexandria, Feb. 23 -- Investweiler Participacoes Ltda has submitted a patent application for Machine, Means for Controlling the Compaction of a Substrate and Product Obtained. This invention was developed by Bragotto Ricardo and Forneris Ricardo. The patent application number is US202319104092 20230704. The patent publicatio..

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