Electronics
| Thu 09 Apr 2026
Geneva, April 10 -- Sekisui Chemical has submitted a patent application for Adhesive Composition, Adhesive Tape, and Electronic Device. This invention was developed by Nishiyama Ayane, Ogata Yudai, Ichikawa Hiroto, Tanimoto Takayuki, Hirata Toshiaki, Nakajima Keito, Takijiri Aya and Doi Satoshi.
The patent application number is..