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Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- State Intellectual Property Office of China has received Zhejiang Lishui Zhongxin Jingyuan Semiconductor Tech Co Ltd patent application for Integrated Efficient Preheating Assembly for Epitaxial Growth of Thick Film and Application Process of Integrated Efficient Preheating Assembly. Xiao Shangqing, Wu Caigen, ..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Guangzhou China Star Optoelectronics Semiconductor Display Technology has applied Chinese patent for Display Device. Zhang Lanbin developed it.
The patent application number is CN202511262399 20250904. The patent publication number is CN121191390 (A). International Patent Classification codes are G09F9/30, G..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- State Intellectual Property Office of China has received Huazhong University of Science and Technology patent application for Convolutional Neural Network Acceleration System with Configurable Computing Structure Based on Systolic Array. Wang Yuehuan, Yin Baikai, Zhang Botong, Bu Xiaoqiang and Zhang Tao develop..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- State Intellectual Property Office of China has released Zhejiang Saijin Semiconductor Technology patent application for Automatic Overturning Box Opening Mechanism of Photomask Box. This invention was developed by Yao Qingli, Shi Xiangkun, Wang Congyang, Wen Xiaojian and Liu Chuqun.
The patent application n..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Xi'an Junxin Electronic Technology has submitted a patent application for Integrated Circuit Lamination Packaging Method. This invention was developed by Zhao Hang, Dang Yingfeng and Yang Fan.
The patent application number is CN202511381724 20250925. The patent publication number is CN121191992 (A). Internat..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- State Intellectual Property Office of China has released Lattice Art Semiconductor patent application for Multi-base-island Lead Frame and Packaging Body. This invention was developed by Bao Han and Wan Liang.
The patent application number is CN202511426912 20250930. The patent publication number is CN121192..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- North Integrated Circuit Tech Innovation Center has submitted a patent application for Adapter Plate and Forming Method Thereof. Teng Xinlu, Zhou Yikang, Wu Xusheng and Dong Qiuli developed the invention.
The patent application number is CN202410804239 20240620. The patent publication number is CN121192055 (..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- State Intellectual Property Office of China has received University of South China patent application for Ge-VO2 Metasurface-based Dual-mode Wide-narrow-band Adjustable Near-infrared Absorber. Luo Xiaoqing, Cai Jiahui, Wang Yuxuan, Zhang Ye, Chen Gang, Bai Xingwang and Li Yan developed the invention.
The pat..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- State Intellectual Property Office of China has received Shanghai Zhongxin Jingyuan Semiconductor Technology patent application for PLC-based Circulating Pump Flow Automatic Regulation Control Method. Huang Wei and Huang Hua developed the invention.
The patent application number is CN202511754979 20251126. T..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- State Intellectual Property Office of China has received Tuojing Chuangyi Shenyang Semiconductor Equipment patent application for Semiconductor Device Processing Method and Equipment, and Storage Medium. Zou Nan and Zhang Bo developed the invention.
The patent application number is CN202511383121 20250925. T..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Hangzhou Cobetter Semiconductor Separation Membrane has submitted a patent application for Liquid Supply Assembly and System and Exhaust Method. This invention was developed by Jia Jiandong, Fu Kewei and Chen Juan.
The patent application number is CN202511284345 20250909. The patent publication number is CN1..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Hangzhou Cobetter Semiconductor Separation Membrane has submitted a patent application for Liquid Supply Assembly and Liquid Supply System. This invention was developed by Jia Jiandong, Chen Juan and Fu Kewei.
The patent application number is CN202511284344 20250909. The patent publication number is CN121192..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Hefei Nexchip Integrated Circuit has filed a patent application for Semiconductor Structure and Preparation Method Thereof. This invention was developed by Wang Wenzhi.
The patent application number is CN202511727064 20251124. The patent publication number is CN121192053 (A). International Patent Classificat..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Hefei Nexchip Integrated Circuit has filed a patent application for Semiconductor Structure and Preparation Method Thereof. This invention was developed by Wang Wenzhi.
