Semiconductor
| Fri 25 Apr 2025
Geneva, April 26 -- Applied Materials has filed a patent application for polishing articles for hybrid bonding applications. This invention was developed by Jiang Liu, Lianto Prayudi, Kumar Rath Santosh, Bao Nina, Danish Muhammad Adli, Khanna Aniruddh, Gan Pin Gian, Ang Mohammad Faizal Bin Aermie, Yamamura Mayu, Ganapathiappan S..