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| Wed 02 Sep 2026
Beijing, Sept. 2 -- Tsinghua University and Tencent Technology, Shenzhen have applied Chinese patent for Bimodal Strain Sensor, Sensor Preparation Method and Intelligent Glove. Wu Daixuan, Zhao Ruolan, Xiang Lingzhu, Zhao Yuhan, Fan Jiarong and Tian He developed it.
The patent application number is CN202610338129 20260319. Th..