The patent application number is CN202511727063 20251124. The patent publication number is CN121192052 (A). International Patent Classificat..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Fuji Electric has applied Chinese patent for Semiconductor Device. Kanai Naoyuki developed it.
The patent application number is CN202510527502 20250425. The patent publication number is CN121192073 (A). International Patent Classification codes are H01L23/367 and H01L23/42. Cooperative Patent Classification ..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- JCET Xingke Chippac Korea has submitted a patent application for Semiconductor Device and Method for Reducing the Occurrent of Em Dendritic Shorting Between Interconnect. Lee Min-sung, Yoon Yeo-june, Lee Hee-soo and Yin Yongniao developed the invention.
The patent application number is CN202510544143 2025042..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Nanya Technology has filed a patent application for Semiconductor Element with Air Gap and Preparation Method Thereof. This invention was developed by Huang Zhiwei.
The patent application number is CN202411849365 20241216. The patent publication number is CN121192085 (A). International Patent Classification ..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Anhui Geen Semiconductor has filed a patent application for Laser Element with Excitation Transfer Emission Mechanism. This invention was developed by Kan Hongzhu, Zheng Jinjian, Deng Heqing, Xun Feilin, Zhang Jiangyong, Lan Jiabin, Liu Zihan, Cai Xin, Li Xiaoqin, Cao Jun and Zhang Huikang.
The patent applic..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- State Intellectual Property Office of China has released Inner Mongolia University of Science and Technology patent application for Preparation Method of Bipolar Wetting Sers (surface Enhanced Raman Scattering) Substrate, Sers Substrate and Detection Method of Sers Substrate. This invention was developed by Sun..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- State Intellectual Property Office of China has released Xinjiang Technical Institute of Physics and Chemistry, Chinese Academy of Sciences patent application for Low-leakage Transistor Array Chip for Total Dose Effect Test. This invention was developed by Zheng Qiwen, Cui Jiangwei, Guo Qi and Li Yudong.
The p..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- State Intellectual Property Office of China has released Guangdong OPPO Mobile Telecommunications patent application for Cache Allocation Method and Device, Processor, Chip and Electronic Equipment. This invention was developed by Cheng Liang, Lin Ziyuan and Chen Peng.
The patent application number is CN202511..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- State Intellectual Property Office of China has released Huawei Technologies patent application for Substrate and Preparation Method Thereof, Packaging Structure and Electronic Equipment. This invention was developed by Liu Zhongjian, Zhu Ze, Mao Lianlian and Zhao Nan.
The patent application number is CN202410..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- State Intellectual Property Office of China has released ChangXin Technology Group patent application for Semiconductor Device, Semiconductor Memory and Semiconductor Device Forming Method. This invention was developed by Zhuang Lingyi and Liu Ying.
The patent application number is CN202410805947 20240620. The..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- State Intellectual Property Office of China has released SEMES patent application for Substrate Processing Apparatus and Method. This invention was developed by Bae Hyun Woo, Kim Dae-hun, Na Seung-eun, Kim Sung-hyun, Lee Dong-keon, Park Sang-woo, Hong Ji-su and Lee Seong-soo.
The patent application number is C..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- State Intellectual Property Office of China has published Zhongke Guangzhi (Chongqing) Technology patent application for High-speed Reliable Isolator Chip Mounter and Working Method Thereof. The invention was developed by Qin Zhanyang, Yang Ziliang, Wang Xiyu, Lin Hongfei and Geng Kaige.
The patent application..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- State Intellectual Property Office of China has received China Triumph International Engineering patent application for Glass Substrate Air Floating Type Double-sided Grinding Machine and Grinding Process Thereof. Ding Honghan, Cheng Ming and Liu Ziyu developed the invention.
The patent application number is C..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- State Intellectual Property Office of China has received Qilu Hospital of Shandong University patent application for Microfluidic Electrochemical Sensing Chip. Lai Qingteng, Du Lutao and Liu Rongzhen developed the invention.
