Semiconductor
| Thu 02 Apr 2026
Munich, April 3 -- European Patent Office has published Resonac patent application for Resin Composition, Prepreg, Laminate, Resin Film, Printed Wiring Board, and Semiconductor Package. The invention was developed by Takeguchi Ayaka, Kakitani Minoru, Shimizu Hiroshi, Tanigawa Takao, Fukui Masato, Akebi Ryuji, Murata Yuta, Otsuka..