Metal & Mining
| Sun 29 Mar 2026
Alexandria, March 30 -- U.S. Patent and Trademark Office has received Intel patent application for 3D Printing of Glass Core Edge Protection in IC Device Packaging. Xie Zhixin, Saber Mohamed, Shan Bohan, Arrington Anastasia, Arrington Clay, Patel Jigneshkumar, Mau Catherine, Carrazzone Ryan, Chen Haobo, Li Wei, Arrington Kyle, L..