The patent application number is CN202511175450 20250821. The patent publication numbe..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- State Intellectual Property Office of China has received Huawei Technologies patent application for Processor Chip, Chip System and Access Method. Xing Qi developed the invention.
The patent application number is CN202410817071 20240621. The patent publication number is CN121187968 (A). International Patent Cl..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- State Intellectual Property Office of China has received Wuhan Xinxin Semiconductor patent application for Clock Voltage Doubling Circuit, Reference Circuit and Chip. Zhuang Bangxiang, Yuan Xiaobo, Xiong Liangpeng and Chen Jian developed the invention.
The patent application number is CN202511277663 20250908. ..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- State Intellectual Property Office of China has received Nanya Technology patent application for Method for Manufacturing Semiconductor Device. Su Zhengjie and Lin Zhiqing developed the invention.
The patent application number is CN202411340405 20240925. The patent publication number is CN121192050 (A). Intern..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- State Intellectual Property Office of China has received Forty Eighth Research Institute of China Electronics Technology Group patent application for Substrate Conveying System and Conveying Method. Fan Jianghua, Zhang Chao, Liu Qinghao, Chen Long, Chen Lisong and Ye Wenlong developed the invention.
The patent..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Shanghai University has sought patent for Portable Plasma Separation Chip and Method for Instant Detection. This invention was developed by Yue Tao, Chen Shiwei, Wang Yue and Liu Na.
The patent application number is CN202511108673 20250808. The patent publication number is CN121178235 (A). International Patent..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Suzhou Haosheng Intelligence Technology has sought patent for Electroplating Suspension Device and Electroplating Equipment for Metal Electrode of Solar Cell. This invention was developed by Yang Xin and Wu Tingbin.
The patent application number is CN202511348372 20250920. The patent publication number is CN12..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Advanced Micro-Fabrication Equipmen has sought patent for Substrate Processing Chamber and Flexible Grounding Device Thereof. This invention was developed by Cai Menglei, Zhang Zhao, Jubin and Zhang Kai.
The patent application number is CN202410815055 20240621. The patent publication number is CN121183318 (A)...
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Beijing Xuanjie Technology has sought patent for Image Processing Method and Device, Electronic Equipment, Chip and Storage Medium. This invention was developed by Liu Yuqing.
The patent application number is CN202511234535 20250829. The patent publication number is CN121190318 (A). International Patent Classi..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Prilit Optronics has sought patent for Micro Light Emitting Diode Display Panel. This invention was developed by Wu Bingsheng, Chen Xinhong and Li Xingying.
The patent application number is CN202511433401 20220711. The patent publication number is CN121191438 (A). International Patent Classification codes are ..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- CETC Siyi Technology has sought patent for Tunable Semiconductor Laser Health Management System and Method. This invention was developed by Sheng Liwen, Huang Lin, Liu Zhiming, Wang Jianjun, Qiao Shan, Ju Junwei, Zhou Shuai, Yoon Byung-ki and Wei Yu.
The patent application number is CN202511178678 20250822. Th..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- ACM Research, Shanghai has sought patent for Chuck for Square Substrate. This invention was developed by Wang Hui, Wang Jian, Wu Jun, Yang Hongchao, Yang Xiaoya and Diao Jianhua.
The patent application number is CN202410816350 20240621. The patent publication number is CN121192043 (A). International Patent Cla..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Applied Materials Israel has sought patent for Hybrid Vacuum Electrostatic Chuck Carrier for High Warpage Wafers. This invention was developed by Dudovich Ofer and Zur Yehuda.
The patent application number is CN202510835392 20250620. The patent publication number is CN121192001 (A). International Patent Classi..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Taiwan Semiconductor Manufacturing has applied Chinese patent for Plating Film and Plating Method. Chen Yongxiang, Lyu Hongsan, Wu Tingying, Zhuang Zizhou and Ye Yulong developed it.
