Semiconductor
| Sun 11 Jan 2026
Munich, Jan. 12 -- European Patent Office has received Intel patent application for Fabricating Integrated Circuit Packages with Glass Core Hybrid Panels. Agarwal Soham, Bryks Whitney, Candadai Aaditya Anand, Cao Yi, Darmawikarta Kristof, Duan Gang, Duong Benjamin, Ecton Jeremy, Mohammadighaleni Mahdi, Hernandez Kari, Jimenez An..