The patent application number is CN202511362887 20200915. The patent publication number is CN121183383 (A). International Patent..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Chongqing Tsingshan Industrial has applied Chinese patent for Fault Processing Method for Grid Driving Chip of Motor Controller. Gu Xingying, Li Senlin, Chen Junhao, Tang Zhongbo, Chen Hongqi and Liu Decai developed it.
The patent application number is CN202511692247 20251118. The patent publication number is ..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Samsung Electronics has applied Chinese patent for Universal Flash Memory Device and System and Method of Operating Same. Choi Kyu-seok, Shin Myong-sop, Seo Sung-ho and Jeon Sang-jin developed it.
The patent application number is CN202510284651 20250311. The patent publication number is CN121187500 (A). Intern..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Huawei Technologies has applied Chinese patent for Service Recommendation Method, Electronic Equipment, Readable Storage Medium and Chip. Tang Pengcheng, Liang Deming, Zhu Yue and Gao Yuan developed it.
The patent application number is CN202411118272 20240814. The patent publication number is CN121188272 (A). ..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Huawei Cloud Computing Technologies has applied Chinese patent for Data Processing Method, Chip and Computing Device Cluster. Zhan Hongxin and Wang Pan developed it.
The patent application number is CN202410804382 20240620. The patent publication number is CN121189665 (A). International Patent Classification c..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Tong Hsing Electronic Industries has applied Chinese patent for Power Semiconductor Device. Guo Yuru, Zhong Zhiyu and Wu Jiayi developed it.
The patent application number is CN202410810142 20240621. The patent publication number is CN121192075 (A). International Patent Classification codes are H01B17/58, H01L2..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Advanced Micro-Fabrication Equipmen has applied Chinese patent for Jacking Assembly and Plasma Processing Device. Song Jingpeng and Li Kaiyuan developed it.
The patent application number is CN202410815225 20240621. The patent publication number is CN121192042 (A). International Patent Classification codes are ..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Shenzhen Sunlord Electronics has applied Chinese patent for Laminated Chip Inductor and Electronic Equipment. Yao Bin, Mo Chonggui, Pan Longyan and Kong Yuhao developed it.
The patent application number is CN202511266310 20250905. The patent publication number is CN121191901 (A). International Patent Classific..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Guiyang Sunlord Xunda Electronic has applied Chinese patent for Multi-wire Lap-wound Chip Inductor and Preparation Method Thereof. Liu Xiaolian, Wang Yuting, Zeng Deping and Zhou Yanhui developed it.
The patent application number is CN202511697163 20251119. The patent publication number is CN121191896 (A). Int..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Harbin Institute of Technology Shenzhen Institute of Science and Technology Innovation has applied Chinese patent for Preparation Method of Thin Film Chip Resistor Based on Bipolar High-power Pulse Magnetron Sputtering. Liu Xiangli and Luo Xingshun developed it.
The patent application number is CN202511282751 ..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Guilin University of Electronic Technology has filed a patent application for Micro-pitch Bump Preparation Device for Chip Packaging. This invention was developed by Chen Jingxian, Lu Shaowei and Zeng Zhipeng.
The patent application number is CN202511383483 20250926. The patent publication number is CN12117897..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Beijing NAURA Microelectronics Equipment has filed a patent application for Bearing Device and Semiconductor Process Equipment. This invention was developed by Qu Yang.
The patent application number is CN202410804514 20240620. The patent publication number is CN121183315 (A). International Patent Classificatio..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Xidian University has filed a patent application for BGA Chip Defect Detection Method Based on Template Matching and Alignment. This invention was developed by Yang Wen, Chen Zhanfei, Ma Jupo, Wu Jinjian and Jia Yaoqiang.
The patent application number is CN202511210008 20250827. The patent publication number i..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Wuxi Yixin Technology has filed a patent application for Intelligent Scheduling Platform and Method for Vehicle Gauge Chip Final Test. This invention was developed by Fang Miaolin, Meng Qingheng, Feng Qiang, Zhou Qing and Nie Xinchen.
The patent application number is CN202511211281 20250828. The patent publica..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Xiaomi Automobile Technology has filed a patent application for Image Correction Method and Device, Electronic Equipment, Vehicle, Chip and Storage Medium. This invention was developed by Gong Mingjun, Zhang Guangyu, Liu Jie and Xiao Zhengdong.
The patent application number is CN202511220575 20250828. The pate..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Center has filed a patent application for Simulation Method Based on Chip Verification Simulation Platform. This invention was developed by Zhang Mengke, Zeng Zhaogui, Yao Xiangjun, Ma Jianning and Zhang Shikai.
The patent application numb..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Xiaomi Automobile Technology has filed a patent application for Target Detection Method and Device, Vehicle Control Method and Device, Medium, Product and Chip System. This invention was developed by Wu Jing.
The patent application number is CN202511310511 20250912. The patent publication number is CN121191129..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Huawei Technologies has filed a patent application for Electric Connection Substrate, Chip Packaging Structure and Electronic Equipment. This invention was developed by Su Wenyu, Luo Duona, Hu Xiao, Hu Hengqian, Zhang Chi and Niu Jiahao.
The patent application number is CN202410817418 20240621. The patent publ..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Hefei Jiufu Semiconductor Technology has submitted a patent application for Purging Device for Mounting Semiconductor Equipment. Zhao Jiangmin and Yuan He developed the invention.
The patent application number is CN202511641203 20251111. The patent publication number is CN121178518 (A). International Patent Cl..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- China National Institute of Standardization has submitted a patent application for Ultrafine Crushing Device for Ceramic Substrate Raw Materials for Semiconductor Packaging. This invention was developed by Han Bing, Fu Qiang and Su Hongyu.
The patent application number is CN202511426342 20250930. The patent pu..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Nanjing University of Science & Technology has submitted a patent application for Paper-based Micro-fluidic Chip for Detecting Aging Degree of Engine Oil as Well as Preparation Method and Detection Method of Paper-based Micro-fluidic Chip. This invention was developed by Fan Yiqiang, Zhou Wenzhuo and Gao Kexin...
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- CCCC SHEC Fourth Engineering has submitted a patent application for Heavy Clay Substrate Larsen Steel Sheet Pile Driving Method. Huang Guangyang, Li Bing, Hua Feng, Xu Jianlun, Guo Shifeng, Guo Qing, Li Jinwen, Zhou Chao, Fan Yi, Xiong Fang and Ren Hang developed the invention.
The patent application number is..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Suzhou Tongfu Chaowei Semiconductor has submitted a patent application for Substrate Wiring Open Circuit Defect Positioning Method and Device and Medium. Han Jun, Zhang Zhuoran, Zhou Xiaoyu and Li Yunpeng developed the invention.
The patent application number is CN202511445443 20251010. The patent publication ..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Taiwan Semiconductor Manufacturing has submitted a patent application for Package and Method of Forming Same. Tan Jiayan, Guo Hongyi, Liang Yumin and Cai Haoyi developed the invention.
The patent application number is CN202510821271 20250619. The patent publication number is CN121186934 (A). International Pate..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Wuhan China Star Optoelectronics Technology has submitted a patent application for Array Substrate and Display Panel. This invention was developed by Li Zhuang and Song Dewei.
The patent application number is CN202511649399 20251111. The patent publication number is CN121187041 (A). International Patent Classi..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Shanghai Tianma Microelectronics has submitted a patent application for Microfluidic Substrate and Microfluidic Device. This invention was developed by Zhang Kaidi, Tong Hao, Awahira, Lin Baiquan, Zhang Dongli, Wang Liying and Fu Xueli.
The patent application number is CN202511294579 20250910. The patent publi..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Wuhan Xinxin Semiconductor has submitted a patent application for Clock Voltage Doubling Circuit, Reference Circuit and Chip. Zhuang Bangxiang developed the invention.
The patent application number is CN202511277648 20250908. The patent publication number is CN121187410 (A). International Patent Classification..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Hangzhou Changchuan Technology has submitted a patent application for Management Method of Test Board Card and Chip Test System. This invention was developed by Zhang Yuhang, Dong Yuqing, Liu Wei, Jiang Huming, Wu Zemin and Zhang Can.
The patent application number is CN202511384270 20250925. The patent publica..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Huawei Technologies has submitted a patent application for Secure Starting Method of Chip and Related Equipment. This invention was developed by Zhao Xiangyu, Wang Baichuan and Zhang Xiaohu.
The patent application number is CN202410807989 20240620. The patent publication number is CN121188786 (A). Internationa..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- Semitronix has submitted a patent application for Test Chip Design Method and Device Based on Failure Mode, Medium and Chip. Shi Jiao, Yang Ludan and Qu Yichao developed the invention.
The patent application number is CN202511397346 20250928. The patent publication number is CN121189256 (A). International Pate..
Semiconductor
| Thu 30 Apr 2026
Beijing, May 1 -- NVIDIA has submitted a patent application for Differential and Modular End-to-end Stacks for Autonomous Systems and Applications. This invention was developed by Weng Xinshuo, Kakus Petri, Cao Yi, Ivanovic Branko, Wang Yue, Chen Yuxiao, Sharma Amit and M Pavone.
The patent application number is CN202510818010 ..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Zhejiang Dahua Technology has submitted a patent application for Driving Chip Adjusting Method and Device and Electronic Equipment. This invention was developed by Liu Qian, Xu Mingliang, Lu Yubin, Bai Xue and Ma Xinwei.
The patent application number is CN202511180456 20250821. The patent publication number is..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Realtek Semiconductor Corporation has submitted a patent application for Integrated Transformer and Balun. This invention was developed by Luo Zhengwei.
The patent application number is CN202410803291 20240620. The patent publication number is CN121191894 (A). International Patent Classification codes are H01F..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- ACM Research, Shanghai has submitted a patent application for Chuck for Square Substrate. This invention was developed by Wang Hui, Wang Jian, Wu Jun, Yang Hongchao, Yang Xiaoya and Diao Jianhua.
The patent application number is CN202411358048 20240926. The patent publication number is CN121192044 (A). Interna..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- SEMES has submitted a patent application for Substrate Processing System. Kim Sung-pil and Kim Sung-hyun developed the invention.
The patent application number is CN202510831116 20250620. The patent publication number is CN121192031 (A). International Patent Classification codes are B08B13/00, B08B5/04, H01L21..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- South China University of Technology has submitted a patent application for Two-dimensional Semiconductor Device and Preparation Method and Special Seal Thereof. This invention was developed by Zhou Haohan, Wang Yuxian, Wang Jie, Wang Kun and Xie Hongchao.
The patent application number is CN202511724571 202511..
Semiconductor
| Fri 01 May 2026
Beijing, May 1 -- Hubei Jiufengshan Laboratory has submitted a patent application for Large-size Inp-based Semiconductor Laser Epitaxial Structure and Preparation Method Thereof. This invention was developed by Liu Yangbowen, Pan Lei and Zhang Wei.
The patent application number is CN202511731709 20251124. The patent publication..
Semiconductor
| Wed 29 Apr 2026
Beijing, April 30 -- Fujian Institute of Research on the Structure of Matter CAS and Mindu Innovation Laboratory have sought patent for High-power Semiconductor Laser Device. This invention was developed by Huang Xin, Zheng Yi, Wang Shuaihua, Xu Xieming, Chen Min and Wu Shaofan.
The patent application number is CN20251144473 ..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- Zuizhongqianyan Wuxi Aerospace Co Ltd and Yangtze River Delta Solar Photovoltaic Tech Innovation Center have sought patent for Semi-rigid Substrate, Semi-rigid Solar Cell Array and Preparation Method of Semi-rigid Substrate and Semi-rigid Solar Cell Array. This invention was developed by Li Tengfei, Zhang We..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- BOE Technology Group and Hefei BOE Ruisheng Technology have sought patent for Light-emitting Substrate and Display Device. This invention was developed by Sun Yiding, Wang Kangli, Cheng Amei, Tang Hai, Qin Jianwei, Gu Erxing and Qi Qi.
The patent application number is CN20248000571 20240322. The patent pu..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- Inner Mongolia University of Science and Technology, Jiuquan Steel Group Gansu Hongxing Hongyu New Mat Co Ltd and Inner Mongolia Xineng Electromagnetic Tech Co Ltd have sought patent for Non-oriented Silicon Steel for New Energy Automobile Driving Motor and Preparation Method of Non-oriented Silicon Steel. T..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- Suzhou Laboratory and Nanjing University have sought patent for Two-dimensional TMDC Single Crystal Epitaxial Substrate and Preparation Method and Application Thereof. This invention was developed by Wang Xinran, Zou Qianlu and Li Taotao.
The patent application number is CN202511145440 20250815. The paten..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- Shandong Aiko Solar Energy Tech Co Ltd, Zhuhai Fushan Aixu Solar Energy Technology, Zhejiang Aiko Solar Energy Technology, Tianjin Aiko Solar Energy Technology and Guangdong Aiko Solar Energy Technology Co Ltd have sought patent for Welding Method of Low-oxygen Monocrystalline Silicon Seed Crystal. This inve..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- Baoding Tongmei Crystal Mfg Co Ltd, Chaoyang Tongmei Crystal Tech Co Ltd and Beijing Tongmei Crystal Technology have sought patent for Wide-angle Wafer Edge Reference Interface Precision Measuring Device and Use Method. This invention was developed by Yao Zili, Hong Qingfu, Dong Zhengda, Wang Yuanli, Han Don..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- North Integrated Circuit Tech Innovation Center and Tsinghua University have applied Chinese patent for Stacked Capacitor, Preparation Method Thereof and Semiconductor Device. Liu Xiaosen, Yang Guoshan, Ampen, Chai Guoxing, Liu Zhoutong, Zhou Yikang and Dong Qiuli developed it.
The patent application numb..
Semiconductor
| Wed 29 Apr 2026
Beijing, April 30 -- Global Unichip and Taiwan Semiconductor Manufacturing have filed a patent application for Semiconductor Packaging Device and Semiconductor Wiring Board Thereof. This invention was developed by Wang Weiqiao, Yang Shengfan, Lin Yizeng, Lin Yuanhong, Zeng Liya and Xie Yating.
The patent application number is..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- Zhejiang Aiko Solar Energy Technology, Shandong Aiko Solar Energy Tech Co Ltd, Tianjin Aiko Solar Energy Technology, Guangdong Aiko Solar Energy Technology Co Ltd and Zhuhai Fushan Aixu Solar Energy Technology have filed a patent application for Composite Hole Transport Layer, Perovskite-crystalline Silicon ..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- Electric Power Res Institute Guangdong Power Grid Corp and Chongqing University have filed a patent application for Junction Temperature Measurement Method and Device of Crimping Type Insulated Gate Bipolar Transistor, Terminal Equipment and Storage Medium. This invention was developed by Ma Kai, Tan Lingqi,..
Semiconductor
| Wed 29 Apr 2026
Beijing, April 30 -- Hefei Chipsea Electronic Tech Co Ltd and Chipsea Technology Shenzhen have submitted a patent application for Data Tracking Circuit, Data Tracking Processing Method, Chip and Electronic Equipment. This invention was developed by Wang Shang and Li Xiaobin.
The patent application number is CN20251145352 2025..
Semiconductor
| Wed 29 Apr 2026
Beijing, April 30 -- South China University of Technology and Yuexin Semiconductor Technology have submitted a patent application for Dielectric Layer Preparation Method, Semiconductor Device Preparation Method and Semiconductor Device. Tian Ye, Peng Xiong and Zhou Changjian developed the invention.
The patent application num..
Semiconductor
| Wed 29 Apr 2026
Beijing, April 30 -- North Integrated Circuit Tech Innovation Center and Institute of Microelectronics, CAS have submitted a patent application for Molecular Dynamics Simulation Method, Device and Equipment for Molecular Beam Epitaxy Process. This invention was developed by Feng Zemeng and Chen Rui.
The patent application num..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- Jiangsu Fulehua Power Semiconductor Research Institute and Shanghai Fulehua Semiconductor Tech Co Ltd have submitted a patent application for Static Electricity Removing Method for Ceramic Substrate. This invention was developed by Ji Chenglong, Wang Bin and Duan Xuefeng.
The patent application number is ..
Semiconductor
| Wed 29 Apr 2026
Beijing, April 30 -- Verisilicon Microelectronics Shanghai Co Ltd, Verisilicon Microelectronics Nanjing Co Ltd, Verisilicon Microelectronics Hainan Co Ltd and Verisilicon Microelectronics Chengdu Co Ltd have submitted a patent application for Power Amplifier and Fallback Power Efficiency Control Method Thereof, Transmitter and C..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- BOE Technology Group and Chongqing BOE Display Technology have submitted a patent application for Pixel Circuit, Driving Method, Display Substrate and Display Device. Wang Rui, Zeng Chao, Hu Ming and Qiu Haijun developed the invention.
The patent application number is CN20248000472 20240307. The patent pu..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- BOE Technology Group and Chengdu BOE Optoelectronics Technology have submitted a patent application for Display Substrate and Display Device. Wang Yuanguo, Qu Yi, Zhang Bo, Xu Peng, Wei Liheng, Wang Wei, Liao Maoying, Li Bin, Feng Aoyuan, Chu Zhiwen, Niu Ge and Li Xiangyi developed the invention.
The pate..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- BOE Technology Group and Hefei BOE Joint Technology have submitted a patent application for Display Substrate and Display Device. This invention was developed by Yuan Can and Li Yongqian.
The patent application number is CN20248000632 20240328. The patent publication number is CN121176182 (A). Internation..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- Semiconductor Mfg International Shenzhen Corporation and Semiconductor Mfg International Shanghai Co Ltd have submitted a patent application for Low Dropout Linear Regulator Circuit, Power Supply Chip and Electronic Equipment. Liu Tao and Yang Fengjuan developed the invention.
The patent application numbe..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- State Intellectual Property Office of China has received Zhejiang Guangxin Microelectronic Co Ltd patent application for Adaptive Power Regulation and Control Method and System for Power Integrated Circuit. Xie Gang and Ye Bilin developed the invention.
The patent application number is CN202511716274 2025..
Semiconductor
| Wed 29 Apr 2026
Beijing, April 30 -- Yangtze Memory Holdings Co Ltd has filed a patent application for Semiconductor Device, Operating Method and System Thereof, and Computer Readable Storage Medium. This invention was developed by Wang Wendong, Xiong Wenhao, Guan Lei, Wang Tingze, Xu Feng, Zhu Anyi, Jin Lei and Huo Zongliang.
The patent app..
Semiconductor
| Wed 29 Apr 2026
Beijing, April 30 -- Suanmiao Tech Beijing Co Ltd has submitted a patent application for Self-adaptive Memory Refreshing Method, Memory Controller and Storage Medium. Cao Pengyi and Yin Leizu developed the invention.
The patent application number is CN202511376070 20250924. The patent publication number is CN121171283 (A). In..
Semiconductor
| Thu 30 Apr 2026
Beijing, April 30 -- State Intellectual Property Office of China has released Rongxin Semiconductor Ningbo patent application for Method for Removing Photoresist Residues and Substrate. This invention was developed by Xie Wenchun.
The patent application number is CN202511304819 20250912. The patent publication number is CN12116..
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